Intel SSDSC2BA012T401 User Manual

Intel® Solid-State Drive DC S3710 Series

Capacity:

200GB, 400GB, 800GB, 1.2TB

Components:

Intel® 20nm NAND Flash Memory

High Endurance Technology (HET) Multi-Level Cell (MLC)

Form Factor: 2.5–inch Read and Write IOPS1,2

(Full LBA Range, IOMeter* Queue Depth 32)

Random 4KB3 Reads: Up to 85,000 IOPS

Random 4KB Writes: Up to 45,000 IOPS

Random 8KB3 Reads: Up to 52,000 IOPS

Random 8KB Writes: Up to 21,000 IOPS

Bandwidth Performance1

Sustained Sequential Read: Up to 550 MB/s4

Sustained Sequential Write: Up to 520 MB/s

Endurance: 10 drive writes per day5 for 5 years

	200GB:	3.6PB	400GB:	8.3PB
	800GB:	16.9PB	1.2TB:	24.3PB

Latency (average sequential)

Read: 55 µs (TYP)

Write: 66 µs (TYP)

Quality of Service6,8

Read/Write: 500 µs / 5 ms (99.9%)

Performance Consistency7,8

Read/Write: Up to 90%/90% (99.9%)

AES 256-bit Encryption Altitude9

Operating: -1,000 to 10,000 ft

Operating10: 10,000 to 15,000 ft

Non-operating: -1,000 to 40,000 ft

Product Ecological Compliance

RoHS*

Compliance

SATA Revision 3.0; compatible with SATA 6Gb/s, 3Gb/s and 1.5Gb/s interface rates

ATA/ATAPI Command Set – 2 (ACS-2 Rev 7); includes SCT (Smart Command Transport) and device statistics log support

Enhanced SMART ATA feature set

Native Command Queuing (NCQ) command set

Data set management Trim command

Product Specification

Power Management

5V or 5V+12V SATA Supply Rail11

SATA Interface Power Management

OS-aware hot plug/removal

Enhanced power-loss data protection feature

Power12

Active: Up to 6.9 W (TYP)8

Idle: 600 mW

Weight:

200GB: 82 grams ± 2 grams

400GB: 82 grams ± 2 grams

800GB: 88 grams ± 2 grams

1.2TB: 94 grams ± 2 grams

Temperature

Operating: 0° C to 70° C

Non-Operating13: -55° C to 95° C

Temperature monitoring and logging

Thermal throttling

Shock (operating and non-operating):

1,000 G/0.5 ms

Vibration

Operating: 2.17 GRMS (5-700 Hz)

Non-Operating: 3.13 GRMS (5-800 Hz)

Reliability

Uncorrectable Bit Error Rate (UBER): 1 sector per 10^17 bits read

Mean Time Between Failures (MTBF): 2 million hours

End-to-End data protection

Certifications and Declarations

UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHCK, VCCI*, SATA-IO*

Compatibility

Windows 7* and Windows 8*, and Windows 8.1*

Windows Server 2012* R2

Windows Server 2012*

Windows Server 2008* Enterprise 32/64bit SP2

Windows Server 2008* R2 SP1

Windows Server 2003* Enterprise R2 64bit SP2

VMWare* 5.1, 5.5

Red Hat* Enterprise Linux* 5.5, 5.6, 6.1, 6.3, 7.0

SUSE* Linux* Enterprise Server 10, 11 SP1

CentOS* 64bit 5.7, 6.3

Intel® SSD Toolbox with Intel® SSD Optimizer

1.Performance values vary by capacity

2.Performance specifications apply to both compressible and incompressible data

3.4KB = 4,096 bytes; 8KB = 8,192 bytes.

4.MB/s = 1,000,000 bytes/second

5.Based on JESD218 standard.

6.Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host

7.Based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test)

8.Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability

9.Altitude pressure is simulated in a test chamber; excludes soft error

10.Extended operation at a higher altitude might impact reliability.

11.If both 12V and 5V power supplies are present, defaults to 5V+ 12V power supplies. Does not support 12 volt only.

12.Based on 5Vpower supply

13.Please contact your Intel representative for details on the non-operating temperature range

Order Number: 331847-004US

Intel® Solid-State Drive DC S3710 Series

Ordering Information

Contact your local Intel sales representative for ordering information.

Revision History

Revision	Description	Date
001	Initial release	January 2015
002	Updated values in Table 1, “User Addressable Sectors.”	March 2015
	Table 18, SMART Attributes:
	SMART Attribute EAh – added bytes description
003	Added new SMART Attribute F3h description and status flags	July 2015
	Section 5.4.2: Updated SMART Attribute E2h decimal precision
	points from 3 to 2
004	Table 4, Documentation correction	September 2015

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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel Non-Volatile Memory Solutions Group (NSG) states that, through our Software Legal Compliance (SWLC) process, we have examined and evaluated firmware and software components that may accompany this Intel Solid-State Drive product, including embedded SSD firmware and any Intel-provided drivers. We conclude that there are no Open Source elements contained in these components. For more information about our SWLC process, please contact your Intel Representative.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.

Copyright © 2015 Intel Corporation. All rights reserved.

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Contents

1	Overview.......................................................................................................................................................................................................		6
2	Product Specifications ..............................................................................................................................................		7
	2.1	Capacity.........................................................................................................................................................................................	7
	2.2	Performance................................................................................................................................................................................	7
	2.3	Electrical Characteristics .......................................................................................................................................................	9
	2.4	Environmental Conditions.................................................................................................................................................	12
	2.5	Product Regulatory Compliance.....................................................................................................................................	12
	2.6	Reliability ...................................................................................................................................................................................	13
	2.7	Temperature Sensor ............................................................................................................................................................	14
	2.8	Power Loss Capacitor Test ................................................................................................................................................	14
	2.9	Hot Plug Support ...................................................................................................................................................................	14
3	Mechanical Information .........................................................................................................................................		15
4	Pin and Signal Descriptions ..................................................................................................................................		16
	4.1	Form Factor Pin Locations.................................................................................................................................................	16
	4.2	Connector Pin Signal Definitions....................................................................................................................................	16
	4.3	Power Pin Signal Definitions.............................................................................................................................................	17
5	Supported Command Sets ....................................................................................................................................		18
	5.1	ATA General Feature Command Set.............................................................................................................................	18
	5.2	Power Management Command Set...............................................................................................................................	18
	5.3	Security Mode Feature Set ................................................................................................................................................	19
	5.4	SMART Command Set .........................................................................................................................................................	19
	5.5	Device Statistics......................................................................................................................................................................	25
	5.6	SMART Command Transport (SCT)...............................................................................................................................	26
	5.7	Data Set Management Command Set ..........................................................................................................................	26
	5.8	Host Protected Area Command Set..............................................................................................................................	26
	5.9	48-Bit Address Command Set .........................................................................................................................................	27
	5.10	General Purpose Log Command Set.............................................................................................................................	27
	5.11	Native Command Queuing ................................................................................................................................................	27
	5.12	Software Settings Preservation.......................................................................................................................................	27
6	Certifications and Declarations ............................................................................................................................		28
7	References ................................................................................................................................................................		29
Appendix A: IDENTIFY DEVICE Command Data...............................................................................................................			30

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Figures

Figure 1:

Intel SSD DC S3710 Series 2.5-inch Dimensions.................................................................................................................

15

Tables
Table 1:	User Addressable Sectors.....................................................................................................................................................................	7
Table 2:	Random Read/Write Input/Output Operations Per Second (IOPS) ..................................................................................	7
Table 3:	Random Read/Write IOPS Consistency..........................................................................................................................................	8
Table 4:	Sequential Read and Write Bandwidth...........................................................................................................................................	8
Table 5:	Latency...........................................................................................................................................................................................................	8
Table 6:	Quality of Service......................................................................................................................................................................................	9
Table 7:	Operating Voltage ....................................................................................................................................................................................	9
Table 8:	Power Consumption for 5V Supply...............................................................................................................................................	10
Table 9:	Power Consumption for 5V + 12V Supply.................................................................................................................................	11
Table 10:	Temperature, Shock, Vibration........................................................................................................................................................	12
Table 11:	Product Regulatory Compliance Specifications ......................................................................................................................	12
Table 12:	Reliability Specifications.....................................................................................................................................................................	13
Table 13:	Serial ATA Connector Pin Signal Definitions.............................................................................................................................	16
Table 14:	Serial ATA Power Pin Definitions....................................................................................................................................................	17
Table 15:	SMART Attributes ..................................................................................................................................................................................	19
Table 16:	SMART Attribute Status Flags..........................................................................................................................................................	22
Table 17:	Serial ATA Power Pin Definitions—2.5-inch Form Factors ................................................................................................	25
Table 18:	Device Certifications and Declarations ........................................................................................................................................	28
Table 19:	Standards References..........................................................................................................................................................................	29
Table 20:	Returned Sector Data...........................................................................................................................................................................	30

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Terminology

	Term	Definition
	ATA	Advanced Technology Attachment
	CRC	Cyclic Redundancy Check
	DAS	Device Activity Signal
	DMA	Direct Memory Access
	ECC	Error Correction Code
	EXT	Extended
	FPDMA	First Party Direct Memory Access
	GB	Gigabyte. Note: The total usable capacity of the SSD may be less than the total physical capacity
		because a small portion of the capacity is used for NAND flash management and maintenance purposes.
	Gb	Gigabit
	HDD	Hard Disk Drive
	HET	High Endurance Technology
	KB	Kilobyte
	I/O	Input/Output
	IOPS	Input/Output Operations Per Second
	ISO	International Standards Organization
	LBA	Logical Block Address
	MB	Megabyte (1,000,000 bytes)
	MLC	Multi-level Cell
	MTBF	Mean Time Between Failures
	NCQ	Native Command Queuing
	NOP	No Operation
	PB	Petabyte
	PCB	Printed Circuit Board
	PIO	Programmed Input/Output
	RDT	Reliability Demonstration Test
	RMS	Root Mean Square
	SATA	Serial Advanced Technology Attachment
	SCT	SMART Command Transport
	SMART	Self-Monitoring, Analysis and Reporting Technology. This is an open standard for developing hard drives
		and software systems that automatically monitors the health of a drive and reports potential problems.
	SSD	Solid-State Drive
	TB	Terabyte
	TYP	Typical
	UBER	Uncorrectable Bit Error Rate

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1 Overview

This document describes the specifications and capabilities of the Intel® SSD DC S3710 Series.

The Intel SSD DC S3710 Series delivers excellent performance and Quality of Service combined with high reliability for Serial Advanced Technology Attachment (SATA)-based computers in capacities of 200GB, 400GB, 800GB, and 1.2TB.

By combining 20nm Intel® NAND Flash Memory technology with SATA 6Gb/s interface support, the Intel SSD DC S3710 Series delivers Sequential Read speeds of up to 550 MB/s and Sequential Write speeds of up to 520 MB/s. The Intel SSD DC S3710 Series also delivers Random 4k Read speeds of up to 85,000 IOPS and Random 4K Write speeds of up to 45,000 IOPS, and Quality of Service of 500 µs for random 4KB reads measured at a queue depth of 1.

The industry-standard 2.5-inch form factor enables interchangeability with existing hard disk drives (HDDs) and native SATA HDD drop-in replacement with the enhanced performance, reliability, ruggedness, and power savings offered by an SSD.

Intel SSD DC S3710 Series offers these key features:

High Endurance Technology

High I/O and throughput performance

Consistent I/O latency

Enhanced power-loss data protection

End-to-End data protection

Thermal throttling

Temperature Sensor

Inrush current management

Low power

High reliability

Temperature monitor and logging

Power loss protection capacitor self-test

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2 Product Specifications

2.1Capacity

Table 1:	User Addressable Sectors
Intel SSD DC S3710 Series			Unformatted Capacity
			(Total User Addressable Sectors in LBA Mode)
	200GB		390,721,968
	400GB		781,422,768
	800GB		1,562,824,368
	1.2TB		2,344,225,968

Notes:

1GB = 1,000,000,000 bytes; 1 sector = 512 bytes.

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.

The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

2.2Performance

Table 2:	Random Read/Write Input/Output Operations Per Second (IOPS)
				Intel SSD DC S3710 Series
Specification1		Unit
			200GB	400GB		800GB	1.2TB
Random 4KB Read (up to)2		IOPS	85,000	85,000		85,000	85,000
Random 4KB Write (up to)		IOPS	43,000	43,000		39,000	45,000
Random 8KB Read (up to)3		IOPS	52,000	52,000		52,000	52,000
Random 8KB Write (up to)		IOPS	21,000	20,000		19,000	21,000
Random 4KB		IOPS	56,000	62,000		62,000	63,000
70/30 Read/Write (up to)2
Random 8KB		IOPS	35,000	37,000		37,000	39,000
70/30 Read/Write (up to)3

Notes:

1.Performance measured using IOMeter* with Queue Depth 32. Measurements are performed on a full Logical Block Address (LBA) span of the drive.

2.4KB = 4,096 bytes

3.8KB = 8,192 bytes

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Table 3:	Random Read/Write IOPS Consistency
				Intel SSD DC S3710 Series
	Specification1	Unit
			200GB	400GB	800GB	1.2TB
Random 4KB Read (up to)2		%	90	90	90	90
Random 4KB Write (up to)		%	90	90	90	90
Random 8KB Read (up to)3		%	90	90	90	90
Random 8KB Write (up to)		%	90	90	90	90

Notes:

1.Performance consistency measured using IOMeter* based on Random 4KB QD=32 workload, measured as the (IOPS in the 99.9th percentile slowest 1-second interval) / (average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

2.4KB = 4,096 bytes

3.8KB = 8,192 bytes

Table 4:	Sequential Read and Write Bandwidth
				Intel SSD DC S3710 Series
	Specification1	Unit
			200GB	400GB	800GB	1.2TB
Sequential Read (SATA 6Gb/s) 1		MB/s	550	550	550	550
Sequential Write (SATA 6Gb/s) 1		MB/s	300	470	460	520

Note:

1.Performance measured using IOMeter* with 128KB (131,072 bytes) of transfer size with Queue Depth 32.

Table 5:	Latency
		Intel SSD DC S3710 Series
	Specification
		200GB/400GB		800GB/1.2TB
Latency1 (TYP)
Read		55 µs		55 µs
Write		66 µs		66 µs
Power On to Ready2		5.0 s		7.0 s

Notes:

1.Device measured using IOMeter*. Latency measured using 4KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload.

2.Power On To Ready time assumes proper shutdown. Time varies if shutdown is not preceded by STANDBY IMMEDIATE command. For 95% of the time, the maximum time for power on to ready will be less than 15 seconds.

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Table 6:	Quality of Service
				Intel SSD DC S3710 Series
	Specification	Unit
			Queue Depth=1		Queue Depth=32
			200GB/400GB	800GB/1.2TB	200GB/400GB	800GB/1.2TB
Quality of Service1,2 (99.9%)
Reads		ms	0.5/2	0.2/1	1	1/2
Writes		ms	0.2	0.2	5	5
Quality of Service1,2 (99.9999%)
Reads		ms	10	10	10/5	5/10
Writes		ms	5	5/10	15/20	30

Notes:

1.Device measured using IOMeter*. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

2.Based on Random 4KB QD=1, 32 workloads, measured as the time taken for 99.9(or 99.9999) percentile of commands to finish the round-trip from host to drive and back to host.

2.3Electrical Characteristics

Table 7: Operating Voltage

		Intel SSDDC S3710 Series
	Electrical Characteristics
		200GB, 400GB, 800GB, 1.2TB
	5V Operating Characteristics:
	Operating Voltage range	5V (±5%)
	Inrush Current (Typical Peak) 1	1.2A for the first 1s
	12V Operating Characteristics:
	Operating Voltage range	12V (±10%)
	Inrush Current (Typical Peak) 1	1.2A for the first 1s

Notes:

1.Measured from initial device power supply application.

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Table 8:	Power Consumption for 5V Supply
				Intel SSD DC S3710 Series
	Specification	Unit
			200GB	400GB	800GB	1.2TB
Active Write - RMS Average1		W	4.0	5.4	5.9	6.9
Active Write - Burst2		W	4.4	7.1	8.8	10.6
Active Write - Max Burst3		W	7.1	9.5	11.1	12.4
Active Read - RMS Average4		W	2.6	2.7	3.0	3.1
Active Read - Burst5		W	3.7	4.4	4.8	5.1
Active Read – Max Burst6		W	5.2	5.3	5.5	5.6
Idle		W	0.5	0.6	0.6	0.6

Notes:

1.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. RMS (Root Mean Squared) Average Power is measured using Agilent Power Analyzer over a 100 ms sample period with PLI capacitor charge enabled.

2.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. RMS (Root Mean Squared) Burst Power is measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge disabled.

3.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential writes. RMS (Root Mean Squared) Max Burst power is measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge enabled. Pulse is 0.25% of total time.

4.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. RMS (Root Mean Squared) average power is measured using Agilent Power Analyzer over a 100 ms sample period with PLI capacitor charge enabled.

5.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. RMS (Root Mean Squared) burst power is measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge disabled.

6.The workload equates 128 KB (131,072 bytes) Queue Depth equal to 32 sequential reads. RMS (Root Mean Squared) Max Burst power is measured using Agilent Power Analyzer over a 500 µs sample period with PLI capacitor charge enabled. Pulse is approximately 0.25% of total time.

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