Product brief
Intel® SSD 660p Series
PCIe* (p), 3D NAND
Intel QLC Technology Built for the PC.
Capacity at an Amazing Price.
Finally, PCIe* and Intel QLC 3D NAND in one SSD.
Meet today’s storage needs and prepare for the growing demands of tomorrow
with the Intel® SSD 660p Series built on Intel QLC 3D NAND technology.
The Intel SSD 660p is the rst QLC-based client PCIe* SSD in the industry,
continuing Intel’s leadership in ash cell technology and quality manufacturing.
The SSD 660p nally ts low-cost and high-capacity into one drive.
PCIe* Performance at an Aordable Price
Empowered by Intel’s innovative Intel QLC technology, the Intel® SSD 660p oers
higher capacities at a lower cost than TLC-based options.² With PCIe, the new SSD
660p skips SATA and its limitations to oer up to 2TB in one drive.
2x the Capacity in Identical Footprints
These client SSDs pack more data than TLC-based storage, allowing up to 2x more
capacity in identical footprints. The thin M.2 80mm form factor makes it perfect
for notebooks, desktops, and mobile devices that need storage for everyday
computing.
The architecture of Intel QLC technology in the SSD 660p is made to intelligently
boost performance. QLC and SLC “spans” on the drive adjust bi-directionally based
on used capacity for the life of the product. Increases in capacity usage trigger
the SLC span to decrease, and decreases in capacity usage trigger the SLC span to
increase.
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Performance and Price that Matter
The SSD 660p hits the marks that matter for client SSDs. This drive is tuned to
deliver a capacity optimized NVMe* performance and deliver an intelligent storage
option for mainstream and entry-level computing. Oered in 512GB, 1TB, and 2TB,
and at an aordable price.²
Why Intel?
Intel has a foundation in innovation leadership, our complete product life cycle
support that extends from ecosystem enabling to design-in to post-sales support,
and the quality of our supply chain.
Our foundation results in drives with robust and lasting data integrity, reliably
eective performance, and increased platform condence through our unique
position as a platform provider. Intel knows workloads, and we architect our
products to excel in real world use.
Product Brief | Intel® SSD 600p Series
FE ATUR ES-AT-A - GLAN CE
MODEL NAME Intel® Solid State Drive 660p Series
Capacity (GB) 512, 1024 (1TB), 2048 (2TB)
NAND Flash Memory 64-layer, QLC, Intel® 3D NAND
Bandwidth Sequential Read: up to 1800MB/s, Sequential Write: up to 1800MB/s
Bandwidth Random 4KB Reads: up to 220,000 IOPS, Random 4KB Writes: up to 220,00 IOPS
Interface PCIe* 3.0x4, NVMe*
Form Factor, Height, Weight 80mm M.2 2280, S3, <10 grams
Power Consumption Active: 100mW, Idle: 40mW
Operating Tempurature 0° C to 70° C
Warranty 5-year limited warranty
High Capacity NVMe* PCIe* SSDS For Everyday Computing.
More Value
Intel® QLC 3D NAND
Low Power³
Better Performance
To learn more, visit www.intel.com/ssd
1 2x more cap acity in ident ical fo otprints ba sed on spe cication comparisons betwe en the Intel® SSD 660p (up to 2TB) and Intel® SSD 600 (up to 1TB)
2 Intel® SSD 660p 512GB vs Inte l® SSD 545s 512GB ($109. 99) Source: Inte l.co m
3 As mea sured by MM14 ben chmark comp ared to SATA Intel® SSD 5 45s and PCIe* I ntel® SSD 760p
Intel technologies ’ features and benet s depend on system conguration and may requi re enab led hardware, sof twa re, or service activatio n. Performance varies depending on sys tem congu-
ratio n. No compute r system ca n be absolute ly secure. Ch eck with your s ystem manu facture r or retailer t o learn more.
Intel disclaims all exp ress and implie d warr anties, inc ludin g without limit ation the implied warranti es of merchantability, tness for a par ticular pur pose , and non-infringe ment, as well as any
warr anty arising from course of perfor mance, course of dealin g, or usage in trade.
The benchmar k results may nee d to be revis ed as additional testing is conducte d. The results depend on the specic platfor m cong urations and workloads util ized in the te sting, and may not
be appli cable to any part icular user ’s component s, computer sy stem or wo rkloa ds. Th e result s are not ne cessa rily represe ntative of other benchmarks and other benchmark results may show
greater or lesser impact from mitigations.
Tests document pe rformance of compon ents on a partic ular test, in specic syste ms. Dierences in har dware, sof twa re, or congur ation will aect actual per formance. Consult other sources of
infor matio n to evaluate per formance as you consider your pur chas e.
Soft ware and workloads us ed in perform ance tests may have been optimized for performance only on Intel mic roprocessors.
Intel , the Inte l logo, and Xeon are tradema rks of Intel Corporation or its su bsidi aries in the U.S . and/or other countries.
*Other names and brands may be claimed as the prop ert y of others.
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