Intel SSDPEDMX020T401 User Manual
Intel® Solid-State Drive DC P3500 Series
Product Specification
Capacities:
400GB, 1.2TB, 2TB
Components
– Intel® 20nm MLC NAND Flash Memory
PCIe* Gen3 X4
Form Factors
2.5-inch Form Factor
15mm Z-height
8639-compatible connector
AIC Form Factor
Half-height, Half-length
Single slot x4 connector
Performance
Seq R/W: Up to 2700/1800MB/s
IOPS Rnd 70/30 4KB
1,2
4
: Up to 80K
3
Seq Latency (typ) R/W: 20/20µs
Operating System Support:
Windows* Server 2012, 2012R2, 2008R2 x64
Windows* 7, Windows* 8, Windows* 8.1
RHEL* 6.5/6.6, RHEL* 7.0
SLES* 11 SP3
UEFI 2.3.1
Reliability
Uncorrectable Bit Error Rate (UBER):
1 sector per 10
17
bits read
Mean Time Between Failure (MTBF):
2 million hours
T10 DIF protection
Variable Sector Size:512, 520, 528, 4096,
4104, 4160, 4224 Bytes
Power
2.5-inch: 3.3V and 12V Supply Rail
AIC: 3.3V and 12V Supply Rail
Enhanced power-loss data protection
Active/Idle (TYP): Up to 25W/4W (TYP)
Compliance
NVM Express* 1.0
PCI Express* Base Specification Rev 3.0
Enterprise SSD Form Factor Version 1.0a
PCI Express* Card Electro-Mechanical (CEM)
Specification Rev 2.0
Certifications and Declarations
UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft*
WHQL*, VCCI*
Endurance Rating
Up to 1095 TBW (Terabytes Written)
Temperature Specification
Operating:
AIC: 0 to 55° C with specified airflow
2.5-inch: 0 to 35° C ambient,
0 to 70° C case with specified airflow
Non-Operating
6
: -55 to 95° C
Temperature monitoring (In-band and
by way of SMBUS)
Thermal throttling when approaching
maximum operating temperature
Airflow
AIC (55° C airflow towards IO bracket
400 GB: 100 LFM
1.2TB/2.0TB: 300 LFM
2.5-inch (Airflow towards the connector)
400GB: 250/300 LFM (25/35° C)
1.2TB/2.0TB: 450/650 LFM (25/35° C)
Weight
AIC: 400GB up to 185gm
1.2TB, 2TB up to 195gm
2.5-inch: 400GB up to 115 gm
1.2TB, 2TB up to 125gm
Shock
2.5-inch: 1,000 G/0.5msec
AIC: 50 G Trapezoidal, 170 in/s
Vibration
Operating: 2.17 G
Non-Operating: 3.13 G
Altitude (Simulated)
(5-700Hz)
RMS
(5-800Hz)
RMS
Operating: -1,000 to 10,000 ft
Non-Operating: -1,000 to 40,000 ft
Product Ecological Compliance
RoHS
5
7
)
Performance values vary by capacity and form factor
1.
2. Performance specifications apply to both compressible and incompressible data
3. MB/s = 1,000,000 bytes/second
4. 4KB = 4,096 bytes; 8 KB = 8,192 bytes
5. 1PB = 10
6. Please contact your Intel representative for details on the non-operating temperature range
7. Airflow out of server through PCIe Card Slot
15
Bytes
Order Number: 332164-003US
Ordering Information
Contact your local Intel sales representative for ordering information.
Intel® Solid-State Drive DC P3500 Series
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the
absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The information here is subject to change without notice. Do not finalize a design with this information.
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or
configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider
your purchase.
All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections
within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.
The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
This document contains information on products in the design phase of development.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be
obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2015 Intel Corporation. All rights reserved.
Product Specification May 2015
2 332164-003US
Intel® Solid-State Drive DC P3500 Series
Contents
1 Overview ....................................................................................................................................................................................................... 6
1.1 References ................................................................................................................................................................................................... 7
1.2 Terms and Acronyms ........................................................................................................................................................................... 8
2 Product Specifications.......................................................................................................................................................................... 9
2.1 Capacity ......................................................................................................................................................................................................... 9
2.2 Performance ................................................................................................................................................................................................ 9
2.3 Electrical Characteristics ................................................................................................................................................................. 11
2.4 Environmental Conditions .............................................................................................................................................................. 13
2.5 Product Regulatory Compliance ................................................................................................................................................ 14
2.6 Reliability Specifications .................................................................................................................................................................. 15
2.7 Temperature Sensor .......................................................................................................................................................................... 15
2.8 Power Loss Capacitor Test ............................................................................................................................................................ 16
2.9 Hot Plug Support .................................................................................................................................................................................. 16
2.10 Out of Band Management (SMBUS) ....................................................................................................................................... 16
2.11 Variable Sector Size Support ....................................................................................................................................................... 16
3 Mechanical Information ................................................................................................................................................................... 17
4 Pin and Signal Descriptions .......................................................................................................................................................... 19
4.1 Pin Signal Definitions ........................................................................................................................................................................ 19
5 Supported Command Sets ............................................................................................................................................................ 23
5.1 NVMe Admin Command Set ......................................................................................................................................................... 23
5.2 NVMe I/O Command Set ................................................................................................................................................................ 23
5.3 Log Page Support................................................................................................................................................................................. 24
5.4 SMART Attributes ................................................................................................................................................................................. 24
5.5 Temperature Statistics ..................................................................................................................................................................... 27
5.6 Drive Marketing Name Log ........................................................................................................................................................... 27
5.7 SET Feature Identifiers .................................................................................................................................................................... 28
6 NVMe Driver Support ........................................................................................................................................................................ 30
7 Certifications and Declarations .................................................................................................................................................. 31
Appendix A IDENTIFY Data Structure ......................................................................................................................................... 32
Appendix B Vital Data Structure...................................................................................................................................................... 40
Appendix C Out of Band Temperature Sensor Read Out ............................................................................................... 41
Appendix D Appendix D PCIe ID ...................................................................................................................................................... 42
Appendix E Appendix E SCSI Command Translation ....................................................................................................... 43
Appendix F Appendix F Add-in Card LED Decoder ............................................................................................................. 44
May 2015 Product Specification
332164-003US 3
Intel® Solid-State Drive DC P3500 Series
Figures
Figure 3-1 Intel SSD DC P3500 Series SFF Dimensions ........................................................................................................................ 17
Figure 3-2 Intel SSD DC P3500 Series PCIe Dimensions ...................................................................................................................... 18
Figure A-1 LED Location ....................................................................................................................................................................................... 44
Tables
Table 1: Standard Information Referenced in this Document ........................................................................................... 7
Table 2: Glossary of Terms and Acronyms .................................................................................................................................. 8
Table 3: User Addressable Sectors ................................................................................................................................................. 9
Table 4: Random Read/Write Input/Output Operations Per Second (IOPS) ............................................................... 9
Table 5: Random Read/Write IOPS Consistency ................................................................................................................... 10
Table 6: Sequential Read and Write Bandwidth .................................................................................................................... 10
Table 7: Latency .................................................................................................................................................................................... 10
Table 8: Quality of Service ............................................................................................................................................................... 11
Table 9: Operating Voltage .............................................................................................................................................................. 11
Table 10: Power Consumption ......................................................................................................................................................... 12
Table 11: Temperature, Shock, Vibration .................................................................................................................................... 13
Table 12: Airflow requirement for Intel SSD DC P3500 Series (Add-In Card) ............................................................ 13
Table 13: Airflow Requirements for Intel SSD DC P3500 Series (2.5-inch Form Factor) ...................................... 14
Table 14: Product Regulatory Compliance Specifications ................................................................................................... 14
Table 15: Reliability Specifications ................................................................................................................................................. 15
Table 16: Pin Definition for 2.5-inch Form Factor (8639 connector specification) .................................................. 19
Table 17: Pin Definition for Add-In Card (Half Height Half Length) Form Factor ...................................................... 21
Table 18: SMART Attributes (Log Identifier 02h) ..................................................................................................................... 24
Table 19: Additional SMART Attributes (Log Identifier CAh) .............................................................................................. 26
Table 20: Temperature Statistics (Log Identifier C5h) ........................................................................................................... 27
Table 21: Drive Marketing Name Log (Log Identifier DDh) .................................................................................................. 27
Table 22: Set Max LBA Setting - Command Dword 11 and Command Dword 12 .................................................... 28
Table 23: Status Code - Set Max LBA Command Specific Status Values ...................................................................... 29
Table 24: C6h - Set/ Get Power (Typical) Governor Setting – Command Dword 11 ............................................... 29
Table 25: Status Codes - Power Governor Setting Command Specific Status Values ........................................... 29
Table 26: D5h - Reset Timed Workload Counters - Command Dword 11 ................................................................... 29
Table 27: NVMe Driver Support ....................................................................................................................................................... 30
Table 28: Device Certifications and Declarations .................................................................................................................... 31
Table 29: Identify Controller .............................................................................................................................................................. 32
Table 30: Power State Descriptor .................................................................................................................................................... 36
Table 31: Identify Namespace........................................................................................................................................................... 37
Table 32: LBA Format Data Structure ............................................................................................................................................ 39
Table 33: Vital Product Data Structure (VPD) ............................................................................................................................ 40
Table 34: Capability List Pointer (Out of Band Temperature Sensor) ............................................................................ 40
Table 35: Register 0x05 read out format ..................................................................................................................................... 41
Table 36: PCIe ID ..................................................................................................................................................................................... 42
Table 37: LED Functionality ............................................................................................................................................................... 44
Product Specification May 2015
4 332164-003US
Intel® Solid-State Drive DC P3500 Series
Revision
Number
Description
Revision Date
001
Initial release
March 2015
002
Updated Table 3: User Addressable Sectors – Unformatted Capacity
April 2015
003
Table 9: Min Off time changed from 500 ms to 3 seconds and
Clarified Slew Rate Specifications
Removed inaccurate 2.5-inch Form Factor Pin Locations illustration
May 2015
Revision History
§
May 2015 Product Specification
332164-003US 5
Intel® Solid-State Drive DC P3500 Series
1 Overview
This document describes the specifications and capabilities of the Intel® Solid State Drive (SSD)
DC P3500 Series.
The Intel SSD DC P3500 Series is a PCIe Gen3 SSD architected with the new high performance controller interface NVMe (Non-Volatile Memory express) delivering leading performance, low latency and QoS (Quality of Service).
Matching the performance with world-class reliability and endurance, Intel SSD DC P3500 Series offer a range of
capacity – 400GB, 1.2TB, and 2TB in both AIC (Add-In card) and 2.5-inch form factor.
With PCIe* Gen3 support and NVMe queuing interface, the Intel SSD DC P3500 Series delivers excellent sequential
read performance of up to 2.7 GB/s and sequential write speeds of up to 1800MB/s. Intel SSD DC P3500 Series
delivers very high random read IOPS of 440K and random write IOPS of 68K for 4KB operations. Taking advantage
of the direct path from the storage to the CPU by means of NVMe, Intel SSD DC P3500 Series exhibits low latency
of less than 18 μs for sequential access to the SSD.
The 2.5-inch Intel SSD DC P3500 Series takes advantage of the 8639 connector and provides
hot-pluggable removal and insertion providing in-service replacement options.
Intel SSD DC P3500 Series includes these key features:
Consistently High IOPS and throughput
Sustained low latency
Variable Sector Size and End-to-End data-path protection
Enhanced power-loss data protection
Power loss protection capacitor self-test
Out of band management
Thermal throttling and monitoring
Product Specification May 2015
6 332164-003US
Intel® Solid-State Drive DC P3500 Series
Date
Title
Location
Jan 2013
Enterprise SSD Form Factor Version 1.0a
http://www.ssdformfactor.org
Feb 2012
NVMe Revision 1.0c
http://www.nvmexpress.org
Nov 2010
PCIe* Base Specification Revision 3.0
http://pcisig.com
July 2012
Solid-State Drive (SSD) Requirements and Endurance
Test Method (JESD219)
http://www.jedec.org/standardsdocuments/results/jesd219
Sept 2010
Solid-State Drive (SSD) Requirements and Endurance
Test Method (JESD218)
http://www.jedec.org/standardsdocuments/docs/jesd218/
Dec 2008
VCCI
http://www.vcci.jp/vcci_e/
June 2009
RoHS
http://qdms.intel.com/
Click Search MDDS Database and
search for material description
datasheet
1995
1996
1995
1995
1997
1994
International Electrotechnical Commission EN 61000
4-2 (Electrostatic discharge immunity test)
4-3 (Radiated, radio-frequency, electromagnetic field
immunity test)
4-4 (Electrical fast transient/burst immunity test)
4-5 (Surge immunity test)
4-6 (Immunity to conducted disturbances, induced by
radio- frequency fields)
4-11 (Voltage Variations, voltage dips, short interruptions
and voltage variations immunity tests)
http://www.iec.ch/
1995
ENV 50204
(Radiated electromagnetic field from digital radio
telephones)
http://www.dbicorporation.com/
radimmun.htm/
1.1 References
Table 1: Standard Information Referenced in this Document
May 2015 Product Specification
332164-003US 7
Term
Definition
ATA
Advanced Technology Attachment
CRC
Cyclic Redundancy Check
DAS
Device Activity Signal
DMA
Direct Memory Access
ECC
Error Correction Code
EEPROM
Electrically Erasable Programmable Read Only Memory
EXT
Extended
FPDMA
First Party Direct Memory Access
GB
Gigabyte
Note: The total usable capacity of the SSD may be less than the total physical capacity
because a small portion of the capacity is used for NAND flash management and
maintenance purposes.
Gb
Gigabit
HDD
Hard Disk Drive
HET
High Endurance Technology
KB
Kilobyte
I/O
Input/Output
IOPS
Input/Output Operations Per Second
ISO
International Standards Organization
LBA
Logical Block Address
MB
Megabyte (1,000,000 bytes)
MLC
Multi-level Cell
MTBF
Mean Time Between Failures
NOP
No Operation
NVMe
Non-Volatile Memory Express
PB
Petabyte
PCB
Printed Circuit Board
RDT
Reliability Demonstration Test
RMS
Root Mean Square
SSD
Solid-State Drive
TB
Terabyte
TYP
Typical
UBER
Uncorrectable Bit Error Rate
VPD
Vital Product Data
1.2 Terms and Acronyms
Table 2: Glossary of Terms and Acronyms
Intel® Solid-State Drive DC P3500 Series
§
Product Specification May 2015
8 332164-003US
Intel® Solid-State Drive DC P3500 Series
Intel SSD DC P3500 Series
Unformatted Capacity
(Total User Addressable Sectors in LBA Mode)
400GB
781,422,768
1.2TB
2,344,225,968
2TB
3,907,029,168
Specification1
Unit
Intel SSD DC P3500 Series
400GB
1.2TB
2TB
Random 4KB 70/30
Read/Write (up to)2
IOPS
65,000
65,000
80,000
Random 8KB 70/30
Read/Write (up to)2
IOPS
35,000
35,000
40,000
Random 4KB Read (up to)
IOPS
420,000
420,000
430,000
Random 4KB Write (up to)
IOPS
23,000
23,000
28,000
Random 8KB Read (up to)
IOPS
220,000
250,000
250,000
Random 8KB Write (up to)
IOPS
10,000
10,000
14,000
2 Product Specifications
2.1 Capacity
Table 3: User Addressable Sectors
NOTES:
1. 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes or 520 bytes or 528 bytes LBA count shown represents total
user storage capacity and will remain the same throughout the life of the drive.
2. The total usable capacity of the SSD may be less than the total physical capacity because a small portion
of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.
2.2 Performance
Table 4: Random Read/Write Input/Output Operations Per Second (IOPS)
NOTES:
1. Performance measured using IOMeter* on Intel provided Windows Server 2012R2 driver with Queue Depth 128
(QD=32, workers=4). Measurements are performed on a full Logical Block Address (LBA) span of the drive. Power
mode set at 25W.
2. 4KB = 4,096 bytes
3. 8KB = 8,192 bytes
May 2015 Product Specification
332164-003US 9
Intel® Solid-State Drive DC P3500 Series
Specification1
Unit
Intel SSD DC P3500 Series
400GB
1.2TB
2TB
Random 4KB Read (up to)2
%
90
88
88
Random 4KB Write (up to)
%
90
90
90
Random 8KB Read (up to)3
%
90
88
85
Random 8KB Write (up to)
%
90
90
90
Specification
Unit
Intel SSD DC P3500 Series
400GB
1.2TB
2TB
Sequential Read1
MB/s
2,200
2,600
2,700
Sequential Write1
MB/s
1,000
1,200
1,800
Specification
Intel SSD DC P3500 Series
Latenct1 (TYP)
Read Sequential/Random
Write Sequential/Random
Power on to PCIe Config Ready
2
Power on to Controller Ready
3
20/120µs
20/30µs
2.0 sec
10.0 sec (TYP)
Table 5: Random Read/Write IOPS Consistency
NOTES:
1. Performance consistency measured using IOMeter* based on Random 4KB QD=128 (QD=32, workers=4) workload,
measured as (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements
are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but
including all background activities required for normal operation and data reliability
2. 4KB = 4,096 bytes
3. 8KB = 8,192 bytes
Table 6: Sequential Read and Write Bandwidth
Note:
Performance measured using IOMeter* with 64 KB (65,536 bytes) of transfer size with Queue
Depth 128. Power mode set at 25W.
Table 7: Latency
NOTES:
1. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 using Windows Server 2012R2
2. Power On To Ready time measured from de-assertion of PCIe* reset to PCIe Config Ready state.
3. Power On to Controller ready signifies when drive can begin receiving PCIe commands from host based on a single
Product Specification May 2015
10 332164-003US
driver. Power mode set at 25W.
#PERESET. For power on from unsafe shutdown, power on to controller ready can take up to 20 seconds.
Intel® Solid-State Drive DC P3500 Series
Specification
Unit
Intel SSD DC P3500 Series
QD=1
QD=128
Quality of Service
1,2
(99%)
Reads
ms
0.150 (400GB)
0.120 (1.2TB and 2TB)
1.5 (400GB)
0.75 (1.2TB and 2TB)
Writes
ms
0.120 (400GB)
0.100 (1.2TB and 2TB)
18
Quality of Service
1, 2
(99.99%)
Reads
ms
4 5 Writes
ms
4
30
Electrical Characteristics
Intel SSD DC P3500 Series
3.3V Operating Characteristics: (Add-in Card only)
Operating Voltage range
Rise Slew Rate (Max/Min)
Fall Slew Rate (Max/Min)1
Noise level
Min Off time2
Inrush Current (Typical Peak)
3
Max Average Current
3.3 V (±10%)
66/3300 V/s
0.66/3300 V/s
300 mV pp 10Hz – 100 KHz
50 mV pp 100KHz – 20 MHz
3 seconds
1.5 A
3.0 A
12V Operating Characteristics:
Operating Voltage range
Rise Slew Rate (Max/Min)
Fall Slew Rate (Max/Min)1
Noise level
Min Off time2
Inrush Current (Typical Peak)
3
Max Average Current
12 V (+10%/-20%)
240/12000 V/s
2.4/12000 V/s
1000 mV pp 10Hz – 100 KHz
100 mV pp 100KHz – 20 MHz
3 seconds
1.5 A
2.1 A/ 2.45 A (Add-in Card/2.5” FF)
Table 8: Quality of Service
NOTES:
1. Device measured using IOMeter. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random
workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but
including all background activities required for normal operation and data reliability.
2. Based on Random 4KB QD=1,128 workloads, measured as the time taken for 99.0(or 99.99) percentile of commands
to finish the round-trip from host to drive and back to host.
2.3 Electrical Characteristics
Table 9: Operating Voltage
May 2015 Product Specification
332164-003US 11
Intel® Solid-State Drive DC P3500 Series
Electrical Characteristics
Intel SSD DC P3500 Series
3.3Vaux Operating Characteristics4:
Operating Voltage range
Rise Slew Rate (Max/Min)
Fall Slew Rate (Max/Min)1
Noise level
Max Current
3.3 V (±9%)
66/3300 V/s
0.66/3300 V/s
300 mV pp 10Hz – 100 KHz
50 mV pp 100KHz – 20 MHz
20mA/1mA (AIC/2.5” FF)
Specification
Unit
Intel SSD DC P3500 Series
400GB
1.2TB
2TB
Active Write - Average 1
W
12
15
20
Active Read - Average 2
W 9 9
10
Idle
W 4 4
4
NOTES:
1. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss
management.
2. The drive must be powered off for at least 3 seconds before powering on.
3. Measured during initial power supply application. Typically this will be seen within 2 seconds of initial power up. Inrush
specified for 12V and 3.3V supply, not the 3.3V Aux.
4. 3.3V aux is optional, not needed for power up or functionality. 3.3Vaux is needed for accessing VPD page by means of
SMBUS for both form factors.
Table 10: Power Consumption
NOTES:
1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential writes. Average
power is measured using scope trigger over a 100 ms sample period
2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential reads.
Product Specification May 2015
12 332164-003US
Intel® Solid-State Drive DC P3500 Series
Temperature
Add-In card form factor
2.5-inch form factor
Temperature
Operating1
Non-operating3
Ambient 0 – 55° C / 0 -40° C2
-55–95° C
Ambient: 0–35° C, Case: 0-70° C
Temperature Gradient
4
Operating
Non-operating
30° C/hr (Typical)
30° C/hr (Typical)
30° C/hr (Typical)
30° C/hr (Typical)
Humidity
Operating
Non-operating
5–95%
5–95%
5–95%
5–95%
Shock and Vibration
Range
Shock
5
Operating
Non-operating
50 G Trapezoidal, 170 in/s
50 G Trapezoidal, 170 in/s
1,000 G (Max) at 0.5 msec
1,000 G (Max) at 0.5 msec
Vibration
6
Operating
Non-operating
2.17 GRMS (5-700 Hz) Max
3.13 G
RMS
(5-800 Hz) Max
2.17 GRMS (5-700 Hz) Max
3.13 G
RMS
(5-800 Hz) Max
Airflow
Direction
Unit
Ambient
Temperature
Intel SSD DC P3500 Series
400GB
1.2TB
2TB
Towards the
server
LFM
40° C
100
300
300
Out of the
server
LFM
55° C
100
300
300
2.4 Environmental Conditions
Table 11: Temperature, Shock, Vibration
NOTES: :
1. Operating temperature implies ambient air temperature under defined airflow in Tables 12 and 13.
2. 0-55° C is for airflow from the server towards the card and 0-40° C is for airflow into the server.
3. Please contact your Intel representative for details on the non-operating temperature range.
4. Temperature gradient measured without condensation.
5. Shock specifications assume the SSD is mounted securely with the input vibration applied to the
drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean
Squared (RMS) value.
6. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the
drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS
value.
Table 12: Airflow requirement for Intel SSD DC P3500 Series (Add-In Card)
NOTE: For Add-In cards airflow can be for both the directions. Airflow specified is based on approach velocity.
May 2015 Product Specification
332164-003US 13
Intel® Solid-State Drive DC P3500 Series
Airflow
Definition
Unit
Ambient
Temperature
Intel SSD DC P3500 Series
400GB
1.2TB
2TB
Airflow Along
Drive1
LFM
35° C
300
650
650
LFM
25° C
250
450
450
Approach
Airflow2
LFM
35° C
70
155
155
LFM
25° C
60
110
110
Title
Description
Region For Which
Conformity Declared
TITLE 47-Telecommunications CHAPTER 1 –
FEDERAL COMMUNMICATIONS COMMISSION
PART 15 – RADIO FREQUENCY DEVICES
ICES-003, Issue 4 Interference-Causing
Equipment
Standard Digital Apparatus
FCC Part 15B Class A
CA/CSA-CEI/IEC CISPR 22:02. This is
CISPR 22:1997 with Canadian
Modifications
USA
Canada
IEC 55024 Information Technology Equipment
– Immunity characteristics – Limits and
methods of measurement CISPR24:2010
EN-55024: 1998 and its amendments
European Union
IEC 55022 Information Technology Equipment
– Radio disturbance Characteristics – Limits
and methods of measurement CISPR24:2008
(Modified)
EN-55022: 2006 and its amendments
European Union
EN-60950-1 2nd Edition
Information Technology Equipment –
Safety – Part 1: General Requirements
USA/Canada
UL/CSA EN-60950-1 2nd Edition
Information Technology Equipment –
Safety – Part 1: General Requirements
USA/Canada
Table 13: Airflow Requirements for Intel SSD DC P3500 Series (2.5-inch Form Factor)
NOTES:
1. It is recommended that airflow for 2.5-inch form factor should be towards the server, from the non-connector
side to the connector side. Airflow is specified across the surface of the drive. Spacing between two SSDs
is assumed to be 3mm.
2. The approach velocity of the airflow will be less than the airflow along the surface. Approach area
of 1.35 ft2 is assumed.
2.5 Product Regulatory Compliance
Intel SSD DC P3500 Series meets or exceeds the regulatory or certification requirements in Table 14.
Table 14: Product Regulatory Compliance Specifications
Product Specification May 2015
14 332164-003US
Loading...