Intel SSDPEDMW012T4X1, SSDPEDMW012T401, SSDPEDMW012T4R5 User Manual

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Intel® Solid State Drive 750 Series

Capacities

400GB, 800GB, 1.2TB PCIe® Gen3 x4

Form Factor

2.5-inch Form Factor

15mm Z-height

U.2-compatible connector

Add-in Card (AIC) Form Factor

Half-height, Half-length

Single slot x4 connector

Performance1,2

Seq R/W: Up to 2500/1200 MB/s3

4K Random Read: Up to 460K

4K Random Write: Up to 290K

Latency (average sequential)

Read: 20 µs (TYP)

Write: 20 µs (TYP)

Components

Intel® 20nm MLC NAND Flash Memory Operating System Support:

Windows 7* 64 bit

Windows 8* 64 bit

Windows 8.1* 64 bit

Windows 10* 64 bit

Ubuntu 14.05 and 15.05

UEFI* 2.3.1 or later

Reliability

Uncorrectable Bit Error Rate (UBER): 1 sector per 1016 bits read

Mean Time Before Failure (MTBF): 1.2 million hours

Power

2.5-inch: 12V Supply Rail

AIC: 3.3V and 12V Supply Rail

Enhanced power-loss data protection

Active/Idle (TYP): 22W/4W (TYP)

Product Specification

Compliance

NVM ExpressTM 1.0

PCI Express® Base Specification Rev 3.0

SFF 8639 Enterprise SSD Form Factor Version 1.0a

PCI Express Card Electro-Mechanical* (CEM) Specification Rev 2.0

Certifications and Declarations

UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft WHQL*, VCCI*

Endurance Rating

70 GB Writes Per Day

Up to 127 TBW (Terabytes Written)5

Temperature Specification

Operating:

AIC: 0 to 55° C

2.5-inch: 0 to 70° C

Non-Operating6: -55 to 95° C

Temperature monitoring

Weight

AIC: up to 195 gm

2.5-inch: up to 125 gm

Shock

2.5-inch: 1,000 G/0.5msec

AIC: 50 G Trapezoidal, 170 in/s

Vibration

Operating: 2.17 GRMS (5-700Hz)

Non-Operating: 3.13 GRMS (5-800Hz)

Altitude (Simulated)

Operating: -1,000 to 10,000 ft

Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance

RoHS

1.Performance values vary by capacity and form factor

2.Performance specifications apply to both compressible and incompressible data

3.MB/s = 1,000,000 bytes/second

4.4KB = 4,096 bytes; 8 KB = 8,192 bytes

5.1PB = 1015 Bytes

6.Please contact your Intel representative for details on the non-operating temperature range

Order Number: 332059-004US

Intel® Solid State Drive 750 Series

Revision History

Revision

Description

Revision Date

Number

 

 

 

 

 

001

Initial release

April 2015

 

 

 

002

TBW Endurance Value Correction

June 2015

Minor Documentation edit in SMART Attributes Table 14

 

 

 

 

 

 

Amended with 800GB SKU information

 

003

Updated Performance numbers

August 2015

 

Included Ubuntu OS support

 

 

 

 

004

Removed 3.3v from 2.5 FF

October 2015

Added Windows 10 support

 

 

 

 

 

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.

Test and System Configuration: Processor: Intel® Core™ i7-4790K, Speed: 4.0 GHz, Chipset: Intel® Z97, Motherboard: ASUS* z97-Deluxe, DRAM capacity: 4GB, DRAM Speed: DDR3 2133 MHz, OS: Windows* 8.1.

For more complete information about performance and benchmark results, visit http://www.intel.com/performance.

All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others. Copyright © 2015 Intel Corporation. All rights reserved.

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Contents

 

Revision History.....................................................................................................................................................................................................

2

 

Ordering Information..........................................................................................................................................................................................

2

1

Overview

...............................................................................................................................................................................................................

5

 

1.1

References .................................................................................................................................................................................................

6

 

1.2

Terms and Acronyms............................................................................................................................................................................

7

2

Product Specifications .......................................................................................................................................................................................

8

 

2.1

Capacity ......................................................................................................................................................................................................

8

 

2.2

Performance .............................................................................................................................................................................................

8

 

2.3

Electrical Characteristics.....................................................................................................................................................................

9

 

2.4

Environmental Conditions ..............................................................................................................................................................

10

 

2.5

Product Regulatory Compliance ..................................................................................................................................................

11

 

2.6

Reliability Specifications ..................................................................................................................................................................

11

3

Mechanical Information..................................................................................................................................................................................

12

4

Pin and Signal Descriptions..........................................................................................................................................................................

14

 

4.1

2.5-inch Form Factor Pin Locations............................................................................................................................................

14

 

4.2

Pin Signal Definitions.........................................................................................................................................................................

14

5

Supported Command Sets............................................................................................................................................................................

17

 

5.1

NVMe Admin Command Set...........................................................................................................................................................

17

 

5.2

NVMe I/O Command Set..................................................................................................................................................................

17

 

5.3

Log Page Support................................................................................................................................................................................

18

 

5.4

SMART Attributes................................................................................................................................................................................

18

 

5.5

Temperature Statistics......................................................................................................................................................................

21

 

5.6

SET Feature Identifiers......................................................................................................................................................................

21

6

NVMe Driver Support ......................................................................................................................................................................................

23

7

Certifications and Declarations...................................................................................................................................................................

24

Appendix A

IDENTIFY Data Structure ........................................................................................................................................................

25

Appendix B

PCIe ID.............................................................................................................................................................................................

31

Appendix C

SCSI Command Translation ..................................................................................................................................................

32

Appendix D Add-in Card LED Decoder......................................................................................................................................................

33

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Intel® Solid State Drive 750 Series

Figures

Figure 3-1

Intel SSD 750 Series SFF Dimensions ......................................................................................................................

12

Figure 4-1

2.5-inch Form Factor Pin Locations...........................................................................................................................

14

Figure A-1

LED Location.........................................................................................................................................................................

33

Tables

Table 1:

Standard Information Referenced in this Document ...........................................................................................

6

Table 2:

Glossary of Terms and Acronyms..................................................................................................................................

7

Table 3:

User Addressable Sectors.................................................................................................................................................

8

Table 4:

Performance............................................................................................................................................................................

8

Table 5:

Latency.......................................................................................................................................................................................

9

Table 6:

Operating Voltage.................................................................................................................................................................

9

Table 7:

Power Consumption .........................................................................................................................................................

10

Table 8:

Temperature, Shock, Vibration....................................................................................................................................

10

Table 9:

Product Regulatory Compliance Specifications...................................................................................................

11

Table 10:

Reliability Specifications.................................................................................................................................................

11

Table 11:

Pin Definition for 2.5-inch Form Factor (U.2 connector specification)......................................................

14

Table 12:

Pin Definition for Add-In Card (Half Height Half Length) Form Factor......................................................

16

Table 13:

SMART Attributes (Log Identifier 02h) .....................................................................................................................

18

Table 14:

Additional SMART Attributes (Log Identifier CAh)..............................................................................................

20

Table 15:

Temperature Statistics (Log Identifier C5h)...........................................................................................................

21

Table 16:

Set Max LBA Setting - Command Dword 11 and Command Dword 12....................................................

22

Table 17:

Status Code - Set Max LBA Command Specific Status Values......................................................................

22

Table 18:

D5h - Reset Timed Workload Counters - Command Dword 11...................................................................

22

Table 19:

NVMe Driver Support .......................................................................................................................................................

23

Table 20:

Device Certifications and Declarations ....................................................................................................................

24

Table 21:

Identify Controller..............................................................................................................................................................

25

Table 22:

Power State Descriptor....................................................................................................................................................

28

Table 23:

Identify Namespace...........................................................................................................................................................

29

Table 24:

LBA Format Data Structure............................................................................................................................................

30

Table 25:

PCIe ID .....................................................................................................................................................................................

31

Table 26:

LED Functionality ...............................................................................................................................................................

33

§

Product Specification

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Intel® Solid State Drive 750 Series

1 Overview

This document describes the specifications and capabilities of the Intel® Solid State Drive 750 Series (Intel® SSD 750 Series).

The Intel SSD 750 Series is Intel’s first PCIe® Gen3 x4 SSD developed for the client enthusiast and workstation markets. The Intel SSD 750 Series is architected with the new high performance controller interface - Non-Volatile Memory Express™ (NVMe™) - delivering outstanding performance, low latency and Quality of Service. NVMe is a standardized interface that enables higher performance and lower latency than previous generations. The Intel SSD 750 Series offers capacities of 400GB, 800GB, and 1.2TB in Add-In card and 2.5-inch U.2 (formerly known as SFF-8639) form factors.

The Intel SSD 750 Series is Intel’s highest performing client drive specifically designed for the PC enthusiast and workstation systems with demanding storage workstation requirements. With PCIe Gen3 x4 support and NVMe queuing interface, the Intel SSD 750 Series delivers excellent sequential read performance of up to 2.5GB/s and sequential write speeds of up to 1.2 GB/s. The Intel SSD 750 Series delivers random read IOPS of up to 460K and random write IOPS of up to 290K for 4KB operations. Also, by taking advantage of the direct path from the storage to the CPU by means of NVMe, the Intel SSD 750 Series exhibits low latency of less than 20 μs for sequential access to the SSD.

Intel SSD 750 Series includes these key features:

PCIe Gen3 x4 with NVMe interface

Consistently Higher IOPS and throughput

Sustained low latency

Enhanced power-loss data protection

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Intel SSDPEDMW012T4X1, SSDPEDMW012T401, SSDPEDMW012T4R5 User Manual

Intel® Solid State Drive 750 Series

1.1References

Table 1: Standard Information Referenced in this Document

Date

 

Title

Location

 

 

 

Jan 2013

SFF 8639 Enterprise SSD Form Factor Version 1.0a

http://www.ssdformfactor.org

 

 

 

Feb 2012

NVMe Revision 1.0c

http://www.nvmexpress.org

 

 

 

Nov 2010

PCIe Base Specification Revision 3.0

http://pcisig.com

 

 

 

July 2012

Solid State Drive (SSD) Requirements and Endurance Test Method

http://www.jedec.org/standards-

(JESD219)

documents/results/jesd219

 

 

 

 

Sept 2010

Solid State Drive (SSD) Requirements and Endurance Test Method

http://www.jedec.org/standards-

(JESD218)

documents/docs/jesd218/

 

 

 

 

 

Dec 2008

VCCI

 

http://www.vcci.jp/vcci_e/

 

 

 

 

 

 

 

http://qdms.intel.com/

June 2009

RoHS

Click Search MDDS Database and

search for material description

 

 

 

 

 

 

datasheet

 

 

 

 

International Electrotechnical Commission EN 61000

 

1995

4-2 (Electrostatic discharge immunity test)

 

1996

4-3 (Radiated, radio-frequency, electromagnetic field immunity test)

 

1995

4-4

(Electrical fast transient/burst immunity test)

 

 

 

 

http://www.iec.ch/

1995

4-5

(Surge immunity test)

 

1997

4-6

(Immunity to conducted disturbances, induced by radio-

 

 

 

frequency fields)

 

1994

4-11 (Voltage Variations, voltage dips, short interruptions and voltage

 

 

 

variations immunity tests)

 

 

 

 

1995

ENV 50204

http://www.dbicorporation.com/

 

(Radiated electromagnetic field from digital radio telephones)

radimmun.htm/

 

 

 

 

Product Specification

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1.2Terms and Acronyms

Table 2: Glossary of Terms and Acronyms

Term

Definition

 

 

ATA

Advanced Technology Attachment

 

 

CRC

Cyclic Redundancy Check

 

 

DAS

Device Activity Signal

 

 

DMA

Direct Memory Access

 

 

ECC

Error Correction Code

 

 

EEPROM

Electrically Erasable Programmable Read Only Memory

EXT

Extended

FPDMA

First Party Direct Memory Access

 

Gigabyte

GB

Note: The total usable capacity of the SSD may be less than the total physical capacity because a

 

small portion of the capacity is used for NAND flash management and maintenance purposes.

 

 

Gb

Gigabit

 

 

HDD

Hard Disk Drive

HET

High Endurance Technology

KB

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

MB

Megabyte (1,000,000 bytes)

 

 

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

 

 

NOP

No Operation

 

 

NVMe

Non-Volatile Memory Express

 

 

PB

Petabyte

 

 

PCB

Printed Circuit Board

 

 

RDT

Reliability Demonstration Test

 

 

RMS

Root Mean Square

 

 

SSD

Solid State Drive

 

 

TB

Terabyte

 

 

TYP

Typical

 

 

UBER

Uncorrectable Bit Error Rate

 

 

VPD

Vital Product Data

 

 

§

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Intel® Solid State Drive 750 Series

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

Intel SSD 750 Series

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

 

 

 

400GB

781,422,768

 

 

800GB

1,562,824,368

 

 

1.2TB

2,344,225,968

 

 

NOTES:

1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion

of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.

2.2Performance

Table 4: Performance1

 

 

 

Intel SSD 750 Series

 

Specification1

Unit

 

 

 

400GB

800GB5

1.2TB

 

 

 

 

 

 

 

Random 4KB2 Read (up to)

IOPS

430,000

420,000

460,000

 

 

 

 

 

Random 4KB Write (up to)

IOPS

230,000

210,000

290,000

 

 

 

 

 

Sequential 128KB Read3

MB/s4

2,200

2,100

2,500

 

 

 

 

 

Sequential 128KB Write

MB/s

900

800

1,200

 

 

 

 

 

NOTES:

1.Performance measured by Intel using IOMeter* on Intel provided NVMe driver with Queue Depth 128 (QD=32, workers=4). Measurements are performed on a contiguous 8GB span of the drive on a full SSD. Power mode set at 25W. Drive is unpartitioned.

2.4KB = 4,096 bytes

3.Performance measured by Intel using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue Depth 128. Power mode set at 25W.

4.MB/s = 1,000,000 bytes/second

5.Performance due to nonoptimal NAND layout

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Intel® Solid State Drive 750 Series

Table 5:

Latency

 

 

 

 

 

 

 

 

 

 

Intel SSD 750 Series

 

Specification

 

 

 

 

Sequential

 

Random

 

 

 

 

 

 

 

 

Read1

 

20 µs (TYP)

 

120 µs (TYP)

Write1

 

20 µs (TYP)

 

45 µs (TYP)

Typical Power On to First I/O

 

Up to 10 seconds

Completion2

 

 

 

 

Typical Reset to First I/O

 

Up to 15 seconds

Completion3

 

 

 

 

NOTES:

1.Device measured by Intel using IOMeter*. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 using Windows 8.1 driver. Power mode set at 25W.

2.Assumes clean shutdown. Time to complete first I/O from complete power off state.

3.Time to complete first I/O after start of NVMe Controller Reset.

2.3Electrical Characteristics

Table 6: Operating Voltage

Electrical Characteristics

Intel SSD 750 Series

 

 

3.3V Operating Characteristics: (Add-in Card only)

 

Operating Voltage range

3.3 V (±10%)

 

Rise time (Max/Min)

50ms/1ms

 

Fall time (Max/Min)

1

5s/1ms

 

 

Noise level

 

300 mV pp 10Hz – 100 KHz

 

 

50 mV pp 100KHz – 20 MHz

Min Off time2

 

500 ms

Max Average Current

3.0 A

 

 

12V Operating Characteristics:

 

Operating Voltage range

12 V (+10%/-20%)

 

Rise time (Max/Min)

50ms/1ms

 

Fall time (Max/Min)

1

5s/1ms

 

 

Noise level

 

1000 mV pp 10Hz – 100 KHz

 

 

100 mV pp 100KHz – 20 MHz

Min Off time2

 

500 ms

Max Average Current

2.1 A

 

 

 

NOTES:

1.Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management. Intel makes no claims on the success rate of its power loss protection feature. The power loss feature does not provide 100 percent protection on all power loss scenarios.

2.The drive must be powered off for at least 500msec before powering on.

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Intel® Solid State Drive 750 Series

Table 7: Power Consumption

 

 

 

 

 

 

 

 

 

 

Specification

Unit

 

Intel SSD 750 Series

 

 

 

 

 

 

 

 

 

 

400GB

800GB

1.2TB

 

 

 

 

 

 

 

Active Write – Average1

W

12

15

22

 

Active Read – Average2

W

9

9

10

 

Idle

W

4

4

4

 

 

 

 

 

 

 

NOTES:

1.The workload equates 64KB (65,536 bytes) Queue Depth equal to 128 sequential writes. Average power is measured by Intel using scope trigger over a 100 ms sample period.

2.The workload equates 64KB (65,536 bytes) Queue Depth equal to 128 sequential reads.

2.4Environmental Conditions

Table 8: Temperature, Shock, Vibration

Temperature

Add-In card form factor

 

2.5-inch form factor

 

 

 

 

 

 

 

 

Temperature

 

 

 

 

 

 

 

Operating1

o

 

 

0–35

o

C

Non-operating2

0 – 55 C

 

 

-55–95

o

C

 

0-70

o

C

 

 

 

 

 

 

 

 

Temperature Gradient3

30o C/hr (Typical)

 

30o C/hr (Typical)

Operating

30o C/hr (Typical)

 

30o C/hr (Typical)

Non-operating

 

 

 

 

 

 

 

Humidity

5–95%

 

5–95%

Operating

 

5–95%

 

5–95%

Non-operating

 

 

 

 

 

 

 

 

 

Shock and Vibration

 

 

 

Range

 

 

 

 

 

 

 

 

 

 

Shock4

50 G Trapezoidal, 170 in/s

 

1,000 G (Max) at 0.5 msec

Operating

 

50 G Trapezoidal, 170 in/s

 

1,000 G (Max) at 0.5 msec

Non-operating

 

 

 

 

 

 

 

 

 

Vibration5

2.17 GRMS (5-700 Hz) Max

 

2.17 GRMS (5-700 Hz) Max

Operating

 

3.13 GRMS (5-800 Hz) Max

 

3.13 GRMS (5-800 Hz) Max

Non-operating

 

 

 

 

 

 

 

 

 

NOTES:

1.Operating temperature implies ambient air temperature with any airflow conditions.

2.Please contact your Intel representative for details on the non-operating temperature range.

3.Temperature gradient measured without condensation.

4.Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

5.Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

Product Specification

October 2015

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