Intel SSDPEDMW012T4X1, SSDPEDMW012T401, SSDPEDMW012T4R5 User Manual

Intel® Solid State Drive 750 Series

Product Specification

 Capacities

 400GB, 800GB, 1.2TB

PCIe® Gen3 x4

Form Factor

 2.5-inch Form Factor

 15mm Z-height  U.2-compatible connector

 Add-in Card (AIC) Form Factor

 Half-height, Half-length  Single slot x4 connector

Performance

1,2

 Seq R/W: Up to 2500/1200 MB/s  4K Random Read: Up to 460K  4K Random Write: Up to 290K

Latency (average sequential)

 Read: 20 µs (TYP)  Write: 20 µs (TYP)

Components

 Intel® 20nm MLC NAND Flash Memory

Operating System Support:

 Windows 7* 64 bit  Windows 8* 64 bit  Windows 8.1* 64 bit  Windows 10* 64 bit  Ubuntu 14.05 and 15.05  UEFI* 2.3.1 or later

Reliability

 Uncorrectable Bit Error Rate (UBER):

1 sector per 1016 bits read

 Mean Time Before Failure (MTBF):

1.2 million hours

Power

 2.5-inch: 12V Supply Rail  AIC: 3.3V and 12V Supply Rail  Enhanced power-loss data protection

Compliance

 NVM Express

1.0

 PCI Express® Base Specification Rev 3.0  SFF 8639 Enterprise SSD

Form Factor Version 1.0a

 PCI Express Card Electro-Mechanical*

(CEM) Specification Rev 2.0

Certifications and Declarations

 UL*, CE*, C-Tick*, BSMI*, KCC*,

Microsoft WHQL*, VCCI*

Endurance Rating

 70 GB Writes Per Day  Up to 127 TBW (Terabytes Written)

Temperature Specification

 Operating:

 AIC: 0 to 55°

 2.5-inch: 0 to 70° C

 Non-Operating

: -55 to 95° C

 Temperature monitoring

Weight

 AIC: up to 195 gm  2.5-inch: up to 125 gm

Shock

 2.5-inch: 1,000 G/0.5msec  AIC: 50 G Trapezoidal, 170 in/s

Vibration

 Operating: 2.17 G  Non-Operating: 3.13 G

Altitude (Simulated)

(5-700Hz)

RMS

(5-800Hz)

 Operating: -1,000 to 10,000 ft  Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance

 RoHS

 Active/Idle (TYP): 22W/4W (TYP)

Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. MB/s = 1,000,000 bytes/second

4. 4KB = 4,096 bytes; 8 KB = 8,192 bytes

5. 1PB = 10

6. Please contact your Intel representative for details on the non-operating temperature range

Bytes

Order Number: 332059-004US

Revision

Number

Description

Revision Date

001

 Initial release

April 2015

002

 TBW Endurance Value Correction  Minor Documentation edit in SMART Attributes Table 14

June 2015

003

 Amended with 800GB SKU information  Updated Performance numbers  Included Ubuntu OS support

August 2015

004

 Removed 3.3v from 2.5 FF  Added Windows 10 support

October 2015

Intel® Solid State Drive 750 Series

Revision History

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.

Test and System Configuration: Processor: Intel® Core™ i7-4790K, Speed: 4.0 GHz, Chipset: Intel® Z97, Motherboard: ASUS* z97-Deluxe, DRAM capacity: 4GB, DRAM Speed: DDR3 2133 MHz, OS: Windows* 8.1.

For more complete information about performance and benchmark results, visit http://www.intel.com/performance.

All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

Product Specification October 2015 2 332059-004US

Intel® Solid State Drive 750 Series

Contents

Revision History ..................................................................................................................................................................................................... 2

Ordering Information .......................................................................................................................................................................................... 2

1 Overview ............................................................................................................................................................................................................... 5

1.1 References ................................................................................................................................................................................................. 6

1.2 Terms and Acronyms ............................................................................................................................................................................ 7

2 Product Specifications ....................................................................................................................................................................................... 8

2.1 Capacity ...................................................................................................................................................................................................... 8

2.2 Performance ............................................................................................................................................................................................. 8

2.3 Electrical Characteristics ..................................................................................................................................................................... 9

2.4 Environmental Conditions .............................................................................................................................................................. 10

2.5 Product Regulatory Compliance .................................................................................................................................................. 11

2.6 Reliability Specifications .................................................................................................................................................................. 11

3 Mechanical Information .................................................................................................................................................................................. 12

4 Pin and Signal Descriptions .......................................................................................................................................................................... 14

4.1 2.5-inch Form Factor Pin Locations ............................................................................................................................................ 14

4.2 Pin Signal Definitions ......................................................................................................................................................................... 14

5 Supported Command Sets............................................................................................................................................................................ 17

5.1 NVMe Admin Command Set........................................................................................................................................................... 17

5.2 NVMe I/O Command Set .................................................................................................................................................................. 17

5.3 Log Page Support ................................................................................................................................................................................ 18

5.4 SMART Attributes ................................................................................................................................................................................ 18

5.5 Temperature Statistics ...................................................................................................................................................................... 21

5.6 SET Feature Identifiers...................................................................................................................................................................... 21

6 NVMe Driver Support ...................................................................................................................................................................................... 23

7 Certifications and Declarations ................................................................................................................................................................... 24

Appendix A IDENTIFY Data Structure ........................................................................................................................................................ 25

Appendix B PCIe ID ............................................................................................................................................................................................. 31

Appendix C SCSI Command Translation .................................................................................................................................................. 32

Appendix D Add-in Card LED Decoder ...................................................................................................................................................... 33

October 2015 Product Specification 332059-004US 3

Intel® Solid State Drive 750 Series

Figures

Figure 3-1 Intel SSD 750 Series SFF Dimensions ...................................................................................................................... 12

Figure 4-1 2.5-inch Form Factor Pin Locations ........................................................................................................................... 14

Figure A-1 LED Location......................................................................................................................................................................... 33

Tables

Table 1: Standard Information Referenced in this Document ........................................................................................... 6

Table 2: Glossary of Terms and Acronyms .................................................................................................................................. 7

Table 3: User Addressable Sectors ................................................................................................................................................. 8

Table 4: Performance ............................................................................................................................................................................ 8

Table 5: Latency ....................................................................................................................................................................................... 9

Table 6: Operating Voltage ................................................................................................................................................................. 9

Table 7: Power Consumption ......................................................................................................................................................... 10

Table 8: Temperature, Shock, Vibration .................................................................................................................................... 10

Table 9: Product Regulatory Compliance Specifications ................................................................................................... 11

Table 10: Reliability Specifications ................................................................................................................................................. 11

Table 11: Pin Definition for 2.5-inch Form Factor (U.2 connector specification) ...................................................... 14

Table 12: Pin Definition for Add-In Card (Half Height Half Length) Form Factor ...................................................... 16

Table 13: SMART Attributes (Log Identifier 02h) ..................................................................................................................... 18

Table 14: Additional SMART Attributes (Log Identifier CAh) .............................................................................................. 20

Table 15: Temperature Statistics (Log Identifier C5h) ........................................................................................................... 21

Table 16: Set Max LBA Setting - Command Dword 11 and Command Dword 12 .................................................... 22

Table 17: Status Code - Set Max LBA Command Specific Status Values ...................................................................... 22

Table 18: D5h - Reset Timed Workload Counters - Command Dword 11 ................................................................... 22

Table 19: NVMe Driver Support ....................................................................................................................................................... 23

Table 20: Device Certifications and Declarations .................................................................................................................... 24

Table 21: Identify Controller .............................................................................................................................................................. 25

Table 22: Power State Descriptor .................................................................................................................................................... 28

Table 23: Identify Namespace........................................................................................................................................................... 29

Table 24: LBA Format Data Structure ............................................................................................................................................ 30

Table 25: PCIe ID ..................................................................................................................................................................................... 31

Table 26: LED Functionality ............................................................................................................................................................... 33

Product Specification October 2015 4 332059-004US

Intel® Solid State Drive 750 Series

1 Overview

This document describes the specifications and capabilities of the Intel® Solid State Drive 750 Series (Intel® SSD 750 Series).

The Intel SSD 750 Series is Intel’s first PCIe® Gen3 x4 SSD developed for the client enthusiast and workstation markets. The Intel SSD 750 Series is architected with the new high performance controller interface - Non-Volatile Memory Express™ (NVMe™) - delivering outstanding performance, low latency and Quality of Service. NVMe is a standardized interface that enables higher performance and lower latency than previous generations. The Intel SSD 750 Series offers capacities of 400GB, 800GB, and 1.2TB in Add-In card and 2.5-inch U.2 (formerly known as SFF-8639) form factors.

The Intel SSD 750 Series is Intel’s highest performing client drive specifically designed for the PC enthusiast and

workstation systems with demanding storage workstation requirements. With PCIe Gen3 x4 support and NVMe queuing interface, the Intel SSD 750 Series delivers excellent sequential read performance of up to 2.5GB/s and sequential write speeds of up to 1.2 GB/s. The Intel SSD 750 Series delivers random read IOPS of up to 460K and random write IOPS of up to 290K for 4KB operations. Also, by taking advantage of the direct path from the storage to the CPU by means of NVMe, the Intel SSD 750 Series exhibits low latency of less than 20 μs for sequential access to the SSD.

Intel SSD 750 Series includes these key features:

 PCIe Gen3 x4 with NVMe interface  Consistently Higher IOPS and throughput  Sustained low latency  Enhanced power-loss data protection

October 2015 Product Specification 332059-004US 5

Date

Title

Location

Jan 2013

SFF 8639 Enterprise SSD Form Factor Version 1.0a

http://www.ssdformfactor.org

Feb 2012

NVMe Revision 1.0c

http://www.nvmexpress.org

Nov 2010

PCIe Base Specification Revision 3.0

http://pcisig.com

July 2012

Solid State Drive (SSD) Requirements and Endurance Test Method (JESD219)

http://www.jedec.org/standardsdocuments/results/jesd219

Sept 2010

Solid State Drive (SSD) Requirements and Endurance Test Method (JESD218)

http://www.jedec.org/standardsdocuments/docs/jesd218/

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

June 2009

RoHS

http://qdms.intel.com/

Click Search MDDS Database and search for material description datasheet

International Electrotechnical Commission EN 61000

http://www.iec.ch/

1995

4-2 (Electrostatic discharge immunity test)

1996

4-3 (Radiated, radio-frequency, electromagnetic field immunity test)

1995

4-4 (Electrical fast transient/burst immunity test)

1995

4-5 (Surge immunity test)

1997

4-6 (Immunity to conducted disturbances, induced by radio frequency fields)

1994

4-11 (Voltage Variations, voltage dips, short interruptions and voltage variations immunity tests)

1995

ENV 50204

(Radiated electromagnetic field from digital radio telephones)

http://www.dbicorporation.com/

radimmun.htm/

1.1 References

Table 1: Standard Information Referenced in this Document

Intel® Solid State Drive 750 Series

Product Specification October 2015 6 332059-004US

Intel® Solid State Drive 750 Series

Term

Definition

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EEPROM

Electrically Erasable Programmable Read Only Memory

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte

Note: The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NOP

No Operation

NVMe

Non-Volatile Memory Express

Petabyte

PCB

Printed Circuit Board

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SSD

Solid State Drive

Terabyte

TYP

Typical

UBER

Uncorrectable Bit Error Rate

VPD

Vital Product Data

1.2 Terms and Acronyms

Table 2: Glossary of Terms and Acronyms

October 2015 Product Specification 332059-004US 7

Intel® Solid State Drive 750 Series

Intel SSD 750 Series

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

400GB

781,422,768

800GB

1,562,824,368

1.2TB

2,344,225,968

Specification1

Unit

Intel SSD 750 Series

400GB

800GB5

1.2TB

Random 4KB2 Read (up to)

IOPS

430,000

420,000

460,000

Random 4KB Write (up to)

IOPS

230,000

210,000

290,000

Sequential 128KB Read3

MB/s4

2,200

2,100

2,500

Sequential 128KB Write

MB/s

900

800

1,200

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

NOTES:

1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.

2.2 Performance

Table 4: Performance1

NOTES:

1. Performance measured by Intel using IOMeter* on Intel provided NVMe driver with Queue Depth 128 (QD=32,

workers=4). Measurements are performed on a contiguous 8GB span of the drive on a full SSD. Power mode set at 25W. Drive is unpartitioned.

2. 4KB = 4,096 bytes

3. Performance measured by Intel using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue

Depth 128. Power mode set at 25W.

4. MB/s = 1,000,000 bytes/second

5. Performance due to non- optimal NAND layout

Product Specification October 2015 8 332059-004US

Intel® Solid State Drive 750 Series

Specification

Intel SSD 750 Series

Sequential

Random

20 µs (TYP)

120 µs (TYP)

Write1

20 µs (TYP)

45 µs (TYP)

Typical Power On to First I/O Completion2

Up to 10 seconds

Typical Reset to First I/O Completion3

Up to 15 seconds

Electrical Characteristics

Intel SSD 750 Series

3.3V Operating Characteristics: (Add-in Card only)

Operating Voltage range

Rise time (Max/Min)

Fall time (Max/Min)1

Noise level

Min Off time2

Max Average Current

3.3 V (±10%)

50ms/1ms

5s/1ms

300 mV pp 10Hz – 100 KHz

50 mV pp 100KHz – 20 MHz

500 ms

3.0 A

12V Operating Characteristics:

Operating Voltage range

Rise time (Max/Min)

Fall time (Max/Min)1

Noise level

Min Off time2

Max Average Current

12 V (+10%/-20%)

50ms/1ms

5s/1ms

1000 mV pp 10Hz – 100 KHz

100 mV pp 100KHz – 20 MHz

500 ms

2.1 A

Table 5: Latency

NOTES:

1. Device measured by Intel using IOMeter*. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth

equal to 1 using Windows 8.1 driver. Power mode set at 25W.

2. Assumes clean shutdown. Time to complete first I/O from complete power off state.

3. Time to complete first I/O after start of NVMe Controller Reset.

2.3 Electrical Characteristics

Table 6: Operating Voltage

NOTES:

1. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss

management. Intel makes no claims on the success rate of its power loss protection feature. The power loss feature does not provide 100 percent protection on all power loss scenarios.

2. The drive must be powered off for at least 500msec before powering on.

October 2015 Product Specification 332059-004US 9

Intel® Solid State Drive 750 Series

Specification

Unit

Intel SSD 750 Series

400GB

800GB

1.2TB

Active Write – Average1

Active Read – Average2

W 9 9

Idle

W 4 4

Temperature

Add-In card form factor

2.5-inch form factor

Temperature

Operating1 Non-operating2

0 – 55o C

-55–95o C

0–35o C 0-70

Temperature Gradient

Operating Non-operating

30o C/hr (Typical) 30o C/hr (Typical)

Humidity

Operating Non-operating

5–95%

Shock and Vibration

Range

Shock

Operating Non-operating

50 G Trapezoidal, 170 in/s

1,000 G (Max) at 0.5 msec

Vibration

Operating Non-operating

2.17 G

RMS

(5-700 Hz) Max

3.13 G

RMS

(5-800 Hz) Max

2.17 G

RMS

(5-700 Hz) Max

3.13 G

RMS

(5-800 Hz) Max

Table 7: Power Consumption

NOTES:

1. The workload equates 64KB (65,536 bytes) Queue Depth equal to 128 sequential writes. Average

power is measured by Intel using scope trigger over a 100 ms sample period.

2. The workload equates 64KB (65,536 bytes) Queue Depth equal to 128 sequential reads.

2.4 Environmental Conditions

Table 8: Temperature, Shock, Vibration

NOTES:

Product Specification October 2015 10 332059-004US

1. Operating temperature implies ambient air temperature with any airflow conditions.

2. Please contact your Intel representative for details on the non-operating temperature range.

3. Temperature gradient measured without condensation.

4. Shock specifications assume the SSD is mounted securely with the input vibration applied to the

drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

5. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the

drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

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