Intel SSDPEDMD400G401 Product sheet

product brief

Intel® Solid State Drive Data Center Family for PCIe®

Consistently Amazing

Make the Switch to Faster Data

Deliver breakthrough performance with Intel PCIe Solid State Drives.

Servers can now support more
users simultaneously, compute on
larger data sets, and address high­performance computing at lower
Total Cost of Ownership (TCO).1

Intel® SSD Data Center Tool provides
a powerful set of management
capabilities.

Intel led the industry in creation of a
new Non-Volatile Memory Express*
(NVMe™) storage interface standard.

Intel is driving transition to NVMe
SSDs by providing a comprehensive
product line.

For more information, visit www.intel.com/

design/ash/nand/managessd.htm

Breakthrough Performance

The Intel® Solid State Drive (SSD) Data
Center Family for PCIe brings extreme
data throughput directly to Intel® Xeon®
processors with up to six times faster
data transfer speed than 6 Gbps SAS/
SATA SSDs.The Intel SSD Data Center
Family for PCIe is capable of reading data
up to 2.8GB/s and 460k Input/Output
Operations Per Second (IOPS) and writ­ing up to 2.0GB/s and 175k IOPS.

The performance of a single drive from
the Intel SSD Data Center Family for

PCIe, specically the Intel® SSD DC

P3700 Series (460K IOPS), can replace
the performance of 7 SATA SSDs
aggregated through an HBA (~500K
IOPS). At 200 IOPS per Hard Disk Drive
(HDD), 2,300 15K HDDs would be needed
to match the performance of one Intel
SSD Data Center Family for PCIe device.

Intel SSD Data Center Family for PCIe’s
consistently amazing performance
provides fast, unwavering data streams
directly to Intel Xeon processors mak-

ing server data transfers ecient. SSD

performance consistency provides
scalable throughput when multiple SSDs

are unied into a single storage volume.

The massive storage bandwidth increase
feeds Intel Xeon processor systems giv­ing data center servers a performance
boost.

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Proven Quality and Reliability

Intel SSD Data Center Family for PCIe
devices are based on Intel-developed

controller, rmware, and leading manu­facturing process NAND ash memory.
Rigorous qualication and compatibility

testing ensures a highly reliable SSD.
By combin-ing SSD NAND management
techniques and NAND silicon enhance­ments, High Endurance Technology

(HET) enables the Intel DC P3700 Series to

achieve 17 drive writes per day over a ve

year drive life.

Modernize Data Center Storage

NVMe is engineered for current and future
Non-Volatile Memor y (NVM) technologies,
unlike SAS/SATA SSDs. NVMe overcomes
SAS/SATA SSD performance limitations
by optimizing hardware and software to
take full advantage of NVM SSD technol-

ogy. Intel Xeon processors eciently

transfer data in fewer clock cycles with the
NVMe optimized software stack compared
to the legacy Advance Host Controller
Interface (AHCI) stack, reducing latency
and overhead. Direct CPU connection also
eliminates Host-Bus-Adapter (HBA) cards,
further reducing latency and TCO.

Comprehensive Solution

Intel‘s product line enables extensive
system compatibility, completes
numerous industry standard compliance

certications, and delivers Intel drivers,

supporting industry driver development.
The Intel SSD Data Center Family for
PCIe includes the Intel Solid State Drive
DC P3700, P3600, and P3500 Series
providing a full range of endurance up to
17 full-capacity writes per day, capacity
up to 2TB, and 2.5-inch and Add-in­Card (AIC) form factors. Intel-enabled
NVMe software drivers are provided
by major operating system vendors
including Microsoft* Server 2012 and
2008, Windows* 7, 8, and 8.1 Red Hat*

7.0/6.6/6.5, SLES* 11 SP3, UEFI* 2.3.1,
and the Linux* Open Source development
community. The new 2.5-inch form
factor with hot-swap capability provides
convenient front panel serviceability
allowing quick, uninterrupted installation.

The AIC form factor conveniently ts in

half-height, half-length (HHHL) slots.

Non-Volatile Memory Storage Solutions

Intel® Solid State Dri ve Data Center Family for PCIe® 2

TECHNICAL SPECIFICATIONS

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PRODUCT FAMILY INTEL® SOLID STATE DRIVE DATA CENTER FAMILY FOR PCIe®

SERIES NAME INTEL® SSD DC P3500 SERIES INTEL® SSD DC P3600 SERIES INTEL® SSD DC P3700 SERIES

Capacities 400GB, 1.2TB, 2TB 400GB, 800GB, 1.2TB, 1.6TB, 2TB 400GB, 800GB, 1.6TB, 2TB

Sequential Read

Sustained Write

Performance

2,3

(MB/s)

Random I/O Read

Operations Write

Up to 2500

Up to 1700

Up to 450

Up to 35

Up to 85

Up to 2600

Up to 1700

Up to 450

Up to 56

Up to 160

Up to 2800

Up to 2000

Up to 460

Up to 175

Up to 265

70/30 Read/Write

per Second 4KB K- IOPS

Lifetime Endurance

2, 3

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Up to: 0.3 Drive Writes Per Day 3 Drive Writes Per Day 17 Drive Writes Per Day

Latency5 Read/Write 20µs / 20 µs

Interface Non-Volatile Memory express (NVMe™) PCIe 3.0 x4

Form Factor

Height / Weight

2.5-inch

15mm/up to 125 grams

AIC

Half-Height Half-Length (HHHL)/195 grams

Life Expectancy 2 million hours Mean Time Between Failures (MTBF), 230 years

Power Consumption

6

Active: <25W (Write) / <11W (Read) Idle: 4W Typical

NAND Flash Memory Intel® NAND Flash Memory Multi-Level Cell (MLC) 20nm

Operating Temperature

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2.5-inch FF: 0° C to 35° C ambient temperature with suggested airflow, 0° to 70° C case temperature

AIC: 0° C to 55° C ambient temperature with suggested airflow

RoHS Compliance Meets the requirements of European Union (EU) RoHS Compliance Directives

Software Support Intel® Solid State Drive Data Center Tool, NVMe Drivers: www.intel.com

Product Ordering Solid State Drive Computing Star ts with Intel Inside®. To order visit www.intel.com/ssd

Solid State Drive Computing Starts with Intel Inside®. For more information,
visit www.intel.com/ssd

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Base d on the Intel® Sol id State Driv e DC P3500, P360 0 and P3700 Ser ies Produc t Specic ations. Ran dom I/O Oper ations base d on Thousan d (K) IOPS

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Perfor mance vari es by capacit y and is meas ured using IO Meter* wi th Queue Dep th 128, for sequen tial worklo ad Queue Dep th 128 with single wo rker. For Rando m workload Qu eue Depth 32, w ith 4 workers .

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Measurem ents are perf ormed on full spa n of logic al block address (L BA) range on an SSD th at is lled to capaci ty with data. I OPS setup: Inte l® CoreTM i7-3770K CP U @ 3.50GHz , 8GB of syste m memory, Wi ndows*

Serv er 2012, and IOMet er tool were us ed. DC P3700 sy stem perf ormance is con guratio n dependent . Random pe rforman ce is collecte d with 4 worker s each with 32 QD.

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Using JES D218 standard w ith JESD219 work load, Teraby tes Written ( TBW)

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Average l atency mea sured with 4K B sequenti al I/O at Queue D epth

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Active po wer measur ed during exe cution of Full S equential Wo rkload with 128K B transfe r size, idle pow er is measur ed when ther e is no I/O to SSD.

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For suggeste d air ow please refe r to the prod uct specic ation docume nt.

Intel may ma ke changes to speci cations an d produ ct descripti ons at any time, with out notice. Des igners must not r ely on the absence or charac teristic s of any featu res or instruc tions marked “r eserved ” or “unde ­ned .” Intel re serv es these for futur e den ition and shall have n o respo nsibility wh atsoever for co nicts or inco mpatibiliti es arising fro m futur e chang es to them. The infor mation here is su bjec t to change w ithout
notice . Do not na lize a desig n with thi s infor mation.

Soft ware and work loads used in per formance tes ts may have been opti mized for perf ormance only on Int el microproce ssors. Per formance test s, such as SYSma rk and MobileM ark, are meas ured using spec ic

comput er systems , component s, soft ware, ope rations and f unction s. Any change t o any of those fa ctors may ca use the resul ts to vary. You sho uld consult oth er informa tion and per formance te sts to assi st you in
fully ev aluating yo ur contempla ted purchas es, includ ing the per formance of th at produc t when combin ed with other p roducts .

Perf ormance test s and rat ings are measur ed using speci c computer sys tems and/or compo nents and ree ct the approxim ate perform ance of Intel prod ucts as measu red by those test s. Any dieren ce in system
hardw are or softw are design or con guration may a ect actual pe rformanc e. Buyers shou ld consul t other so urces of informa tion to eva luate the perfo rmance of syste ms or component s they are conside ring

purchasing. For more information on performance tests and on the performance of Intel products, go to: http://www.intel.com/performance/resources/benchmark_limitations.htm.

The prod ucts descr ibed in this docum ent may contain de sign defect s or erro rs known as erra ta which may cause t he product to dev iate from publis hed specic ations. Curr ent charact erized errat a are available on
reque st. Contac t your loca l Intel sa les oce or your dist ributo r to obta in the latest spec ications an d befor e placing your pro duct order. Copi es of document s which hav e an orde r numbe r and are ref erenced in this

docum ent, or othe r Intel liter ature, may be o btained by c alling 1-80 0-548- 4725, or by visi ting Intel’s We b site at ww w.intel. com.

Copyri ght © 2015 Intel Corp oration . All rights re served. I ntel, Inte l Xeon, the Inte l logo, and Int el Inside are t rademark s of Intel Corp oration in t he U.S. and o ther countri es.

* Other n ames and br ands may be cla imed as the pr operty o f others. Printed in the USA 151203/jm/ra Please Recycle 330591-005US

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