Intel SR1475, SR1475NH1-E Technical Product Specification

Intel® Server Chassis SR1475 / Intel®
Server System SR1475NH1-E

Technical Product Specification

Intel order number D54566-001

Enterprise Platforms and Services Marketing

Revision 1.0

March 2006

Revision History

Date Revision

Number

March 2006 1.0 Initial Release

Modifications

Revision 1.0 ii

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

This document contains information on products in the design phase of development. Do not
finalize a design with this information. Revised information will be published when the product
is available. Verify with your local sales office that you have the latest datasheet before
finalizing a design.

The Intel® Server Chassis SR1475 and Intel® Server System SR1475NH1-E may contain
design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.

This document and the software described in it is furnished under license and may only be used
or copied in accordance with the terms of the license. The information in this manual is
furnished for informational use only, is subject to change without notice, and should not be
construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or
liability for any errors or inaccuracies that may appear in this document or any software that may
be provided in association with this document.

Except as permitted by such license, no part of this document may be reproduced, stored in a
retrieval system, or transmitted in any form or by any means without the express written consent
of Intel Corporation.

Intel, Pentium, Celeron and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Copyright © Intel Corporation 2006.

Revision 1.0 iii

Table of Contents

1. Intel® Server Chassis SR1475 Feature Summary ........................................................- 13 -

1.1 Chassis Views ...................................................................................................- 13 -

1.2 Chassis Dimensions ..........................................................................................- 14 -

1.3 Intel® Server Chassis SR1475 System Components.........................................- 14 -

1.4 Rear Panel Components ...................................................................................- 15 -

1.5 Hard Drive and Peripheral Bays ........................................................................- 15 -

1.6 Control Panel .....................................................................................................- 16 -

1.7 Power Sub-system.............................................................................................- 18 -

1.8 System Cooling..................................................................................................- 18 -

1.9 Chassis Security ................................................................................................- 18 -

1.10 Rack and Cabinet Mounting Options .................................................................- 18 -

1.11 Front Bezels.......................................................................................................- 18 -

2. Cooling Sub-System ......................................................................................................- 20 -

2.1 System Fans......................................................................................................- 21 -

2.2 Power Supply Fans............................................................................................- 22 -

2.3 CPU/Memory Air Duct and Side Air Baffle.........................................................- 22 -

3. Peripheral and Hard Drive Support...............................................................................- 24 -

3.1 Slim-line Drive Bay ............................................................................................- 24 -

3.1.1 Floppy Drive Support With or Without Backplane Present ................................- 25 -

3.1.2 Optional Floppy Drive Configuration..................................................................- 26 -

3.1.3 CD-ROM or DVD-CDR Drive Use With or Without Backplane Present.............- 26 -

3.2 Hard Disk Drive Bays.........................................................................................- 28 -

3.2.1 Hot-Swap Hard Disk Drive Trays.......................................................................- 28 -

3.2.2 Fixed Drive Trays...............................................................................................- 29 -

3.2.3 Drive Blanks.......................................................................................................- 29 -

3.3 Hot-Swap SCSI Backplane................................................................................- 30 -

3.3.1 SCSI Backplane Board Layout ..........................................................................- 30 -

3.3.2 SCSI Backplane Functional Architecture...........................................................- 31 -

3.3.3 SCSI Backplane Connector Definitions .............................................................- 34 -

3.4 Hot-Swap SATA Backplane...............................................................................- 37 -

3.4.1 SATA Backplane Layout....................................................................................- 38 -

3.4.2 SATA Backplane Functional Architecture..........................................................- 39 -

3.4.3 SATA Backplane Connector Definitions ............................................................- 41 -

4. Standard Control Panel .................................................................................................- 44 -

Revision 1.0 iv

4.1 Standard Control Panel Buttons .......................................................................- 44 -

4.2 Standard Control Panel LED Indicators.............................................................- 45 -

4.2.1 Power / Sleep LED ............................................................................................- 46 -

4.2.2 Drive Activity LED ..............................................................................................- 46 -

4.2.3 System Identification LED..................................................................................- 47 -

4.3 Control Panel Connectors..................................................................................- 47 -

4.4 Internal Control Panel Assembly Headers.........................................................- 47 -

5. PCI Riser Cards and Assembly.....................................................................................- 49 -

5.1 Riser Card Options ............................................................................................- 50 -

6. Power Sub-system .........................................................................................................- 51 -

6.1 Mechanical Specifications .................................................................................- 51 -

6.2 Airflow Requirements.........................................................................................- 52 -

6.3 Acoustics ...........................................................................................................- 52 -

6.4 Temperature ......................................................................................................- 53 -

6.5 Output Connectors.............................................................................................- 53 -

6.5.1 P1 Main power connector ..................................................................................- 54 -

6.5.2 P2 Processor Power Connector ........................................................................- 54 -

6.5.3 HD Power Connector (P3) .................................................................................- 55 -

6.5.4 Slim-line Power Connector (P4) ........................................................................- 55 -

6.6 AC Inlet Connector ............................................................................................- 55 -

6.7 Marking and Identification..................................................................................- 55 -

6.8 AC Input Voltage................................................................................................- 56 -

6.9 AC Line Transient Specification.........................................................................- 56 -

6.10 Susceptibility......................................................................................................- 57 -

6.10.1 Electrostatic Discharge Susceptibility ................................................................- 57 -

6.10.2 Fast Transient/Burst ..........................................................................................- 57 -

6.10.3 Radiated Immunity.............................................................................................- 57 -

6.10.4 Surge Immunity..................................................................................................- 57 -

6.11 AC Line Fast Transient (EFT) Specification ......................................................- 58 -

6.12 AC Line Dropout / Holdup..................................................................................- 58 -

6.12.1 AC Line 5VSB Holdup .......................................................................................- 58 -

6.13 Power Recovery ................................................................................................- 58 -

6.13.1 Voltage Brown Out.............................................................................................- 59 -

6.13.2 Voltage Interruptions..........................................................................................- 59 -

6.14 AC Line Inrush ...................................................................................................- 59 -

6.15 AC Line Isolation Requirements ........................................................................- 59 -

6.16 AC Line Leakage Current ..................................................................................- 59 -

Revision 1.0 v

6.17 AC Line Fuse .....................................................................................................- 60 -

6.18 Power Factor Correction....................................................................................- 60 -

6.19 Efficiency ...........................................................................................................- 60 -

6.20 Grounding ..........................................................................................................- 60 -

6.21 Remote Sense ...................................................................................................- 60 -

6.22 Output Power / Currents ....................................................................................- 61 -

6.22.1 Standby Outputs ................................................................................................- 61 -

6.22.2 Fan Operation in Stand-By Mode ......................................................................- 61 -

6.23 Voltage Regulation ............................................................................................- 61 -

6.23.1 Dynamic Loading ...............................................................................................- 62 -

6.24 Capacitive Loading ............................................................................................- 62 -

6.25 Closed loop stability...........................................................................................- 62 -

6.26 Common Mode Noise ........................................................................................- 63 -

6.27 Ripple / Noise ....................................................................................................- 63 -

6.28 Soft Starting .......................................................................................................- 63 -

6.29 Zero Load Stability Requirements .....................................................................- 63 -

6.30 Timing Requirements.........................................................................................- 63 -

6.31 Residual Voltage Immunity in Standby mode ....................................................- 66 -

6.32 Protection Circuits..............................................................................................- 66 -

6.33 Over-Current Limit (OCP) ................................................................................- 67 -

6.34 Over-Voltage Protection (OVP) ........................................................................- 67 -

6.35 Over-Temperature Protection (OTP) ................................................................- 68 -

6.36 Control and Indicator Functions.........................................................................- 68 -

6.37 PSON

#

Input Signal ..........................................................................................- 68 -

6.38 PWOK (Power OK) Output Signal .....................................................................- 69 -

6.39 Environmental Requirements ............................................................................- 70 -

6.39.1 Temperature ......................................................................................................- 70 -

6.39.2 Humidity.............................................................................................................- 70 -

6.39.3 Altitude...............................................................................................................- 70 -

6.39.4 Mechanical Shock..............................................................................................- 70 -

6.39.5 Random Vibration ..............................................................................................- 70 -

6.39.6 Thermal Shock (Shipping) .................................................................................- 70 -

6.39.7 Ecological Requirements ...................................................................................- 70 -

6.39.8 Catastrophic Failure...........................................................................................- 70 -

7. Electromagnetic Compatibility......................................................................................- 71 -

7.1 EMI ....................................................................................................................- 71 -

7.2 Input Line Current Harmonic Content (PFC) ....................................................- 71 -

Revision 1.0 vi

7.3 Magnetic Leakage Fields...................................................................................- 72 -

7.4 Voltage Fluctuations and Flicker........................................................................- 72 -

7.5 Reliability / Warranty / Service...........................................................................- 72 -

7.5.1 Component De-rating ........................................................................................- 72 -

7.5.2 Component Life requirement .............................................................................- 72 -

7.6 Mean Time Between Failures (MTBF)...............................................................- 72 -

7.6.1 Warranty Period.................................................................................................- 72 -

7.6.2 Serviceability......................................................................................................- 73 -

7.7 Power Supply Returned for Repair ....................................................................- 73 -

7.8 Modifications / Change Control..........................................................................- 73 -

7.9 Power Supply Compliance Overview.................................................................- 73 -

7.10 Power Supplies Compliance Information...........................................................- 74 -

7.11 EMC Compliance Information............................................................................- 74 -

7.12 Immunity Compliance Information .....................................................................- 75 -

7.13 Harmonics & Voltage Flicker Compliance Information ......................................- 75 -

7.14 Environmental / Ecology Compliance Information .............................................- 75 -

7.15 Other Safety Requirement Notations.................................................................- 76 -

7.15.1 Certification Conditions......................................................................................- 76 -

7.15.2 Isolation Between Primary - Secondary.............................................................- 76 -

7.15.3 Creepage & Clearance Requirements...............................................................- 76 -

7.15.4 Leakage Current Maximums..............................................................................- 76 -

7.15.5 Max Surface Temperatures ...............................................................................- 76 -

7.15.6 Date Coded Serial Numbers..............................................................................- 76 -

7.15.7 Power Input Electrical Ratings...........................................................................- 76 -

7.15.8 Maximum Allowable Temperatures on Inlet Receptacles..................................- 76 -

7.15.9 Maximum Allowable Temperatures on Power Cords.........................................- 76 -

8. Supported Intel® Server Boards....................................................................................- 77 -

8.1 Intel® Server Board SE7230NH1-E Feature Set................................................- 77 -

9. Regulatory, Environmentals, and Specifications........................................................- 80 -

9.1 Product Regulatory Compliance ........................................................................- 80 -

9.1.1 Product Safety Compliance ...............................................................................- 80 -

9.1.2 Product EMC Compliance .................................................................................- 80 -

9.1.3 Product Regulatory Compliance Markings ........................................................- 81 -

9.2 Electromagnetic Compatibility Notices ..............................................................- 81 -

9.2.1 USA ...................................................................................................................- 81 -

9.2.2 FCC Verification Statement ...............................................................................- 82 -

9.2.3 ICES-003 (Canada) ...........................................................................................- 82 -

Revision 1.0 vii

9.2.4 Europe (CE Declaration of Conformity) .............................................................- 82 -

9.2.5 Japan EMC Compatibility ..................................................................................- 83 -

9.2.6 BSMI (Taiwan) ...................................................................................................- 83 -

9.3 Replacing the Back up Battery ..........................................................................- 84 -

9.4 System Level Environmental Limits...................................................................- 85 -

9.5 Serviceability......................................................................................................- 85 -

Appendix A: Intel

®

Server Chassis SR1475 Integration and Usage Tips...........................- 3 -

Glossary...................................................................................................................................- 4 -

Revision 1.0 viii

List of Figures

Figure 1. Front Chassis View with Bezel ................................................................................- 13 -

Figure 2. Front Chassis View without Bezel ...........................................................................- 13 -

Figure 3. Rear Chassis View ..................................................................................................- 13 -

Figure 4. Major Chassis Components.....................................................................................- 14 -

Figure 5. Back Panel Feature Overview .................................................................................- 15 -

Figure 6. Front Panel Feature Overview.................................................................................- 16 -

Figure 7. Control Panel Module ..............................................................................................- 17 -

Figure 8. Standard Control Panel Overview ...........................................................................- 17 -

Figure 9. Optional Front Bezel ................................................................................................- 19 -

Figure 10. Front Bezel Options ...............................................................................................- 19 -

Figure 11. Intel

Figure 12. Intel

Figure 13. Intel

Figure 14. Air Baffle ................................................................................................................- 22 -

®

Server Chassis SR1475 Cooling Subsystem ...............................................- 20 -

®

Server Chassis SR1475 System Fans 4, 5, 6, 7, 8 ......................................- 21 -

®

Server System SE7230NH1-E System Fan Headers 4, 5, 6, 7, 8 ...............- 21 -

Figure 15. CPU/Memory Air Duct ...........................................................................................- 23 -

Figure 16. Intel

®

Server Chassis SR1475 Peripheral Bay Configuration Options...................- 24 -

Figure 17. View of Slim-line Drive Bay....................................................................................- 24 -

Figure 18. Optional Floppy Drive Configuration......................................................................- 26 -

Figure 19. Hard Disk Drive Bay ..............................................................................................- 28 -

Figure 20. Hard Drive Tray Assembly.....................................................................................- 29 -

Figure 21. Drive Tray with Drive Blank ...................................................................................- 29 -

Figure 22. SCSI Backplane Layout.........................................................................................- 30 -

Figure 23. SCSI Backplane Functional Diagram ....................................................................- 31 -

Figure 24. Intel

®

Server Chassis SR1475 SCSI HSBP I2C Bus Connection Diagram ...........- 33 -

Figure 25. 68-Pin SCSI Cable Connector ...............................................................................- 34 -

Figure 26. 80-pin SCA2 SCSI Interface ..................................................................................- 36 -

Figure 27. SATA Backplane Layout........................................................................................- 38 -

Figure 28. SATA Backplane Layout........................................................................................- 38 -

Figure 29. SATA Backplane Functional Block Diagram..........................................................- 39 -

Figure 30. Intel

®

Server Chassis SR1475 SATA HSBP I2C Bus Connection Diagram ..........- 40 -

Figure 31. Standard Control Panel Assembly Module ............................................................- 44 -

Figure 32. Standard Control Panel Buttons ............................................................................- 44 -

Figure 34. PCI Riser Bracket and Optional PCI-X* and PCI Express* Risers ........................- 49 -

Figure 35. 1U Full Height PCI-X* Riser Card Mechanical Drawing.........................................- 50 -

Revision 1.0 ix

Figure 36. 1U Full Height PCI Express* Riser Card Mechanical Drawing ..............................- 50 -

Figure 37. Power Supply Enclosure Drawing .........................................................................- 51 -

Figure 38. Airflow Characteristics ...........................................................................................- 52 -

Figure 39. Output Voltage Timing ...........................................................................................- 64 -

Figure 40. Turn On/Off Timing (Power Supply Signals)..........................................................- 66 -

Figure 41. PSON# Required Signal Characteristic. ................................................................- 69 -

Figure 42. SE7230NH1-E (LX) Board Layout .........................................................................- 78 -

Revision 1.0 x

List of Tables

Table 1. Chassis Dimensions .................................................................................................- 14 -

Table 2. Major Chassis Components......................................................................................- 15 -

Table 3. Individual Fan Assembly Pin-out (J5J1, J4J1, J4J3, J4J2).......................................- 22 -

Table 4. 4-pin Floppy Power Connector Pin-out (J3)..............................................................- 25 -

Table 5. 34-pin Floppy Connector Pin-out (J2) .......................................................................- 25 -

Table 6. 50-pin CD-ROM Connector Pin-out (J6) ...................................................................- 26 -

Table 7. 4-pin CD-ROM Power Connector Pin-out (J5)..........................................................- 27 -

Table 8. 40-pin CD-ROM Connector Pin-out (J1) ...................................................................- 27 -

Table 9. SCSI Backplane Power Connector Pin-out (J1) .......................................................- 34 -

Table 10. UltraWide (SE) and Ultra2 (LVD) Ultra320 SCSI Connector Pin-out (J8)...............- 35 -

Table 11. 80-pin SCA2 SCSI Interface Pin-out.......................................................................- 36 -

Table 12. LED Function ..........................................................................................................- 41 -

Table 13. SATA Backplane Power Connector Pin-out............................................................- 41 -

Table 14. 7-Pin SATA Connector Pin-out (J2, J3, J4, J5, J6).................................................- 42 -

Table 15. 22-Pin SATA Connector Pin-out .............................................................................- 42 -

Table 16. Standard Control Panel Button Functions...............................................................- 45 -

Table 17. Standard Control Panel LED Functions ..................................................................- 46 -

Table 18. SSI Power LED Operation ......................................................................................- 46 -

Table 19. External USB Connector (J2)..................................................................................- 47 -

Table 20. 50-pin Control Panel Connector (J3) ......................................................................- 48 -

Table 21. Internal USB Header (J9F2) ...................................................................................- 48 -

Table 22. Acoustic Requirements ...........................................................................................- 53 -

Table 23. Environmental Requirements.................................................................................- 53 -

Table 24. Cable Lengths.........................................................................................................- 53 -

Table 25. P1 Main Power Connector .....................................................................................- 54 -

Table 26. P2 Processor Power Connector.............................................................................- 54 -

Table 27. HD Power Connector .............................................................................................- 55 -

Table 28. Slim-line Power Connector ....................................................................................- 55 -

Table 29. AC Input Rating.......................................................................................................- 56 -

Table 30. AC Line Sag Transient Performance ....................................................................- 56 -

Table 31. AC Line Surge Transient Performance .................................................................- 57 -

Table 32. Performance Criteria...............................................................................................- 57 -

Table 33. Dropout Criteria.......................................................................................................- 58 -

Table 34. Load Ratings..........................................................................................................- 61 -

Revision 1.0 xi

Table 35. Voltage Regulation Limits .......................................................................................- 61 -

Table 36. Transient Load Requirements.................................................................................- 62 -

Table 37. Capacitve Loading Conditions ................................................................................- 62 -

Table 38. Ripple and Noise.....................................................................................................- 63 -

Table 39. Output Voltage Timing ............................................................................................- 64 -

Table 40. Turn On/Off Timing .................................................................................................- 65 -

Table 41. Over Current Protection (OCP)...............................................................................- 67 -

Table 42. Over-Voltage Protection (OVP) Limits ....................................................................- 67 -

Table 43. PSON

#

Signal Characteristic...................................................................................- 68 -

Table 44. PWOK Signal Characteristics .................................................................................- 69 -

Table 45. Harmonic Limits, Class A equipment ......................................................................- 71 -

Table 46: Baseboard Layout Reference .................................................................................- 79 -

Table 47. System Office Environment Summary ....................................................................- 85 -

Table 48. Mean Time To Repair Estimate ..............................................................................- 86 -

Revision 1.0 xii

Intel® Server Chassis SR1475/ Intel® Server System SR1475NH1-E

1. Intel® Server Chassis SR1475 Feature Summary

The Intel® Server Chassis SR1475 is a 1U server chassis specifically designed to support the

®

Intel

Server Board SE7230NH1-E. The Intel® Server Chassis SR1475 is available as a
standalone chassis solution from Intel, and as an integrated system. The Intel
SR1475NH1-E consists of the Intel

®

Server Board SE7230NH1-E integrated into the Intel®
Server Chassis SR1475. The server board and the server chassis have feature sets designed to
support the high-density server market.

®

Server System

The Intel
SE7230NH1LC version and the SE7230NH1LX version. Only the SE7230NH1LX version is
available for integration into the Intel

®

Server Board SE7230NH1-E is available in two different configurations, the

®

Server Chassis SR1475, and all references to the Intel®
Server Board SE7230NH1-E in this document refers to the SE7230NH1LX version of the server
board. This document provides details on the server chassis feature set and technical
specifications. For technical details related to the Intel
refer to the Intel

®

Server Board SE7230NH1-E Technical Product Specification.

®

Server Board SE7230NH1-E, please

1.1 Chassis Views

Figure 1. Front Chassis View with Bezel

Figure 2. Front Chassis View without Bezel

Figure 3. Rear Chassis View

- 13 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

1.2 Chassis Dimensions

Table 1. Chassis Dimensions

Height 43.25 mm 1.703”

Width 430 mm 16.930”

Depth 672 mm 26.457”

Max. Weight 14.1 kg 31 LBS

1.3 Intel® Server Chassis SR1475 System Components

C

A

J

I

H

B

G

D

E

F

Revision 1.0 - 14 -

Figure 4. Major Chassis Components

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

Table 2. Major Chassis Components

A Power Supply F Control Panel
B Chassis Intrusion Switch G Hard Drive Bays

C PCI Riser Card Assembly Placement H Slim-line Drive Bay
D CPU Air Duct Placement I PS / Electronics Bay Isolation Air Baffle

E System Fan Module J Power Supply Fans

1.4 Rear Panel Components

On the back of the chassis are cutouts for all external I/O connectors found on the server board.
The I/O connector locations are pre-cut, so the use of an I/O shield is not required.

A PS2 keyboard connector G USB 2 connector
B PS2 mouse connector H NIC 1 connector (RJ45)
C Serial port A connector (DB9) I PCI card bracket (full-height)
D Video connector J Rear chassis venting holes
E NIC 2 connector (RJ45) K Power Supply fans
F USB 1 connector L AC Power Receptacle

Figure 5. Back Panel Feature Overview

1.5 Hard Drive and Peripheral Bays

The server chassis is designed to support several different hard drive and peripheral
configurations. The hard drive bay is designed to support up to three fixed SATA or SCSI
drives, or three hot-swappable SATA or SCSI drives. SATA and SCSI hot-swap configurations
require an orderable accessory kit which includes the necessary cables, drive trays and
backplane. Reference the Intel
detailed accessory information.

The slim-line peripheral bay is capable of supporting any of the following slim-line devices: CD­ROM drive, DVD Drive, DVD/CDR Drive, or floppy drive. If both a CD-ROM or DVD/CDR and
floppy drive are required, an optional kit is available to convert the first 1” hard drive bay to a
floppy drive bay. The kit includes the necessary cables and slim-line floppy drive mounting tray.

®

Server Chassis SR1400 Spares/Parts and Configuration List for

Revision 1.0 - 15 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

Figure 6. Front Panel Feature Overview

A Slim-line drive bay (CD-ROM or DVD/CDR or

Floppy)
B Control Panel
C Hard Drive Fault/Activity LED
D 1” Hard Drive Bays
E Chassis Handle

1.6 Control Panel

The server chassis control panel assembly is pre-assembled and modular in design. The entire
module assembly slides into a predefined slot in the front of the chassis.

Revision 1.0 - 16 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

Figure 7. Control Panel Module

The control panel supports several push buttons and status LEDs, and includes USB and video
ports to centralize system control, monitoring, and accessibility to within a common compact
design. The following diagram overviews the layout and functions of the control panel.

C D E

B

F

G

H

A

I

L

Figure 8. Standard Control Panel Overview

K

J

A Power / Sleep Button G System Identification LED
B NIC #2 Activity LED H System Identification Button
C NIC #1 Activity LED I System Reset Button
D Power / Sleep LED J USB 2.0 Connector
E Not Used K Recessed NMI Button (Tool Required)
F Hard Drive Activity LED L Video connector (not supported on SR1475)

Revision 1.0 - 17 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

1.7 Power Sub-system

The power sub-system of the server chassis consists of a single non-redundant 350 W power
supply (PS) and provides several integrated management features including:

• Status LED

• Over-temperature protection circuitry

• Over-voltage protection circuitry

The power supply operates within the following voltage ranges and ratings: 100-127VAC (V) ∼
at 50/60 Hertz (Hz), 6 Ampere (A) maximum (max); 200-240VAC∼ at 50/60 Hz, 3 A maximum.

1.8 System Cooling

The server chassis provides non-redundant system fans and dual non-redundant power supply
fans to provide sufficient air flow for fixed and hot-swap drive configurations, processors,
memory, and an add-in card, when external ambient temperatures remain within specified limits.

1.9 Chassis Security

The server chassis provides support for several system security features including a lockable
front bezel, chassis intrusion switch, and a Kensington* style lock attach point.

1.10 Rack and Cabinet Mounting Options

The server chassis was designed to support 19” wide by up to 24”-30” deep server cabinets.
The chassis can be configured to support either a relay rack / cabinet mount kit that can be
configured to support both 2-post racks and 4-post cabinets; or a tool-less sliding rail kit that is
used to mount the chassis into a standard (19” by up to 30” deep) EIA-310D compatible server
cabinet.

1.11 Front Bezels

The optional front bezel is made of molded plastic and uses a snap-on design. When installed,
its design allows for maximum airflow.

Revision 1.0 - 18 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

Figure 9. Optional Front Bezel

Light pipes in the front bezel supporting the standard control panel allow the system status
LEDs to be monitored with the bezel installed

Figure 10. Front Bezel Options

Revision 1.0 - 19 -

Intel® Server Chassis SR1475/ Intel® Server System SR1475NH1-E

2. Cooling Sub-System

The cooling sub-system on the server chassis is compromised of four 40x40x56mm dual rotor
fans, one 40x40x28mm single rotor fan, two 40x40x28mm power supply fans, a CPU/memory
air duct, and a PS/electronics bay isolation air baffle, to provide the necessary cooling and
airflow to the system. A fan on the processor heat sink is not necessary in this chassis. In
order to maintain the necessary airflow within the system, the air baffle, CPU/memory air duct,
and the top cover need to be properly installed.

Note: The Intel

®

Server Chassis SR1475 does not support redundant cooling. Should a fan fail,

the system should be brought down as soon as possible to replace the failed fan.

Figure 11. Intel® Server Chassis SR1475 Cooling Subsystem

A System Fan #4 D Air Baffle

B Fans 5, 6, 7, 8 E Processor Heat Sink

C CPU / Memory Air Duct

- 20 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

2.1 System Fans

The server chassis system fans consist of four 40x40x56mm dual rotor and one 40x40x28mm
single rotor multi-speed fans, which provide the primary airflow for the system. The four dual
rotor fans provide the primary cooling for the processor, GMCH, and memory components on
the Intel
PCI add-in card, the ICH7R, and the PXH chipset components.

Removal and insertion of individual fans is a tool-less operation, and provides for ease of
installation and serviceability of the server chassis cooling subsystem. The individual fans are
not hot-swappable. The server must be turned off and power removed from the system before
any of the fans can safely be replaced.

Each dual rotor fan has an 8-pin wire harness which connects to the system fan headers 5, 6, 7
and 8 on the server board. These are shown, from left to right, in the following figure. Each fan
harness provides power and tachometer lines allowing the fans to be monitored independently
by server management software.

®

Server Board SE7230NH1-E. The single rotor fan provides the primary cooling for a

Figure 12. Intel® Server Chassis SR1475 System Fans 4, 5, 6, 7, 8

Figure 13. Intel

®

Server System SE7230NH1-E System Fan Headers 4, 5, 6, 7, 8

Revision 1.0 - 21 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

The following table provides the pin-outs for each dual rotor fan header.

Table 3. Individual Fan Assembly Pin-out (J5J1, J4J1, J4J3, J4J2)

Pin Signal Name Description

1 FAN_SPEED_CNTL2 Control the fan speed
2 FAN_FAIL FAN_TACH signal
3 GND Power Supply Ground
4 Reserved Reserved
5 GND Power Supply Ground
6 GND Power Supply Ground
7 FAN_FAIL FAN_TACH signal
8 Fan speed control Variable Speed Fan Power

The single rotor fan has a standard 3 or 4-pin SSI fan header that connects directly to the server
board system fan header #4 (J5J2).

Each fan within the module is capable of supporting multiple speeds. If the internal ambient
temperature of the system exceeds the value programmed into the fan control via BIOS, the
system will automatically increase the rotational speed for all the fans within fan module.

Note: There is no fan redundancy. Should a fan fail, the system should be shut down as soon
as possible to have the fan replaced. The system fans are not hot-swapable.

2.2 Power Supply Fans

The power supply supports two non-redundant 40mm fans. They are responsible for the cooling
of the power supply and drive bay 1 (the far left hard drive as viewed from the front of the
chassis).

2.3 CPU/Memory Air Duct and Side Air Baffle

The chassis requires the use of a CPU/memory air duct and power supply / electronics bay
isolation air baffle to direct airflow and sustain appropriate air pressure.

An air baffle is used to isolate the airflow of the two power supply fans from that of the system
fan module. The baffle is mounted into three stand-offs with one end fitting under the back
edge of the hard drive bay

Revision 1.0 - 22 -

Figure 14. Air Baffle

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

The CPU/memory air duct must be properly installed to direct airflow through the processor
heatsink and the memory area of the system.

Figure 15. CPU/Memory Air Duct

Notes:

1. If the CPU/memory air duct is removed, the system will not meet the thermal cooling
requirements of the processor, which will most likely result in degraded performance as a result
of throttling or thermal shutdown of the system.

2. Once the air dam is removed from the CPU air duct, it cannot be reinstalled.

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Intel® Server Chassis SR1475/ Intel® Server System SR1475NH1-E

3. Peripheral and Hard Drive Support

The server chassis provides three hard drive bays and one slim-line peripheral drive bay at the
front of the chassis. The drive bays are designed to support both fixed and hot-swap SCSI and
SATA drive configurations.

Figure 16. Intel® Server Chassis SR1475 Peripheral Bay Configuration Options

3.1 Slim-line Drive Bay

The chassis provides a slim-line drive bay that can be configured for either CD-ROM,
DVD/CDRW, or floppy drives, with or without the presence of a backplane. Regardless of
whether a SATA or SCSI backplane is present, all slim-line devices attach directly to the Intel
Server Board SE7230NH1-E.

Note: The 100-pin connector on the SATA and SCSI backplane is not used in the Intel

®

Chassis SR1475 and the Intel® Server Board SE7230NH1-E.

Drives are mounted on a tool-less tray which allows for easy installation into and removal from
the chassis. The slim-line devices are not hot-swappable.

Figure 17. View of Slim-line Drive Bay

®

Server

- 24 -

Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

3.1.1 Floppy Drive Support With or Without Backplane Present

The floppy drive is mated with an interposer card which provides the power and IO
interconnects between the drive, power supply, and the server board.

Note: The 100-pin connector on the backplane is not used with the Intel

®

Server Board

SE7230NH1-E.

The interposer card has three connectors. The first connector has 28 pins and is cabled directly
to the drive. The second connector has 4 pins and is cabled to the 2x3 pin power lead from the
power supply; this connector has the following pin-out.

Table 4. 4-pin Floppy Power Connector Pin-out (J3)

Pin Name

1 P12V
2 GND
3 GND
4 P5V

The power cable for the floppy drive is provided via a slim-line Y cable which comes with the

®

Intel

Server Chassis SR1475. The third connector has 34 pins and is cabled to the legacy

floppy connector on the server board; this connector has the following pin-out.

Table 5. 34-pin Floppy Connector Pin-out (J2)

Name Pin Pin Name

GND 1 2 FD_DENSEL0
GND 3 4 2M_MEDIA
GND 5 6 FD_DRATE0_L
GND 7 8 FD_INDEX_L
GND 9 10 FD_MTR0_L
GND 11 12 FD_DS1_L
GND 13 14 FD_DS0_L
GND 15 16 FD_MTR1_L
Unused 17 18 FD_DIR_L
GND 19 20 FD_STEP_L
GND 21 22 FD_WDATA_L
GND 23 24 FD_WGATE_L
GND 25 26 FD_TRK0_L
Unused 27 28 FD_WP_L
GND_FDD 29 30 FD_RDATA_L
GND 31 32 FD_HDSEL_L
MSEN0 33 34 FD_DSKCHG_L

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Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

3.1.2 Optional Floppy Drive Configuration

For system configurations that require a CD-ROM or DVD-CDR and floppy drive, where using a
USB floppy or USB CD-ROM is not desired, an accessory kit which consists of a slim-line floppy
drive tray and face plate can be used to install a floppy drive into the hard drive bay directly
beneath the slim-line drive bay a shown in the following diagram.

Figure 18. Optional Floppy Drive Configuration

3.1.3 CD-ROM or DVD-CDR Drive Use With or Without Backplane Present

The slim-line CD-ROM or DVD-CDR drive is mated with an interposer card which provides the
power and IO interconnects between the drive, power supply and the server board. The
interposer card has three connectors. The first connector has 50 pins and is plugged directly
into the drive connector; the connector has the following pin-out.

Table 6. 50-pin CD-ROM Connector Pin-out (J6)

Name Pin Pin Name

RSV_LCM 1 2 RSV_RCM
RSV_GND 3 4 GND
RST_IDE_S_L 5 6 IDE_SDD<8>
IDE_SDD<7> 7 8 IDE_SDD<9>
IDE_SDD<6> 9 10 IDE_SDD<10>
IDE_SDD<5> 11 12 IDE_SDD<11>
IDE_SDD<4> 13 14 IDE_SDD<12>
IDE_SDD<3> 15 16 IDE_SDD<13>
IDE_SDD<2> 17 18 IDE_SDD<14>
IDE_SDD<1> 19 20 IDE_SDD<15>
IDE_SDD<0> 21 22 IDE_SDDREQ
GND 23 24 IDE_SDIOR_L
IDE_SDIOW_L 25 26 GND
IDE_SIORDY 27 28 IDE_SDDACK_L
IRQ_IDE_S 29 30 NC_IDEIO16_L
IDE_SDA<1> 31 32 NC_CBL_DET_S
IDE_SDA<0> 33 34 IDE_SDA<2>
IDE_SDCS0_L 35 36 IDE_SDCS1_L
IDE_SEC_HD_ACT_L 37 38 P5V
P5V 39 40 P5V
P5V 41 42 P5V
GND 43 44 GND
GND 45 46 GND
IDEP_ALE_H 47 48 GND
49 50
52 Unused (50 pin or 52 pin)

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Intel® Server Chassis SR1475 / Intel® Server System SR1475NH1-E

The second connector has 4 pins and is cabled to the 2x3 pin power lead from the power
supply. The power cable for the drive is included in the Intel

®

Server Chassis SR1475 in the
form of a Y power cable. Both ends of the Y cable are necessary when a slim-line CD/DVD is
used in conjunction with a floppy installed in the hard drive bay. Both ends of this cable are
identical and have the following pin-out.

Table 7. 4-pin CD-ROM Power Connector Pin-out (J5)

Pin Name

1 P12V
2 GND
3 GND
4 P5V

The third connector has 40 pins and is cabled to the legacy IDE connector on the server board.
This connector has the following pin-out.

Table 8. 40-pin CD-ROM Connector Pin-out (J1)

Name Pin Pin Name

RST_IDE_S_L 1 2 GND
IDE_SDD<7> 3 4 IDE_SDD<8>
IDE_SDD<6> 5 6 IDE_SDD<9>
IDE_SDD<5> 7 8 IDE_SDD<10>
IDE_SDD<4> 9 10 IDE_SDD<11>
IDE_SDD<3> 11 12 IDE_SDD<12>
IDE_SDD<2> 13 14 IDE_SDD<13>
IDE_SDD<1> 15 16 IDE_SDD<14>
IDE_SDD<0> 17 18 IDE_SDD<15>
GND 19 20 Unused
IDE_SDDREQ 21 22 GND
IDE_SDIOW_L 23 24 GND
IDE_SDIOR_L 25 26 GND
IDE_SIORDY 27 28 IDEP_ALE_H
IDE_SDDACK_L 29 30 GND
IDE_IDE_S 31 32 NC_IDEIO16_L
IDE_SDA<1> 33 34 IDE_CBL_DET_S
IDE_SDA<0> 35 36 IDE_SDA<2>
IDE_SDCS0_L 37 38 IDE_SDCS1_L
IDE_SEC_HD_ACT_L 39 40 GND

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