* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.
4-8 How to Update BIOS..................................................................................................42
4-9 G.P.I. Function LED Display .....................................................................................43
ABOUT INTEL LGA 1156 CPU SOCKET ................................................. 9
ii
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset).
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF THIS
MOTHERBOARDS TO MEET THE USER’S REQUIREMENTS. BUT IT WILL CHANGE, CORRECT
AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS”
WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition January, 2010
Item Checklist
5
Intel H55 chipset based Motherboard
5
User’s Manual
5
DVD for motherboard utilities
5
SATA Cable
5
I/O Back Panel Shield
Intel Core Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial while building computer systems. Maintaining the
proper thermal environment is the key to reliable, long-term system operation. The overall
goal in providing the proper thermal environment is keeping the processor below its specified
maximum case temperature. Heat sinks induce improved processor heat dissipation through
increased surface area and concentrated airflow from attached fans. In addition, interface
materials allow effective transfers of heat from the processor to the heat sink. For optimum
heat transfer, Intel recommends the use of thermal grease and mounting clips to attach the
heat sink to the processor.
When selecting a thermal solution for your system, please refer to the website below for
collection of heat sinks evaluated and recommended by Intel for use with Intel processors.
Note, those heat sinks are recommended for maintaining the specified Maximum T case
requirement. In addition, this collection is not intended to be a comprehensive listing of all
heat sinks that support Intel processors.
iv
Chapter 1
Introduction of IntelH55 Express Chipset
Motherboards
1-1 Features of Motherboard
The Intel H55 Express chipset based motherboard series are based on Intel H55
Express chipset technology which supports the innovative Intel LGA 1156 socket
Intel® Core™ i7, Intel® Core™ i5(Lynnfield & Clarkdale), Core™ i3 and Pentium®
Processor.
The Intel H55 Express chipset based motherboard series comes with an integrated
DDRIII memory controller for dual channel DDRIII 1066 /DDRIII 1333 MHz system
memories which are expandable to 16 GB capacity and the new generation of PCI
Express interface for the latest graphics AMD cards. The Intel H55 Express chipset
motherboard series are absolutely the ultimate solution for game enthusiasts and
applications, and it also meets the demanding usage of computing of gaming,
multimedia entertainment and business applications.
The motherboard provides six serial ATA2 interfaces of 3.0 Gb / s data transfer rate
for six serial ATA devices.
The H55 Express chipset Based motherboard provides Gigabit LAN function by using
Gigabit LAN chip which support 10M / 100M / 1Gbps data transfer rate. Embedded
8-channel ALC883 HD CODEC is fully compatible with Sound Blaster Pro standards
that offer you with the home cinema quality and absolutely software compatibility.
The H55 Express chipset based motherboard series offer two PCI-Express2.0 x16
graphics slots. With PE1 being PCI Express 2.0 x16by16 lane slot and PE3 being PCI
Express 2.0 x16by4 lane slot. These two graphics slots are fully compatible with the
latest AMD CrossFireX Technology to guarantee the fully operational Multi-GPUs
graphics function and avoid the possible installation error. One PCI Express x1 I/O
slot and one 32-bit PCI slot guarantee the rich connectivity for the I/O of peripherals.
Embedded USB controllers as well as capability of expanding to 10 of USB2.0
functional ports delivering 480Mb/s bandwidth of rich connectivity, these
motherboards meet the future USB demands which are also equipped with hardware
monitor function on system to monitor and protect your system and maintain your
non-stop business computing.
Some special features--- CPU Smart Fan/OC-CON/G.P.I. Function/3D Audio/ DIY Clear Button/Power on Button/Reset Button in this motherboard is designed for
power user to use the over-clocking function in more flexible ways. But please be
caution that the over-clocking may cause the failure in system reliability. This
motherboard provides the guaranteed performance and meets the demands of the
next generation computing. But if you insist to gain more system performance with
variety possibilities of the components you choose, please be careful and make sure
1
to read the detailed descriptions of these value added product features, please get
them in the coming section.
1-1.1 Special Features of motherboard
CPU Smart Fan--- The Noise Management System
It’s never been a good idea to gain the performance of your system by sacrificing its
acoustics. CPU Smart Fan Noise Management System is the answer to control the
noise level needed for now-a-day’s high performance computing system. The system
will automatically increase the fan speed when CPU operating loading is high, after
the CPU is in normal operating condition, the system will low down the fan speed for
the silent operating environment. The system can provide the much longer life cycle
for both CPU and the system fans for game use and business requirements.
OC-CON ---High-polymer Solid Electrolysis Aluminum Capacitors
The working temperature is from 55 degrees Centigrade below zero to 125 degrees
Centigrade, OC-CON capacitors possess superior physical characteristics that can
be while reducing the working temperature between 20 degrees Centigrade each time,
intact extension 10 times of effective product operation lives, at not rising degrees
Centigrade of working temperatures each time a relative one, life of product decline
10% only too.
G.P.I. Function—Green power indicator function
The full name of G.P.I technology is Green Power Indicator technology, obviously
technology utilized to low power consumption. G.P.I is a technology with remarkable
power saving function.
DIY Clear Button— CMOS1 Button
These CMOS Buttons is to facilitate the clear COMS process for power user
overclocking function. The user can easily clear or restore COMS settings by pressing
down the button, without taking trouble to remove the case and locate the jumper for
clear CMOS. (Please remove or turn off the power supply before COMS clear)
Power on Button
You can easily start the computer by pressing down this button for a few seconds,
without troubling yourself to locate the front panel jumpers to find the Power on
jumper.
Reset Button
You can easily restart the computer by pressing down this button for a few seconds,
without troubling yourself to locate the front panel jumpers to find the reset jumper.
2
1-2 Specification
Spec Description
U-ATX form factor, 4 layers blue PCB size:
Design
Chipset z
CPU Socket
Memory Sockets
Expansion Slots
Serial ATA2
Gigabit LAN
8-CH HD Audio
BIOS z
z
23.0cmx24.5cm
Intel H55 Express Chipset
z supports the innovative Intel LGA 1156 socket Intel®,
Support 4pcs DDRIII 1066/DDRIII 1333 memory modules
z
expandable to 16GB.
Support dual channel function
z
1pcs PCI-Express2.0 x16by16 lane slot
z
1pcs PCI-Express2.0 x16by4 lane slot
z
1pcs 32-bit PCI slot
z
1pcs PCI-Express2.0 x1 slot
z
The Intel H55 chipset supports six internal Serial ATA ports
z
for six SATA devices providing 3.0 Gb/sec data transfer
rate.
Integrated Realtek PCI-E Gigabit LAN chip
z
Supports Fast Ethernet LAN function provide
z
10Mb/100Mb/ 1Gb /s data transfer rate.
Realtek ALC883 8-channel HD Audio Codec integrated
z
Support 8-channel 3D surround & Positioning Audio
z
Audio driver and utility included
z
AMI 32MB SMT Flash ROM
PS/2 keyboard connector x1
z
PS/2 mouse connector x1
z
Coaxial S/PDIF Out connector x1
z
Optical S/PDIF Out connector x1
z
HDMI Connector x1
z
DVI Connector x1
z
VGA Connector x1
z
SATA connector x6
Multi I/O
z
USB2.0 port x4 and header x3
z
RJ-45 LAN connector x1
z
Audio connector x1 (8-CH Audio)
z
Front Panel Audio Header x1
z
Serial Port headerx1
z
HDMI-SPDIF header x1
z
IR header x 1
z
WI-FI header x 1
z
3
/
/
/
/
1-3 Performance List
The following performance data list is the testing result of some popular benchmark
testing programs. These data are just referred by users, and there is no responsibility
for different testing data values gotten by users (the different Hardware & Software
configuration will result in different benchmark testing results.)
CPU: Intel CPU 3.07GHZ 08#
HDD: WesternDigtal 160GB SATA
VGA: onboard VGA
BIOS: R1.00
MEMORY: Apacer 2G1333
VGA DRIVER: 06.14.14.10.5160
3DMark Vantage
3D Mark 2006
3D Mark 2005
AQUAMRK3
PCMark2005
System / CPU / Memory
Graph / HDD
Content Creation Winstone 2004
Business Winstone 2004
Winbench 99 V2.0:
Business/Hi-end Disk Winmark99
USB from UL1 and
USB1
RJ 45 LAN from UL1 RJ-45 LAN Port Over USB Connectors. 8-pin Connector
AUDIO8-CH Audio Connector 6 phone jack Connector
SATA~SATA6 Serial ATA2 Connector 7-pin Connector
SPDIF_ Out Coaxial S/PDIF Out Connector 1-pin Connector
SPDIF_ Out2 Optical S/PDIF Out Connector 1-pin Connector
USB 2.0 Port Connectors 4-pin Connector
Headers
Header Name Description
FP_AUDIO SPEAKER, MIC Header 9-pin Block
USB2,USB3,USB4 USB Port Headers 9-pin Block
SPEAK PC Speaker Header 4-pin Block
PWR LED Power LED Header 3-pin Block
JW_FP(PWR
LED/Reset/
HD LED/PWR BTN)
CPUFAN1 CPUFAN Header 4-pin Block
SYSFAN1, SYSFAN2 System FAN Headers 3-pin Block
CDIN CD Audio-In Header 4-pin Block
IR1 IR Header 5-pin Block
Front Panel Header
(including Power LED/ IDE activity
LED/Reset switch / Power On Button lead)
9-pin Block
Sockets and Slots
Socket/Slot Name Description
CPU Socket LGA 1156 CPU socket LGA 1156 CPU socket
DIMM1~DIMM4
PCI1
PE2
PE1
PE3
DDRIII module Sockets 240-pin DDRIII module sockets
PCI slot 32-bit PCI Local Bus Expansion slot
PCI-Express2.0 x 1 slot PCI-Express2.0 x 1 Expansion slot
PCI-Express2.0x16by
16lane slot
PCI-Express2.0x16by4 lane
slot
PCI-Express2.0 x16 by16 lane Expansion
slot
PCI-Express2.0 x16 by 4 lane Expansion
slot
6
Chapter 2
Hardware Installation
WARNING!
Turn off your power when adding or removing expansion cards or
other system components. Failure to do so may cause severe
damage to both your motherboard and expansion cards.
2-1 Hardware installation Steps
Before using your computer, you had better complete the following steps:
1. Check motherboard jumper setting
2. Install CPU and Fan
3. Install System Memory (DIMM)
4. Install Expansion cards
5. Connect IDE Front Panel /Back Panel cable
6. Connect ATX Power cable
7. Power-On and Load Standard Default
8. Reboot
9. Install Operating System
10. Install Driver and Utility
2-2 Checking Motherboard’s Jumper Setting
(1) CMOS RAM Clear (2-pin): JBAT
A battery must be used to retain the motherboard configuration in CMOS RAM,
short 1-2 pins of JBAT to clear the CMOS data.
To clear the CMOS, follow the procedure below:
1. Turn off the system and unplug the AC power
2. Remove ATX power cable from ATX power connector
3. Locate JBAT and short pins 1-2 for a few seconds, if shorted with the jump cap,
short for a few seconds then pull out the hat.
4. Connect ATX power cable back to ATX power connector
Note: When should clear CMOS
1. Troubleshooting
2. Forget password
3. After over clocking system boot fail
JBAT
1-2 Open: Normal
CMOS Clear Setting
1-2 Short: CMOS Clear
7
(2) KB/MS Power on Function Enabled/Disabled: JP1
JP1
1-2 Closed KB/MS Power ON Disable (Default)
Keyboard/Mouse Power On Setting
JP1
2-3 Closed KB/MS Power ON Enabled
(3) USB Power On function Enabled/Disabled: JP2/JP3
JP2/ JP3 JP2 / JP3
2-3 closed USB Power On En abled
1-2 c losed USB Pow er On Disable
(Defaul t)
USB Power-On Setting
2-3 Installing CPU
2-3-1 Glossary
Chipset (or core logic) - two or more integrated circuits which control the interfaces
between the system processor, RAM, I/O devises, and adapter cards.
Processor slot/socket - the slot or socket used to mount the system processor on
the motherboard.
Slot (PCI-E, PCI, RAM) - the slots used to mount adapter cards and system RAM.
PCI - Peripheral Component Interconnect - a high speed interface for video cards,
sound cards, network interface cards, and modems; runs at 33MHz.
PCI Express2.0- Peripheral Component Interconnect Express2.0, developed in 2003,
the speed of each line doubled from the previous PCI-E of 2.5Gbps to 5 Gbps.
Serial Port - a low speed interface typically used for mouse and external modems.
Parallel Port - a low speed interface typically used for printers.
PS/2 - a low speed interface used for mouse and keyboards.
USB - Universal Serial Bus - a medium speed interface typically used for mouse,
keyboards, scanners, and some digital cameras.
Sound (interface) - the interface between the sound card or integrated sound
connectors and speakers, MIC, game controllers, and MIDI sound devices.
LAN (interface) - Local Area Network - the interface to your local area network.
BIOS (Basic Input/Output System) - the program logic used to boot up a computer
and establish the relationship between the various components.
Driver - software, which defines the characteristics of a device for use by another
device or other software.
8
Processor - the "central processing unit" (CPU); the principal integrated circuit used
for doing the "computing" in "personal computer"
Front Side Bus Frequency -
the working frequency of the motherboard, which is
generated by the clock generator for CPU, DRAM and PCI BUS.
CPU L2 Cache -
the flash memory inside the CPU, normal it depend on CPU type.
2-3-2 About Intel LGA 1156 CPU Socket
This motherboard provides an 1156-pin DIP, LGA 1156 Land Grid Array socket,
referred to as the LGA 1156 socket.
The CPU that comes with the motherboard should have a cooling FAN attached to
prevent overheating. If this is not the case, then purchase a correct cooling FAN
before you turn on your system.
NOTED!
Be sure that there is sufficient air circulation across the processor’s
heat sink and CPU cooling FAN is working correctly, otherwise it
may cause the processor and motherboard overheat and damage,
you may install an auxiliary cooling FAN, if necessary.
To install a CPU, first turn off your system and remove its cover. Locate the LGA
1156 socket and open it by first pulling the level sideways away from the socket then
upward to a 135-degree angle. Insert the CPU with the correct orientation as shown
below. The notched corner should point toward the end of the level. Because the
CPU has a corner pin for two of the four corners, the CPU will only fit in the orientation
as shown.
When you install the CPU into the LGA 1156 socket, there’s no force required CPU
insertion; then press the level to locate position slightly without any extra force.
Alignment key
Pin-1
Indicator
9
2-3-3 LGA 1156 CPU Installation Guide
1. Please make sure that CPU socket is facing
towards you and the level is on you left hand
side.
2. Press down the level and move it to the left side
to make sure it is freed from the hook and then
open it upwards about 135 degree.
3. Open the level upwards about 135 degree and the
metal protection plate will be pulled up at the same
time.
4. Remove the plastic protective cap from the
socket. (Put it to the original place if CPU is not
installed. Do not touch the metal contact point of
the CPU socket).
Pin-1
Indicator
Alignment
Key
Alignment
Key
5. Make sire that golden finger in the right place as shown in the above illustration and
match the two alignment keys on the CPU with two points of the socket. CPU can only be
correctly installed with this direction. Incorrect installation might cause damage to CPU.
10
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