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Pentium M 733J
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Intel Pentium M 765, Pentium M 735, Pentium M 755, Pentium M 745, Pentium M 725 Datasheet

...
Intel® Pentium® M Processor on 90 nm Process with 2-MB L2 Cache
Datasheet
January 2006
IINFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PRO PERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHA TSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING T O FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY P ATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “un defined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
®
The Intel product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. .
different processor families. See www.intel.com/products/processor_number for details. Intel, Pentium, Celeron, MMX, Intel SpeedStep and the In tel logo are tr ademarks or re gistered tra demarks of Intel Cor poration or it s subsidiaries in the
United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2004—2006, Intel Corporation. All rights reserved
Pentium® M processor on 90 nm process with 2-MB L2 cache may contain design defects or errors known as errata which may cause the
Intel processor numbers are not a measure of performance. Processor numbers differentiat e features within each processor family, not across
2 Datasheet

Contents

1 Introduction....................................................................................................................................7
1.1 Terminology..........................................................................................................................9
1.2 References ...........................................................................................................................9
2 Low Power Features....................................................................................................................11
2.1 Clock Control and Low Power States .................................................................................11
2.1.1 Normal State..........................................................................................................11
2.1.2 AutoHALT Power-Down State ............................................................ ... ... ... .... ... ...11
2.1.3 Stop-Grant State....................................................................................................12
2.1.4 HALT/Grant Snoop State.......................................................................................12
2.1.5 Sleep State ............................................................................................................13
2.1.6 Deep Sleep State...................................................................................................13
2.1.7 Deeper Sleep State ...............................................................................................14
2.2 Enhanced Intel SpeedStep
2.3 Front Side Bus Low Power Enhancements ........................................................................15
2.4 Processor Power Status Indicator (PSI#) Signal ................................................................15
3 Electrical Specifications .............................................................................................................17
3.1 Power and Ground Pins......................................................................................................17
3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking ...................................................17
3.2 Voltage Identification ..........................................................................................................17
3.3 Catastrophic Thermal Protection........................................................................................18
3.4 Signal Terminations and Unused Pins................................................................................19
3.5 FSB Frequency Select Signals (BSEL[1:0]) .......................................................................19
3.6 FSB Signal Groups.............................................................................................................19
3.7 CMOS Signals ....................................................................................................................20
3.8 Maximum Ratings...............................................................................................................21
3.9 Processor DC Specifications ..............................................................................................21
®
Technology ...........................................................................14
4 Package Mechanical Specifications and Pin Information .......................................................47
4.1 Processor Pinout and Pin List............ .... ... ..........................................................................54
4.2 Alphabetical Signals Reference..........................................................................................70
5 Thermal Specifications and Design Considerations................................................................77
5.1 Thermal Specifications .......................................................................................................80
5.1.1 Thermal Diode .......................................................................................................80
5.1.2 Thermal Diode Offset.............................................................................................81
5.1.3 Intel
Datasheet 3
®
Thermal Monitor...........................................................................................82
Figures
2-1 Clock Control States..................... .... ... ... ... ... .... ... ... ... .................................................................11
3-1 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#A)............................31
3-2 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#A) ...................32
3-3 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#B)............................33
3-4 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#B) ...................34
3-5 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#C) ...........................35
3-6 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#C) ...................36
3-7 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#D) ...........................37
3-8 Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#D) ...................38
3-9 Illustration of Active State VCC Static and Ripple Tolerances (HFM- VID#E)............................39
3-10Illustration of Deep Sleep State VCC Static and Ripple Tolerances (LFM- VID#E) ...................40
3-11Active VCC and ICC Load Line ..................................................................................................43
3-12Deep Sleep VCC and ICC Load Line .........................................................................................44
4-1 Micro-FCPGA Package Top and Bottom Isometric Views ............................ ... ... .... ... ... ... ... .... ...47
4-2 Micro-FCPGA Package - Top and Side Views...........................................................................48
4-3 Micro-FCPGA Package - Bottom View.......................................................................................49
4-4 Micro-FCBGA Package Top and Bottom Isometric Views ............................ ... ... .... ... ... ... ... .... ...51
4-5 Micro-FCBGA Package Top and Side Views .............................................................................52
4-6 Micro-FCBGA Package Bottom View.........................................................................................54
4-7 The Coordinates of the Processor Pins as Viewed from the Top of the Package... ... ... ... ... .... ...55
4 Datasheet
Tables
1-1 References ...................................................................................................................................9
3-1 Voltage Identification Definition ..................................................................................................18
3-2 FSB Pin Groups..........................................................................................................................20
3-3 Processor DC Absolute Maximum Ratings....... ... ... .... ... ... ... .... ... ... ....................................... ... ...21
3-4 Voltage and Current Specifications - Standard Voltage Processors ..........................................22
3-5 Voltage and Current Specifications - Low Voltage Processors ..................................................24
3-6 Voltage and Current Specifications - Ultra Low Voltage Processors..........................................26
3-7 Voltage and Current Specifications (Continued).........................................................................28
3-8 Voltage Tolerances for the Intel 3-9 Voltage Tolerances for the Intel 3-10Voltage Tolerances for the Intel 3-11Voltage Tolerances for the Intel 3-12Voltage Tolerances for the Intel 3-13Voltage Tolerances for the Intel 3-14Voltage Tolerances for the Intel 3-15Voltage Tolerances for the Intel 3-16Voltage Tolerances for the Intel 3-17Voltage Tolerances for the Intel 3-18Voltage Tolerances for the Intel 3-19Voltage Tolerances for the Intel 3-20Voltage Tolerances for the Intel 3-21Voltage Tolerances for the Intel
3-22FSB Differential BCLK Specifications.........................................................................................44
3-23AGTL+ Signal Group DC Specifications.....................................................................................45
3-24CMOS Signal Group DC Specifications......................................................................................45
3-25Open Drain Signal Group DC Specifications..............................................................................46
4-1 Micro-FCPGA Package Dimensions...........................................................................................50
4-2 Micro-FCBGA Package Dimensions...........................................................................................53
4-3 Pin Listing by Pin Name..............................................................................................................57
4-4 Pin Listing by Pin Number ..........................................................................................................63
4-5 Signal Description.......................................................................................................................70
5-1 Power Specifications for the Intel
5-2 Thermal Diode Interface.............................................................................................................81
5-3 Thermal Diode Specification.......................................................................................................81
®
Pentium® M Processor (Active State) VID#A........................31
®
Pentium® M Processor (Deep Sleep State) VID#A ...............32
®
Pentium® M Processor (Active State) VID#B........................33
®
Pentium® M Processor (Deep Sleep State) VID#B ...............34
®
Pentium® M Processor (Active State) VID#C........................35
®
Pentium® M Processor (Deep Sleep State) VID#C...............36
®
Pentium® M Processor (Active State) VID#D........................37
®
Pentium® M Processor (Deep Sleep State) VID#D...............38
®
Pentium® M Processor (Active State) VID#E........................39
®
Pentium® M Processor (Deep Sleep State) VID#E ...............40
®
Pentium® M Processor LV (Active State)..............................41
®
Pentium® M Processor LV (Deep Sleep State).....................42
®
Pentium® M Processor ULV (Active State)............................42
®
Pentium® M Processor ULV (Deep Sleep State)...................43
®
Pentium M Processor..........................................................78
Datasheet 5

Revision History

Revision Description Date
001 Initial release of datasheet May 2004 002 Added Intel
• Specifications of Intel
003
004 Added Intel
005
006 • Added Intel 007 008 Added Intel
• Chapter 2 section 2.1.3 - Missing Stop Grant State title added.
• Table 4 - Max ratings specifications updated
• Added Intel
• Added Execute Disable support feature and lead free SLI
• Added Table 3-20 AGTL + Signal Group Signal DC
• Table 3-18 - Voltage Tolerances for Intel
Updated Intel for optimized VID
®
Pentium® M processor 725 and 715 specifications June 2004
and Ultra Low Voltage 733 & 723 added in chapter 3 and chapter
5. Description was previously merged with Auto Halt state section
and is unchanged.
®
Pentium® M processor 765 specifications October 2004
®
Pentium® M processor 753 and 758 specifications
(second layer interconnect) Micro-FCPGA packaging information in chapter 1
Specifications
processor ULV (Deep Sleep State) updated
®
Pentium® M processor 778 specifications July 2005
®
Pentium® M processor 753 and 733J specifications
®
Pentium® M processor 773 specifications January 2006
®
Pentium® M processor Low Voltage 738
®
Pentium® M
July 2004
January 2005
July 2005
§
6 Datasheet

1 Introduction

The Intel® Pentium® M processor based on 90 nm process technology featuring 2-MB L2 cache and 400-MHz front side bus (FSB) is the next generation high- performance, low-power mobile processor based on the Intel
®
Pentium® processor architecture.
Introduction
Throughout this document, Intel Pentium M processor based on 90 nm technology featuring 2-MB L2 cache and 400 MHz FSB will be referred to as Pentium including low voltage and ultra low voltage processors.
This document contains specifications for the Pentium M processors 765/ 755/ 745/ 735/ 725/ 715 Standard Voltage, 778/758/738 Low Voltage and 773/753/733J/733/723 Ultra Low Voltage
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/ products/processor_number for details.
The following list provides some of the key features on this processor:
• Supports Intel
®
Architecture with Dynamic Execution
M processor, or simply the processor,
.
• On-die, primary 32-KB instruction cache and 32-KB write-back data cache
• On-die, 2 MB second level cache with Advanced Transfer Cache Architecture
• Way set associativity and ECC (Error Correcting Code) support
• Data Prefetch Logic
• Streaming SIMD extensions 2 (SSE2)
• 400 MHz, source-synchronous FSB
• Advanced power management features including Enhanced Intel SpeedStep
®
technology
• Micro-FCPGA and Micro-FCBGA packaging technologies
• Manufactured on Intel’s advanced 90 nanometer process technology with copper interconnect.
• Support for MMX™ technology and Internet Streaming SIMD instructions
• The processor’s data prefetch logic fetches data to the L2 cache before L1 cache requests
occurs, resulting in reduced bus cycle penalties and improved performance
• Micro-FCPGA and Micro-FCBGA packaging technologies, includ ing lead free SLI (second
level interconnect) technology for the Micro-FCBGA package (for Pentium M processors 755, 745, 778, 758, 738, 773, 753, 733J/733, 723)
• Execute Disable Bit support for enhanced security (available on processors with CPU
Signature = 06D8h and recommended for implementation on Intel family-based platforms only)
The Pentium M processor will be manufactured on Intel’s advanced 90 nm process technology with copper interconnect. The processor maintains support for MMX technology and Internet Streaming SIMD instructions and full compatibility with IA-32 software. The on-die, 32-KB Level 1 instruction and data caches along with the 2-MB L2 cache with advanced transfer cache
Datasheet 7
®
915 Express chipset
Introduction
architecture enable significant performance improvement over existing mobile processors. The processor’s data prefetch logic fetches data to the L2 cache before L1 cache requests occurs, resulting in reduced bus cycle penalties and improved performance.
The streaming SIMD extensions 2 (SSE2) enable break-through levels of performance in multimedia applications including 3-D graphics, video decoding/encoding, and speech recognition. The new packed double-precision floating-point instructions enhance performance for applications that require greater range and precision, including scientific and engineering applications and advanced 3-D geometry techniques, such as ray tracing.
The Pentium M processor’s 400-MHz FSB utilizes a split-transaction, deferred reply protocol. The 400-MHz FSB uses source-synchronous transfer (SST) of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate, as in AGP 4X). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a “double-clocked” or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 3.2 GB/second. The FSB uses Advanced Gunning Transceiver Logic (AGTL+) signaling technolo gy, a variant of GTL+ signaling technology with low power enhancements.
The processor features Enhanced Intel SpeedStep technology, which enables real-time dynamic switching between multiple voltage and frequen cy points. This results in optimal performance without compromising low power. The processor features the Auto Halt, Stop Grant, Deep Sleep, and Deeper Sleep low power states.
The Pentium M processor utilizes socketable Micro Flip-Chip Pin Grid Array (Micro-FCPGA) and surface mount Micro Flip-Chip Ball Grid Array (Micro-FCBGA) package technology. The Micro­FCPGA package plugs into a 479-hole, surface-mount, zero insertion force (ZIF) socket, which is referred to as the mPGA479M socket.
Pentium M processors with CPU Signature = 06D8h will also include the Execute Disable Bit capability . This feature combined with a support operating system allows memory to be marked as executable or non executable. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel
®
Architecture Software Developer's Manual for more detailed information. Intel will validate this feature only on Intel 915 Express chipset family based platforms and recommends customers implement BIOS changes related to this feature, only on Intel 915 Express chipset family based platforms.
Note: The term AGTL+ is used to refer to Assisted GTL+ signalling technology on some Intel processors.
8 Datasheet

1.1 Terminology

Term Definition
# A “#” symbol after a signal name refers to an active low signal, indicating a signal is in
Front Side Bus (FSB)
the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the “#” symbol implies that the signal is inverted. For example, D[3:0] = “HLHL” refers to a hex ‘A’, and D[3:0]# = “LHLH” also refers to a hex “A” (H= High logic level, L= Low logic level). XXXX means that the specification or value is yet to be determined.
Refers to the interface between the processor and system core logic (also known as the chipset components).

1.2 References

Material and concepts available in the following documents may be beneficial when reading this document. Please note that “platform design guides,” when used throughout this document, refers to the platform design guides listed below:
Introduction
Table 1-1. References (Sheet 1 of 2)
Intel Pentium M Processor on 90 nm Process with 2-MB L2 Cache ­Specification Update
Mobile Intel
Mobile Intel Update
Intel Intel
Intel
Intel
Intel Datasheet
Intel Chipset Specification Update
Intel
915PM/GM/GMS and 910GML Express Chipset Datasheet http://www.intel.com/
915PM/GM/GMS and 910GML Express Chipset Specification
855PM Chipset Platform Design Guide: For use with IntelPentium M and
CeleronProcessors
855PM Chipset Memory Controller Hub (MCH) Datasheet http://developer.intel.com/
855PM Chipset MCH DDR 333/200/266 MHz Specification Update http://developer.intel.com/
855GM/GME Chipset Graphics and Memory Controller Hub (GMCH)
855GM/GME Chipset Graphics and Memory Controller Hub (GMCH)
855GM/855GME Chipset Platform Design Guide http://developer.intel.com/
Document
Document Number/
Location
http://www.intel.com/ design/mobile/specupdt/
302209.htm
design/mobile/datashts/
305264.htm http://www.intel.com/
design/mobile/specupdt/
307167.htm http://developer.intel.com/
design/mobile/desguide/
252614.htm
design/chipsets/datashts/
252613.htm
design/chipsets/specupdt/
253488.htm http://developer.intel.com/
design/chipsets/datashts/
252615.htm http://developer.intel.com/
design/chipsets/specupdt/
253572.htm
design/mobile/desguide/
252616.htm
1
Datasheet 9
Introduction
Table 1-1. References (Sheet 2 of 2)
Document
IA-32 Intel Architecture Software Developer's Manual http://www.intel.com/
Volume 1: Basic Architecture Volume 2A: Instruction Set Reference Volume 2B: Instruction Set Reference Volume 3: System Programming Guide
NOTE: Contact your Intel representative for the latest revision and document number of this document.
Document Number/
Location
design/pentium4/ manuals/index_new.htm
§
1
10 Datasheet

2 Low Power Features

2.1 Clock Control and Low Power States

The Pentium M processor supports the AutoHALT Power-Down, Stop Grant, Sleep, Deep Sleep, and Deeper Sleep states for optimal power management. See Figure 2-1 for a visual representation of the processor low-power states.
Figure 2-1. Clock Control States
Low Power Features
STPCLK# asserted
Normal Sleep
halt
break
instruction
Auto Halt
STPCLK# deasserted
HLT
Halt break - A20M#, INIT#, INTR, N MI, PREQ#, RESET# , S MI#, or APIC interrupt

2.1.1 Normal State

This is the normal operating state for the processor.
STPCLK#
asserted
STPCLK#
deasserted
snoop
occurs
snoop
serviced
Stop
Grant
snoop
serviced
HALT/
Grant
Snoop
snoop
occurs
SLP# asserted
SLP# deasserted
core voltage raised
Deeper
Sleep
core voltage lowered
V0001-04
DPSLP#
de-asserted
DPSLP# asserted
Deep
Sleep

2.1.2 AutoHALT Power-Down State

AutoHALT Power-Down is a low-power state entered when the processor executes the HALT instruction. The processor will transition to the Normal state upon the occurrence of SMI#, INIT#, LINT[1:0] (NMI, INTR), or FSB interrupt me ss age. RESET# will cause the processor to immediately initialize itself.
A system management interrupt (SMI) handler will return execution to either Normal state or the AutoHALT Power-Down state. See the IA-32 Intel Volume 3: System Programmer's Guide for more information.
Datasheet 11
®
Architecture Software Developer's Manual,
Low Power Features
The system can generate a STPCLK# while the processor is in the AutoHALT Power-Down state. When the system deasserts the STPCLK# interrupt, the processor will return execution to the HALT state.
While in AutoHALT Power-Down state, the processor will process bus snoops and interrupts.

2.1.3 Stop-Grant State

When the STPCLK# pin is asserted, the Stop-Grant state of the processor is entered 20 bus clocks after the response phase of the processor-issued Stop Grant Acknowledge special bus cycle.
Since the AGTL+ signal pins receive power from the FSB, these pins should not be driven (allowing the level to return to V state. In addition, all other input pins on the FSB should be driven to the inactive state.
RESET# will cause the processor to immediately initialize itself, but the processor will stay in Stop-Grant state. A transition back to the Normal state will occur with the de-assertion of the STPCLK# signal. When re-entering the Stop-Grant state from the Sleep state, STPCLK# should be deasserted ten or more bus clocks after the de-assertion of SLP#.
A transition to the HALT/Grant Snoop state will occur when the processor detects a snoop on the FSB (see Section 2.1.3). A transition to the Sleep state (see Section 2.1.5) will occur with the assertion of the SLP# signal.
) for minimum power drawn by the termination resistors in this
CCP
While in the Stop-Grant State, SMI#, INIT# and LINT[1:0] will be latched by the processor, and only serviced when the processor returns to the Normal State. Only one occurrence of each event will be recognized upon return to the Normal state.
While in Stop-Grant state, the processor will process snoops on the FSB and it will latch interrupts delivered on the FSB.
The PBE# signal can be driven when the processor is in Stop-Grant state. PBE# will be asserted if there is any pending interrupt latched within the processor. Pending interrupts that are blocked by the EFLAGS.IF bit being clear will still cause assertion of PBE#. Assertion of PBE# indicates to system logic that it should return the processor to the Normal state.

2.1.4 HALT/Grant Snoop State

The processor responds to snoop or interrupt transactions on the FSB while in Stop-Grant state or in AutoHALT Power-Down state. During a snoop or interrupt transaction, the processor enters the HALT/Grant Snoop state. The processor will stay in this state until the snoop on the FSB has been serviced (whether by the processor or another agent on the FSB) or the interrupt has been latched. After the snoop is serviced or the interrupt is latched, the processor will return to the Stop-Grant state or AutoHALT Power-Down state, as appropriate.
12 Datasheet

2.1.5 Sleep State

A low power state in which the processor maintains its context, maintains the phase-locked loop (PLL), and has stopped all internal clocks. The Sleep state can be entered only from Stop-Grant state. Once in the Stop-Grant state, the processor will enter the Sleep state upon the assertion of the SLP# signal. The SLP# pin should only be asserted when the processor is in the Stop Grant state. SLP# assertions while the processor is not in the Stop-Grant state is out of specification and may result in unapproved operation.
Snoop events that occur while in Sleep State or during a transition into or out of Sleep state will cause unpredictable behavior.
In the Sleep state, the processor is incapable of responding to snoop transactions or latching interrupt signals. No transitions or assertions of signals (with the exception of SLP#, DPSLP# or RESET#) are allowed on the FSB while the processor is in Sleep state. Any transition on an input signal before the processor has returned to Stop-Grant state will result in unpredictable behavior.
If RESET# is driven active while the processor is in the Sleep state, and held active as specified in the RESET# pin specification, then the processor will reset itself, ignoring the transition through Stop-Grant State. If RESET# is driven active while the processor is in the Sleep State, the SLP# and STPCLK# signals should be deasserted immediately after RESET# is asserted to ensure the processor correctly executes the reset sequence.
Low Power Features
While in the Sleep state, the processor is capable of entering an even lower power state, the Deep Sleep state by asserting the DPSLP# pin. (See Section 2.1.6.) While the processor is in the Sleep state, the SLP# pin must be deasserted if another asynchronous FSB event needs to occur.

2.1.6 Deep Sleep State

Deep Sleep state is a very low power state the processor can enter while maintaining context. Deep Sleep state is entered by asserting the DPSLP# pin while in the Sleep state. BCLK may be stopped during the Deep Sleep state for additional platform level power savings.
BCLK stop/restart timings on 855PM and Intel 855GM chipset-based platforms are as follows:
• Deep Sleep entry - DPSLP# and CPU_STP# are asserted simultaneously. The platform clock
chip will stop/tristate BCLK within 2 BCLKs +/- a few nanoseconds.
• Deep Sleep exit - DPSLP# and CPU_STP# are deasserted simultaneously. The platform clock
chip will drive BCLK to differential DC levels within 2-3 ns and starts toggling BCLK 2-6 BCLK periods later.
To re-enter the Sleep state, the DPSLP# pin must be deasserted. BCLK can be restarted after DPSLP# deassertion, as described above. A period of 30 microseconds (to allow for PLL stabilization) must occur before the processor can be considered to be in the Sleep State. Once in the Sleep state, the SLP# pin must be deasserted to re-enter the Stop-Grant state.
While in Deep Sleep state, the processor is incapable of responding to snoop transactions or latching interrupt signals. No transitions of signals are allowed on the FSB while the processor is in Deep Sleep state. Any transition on an input signal before the processor has returned to Stop-Grant state will result in unpredictable behavior.
When the processor is in Deep Sleep state, it will not respond to interrupts or snoop transactions.
Datasheet 13
Low Power Features

2.1.7 Deeper Sleep State

The Deeper Sleep state is the lowest power state the processor can enter. This state is functionally identical to the Deep Sleep state but at a lower core voltage. The control signals to the voltage regulator to initiate a transition to the Deeper Sleep state are provided on the platform. Please refer to the platform design guides listed in Table 1-1.

2.2 Enhanced Intel SpeedStep® Technology

The Pentium M processor features Enhanced Intel SpeedStep technology. Unlike previous implementations of Intel SpeedStep technology, this technology enables the processor to switch between multiple frequency and voltage points instead of two. This will enable superior performance with optimal power savings. Switching between states is software controlled un like previous implementations where the GHI# pin is used to toggle between two states. Following are the key features of Enhanced Intel SpeedStep technology:
• Multiple voltage/frequency operating points provide optimal performance at the lowest power.
• Voltage/Frequency selection is software controlled by writing to processor MSR’s (Model
Specific Registers) thus eliminating chipset dependency.
— If the target frequency is higher than the current frequency, Vcc is ramped up by placing a
new value on the VID pins and the PLL then locks to the new frequency.
— If the target frequency is lower than the current frequency, the PLL locks to the new
frequency and the Vcc is changed through the VID pin mechanism.
— Software transitions are accepted at any time. If a previous transition is in progress, the
new transition is deferred until its completion.
• The processor controls voltage ramp rates internally to ensure glitch free transitions.
• Low transition latency and large number of transitions possible per second.
— Processor core (including L2 cache) is unavailable for up to 10 s during the frequency
transition
— The bus protocol (BNR# mechanism) is used to block snooping
• No bus master arbiter disable required prior to transition and no processor cache flush
necessary.
• Improved Intel
— When the on-die thermal sensor indicates that the die temperature is too high, the
processor can automatically perform a transition to a lower frequency/voltage specified in a software programmable MSR.
— The processor waits for a fixed time period. If the die temperature is down to acceptable
levels, an up transition to the previous frequency/voltage point occurs.
— An interrupt is generated for the up and down Intel Thermal Monitor transitions enabling
better system level thermal management.
®
Thermal Monitor mode.
14 Datasheet

2.3 Front Side Bus Low Power Enhancements

The Pentium M processor incorporates the following front side bus (processor system bus) low power enhancements:
• Dynamic FSB Power Down
• BPRI# control for address and control input buffers
• Dynamic On Die Termination disabling
• Low VCCP (I/O termination voltage)
The Pentium M processor incorporates the DPWR# signal that controls the data bus input buffers on the processor. The DPWR# signal disables the buffers when not used and activates them only when data bus activity occurs, resulting in significant power savings with no performance impact. BPRI# control also allows the processor address and control input buffers to be turned off when the BPRI# signal is inactive. The on-die termination on the processor FSB buffers is disabled when the signals are driven low, resulting in additional power savings. The low I/O termination voltage is on a dedicated voltage plane independent of the core voltage, enabling low I/O switching power at all times.

2.4 Processor Power Status Indicator (PSI#) Signal

Low Power Features
The Pentium M processor incorporates the PSI# signal that is asserted when the processor is in a low power (Deep Sleep or Deeper Sleep) state. This signal is asserted upon Deep Sleep entry and deasserted upon exit. PSI# can be used to improve the light load efficiency of the voltage regulator, resulting in platform power savings and ext ended battery life. PSI# can also be used to simplify voltage regulator designs since it removes the need for integrated 100 s timers required to mask the PWRGOOD signal during Deeper Sleep transitions. It also helps loosen PWRGOOD monitoring requirements in the Deeper Sleep state.
§
Datasheet 15
Low Power Features
16 Datasheet
Electrical Specifications

3 Electrical Specifications

3.1 Power and Ground Pins

For clean, on-chip power distribution, the Pentium M processor has a large number of VCC (power) and V must be connected to system ground planes. Use of multiple power and ground planes is recommended to reduce I*R drop. Please refer to the platform design guides for more details. The processor V

3.1.1 FSB Clock (BCLK[1:0]) and Processor Clocking

BCLK[1:0] directly controls the system bus interface speed as well as the core frequency of the processor. As in previous generation processors, the Pentium M processor core frequency is a multiple of the BCLK[1:0] frequency. In regards to processor clocking, the Pentium M processor uses a differential clocking implementation.
(ground) inputs. All power pins must be connected to V
SS
pins must be supplied the voltage determined by the VID (Voltage ID) pins.
CC
power planes while all VSS pins
CC

3.2 Voltage Identification

The Pentium M processor uses six voltage identification pins, VID[5:0], to support automatic selection of power supply voltages. The VID pins for the Pentium driven by the processor VID circuitry. Table 3-1 specifies the voltage level corresponding to the state of VID[5:0]. A “1” in this refers to a high-voltage level and a “0” refers to low-voltage level.
M processor are CMOS outputs
Datasheet 17
Electrical Specifications
Table 3-1. Voltage Identification Definition
VID VID
5 4 3 2 1 0
0 0 0 0 0 0 1.708 1 0 0 0 0 0 1.196 0 0 0 0 0 1 1.692 1 0 0 0 0 1 1.180 0 0 0 0 1 0 1.676 1 0 0 0 1 0 1.164 0 0 0 0 1 1 1.660 1 0 0 0 1 1 1.148 0 0 0 1 0 0 1.644 1 0 0 1 0 0 1.132 0 0 0 1 0 1 1.628 1 0 0 1 0 1 1.116 0 0 0 1 1 0 1.612 1 0 0 1 1 0 1.100 0 0 0 1 1 1 1.596 1 0 0 1 1 1 1.084 0 0 1 0 0 0 1.580 1 0 1 0 0 0 1.068 0 0 1 0 0 1 1.564 1 0 1 0 0 1 1.052 0 0 1 0 1 0 1.548 1 0 1 0 1 0 1.036 0 0 1 0 1 1 1.532 1 0 1 0 1 1 1.020 0 0 1 1 0 0 1.516 1 0 1 1 0 0 1.004 0 0 1 1 0 1 1.500 1 0 1 1 0 1 0.988 0 0 1 1 1 0 1.484 1 0 1 1 1 0 0.972 0 0 1 1 1 1 1.468 1 0 1 1 1 1 0.956 0 1 0 0 0 0 1.452 1 1 0 0 0 0 0.940 0 1 0 0 0 1 1.436 1 1 0 0 0 1 0.924 0 1 0 0 1 0 1.420 1 1 0 0 1 0 0.908 0 1 0 0 1 1 1.404 1 1 0 0 1 1 0.892 0 1 0 1 0 0 1.388 1 1 0 1 0 0 0.876 0 1 0 1 0 1 1.372 1 1 0 1 0 1 0.860 0 1 0 1 1 0 1.356 1 1 0 1 1 0 0.844 0 1 0 1 1 1 1.340 1 1 0 1 1 1 0.828 0 1 1 0 0 0 1.324 1 1 1 0 0 0 0.812 0 1 1 0 0 1 1.308 1 1 1 0 0 1 0.796 0 1 1 0 1 0 1.292 1 1 1 0 1 0 0.780 0 1 1 0 1 1 1.276 1 1 1 0 1 1 0.764 0 1 1 1 0 0 1.260 1 1 1 1 0 0 0.748 0 1 1 1 0 1 1.244 1 1 1 1 0 1 0.732 0 1 1 1 1 0 1.228 1 1 1 1 1 0 0.716 0 1 1 1 1 1 1.212 1 1 1 1 1 1 0.700
V
CC
V
5 4 3 2 1 0
V
CC
V

3.3 Catastrophic Thermal Protection

The Pentium M processor supports the THERMTRIP# signal for catastrophic thermal protection. An external thermal sensor should also be used to protect the processor and the system against excessive temperatures. Even with the activation of THERMTRIP#, which halts all processor internal clocks and activity, leakage current can be high enough such that the processor cannot be protected in all conditions without the removal of power to the processor. If the external thermal sensor detects a catastrophic processor temperature of 125 °C (maximum), or if the THERMTRIP# signal is asserted, the VCC supply to the processor must be turned off within 500 ms to prevent permanent silicon damage due to thermal runaway.
18 Datasheet

3.4 Signal Terminations and Unused Pins

All RSVD (RESERVED) pins must remain unconnected. Connection of these pins to VCC, VSS, or to any other signal (including each other) can result in component malfunction or incompatibility with future Pentium M processors. See Section 4.2 for a pin listing of the processor and the location of all RSVD pins.
For reliable operation, always connect unused inputs or bidirectional sign als to an appropriate signal level. Unused active low AG TL+ inputs may be left as no connects if AGTL+ termination is provided on the processor silicon. Unused active high inputs should be connected through a resistor to ground (V
For details on signal terminations, please refer to the platform design guides.
). Unused outputs can be left unconnected.
SS
Electrical Specifications
The TEST1 and TEST2 pins must have a stuffing option connection to V pull-down resistors.
separately via 1-k
SS

3.5 FSB Frequency Select Signals (BSEL[1:0])

These signals are used to select the FSB clock frequency. They should be connected between the processor and the chipset MCH and clock generator on Intel 915 Express chipset family based platforms. These signals must be left unconnected on platforms designed with the Intel 855 chipset family. On these platforms, FSB clock frequency should be configured on the motherboard.

3.6 FSB Signal Groups

In order to simplify the following discussion, the FSB signals have been combined in to groups by buffer type. AG TL+ input signals have differential input buffers, which use GTLREF as a reference level. In this document, the term "AGTL+ Input" refers to the AGTL+ input grou p as well as the AGTL+ I/O group when receiving. Similarly, "AGTL+ Output" refers to the AGTL+ output group as well as the AGTL+ I/O group when driving.
With the implementation of a source synchronous data bus comes the need to specify two sets of timing parameters. One set is for common clock signals which are dependant upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second set is for the source synchronous signals which are relative to their respective strobe lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are still present (A20M#, IGNNE#, etc.) and can become active at any time during the clock cycle. Table 3-2 identifies which signals are common clock, source synchronous, and asynchronous.
Datasheet 19
Electrical Specifications
Table 3-2. FSB Pin Groups
Signal Group Type Signals
1
AGTL+ Common Clock Input Synchronous
to BCLK[1:0]
AGTL+ Common Clock I/O Synchronous
to BCLK[1:0]
AGTL+ Source Synchronous I/O Synchronous
to assoc. strobe
AGTL+ Strobes Synchronous
to BCLK[1:0]
CMOS Input Asynchronous A20M#, DPSLP#, IGNNE#, INIT#, LINT0/INTR, LINT1/
Open Drain Output Asynchronous FERR#, IERR#, PROCHOT#, THERMTRIP# CMOS Output Asynchronous PSI#, VID[5:0], BSEL[1:0] CMOS Input Synchronous
to TCK
Open Drain Output Synchronous
to TCK FSB Clock Clock BCLK[1:0], ITP_CLK[1:0] Power/Other COMP[3:0], DBR#2, GTLREF, RSVD, TEST2, TEST1,
BPRI#, DEFER#, DPWR#, PREQ#, RESET#, RS[2:0]#, TRDY#
ADS#, BNR#, BPM[3:0]#, BR0#, DBSY#, DRDY#, HIT#, HITM#, LOCK#, PRDY#
Signals Associated Strobe
REQ[4:0]#, A[16:3]# ADSTB[0]# A[31:17]# ADSTB[1]# D[15:0]#, DINV0# DSTBP0#, DSTBN0# D[31:16]#, DINV1# DSTBP1#, DSTBN1# D[47:32]#, DINV2# DSTBP2#, DSTBN2# D[63:48]#, DINV3# DSTBP3#, DSTBN3#
ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#
NMI, PWRGOOD, SMI#, SLP#, STPCLK#
TCK, TDI, TMS, TRST#
TDO
2
THERMDA, THERMDC, V V
CC_SENSE
, V
SS, VSS_SENSE
, V
[3:0], V
CC
CCA
CCP, VCCQ
[1:0],
NOTES:
1. Refer to Chapter 4 for signal descriptions and termination requirements.
2. BPM[2:0}# and PRDY# are AGTL+ output only signals.
3. In processor systems where there is no debug port implemented on the system board, these signals are used to support a debug port interposer. In systems with the debug port implemented on the system board, these signals are no connects.

3.7 CMOS Signals

CMOS input signals are shown in Table 3-2. Legacy output FERR#, IERR# and other non-AGTL+ signals (THERMTRIP# and PROCHOT#) utilize Open Drain output buffers. These signals do not have setup or hold time specifications in relation to BCLK[1:0]. However, all of the CMOS signals are required to be asserted for at least three BCLKs in order for the processor to recognize them. See Section 3.9 for the DC and AC specifications for the CMOS signal groups.
20 Datasheet

3.8 Maximum Ratings

Table 3-3 lists the processor’s maximum environmental stress ratings. The processor should not
receive a clock while subjected to these conditions. Functional operating parameters are listed in the AC and DC tables. Extended exposure to the maximum ratings may affect device reliability. Furthermore, although the processor contains protective circuitry to resist damage from electro static discharge (ESD), one should always take precautions to avoid high static voltages or electric fields.
Table 3-3. Processor DC Absolute Maximum Ratings
Symbol Parameter Min Max Unit Notes
T
STORAGE Processor storage
V
CC
V
inAGTL+
V
inAsynch_CMOS
temperature Any processor supply
voltage with respect to V AGTL+ buffer DC input
voltage with respect to V CMOS buffer DC input
voltage with respect to V
SS
SS
SS
Electrical Specifications
-40 85 °C 2
-0.3 1.6 V 1
-0.1 1.6 V 1, 2
-0.1 1.6 V 1, 2
NOTES:
1. This rating applies to any processor pin.
2. Contact Intel for storage requirements in excess of one year.

3.9 Processor DC Specifications

The processor DC specifications in this section are defined at the process or core (pads) unless noted otherwise. See Table 4-3 for the pin signal definitions and signal pin assignments. The DC
specifications for these signals are listed in Table 3-24 and Table 3-25.
Table 3-4 through Table 3-25 list the DC specifications for the Pentium
only while meeting specifications for junction temp erature, clock frequency, and input voltages. The Highest Frequency mode (HFM) and Lowest Frequency mode (LFM) refer to the highest and lowest core operating frequencies supported on the processor. Active mode load line s pecifications apply in all states except in the Deep Sleep and Deeper Sleep states. V voltage driven by the voltage regulator at power up in order to set the VID values. Unless specified otherwise, all specifications for the Pentium M processor are at Tjunction = 100° C. Care should be taken to read all notes associated with each parameter.
M processor and are valid
CC,BOOT
is the default
Datasheet 21
Electrical Specifications
Table 3-4. Voltage and Current Specifications - Standard Voltage Processors (Sheet 1 of 2)
Symbol Parameter
V
CCD765
Intel® Pentium® M Processor
765 Core V
Intel SpeedS tep
CC FOR
Operating Points:
2.1 GHz 1.340 1.324 1.308 1.356
1.8 GHz 1.276 1.260 1.244 1.292
1.6 GHz 1.228 1.212 1.212 1.244
1.4 GHz 1.180 1.180 1.164 1.196
1.2 GHz 1.132 1.132 1.116 1.148
1.0 GHz 1.084 1.084 1.084 1.100 800 MHz 1.036 1.036 1.036 1.052 600 MHz 0.988 0.988 0.988 0.988
V
CCD755
Pentium M Processor 755
Core V
for Enhanced Intel
CC
SpeedStep Technology
Operating Points:
2.0 GHz 1.340 1.324 1.308 1.276
1.8 GHz 1.292 1.276 1.276 1.244
1.6 GHz 1.244 1.228 1.228 1.196
1.4 GHz 1.196 1.180 1.180 1.164
1.2 GHz 1.148 1.132 1.132 1.116
1.0 GHz 1.100 1.084 1.084 1.084 800 MHz 1.052 1.036 1.036 1.036 600 MHz 0.988 0.988 0.988 0.988
V
CCD745
Pentium M Processor 745
Core V
for Enhanced Intel
CC
SpeedStep Technology
Operating Points:
1.8 GHz 1.340 1.324 1.308 1.276
1.6 GHz 1.292 1.276 1.260 1.228
1.4 GHz 1.228 1.212 1.212 1.180
1.2 GHz 1.164 1.164 1.148 1.132
1.0 GHz 1.116 1.100 1.100 1.084 800 MHz 1.052 1.052 1.052 1.036 600 MHz 0.988 0.988 0.988 0.988
Enhanced
®
T echnology
VID#A
Typical
VID#B
Typical
VID#C
Typical
VID#D
Typical
VID#E
Typical
Unit Notes
V1, 2
V1, 2
V1, 2
22 Datasheet
Electrical Specifications
Table 3-4. Voltage and Current Specifications - Standard Voltage Processors (Sheet 2 of 2)
Symbol Parameter
V
CCD735
Pentium M Processor 735
Core V
for Enhanced Intel
CC
SpeedStep Technology
Operating Points:
1.7 GHz 1.340 1.324 1.308 1.276
1.4 GHz 1.244 1.244 1.228 1.212
1.2 GHz 1.180 1.180 1.164 1.148
1.0 GHz 1.116 1.116 1.116 1.100 800 MHz 1.052 1.052 1.052 1.052 600 MHz 0.988 0.988 0.988 0.988
V
CCD725
Pentium M Processor 725
Core V
for Enhanced Intel
CC
SpeedStep Technology
Operating Points:
1.6 GHz 1.340 1.324 1.308 1.276
1.4 GHz 1.276 1.260 1.244 1.228
1.2 GHz 1.212 1.196 1.180 1.164
1.0 GHz 1.132 1.132 1.116 1.116 800 MHz 1.068 1.068 1.052 1.052 600 MHz 0.988 0.988 0.988 0.988
V
CCD715
Pentium M Processor 715
Core V
for Enhanced Intel
CC
SpeedStep Technology
Operating Points:
1.5 GHz 1.340 1.324 1.308 1.276
1.2 GHz 1.228 1.212 1.212 1.180
1.0 GHz 1.148 1.148 1.132 1.116 800 MHz 1.068 1.068 1.068 1.052 600 MHz 0.988 0.988 0.988 0.988
VID#A
Typical
VID#B
Typical
VID#C
Typical
VID#D
Typical
VID#E
Typical
Unit Notes
V1, 2
V1, 2
V1, 2
NOTES:
1. The typical values shown are the VID encoded voltages. Static and ripple tolerances (for minimum and maximum voltages) are defined in the load line tables, Table 3-8 through Table 3-21. Adherence to loadline specifications for the Pentium M processor is required to ensure reliable processor operation.
2. The voltage specifications are assumed to be measured at a via on the motherboard’s opposite side of the processor’s socket (or BGA) ball with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
Datasheet 23
Electrical Specifications
Table 3-5. Voltage and Current Specifications - Low Voltage Processors (Sheet 1 of 2)
Symbol Parameter Min Typ Max Unit Note
V
CCD778
V
CCD758
Intel® Pentium® M
Processor, Low Voltage
778 Core VCC for
Enhanced Intel
SpeedStep
Pentium M Processor,
SpeedStep Technology
®
Operating Points:
758 Core VCC for
Operating Points:
Technology
1.6 GHz 1.116
1.5 GHz 1.116
1.4 GHz 1.100
1.3 GHz 1.084
1.2 GHz 1.068
1.1 GHz 1.052
1.0 GHz 1.052
900 GHz 1.036 800 MHz 1.020 600 MHz 0.988
Low Voltage,
Enhanced Intel
1.5 GHz 1.116
1.4 GHz 1.116
1.3 GHz 1.100
1.2 GHz 1.084
1.1 GHz 1.068
1.0 GHz 1.052
900 GHz 1.036 800 MHz 1.020 600 MHz 0.988
V1, 2
V1, 2
24 Datasheet
Electrical Specifications
Table 3-5. Voltage and Current Specifications - Low Voltage Processors (Sheet 2 of 2)
Symbol Parameter Min Typ Max Unit Note
V
CCD738
NOTES:
1. The typical values shown are the VID encoded voltages. Static and ripple tolerances (for minimum and maximum voltages) are defined in the load line tables, Table 3-8 through Table 3-21. Adherence to loadline specifications for the Pentium M processor is required to ensure reliable processor operation.
2. The voltage specifications are assumed to be measured at a via on the motherboard’s opposite side of the processor’s socket (or BGA) ball with a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-M minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled in the scope probe.
Pentium M Processor,
Low Voltage,
738 Core VCC for
Enhanced Intel
SpeedStep Technology
Operating Points:
1.4 GHz 1.116
1.3 GHz 1.116
1.2 GHz 1.100
1.1 GHz 1.068
1.0 GHz 1.052 900 GHz 1.036 800 MHz 1.020 600 MHz 0.988
V1, 2
Datasheet 25
Electrical Specifications
Table 3-6. Voltage and Current Specifications - Ultra Low Voltage Processors (Sheet 1 of 2)
VID#
VID#
Symbol Parameter Min Typ Max
GTyp
HTyp
VID#I
Typ
VID#
J Typ
VID#
K Typ
VID#
L Typ
Unit Note
V
CCD773
V
CCD753
V
CCD733J
Intel® Pentium® M
Processor, Ultra Low
Voltage,
773 Core VCC for
Enhanced Intel
SpeedStep
®
T echnology Operating
Points:
1.3 GHz 0.956 0.940 0.924 0.908 0.892 0.876
1.2 GHz 0.940 0.924 0.908 0.908 0.892 0.876
1.1 GHz 0.924 0.908 0.892 0.892 0.876 0.860
1.0 GHz 0.908 0.892 0.876 0.876 0.860 0.860 900 MHz 0.876 0.876 0.860 0.860 0.860 0.844 800 MHz 0.860 0.860 0.844 0.844 0.844 0.844 600 MHz 0.812 0.812 0.812 0.812 0.812 0.812
Pentium M Processor,
Ultra Low Voltage, 753 Core VCC for
Enhanced Intel
SpeedStep
T echnology Operating
Points:
1.2 GHz 0.956 0.940 0.924 0.908 0.892 0.876
1.1 GHz 0.940 0.924 0.908 0.892 0.892 0.876
1.0 GHz 0.908 0.908 0.892 0.876 0.876 0.860 900 MHz 0.892 0.876 0.876 0.860 0.860 0.844 800 MHz 0.860 0.860 0.860 0.844 0.844 0.844 600 MHz 0.812 0.812 0.812 0.812 0.812 0.812
Pentium M Processor,
Ultra Low Voltage,
733J Core VCC for
Enhanced Intel
SpeedStep
T echnology operating
points:
1.1 GHz 0.956 0.940 0.924 0.908 0.892 0.876
1.0 GHz 0.940 0.924 0.908 0.892 0.876 0.876 900 MHz 0.908 0.892 0.892 0.876 0.860 0.860 800 MHz 0.876 0.876 0.860 0.860 0.844 0.844 600 MHz 0.812 0.812 0.812 0.812 0.812 0.812
V2, 3
V2, 3
V2, 3, 4
26 Datasheet
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