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CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160
1.0Introduction
1.1Document Goals and Scope
1.1.1Importance of Thermal Management
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within their functional temperature range.
Within this range, a component is expected to meet its specified performance level.
Operation outside the functional temperature range can degrade system performance,
cause logic errors or cause component and/or system damage. Temperatures
exceeding the maximum operating limit of a component may result in irreversible
changes in the operating characteristics of this component.
In a system environment, the processor temperature is a function of both system and
component thermal characteristics. The system level thermal constraints consist of the
local ambient air temperature and airflow over the processor as well as the physical
constraints at and above the processor. The processor temperature depends on the
component power dissipation, the processor package thermal characteristics and the
processor thermal solution.
All of these parameters are affected by the continued push of technology to increase
processor performance levels and packaging density (more transistors). As operating
frequencies increase and packaging size decreases, the power density increases while
the thermal solution space and airflow typically become more constrained or remains
the same within the system. The result is an increased importance on system design to
ensure that thermal design requirements are met for each component, including the
processor, in the system.
1.1.2Document Goals
Depending on the type of system and the chassis characteristics, new system and
component designs may be required to provide adequate cooling for the processor. The
goal of this document is to provide an understanding of these thermal characteristics
and discuss guidelines for meeting the thermal requirements imposed on single
processor systems using the Intel
Dual-Core E2160 Processor.
The concepts given in this document are applicable to any system form factor. Specific
examples used will be the Intel enabled reference solution for PICMG 1.3 server
systems. Please refer to the applicable ATX and BTX form factor reference documents
and thermal design guidelines to design a thermal solution for those form factors.
1.1.3Document Scope
In this document, when a reference is made to "the processor", it is intended that this
includes all the processors described and supported in this document. If needed for
clarity, the specific processor will be listed.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium®
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—
Introduction
This design guide supports the following processors:
®
•Intel
•Intel
CoreTM 2 Duo E6400 Processor for Embedded Applications
®
CoreTM 2 Duo E4300 Processor for Embedded Applications
• Intel® Pentium® Dual-Core E2160 Processor for Embedded Applications
In this document, when a reference is made to "the datasheet", the reader should refer
to the Intel® Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop
Processor E6000 and E4000 Sequences Datasheet and Intel® Pentium® Dual-Core
Processor E2000 Sequence Datasheet. For more information on a specific processor,
reference the specific processor datasheet.
Section 2.0 of this document discusses package thermal mechanical requirements to
design a thermal solution for the processor in the context of personal computer
applications.
Section 2.0 discusses the thermal solution considerations and metrology
recommendations to validate a processor thermal solution.
Section 4.0 addresses the benefits of the processor's integrated thermal management
logic for thermal design.
Section 5.0 gives information on the Intel reference thermal solution for the processor.
Section 6.0 discusses the implementation of Intel Quiet System Technology (Intel®
QST).
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the datasheet for the product
dimensions, thermal power dissipation and maximum case temperature. In case of
conflict, the data in the datasheet supersedes any data in this document.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
The measured ambient temperature locally surrounding the processor. The ambient
T
A
T
C
T
E
T
S
T
C-MAX
Ψ
CA
Ψ
CS
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temperature should be measured just upstream of a passive heatsink or at the fan inlet for
an active heatsink. Also referred to as T
.
LA
The case temperature of the processor, measured at the geometric center of the topside of
the IHS.
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets. Also referred to as T
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to T
.
C
EXT
.
The maximum case temperature as specified in a component specification.
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
Note: Heat source must be specified for Ψ measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (T
referred to as Ψ
TIM
.
- TA) / Total Package Power.
C
- TS) / Total Package Power. Also
C
Note: Heat source must be specified for Ψ measurements.
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—
Table 2.Terms Used (Sheet 2 of 2)
TermDescription
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
Ψ
SA
TIM
P
MAX
TDP
IHS
LGA775 Socket
ACPIAdvanced Configuration and Power Interface.
Bypass
Thermal Monitor
TCC
T
DIODE
FSC
T
CONTROL
PWM
Health Monitor
Component
TMA
performance using total package power. Defined as (T
Note: Heat source must be specified for Ψ measurements.
Thermal Interface Material: The thermally conductive compound between the heatsink and
the processor case. This material fills the air g aps and vo ids, and enhances the tr ansfer of
the heat from the processor case to the heatsink.
The maximum power dissipated by a semiconductor component.
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
Integrated Heat Spreader: a thermally conductive lid integrated into a processor package
to improve heat transfer to a thermal solution through heat spreading.
The surface mount socket designed to accept the processors in the 775-Land LGA
package.
Bypass is the area between a passive heatsink and an y object that can act to form a duct.
For this example, it can be expressed as a dimension away from the outside dimension of
the fins to the nearest surface.
A feature on the processor that attempts to keep the processor die temperature within
factory specifications.
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the d i e temperature has exceeded its
operating limits.
Temperature reported from the on-die thermal diode.
Fan Speed Control: Thermal solution that includes a variable fan speed which is driven by
a PWM signal and uses the on-die thermal diode as a reference to change the du ty cycle of
the PWM signal.
T
is the specification limit for use with the on-die thermal diode.
CONTROL
Pulse width modulation is a method of controlling a variable speed fan. The enabled 4 wire
fans use the PWM duty cycle percent from the fan speed controller to modulate the fan
speed.
Any standalone or integrated component that is capable of reading the processor
temperature and providing the PWM signal to the 4 pin fan header.
Thermal Module Assembly. The heatsink, fan and duct assembly for the BTX thermal
solution.
Introduction
- TA) / Total Package Power.
S
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
The processor is packaged in a 775-Land LGA package that interfaces with the
motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical
specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center of
the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in Figure 1.
Refer to the processor datasheet for more information. In case of conflict, the package
dimensions in the processor datasheet supersedes dimensions provided in this
document.
Figure 1.Package IHS Load Areas
Top Surface ofIHS
Substrate
Substrate
Top Surface of IHS
to install a heatsink
to install a he atsink
IHS Step
IH S St ep
to interface with LGA775
to in te rface with LGA775
Socket LoadPlate
Socket Load Plate
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Thermal/Mechanical Information
The primary function of the IHS is to transfer the non-uniform heat distribution from
the die to the top of the IHS, out of which the heat flux is more uniform and spread
over a larger surface area (not the entire IHS area). This allows more efficient heat
transfer out of the package to an attached cooling device. The top surface of the IHS is
designed to be the interface for contacting a heatsink.
The IHS also features a step that interfaces with the LGA775 socket load plate, as
described in the LGA775 Socket Mechanical Design Guide. The load from the load plate
is distributed across two sides of the package onto a step on each side of the IHS. It is
then distributed by the package across all of the contacts. When correctly actuated, the
top surface of the IHS is above the load plate allowing proper installation of a heatsink
on the top surface of the IHS. After actuation of the socket load plate, the seating plane
of the package is flush with the seating plane of the socket. Package movement during
socket actuation is along the Z-direction (perpendicular to substrate) only. Refer to the
LGA775 Socket Mechanical Design Guide for more information about the LGA775
socket.
The processor package has mechanical load limits that are specified in the processor
datasheet. The specified maximum static and dynamic load limits should not be
exceeded during their respective stress conditions. These include heatsink installation,
removal, mechanical stress testing and standard shipping conditions.
• When a compressive static load is necessary to ensure thermal performance of the
thermal interface material between the heatsink base and the IHS, it should not
exceed the corresponding specification given in the processor datasheet.
• When a compressive static load is necessary to ensure mechanical performance, it
should remain in the minimum/maximum range specified in the processor
datasheet.
• The heatsink mass can also generate additional dynamic compressive load to the
package during a mechanical shock event. Amplification factors due to the impact
force during shock must be taken into account in dynamic load calculations. The
total combination of dynamic and static compressive load should not exceed the
processor datasheet compressive dynamic load specification during a vertical
shock.
For example, with a 0.550 kg [1.2 lb] heatsink, an acceleration of 50G during an 11
ms trapezoidal shock with an amplification factor of 2 results in approximately a
539 N [117 lbf] dynamic load on the processor package. If a 178 N [40 lbf] static
load is also applied on the heatsink for thermal performance of the thermal
interface material, the processor package could see up to a 717 N [156 lbf]. The
calculation for the thermal solution of interest should be compared to the processor
datasheet specification.
No portion of the substrate should be used as a load- bearing surface.
Finally, the processor datasheet provides package handling guidelines in terms of
maximum recommended shear, tensile and torque loads for the processor IHS relative
to a fixed substrate. These recommendations should be followed in particular for
heatsink removal operations.
2.1.2Heatsink Attach
2.1.2.1General Guidelines
There are no features on the LGA775 socket to directly attach a heatsink. A mechanism
must be designed to attach the heatsink directly to the motherboard. In addition to
holding the heatsink in place on top of the IHS, this mechanism plays a significant role
in the robustness of the system in which it is implemented, in particular:
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
• Ensuring thermal performance of the thermal interface material (TIM) applied
between the IHS and the heatsink. TIMs based on phase change materials are very
sensitive to applied pressure: the higher the pressure, the better the initial
performance. TIMs, such as thermal greases, are not as sensitive to applied
pressure. Designs should consider a possible decrease in applied pressure over
time due to potential structural relaxation in retention components.
• Ensuring system electrical, thermal and structural integrity under shock and
vibration events. The mechanical requirements of the heatsink attach mechanism
depend on the mass of the heatsink and the level of shock and vibration that the
system must support. The overall structural design of the motherboard and the
system have to be considered when designing the heatsink attach mechanism.
Their design should provide a means for protecting LGA775 socket solder joints.
One of the strategies for mechanical protection of the socket is to use a preload and
high stiffness clip. This strategy is implemented by the reference design and
described in this document.
Note:Package pull-out during mechanical shock and vibration is constrained by the LGA775
socket load plate (refer to the LGA775 Socket Mechanical Design Guide for more
information).
2.1.2.2Heatsink Clip Load Requirement
The attach mechanism for the heatsink developed to support the processor should
create a static preload on the package between 18 lbf and 70 lbf throughout the life of
the product for designs compliant with the Intel reference design assumption:
• 72 mm x 72 mm mounting hole span (refer to Figure 20)
The minimum load is required to protect against fatigue failure of socket solder joint in
temperature cycling.
It is important to take into account potential load degradation from creep over time
when designing the clip and fastener to the required minimum load. This means that,
depending on clip stiffness, the initial preload at beginning of life of the product may be
significantly higher than the minimum preload that must be met throughout the life of
the product. For additional guidelines on mechanical design, in particular on designs
departing from the reference design assumptions, refer to Appendix A.
For information on Clip loading, refer to the Intel® Core™2 Duo Desktop Processor
E6000? Sequence Thermal and Mechanical Design Guidelines Supporting the Intel®
Core™2 Duo desktop processor E6000 Sequence.
2.1.2.3Additional Guidelines
In addition to the general guidelines given above, the heatsink attach mechanism for
the processor should be designed to the following guidelines:
• Holds the heatsink in place under mechanical shock and vibration events and
applies force to the heatsink base to maintain desired pressure on the thermal
interface material. Note that the load applied by the heatsink attach mechanism
must comply with the package specifications described in the processor datasheet.
One of the key design parameters is the height of the top surface of the processor
IHS above the motherboard. The IHS height from the top of board is expected to
vary from 7.517 mm to 8.167 mm. This data is provided for information only, and
should be derived from:
— The height of the socket seating plane above the motherboard after reflow,
given in the LGA775 Socket Mechanical Design Guide with its tolerances.
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— The height of the package, from the package seating plane to the top of the
IHS, and accounting for its nominal variation and tolerances that are given in
the corresponding processor datasheet.
• Engages easily, and if possible, without the use of special tools. In general, the
heatsink is assumed to be installed after the motherboard has been installed into
the chassis.
• Minimizes contact with the motherboard surface during installation and actuation to
avoid scratching the motherboard.
2.2Thermal Requirements
Refer to the datasheet for the processor thermal specifications. The majority of
processor power is dissipated through the IHS. There are no additional components,
e.g., BSRAMs, which generate heat on this package. The amount of power that can be
dissipated as heat through the processor package substrate and into the socket is
usually minimal.
Thermal/Mechanical Information
The thermal limits for the processor are the Thermal Profile and T
Profile defines the maximum case temperature as a function of power being dissipated.
T
die thermal diode and a fan speed control method. Designing to these specifications
is a specification used in conjunction with the temperature reported by the on-
CONTROL
. The Thermal
CONTROL
allows optimization of thermal designs for processor performance and acoustic noise
reduction.
2.2.1Processor Case Temperature
For the processor, the case temperature is defined as the temperature measured at the
geometric center of the package on the surface of the IHS. For illustration, Figure 2
shows the measurement location for a 37.5 mm x 37.5 mm [1.474 in x 1.474 in] 775Land LGA processor package with a 28.7 mm x 28.7 mm [1.13 in x 1.13 in] IHS top
surface. Techniques for measuring the case temperature are detailed in Section 3.4.
Note:In case of conflict, the package dimensions in the processor datasheet supersedes
dimensions provided in this document.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Figure 2.Processor Case Temperature Measurement Location
37.5 mm
37.5 mm
2.2.2Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. The TDP and Maximum Case Temperature are defined as the
maximum values of the thermal profile. By design, the thermal solutions must meet the
thermal profile for all system operating conditions and processor power levels.
37.5 mm
37.5 mm
Meas ure TCat this point
Meas ure TCat this point
(geometric center of the package)
(geometric center of the package)
The slope of the thermal profile was established assuming a generational improvement
in thermal solution performance of about 15% over the previous Intel reference design,
less than the Intel RCBFH-3 reference design and about 28% less than the BTX Type II
reference design. Refer to the Intel® Pentium® 4 Processor on 90 nm Process in the
775-Land LGA Package Thermal and Mechanical Design Guidelines, available on
www.intel.com for details on the RCBFH-3 thermal solution.
This performance is expressed as the slope on the thermal profile and can be thought
of as the thermal resistance of the heatsink attached to the processor, Ψ
Section 3.1). The intercept on the thermal profile assumes a maximum ambient
(Refer to
CA
operating condition that is consistent with the available chassis solutions.
T o determine compliance to the thermal profile, a measurement of the actual processor
power dissipation is required. The measured power is plotted on the Thermal Profile to
determine the maximum case temperature. Using the examp l e in Figure 3 for a
processor dissipating 70W, the maximum case temperature is 61°C. Refer to the
datasheet for the thermal profile.
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e
Figure 3.Example Thermal Profile
75
70
65
60
Thermal/Mechanical Information
Heatsink
Desi gn P o in t
2.2.3T
CONTROL
T
CONTROL
when the thermal solution fan speed is being controlled by the digital thermal sensor.
The T
speed can be reduced. This allows the system integrator a method to reduce the
acoustic noise of the processor cooling solution, while maintaining compliance to the
processor thermal specification.
Note:The T
Dual-Core E2160 processor is relative to the Thermal Control Circuit (TCC) activation
set point which will be seen as 0 (zero) when using the digital thermal sensor. As a
result, the T
discussion on thermal management logic and features and Chapter 6.0 on Intel® Quiet
System Technology (Intel® QST).
55
50
45
Case Temperature (C)
40
35
30
30405060708090100110
Watts
Thermal Profil
TDP
defines the maximum operating temperature for the digital thermal sensor
parameter defines a very specific processor operating region where fan
CONTROL
value for Intel® Core™2 Duo desktop E6400,E4300, and Intel® Pentium®
CONTROL
value will always be a negative number. Refer to Chapter 4.0 for a
CONTROL
The value of T
these is the processor idle power. As a result, a processor with a high T
CONTROL
dissipate more power than a part with lower value of T
application.
The value of T
T
parts is offset by a higher value of T
value, the thermal solution should perform similarly. The higher power of some
CONTROL
CONTROL
virtually the same acoustically. This is achieved in part by using the Ψ
RPM versus acoustics (dBA) performance curves from the Intel enabled thermal
solution. A thermal solution designed to meet the thermal profile should have similar
acoustic performance for any value of T
The value for T
factory configured processor register. The result can be used to program a fan speed
CONTROL
control component. Refer to the appropriate datasheet for more details on reading the
register and calculating T
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Refer to Chapter 6.0, Intel® Quiet System Technology (Intel® QST), for details on
implementing a design using T
and the Thermal Profile.
CONTROL
2.3Heatsink Design Considerations
To remove the heat from the processor, three basic parameters should be considered:
• The surface area on which the heat transfer takes place. Without any
enhancements, this is the surface of the proce ssor pack age IHS. One method us ed
to improve thermal performance is by attaching a heatsink to the IHS. A heatsink
can increase the effective heat transfer surface area by conducting heat out of the
IHS and into the surrounding air through fins attached to the heatsink base.
• The conduction path from the heat source to the heatsink fins. Providing a direct
conduction path from the heat source to the heatsink fins and selecting materials
with higher thermal conductivity typically improves heatsink performance. The
length, thickness, and conductivity of the conduction path from the heat source to
the fins directly impact the thermal performance of the heatsink. In particular, the
quality of the contact between the package IHS and the heatsink base has a higher
impact on the overall thermal solution performance as processor cooling
requirements become stricter. Thermal interface material (TIM) is used to fill in the
gap between the IHS and the bottom surface of the heatsink, and thereby, improve
the overall performance of the stack-up (IHS-TIM-Heatsink). With extremely poor
heatsink interface flatness or roughness, TIM may not adequately fill the gap. The
TIM thermal performance depends on its thermal conductivity as well as the
pressure applied to it. Refer to Section 2.3.4 and Appendix B for more information
on TIM and on bond line management between the IHS and the heatsink base.
• The heat transfer conditions on the surface on which heat transfer takes place.
Convective heat transfer occurs between the airflow and the surface exposed to the
flow. It is characterized by the local ambient temperature of the air, TA and the
local air velocity over the surface. The higher the air velocity over the surface, and
the cooler the air, the more efficient is the resulting cooling. The nature of the
airflow can also enhance heat transfer via convection. Turbulent flow can provide
improvement over laminar flow. In the case of a heatsink, the surface exposed to
the flow includes in particular the fin faces and the heatsink base.
Active heatsinks typically incorporate a fan that helps manage the airflow through the
heatsink.
Passive heatsink solutions require in-depth knowledge of the airflow in the chassis.
T ypically, passive heatsinks see lower air speed. These heatsinks are therefore typically
larger (and heavier) than active heatsinks due to the increase in fin surface required to
meet a required performance. As the heatsink fin density (the number of fins in a given
cross-section) increases, the resistance to the airflow increases, and it is more likely
that the air travels around the heatsink instead of through it, unless air bypass is
carefully managed. Using air-ducting techniques to manage the bypass area can be an
effective method for controlling airflow through the heatsink.
2.3.1Heatsink Size
The size of the heatsink is dictated by height restrictions for installation in a system and
by the real estate available on the motherboard and other considerations for
component height and placement in the area potentially impacted by the processor
heatsink. The height of the heatsink must comply with the requirements and
recommendations published for the motherboard form factor of interest. Designing a
heatsink to the recommendations may preclude using it in system adhering strictly to
the form factor requirements, while still in compliance with the form factor
documentation.
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For the PICMG 1.3 server form factor, it is recommended to use:
• The PICMG 1.3 motherboard keep-out footprint definition and height restrictions for
enabling components, defined for the platforms designed with the LGA775 socket
in Appendix E of this design guide.
• The motherboard primary side height constraints are located at http://picmg.org/
specifications.stm.
The resulting space available above the motherboard is generally not entirely available
for the heatsink. The target height of the heatsink must take into account airflow
considerations (for fan performance for example) as well as other design considerations
(air duct, etc.).
2.3.2Heatsink Mass
With the need to push air cooling to better performance, heatsink solutions tend to
grow larger (increase in fin surface) resulting in increased mass. The insertion of highly
thermally conductive materials like copper to increase heatsink thermal conduction
performance results in even heavier solutions. As mentioned in Section 2.1, the
heatsink mass must take into consideration the package and socket load limits, the
heatsink attach mechanical capabilities and the mechanical shock and vibration profile
targets. Beyond a certain heatsink mass, the cost of developing and implementing a
heatsink attach mechanism that can ensure the system integrity under the mechanical
shock and vibration profile targets may become prohibitive.
Thermal/Mechanical Information
2.3.3Package IHS Flatness
The package IHS flatness for the product is specified in the datasheet and can be used
as a baseline to predict heatsink performance during the design phase.
Intel recommends testing and validating heatsink performance in full mechanical
enabling configuration to capture any impact of IHS flatness change due to combined
socket and heatsink loading. While socket loading alone may increase the IHS warpage,
the heatsink preload redistributes the load on the package and improves the resulting
IHS flatness in the enabled state.
2.3.4Thermal Interface Material
Thermal interface material application between the processor IHS and the heatsink
base is required to improve thermal conduction from the IHS to the heatsink. Many
thermal interface materials can be pre-applied to the heatsink base prior to shipment
from the heatsink supplier and allow direct heatsink attach, without the need for a
separate thermal interface material dispense or attach process in the final assembly
factory.
All thermal interface materials should be sized and positioned on the heatsink base in a
way that ensures the entire processor IHS area is covered. It is important to
compensate for heatsink-to-processor attach positional alignment when selecting the
proper thermal interface material size.
When pre-applied material is used, it is recommended to have a protective application
tape over it. This tape must be removed prior to heatsink installation.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
The Intel reference thermal solution for PICMG 1.3 chassis assumes that the chassis
delivers a maximum TA of 38-40°C with 15-25 CFM of airflow at the inlet of the
processor heatsink.
2.4.2Improving Chassis Thermal Performance
The heat generated by components within the chassis must be removed to provide an
adequate operating environment for both the processor and other system components.
Moving air through the chassis brings in air from the external ambient environment and
transports the heat generated by the processor and other system components out of
the system. The number, size and relative position of fans and vents determine the
chassis thermal performance, and the resulting ambient temperature around the
processor. The size and type (passive or active) of the thermal solution and the amount
of system airflow can be traded off against each other to meet specific system design
constraints. Additional constraints are board layout, spacing, component placement,
acoustic requirements and structural considerations that limit the thermal solution size.
For more information, refer to the Thin Electronics Bay specification at the following
web site: www.ssiforum.org.
In addition to passive heatsinks, fan heatsinks and system fans are other solutions that
exist for cooling integrated circuit devices. For example, ducted blowers, heat pipes and
liquid cooling are all capable of dissipating additional heat. Due to their varying
attributes, each of these solutions may be appropriate for a particular system
implementation.
To develop a reliable, cost-effective thermal solution, thermal characterization and
simulation should be carried out at the entire system level, accounting for the thermal
requirements of each component. In addition, acoustic noise constraints may limit the
size, number, placement and types of fans that can be used in a particular design.
To ease the burden on thermal solutions, the Thermal Monitor feature and associated
logic have been integrated into the silicon of the processor. By taking advantage of the
Thermal Monitor feature, system designers may reduce the thermal solution cost by
designing to TDP instead of maximum power. Thermal Monitor attempts to protect the
processor during sustained workload above TDP. Implementation options and
recommendations are described in Section 4.
2.4.3Summary
In summary, considerations in heatsink design include:
• The local ambient temperature TA at the heatsink, which is a function of chassis
design.
• The thermal design power (TDP) of the processor , and the corresponding maximum
TC as calculated from the thermal profile. These parameters are usually combined
in a single lump cooling performance parameter, Ψ
characterization parameter). More information on the definition and the use of Ψ
is given in section 3.1.
• Heatsink interface to IHS surface characteristics, including flatness and roughness.
• The performance of the thermal interface material used between the heatsink and
the IHS.
• The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life of
the product (Refer to Section 2.1.2.2 for more information).
(case to air thermal
CA
CA
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• Surface area of the heatsink.
• Heatsink material and technology.
• Volume of airflow over the heatsink surface area.
• Development of airflow entering and within the heatsink area.
• Physical volumetric constraints placed by the system.
2.5System Integration Considerations
Manufacturing with Intel® Components using 775-Land LGA Package and LGA775
Socket documentation provides Best Known Methods for all aspects of LGA775 socket
based platforms and systems manufacturing. Of particular interest for package and
heatsink installation and removal is the System Assembly module. A video covering
system integration is also available. Contact your Intel field sales representative for
more information.
Thermal/Mechanical Information
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160
3.0Thermal Metrology
This section discusses guidelines for testing thermal solutions, including measuring
processor temperatures. In all cases, the thermal engineer must measure power
dissipation and temperature to validate a thermal solution. To define the performance
of a thermal solution the "thermal characterization parameter", Ψ ("psi") will be used.
The idea of a "thermal characterization parameter", Ψ ("psi"), is a convenient way to
characterize the performance needed for the thermal solution and to compare thermal
solutions in identical situations (same heat source and local ambient conditions). The
thermal characterization parameter is calculated using total package power.
Note:Heat transfer is a three-dimensional phenomenon that can rarely be accur ately and
easily modeled by a single resistance parameter like Ψ.
Equation 1. Ψ
Equation 2. Ψ
The case-to-local ambient thermal characterization parameter value (Ψ
measure of the thermal performance of the overall thermal solution that is attached to
) is used as a
CA
the processor package. It is defined by the following equation, and measured in units of
°C/W:
= (TC - TA) / P
CA
D
Where:
Ψ
T
T
A
P
The case-to-local ambient thermal characterization parameter of the processor, Ψ
comprised of Ψ
and of Ψ
=Local ambient temperature in chassis at processor (°C)
=Processor total power dissipation (W) (assumes all power dissipates
D
SA
= ΨCS + ΨSA
CA
through the IHS)
, the thermal interface material thermal characterization parameter,
CS
, the sink-to-local ambient thermal characterization parameter:
CA
, is
Where:
Ψ
Ψ
=Thermal characterization parameter of the thermal interface material
CS
=Thermal characterization parameter from heatsink-to-local ambient
SA
(°C/W)
(°C/W)
Ψ
is strongly dependent on the thermal conductivity and thickness of the TIM
CS
between the heatsink and IHS.
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Ψ
is a measure of the thermal characterization parameter from the bottom of the
SA
heatsink to the local ambient air. SA is dependent on the heatsink material, thermal
conductivity, and geometry. It is also strongly dependent on the air velocity through
the fins of the heatsink.
Figure 4 illustrates the combination of the different thermal characterization
The cooling performance, ΨCA, is then defined using the principle of thermal
characterization parameter described above:
• The case temperature T
datasheet.
• Define a target local ambient temperature at the processor, T
Since the processor thermal profile applies to all processor frequencies, it is important
to identify the worst case (lowest Ψ
establish a design strategy.
IHS
IHS
T
T
A
A
Ψ
Ψ
T
T
S
S
T
T
C
C
LGA775 Socket
LGA775 Socket
System Board
System Board
and thermal design power TDP given in the processor
C-MAX
.
A
) for a targeted chassis characterized by TA to
CA
CA
CA
The following provides an illustration of how one might determine the appropriate
performance targets. The example power and temperature numbers used here are not
related to any specific Intel processor thermal specifications, and are for illustration
purposes only.
Assume the TDP, as listed in the datasheet, is 100 W and the maximum case
temperature from the thermal profile for 100 W is 67° C. Assume as well that the
system airflow has been designed such that the local ambient temperature is 38° C.
Then the following could be calculated using Equation 1 from above:
Ψ
= (TC,- TA) / TDP = (67 - 38) / 100 = 0.29 °C/W
CA
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160
To determine the required heatsink performance, a heatsink solution provider would
need to determine CS performance for the selected TIM and mechanical load
configuration. If the heatsink solution were designed to work with a TIM material
performing at CS 0.10 °C/W, solving for Equation 2 from above, the performance of
the heatsink would be:
Thermal performance of a heatsink should be assessed using a thermal test vehicle
(TTV) provided by Intel. The TTV is a stable heat source for making accurate power
measurements, whereas processors can introduce additional factors that can impact
test results. In particular, the power level from actual processors varies significantly,
even when running the maximum power application provided by Intel, due to variances
in the manufacturing process. The TTV provides consistent power and power density for
thermal solution characterization and results can be easily translated to real processor
performance. Accurate measurement of the power dissipated by an actual processor is
beyond the scope of this document.
Once the thermal solution is designed and validated with the TTV, it is strongly
recommended to verify functionality of the thermal solution on real processors and on
fully integrated systems The Intel maximum power application enables steady power
dissipation on a processor to assist in this testing. This application is called the
Maximum Power Program for the Intel
Field Sales representative for a copy of the latest release of this application.
®
Core™ 2 Duo Processor. Contact your Intel
3.3Local Ambient Temperature Measurement Guidelines
The local ambient temperature TA is the temperature of the ambient air surrounding
the processor. For a passive heatsink, T
temperature; for an actively cooled heatsink, it is the temperature of inlet air to the
active cooling fan.
It is worthwhile to determine the local ambient temperature in the chassis around the
processor to understand the effect it may have on the case temperature.
T
is best measured by averaging temperature measurements at multiple locations in
A
the heatsink inlet airflow. This method helps reduce error and eliminate minor spatial
variations in temperature. The following guidelines are meant to enable accurate
determination of the localized air temperature around the processor during system
thermal testing.
For active heatsinks, it is important to avoid taking a measurement in the dead flow
zone that usually develops above the fan hub and hub spokes. Measurements should
be taken at four different locations uniformly placed at the center of the annulus
formed by the fan hub and the fan housing to evaluate the uniformity of the air
temperature at the fan inlet. The thermocouples should be placed approximately 3 mm
to 8 mm [0.1 to 0.3 in] above the fan hub vertically and halfway between the fan hub
and the fan housing horizontally as shown in Figure 5 (avoiding the hub spokes). Using
an open bench to characterize an active heatsink can be useful, and usually ensures
more uniform temperatures at the fan inlet. However, additional tests that include a
solid barrier above the test motherboard surface can help evaluate the potential impact
of the chassis. This barrier is typically clear Plexiglas*, extending at least 100 mm [4
in] in all directions beyond the edge of the thermal solution. Typical distance from the
motherboard to the barrier is 81 mm [3.2 in]. For an even more realistic airflow, the
motherboard should be populated with significant elements like memory cards, a
graphic card and a chipset heatsink. If a barrier is used, the thermocouple can be taped
directly to the barrier with clear tape at the horizontal location as previously described,
is defined as the heatsink approach air
A
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Metrology
half way between the fan hub and the fan housing. If a variable speed fan is used, it
may be useful to add a thermocouple taped to the barrier above the location of the
temperature sensor used by the fan to check its speed setting against air temperature.
When measuring TA in a chassis with a live motherboard, add-in cards, and other
system components, it is likely that the TA measurements will reveal a highly nonuniform temperature distribution across the inlet fan section.
For passive heatsinks, thermocouples should be placed approximately 13 mm to 25
mm [0.5 to 1.0 in] away from processor and heatsink as shown in Figure 5. The
thermocouples should be placed approximately 51 mm [2.0 in] above the baseboard.
This placement guideline is meant to minimize the effect of localized hot spots from
baseboard components.
Note:Testing an active heatsink with a variable speed fan can be done in a thermal chamber
to capture the worst-case thermal environment scenarios. Otherwise, when doing a
bench top test at room temperature, the fan regulation prevents the heatsink from
operating at its maximum capability. To characterize the heatsink capability in the
worst-case environment in these conditions, it is then necessary to disable the fan
regulation and power the fan directly, based on guidance from the fan supplier.
Figure 5.Locations for Measuring Local Ambient Temperature, Active Heatsink
Note:Drawing Not to Scale
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160
Figure 6.Locations for Measuring Local Ambient Temperature, Passive Heatsink
Note:Drawing Not to Scale
3.4Processor Case Temperature Measurement Guidelines
To ensure functionality and reliability, the processor is specified for proper operation
when T
measurement location for T
location for T
Special care is required when measuring T
measurement. Thermocouples are often used to measure T
measurements are made, the thermocouples must be calibrated, and the complete
measurement system must be routinely checked against known standards.
When measuring the temperature of a surface that is at a different temperature from
the surrounding local ambient air, errors could be introduced in the measurements. The
measurement errors could be caused by poor thermal contact between the junction of
the thermocouple and the surface of the integrated heat spreader, heat loss by
radiation, convection, by conduction through thermocouple leads, or by contact
between the thermocouple cement and the heatsink base.
Appendix C defines a reference procedure for attaching a thermocouple to the IHS of a
775-Land LGA processor package for T
account the specific features of the 775-Land LGA package and of the LGA775 socket
for which it is intended.
is maintained at or below the thermal profile as listed in the datasheet. The
C
measurement.
C
is the geometric center of the IHS. Figure 2 shows the
C
to ensure an accurate temperature
C
measurement. This procedure takes into
C
. Before any temperature
C
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Management Logic and Thermal Monitor Feature
4.0Thermal Management Logic and Thermal Monitor
Feature
4.1Processor Power Dissipation
An increase in processor operating frequency not only increases system performance,
but also increases the processor power dissipation. The relationship between frequency
and power is generalized in the following equation: P = CV
capacitance, V = voltage, F = frequency). From this equation, it is evident that power
increases linearly with frequency and with the square of voltage. In the absence of
power saving technologies, ever increasing frequencies will result in processors with
power dissipations in the hundreds of watts. Fortunately, there are numerous ways to
reduce the power consumption of a processor, and Intel is aggressively pursuing low
power design techniques. For example, decreasing the operating voltage, reducing
unnecessary transistor activity , and using more po wer efficient circuits can significantly
reduce processor power consumption.
An on-die thermal management feature called Intel
®
the processor. It provides a thermal management approach to support the continued
increases in processor frequency and performance. By using a highly accurate on-die
temperature sensing circuit and a fast acting Thermal Control Circuit (TCC), the
processor can rapidly initiate thermal management control. The Thermal Monitor can
reduce cooling solution cost by allowing thermal designs to target TDP.
The processor also supports an additional power reduction capability known as Intel
Thermal Monitor 2 described in Section 4.2.3.
2
F (where P = power, C =
Thermal Monitor is available on
®
4.2Thermal Monitor Implementation
The Thermal Monitor consists of the following components:
• A highly accurate on-die temperature sensing circuit.
• A bi-directional signal (PROCHOT#) that indicates if the processor has exceeded its
maximum temperature or can be asserted externally to activate the Thermal
Control Circuit (TCC) (Refer to Section 4.2.1 for more details on user activation of
TCC via PROCHOT# signal).
• FORCEPR# signal that will activate the TCC.
• A Thermal Control Circuit that will attempt to reduce processor temperature by
rapidly reducing power consumption when the on-die temperature sensor indicates
that it has exceeded the maximum operating point.
• Registers to determine the processor thermal status.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Thermal Management Logic and Thermal Monitor Feature—Intel
and Intel
®
Pentium® Dual-Core E2160 Processor
4.2.1PROCHOT# Signal
The primary function of the PROCHOT# signal is to provide an external indication that
the processor has exceeded its maximum operating temperature. While PROCHOT# is
asserted, the TCC will be active. Assertion of the PROCHOT# signal is independent of
any register settings within the processor. It is asserted any time the processor die
temperature reaches the trip point.
PROCHOT# can be configured via BIOS as an output or bi-directional signal. As an
output, PROCHOT# will go active when the processor temperature of either core
exceeds its maximum operating temperature. This indicates that the TCC has been
activated. As an input, assertion of PROCHOT# will activate the TCC for both cores. The
TCC will remain active until the system de-asserts PROCHOT#.
The temperature at which the PROCHOT# signal goes active is individually calibrated
during manufacturing. The power dissipation of each processor affects the set point
temperature. The temperature where PROCHOT# goes active roughly parallels the
thermal profile. Once configured, the processor temperature at which the PROCHOT#
signal is asserted is not re-configurable.
One application of using PROCHOT# is the thermal protection of voltage regulators
(VR). System designers can create a circuit to monitor the VR temperature and activate
the TCC when the temperature limit of the VR is reached. By asserting PROCHOT#
(pulled-low) or FORCEPR#, which activates the TCC, the VR can cool down as a result
of reduced processor power consumption. Bi-directional PROCHOT# can allow VR
thermal designs to target maximum sustained current instead of maximum current.
Systems should still provide proper cooling for the VR, and rely on a bi-directional
PROCHOT# signal only as a backup in case of system cooling failure.
®
CoreTM 2 Duo E6400, E4300,
Note:A thermal solution designed to meet the thermal profile targets should rarely
experience activation of the TCC as indicated by the PROCHOT# signal going active.
4.2.2Thermal Control Circuit
The Thermal Control Circuit portion of the Thermal Monitor must be enabled for the
processor to operate within specifications. The Thermal Monitor's TCC, when active, will
attempt to lower the processor temperature by reducing the processor power
consumption. In the original implementation of thermal monitor this is done by
changing the duty cycle of the internal processor clocks, resulting in a lower effective
frequency . When active, the TCC turns the processor clocks off and then back on with a
predetermined duty cycle. The duty cycle is processor specific, and is fixed for a
particular processor. The maximum time period the clocks are disabled is ~3 μs. This
time period is frequency dependent and higher frequency processors will disable the
internal clocks for a shorter time period. Figure 7 illustrates the relationship between
the internal processor clocks and PROCHOT#.
Performance counter registers, status bits in model specific registers (MSRs), and the
PROCHOT# output pin are available to monitor the Thermal Monitor behavior.
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N
Management Logic and Thermal Monitor Feature
Figure 7.Concept for Clocks under Thermal Monitor Control
PROCHOT#
ormal clock
Internal clock
Duty cycle
control
Resultant
internal clock
4.2.3Thermal Monitor 2
The processor supports an enhanced Thermal Control Circuit. In conjunction with the
existing Thermal Monitor logic, this capability is known as Thermal Monitor 2. This
enhanced TCC provides an efficient means of reducing the power consumption within
the processor and limiting the processor temperature.
When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the
enhanced TCC will be activated. The enhanced TCC causes the processor to adjust its
operating frequency (by dropping the bus-to-core multiplier to its minimum available
value) and input voltage identification (VID) value. This combination of reduced
frequency and VID results in a reduction in processor power consumption.
A processor enabled for Thermal Monitor 2 includes two operating points, each
consisting of a specific operating frequency and voltage. The first operating point
represents the normal operating condition for the processor.
The second operating point consists of both a lower operating frequency and voltage.
When the TCC is activated, the processor automatically transitions to the new
frequency. This transition occurs very rapidly (on the order of 5 μs). During the
frequency transition, the processor is unable to service any bus requests, all bus traffic
is blocked. Edge-triggered interrupts will be latched and kept pending until the
processor resumes operation at the new frequency.
Once the new operating frequency is engaged, the processor will transition to the new
core operating voltage by issuing a new VID code to the voltage regulator. The voltage
regulator must support VID transitions in order to support Thermal Monitor 2. During
the voltage change, it will be necessary to transition through multiple VID codes to
reach the target operating voltage. Each step will be one VID table entry (i.e., 12.5 mV
steps). The processor continues to execute instructions during the voltage transition.
Operation at the lower voltage reduces the power consumption of the processor,
providing a temperature reduction.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Thermal Management Logic and Thermal Monitor Feature—Intel
and Intel
Figure 8.Thermal Monitor 2 Frequency and Voltage Ordering
®
Pentium® Dual-Core E2160 Processor
Once the processor has sufficiently cooled, and a minimum activation time has expired,
the operating frequency and voltage transition back to the normal system operating
point. Transition of the VID code will occur first, in order to insure proper operation
once the processor reaches its normal operating frequency. Refer to Figure 8 for an
illustration of this ordering.
®
CoreTM 2 Duo E6400, E4300,
T
TM2
Temperature
PROCHOT#
f
MAX
f
TM2
Frequency
VID
VID
TM2
Refer to the datasheet for more information on Thermal Monitor 2.
4.2.4Operation and Configuration
To maintain compatibility with previous generations of processors, which have no
integrated thermal logic, the Thermal Control Circuit portion of Thermal Monitor is
disabled by default. During the boot process, the BIOS must enable the Thermal
Control Circuit. Thermal Monitor must be enabled to ensure proper processor
operation.
The Thermal Control Circuit feature can be configured and monitored in a number of
ways. OEMs are required to enable the Thermal Control Circuit while using various
registers and outputs to monitor the processor thermal status. The Thermal Control
Circuit is enabled by the BIOS setting a bit in an MSR (model specific register).
Enabling the Thermal Control Circuit allows the processor to attempt to maintain a safe
operating temperature without the need for special software drivers or interrupt
handling routines. When the Thermal Control Circuit has been enabled, processor
power consumption will be reduced after the thermal sensor detects a high
temperature, i.e., PROCHOT# assertion. The Thermal Control Circuit and PROCHOT#
transitions to inactive once the temperature has been reduced below the thermal trip
point, although a small time-based hysteresis has been included to prevent multiple
PROCHOT# transitions around the trip point. External hardware can monitor
PROCHOT# and generate an interrupt whenever there is a transition from active-toinactive or inactive-to-active. PROCHOT# can also be configured to generate an
VID
Time
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internal interrupt which would initiate an OEM supplied interrupt service routine.
Regardless of the configuration selected, PROCHOT# will always indicate the thermal
status of the processor.
The power reduction mechanism of thermal monitor can also be activated manually
using an "on-demand" mode. Refer to Section 4.2.5 for details on this feature.
4.2.5On-Demand Mode
For testing purposes, the thermal control circuit may also be activated by setting bits in
the ACPI MSRs. The MSRs may be set based on a particular system event (e.g., an
interrupt generated after a system event), or may be set at any time through the
operating system or custom driver control thus forcing the thermal control circuit on.
This is referred to as "on-demand" mode. Activating the thermal control circuit ma y be
useful for thermal solution investigations or for performance implication studies. When
using the MSRs to activate the on-demand clock modulation feature, the duty cycle is
configurable in steps of 12.5%, from 12.5% to 87.5%.
For any duty cycle, the maximum time period the clocks are disabled is ~3 μs. This
time period is frequency dependent, and decreases as frequency increases. To achieve
different duty cycles, the length of time that the clocks are disabled remains constant,
and the time period that the clocks are enabled is adjusted to achieve the desired ratio.
For example, if the clock disable period is 3 µs, and a duty cycle of ¼ (25%) is
selected, the clock on time would be reduced to approximately 1 s [on time (1 μs)
total cycle time (3 + 1) μs = ¼ duty cycle]. Similarly, for a duty cycle of 7/8 (87.5%),
the clock on time would be extended to 21 μs [21
Management Logic and Thermal Monitor Feature
÷
÷ (21 + 3) = 7/8 duty cycle].
In a high temperature situation, if the thermal control circuit and ACPI MSRs
(automatic and on-demand modes) are used simultaneously, the fixed duty cycle
determined by automatic mode would take precedence.
Note:On-demand mode can not activate the power reduction mechanism of Thermal
Monitor 2.
4.2.6System Considerations
Intel requires the Thermal Monitor and Thermal Control Circuit to be enabled for all
processors. The thermal control circuit is intended to protect against short term
thermal excursions that exceed the capability of a well designed processor thermal
solution. Thermal Monitor should not be relied upon to compensate for a thermal
solution that does not meet the thermal profile up to the thermal design power (TDP).
Each application program has its own unique power profile, although the profile has
some variability due to loop decisions, I/O activity and interrupts. In general, compute
intensive applications with a high cache hit rate dissipate more processor power than
applications that are I/O intensive or have low cache hit rates.
The processor TDP is based on measurements of processor power consumption while
running various high power applications. This data is used to determine those
applications that are interesting from a power perspective. These applications are then
evaluated in a controlled thermal environment to determine their sensitivity to
activation of the thermal control circuit. This data is used to derive the TDP targets
published in the processor datasheet.
A system designed to meet the thermal profile at TDP and T
the processor datasheet greatly reduces the probability of real applications causing the
thermal control circuit to activate under normal operating conditions. Systems that do
not meet these specifications could be subject to more frequent activation of the
thermal control circuit depending upon the ambient air temperature and the application
values published in
C-MAX
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Thermal Management Logic and Thermal Monitor Feature—Intel
and Intel
®
Pentium® Dual-Core E2160 Processor
®
CoreTM 2 Duo E6400, E4300,
power profile. Moreover, if a system is significantly under designed, there is a risk that
the Thermal Monitor feature will not be capable of maintaining a safe operating
temperature and the processor could shutdown and signal THERMTRIP#.
For information regarding THERMTRIP#, refer to the processor datasheet and to
Section 4.2.8.
4.2.7Operating System and Application Software Considerations
The Thermal Monitor feature and its thermal control circuit work seamlessly with ACPI
compliant operating systems. The Thermal Monitor feature is transparent to the
application software since the processor bus snooping, ACPI timer and interrupts are
active at all times.
4.2.8THERMTRIP# Signal
In the event of a catastrophic cooling failure, the processor will automatically shut
down when the silicon temperature has reached its operating limit. At this point, the
system bus signal THERMTRIP# goes active and power must be removed from the
processor. THERMTRIP# activation is independent of processor activity and does not
generate any bus cycles. Refer to the processor datasheet for more information about
THERMTRIP#.
The temperature where the THERMTRIP# signal goes active is individually calibrated
during manufacturing. The temperature where THERMTRIP# goes active is roughly
parallel to the thermal profile and greater than the PROCHOT# activation temperature.
Once configured, the temperature at which the THERMTRIP# signal is asserted is
neither re-configurable nor accessible to the system.
4.2.9Cooling System Failure Warning
It may be useful to use the PROCHOT# signal as an indication of cooling system failure.
Messages could be sent to the system administrator to warn of the cooling failure, while
the thermal control circuit would allow the system to continue functioning or allow a
normal system shutdown. If no thermal management action is taken, the silicon
temperature may exceed the operating limits, causing THERMTRIP# to activate and
shut down the processor. Regardless of the system design requirements or thermal
solution ability, the Thermal Monitor feature must still be enabled to ensure proper
processor operation.
4.2.10Digital Thermal Sensor
The Intel® Core™2 Duo desktop processor E6000 sequence introduces the Digital
Thermal Sensor (DTS) as the on-die sensor to use for fan speed control (FSC). The DTS
will eventually replace the on-die thermal diode used in previous products. The
processor will have both the DTS and thermal diode enabled. The DTS is monitoring the
same sensor that activates the TCC (Refer to Section 4.2.2). Readings from the DTS
are relative to the activation of the TCC. The DTS value where TCC activation occurs is
0 (zero).
The DTS can be accessed by two methods. The first is via a MSR. The value read via the
MSR is an unsigned number of degrees C away from TCC activation. The second
method which is expected to be the primary method for FSC is via the PECI interface.
The value of the DTS when read via the PECI interface is always negative and again is
degrees C away from TCC activation.
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Thermal
Management Logic and Thermal Monitor Feature
Figure 9.T
A T
DTS is the same as with the on-die thermal diode:
o If the Digital thermal sensor is less than T
o If the Digital thermal sensor is greater than or equal to T
maintained at or below the Thermal Profile for the measured power dissipation.
The calculation of T
value to sum with the T
The BIOS only needs to read the T
control device.
CONTROL
value will be provided for use with DTS. The usage model for T
CONTROL
, the fan speed can be reduced.
CONTROL
is slightly different from previous product. There is no base
CONTROL
for Digital Thermal Sensor
Thermal Diode Temperature
Thermal Diode Temperature
70
70
70
70
70
70
60
60
60
60
60
60
Tcontrol= 66
Tcontrol= 66
Tcontrol= 66
Tcontrol= 66
50
50
50
50
50
50
40
40
40
40
40
40
30
30
30
30
30
30
located in the same MSR as used in previous processors.
OFFSET
Temperature
Temperature
Temperature
Temperature
MSR and provide this value to the fan speed
OFFSET
Digital Thermometer Temperature
Digital Thermometer Temperature
Power
Power
Power
Power
CONTROL
CONTROL
, TC must be
0
0
0
0
0
0
20
20
20
20
20
20
30
30
30
30
30
30
40
40
40
40
40
40
50
50
50
50
50
50
with the
Tcontrol= -10
Tcontrol
Tcontrol= -10
Tcontrol
20
20
20
20
20
20
10
10
10
10
10
10
Time
Time
Time
Time
Multiple digital thermal sensors can be implemented within the package without adding
a pair of signal pins per sensor as required with the thermal diode. The digital thermal
sensor is easier to place in thermally sensitive locations of the processor than the
thermal diode. This is achieved due to a smaller foot print and decreased sensitivity to
noise. Since the DTS is factory set on a per-part basis, there is no need for the health
monitor components to be updated at each processor family.
Fan Speed
Fan Speed
Fan Speed
Fan Speed
4.2.11Platform Environmental Control Interface (PECI)
The PECI interface is a proprietary single wire bus between the processor and the
chipset or other health monitoring device. At this time, the digital thermal sensor is the
only data being transmitted. For an overview of the PECI interface, refer to the PECI
Feature Set Overview. For additional information on the PECI, refer to the Intel®
Core™2 Duo Extreme Processor X6800 and Intel® Core™2 Duo Desktop Processor
E6000 Sequence Datasheet.
The PECI bus is available on pin G5 of the LGA 775 socket. Starting with the Intel ICH8,
the IO Controller Hub has integrated a PECI host controller. The PECI interface and the
Manageability Engine, embedded in the Intel
elements to the Intel
and the Intel
Intel has worked with many vendors that provide fan speed control devices to provide
PECI host controllers. Consult the local representative for your preferred vendor for his/
her product plans and availability.
®
®
Quiet System Technology (Intel® QST), refer to Chapter 6.0
Quiet System Technology Configuration and Tuning Manual.
®
965 Express chipset family, are key
60
60
60
60
60
60
70
70
70
70
70
70
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
The thermal performance required for the heatsink is determined by calculating the
case-to-ambient thermal characterization parameter, Ψ
This is a basic thermal engineering parameter that may be used to evaluate and
compare different thermal solutions in similar boundary conditions. An example of how
Ψ
is calculated for the Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium®
CA
Dual-Core E2160 Processors for Embedded Applications is shown in Equation 3.
Core™2 Extreme Processor X6800 and Intel® Core™2 Duo Desktop
=Ψ
C-MAX
max
−
and TDP are taken from the thermal profile specification in
CTCT
)()(
LAC
WTDP
)(
=
65
−
W
384.61
Processor E6000 Sequence Datasheet. It is important to note that in this calculation,
the T
temperature (TLA).
and TDP are constant, while ΨCA will vary according to the local ambient
C-MAX
Table 1 shows an example of required thermal characterization parameters for the
thermal solution at various TLAs. This table uses the TC max and TDP from the
datasheets. These numbers are subject to change, and in case of conflict, the
specifications in the processor datasheet supersede the T
in this document.
Table 3.Thermal Characterization Parameter at various TLA's
Intel® Core™2 Duo E6400,
E4300, and Intel® Pentium®
Dual-Core E2160 Processors for
Embedded Applications in the
775-Land Package
TDP (W) TC Max (°C)44.1403530
6561.40.2660.3290.4060.483
Required Ψ
CA (°C/W) of Thermal Solution at TLA = (°C)
Figure 10 further illustrates the required thermal characterization parameter for the
Intel® Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors
for Embedded Applications at various operating ambient temperatures. The thermal
solution design must have a Ψ
temperature.
less than the values shown for the given local ambient
CA
ooooo
CC
=
C
360.0
W
and TDP specifications
C-MAX
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Intel®
Reference Thermal Solution
Figure 10.Thermal Characterization Parameters for Various Operating Conditions
5.2PICMG 1.3 Form Factor
Thermal solution design for the Intel® Core™ 2 Duo E6400, E4300, and Intel®
Pentium® Dual-Core E2160 Processors for Embedded Applications in the PICMG 1.3
form factor is very challenging. Due to limited volume for the heatsink (mainly in
direction of heatsink height) and the available amount of airflow, system designers may
have to make some tradeoffs in the system boundary condition requirements (i.e.,
maximum T
requirements. The entire thermal solution from the heatsink design, chassis
configuration and airflow source needs to be optimized for server systems in order to
obtain the best performing solution.
Intel has worked with a third party vendor to enable a heatsink design for the Intel®
Core™ 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processors for
Embedded Applications for the PICMG 1.3 form factor. This design was optimized for
the PICMG 1.3 form factor within the available volume for the thermal solution. The
motherboard component keep-ins can be seen in Figure 20 and Figure 20.
This solution requires 100% of the airflow to be ducted through the heatsink fins in
order to prevent heatsink bypass. It is a copper base and copper fin heatsink that is
attached to the motherboard with the use of a backplate. This solution is shown in
Figure 11.
, acoustic requirements, etc.) in order to meet the processor's thermal
LA
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Based on lab test data, the case-to-ambient (ΨCA) performance of heatsink was found
to be 0.356 °C/W with 18 CFM of airflow through the heatsink fins. This will allow a
maximum T
described in the processor datasheet. The estimated performance for additional
of 39 °C and meet the processors Thermal Profile specification as
LA
airflows is shown in Figure 12.
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Intel®
Figure 12.PICMG 1.3 Heatsink Performance
Reference Thermal Solution
0.450
0.400
0.350
0.300
C/W)
o
0.250
0.200
0.150
Thermal Resistance (
0.100
0.050
0.000
101520253035
PICMG 1.3 Heatsink Psi_ca
Airflow Throught the Fins (CFM)
The performance of the heatsink could improve with more airflow. However, the final
intended thermal solution including, heatsink, airflow source, TIM and attach
mechanism must be validated by system integrators.
Developers who wish to design thermal solutions for the processor, need to ensure that
it meets the processor thermal specifications as stated in the processor datasheet and
follow the recommended motherboard component keep-out as shown in Figure 20. This
keep-out will ensure that the processor thermal solution will not interfere with the
voltage regulator components. In addition to this, a thermal solution design must meet
the maximum component heights as specified by the PICMG 1.3 (http://picmg.org/
specifications.stm). It should be noted that due to the vertical orientation of the
heatsink, there might be some stresses in the board due to the heatsink weight.
5.3ATX/BTX form factors
For information regarding the Intel Thermal/Mechanical Reference Design thermal
solution and design criteria for the ATX and BTX form factor, refer to the Intel
Duo Desktop Processor E6000 Sequence Thermal and Mechanical Design Guidelines.
®
Core™2
5.4Altitude
The reference heatsink solutions will be evaluated at sea level. However, many
companies design products that must function reliably at high altitude, typically 1,500
m [5,000 ft] or more. Air-cooled temperature calculations and measurements at sea
level must be adjusted to take into account altitude effects like variation in air density
and overall heat capacity. This often leads to some degradation in thermal solution
performance compared to what is obtained at sea level, with lower fan performance
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
and higher surface temperatures. The system designer needs to account for altitude
effects in the overall system thermal design to make sure that the T
the processor is met at the targeted altitude.
requirement for
C
5.5Geometric Envelope for Intel Reference PICMG 1.3
Thermal Mechanical Design
Figure 20 and Figure 21 in Appendix D give detailed reference PICMG 1.3 motherboard
keep-out information for the reference thermal/mechanical enabling design. These
drawings include height restrictions in the enabling component region.
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Intel®
Quiet System Technology (Intel® QST)
6.0Intel® Quiet System Technology (Intel® QST)
In the Intel® 965 Express Chipset family, a new control algorithm for fan speed control
is being introduced. It is composed of a Manageability Engine (ME) in the Graphics
Memory Controller Hub (GMCH) which executes the Intel® Quiet System Technology
®
(Intel
The ME provides integrated fan speed control in lieu of the mechanisms available in a
SIO or a stand-alone ASIC. The Intel QST is time based as compared to the linear or
state control used by the current generation of FSC devices.
A short discussion of Intel QST will follow along with thermal solution design
recommendations. For a complete discussion of programming the Intel QST in the ME,
consult the IntelManual.
QST) algorithm and the ICH8 containing the sensor bus and fan control circuits.
®
Quiet System Technology (Intel® QST) Configuration and Tuning
Note:Fan speed control algorithms and Intel QST in particular rely on a thermal solution
being compliant to the processor thermal profile. It is unlikely that any fan speed
control algorithm can compensate for a non-compliant thermal solution. See
Chapter 5.0 and Chapter 6.0 for thermal solution requirements that should be met
before evaluating or configuring a system with Intel QST.
6.1Intel® QST Algorithm
The objective of Intel QST is to minimize the system acoustics by more closely
controlling the thermal sensors to the corresponding processor or chipset device
T
control algorithm and a Fan Output Weighting Matrix. The PID algorithm takes into
account the difference between the current temperature and the target (T
rate of change and direction of change to minimize the required fan speed change. The
Fan Output Weighting Matrix uses the effects of each fan on a thermal sensor to
minimize the required fan speed changes
Figure 13 shows in a very simple manner how Intel QST works. Refer to the Intel®
Quiet System Technology (Intel® QST) Configuration and Tuning Manual for details of
the inputs and response.
value. This is achieved by the use of a Proportional-Integral-Derivative (PID)
CONTROL
CONTROL
), the
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® Quiet System Technology (Intel® QST)—Intel
Pentium
®
Dual-Core E2160 Processor
Figure 13.Intel® QST Overview
®
CoreTM 2 Duo E6400, E4300, and Intel®
Temperature sensing
and response
Calculations
(PID)
Temperature
Sensors
6.1.1Output Weighting Matrix
Intel QST provides an Output Weighting Matrix that provides a means for a single
thermal sensor to affect the speed of multiple fans. An example of how the matrix
could be used is if a sensor located next to the memory is sensitive to changes in both
the processor heatsink fan and a second fan in the system. By placing a factor in this
matrix additional the Intel QST could command the processor thermal solution fan and
this second fan to both accelerate a small amount. At the system level these two small
changes can result in a smaller change in acoustics than having a single fan respond to
this sensor.
(Output Weighting Matrix)
Intel®QST
Fan to sensor
Relationship
System Response
Fan Commands
(PID)
PWMPECI / SST
Fans
6.1.2Proportional-Integral-Derivative (PID)
The use of Proportional-Integral-Derivative (PID) control algorithms allow the
magnitude of fan response to be determined based upon the difference between
current temperature readings and specific temperature targets. A major adv antage of a
PID Algorithm is the ability to control the fans to achieve sensor temperatures much
closer to the T
Figure 14 is an illustration of the PID fan control algorithm. As illustrated in the figure,
when the actual temperature is below the target temperature, the fan will slow down.
The current FSC devices have a fixed temperature vs. PWM output relationship and
miss this opportunity to achieve additional acoustic benefits. As the actual temper ature
starts ramping up and approaches the target temperature, the algorithm will instruct
the fan to speed up gradually , but will not abruptly increase the fan speed to respond to
the condition. It can allow an overshoot over the target temperature for a short period
of time while ramping up the fan to bring the actual temperature to the target
temperature. As a result of its operation, the PID control algorithm can enable an
acoustic-friendly platform.
October 2007TDG
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.
CONTROL
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Intel®
Figure 14.PID Controller Fundamentals
Integral (time averaged)
Integral (time averaged)
Integral (time averaged)
Integral (time averaged)
RPMTemperature
Proportional
Proportional
Proportional
Proportional
Error
Error
Error
Error
+ dPWM
+ dPWM
+ dPWM
+ dPWM
+ dPWM
dPWM
dPWM
dPWM
dPWM
dPWM
dPWM
-
-
-
-
-
-
+ dPWM
Quiet System Technology (Intel® QST)
Actual
Actual
Temperature
Temperature
Limit
Limit
Temperature
Temperature
Derivative (Slope)
Derivative (Slope)
Derivative (Slope)
Derivative (Slope)
Time
Fan
Fan
Speed
Speed
For a PID algorithm to work limit temperatures are assigned for each temperature
sensor. For Intel QST, the T
limit temperature. The ME will measure the error, slope and rate of change using the
equations below:
• Proportional Error (P) = TLIMIT - TACTUAL
• Integral (I) = Time averaged error
• Derivative (D) = ΔTemp / ΔTime
Three gain values are used to control response of algorithm:
• Kp = proportional gain
• Ki = Integral gain
• Kd = derivative gain
The Intel® Quiet System Technology (Intel® QST) Configuration and Tuning Manual
provides initial values for the each of the gain constants. In addition it provides a
methodology to tune these gain values based on system response. Finally the fan
speed change will be calculated using the following formula:
for the processor and chipset are to be used as the
CONTROL
ΔPWM = -P*(Kp) - I*(Ki) + D*(Kd)
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® Quiet System Technology (Intel® QST)—Intel
Pentium
®
Dual-Core E2160 Processor
®
CoreTM 2 Duo E6400, E4300, and Intel®
6.2Board and System Implementation of Intel® QST
To implement, the board must be configured as shown in Figure 15 and listed below:
• ME system (S0-S1) with Controller Link connected and powered
• DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel® QST FW
execution
• SPI Flash with sufficient space for the Intel® QST Firmware
• SST-based thermal sensors to provide board thermal data for Intel® QST
algorithms
• Intel® QST firmware
Figure 15.Intel® QST Platform Requirements
Processor
Intel® (G)MCH
ME
ME
DRAM
DRAM
Controller Link
Intel®
ICH8
Note:Simple Serial T r ansport (SST) is a single wire bus that is included in the ICH8 to provide
additional thermal and voltage sensing capability to the Manageability Engine (ME).
Figure 16 shows the major connections for a typical implementation that can support
processors with Digital thermal sensor or a thermal diode. In this configuration, a SST
Thermal Sensor has been added to read the on-die thermal diode that is in all of the
processors in the 775-land LGA packages shipped before the Intel® Core™2 Duo
processor. With the proper configuration information, the ME can be accommodate
inputs from PECI or SST for the processor socket. Additional SST sensors can be added
to monitor system thermal conditions (refer to Appendix E for BTX recommendations
for placement).
FSC
Control
SPI
SPI
Flash
SST
Sensor
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Intel®
Quiet System Technology (Intel® QST)
Figure 16.Example Acoustic Fan Speed Control Implementation
LGA 775 Socket
Intel
TM
Core
Processor
®
2 Duo
Thermal Sensor
DMI
PECI
SST
Thermal Sensor
Intel (G)MCH
Thermal
Sensor
Intel® ICH8
Thermal
Sensors
ME
Controller
Link
PWM
TACH
PWM
TACH
Thermal Sensor
Intel® Pentium
®
Dual-Core Processor
Intel has engaged with a number of major manufacturers of thermal / voltage sensors
to provide devices for the SST bus. Contact your Intel Field Sales representative for the
current list of manufacturers and visit their web sites or local sales representatives for
a part suitable for your design.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® Quiet System Technology (Intel® QST)—Intel
Pentium
®
Dual-Core E2160 Processor
®
CoreTM 2 Duo E6400, E4300, and Intel®
6.3Intel® QST Configuration and Tuning
Initial configuration of the Intel QST is the responsibility of the board manufacturer . The
SPI flash should be programmed with the hardware configuration of the motherboard
and initial settings for fan control, fan monitoring, voltage and thermal monitoring. This
initial data is generated using the Intel provided Configuration Tool.
At the system integrator level, the Configur ation Tool can be used again but this time to
tune the Intel QST subsystem to reflect the shipping system configuration. In the
tuning process, the Intel QST can be modified to have the proper relationships between
the installed fans and sensors in the shipping system. A Weighting Matrix Utility and
Intel QST Log program are planned to assist in optimizing the fan management and
achieve the acoustic goal.
See your Intel field sales representative for availability of these tools.
6.4Fan Hub Thermistor and Intel® QST
There is no closed loop control between Intel QST and the thermistor, but they can
work in tandem to provide the maximum fan speed reduction. The BTX reference
design includes a thermistor on the fan hub. This Variable Speed Fan curve will
determine the maximum fan speed as a function of the inlet ambient temperature, and
by design, provides a Ψ
QST, by measuring the processor Digital thermal sensor, will command the fan to
reduce speed below the VSF curve in response to processor workload. Conversely , if the
processor workload increases, the FSC will command the fan via the PWM duty cycle to
accelerate the fan up to the limit imposed by the VSF curve. Care needs to be taken in
BTX designs to ensure the fan speed at the minimum operating speed provides
sufficient air flow to support the other system components.
sufficient to meet the thermal profile of the processor. Intel
CA
Figure 17. Digital Thermal Sensor and Thermistor
Fan Speed
Fan Speed
Full
Full
Speed
Speed
(RPM)
(RPM)
Min.
Min.
Operating
Operating
Variable Speed Fan (VSF) Curve
Variable Speed Fan (VSF) Curve
30
30
Inlet Temperat ure (°C)
Inlet Temperat ure (°C)
Fan Speed
Fan Speed
Operating Range
Operating Range
with FSC
with FSC
34
34
38
38
100 %
100 %
Min %
Min %
Fan Speed
Fan Speed
(% PWM Duty Cycle)
(% PWM Duty Cycle)
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—LGA775
Appendix A LGA775 Socket Heatsink Loading
A.1LGA775 Socket Heatsink Considerations
Heatsink clip load is traditionally used for:
• Mechanical performance in mechanical shock and vibration
• Thermal interface performance
— Required preload depends on TIM
— Preload can be low for thermal grease
In addition to mechanical performance in mechanical shock and vibration and TIM
performance, the LGA775 socket requires a minimum heatsink preload to protect
against fatigue failure of socket solder joints.
Socket Heatsink Loading
Solder ball tensile stress is originally created when, after inserting a processor into the
socket, the LGA775 socket load plate is actuated. In addition, solder joint shear stress
is caused by coefficient of thermal expansion (CTE) mismatch induced shear loading.
The solder joint compressive axial force (Faxial) induced by the heatsink preload helps
to reduce the combined joint tensile and shear stress.
Overall, the heatsink required preload is the minimum preload needed to meet all of
the above requirements: Mechanical shock and vibration and TIM performance AND
LGA775 socket protection against fatigue failure.
A.2Metric for Heatsink Preload for Designs Non-Compliant
with Intel Reference Design
A.2.1Heatsink Preload Requirement Limitations
Heatsink preload by itself is not an appropriate metric for solder joint force across
various mechanical designs and does not take into account other factors such as:
• Heatsink mounting hole span
• Heatsink clip/fastener assembly stiffness and creep
• Board stiffness and creep
• Board stiffness is modified by fixtures like backing plate, chassis attach, etc.
Simulation shows that the solder joint force (F
deflection measured along the socket diagonal. The matching of Faxial required to
protect the LGA775 socket solder joint in temperature cycling is equivalent to matching
a target MB deflection.
) is proportional to the board
axial
Therefore, the heatsink preload for LGA775 socket solder joint protection against
fatigue failure can be more generally defined as the load required to create a target
board downward deflection throughout the life of the product.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
This board deflection metric provides guidance for mechanical designs that differ from
the reference design for ATX//µATX form factor.
A.2.2Motherboard Deflection Metric Definition
Motherboard deflection is measured along either diagonal (refer to Figure 18):
d = dmax - (d1 + d2)/2
d' = dmax - (d'1 + d'2)/2
Configurations in which the deflection is measured are defined in the Table 2 below.
To measure board deflection, follow industry standard procedures (such as IPC) for
board deflection measurement. Height gauges and possibly dial gauges may also be
used.
A.2.4Board Deflection Metric Implementation Example
This section is for illustration only, and relies on the following assumptions:
• 72 mm x 72 mm hole pattern of the reference design.
• Board stiffness = 900 lb/in at BOL, with degradation that simulates board creep
over time.
— Though these values are representative, they may change with selected
material and board manufacturing process. Check with your motherboard
vendor.
• Clip stiffness assumed constant - No creep.
Using Figure 19 below, the heatsink preload at beginning of life is defined to comply
with d_EOL - d_ref = 0.15mm depending on clip stiffness assumption.
Note that the BOL and EOL preload and board deflection differ. This is a result of the
creep phenomenon. The example accounts for the creep expected to occur in the
motherboard. It assumes no creep to occur in the clip. However, there is a small
amount of creep accounted for in the plastic fasteners - this situation is somewhat
similar to the Intel Reference Design.
The impact of the creep to the board deflection is a function of the clip stiffness:
• The relatively compliant clips store strain energy in the clip under the BOL preload
condition and tend to generate increasing amounts of board deflection as the
motherboard creeps under exposure to time and temperature.
• In contrast, the stiffer clips store very little strain energy, and therefore, do not
generate substantial additional board deflection through life.
Note:
1. Board and clip creep modify board deflection over time and depends on board
stiffness, clip stiffness and selected materials.
2. Designers must define the BOL board deflection that will lead to the correct end of
life board deflection.
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—LGA775
Intel recommends to design to {d_BOL - d_ref = 0.15mm} at BOL when EOL conditions
are not known or difficult to assess.
The following information is given for illustration only. It is based on the reference
keep-out, assuming there is no fixture that changes board stiffness:
d_ref is expected to be 0.18 mm on average, and be as high as 0.22 mm
As a result, the board should be able to deflect 0.37 mm minimum at BOL.
Additional deflection as high as 0.09 mm may be necessary to account for additional
creep effects impacting the board/clip/fastener assembly. As a result, designs could see
as much as 0.50mm total downward board deflection under the socket.
In addition to board deflection, other elements need to be considered to define the
space needed for the downward board total displacement under load, like the potential
interference of through-hole mount component pin tails of the board with a mechanical
fixture on the back of the board.
Note:
1. The heatsink preload must remain below the maximum load limit of the package at
all times (Refer to processor datasheet).
2. Board deflection should not exceed motherboard manufacturer specifications.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
To protect LGA775 socket solder joint, designers need to drive their mechanical design
to:
• Allow downward board deflection to put the socket balls in a desirable force state to
protect against fatigue failure of socket solder joint (refer to sections A.2.1, A.2.2
and A.2.3.
• Prevent board upward bending during mechanical shock event.
• Define load paths that keep the dynamic load applied to the package within
specifications published in the processor datasheet.
Limiting board deflection may be appropriate in some situations like:
• Board bending during shock
• Board creep with high heatsink preload
However, the load required to meet the board deflection recommendation (refer to
Section A.2.3) with a very stiff board may lead to heatsink preloads exceeding package
maximum load specification. For example, such a situation may occur when using a
backing plate that is flush with the board in the socket area, and prevents the board to
bend underneath the socket.
A.3Heatsink Selection Guidelines
Evaluate carefully heatsinks coming with motherboard stiffening devices (like backing
plates), and conduct board deflection assessments based on the board deflection
metric.
Solutions derived from the reference design comply with the reference heatsink
preload, for example:
• the Boxed processor
• The Intel RCFH-4 reference design available from licensed suppliers (refer to
Appendix E for contact information)
Intel will collaborate with vendors participating in its third party test house program to
evaluate third party solutions. Vendor information will be available after product
launch.
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Thermal
Appendix B Thermal Interface Management
To optimize a heatsink design, it is important to understand the impact of factors
related to the interface between the processor and the heatsink base. Specifically, the
bond line thickness, interface material area and interface material thermal conductivity
should be managed to realize the most effective thermal solution.
B.1Bond Line Management
Any gap between the processor integrated heat spreader (IHS) and the heatsink base
degrades thermal solution performance. The larger the gap between the two surfaces,
the greater the thermal resistance. The thickness of the gap is determined by the
flatness and roughness of both the heatsink base and the integrated heat spreader,
plus the thickness of the thermal interface material (for example thermal grease) used
between these two surfaces and the clamping force applied by the heatsink attach
clip(s).
Interface Management
B.2Interface Material Area
The size of the contact area between the processor and the heatsink base will impact
the thermal resistance. However, there is a point of diminishing returns. Unrestrained
incremental increases in thermal interface material area do not translate to a
measurable improvement in thermal performance.
B.3Interface Material Performance
Two factors impact the performance of the interface material between the processor
and the heatsink base:
• Thermal resistance of the material
• Wetting/filling characteristics of the material
Thermal resistance is a description of the ability of the thermal interface material to
transfer heat from one surface to another. The higher the thermal resistance, the less
efficient the interface material is at transferring heat. The thermal resistance of the
interface material has a significant impact on the thermal performance of the overall
thermal solution. The higher the thermal resistance, the larger the temperature drop is
across the interface and the more efficient the thermal solution (heatsink, fan) must be
to achieve the desired cooling.
The wetting or filling characteristic of the thermal interface material is its ability, under
the load applied by the heatsink retention mechanism, to spread and fill the gap
between the processor and the heatsink. Since air is an extremely poor thermal
conductor, the more completely the interface material fills the gaps, the lower the
temperature drops across the interface. In this case, thermal interface material area
also becomes significant; the larger the desired thermal interface material area, the
higher the force required to spread the thermal interface material.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Case Temperature Reference Metrology—Intel
Pentium
®
Dual-Core E2160 Processor
®
CoreTM 2 Duo E6400, E4300, and Intel®
Appendix C Case Temperature Reference Metrology
C.1Objective and Scope
This appendix defines a reference procedure for attaching a thermocouple to the IHS of
a 775-land LGA package for TC measurement. This procedure takes into account the
specific features of the 775-land LGA package and of the LGA775 socket for which it is
intended. The recommended equipment for the reference thermocouple installation,
including tools and part numbers are also provided. In addition, a video that shows the
process in real time - Thermocouple Attach Using Solder - Video CD-ROM - is available.
For information on case temperature reference setup, tool use, and approach, please
refer to Intel® Core™2 Duo Processor and Intel® Pentium® Dual Core Processor Thermal and Mechanical Design Guidelines, Appendix D.
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Mechanical Drawings—Intel
E2160 Processor
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core
Appendix D Mechanical Drawings
The following table lists the mechanical drawings included in this appendix. These
drawings refer to the reference thermal mechanical enabling components for the
processor.
Note:Intel reserves the right to make changes and modifications to the design as necessary.
Drawing DescriptionPage Number
Figure 20, “PICMG 1.3 Motherboard Keep-out Footprint Definition and
Height Restrictions for Enabling Components, Primary Side” on
page 54
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—
Mechanical Drawings
Figure 20.PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions
for Enabling Components, Primary Side
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel
TDGOctober 2007
54 Order Number: 315279 - 003US
Mechanical Drawings—Intel
E2160 Processor
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core
Figure 21.PICMG 1.3 Motherboard Keep-out, Secondary Side
October 2007TDG
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Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel® CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor—Intel®
Enabled Reference Solution Information
Appendix E Intel® Enabled Reference Solution
Information
This appendix includes supplier information for Intel enabled vendors for the PICMG 1.3
thermal solution.
Table 5 lists suppliers that produce Intel enabled reference components. The part
numbers listed below identify these reference components. End-users are responsible
for the verification of the Intel enabled component offerings with the supplier. OEMs
and System Integrators are responsible for thermal, mechanical and environmental
validation of these solutions.
Note:These vendors and devices are listed by Intel as a convenience to Intel's general
customer base, but Intel does not make any representations or warranties whatsoever
regarding quality, reliability, functionality or compatibility of these devices. This list
and/or these devices may be subject to change without notice.
®
CoreTM 2 Duo E6400, E4300, and Intel® Pentium® Dual-Core E2160 Processor
Intel
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56 Order Number: 315279 - 003US
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