Intel NUC7i7DNKE User manual
Intel® NUC Board/Kit NUC7i7DN
Technical Product Specification
September 2018
Intel® NUC Board NUC7i7DN may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC7i7DN Specification Update.
Revision History
Revision
Revision History
Date
102
Added clarifying information about supported technologies
June 2018
103
Added clarification to Wireless information in Feature Summary section
September 2018
100 First release of the Intel NUC Board/Kit NUC7i7DN Technical Product Specification February 2018
101 Clarifications February 2018
Disclaimer
This product specification applies to only the standard Intel NUC Board with BIOS identifier DNKBLi7v.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR
ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC
or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.
may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
Learn About Intel
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
order.
Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright 2018 Intel Corporation. All rights reserved.
®
Processor Numbers
Board Identification Information
AA Revision
BIOS Revision
Notes
Device
Stepping
S-Spec Numbers
Intel Core i7
Y0
SR3L8
Product Name
Intel® NUC Board
NUC7i7DNKE
NUC7i7DNBE
Date
Type of Change
Description of Changes or Clarifications
2/2/2018
Clarification
Pin 1 designator on board silkscreen is incorrect for the following headers:
09/07/2018
Clarification
Added text to Wireless row of table in Feature Summary section:
Basic Intel® NUC Board NUC7i7DNBE Identification Information
J83500-00X DNKBLi7v.86A.0040 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel
®
Core™ i7-8650U processor is used on this AA revision consisting of the following component:
Production Identification Information
Intel® NUC Products NUC7i7DN{x} Identification Information
NUC7i7DNB NUC7i7DNHE
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to
the Intel NUC Board/Kit NUC7i7DN.
Specification Changes or Clarifications
USB 2.0, HDMI CEC, Serial Port, SATA Power, and eDP. The pinout information
and pin 1 designators in the TPS are correct for these headers.
“Pre-installed M.2 module”
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/content/www/us/en/nuc/overview.html
for the latest documentation.
iii
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
Chapter
Description
1
A description of the hardware used on Intel® NUC Board NUC7i7DNBE
2
A map of the resources of the Intel® NUC Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for Intel® NUC Board/Kits NUC7i7DN. Some
features are only available on Kit SKUs.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel® NUC Board/Kit
NUC7i7DN and its components to the vendors, system integrators, and other engineers and
technicians who need this level of information. It is specifically not intended for general
audiences.
What This Document Contains
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of
these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iv
Other Common Notation
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
x.x V
Volts. Voltages are DC unless otherwise specified.
x.x A
Amperes.
# Used after a signal name to identify an active-low signal (such as USBP0#)
KB Kilobyte (1024 bytes)
MB/s Megabytes per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
* This symbol is used to indicate third-party brands and names that are the property of their respective
owners.
v
Contents
Revision History ............................................................................................................... ii
Disclaimer .................................................................................................................................................................. ii
Board Identification Information ..................................................................................................................... iii
Errata ........................................................................................................................................................................... iii
Intended Audience ................................................................................................................................................ iv
What This Document Contains ........................................................................................................................ iv
Typographical Conventions .............................................................................................................................. iv
Contents ............................................................................................................................ 6
1 Product Description ............................................................................................... 11
1.1 Overview ...................................................................................................................................................... 11
1.1.1 Feature Summary .................................................................................................................. 11
1.1.2 Board Layout (Top) ............................................................................................................... 13
1.1.3 Board Layout (Bottom) ........................................................................................................ 14
1.1.4 Block Diagram ......................................................................................................................... 16
1.2 Online Support .......................................................................................................................................... 17
1.3 Processor ..................................................................................................................................................... 17
1.4 System Memory ........................................................................................................................................ 17
1.5 Processor Graphics Subsystem .......................................................................................................... 20
1.5.1 Integrated Graphics .............................................................................................................. 20
1.6 USB ................................................................................................................................................................. 24
1.7 SATA Interface ........................................................................................................................................... 24
1.7.1 AHCI Mode ................................................................................................................................ 24
1.7.2 NVMe........................................................................................................................................... 25
1.7.3 Intel® Rapid Storage Technology / SATA RAID ......................................................... 25
1.7.4 Intel® Next Generation Storage Acceleration ............................................................. 25
Real-Time Clock Subsystem ........................................................................................................................... 26
1.8 Audio Subsystem Software .................................................................................................................. 26
1.8.1 Audio Subsystem Software ............................................................................................... 26
1.9 LAN Subsystem ......................................................................................................................................... 27
1.9.1 Intel® I219LM Gigabit Ethernet Controller .................................................................. 27
1.9.2 RJ-45 LAN Connector with Integrated LEDs .............................................................. 28
1.9.3 Wireless Network Module .................................................................................................. 28
1.10 Hardware Management Subsystem ................................................................................................. 29
1.10.1 Hardware Monitoring ........................................................................................................... 29
1.10.2 Fan Monitoring ........................................................................................................................ 29
1.10.3 Thermal Solution ................................................................................................................... 29
1.11 Power Management ................................................................................................................................ 31
1.11.1 ACPI ............................................................................................................................................. 31
1.11.2 Hardware Support ................................................................................................................. 33
Product Description
1.12 Intel® Security and Manageability Technologies ......................................................................... 35
1.12.1 Intel® vPro™ Technology ..................................................................................................... 35
2 Technical Reference ............................................................................................... 39
2.1 Memory Resources .................................................................................................................................. 39
2.1.1 Addressable Memory ........................................................................................................... 39
2.2 Connectors and Headers....................................................................................................................... 39
2.2.1 Front Panel Connectors ...................................................................................................... 40
2.2.2 Back Panel Connectors ....................................................................................................... 40
2.2.3 Connectors and Headers (Top) ........................................................................................ 41
2.2.4 Connectors and Headers (Bottom) ................................................................................. 42
2.3 BIOS Security Jumper ............................................................................................................................ 53
2.4 Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header ......................... 55
2.5 Mechanical Considerations .................................................................................................................. 57
2.5.1 Form Factor .............................................................................................................................. 57
2.6 Electrical Considerations ...................................................................................................................... 59
2.6.1 Power Supply Considerations .......................................................................................... 59
2.6.2 Fan Header Current Capability ......................................................................................... 60
2.7 Thermal Considerations ........................................................................................................................ 61
2.8 Reliability ..................................................................................................................................................... 65
2.9 Environmental ........................................................................................................................................... 65
3 Overview of BIOS Features ................................................................................... 67
3.1 Introduction ................................................................................................................................................ 67
3.2 BIOS Flash Memory Organization ..................................................................................................... 67
3.3 System Management BIOS (SMBIOS) .............................................................................................. 67
3.4 Legacy USB Support ............................................................................................................................... 68
3.5 BIOS Updates ............................................................................................................................................. 68
3.5.1 Language Support ................................................................................................................. 69
3.5.2 BIOS Recovery ......................................................................................................................... 69
3.6 Boot Options .............................................................................................................................................. 70
3.6.1 Network Boot........................................................................................................................... 70
3.6.2 Booting Without Attached Devices ................................................................................ 70
3.6.3 Changing the Default Boot Device during POST ...................................................... 70
3.6.4 Power Button Menu .............................................................................................................. 70
3.7 Hard Disk Drive Password Security Feature .................................................................................. 72
3.8 BIOS Security Features .......................................................................................................................... 72
4 Error Messages and Blink Codes ......................................................................... 75
4.1 Front-panel Power LED Blink Codes ................................................................................................ 75
4.2 BIOS Error Messages ............................................................................................................................... 75
7
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
Figures
Figure 1. Major Board Components (Top) ....................................................................................................... 13
Figure 2. Major Board Components (Bottom) ................................................................................................ 14
Figure 3. Block Diagram ........................................................................................................................................... 16
Figure 4. Memory Channel and SO-DIMM Configuration.......................................................................... 19
Figure 5. eDP Connector on Bottom-side of the Board ............................................................................. 22
Figure 6. LAN Connector LED Locations........................................................................................................... 28
Figure 7. Thermal Solution and Fan Header ................................................................................................... 30
Figure 8. Location of the Standby Power LED ............................................................................................... 34
Figure 9. Front Panel Connectors ........................................................................................................................ 40
Figure 10. Back Panel Connectors ...................................................................................................................... 40
Figure 11. Connectors and Headers (Top) ....................................................................................................... 41
Figure 12. Connectors and Headers (Bottom) ............................................................................................... 42
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................ 50
Figure 14. Connection Diagram for the Internal Power Supply Connector ....................................... 52
Figure 15. Location of the BIOS Security Jumper ........................................................................................ 53
Figure 16. Intel MEBX Reset Header .................................................................................................................. 56
Figure 17. Board Dimensions ................................................................................................................................ 57
Figure 18. Board Height Dimensions ................................................................................................................. 58
Figure 19. Localized High Temperature Zones ............................................................................................. 62
Figure 20. Installation Area of the Thermal Pad ........................................................................................... 63
8
Product Description
Tables
Table 1. Feature Summary ..................................................................................................................................... 11
Table 2. Components Shown in Figure 2 ......................................................................................................... 15
Table 3. Supported Memory Configurations .................................................................................................. 18
Table 4. Unsupported Memory Configurations............................................................................................. 18
Table 5. LAN Connector LED States ................................................................................................................... 28
Table 6. Effects of Pressing the Power Switch ............................................................................................... 31
Table 7. Power States and Targeted System Power ................................................................................... 32
Table 8. Wake-up Devices and Events .............................................................................................................. 33
Table 9. Connectors and Headers Shown in Figure 11 .............................................................................. 41
Table 10. Connectors and Headers Shown in Figure 12 ........................................................................... 43
Table 11. SATA Power Header (1.25 mm pitch) ............................................................................................ 44
Table 12. Internal USB 2.0 Header (1.25 mm pitch) ..................................................................................... 44
Table 13. Internal USB 3.0 Header (1.25 mm pitch) ..................................................................................... 45
Table 14. Serial Port Header (1.25 mm pitch) ................................................................................................. 45
Table 15. HDMI CEC Header (1.25 mm pitch) ................................................................................................. 46
Table 16. M.2 2280 Module (Mechanical Key M) Connector .................................................................... 46
Table 17. M.2 2230 Module (Mechanical Key E) Connector .................................................................... 47
Table 18. 40-Pin eDP Connector ......................................................................................................................... 49
Table 19. Front Panel Header (2.0 mm Pitch) ................................................................................................ 49
Table 20. States for a One-Color Power LED ................................................................................................. 50
Table 21. States for a Dual-Color Power LED ................................................................................................ 51
Table 22. 12-24 V Internal Power Supply Connector ................................................................................ 51
Table 23. BIOS Security Jumper Settings ........................................................................................................ 54
Table 24. Intel MEBX Reset Header Signals .................................................................................................... 56
Table 25. Power Budget for Assessing the DC-to-DC Circuit’s Power Rating (worst
rd
case: Embedded board in 3
Table 26. Fan Header Current Capability ......................................................................................................... 60
Table 27. Thermal Considerations for Components ................................................................................... 64
Table 28. Tcontrol Values for Components ................................................................................................... 64
Table 29. Environmental Specifications ........................................................................................................... 65
Table 30. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 69
Table 31. Boot Device Menu Options ................................................................................................................ 70
Table 32. Master Key and User Hard Drive Password Functions ........................................................... 72
Table 33. Supervisor and User Password Functions................................................................................... 73
Table 34. Front-panel Power LED Blink Codes ............................................................................................. 75
Table 35. BIOS Error Messages ............................................................................................................................ 75
party chassis) ........................................................................................... 59
9
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
10
Form Factor
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
Intel® NUC Board NUC7i7DNBE has a soldered-down 8th generation Intel® Core™ i7-8650U
Memory
Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)
Graphics
Integrated graphics support for processors with Intel® Graphics Technology:
Intel® High Definition (Intel® HD) Audio via the HDMI v2.0a interface through the processor
Storage
SATA ports:
Peripheral Interfaces
USB 3.0 ports:
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of Intel® NUC Board NUC7i7DNBE.
Table 1. Feature Summary
quad-core processor with up to 15 W TDP
― Intel® UHD Graphics 620
― Integrated memory controller
― Integrated PCH
sockets
― Support for DDR4 2400 MHz SO-DIMMs
― Support for 4 Gb and 8 Gb memory technology
― Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory
technology
― Support for non-ECC memory
― Support for 1.2 V low voltage JEDEC memory only
Note: 2 Gb memory technology (SDRAM Density) is not compatible
― Two High Definition Multimedia Interface* 2.0a (HDMI*) back panel connectors
― Flat panel displays via the internal Embedded DisplayPort* 1.4 (eDP) connector
Audio
― One SATA 6.0 Gb/s port (blue)
― One SATA 6.0 Gb/s port is reserved for an M.2 2280 module
Note: Intel® NUC Board NUC7i7DNBE supports key type M (PCI Express* x1/x2/x4 and
SATA)
― Two ports are implemented with external front panel connectors (blue)
― Two ports are implemented with external back panel connectors (blue)
― One port is implemented with an internal 1x10 1.25mm pitch header (white)
USB 2.0 ports:
― Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)
― One port is reserved for an M.2 2230 Module (key type E)
Serial Port 1x9 1.25mm pitch header (black)
HDMI CEC 1x4 1.25 mm pitch header (black)
continued
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
Expansion Capabilities
One M.2 Module supporting M.2 2280 (key type M)
BIOS
Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219LM Gigabit Ethernet
Hardware Monitor
Hardware monitoring subsystem, based on ITE Tech. ITE8987E-VG embedded controller,
Wireless (Kit only)
Intel® Dual Band Wireless-AC vPro 8265
Intel® vPro™
Intel® Active Management Technology (Intel® AMT) 11.6
Table 1. Feature Summary (continued)
One M.2 Module supporting M.2 2230 (key type E)
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System
Management BIOS (SMBIOS)
LAN
Controller
Subsystem
Technologies
including:
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
One processor fan header
Fan sense input used to monitor fan activity
Fan speed control
― 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth v4.2
― Maximum Transfer speed up to 867 Mbps
Supports Intel® Smart Connect Technology
Pre-installed M.2 module
Intel® Virtualization (Intel® VT-x)
Intel® Virtualization for Directed I/O (Intel® VT-d)
Intel® Trusted Execution Technology (Intel® TXT)
Intel® Identity Protection Technology (Intel® IPT)
Intel® Software Guard Extensions (Intel® SGX)
Intel® Transparent Supply Chain (Intel® TSC)
Trusted Platform Module (TPM) 2.0
12
1.1.2 Board Layout (Top)
Item from Figure 1
Description
A
Thermal Solution
B
Processor Fan Header
E
eDP Connector
F
DC Internal Power Connector
Figure 1 shows the location of the major components on the top-side of Intel NUC Board
NUC7i7DNBE.
Product Description
Table 2. Components Shown in Figure 1
Figure 1. Major Board Components (Top)
C SPI
D Battery Header
13
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
1.1.3 Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board
NUC7i7DNBE.
14
Figure 2. Major Board Components (Bottom)
Table 2. Components Shown in Figure 2
Item from Figure 2
Description
A
12-24 V DC Input Jack
B
HDMI 2.0a Port 1 with HDCP 2.2 Support and Built-In CEC Support
D
Back Panel USB 3.0
E
HDMI 2.0a Port 2
F
Serial Port Header
H
HDMI CEC
I
SATA Power Header
J
USB 2.0 Header
L
M.2 2280 Module Connector (Key Type M)
M
Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header
N
Front Panel USB 3.0
P
Front Panel USB 3.0
Q
USB 3.0 Header
R
Front Panel Power Button
T
Front Panel Header
U
Standby Power LED
V
DDR4 SO-DIMM 2 Socket
C LAN Connector
G M.2 2230 Module Connector (Key Type E) (Wireless card on Kit only)
K USB 2.0 Header
O SATA 6.0 Gb/s Connector
Product Description
S BIOS Security Header
W DDR4 SO-DIMM 1 Socket
15
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
1.1.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
i7-8650U
16
Figure 3. Block Diagram
1.2 Online Support
To find information about…
Visit this World Wide Web site:
Intel NUC Board/Kit NUC7i7DN
http://www.intel.com/NUC
Intel NUC Board/Kit Support
http://www.intel.com/NUCSupport
High level details for Intel NUC Board/Kit
http://ark.intel.com
BIOS and driver updates
http://downloadcenter.intel.com
Tested memory
http://www.intel.com/NUCSupport
Integration information
http://www.intel.com/NUCSupport
Processor datasheet
http://ark.intel.com
Product Description
NUC7i7DN
1.3 Processor
Intel NUC Board NUC7i7DNBE has a soldered-down 8th generation Intel Core i7-8650U quad-core
processor with up to 15 W TDP:
• Intel® UHD Graphics 620
• Integrated memory controller
• Integrated PCH
NOTE
There are specific requirements for providing power to the processor. Refer to Section 2.6.1 on
page 59 for information on power supply requirements.
1.4 System Memory
The board has two 260-pin SO-DIMM sockets and supports the following memory features:
• 1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided SO-DIMMs
• 32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1
on page 39 for information on the total amount of addressable memory.
• Minimum recommended total system memory: 2048 MB
• Non-ECC SO-DIMMs
• Serial Presence Detect
• DDR4 2400 MHz SDRAM SO-DIMMs
• Supports 4 Gb and 8 Gb memory technology (SDRAM Density)
17
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
SO-DIMM
Capacity
Configuration
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
2048 MB
SS
4 Gbit
512 M x4/empty
4
4096 MB
DS
4 Gbit
512 M x4/512 M x4
8
4096 MB
SS
8 Gbit
1024 M x4/empty
4
8192 MB
DS
4 Gbit
512 M x8/512 M x8
16
8192 MB
DS
8 Gbit
1024 M x4/1024 M x4
8
16384 MB
DS
8 Gbit
1024 M X8/1024 M x8
16
SO-DIMM
Capacity
Configuration
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
1024 MB
SS
1 Gbit
128 M x8/empty
8
2048 MB
DS
1 Gbit
128 M x8/128 M x8
16
2048 MB
SS
2 Gbit
256 M x8/empty
8
4096 MB
DS
2 Gbit
256 M x8/256 M x8
16
For information about…
Refer to:
Tested Memory
http://www.intel.com/NUCSupport
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This
allows the BIOS to read the SPD data and program the chipset to accurately configure memory
settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to
correctly configure the memory settings, but performance and reliability may be impacted or the
SO-DIMMs may not function under the determined frequency.
NOTE
Intel NUC Board NUC7i7DNBE supports only 4 Gb and 8 Gb memory technologies (also referred to
as “SDRAM density”). Table 3 lists the supported SO-DIMM configurations. Table 4
lists the SO-
DIMM configurations that are not supported.
Table 3. Supported Memory Configurations
(Note)
Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.
Table 4. Unsupported Memory Configurations
(Note)
Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.
18
Figure 4 illustrates the memory channel and SO-DIMM configuration.
Product Description
Figure 4. Memory Channel and SO-DIMM Configuration
19
Intel NUC Board/Kit NUC7i7DN Technical Product Specification
For information about
Refer to
HDMI technology
http://www.hdmi.org
1.5 Processor Graphics Subsystem
The board supports graphics through Intel® UHD Graphics 620.
1.5.1 Integrated Graphics
The board supports integrated graphics via the processor.
1.5.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel® UHD Graphics 620 controller features the following:
• 3D Features
DirectX* 12 support
OpenGL* 4.4 support
• Display
Supports eDP flat panel displays up to 3840 x 2160 at 60 Hz
Supports HDMI displays up to 4096 x 2160 at 60 Hz
• Next Generation Intel® Clear Video Technology HD support is a collection of video playback
and enhancement features that improve the end user’s viewing experience
• Encode/transcode HD content
• Playback of high definition content including Blu-ray* disc
• Superior image quality with sharper, more colorful images
• DirectX* Video Acceleration (DXVA) support for accelerating video processing
• Full AVC/VC1/MPEG2/HEVC/VP8/JPEG HW Decode
• Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)
• HDR 10 (High Dynamic Range 10 bit)
• HDCP (High-bandwidth Digital Content Protection) 2.2
NOTE
Intel Quick Sync Video is enabled by an appropriate software application.
HDMI 2.0a enabled by a LSPCON (DisplayPort 1.2 to HDMI 2.0a controller). Stereo 3D (S3D)
technology is not supported.
1.5.1.2 High Definition Multimedia Interface* (HDMI*)
The HDMI ports are HDMI 2.0a specification compliant and support standard, enhanced, or high
definition video, plus multi-channel digital audio on a single cable. The port is compatible with all
ATSC and DVB HDTV standards and supports thirty-two full range channels of lossless audio
formats. The system can support up to two displays at the maximum supported resolution of
4096 x 2160 @ 60 Hz, 24bpp.
1.5.1.2.1 Integrated Audio Provided by the HDMI Interfaces
The following audio technologies are supported by the HDMI 2.0a interface:
20
Product Description
• AC3 – Dolby* Digital
• Dolby Digital Plus
• DTS-HD*
• 192kHz/16-bit or 176.4 kHz/24-bit, 32 Channel
• Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc* Audio Format)
1.5.1.2.2 HDMI Consumer Electronics Control (CEC)
The system provides built-in HDMI CEC support on port 1 (refer to Figure 2), as well as a header
rd
for 3
party HDMI CEC daughtercard support on HDMI port 2. The built-in HDMI CEC feature is
OS agnostic and supports bi-directional power on/off control between the system and the
attached display, as well as automatic HDMI input port detection from the display. This feature
can be enabled and configured in BIOS Setup (Advanced → Display tab). Additional HDMI CEC
capabilities can be implemented on HDMI port 2 using a 3
allow bi-directional power on/off control and other capabilities as supported by the
daughtercard, such as the use of the media buttons on the display’s remote controller.
For information about Refer to
HDMI CEC feature on NUC https://www.intel.com/content/www/us/en/support/arti
cles/000023500/mini-pcs/intel-nuc-kits.html
rd
party daughtercard, which would
1.5.1.2.3 High-bandwidth Digital Content Protection (HDCP)
HDMI Port 1 supports HDCP 2.2. HDCP is the technology for protecting high definition content
against unauthorized copy or interception between a source (computer, digital set top boxes, etc.)
and the sink (panels, monitor, and TVs). The PCH supports HDCP 2.2 for content protection over
wired displays.
1.5.1.3 Flat Panel Display Interfaces
The board supports flat panel displays via the Embedded DisplayPort interface. Figure 5 shows
the flat panel connector on the bottom-side of the board.
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Intel NUC Board/Kit NUC7i7DN Technical Product Specification
Item
Description
A
Embedded DisplayPort Connector
A
Figure 5. eDP Connector on Bottom-side of the Board
1.5.1.3.1 Embedded DisplayPort (eDP) Interface
The Embedded DisplayPort 1.4 (eDP) flat panel display interface supports the following:
• Maximum resolution of 3840 x 2160 at 60 Hz
• 4-lane bandwidth at 5.4 GT/s
• Multiple EDID data source capability (panel, predefined, and custom payloads)
• 3.3V flat panel display voltage
• 0.6A of maximum backlight current capability
• Backlight power voltage same as NUC board DC power source
• Board connector used is I-PEX-20455-040E-12, or compatible.
• Mating plug is I-PEX 20453-040T, or compatible.
1.5.1.3.2 Configuration Modes
Video mode configuration for eDP displays is supported as follows:
• Panel: automatic panel identification via Extended Display Identification Data (EDID) for
panels with onboard EDID support
• Predefined: panel selection from common predefined panel types
• Custom payloads: custom EDID payload installation for ultimate parameter flexibility,
allowing custom definition of EDID data on panels without onboard EDID
In addition, BIOS setup provides the following configuration parameters for internal flat panel
displays:
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Product Description
• Color Depth: allows the system integrator to select whether the panel is 24 bpp with VESA or
JEIDA color mapping, or 18 bpp.
• eDP Interface Type: allows the system integrator to select whether the eDP panel is a single-
lane, dual-lane, or quad-lane display.
• eDP Data Rate: allows the system integrator to select whether the eDP panel runs at
1.62 Gb/s, 2.7 Gb/s, or 5.4 Gb/s.
• Inverter Frequency and Polarity: allows the system integrator to set the operating frequency
and polarity of the panel inverter board.
• Maximum and Minimum Inverter Current Limit (%): allows the system integrator to set
maximum PWM%, as appropriate, according to the power requirements of the internal flat
panel display and the selected inverter board.
NOTE
Support for flat panel display configuration complies with the following:
1. Internal flat panel display settings will be preserved across BIOS updates.
2. Backlight inverter voltage option “Vin” refers to board input voltage as provided to board
power input connector.
1.5.1.4 EDID Emulation Modes
The board supports emulation of displays so that the system may be remotely accessed in a
headless configuration, or be capable of tolerating display connectivity interruptions without
the operating system redetecting and rearranging the overall display layout. The display
emulation feature may be enabled in BIOS Setup (Advanced → Video → “Display Emulation”
drop down menu), with the following options:
• “No display emulation” (default selection): the system operates normally.
• “Headless display emulation”: the system creates a virtual 1280x1024 display when it boots
with no displays connected.
• “Persistent display emulation”: the system is trained with the EDID information from each
display connected on the first boot after selecting this option, and retains such parameters
regardless of display power or connectivity interruptions. The EDID information from each
display will even remain programmed through S3, S4, and S5 power states, until the feature
is disabled or a power cycle event (G3 global state) occurs.
NOTE
“Persistent display emulation” is not compatible with HDCP 2.2 displays.
When using “Persistent display emulation” it would be expected behavior for the system not to
properly drive displays different than those connected when the feature was enabled, as the
EDID parameters of the initially connected displays are still being driven by the system. In
order to retrain “Persistent display emulation” with a different display configuration a power
cycle (AC power loss) is required.
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