Intel NUC6CAYH User manual

Intel® NUC Board NUC6CAYB

Technical Product Specification

Regulatory Model: NUC6CAY

November 2016

Order Number: J46865-001

The Intel NUC Board NUC6CAYB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel NUC Board NUC6CAYB Specification Update.

Revision

Revision History

Date

001

First release of Intel NUC Board NUC6CAYB Technical Product Specification

November 2016

Revision History

Disclaimer

This product specification applies to only the standard Intel® NUC Board and Kits with BIOS identifier AYAPLCEL.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel® NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or

incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC Boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel and Celeron are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

AA Revision

BIOS Revision

Notes

J23203-402

AYAPLCEL.86A.0026

1,2

J26842-402

AYAPLCEL.86A.0026

1,2,3

Device

Stepping

S-Spec Number(s)

Intel Celeron processor J3455

SR2Z9

Device

Model

Version

SanDisk*

SDINADF4-32G-H

5.1

Hynix*

H26M64103EMR

5.0

Kingston*

EMMC32G-M525-A53

5.1

Product Name

Intel® NUC Board

Differentiating Features

NUC6CAYH

J23203-xxx

Kit with power adapter, no memory, no eMMC, no OS

NUC6CAYS

J26842-xxx

Kit with power adapter, preinstalled with 2GB 1600MHz SO-DIMM, 32GB eMMC with Microsoft* Windows* 10 Home

Date

Type of Change

Description of Changes or Clarifications

Board Identification Information

Basic Intel® NUC Board NUC6CAYB Identification Information

Notes:

1. The AA number is found on a small label on the SO-DIMM memory connector.

2. Intel® Celeron® processor J3455, used on this AA revision, consists of the following component:

3. Contains a 32GB embedded MultiMediaCard (eMMC) device consisting of one of the following components:

Product Identification Information

Intel® NUC Products NUC6CAY{x} Identification Information

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board NUC6CAYB.

Specification Changes or Clarifications

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See

http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

iii

Intel NUC Board NUC6CAYB

Chapter

Description

A description of the hardware used on Intel NUC Board NUC6CAYB

A map of the resources of the Intel NUC Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

The features of the Intel NUC Kit

Technical Product Specification

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC6CAYB. This board may be found in Intel® NUC Kit NUC6CAYH (without memory and operating system) and Intel® NUC Kit NUC6CAYS (with pre-installed SO-DIMM memory and operating system).

Intended Audience

The TPS is intended to provide detailed technical information about Intel NUC Board NUC6CAYB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Used after a signal name to identify an active-low signal (such as USBP0#)

Gigabyte (1,073,741,824 bytes)

GB/s

Gigabytes per second

Gb/s

Gigabits per second

Kilobyte (1024 bytes)

Kilobit (1024 bits)

kb/s

1000 bits per second

Megabyte (1,048,576 bytes)

MB/s

Megabytes per second

Megabit (1,048,576 bits)

Mb/s

Megabits per second

TDP

Thermal Design Power

xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their respective owners.

Other Common Notation

Contents

Revision History ............................................................................................................... ii

Board Identification Information ..................................................................................................................... iii

Product Identification Information ................................................................................................................. iii

Errata ........................................................................................................................................................................... iii

Preface .............................................................................................................................. iv

Intended Audience ................................................................................................................................................ iv

What This Document Contains ........................................................................................................................ iv

Typographical Conventions .............................................................................................................................. iv

Contents .......................................................................................................................... vii

1 Product Description ............................................................................................... 11

1.1 Overview ...................................................................................................................................................... 11

1.1.1 Feature Summary .................................................................................................................. 11

1.1.2 Board Layout (Top) ............................................................................................................... 13

1.1.3 Board Layout (Bottom) ........................................................................................................ 15

1.1.4 Block Diagram ......................................................................................................................... 17

1.2 Online Support .......................................................................................................................................... 18

1.3 Processor ..................................................................................................................................................... 18

1.4 System Memory ........................................................................................................................................ 19

1.5 Processor Graphics Subsystem .......................................................................................................... 21

1.5.1 Intel® High Definition (Intel® HD) Graphics ................................................................... 21

1.5.2 High Definition Multimedia Interface* (HDMI*) ......................................................... 21

1.5.3 Video Graphics Array* (VGA*) ........................................................................................... 21

1.6 USB ................................................................................................................................................................. 22

1.7 SATA Interface ........................................................................................................................................... 22

1.7.1 AHCI Mode ................................................................................................................................ 22

1.8 Embedded MultiMediaCard (e-MMC) - optional ......................................................................... 23

1.9 Real-Time Clock Subsystem ................................................................................................................ 23

1.10 Audio Subsystem ..................................................................................................................................... 24

1.10.1 Digital Microphone Array .................................................................................................... 24

1.10.2 Mini-TOSLINK Interface ...................................................................................................... 25

1.10.3 Audio Subsystem Software ............................................................................................... 25

1.11 LAN Subsystem ......................................................................................................................................... 26

1.11.1 Realtek* 8111HN Gigabit Ethernet Controller .......................................................... 26

1.11.2 LAN Subsystem Software ................................................................................................... 26

1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................................................. 27

1.11.4 Wireless Network Module .................................................................................................. 27

1.12 Hardware Management Subsystem ................................................................................................. 28

vii

1.12.1 Hardware Monitoring ........................................................................................................... 28

1.12.2 Fan Monitoring ........................................................................................................................ 28

1.12.3 Thermal Solution ................................................................................................................... 29

1.13 Power Management ................................................................................................................................ 30

1.13.1 ACPI ............................................................................................................................................. 30

1.13.2 Hardware Support ................................................................................................................. 32

1.13.3 HDMI Consumer Electronics Control (CEC) ................................................................ 34

1.14 Intel Platform Security Technologies .............................................................................................. 36

1.14.1 Intel® Virtualization Technology ...................................................................................... 36

1.14.2 Intel® Platform Trust Technology ................................................................................... 36

2 Technical Reference ............................................................................................... 37

2.1 Memory Resources .................................................................................................................................. 37

2.1.1 Addressable Memory ........................................................................................................... 37

2.2 Connectors and Headers....................................................................................................................... 37

2.2.1 Front Panel Connectors ...................................................................................................... 38

2.2.2 Back Panel Connectors ....................................................................................................... 38

2.2.3 Headers and Connectors (Top) ........................................................................................ 39

2.2.4 Connectors and Headers (Bottom) ................................................................................. 40

2.3 BIOS Security Jumper ............................................................................................................................ 50

2.4 Mechanical Considerations .................................................................................................................. 52

2.4.1 Form Factor .............................................................................................................................. 52

2.5 Electrical Considerations ...................................................................................................................... 53

2.5.1 Power Supply Considerations .......................................................................................... 53

2.5.2 Fan Header Current Capability ......................................................................................... 53

2.6 Thermal Considerations ........................................................................................................................ 53

2.7 Reliability ..................................................................................................................................................... 56

2.8 Environmental ........................................................................................................................................... 56

3 Overview of BIOS Features ................................................................................... 57

3.1 Introduction ................................................................................................................................................ 57

3.2 BIOS Flash Memory Organization ..................................................................................................... 57

3.3 System Management BIOS (SMBIOS) .............................................................................................. 57

3.4 Legacy USB Support ............................................................................................................................... 58

3.5 BIOS Updates ............................................................................................................................................. 58

3.5.1 Language Support ................................................................................................................. 59

3.6 BIOS Recovery ........................................................................................................................................... 59

3.7 Boot Options .............................................................................................................................................. 59

3.7.1 Network Boot........................................................................................................................... 60

3.7.2 Booting Without Attached Devices ................................................................................ 60

3.7.3 Changing the Default Boot Device During POST ...................................................... 60

3.7.4 Power Button Menu .............................................................................................................. 61

3.8 Hard Disk Drive Password Security Feature .................................................................................. 62

3.9 BIOS Security Features .......................................................................................................................... 63

viii

Contents

4 Error Messages and Blink Codes ......................................................................... 64

4.1 Front-panel Power LED Blink Codes ................................................................................................ 64

4.2 BIOS Error Messages ............................................................................................................................... 64

5 Intel NUC Kit Features ........................................................................................... 65

5.1 Chassis Front Panel Features .............................................................................................................. 65

5.2 Chassis Rear Panel Features ................................................................................................................ 66

Figures

Figure 1. Major Board Components (Top) ....................................................................................................... 13

Figure 2. Major Board Components (Bottom) ................................................................................................ 15

Figure 3. Block Diagram ........................................................................................................................................... 17

Figure 4. Memory Channel and SO-DIMM Configuration.......................................................................... 20

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... 24

Figure 6. Mini-TOSLINK Adaptor (not included) ........................................................................................... 25

Figure 7. LAN Connector LED Locations........................................................................................................... 27

Figure 8. Thermal Solution and Fan Header ................................................................................................... 29

Figure 9. Location of the Standby Power LED ............................................................................................... 34

Figure 10. Front Panel Connectors, Controls and Indicators .................................................................. 38

Figure 11. Back Panel Connectors ...................................................................................................................... 38

Figure 12. Headers and Connectors (Top) ....................................................................................................... 39

Figure 13. Connectors and Headers (Bottom) ............................................................................................... 40

Figure 14. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................ 47

Figure 15. Location of the CIR Sensor ............................................................................................................... 49

Figure 16. Location of the BIOS Security Jumper ........................................................................................ 50

Figure 17. Board Dimensions ................................................................................................................................ 52

Figure 18. Board Height Dimensions ................................................................................................................. 53

Figure 19. Localized High Temperature Zones ............................................................................................. 54

Figure 20. Intel NUC Kit NUC6CAYH/NUC6CAYS Features – Front ....................................................... 65

Figure 21. Intel NUC Kit NUC6CAYH/NUC6CAYS Features – Rear ......................................................... 66

Tables

Table 1. Feature Summary ..................................................................................................................................... 11

Table 2. Components Shown in Figure 1 ......................................................................................................... 14

Table 3. Components Shown in Figure 2 ......................................................................................................... 16

Table 4. Supported Memory Configurations .................................................................................................. 19

Table 5. Unsupported Memory Configurations............................................................................................. 19

Table 6. LAN Connector LED States ................................................................................................................... 27

Table 7. Effects of Pressing the Power Switch ............................................................................................... 30

Table 8. Power States and Targeted System Power ................................................................................... 31

Table 9. Wake-up Devices and Events .............................................................................................................. 32

Table 10. HDMI CEC expected behavior ............................................................................................................ 35

Table 11. Headers and Connectors Shown in Figure 12 ........................................................................... 39

Table 12. Connectors and Headers Shown in Figure 13 ........................................................................... 41

Table 13. VGA Header .............................................................................................................................................. 42

Table 14. SATA Power Header (1.25 mm Pitch) ............................................................................................ 42

Table 15. Single-Port Internal USB 2.0 Headers (1.25 mm Pitch) ......................................................... 42

Table 16. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch).......................................... 43

Table 17. Front Panel HDD LED Ring Connector (1.25 mm Pitch) ........................................................ 43

Table 18. Consumer Electronics Control (CEC) Connector (1.25 mm Pitch) .................................... 43

Table 19. M.2 2230 Module (Mechanical Key E) Connector .................................................................... 43

Table 20. SDXC Card Reader Connector .......................................................................................................... 45

Table 21. Auxiliary Power Connector ................................................................................................................ 46

Table 22. Front Panel Header (2.0 mm Pitch) ................................................................................................ 47

Table 23. States for a One-Color Power LED ................................................................................................. 48

Table 24. States for a Dual-Color Power LED ................................................................................................ 48

Table 25. BIOS Security Jumper Settings ........................................................................................................ 51

Table 26. Fan Header Current Capability ......................................................................................................... 53

Table 27. Thermal Considerations for Components ................................................................................... 55

Table 28. Tcontrol Values for Components ................................................................................................... 55

Table 29. Environmental Specifications ........................................................................................................... 56

Table 30. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 59

Table 31. Boot Device Menu Options ................................................................................................................ 60

Table 32. Master Key and User Hard Drive Password Functions ........................................................... 62

Table 33. Supervisor and User Password Functions................................................................................... 63

Table 34. Front-panel Power LED Blink Codes ............................................................................................. 64

Table 35. BIOS Error Messages ............................................................................................................................ 64

Table 36. Components Shown in Figure 20 ................................................................................................... 65

Table 37. Components Shown in Figure 21 ................................................................................................... 66

Form Factor

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

Processor

 Soldered-down quad-core Intel

Celeron® processor J3455 with up to 10 W TDP

― Intel

HD Graphics 500

― Integrated memory controller ― Integrated PCH

Memory

 Support for DDR3L 1600/1866 MHz SO-DIMMs  Support for 1600/1866 MHz memory speeds  Support for 4 Gb and 8 Gb memory technology  Support for up to 8 GB of system memory with two SO-DIMMs  Support for non-ECC memory  Support for 1.35 V low voltage JEDEC memory  2 GB DDR3L 1600 MHz SO-DIMM pre-installed (included in Intel NUC Kit

NUC6CAYS only)

Graphics

 Integrated graphics support with Intel

Graphics Technology:

― High Definition Multimedia Interface* (HDMI*) 2.0 full-sized back panel

connector

― VGA header (a VGA cable is provided with the Intel NUC kits)

Audio

 Intel® High Definition (Intel

HD) Audio via the HDMI v2.0 interface

 Realtek ALC283 HD Audio via a stereo microphone/headphone 3.5 mm jack on the

front panel

 Compressed 5.1/7.1 digital audio through a mini-TOSLINK jack on the back panel  Digital microphone (DMIC) array header for support of digital voice assistants, such

as Microsoft* Cortana (dual digital array microphones are included with Intel NUC Kit NUCC6AYH and Intel NUC Kit NUC6CAYS)

Peripheral Interfaces

 USB 3.0 ports:

― Two ports are implemented with external front panel connectors (one blue and

one amber charging capable)

― Two ports are implemented with external back panel connectors (blue)

 USB 2.0 ports:

― Two ports via two single-port internal 1x4 1.25 mm pitch headers (white) ― One port is reserved for an M.2 2230 Type E Module

 Consumer Infrared (CIR)

Storage

 One SATA 6.0 Gb/s port (black)

― Supports one 2.5“ SSD or HDD up to 9.5mm

 One full-sized SDXC slot  32 GB Embedded MultiMediaCard (e·MMC) onboard storage module (included in

Intel NUC Kit NUC6CAYS only)

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

continued

Expansion Capabilities

One M.2 Module supporting M.2 2230 cards (key type E) (prepopulated with Intel® Dual Band Wireless-AC 3168 module)

BIOS

 Intel

BIOS resident in the Serial Peripheral Interface (SPI) Flash device

 Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and

System Management BIOS (SMBIOS)

LAN Support

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Realtek* 8111HN Gigabit Ethernet Controller

Hardware Monitor Subsystem

Hardware monitoring subsystem, based on an ITE IT8987D embedded controller, including:

 Voltage sense to detect out of range power supply voltages  Thermal sense to detect out of range thermal values  One processor fan header  Fan sense input used to monitor fan activity  Simple fan speed control

Wireless

Intel® Dual Band Wireless-AC 3168 module

 Intel’s 3

-generation 802.11ac, Dual Band, 1x1 Wi-Fi + Dual Mode Bluetooth 4.2

 Maximum Transfer speed up to 433Mbps  Supports Intel® Smart Connect Technology  Pre-installed in M.2 2230 slot

Operating System

Supports Microsoft* Windows* 10 Home and Microsoft* Windows* 10 Pro  Intel NUC Kit NUC6CAYS comes with Windows 10 Home pre-installed on the eMMC

storage device

 Other operating system (OS) support may be available. Please check your OS

distributor for support details.

Additional Features

 Integrated HDMI CEC  Intel® Platform Trust Technology

Table 1. Feature Summary (continued)

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC6CAYB.

Product Description

Figure 1. Major Board Components (Top)

Item from Figure 1

Description

Battery

Front panel header

Thermal solution

Processor fan header

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC6CAYB.

Figure 2. Major Board Components (Bottom)

Item from Figure 2

Description

Back panel connectors

Front panel HDD LED ring connector (HDD_LED) (1.25 mm pitch)

Digital microphone array (DMICS) connector (1.25 mm pitch)

VGA header (2.0 mm pitch)

Auxiliary power connector (AUX_PWR) (1.25 mm pitch)

M.2 2230 Module socket (with Intel® Dual Band Wireless-AC 3168 card installed)

BIOS security jumper

SDXC slot

I, J

Front panel single-port USB 2.0 connector (1.25 mm pitch)

Consumer Infrared (CIR) sensor

SATA 6.0 Gb/s connector

Front panel USB 3.0 connector, charging capable (amber)

SATA power connector (1.25 mm pitch)

Front panel USB 3.0 connector (blue)

Front panel stereo speaker/headphone/microphone jack

Power button / power LED

Consumer Electronic Control (CEC) connector

Dual DDR3L SO-DIMM sockets (SO-DIMM shown for illustration purposes; SO-DIMM supplied with Intel NUC Kit NUC6CAYS only)

Table 3. Components Shown in Figure 2

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Product Description

Figure 3. Block Diagram

To find information about…

Visit this World Wide Web site:

Intel NUC Board NUC6CAYB

http://www.intel.com/NUC

NUC Board Support

http://www.intel.com/NUCSupport

Available configurations for Intel NUC Board NUC6CAYB

http://ark.intel.com

BIOS and driver updates

http://downloadcenter.intel.com

Tested memory

http://www.intel.com/NUCSupport

Integration information

http://www.intel.com/NUCSupport

1.2 Online Support

1.3 Processor

Intel NUC Board NUC6CAYB has a soldered-down System-on-a-Chip (SoC), which consists of a quad-core Intel Celeron processor J3455 with up to 10 W TDP.

 Integrated Intel HD Graphics 500  Integrated memory controller  Integrated PCH

NOTE

This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 53 for information on power supply requirements for this board.

Product Description

SO-DIMM Capacity

Configuration

(Note)

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

2048 MB

4 Gbit

512 M x4/empty

4096 MB

4 Gbit

512 M x4/512 M x4

4096 MB

8 Gbit

1024 M x4/empty

8192 MB

4 Gbit

512 M x8/512 M x8

8192 MB

8 Gbit

1024 M x4/1024 M x4

SO-DIMM Capacity

Configuration

(Note)

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

1024 MB

1 Gbit

128 M x8/empty

2048 MB

1 Gbit

128 M x8/128 M x8

2048 MB

2 Gbit

256 M x8/empty

4096 MB

2 Gbit

256 M x8/256 M x8

1.4 System Memory

The board has two 204-pin SO-DIMM sockets and supports the following memory features:

 1.35 V DDR3L 1600/1866 MHz SDRAM non-ECC SO-DIMM with gold plated contacts on

Intel Celeron processor J3455

 Two memory channels  Unbuffered, single-sided or double-sided SO-DIMMs using 4 Gb or 8 Gb technology

(density)

 8 GB maximum total system memory (with 4 Gb or 8 Gb memory technology). Refer to

Section 2.1.1 on page 37 for information on the total amount of addressable memory.

 Minimum recommended total system memory: 2048 MB  Serial Presence Detect  Optional 2 GB DDR3L 1600 MHz SO-DIMM pre-installed (included in Intel NUC Kit

NUC6CAYS only)

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

NOTE

Intel NUC Board NUC6CAYB supports only 4 Gb and 8 Gb memory technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM configurations. Table 5 lists the SO-DIMM configurations that are not supported.

Table 4. Supported Memory Configurations

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Table 5. Unsupported Memory Configurations

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

For information about…

Refer to:

Tested Memory

http://www.intel.com/NUCSupport

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

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