Intel NUC11PH Specifications

i

Intel® NUC Kit/Mini PC
NUC11PHKi7C

Technical Product Specification

Regulatory Models: NUC11PH (Kit, Mini PC)

January 2021

Revision 1.0

Intel® NUC Board NUC11PH{X} may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC11PH{X} Specification Update.

Revision History

Revision

Revision History

Date

0.1

Preliminary release of the Intel NUC NUC11PH{X} Technical Product Specification

January 2021

1.0

Release of the Intel NUC NUC11PH{X} Technical Product Specification

Disclaimer

This product specification applies to only the standard Intel NUC Board NUC11PH{X} with BIOS identifier
PHTGL579.00XX.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.

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USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
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ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC
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may not be supported without further evaluation by Intel.

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not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or

incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published
specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
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* Other names and brands may be claimed as the property of others.

Copyright © 2021 Intel Corporation. All rights reserved.

Contents

iii

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for Intel® NUC Kits NUC11PH{X}. Some
features are only available on Kit SKUs.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel® NUC Kit NUC11PH{X}
and its components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter

Description

1

An overview of the features and specifications of the Intel® NUC NUC11PH{X}

2

The figures, layouts, and physical description of the Intel® NUC NUC11PH{X} Board

3

Detailed descriptions of the features and specifications

4

Technical references and considerations

5

An overview of BIOS features and specifications of the Intel® NUC NUC11PH{X}

Typographical Conventions

This section contains information about the conventions used in this specification. Not all these
symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Other Common Notation

#

Used after a signal name to identify an active-low signal (such as USBP0#)

GB

Gigabyte (1,073,741,824 bytes)

GB/s

Gigabytes per second

Gb/s

Gigabits per second

KB

Kilobyte (1024 bytes)

Kb

Kilobit (1024 bits)

kb/s

1000 bits per second

MB

Megabyte (1,048,576 bytes)

MB/s

Megabytes per second

Mb

Megabit (1,048,576 bits)

Mb/s

Megabits per second

TDP

Thermal Design Power

xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V

Volts. Voltages are DC unless otherwise specified.

x.x A

Amperes.

*

This symbol is used to indicate third-party brands and names that are the property of their respective
owners.

Contents

v

Production Identification Information

Intel® NUC Products NUC11PH{X} Identification Information

Product Name

Intel® NUC Board

NUC11PHKi7C

NUC11PHi7C

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to
the Intel NUC Kit/Mini PC NUC11PH{X}.

Specification Changes or Clarifications

Date

Type of Change

Description of Changes or Clarifications

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See

http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

Online Support

To Find Information About…

Visit this World Wide Web site:

Intel NUC Kit/Mini PC NUC11PH{X}

http://www.intel.com/NUC

Intel NUC Kit/Mini PC Support

http://www.intel.com/NUCSupport

High level details for Intel NUC Kit/Mini PC
NUC11PH{X}

https://ark.intel.com

BIOS and driver updates

https://downloadcenter.intel.com

Tested memory

http://www.intel.com/NUCSupport

Integration information

http://www.intel.com/NUCSupport

Processor datasheet

https://ark.intel.com

Regulatory documentation

https://www.intel.com.tw/content/www/tw/zh/supp
ort/articles/000057855.html

Table of Contents

1 Product Description .................................................................................................. 9

1.1 Overview ......................................................................................................................................................... 9

1.1.1 Summary of Mini PC SKUs .................................................................................................... 9

1.1.2 Summary of Kit SKUs .............................................................................................................. 9

1.1.3 Feature Summary .................................................................................................................. 10

2 Product Layout ........................................................................................................ 13

2.1 Board Layout .............................................................................................................................................. 13

2.1.1 Board Layout (TOP) ............................................................................................................... 13

2.1.2 Board Layout (Bottom) ........................................................................................................ 14

2.1.3 Front Panel ............................................................................................................................... 14

2.1.4 Back Panel ................................................................................................................................ 15

2.1.5 Block Diagram ......................................................................................................................... 16

3 Feature Descriptions .............................................................................................. 17

3.1 System Memory ........................................................................................................................................ 17

3.1.1 Intel® NUC Mini PC Memory Information ..................................................................... 17

3.2 Processor Graphics Subsystem .......................................................................................................... 17

3.2.1 General Power and Memory Guidance for Optimal Graphics Performance . 17

3.2.2 Intel® Iris Xe Graphics ........................................................................................................... 17

3.2.3 Intel® UHD Graphics for 11th Gen Intel Processors .................................................. 18

3.3 Integrated Audio ....................................................................................................................................... 18

3.4 SATA Interface ........................................................................................................................................... 18

3.5 Real-Time Clock Subsystem ................................................................................................................ 18

3.6 LAN Subsystem ......................................................................................................................................... 19

3.6.1 RJ-45 LAN Connector with Integrated LEDs .............................................................. 19

3.7 Hardware Management Subsystem ................................................................................................. 20

3.7.1 Fan Monitoring ........................................................................................................................ 20

3.7.2 System States and Power States .................................................................................... 20

4 Technical Reference ................................................ Error! Bookmark not defined.

4.1 Connectors and Headers....................................................................................................................... 22

4.1.1 Signal Tables for the Connectors and Headers ........................................................ 22

4.2 Mechanical Considerations .................................................................................................................. 28

4.2.1 Form Factor .............................................................................................................................. 28

4.3 Thermal Considerations ........................................................................................................................ 29

4.4 Reliability ..................................................................................................................................................... 30

4.5 Environmental ........................................................................................................................................... 30

Contents

vii

5 Overview of BIOS Features ................................................................................... 32

5.1 Introduction ................................................................................................................................................ 32

5.2 Legacy USB Support ............................................................................................................................... 32

5.3 BIOS Updates ............................................................................................................................................. 32

5.3.1 BIOS Recovery ......................................................................................................................... 32

5.4 Boot Options .............................................................................................................................................. 33

5.4.1 Boot Device Selection During Post................................................................................. 33

5.4.2 Power Button Menu .............................................................................................................. 33

5.5 Hard Disk Drive Password Security Feature .................................................................................. 34

5.6 BIOS Security Features .......................................................................................................................... 35

5.7 BIOS Error Messages ............................................................................................................................... 36

List of Figures

Figure 1. Major Board Components (Bottom) ................................................................................................. 13

Figure 2. Front Panel Connectors ........................................................................................................................ 14

Figure 3. Back Panel Connectors ......................................................................................................................... 15

Figure 4. Block Diagram ........................................................................................................................................... 16

Figure 5. LAN Connector LED Locations........................................................................................................... 19

Figure 6. Common IO Header ............................................................................................................................... 25

Figure 7. Location of the BIOS Security Jumper ........................................................................................... 26

Figure 8. System Dimensions ................................................................................................................................. 28

List of Tables

Table 1. Feature Summary ..................................................................................................................................... 10

Table 2. Additional Features .................................................................................................................................. 12

Table 3. Components Shown in Figure 1 .......................................................................................................... 13

Table 4. Components Shown in Figure 2 ............................................................................................................. 6

Table 5. Components Shown in Figure 3 ............................................................................................................. 7

Table 6. LAN Connector LED States .................................................................................................................... 11

Table 7. Systems States ........................................................................................................................................... 12

Table 8. Wake-up Devices and Events ............................................................................................................... 12

Table 9. SATA Combined Data/Power Header ............................................................................................... 15

Table 10. M.2 2280 Module (Mechanical Key M) Connector .................................................................... 15

Table 11. M.2 2280 Module (Mechanical Key E) Connector ..................................................................... 17

Table 12. Front Panel Header (2.0 mm Pitch) ................................................................................................. 17

Table 13. BIOS Security Jumper Settings ......................................................................................................... 17

Table 14. Fan Header Current Capability .......................................................................................................... 26

Table 15. Enviromental Specs ............................................................................................................................... 20

Table 16. Acceptable Drives/Media Type for BIOS Recovery................................................................... 25

Table 17. Power Buttons .......................................................................................................................................... 26

Table 18. Master Key and User Hard Disk Drive Password Functions .................................................. 27

Table 19. Supervisor and User Password Functions .................................................................................... 25

Table 20. Power Buttons .......................................................................................................................................... 26

9

1 Product Description

1.1 Overview

1.1.1 Summary of Mini PC SKUs

Product Codes and MM#s for the SKUs below can be found at https://ark.intel.com.

Processor

GPU

AC Cord (C5)

RAM

Storage

OS

TPM

Intel® Core™ i7­1165G7

RTX2060

+ 6GB

GDDR6

US, EU, or No Cord

2 x 8 GB

512GB Optane H10

Win 10 Pro

WW

CN

Win 10 Pro

CN - - - - - -

- - -

1.1.2 Summary of Kit SKUs

Product Codes and MM#s for the SKUs below can be found at https://ark.intel.com.

Processor

GPU

AC Cord (C5)

TPM

Intel® Core™ i7-

1165G7

RTX2060 +

6GB GDDR6

US, EU, UK, IN, AU or
No Cord

WW
CN

CN

1.1.3 Feature Summary

Table 1 summarizes the major features of Intel® NUC Mini PC, Kit and Board NUC11PH{X}.

Table 1. Feature Summary

Board Dimensions

8.22in by 5.37in (208.9mm by 136.4mm)

Chassis Dimensions

Chassis: 8.93in by 5.7in by 1.57in (227mm by 145mm x 40mm) (including feet)

Processor

Intel® NUC Mini PCs, and Kits NUC11PH{X} have a soldered-down 11th generation Intel®
Core™ processor with up to 28 W TDP

• Intel® Core™ i7-1165G7 processor, MM# 99A3D0

More information about Intel® processors can be found at https://ark.intel.com

Memory

Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)
sockets

• Support for DDR4 1866/2133/2400/3200 MHz SO-DIMMs

• Support for 8 Gb and 16 Gb technology

• Support for up to 64 GB of system memory with two SO-DIMMs using 32 GB

memory modules

• Support for non-ECC memory

• Support for 1.2 V JEDEC memory only

Note: 2 Gb and 4 Gb memory technology (SDRAM Density) is not supported
More information about tested memory can be found at http://www.intel.com/NUCSupport

Graphics

• Integrated graphics support for processors Intel® Graphics Technology

• Two Type C Front and back panel connectors

• Discrete graphics support by Nvidia RTX 2060

• One Full Size High Definition Multimedia Interface* (HDMI*) Back panel

connectors

• One Mini DisplayPort* back panel connectors

• Two Type C Front and back panel connectors

Audio

Audio via digital display outputs

• The following audio technologies are supported by the HDMI interfaces 192kHz/16-

bit or 176. kHz/24-bit, 32 Channel

• When using an encoded format (such as DTS-HD MA or Dolby True HD) the board

supports a single 7.1 stream. When using an un-encoded format, the board supports
8 discrete, un-encoded channels per HDMI port simultaneously, for a total of 16
discrete/un-encoded channels.

More information about software and drivers can be found at

https://downloadcenter.intel.com

Storage

One M.2 PCIe Gen4 connector supporting M.2 22x80 (key type M) for NVMe only
One M.2 connector supporting M.2 22x42 (key type B) for SATA SSD, PCIe x1 or USB 3.2
expandability

Technical Reference

11

Communication

Intel® Wi-Fi 6 AX201 (Gig+) M.2 2230 add-in card via M.2 2230 (key type E) connector

• 802.11ax, Dual Band, 2x2 Wi-Fi + Bluetooth v5.1

• Maximum transfer speed up to 2.4 Gbps

• Supports PCIe and USB

More information about Intel® wireless products can be found at https://ark.intel.com
To obtain drivers visit https://downloadcenter.intel.com

Gigabit (10/100/1000/2500 Mbps) LAN subsystem using the Intel® i255-LM Gigabit
Ethernet Controller

• PCIe 3.1 5GT/s support for x1 width (Lane)

• Single-port integrated multi-gigabit (up to 2.5G) – standard IEEE 802.3 Ethernet

interface for 2500BASE-T, 1000BASE-T, 100BASE-TX, 10BASE-TE connections (IEEE

802.3, 802.3u, 802.3bz, and 802.3ab)

• Supports Time Sensitive Networking (TSN) IEEE 802.1Qbu, 802.3br, 802.1Qbv,

802.1AS-REV, 802.1p,Q, and 802.1Qav

• Full wake up support

• Supports for packets up to 9.5 KB (Jumbo Frames)

• Support for two RJ45 ports with the Dual LAN chassis option

More information about Intel® Ethernet controllers can be found at https://ark.intel.com
To obtain drivers visit https://downloadcenter.intel.com

Thunderbolt™

2 x Thunderbolt™ ports (front and back panel)

• USB4 compliant

• 15W and18W port bus power

• Thunderbolt networking

• Protocol support:

PD Modes Supported: TBT3, USB4, USB3, DP-alt/MF

TBT3 Tx/Rx rates: 40G (2x 20.625), 20G (2x 10.3125)
PCI Express Tunnel: 32 Gbps

USB4 Tx/Rx rates: 40G (2x 20), 20G (2x 10)
USB3 Native: 10Gbps (1x10G)
USB3 Tunnel: 10Gbps
USB2: 480 Mpbs

DP1.4a, HBR3
DisplayPort Tunneling:

Port 2: 2 streams (~35 Gbps, Thunderbolt 4 certified)
Port 1: 1 stream (~17 Gbps, Thunderbolt 3 certified)

More information about the location of the Thunderbolt™ ports can be found in Section

2.1.4 later in this document

USB Ports and Headers

2 x USB 4 ports via Type C/Thunderbolt™ (Front and back panel)
6 x USB 3.2 Gen 2 ports (2 front panel and 4 back panel)
1 x USB 2.0 port (M.2 slot)

More information about the location of the USB ports and headers can be found in Section
2 later in this document
More information about the pinout of the USB ports and headers can be found in Section

4.1 later in this document

Power

AC Adapter

• ships with a 230W 19.5V adapter

Power Input

• 12V

DC

to 24V

DC

+/- 5% with DC transient voltage protection

More information about the estimated power budget can be found in Section Error! R

eference source not found. later in this document

Operating
Temperatures

0-40C external ambient operating temperature
More information about environmental specifications can be found in Section 4.5 later in
this document

BIOS

Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System
Management BIOS (SMBIOS)

Operating System (Mini
PCs only)

Intel® NUC Mini PCs NUC11PH{X} can be purchased with Windows 10 Pro 64-bit
preinstalled

More information about available Intel® NUC Mini PCs NUC11PH{X} can be found in Section

1.1.1 Summary of Mini PC SKUs. For Product Codes and MM#s visit https://ark.intel.com

Hardware Monitor
Subsystem

Hardware monitoring subsystem including:
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
One processor fan header
Fan sense input used to monitor fan activity
Fan speed control

Table 2. Additional Features

Chassis Expandability

No Chassis Expansion available

HDMI CEC API

CEC commands are supported on all HDMI ports for display power on/off and the BIOS
provides an option to enable/disable the onboard CEC controls

Sustained Operation

Qualified for 24x7 sustained operation

Auto CMOS Reset

Delayed AC Start

There is a short delay after AC power is applied before unit is ready to power-up to protect
the system after AC loss.

Intel® Transparent
Supply Chain

System level visibility and traceability of hardware and firmware that assures platform
integrity throughout the compute lifecycle

More information about Intel® TSC is available on

https://www.intel.com/content/www/us/en/products/docs/servers/transparent-supply­chain.html

Technical Reference

13

2 Product Layout

2.1 Board Layout

2.1.1 Board Layout (TOP)

Figure 1 shows the location of the major components on the bottom of Intel® NUC Board
NUC11PH{X}.

Figure 1. Major Board Components (Top)

Table 3. Components Shown in Figure 1

Item from Figure 1

Description

A

Fan Connector

B

M.2 2280 Module Connector (Key Type B) (NVMe/SATA)

C

M.2 2280 Module Connector (Key Type M) (NVMe Only)

D

Fan Connector

E

BIOS Security Header

F

Common I/O Header

G

DDR4 SO-DIMM 1 Socket

H

DDR4 SO-DIMM 0 Socket

I

AX201D Wifi Module

J

DMIC connector

K

CMOS Battery

L

RGB Header

2.1.2 Board Layout (Bottom)

No user configurable components on the bottom-side of Intel® NUC Board NUC11PH{X}.

2.1.3 Front Panel

Figure 2. Front Panel Connectors

Table 4. Components Shown in Figure 2

Item from Figure 2

Description

A

IR Sensor

B

SD Card Reader

C

DMICs

D

Thunderbolt USB-C

E

USB 3.2 gen 2

F

USB 3.2 gen 2 2A peak current support

G

Audio

H

Power Button

Technical Reference

15

2.1.4 Back Panel

Figure 3. Back Panel Connectors

Table 5. Components Shown in Figure 3

Item from Figure 2

Description

A

Kensington Lock

B

Optical audio port

C

Ethernet

D

USB 3.2 gen 2

E

Thunderbolt USB-C

F

HDMI

G

Mini Display Port

H

Power Input

2.1.5 Block Diagram

Figure 4. Block Diagram

Technical Reference

17

3 Feature Descriptions

3.1 System Memory

Figure 1 illustrates the memory channel and SO-DIMM configuration.

3.1.1 Intel® NUC Mini PC Memory Information

Intel® NUC Mini PCs NUC11PH{X} can be purchased with 2 x 8 GB DDR4 3200 MHz SODIMMs
included. More information about available Intel® NUC Mini PCs NUC11PH{X} can be found in
Section 1.1.1 Summary of Mini PC SKUs. For Product Codes and MM#s visit https://ark.intel.com.

3.2 Processor Graphics Subsystem

Intel® NUC Boards NUC11PH{X} support Intel® Iris® Xe Graphics.

3.2.1 General Power and Memory Guidance for Optimal Graphics

Performance

Intel® NUC Boards NUC11PH{X} graphics performance is significantly impacted by power levels
and memory selection. For the best performance:

• Allow for higher system power level budgets

• Recommend DDR4-3200 128bit 2Rx8

o 128bit (Dual Channel) memory is better performing than 64bit (Single Channel)

memory

o A full list of tested memory modules are available on

https://compatibleproducts.intel.com

3.2.2 Intel® Iris Xe Graphics

Intel® Iris® Xe Graphics supports the following features:

• The HW decode is exposed by the graphics driver using the following APIs: Direct3D* 9 Video

API (DXVA2), Direct3D11 Video API, Intel Media SDK, MFT filters, Intel VA API

o Full HW accelerated video decoding for AVC/VC1/MPEG2/HEVC/VP9/JPEG/AV1

• The HW encode is exposed by the graphics driver using the following APIs: Intel Media SDK,

MFT filters

o Full HW accelerated video encoding for AVC/HEVC/VP9/JPEG

• Max HDMI resolution 4096x2304 at 60Hz

• Max DP resolution 7680x4320 at 60Hz

• Up to four simultaneous displays

• Four display pipes – supporting blending, color adjustments, scaling and dithering

• Direct 3D* 2015, Direct3D* 12

• OpenGL* 4.5

• Open CL* 2.1

• HDR (High Dynamic Range) support

• HDCP (High-bandwidth Digital Content Protection) 2.2 and 1.4

3.2.3 Intel® UHD Graphics for 11

th

Gen Intel Processors

Intel® UHD Graphics for 11th Gen Intel Processors features the following:

• DirectX* 12.1 support

• OpenGL* 4.5 support

• Max HDMI resolution 4096x2304 at 60Hz

• Max DP resolution 7680x4320 at 60Hz

• OpenCL* 2.0 support

3.3 Integrated Audio

HDMI and DP interfaces can carry audio along with video. The processor supports three HD audio
streams over four digital ports simultaneously. The processor supports the following audio
formats over HDMI and DP:

• AC-3 Dolby* Digital

• Dolby* Digital Plus

• DTS-HD*

• LPCM, 192 kHz/24 bit, 6 channel

• Dolby* TrueHD, DTS-HD Master Audio*

Audio drivers are built into the Graphics driver and are available from Intel’s website.

For information about

Refer to

Obtaining NUC software and drivers

https://downloadcenter.intel.com/

3.4 SATA Interface

The board provides the following SATA interfaces:

• One SATA 6.0 Gb/s combined Data and Power connector (blue)

The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gb/s. A
point-to-point interface is used for host to device connections.

3.5 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to  13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V
STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be notified
during the POST.

Technical Reference

19

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS
RAM (for example, the date and time) might not be accurate. Replace the battery with an
equivalent one. Error! Reference source not found. on page Error! Bookmark not defined. shows
the location of the battery.

3.6 LAN Subsystem

3.6.1 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item

Description

A

Link LED (Green)

B

Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 6 describes the LED states when the board is powered up and the LAN subsystem is
operating.

Table 6. LAN Connector LED States

LED

LED Color

LED State

Condition

Link

Green

Off

LAN link is not established

Solid

LAN link is established

Blinking

LAN activity is occurring

Data Rate

Green/Yellow

Off

10/100 Mb/s data rate is selected

Green

1000 Mb/s data rate is selected

Yellow

2500 Mb/s data rate is selected

3.7 Hardware Management Subsystem

3.7.1 Fan Monitoring

Fan monitoring can be implemented using third-party software.

3.7.2 System States and Power States

Table 7 describes the ACPI states supported by the processor.

Table 7. Systems States

State

Description

G0/S0/C0

Full On: CPU operating. Individual devices may be shut to save power. The different
CPU operating levels are defined by Cx states.

GO/S0/Cx

Cx State: CPU manages C-states by itself and can be in lower power states.

G1

Suspend-To-RAM (STR): The system context is maintained in system DRAM, but
power is shut to non-critical circuits. Memory is retained and refreshes continue. All
external clocks are shut off; RTC clock and international oscillator clocks are still
toggling.

G1/S4

Suspend-To-Disk (STD): The context of the system is maintained on the disk. All
power is then shut to the system except to the logic required to resume. Externally
appears the same as S5 but may have different wake events.

G2/S5

Soft Off: System context not maintained. All power is shut except for the logic required
to restart. A full boot is required when waking.

G3

Mechanical Off: System context not maintained. All power shut except for the RTC. No

“Wake” events are possible because the system does not have any power. This state

occurs if the user removes the batteries, turns off a mechanical switch, or if the system
power supply is at a level that is insufficient to power the “waking” logic.

3.7.2.1 Wake-up Devices and Events

Table lists the devices or specific events that can wake the computer from specific states.

Table 8. Wake-up Devices and Events

Devices/events that wake up the

system…

…from this sleep

state

Comments

Power switch

S0iX, S4, S51

RTC alarm

S0iX, S4, S51

Option for monitor to remain in sleep
state

LAN

S0iX, S4, S5

1, 3

“S5 WOL after G3” is supported; monitor
to remain in sleep state

WIFI

S0iX, S4, S5

1, 3

Bluetooth

S0iX, S41

USB

S0iX, S4, S5

1, 2, 3

Wake S4, S5 controlled by BIOS option
(not after G3)

PCIe

S0iX, S41

Via WAKE; monitor to remain in sleep
state

Technical Reference

21

HDMI CEC

S0iX, S4, S51

Wake S4, S5 controlled by BIOS option

Notes:

1. S4 implies operating system support only.

2. Will not wake from Deep S4/S5. USB S4/S5 Power is controlled by BIOS. USB S5 wake is controlled by BIOS. USB S4
wake is controlled by OS driver, not just BIOS option.

3. Windows Fast startup will block wake from LAN and USB from S5.

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides
full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.

4 Technical Reference

4.1 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel USB Type A
and Type C, front panel USB, internal USB headers, internal power header, and DC Vin jack.

All other connectors and headers are not overcurrent protected and should connect only to
devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these
connectors or headers to power devices external to the computer’s chassis. A fault in the load
presented by the external devices could cause damage to the computer, the power cable, and the
external devices themselves.

Furthermore, improper connection of USB header single wire connectors may eventually overload
the overcurrent protection and cause damage to the board.

4.1.1 Signal Tables for the Connectors and Headers

Table 9. SATA Combined Data/Power Header

Pin

Signal Name

Pin

Signal Name

1

+5V (2A total for pins 1, 2, 3, 4 (0.5A per
pin))

2

+5V (2A total for pins 1, 2, 3, 4 (0.5A per
pin))

3

+5V (2A total for pins 1, 2, 3, 4 (0.5A per
pin))

4

+5V (2A total for pins 1, 2, 3, 4 (0.5A per
pin))

5

NC 6 NC 7 NC 8 DEVSLP

9

GND

10

GND

11

SATA_RX_P

12

SATA_RX_N

13

GND

14

SATA_TX_N

15

SATA_TX_P

16

GND

Connector is vertical 0.5mm contact pitch ZIF FPC/FFC with lock

Table 10. M.2 2280 Module (Mechanical Key M) Connector

Pin

Signal Name

Pin

Signal Name

74

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

75

GND

72

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

73

GND

70

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

71

GND

68

SUSCLK(32kHz) (O)(0/3.3V)

69

PEDET (NC-PCIe)

66

Connector Key

67

N/C

64

Connector Key

65

Connector Key

62

Connector Key

63

Connector Key

Technical Reference

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60

Connector Key

61

Connector Key

58

N/C

59

Connector Key

56

N/C

57

GND

54

PEWAKE# (I/O)(0/3.3V) or N/C

55

REFCLKP

52

CLKREQ# (I/O)(0/3.3V) or N/C

53

REFCLKN

50

PERST# (O)(0/3.3V) or N/C

51

GND

48

N/C

49

PETp0

46

N/C

47

PETn0

44

N/C

45

GND

42

N/C

43

PERp0

40

N/C

41

PERn0

38

DEVSLP (O)

39

GND

36

N/C

37

PETp1

34

N/C

35

PETn1

32

N/C

33

GND

30

N/C

31

PERp1

28

N/C

29

PERn1

26

N/C

27

GND

24

N/C

25

PETp2

22

N/C

23

PETn2

20

N/C

21

GND

18

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

19

PERp2

16

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

17

PERn2

14

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

15

GND

12

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

13

PETp3

10

DAS/DSS# (I/O)/LED1# (I)(0/3.3V)

11

PETn3

8

N/C 9 GND 6 N/C 7 PERp3

4

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

5

PERn3

2

3.3V (4A total for pins 74, 72, 70, 18, 16, 14, 12, 4, 2 (0.5A per pin))

3

GND

1

GND

Table 11. M.2 2230 Module (Mechanical Key E) Connector

Pin

Signal Name

Pin

Signal Name

74

3.3V (2A total for pins 74, 72, 4, 2 (0.5A per pin))

75

GND

72

3.3V (2A total for pins 74, 72, 4, 2 (0.5A per pin))

73

WT_CLKP

70

UIM_POWER_SRC/GPIO1/PEWAKE1#

71

WT_CLKN

68

CLKREQ1#

69

GND

66

PERST1#

67

WTD0P

64

REFCLK0

65

WTD0N

62

ALERT#/A4WP_IRQ# (I)(0/3.3)

63

GND

60

I2C CLK/A4WP_I2C_CLK (O)(0/3.3)

61

WT_D1P

58

I2C DATA/A4WP_I2C_DATA (I/O)(0/3.3)

59

WT_D1N

56

W_DISABLE1# (O)(0/3.3V)

57

GND

54

W_DISABLE2# (O)(0/3.3V)

55

PEWAKE0# (I/O)(0/3.3V)

52

PERST0# (O)(0/3.3V)

53

CLKREQ0# (I/O)(0/3.3V)

50

SUSCLK(32kHz) (O)(0/3.3V)

51

GND

48

COEX1 (I/O)(0/1.8V)

49

REFCLKN0

46

COEX2(I/O)(0/1.8V)

47

REFCLKP0

44

COEX3(I/O)(0/1.8V)

45

GND

42

CLink_CLK (I/O)

43

PERn0

40

CLink_DATA (I/O)

41

PERp0

38

C-Link RESET* (I) (0/3.3V)

39

GND

36

UART RTS/BRI_DT (I) (0/1.8V)

37

PETn0

34

UART CTS (O) (0/1.8V)

35

PETp0

32

UART TXD/RGI_DT (I) (0/1.8V)

33

GND

30

Connector Key

31

Connector Key

28

Connector Key

29

Connector Key

26

Connector Key

27

Connector Key

24

Connector Key

25

Connector Key

22

UART RXD/BRI_RSP (O) (0/1.8V)

23

WGR_CLKP

20

UART WAKE# (O) (0/3.3V)

21

WGR_CLKN

18

GND/LNA_EN

19

GND

16

BT_LED (LED2#)

17

WGR_D0P

14

PCM_OUT/I2SSD_OUT/CLKREQ0

15

WGR_D0N

12

PCM_IN/I2SSD_IN

13

GND

10

PCM_SYNC/I2SWS/RF_RESET_B

11

WGR_D1P

8

PCM_CLK/I2SSCK

9

WGR_D1N

6

LED1#

7

GND

4

3.3V (2A total for pins 74, 72, 4, 2 (0.5A per pin))

5

USB_D-

2

3.3V (2A total for pins 74, 72, 4, 2 (0.5A per pin))

3

USB_D+

1

GND

4.1.1.1 Common IO Header (1.25 mm Pitch)

This section describes the functions of the front panel header. Table 12 lists the signal names of
the front panel header. Figure is a connection diagram for the front panel header.

Table 12. Front Panel Header (2.0 mm Pitch)

Pin

Description

Pin

Description

1

USB_VBUS

2

GND

3

USB1_N

4

USB2_P

5

USB1_P

6

USB2_N

7

GND 8 USB_VBUS

9

HDD_LED_P

10

PWR_LED_P

Technical Reference

25

11

HDD_LED_N

12

PWR_LED_N

13

RST_N

14

PWR_BTN_N

15

GND

16

CEC

17

5V_STBY

18

VCC5

19

RSVD

20

GND

Figure 6. Common IO Header (1.25 mm Pitch)

4.1.1.2 BIOS Security Jumper

CAUTION

Do not move a jumper with the power on. Always turn off the power and unplug the power cord
from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure shows the location of the BIOS Security Jumper. The 3-pin jumper determines the BIOS
Security program’s mode.

Figure 7. Location of the BIOS Security Jumper

Table 13 describes the jumper settings for the three modes: normal, lockdown, and configuration.

Table 13. BIOS Security Jumper Settings

Function/Mode

Jumper Setting

Configuration

Normal

1-2

The BIOS uses current configuration information and passwords for
booting.

Lockdown

2-3

The BIOS uses current configuration information and passwords for
booting, except:

• All POST Hotkeys are suppressed (prompts are not displayed and
keys are not accepted. For example, F2 for Setup, F10 for the Boot
Menu).

• Power Button Menu is not available (see Section 5.4.2 Power Button
Menu).

BIOS updates are not available except for automatic Recovery due to
flash corruption.

Technical Reference

27

Configuration

None

BIOS Recovery Update process if a matching *.bio file is found. Recovery
Update can be cancelled by pressing the Esc key.
If the Recovery Update was cancelled or a matching *.bio file was not
found, a Config Menu will be displayed. The Config Menu consists of the
following (followed by the Power Button Menu selections):

[1] Suppress this menu until the BIOS Security Jumper is
replaced.
[2] Clear BIOS User and Supervisor Passwords.
[3] Reset Intel® AMT to default factory settings.
[4] Clear Trusted Platform Module.
Warning: Data encrypted with the TPM will no longer be
accessible if the TPM is cleared.
[F2] Intel® Visual BIOS.
[F4] BIOS Recovery.

See Section 5.4.2 Power Button Menu

4.1.1.3 Fan Header Current Capability

Table 14 lists the current capability of the fan headers.

Table 14. Fan Header Current Capability

Fan Header

Maximum Available Current

Processor fan

1 A

4.1.1.4 Power Supply Connectors

The board has the following power supply connectors:

• External Power Supply – the board can be powered through a 12-24 V DC connector on the

back panel. The back-panel DC connector is compatible with a 5.5 mm/OD (outer diameter)
and 2.5 mm/ID (inner diameter) plug, where the inner contact is +12-24 V DC and the shell is
GND. The maximum current rating is 10 A.

NOTE

External power voltage, 12-24 (±5%) V DC, is dependent on the type of power brick
used. System power requirements will depend on actual system configurations chosen

by the integrator, as well as end user expansion preferences. It is the system integrator’s

responsibility to ensure an appropriate power budget for the system configuration is
properly assessed based on the system-level components chosen.

4.2 Mechanical Considerations

4.2.1 Form Factor

Figure 8 illustrates the mechanical form factor for the system. Dimensions are given in inches
[millimeters]. The outer dimensions are 8.93in by 5.7in by 1.57in [227 millimeters by
145 millimeters by 40 millimeters].

Figure 8. System Dimensions

Technical Reference

29

4.3 Thermal Considerations

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board.

All responsibility for determining the adequacy of any thermal or system design remains solely
with the system integrator. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal
performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 4.5.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in shorter than expected product lifetime.

4.4 Reliability

The demonstrated Mean Time Between Failures (MTBF) is done through 24/7 testing. Full Intel®
NUC systems in chassis with memory, SSD or HDD, and fans are ran at 100% on time for 90 days
continuously while running system wide stress inducing software in a 40 °C ambient air
temperature chamber. The demonstrated MTBF for Intel NUC Board NUC11PH{X} is >50,000
hours.

4.5 Environmental

Table 16 lists the environmental specifications for the board.

CAUTION

If the external ambient temperature exceeds 40 oC, further thermal testing is required to ensure
components do not exceed their maximum operating temperature.

Table 16. Environmental Specifications

Parameter

Specification

Temperature

Sustained Storage Limits (i.e.
warehouse)

-20 C to +40 C
Short Duration Limits (i.e. shipping)

-40 °C to +60 °C

Ambient Operating – NUC Kit*

0 C to +40 C

Ambient Operating – NUC Board*

0 C to +40 C

* Processor performance may automatically decrease when the system
operates in the top 5 °C of the ambient operating temperature ranges above.

Shock (Board)

Unpackaged

50 g trapezoidal waveform

Velocity change of 170 inches/s²

Packaged

Free fall package drop machine set to the height determined by the weight
of the package.

Product
Weight
(pounds)

Non-palletized Product
drop height (inches)

Palletized drop heights (single
product) (inches)
<20

36

N/A

21-40

30

N/A 41-80

24

N/A 81-100

18

12 100-120

12

9

Vibration (System)

Unpackaged

Random profile 5 Hz to 40 Hz @ 0.015 g^2/Hz to 500 Hz @ 0.00015
g^2/Hz(slope down)

Technical Reference

31

Input acceleration is 1.09 gRMS

Packaged

Random profile 5 Hz to 40 Hz @ 0.015 g^2/Hz to 500 Hz @ 0.00015
g^2/Hz(slope down)

Input acceleration is 1.09 gRMS

Note: The operating temperature of the board may be determined by measuring the air temperature from the junction of

the heatsink fins and fan, next to the attachment screw, in a closed chassis, while the system is in operation.

Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum

operating temperature specified. It is recommended that the board temperature be at least room temperature
before attempting to power on the board. The operating and non-operating environment must avoid condensing
humidity.

5 Overview of BIOS Features

5.1 Introduction

The board uses an Intel AMI BIOS core that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated through multiple methods (see Section 5.3). The SPI
Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM
information, and Plug and Play support. The SPI Flash includes a 32 MB flash memory device.

The BIOS Setup program can be used to view and change the identification information and the
BIOS settings for the system. The BIOS Setup program is accessed by pressing <F2> after the
POST memory test beings and before the operating system boots.

5.2 Legacy USB Support

Legacy USB support enables the USB devices to be used even when the operating system’s USB

drivers are not yet available. Legacy USB support is used to access the BIOS setup program and to
install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

To install an operating system that supports USB, verify that Legacy USB support in the BIOS
Setup program is set to Enabled and follow the operating system’s installation instructions.

5.3 BIOS Updates

The BIOS can be updated using one of the following methods:

1. Express BIOS (Windows-based) Update

2. F7 Update

3. Power Button Menu Update

4. iFlash Update

5. UEFI Shell Update

More information and instructions on how to use each of these methods can be found at BIOS

Update and Recovery Instructions. All BIOS update files for Intel NUCs are available on Download
Center.

5.3.1 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs the
BIOS could be unstable. Table 16 lists the drives and media types that can be used for BIOS
recovery. The BIOS recovery media does not need to be made bootable. More information about
BIOS recovery methods and instructions can be found at BIOS Update and Recovery Instructions.

Table 16. Acceptable Drives/Media Type for BIOS Recovery

Media Type

(Note)

Can be used for BIOS recovery?

Hard disk drive (connected to USB)

Yes

USB flash drive

Yes

NVME SSD (M.2 interface)

Yes

Technical Reference

33

NOTE Supported file systems for BIOS recovery: NTFS (sparse, compressed, or encrypted

files are not supported), FAT32, EXT

5.4 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, removeable driver, or
the network. The default setting is for the hard drive to be the first boot device, the removeable
drive second, and the network third.

NOTE The network can be selected as a boot device. This selection allows booting from the

onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the <F12> key
during POST automatically forces booting from the LAN. To use this key during POST, the User

Access Level in the BIOS Setup program’s Security menu must be set to Full.

5.4.1 Boot Device Selection During Post

Pressing the <F10> key during POST causes a boot device menu to be displayed. The menu
displays the list of available boot devices.

5.4.2 Power Button Menu

As an alternative to Configuration Mode or normal POST hotkeys, the user can use the power
button to access a menu with BIOS and boot options. The Power Button Menu is accessible via
the following sequence:

1. System is in S4/S5 (not G3)

2. User pushes the power button and holds it down for 3 seconds

3. The Front Panel Power Button LED will be on for the first 3 seconds. After 3 seconds, the LED

will begin to blink in the following pattern: 0.25 seconds off, 0.25 seconds on, 0.25 seconds
off to signal the user to release the power button

4. User releases the power button before the 4-second shutdown override

If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD where
possible. At the point where Setup Entry/Boot would be in the normal boot path, the BIOS
will display the following prompt and wait for a keystroke:

If an unrecognized key is hit, then the BIOS will do nothing and wait for another keystroke. If
one of the listed hotkeys is hit, the BIOS will follow the indicated boot path. Password
requirements must still be honored.

Table 17. Power Button Menu Options

Keystroke

Option

Description

[ESC]

Normal Boot

[F2]

BIOS Setup Menu

[F3]

Disable Fast Boot

Note: Will only be displayed if at least one Fast Boot optimization is
enabled.

If Disable Fast Boot is selected, the BIOS will disable all Fast Boot
optimizations and reset the system.

[F4]

BIOS Recovery

The BIOS will search for a matching .CAP file from the \EFI\Intel folder in
the supported media with the supported file system. If a matching
recovery capsule is found, the BIOS will display the following:

BIOS will Recover to <BIOSID> in 20 seconds.
[ESC] Cancel Recovery

Recovery will proceed if not cancelled via the ESC key within 20 seconds.
The BIOS shall display the recovery progress. If a BIOS .CAP file was not
detected (or the BIOS Recovery was cancelled) then the BIOS will reset
the system and continue normally to POST.

[F5]

Restore BIOS Settings

The BIOS will restore the current setup settings and the current defaults
to the build time defaults in the case of a boot issue caused by setup
variable changes.

[F7]

Update BIOS

BIOS Update during the BDS phrase. The BIOS will update independent of
any OS loading and provides a menu UI accessible during boot up. This is
not a recovery tool and will not overwrite a corrupt BIOS or ME firmware.

[F9]

Remote Assistance

Note: Will only be displayed if Remote Assistance is supported.

[F10]

Enter Boot Menu

[F12]

Network Boot

5.5 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks ready and write access to the hard disk
drive until the correct password is given. Hard disk drive passwords are set in BIOS Setup and are
prompted for BIOS POST. For convenient support for resuming from S3, the system BIOS will
automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9.
Passwords may be up to 32 characters in length.

The User hard disk drive password, when set, will be required on each power cycle until the
Master Key or User hard disk drive password is submitted.

The Master Key hard disk drive password, when set, will not lock the drive. The Master Key hard
disk drive password exists as an unlock override if the User hard disk drive password is forgotten.
Only the User hard disk drive password, when set, will cause a hard disk to be locked on a system
power cycle. Table show the effects of setting the hard disk drive passwords.

Table 18. Master Key and User Hard Disk Drive Password Functions

Password Set

Password During Boot

Neither

None

Master only

None

User only

User only

Master and User Set

User

During every POST, if a User hard disk drive password is set, POST execution will pause with the
following prompt to force the User to enter the Master Key or the User hard disk drive password:

“Enter Hard Disk Drive Password:”

Upon successful entry of the Master Key or User hard disk drive password, the system will continue

with normal POST.

Technical Reference

35

If the hard disk drive password is not correctly entered, the system will go back to the above
prompt. The User will have three attempts to correctly enter the hard disk drive password. After
the third unsuccessful attempt, the system will halt with the following message:

“Hard Disk Drive Password Entry Error”

A manual power cycle will be required to resume system operation.

NOTE As implemented on the Intel NUC11PH{X} board, the hard disk drive password security

feature is only supported on the SATA Port 0 (M.2) or the SATA port 1 (onboard SATA connector).

5.6 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A Supervisor and User password can be set for the BIOS Setup program and
for botting the computer, with the following restrictions:

• The Supervisor password gives unrestricted access to view and change all the Setup

options in the BIOS Setup program. This is Supervisor Mode.

• The User password gives restricted access to view and change Setup options in the BIOS

Setup program. This is User Mode.

• If only the Supervisor password is set, pressing the <Enter> key at the password prompt of

the BIOS Setup program allows the user restricted access to Setup.

• If both the Supervisor and User passwords are set, users can enter either the Supervisor or

User password to access Setup. Users have access to Setup regardless to which password
is used.

• Setting the User password restricts who can boot the computer. The password prompt

will be displayed before the computer boots. If only the Supervisor password is set, the
computer boots without asking for a password. If both passwords are set, the user can
enter either password to boot the computer.

• For enhanced security, use different passwords for the Supervisor and User passwords.

• Valid password characters are A-Z, a-z, 0-9, and special characters. Passwords may be up

to 20 characters in length.

• To clear a set password, enter a blank password after entering the existing password.

Table shows the effects of setting the Supervisor password and User password. This table is for
reference only and is not displayed on the screen.

Table 19. Supervisor and User Password Functions

Password Set

Supervisor Mode

User Mode

Setup Options

Password to
Enter Setup

Password
During Boot

Neither

Any user can
change all options

Any user can change
all options

None

None

None

Supervisor only

Can change all
options

Can change a limited
number of options

Supervisor Password

Supervisor

None

User only

N/A

Can change all
options

Enter Password
Clear User Password

User

User

Supervisor and
User set

Can change all
options

Can change a limited
number of options

Supervisor Password
Enter Password

Supervisor or
User

Supervisor or
User

5.7 BIOS Error Messages

Table lists the error messages and provides a brief description of each.

Table 20. BIOS Error Messages

Error Message

Explanation

CMOS Battery Failure

The battery may be losing power. Replace the battery soon.

CMOS Checksum Error

The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to
reset values.

Memory Size Decreased

Memory size has decreased since the last boot. If no memory was removed, then the
memory may be bad.

CMOS Timer Not Set

The battery may be losing power. Replace the battery soon.

Processor Thermal Trip

Processor overheated.

Auto RTC Reset

The system triggers RTC clear to recover the system back to the normal condition from
consecutive boot failure.