Intel NUC11PH Specifications
i
Intel® NUC Kit/Mini PC
NUC11PHKi7C
Technical Product Specification
Regulatory Models: NUC11PH (Kit, Mini PC)
January 2021
Revision 1.0
Intel® NUC Board NUC11PH{X} may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC11PH{X} Specification Update.
Revision History
Revision
Revision History
Date
0.1
Preliminary release of the Intel NUC NUC11PH{X} Technical Product Specification
January 2021
1.0
Release of the Intel NUC NUC11PH{X} Technical Product Specification
Disclaimer
This product specification applies to only the standard Intel NUC Board NUC11PH{X} with BIOS identifier
PHTGL579.00XX.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
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ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for
installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC
or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc.
may not be supported without further evaluation by Intel.
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not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
order.
Intel®, the Intel® logo, Intel® NUC and Intel® Core™ are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2021 Intel Corporation. All rights reserved.
Contents
iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for Intel® NUC Kits NUC11PH{X}. Some
features are only available on Kit SKUs.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel® NUC Kit NUC11PH{X}
and its components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter
Description
1
An overview of the features and specifications of the Intel® NUC NUC11PH{X}
2
The figures, layouts, and physical description of the Intel® NUC NUC11PH{X} Board
3
Detailed descriptions of the features and specifications
4
Technical references and considerations
5
An overview of BIOS features and specifications of the Intel® NUC NUC11PH{X}
Typographical Conventions
This section contains information about the conventions used in this specification. Not all these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Other Common Notation
#
Used after a signal name to identify an active-low signal (such as USBP0#)
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
KB
Kilobyte (1024 bytes)
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/s
Megabytes per second
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
x.x A
Amperes.
*
This symbol is used to indicate third-party brands and names that are the property of their respective
owners.
Contents
v
Production Identification Information
Intel® NUC Products NUC11PH{X} Identification Information
Product Name
Intel® NUC Board
NUC11PHKi7C
NUC11PHi7C
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to
the Intel NUC Kit/Mini PC NUC11PH{X}.
Specification Changes or Clarifications
Date
Type of Change
Description of Changes or Clarifications
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.
Online Support
To Find Information About…
Visit this World Wide Web site:
Intel NUC Kit/Mini PC NUC11PH{X}
http://www.intel.com/NUC
Intel NUC Kit/Mini PC Support
http://www.intel.com/NUCSupport
High level details for Intel NUC Kit/Mini PC
NUC11PH{X}
https://ark.intel.com
BIOS and driver updates
https://downloadcenter.intel.com
Tested memory
http://www.intel.com/NUCSupport
Integration information
http://www.intel.com/NUCSupport
Processor datasheet
https://ark.intel.com
Regulatory documentation
https://www.intel.com.tw/content/www/tw/zh/supp
ort/articles/000057855.html
Table of Contents
1 Product Description .................................................................................................. 9
1.1 Overview ......................................................................................................................................................... 9
1.1.1 Summary of Mini PC SKUs .................................................................................................... 9
1.1.2 Summary of Kit SKUs .............................................................................................................. 9
1.1.3 Feature Summary .................................................................................................................. 10
2 Product Layout ........................................................................................................ 13
2.1 Board Layout .............................................................................................................................................. 13
2.1.1 Board Layout (TOP) ............................................................................................................... 13
2.1.2 Board Layout (Bottom) ........................................................................................................ 14
2.1.3 Front Panel ............................................................................................................................... 14
2.1.4 Back Panel ................................................................................................................................ 15
2.1.5 Block Diagram ......................................................................................................................... 16
3 Feature Descriptions .............................................................................................. 17
3.1 System Memory ........................................................................................................................................ 17
3.1.1 Intel® NUC Mini PC Memory Information ..................................................................... 17
3.2 Processor Graphics Subsystem .......................................................................................................... 17
3.2.1 General Power and Memory Guidance for Optimal Graphics Performance . 17
3.2.2 Intel® Iris Xe Graphics ........................................................................................................... 17
3.2.3 Intel® UHD Graphics for 11th Gen Intel Processors .................................................. 18
3.3 Integrated Audio ....................................................................................................................................... 18
3.4 SATA Interface ........................................................................................................................................... 18
3.5 Real-Time Clock Subsystem ................................................................................................................ 18
3.6 LAN Subsystem ......................................................................................................................................... 19
3.6.1 RJ-45 LAN Connector with Integrated LEDs .............................................................. 19
3.7 Hardware Management Subsystem ................................................................................................. 20
3.7.1 Fan Monitoring ........................................................................................................................ 20
3.7.2 System States and Power States .................................................................................... 20
4 Technical Reference ................................................ Error! Bookmark not defined.
4.1 Connectors and Headers....................................................................................................................... 22
4.1.1 Signal Tables for the Connectors and Headers ........................................................ 22
4.2 Mechanical Considerations .................................................................................................................. 28
4.2.1 Form Factor .............................................................................................................................. 28
4.3 Thermal Considerations ........................................................................................................................ 29
4.4 Reliability ..................................................................................................................................................... 30
4.5 Environmental ........................................................................................................................................... 30
Contents
vii
5 Overview of BIOS Features ................................................................................... 32
5.1 Introduction ................................................................................................................................................ 32
5.2 Legacy USB Support ............................................................................................................................... 32
5.3 BIOS Updates ............................................................................................................................................. 32
5.3.1 BIOS Recovery ......................................................................................................................... 32
5.4 Boot Options .............................................................................................................................................. 33
5.4.1 Boot Device Selection During Post................................................................................. 33
5.4.2 Power Button Menu .............................................................................................................. 33
5.5 Hard Disk Drive Password Security Feature .................................................................................. 34
5.6 BIOS Security Features .......................................................................................................................... 35
5.7 BIOS Error Messages ............................................................................................................................... 36
List of Figures
Figure 1. Major Board Components (Bottom) ................................................................................................. 13
Figure 2. Front Panel Connectors ........................................................................................................................ 14
Figure 3. Back Panel Connectors ......................................................................................................................... 15
Figure 4. Block Diagram ........................................................................................................................................... 16
Figure 5. LAN Connector LED Locations........................................................................................................... 19
Figure 6. Common IO Header ............................................................................................................................... 25
Figure 7. Location of the BIOS Security Jumper ........................................................................................... 26
Figure 8. System Dimensions ................................................................................................................................. 28
List of Tables
Table 1. Feature Summary ..................................................................................................................................... 10
Table 2. Additional Features .................................................................................................................................. 12
Table 3. Components Shown in Figure 1 .......................................................................................................... 13
Table 4. Components Shown in Figure 2 ............................................................................................................. 6
Table 5. Components Shown in Figure 3 ............................................................................................................. 7
Table 6. LAN Connector LED States .................................................................................................................... 11
Table 7. Systems States ........................................................................................................................................... 12
Table 8. Wake-up Devices and Events ............................................................................................................... 12
Table 9. SATA Combined Data/Power Header ............................................................................................... 15
Table 10. M.2 2280 Module (Mechanical Key M) Connector .................................................................... 15
Table 11. M.2 2280 Module (Mechanical Key E) Connector ..................................................................... 17
Table 12. Front Panel Header (2.0 mm Pitch) ................................................................................................. 17
Table 13. BIOS Security Jumper Settings ......................................................................................................... 17
Table 14. Fan Header Current Capability .......................................................................................................... 26
Table 15. Enviromental Specs ............................................................................................................................... 20
Table 16. Acceptable Drives/Media Type for BIOS Recovery................................................................... 25
Table 17. Power Buttons .......................................................................................................................................... 26
Table 18. Master Key and User Hard Disk Drive Password Functions .................................................. 27
Table 19. Supervisor and User Password Functions .................................................................................... 25
Table 20. Power Buttons .......................................................................................................................................... 26
9
1 Product Description
1.1 Overview
1.1.1 Summary of Mini PC SKUs
Product Codes and MM#s for the SKUs below can be found at https://ark.intel.com.
Processor
GPU
AC Cord (C5)
RAM
Storage
OS
TPM
Intel® Core™ i71165G7
RTX2060
+ 6GB
GDDR6
US, EU, or No Cord
2 x 8 GB
512GB Optane H10
Win 10 Pro
WW
CN
Win 10 Pro
CN - - - - - -
- - -
1.1.2 Summary of Kit SKUs
Product Codes and MM#s for the SKUs below can be found at https://ark.intel.com.
Processor
GPU
AC Cord (C5)
TPM
Intel® Core™ i7-
1165G7
RTX2060 +
6GB GDDR6
US, EU, UK, IN, AU or
No Cord
WW
CN
CN
1.1.3 Feature Summary
Table 1 summarizes the major features of Intel® NUC Mini PC, Kit and Board NUC11PH{X}.
Table 1. Feature Summary
Board Dimensions
8.22in by 5.37in (208.9mm by 136.4mm)
Chassis Dimensions
Chassis: 8.93in by 5.7in by 1.57in (227mm by 145mm x 40mm) (including feet)
Processor
Intel® NUC Mini PCs, and Kits NUC11PH{X} have a soldered-down 11th generation Intel®
Core™ processor with up to 28 W TDP
• Intel® Core™ i7-1165G7 processor, MM# 99A3D0
More information about Intel® processors can be found at https://ark.intel.com
Memory
Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)
sockets
• Support for DDR4 1866/2133/2400/3200 MHz SO-DIMMs
• Support for 8 Gb and 16 Gb technology
• Support for up to 64 GB of system memory with two SO-DIMMs using 32 GB
memory modules
• Support for non-ECC memory
• Support for 1.2 V JEDEC memory only
Note: 2 Gb and 4 Gb memory technology (SDRAM Density) is not supported
More information about tested memory can be found at http://www.intel.com/NUCSupport
Graphics
• Integrated graphics support for processors Intel® Graphics Technology
• Two Type C Front and back panel connectors
• Discrete graphics support by Nvidia RTX 2060
• One Full Size High Definition Multimedia Interface* (HDMI*) Back panel
connectors
• One Mini DisplayPort* back panel connectors
• Two Type C Front and back panel connectors
Audio
Audio via digital display outputs
• The following audio technologies are supported by the HDMI interfaces 192kHz/16-
bit or 176. kHz/24-bit, 32 Channel
• When using an encoded format (such as DTS-HD MA or Dolby True HD) the board
supports a single 7.1 stream. When using an un-encoded format, the board supports
8 discrete, un-encoded channels per HDMI port simultaneously, for a total of 16
discrete/un-encoded channels.
More information about software and drivers can be found at
https://downloadcenter.intel.com
Storage
One M.2 PCIe Gen4 connector supporting M.2 22x80 (key type M) for NVMe only
One M.2 connector supporting M.2 22x42 (key type B) for SATA SSD, PCIe x1 or USB 3.2
expandability
Technical Reference
11
Communication
Intel® Wi-Fi 6 AX201 (Gig+) M.2 2230 add-in card via M.2 2230 (key type E) connector
• 802.11ax, Dual Band, 2x2 Wi-Fi + Bluetooth v5.1
• Maximum transfer speed up to 2.4 Gbps
• Supports PCIe and USB
More information about Intel® wireless products can be found at https://ark.intel.com
To obtain drivers visit https://downloadcenter.intel.com
Gigabit (10/100/1000/2500 Mbps) LAN subsystem using the Intel® i255-LM Gigabit
Ethernet Controller
• PCIe 3.1 5GT/s support for x1 width (Lane)
• Single-port integrated multi-gigabit (up to 2.5G) – standard IEEE 802.3 Ethernet
interface for 2500BASE-T, 1000BASE-T, 100BASE-TX, 10BASE-TE connections (IEEE
802.3, 802.3u, 802.3bz, and 802.3ab)
• Supports Time Sensitive Networking (TSN) IEEE 802.1Qbu, 802.3br, 802.1Qbv,
802.1AS-REV, 802.1p,Q, and 802.1Qav
• Full wake up support
• Supports for packets up to 9.5 KB (Jumbo Frames)
• Support for two RJ45 ports with the Dual LAN chassis option
More information about Intel® Ethernet controllers can be found at https://ark.intel.com
To obtain drivers visit https://downloadcenter.intel.com
Thunderbolt™
2 x Thunderbolt™ ports (front and back panel)
• USB4 compliant
• 15W and18W port bus power
• Thunderbolt networking
• Protocol support:
PD Modes Supported: TBT3, USB4, USB3, DP-alt/MF
TBT3 Tx/Rx rates: 40G (2x 20.625), 20G (2x 10.3125)
PCI Express Tunnel: 32 Gbps
USB4 Tx/Rx rates: 40G (2x 20), 20G (2x 10)
USB3 Native: 10Gbps (1x10G)
USB3 Tunnel: 10Gbps
USB2: 480 Mpbs
DP1.4a, HBR3
DisplayPort Tunneling:
Port 2: 2 streams (~35 Gbps, Thunderbolt 4 certified)
Port 1: 1 stream (~17 Gbps, Thunderbolt 3 certified)
More information about the location of the Thunderbolt™ ports can be found in Section
2.1.4 later in this document
USB Ports and Headers
2 x USB 4 ports via Type C/Thunderbolt™ (Front and back panel)
6 x USB 3.2 Gen 2 ports (2 front panel and 4 back panel)
1 x USB 2.0 port (M.2 slot)
More information about the location of the USB ports and headers can be found in Section
2 later in this document
More information about the pinout of the USB ports and headers can be found in Section
4.1 later in this document
Power
AC Adapter
• ships with a 230W 19.5V adapter
Power Input
• 12V
DC
to 24V
DC
+/- 5% with DC transient voltage protection
More information about the estimated power budget can be found in Section Error! R
eference source not found. later in this document
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