Updated Intel® Xeon™ Phi™ x205 Product Family CPUs to official marketing
name of
Revision History
Date
April 2018 1.1
Intel® Xeon™ Phi™ 72x5 Product Family CPUs
Modifications
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merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from
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This document contains information on products, services and/or processes in development. All information
provided here is subject to change without notice. Contact your Intel representative to obtain the latest.
The products and services described may contain defects or errors known as errata which may cause
deviations from published specifications. Current characterized errata are available on request.
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*Other names and brands may be claimed as the property of others
Read all caution and safety statements in this document before performing any of the instructions. See also
Intel Server Boards and Server Chassis Safety Information at
Lesen Sie zunächst sämtliche Warnund Sicherheitshinweise in diesem Dokument, bevor Sie eine der
Anweisungen ausführen. Beachten Sie hierzu auch die Sicherheitshinweise zu Intel-Serverplatinen und
Servergehäusen auf der
Lisez attention toutes les consignes de sécurité et les mises en garde indiquées dans ce document avant de
suivre toute instruction. Consultez Intel Server Boards and Server Chassis Safety Information sur le site
Lea todas las declaraciones de seguridad y precaución de este documento antes de realizar cualquiera de las
instrucciones. Vea Intel Server Boards and Server Chassis Safety Information en
Heed safety instructions: Before working with your server product, whether you are using this guide or any
other resource as a reference, pay close attention to the safety instructions. You must adhere to the assembly
instructions in this guide to ensure and maintain compliance with existing product certifications and approvals.
Use only the described, regulated components specified in this guide. Use of other products/components will
void the UL listing and other regulatory approvals of the product and will most likely result in noncompliance
with product regulations in the region(s) in which the product is sold.
System power on/off: Risk of electric shock or fire exist. Do not service the systems if energized by any source
of power. The power button DOES NOT turn off the system AC power. To remove power from the system, you
must unplug the AC power cords fully from the systems and from the wall outlet. Make sure the AC power cord
is unplugged before you open the chassis, add, or remove any components. Hazardous conditions, devices and
cables: Hazardous electrical conditions may be present on power, telephone, and communication cables. Turn
off the server and disconnect the power cord, telecommunications systems, networks, and modems attached
to the server before opening it. Otherwise, personal injury or equipment damage can result.
Liquid Cooling Solutions: Follow the power off guidance. Prior to powering up any compute modules, check
the liquid cooling system for leaks and/or damaged parts (e.g. tubing, fittings, and disconnects). Ensure that
all power is off prior to disconnecting any cooling quick disconnects. Do not to energize or power up any server
node if the liquid cooling system is compromised in any way. To reduce risk of damage to the cooling system,
use care when installing or removing server nodes. Avoid excessive force when connecting & disconnecting
quick disconnects. Keep cooling tubing clear of pinch points when sliding server nodes.
Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper pins.
Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle nosed
pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or install a
jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide sides can
damage the contacts inside the jumper, causing intermittent problems with the function controlled by that
jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper, or you may
bend or break the pins on the board.
Electrostatic Discharge (ESD)
Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur
without the user feeling a shock while working inside the system chassis or while improperly handling
electronic devices like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
• Where available, all system integration and/or service should be performed at a properly equipped ESD
workstation.
• Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive shoes.
• Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.
• Remove all jewelry.
• Disconnect all power cables and cords attached to the server before performing any integration or
service.
• Touch any unpainted metal surface of the chassis before performing any integration or service.
• Hold all circuit boards and other electronic components by their edges only.
• After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive foam pad. Do not place electronic
devices on to the outside of any protective packaging.
Preface
About this document
This document is written for system integrators and service technicians who are responsible for system
assembly, server upgrades, server repair, and component replacement.
This document is divided into two major sections. The first half of the document provides detailed
instructions on how to install critical components to the system like memory, processor and others. It will
guide you through the installation of system components and available accessories. The second half of the
document is focused on system service. It provides many reference diagrams used to identify all key
physical features of the system. It also provides detailed instructions for the replacement of field
replaceable components.
For the latest revision of this document, go to
Document Organization
Chapter 1 Product Features - provides a high level overview of the Intel® Compute Module HNS7200AP.
In this chapter, you will find a list of the compute module features and illustrations identifying the major
compute module components.
http://www.intel.com/support
Chapter 2 Hardware Installations and Upgrades - provides instructions on adding and replacing the
components. Use this chapter for step-by-step instructions and diagrams for installing or replacing the
components such as the processors, memory, and add-in cards, among other components.
Chapter 3 System Software Updates and Configuration - provides instructions on using the utilities that
are shipped with the board or that may be required to update the compute module. This includes
information for navigating through the BIOS Setup screens, performing a BIOS update, and resetting the
password or BIOS defaults.
Chapter 4 Server Utilities - provides instructions for server utilities.
Nomenclature
Throughout this manual “compute module” is the abbreviation of the Intel® Compute Module
HNS7200AP or HNS7200APR. It is also referred to as “compute node” or “node”.
For this information or software
Use this Document or Software
For in-depth technical information
about this product
Intel ® Server Board S7200AP Product Family and Intel® Compute Module HNS7200AP Product Family Technical Product Specification
For product list and supported Intel
spares and accessories
Spares and Accessories List and Configuration Guide
For server configuration guidance
and compatibility
Intel
®
Server Configurator tool
http://serverconfigurator.intel.com
For system power budget guidance
Power Budget Tool
Product Safety and Regulatory
document
Intel Server Products – Product Safety and Regulatory Compliance Document
Additional Information and Software
For additional information about this family of products or any of their supported accessories, refer to the
following resources available at
The server system has support for several software utilities which can be used to configure system
parameters and aid in troubleshooting system issues. All available utilities can be downloaded from the
following Intel web site:
http://downloadcenter.intel.com/
http://www.intel.com/support.
Table 1. Server System References
http://www.intel.com/support
Table of Contents
1 Product Features .................................................................................................................................................... 1
1.1.1 Server Board Feature Set ....................................................................................................................................... 2
1.1.2 HNS7200AP Compute Module Feature Set .................................................................................................... 3
1.1.3 Chassis Feature Set for Intel® Compute Module HNS7200AP ................................................................ 4
1.1.4 HNS7200APR Compute Module Feature Set ................................................................................................. 6
1.1.5 Chassis Feature Set for Intel® Compute Module HNS7200APR ............................................................. 7
1.2 Back Panel Feature Identification................................................................................................................................. 7
1.3 Power Docking Board Features ..................................................................................................................................... 8
1.4 Bridge Board Feature Features ...................................................................................................................................... 8
1.5 Server Board Features ....................................................................................................................................................... 9
1.8.1 Intel® Remote Management Module 4 Lite .................................................................................................. 12
2 Hardware Installations and Upgrades ........................................................................................................... 13
2.1 Before You Begin .............................................................................................................................................................. 13
2.1.1 Tools and Supplies Needed ................................................................................................................................ 13
2.1.2 System Reference ................................................................................................................................................... 13
2.3 Removing and Installing the Air Duct ...................................................................................................................... 14
2.3.1 Removing the Air Duct .......................................................................................................................................... 14
2.3.2 Installing the Air Duct ........................................................................................................................................... 15
2.4 Processor Assembly Installation and Removal .................................................................................................... 16
2.4.1 Assembling the Processor Heat Sink Module (PHM) ............................................................................... 16
2.6 Installation and Removal of the 1U LACC .............................................................................................................. 29
2.6.1 Removal of the 1U LACC Assembly ................................................................................................................ 29
2.6.2 Remove the CPU and Carrier Assembly ........................................................................................................ 33
2.6.3 Install the 1U LACC Assembly ........................................................................................................................... 33
2.7 Removing and Installing Riser 1 and Riser 2 ........................................................................................................ 38
2.10.3 Installing the Fabric Processor Kit ................................................................................................................... 48
2.10.4 Removing the Fabric Processor Kit ................................................................................................................. 51
2.11 Installing and Removing the Memory ...................................................................................................................... 52
2.11.1 Installing the Memory ........................................................................................................................................... 52
2.11.2 Removing the Memory ......................................................................................................................................... 52
2.12 Installing and Removing the Intel® Remote Management Module 4 Lite ................................................. 53
2.12.1 Installing the Intel® RMM4 Lite .......................................................................................................................... 53
2.12.2 Removing the Intel® RMM4 Lite ........................................................................................................................ 53
2.13 Replacing the Bridge Board ......................................................................................................................................... 54
2.13.1 Installing the Bridge Board ................................................................................................................................. 54
2.13.2 Removing the Bridge Board ............................................................................................................................... 54
2.14 Replacing the Server Main Board .............................................................................................................................. 55
2.14.1 Removing the Server Board ............................................................................................................................... 55
2.14.2 Installing the Server Board ................................................................................................................................. 56
2.15 Installing and Removing the Power Docking Board .......................................................................................... 57
2.15.1 Removing the Power Docking Board .............................................................................................................. 57
2.15.2 Installing the Power Docking Board ................................................................................................................ 57
2.16 Replacing the Fan ............................................................................................................................................................ 58
2.16.1 Removing the Fan ................................................................................................................................................... 58
2.16.2 Installing the Fan ..................................................................................................................................................... 58
2.17 Replacing the Backup Battery .................................................................................................................................... 59
2.18 Installing and Removing the Intel® Trusted Platform Module ............................................................................... 60
2.18.1 Installing the TPM ................................................................................................................................................... 60
2.18.2 Removing the TPM ................................................................................................................................................. 60
2.19 Installing and Removing the VGA (Video) Debug Cable ......................................................................................... 61
2.19.1 Installing Video Debug Cable ............................................................................................................................ 61
2.19.2 Removing the Video Debug Cable ................................................................................................................... 62
3 System Software Updates and Configuration .............................................................................................. 63
3.1 Updating the System Software Stack ...................................................................................................................... 63
3.2 Using the BIOS Setup Utility ........................................................................................................................................ 63
4 Server Utilities .................................................................................................................................................... 65
4.1 Intel® System Information Retrieve Utility (Sysinfo) ............................................................................................ 65
4.2 Intel® One Boot Flash Update Utility (OFU) ........................................................................................................... 65
4.3 Intel® System Event Log (SEL) Viewer Utility.......................................................................................................... 65
4.4 Intel® System Configuration Utility (SYSCFG) ........................................................................................................ 65
Appendix A. Technical Reference ...................................................................................................................... 66
System Environmental Specifications .................................................................................................................................... 66
Appendix B. POST Code Diagnostic LED Decoder ......................................................................................... 67
Appendix C. POST Error Codes .......................................................................................................................... 75
Appendix D. System Interconnects S7200AP / H2000G ............................................................................... 78
Appendix E. Regulatory and Compliance Information ................................................................................. 79
Appendix F. Getting Help .................................................................................................................................... 80
Warranty Information ................................................................................................................................................................... 80
Figure 1. Intel® Compute Module HNS7200AP Product Family ........................................................................................ 1
Figure 2. Intel® Ser ver Board S7200AP Product Family .................................................................................................... 1
Figure 3. Intel® Ser ver Board S7200AP Rear Connectors .................................................................................................. 7
Figure 5. Power Docking Board Features ............................................................................................................................. 8
Figure 6. 6G SATA Bridge Board Features ............................................................................................................................ 8
Figure 7. Intel® Ser ver Board S7200AP Features ................................................................................................................ 9
Figure 8. Intel® Ser ver Board S7200APR ............................................................................................................................. 9
Figure 12. Removing the Air Duct ....................................................................................................................................... 14
Figure 13. Installing the Air Duct ........................................................................................................................................ 15
Figure 34. 1U LACC Assembly installed in the system .................................................................................................... 29
Figure 40. Lift out LACC Assembly ..................................................................................................................................... 32
Figure 41. Releasing CPU and Carrier from Cold Plate .................................................................................................... 33
Figure 43. Install CPU and Carrier to Cold LACC Cold Plate ........................................................................................... 34
Figure 44. Install the LACC assembly into the system ..................................................................................................... 35
Figure 44. Install the LACC assembly into the system ..................................................................................................... 35
Figure 63. Lift out the Riser and Add-In-Card– Step 2 ..................................................................................................... 46
Figure 64. Remove the Add-In-Card from Riser 2– Step 3 .............................................................................................. 46
Figure 65. Installing the IFT Carrier .................................................................................................................................... 47
Figure 72. Installing the Memory........................................................................................................................................ 52
Figure 73. Installing the Intel® RMM4 Lite ......................................................................................................................... 53
Figure 74. Installing the Bridge Board ............................................................................................................................... 54
Figure 75. Removing the Bridge Board .............................................................................................................................. 54
Figure 76. Removing the Cable Connections from the Server Board ............................................................................ 55
Figure 77. Removing the Server Board .............................................................................................................................. 55
Figure 78. Installing the Server Board ............................................................................................................................... 56
Figure 79. Connecting all Cables ........................................................................................................................................ 56
Figure 80. Removing the Power Docking Board ............................................................................................................... 57
Figure 81. Installing the Power Docking Board ................................................................................................................ 57
Figure 82. Removing the Fan ............................................................................................................................................... 58
Figure 83. Installing the Fan ................................................................................................................................................ 58
Figure 84. Replacing the Backup Battery .......................................................................................................................... 59
Figure 85. Installing the Intel® Trusted Platform Module ............................................................................................... 60
Figure 86. Video Cable Routing........................................................................................................................................... 61
Figure 87. Connecting video cable to board VGA connector .......................................................................................... 61
Figure 88. Reseat Riser with video cable ........................................................................................................................... 62
Figure 89. Video Cable Routing........................................................................................................................................... 62
Figure 90. POST Diagnostic LED Location ......................................................................................................................... 67
Figure 91. System Interconnect .......................................................................................................................................... 78
List of Tables
Table 1. Server System References ..................................................................................................................................... vii
Table 2. Intel® Compute Module HNS7200AP Product Family Feature Set .................................................................... 3
Table 3. Intel® Server Board S7200APR (Refresh) Product Family Feature Set .............................................................. 4
Table 4. Intel® Compute Module HNS7200APR Product Family Feature Set .................................................................. 6
Table 7. BIOS Setup: Keyboard Command Bar ................................................................................................................. 64
Table 8. System Environmental Limits Summary ............................................................................................................. 66
Table 9. POST Progress Code Decoding LED Example .................................................................................................... 68
Table 12. POST Progress Codes .......................................................................................................................................... 71
Table 13. POST Error Codes and Messages ....................................................................................................................... 75
Table 14. POST Error Beep (with LED) Codes ................................................................................................................... 77
This chapter briefly describes the main features of the Intel® Server Board S7200AP/APR and the Intel®
Compute Module HNS7200AP/APR. This includes illustrations of the products, a list of features, and
diagrams showing the location of important components and connections. The two main boards are
described in this document to include support for several chassis. The document includes updates for Intel®
Server Board S7200APR refresh product that is supported in the Intel® Server Chassis H2204XXLRE.
Figure 1. Intel® Compute Module HNS7200AP Product Family
Figure 2. Intel® Server Board S7200AP Product Family
Feature
Description
Processor Support
Intel® Xeon™ Phi™ x200 Product Family
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
Memory Support
Six DIMM slots in total across six memory channels
Two USB 3.0 connectors Two RJ-45 10/100/1000 Mbit Network Interface Controller (NIC) ports
Internal I/O
One USB 2.0 Header
One Serial Port A Header
PCIe Support
PCIe* 3.0 (2.5, 5, 8 GT/s)
Power Connections
•One 2x4 pin main power connector
One 4 pin power connector for disk drive power
System Fan Support
Three 40x56mm double rotor fans One 4 pin CPU fan or liquid cooling pump support header
Video
128MB DDR3 memory
1.1 Product Feature Overview
1.1.1 Server Board Feature Set
Intel® Server Board S7200AP Product Family contains two server board options. Intel® Server Board
S7200AP supports Intel® Xeon™ Phi™ x200 CPUs (up to 230w TDP) in Intel® Server Chassis H2312XXLR2
and H2216XXLR2.
Intel® Server Board S7200APR supports both Intel® Xeon™ Phi™ x200 and Intel® Xeon™ Phi™ 72x5 Product
Family CPUs (up to 320w TDP) in Intel® Server Chassis H2204XXLRE.
This document describes the servicing of both compute modules. Although, these boards are
independent and stand-alone products, there are many features and service steps that are common to
each board. These common steps will be identified in its respective section.
The following tables list the common feature set, however, a board will be identified by its product code
when a described feature or function is unique to it.
Table 1. Intel® Server Board S7200AP Product Family Feature Set
connectors/headers
Single processor socket P (3647 pins)
Thermal Design Power (TDP) up to 230W
Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
Memory DDR4 data transfer rates of 2400/2666 MT/s
1 DIMM per channel
One TPM Header
One Intel® Omni-Path Fabric Signal Connector
One mSATA Connector
One Bridge Board Connector
One 2x7 pin header for system fan module
One Aux Front Panel Connector
Three 8-pin fan headers for non-Intel chassis support
One 4 pin CPU fan or liquid cooling pump support header
One PSU Control Header
One RMII header for Intel® RMM4 Lite
One internal RGB Video Header
• One 2x2 pin aux. power connector
•
Integrated 2D video graphics controller
Feature
Description
Riser Support
One PCIe Gen3 x16 standard riser connector
On-board storage
controllers and options
Integrated 10-port SATA
o 4 ports to MiniSAS HD connector
Fabric
Dual port Intel® Omni-Path Fabric via
Single Port Intel® Omni-Path Fabric via x16 Gen 3 PCIe Adapter
Network (LAN)
Dual i210 Springvilles
to management traffic.
Server Management
Feature1
Description
Server Board
Intel® Xeon™ Phi™ x200 Product Family
CPUs with Integrated Intel® Omni-Path Fabric supported
Processor TDP Support
Maximum supported Thermal Design Power (TDP) of up to 230W
Heatsink
One 80x107mm 1U Heatsink
Fan
Three 40x56mm dual rotor system fans
Riser Support
One PCIe Gen3 x16 standard riser connector
Compute Module Board
One compute module power docking board
Air Duct
One transparent air duct
o Supports a low-profile adapter in Riser Slot 1
One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector
o Supports a x16 low-profile adapter in Riser Slot 2
o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs with
integrated Intel® Omni-Path Fabric are used
o 5 ports to bridge board,
o 1 port to mSATA
or
Dual 10/100/1000Gbe RJ45 connectors
NC_SI sideband to BMC. Option to host share or dedicate a Network port
Onboard Emulex* Pilot III* Controller
®
Support for Intel
Support for Intel
Support for Intel® Intelligent Power Node Manager
Remote Management Module 4 Lite solutions
®
System Management Software
Xeon™ Phi™ x200 Product Family
NOTE: The Riser Slot 1 on the server board is designed for plugging in ONLY the riser adapter. Plugging
in a PCIe* adapter directly into the riser slot may cause permanent server board and/or PCIe* card
damage.
1.1.2 HNS7200AP Compute Module Feature Set
Table 2. Intel® Compute Module HNS7200AP Product Family Feature Set
Single processor socket P (3647 pins)
Thermal Design Power (TDP) up to 230W
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector
Bridge boards:
o Supports a low-profile adapter in Riser Slot 1
o Supports a x16 low-profile adapter in Riser Slot 2
o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs
with integrated Intel® Omni-Path Fabric are used
o 6G SATA Bridge Board (Default)
Feature1
Description
Form Factor
Length 14.17” (360m), width 6.81” (173mm)
Feature
Description
Dimensions (2U)
438mm x 86.9mm x 771/733mm
Node Support
Intel® Compute Module options:
Power Supply
2 x 2130W AC CRPS
System Cooling
3 dual rotor 40 x 56 mm fixed fans per node
PCIe support
Two low profile PCIe cards on riser 1 and 2
Storage
8 x 2.5” SATA drive Note: 2.5” SATA HDD installed in the 3.5” Drive Carrier
System SKUs
Support for H2312XXLR2 and H2216XXLR2 chassis only
NOTE: The table only lists features that are unique to the compute module or different with the server
board.
1. ONLY standard low profile PCIe* cards can be installed in the riser card slots.
1.1.3 Chassis Feature Set for Intel® Compute Module HNS7200AP
The following table lists a brief description of the 2U H2000G Chassis Product Family features,
17.24” width x 3.42 length x 30.35/28.86” height
HNS7200AP (up to four)
16 x 2.5” SATA drives
Bridge Board Options:
(1) 6G SATA only RAID 0, 1, 10 SW RAID ESRT2
Note: Intel® Compute Module HNS7200AP is not supported in Intel® Server Chassis H2204XXLRE
For additional details on chassis features, refer to the Intel® Server Chassis H2000G and H2000P Product
Family TPS and Service Guide.
Table 3. Intel® Server Board S7200APR (Refresh) Product Family Feature Set
Feature
Description
Processor Support
Intel® Xeon™ Phi™ 72x5 Product Family
CPUs with Integrated Intel® Omni-Path Fabric supported
Memory Support
Six DIMM slots in total across six memory channels
Two USB 3.0 connectors Two RJ-45 10/100/1000 Mbit Network Interface Controller (NIC) ports
Internal I/O
One USB 2.0 Header
One Serial Port A Header
PCIe Support
PCIe* 3.0 (2.5, 5, 8 GT/s)
Power Connections
•One 2x4 pin main power connector
One 4 pin power connector for disk drive power
System Fan Support
Three 40x56mm double rotor fans One 4 pin CPU fan or liquid cooling pump support header
Video
128MB DDR3 memory
Riser Support
One PCIe Gen3 x16 standard riser connector
On-board storage
o 4 ports to MiniSAS HD connector
Fabric
connectors/headers
Single processor socket P
Thermal Design Power (TDP) up to 320W with the 1U LACC thermal
solution
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
Intel® Xeon™ Phi™ x200 Product Family
Single processor socket P (3647 pins)
Thermal Design Power (TDP) up to 230W (Air Cooled Heatsink)
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)
Memory DDR4 data transfer rates of 2400/2666 MT/s
1 DIMM per channel
One TPM Header
One Intel® Omni-Path Fabric Signal Connector
One mSATA Connector
One Bridge Board Connector
One 2x7 pin header for system fan module
One Aux Front Panel Connector
Three 8 pin fan headers for third-party chassis support
One 4 pin CPU fan or liquid cooling pump support header
One PSU Control Header
One RMII header for Intel® RMM4 Lite
One internal RGB Video Header
• One 2x2 pin aux. power connector
•
Integrated 2D video graphics controller
o Supports a low-profile adapter in Riser Slot 1
One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector
o Supports a x16 low-profile adapter in Riser Slot 2
controllers and options
Integrated 10-port SATA
Single Port Intel® Omni-Path Fabric via x16 Gen 3 PCIe Adapter
o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs with
integrated Intel® Omni-Path Fabric are used
o 5 ports to bridge board,
o 1 port to mSATA
Feature
Description
Network (LAN)
Dual i210 Springvilles
to management traffic.
RAID Support
Server Management
Onboard Emulex* Pilot III* Controller
Support for Intel
Intelligent Power Node Manager
Feature1
Description
Server Board
Intel® Xeon™ Phi™ 72x5 Product Family
CPUs with Integrated Intel® Omni-Path Fabric supported
Processor TDP Support
Maximum supported Thermal Design Power (TDP) of up to 320W
Heatsink
Liquid Assisted Air Cooling (LAAC)
Fan
Three 40x56mm dual rotor system fans
Riser Support
One PCIe Gen3 x16 standard riser connector
Compute Module Board
One compute module power docking board
Air Duct
One transparent air duct
Form Factor
Length 14.17” (360m), width 6.81” (173mm)
Dual 10/100/1000Gbe RJ45 connectors
NC_SI sideband to BMC. Option to host share or dedicate a Network port
Intel
Support for Intel
Support for Intel
®
Embedded Server RAID Technology 2 (ESRT2)
®
Remote Management Module 4 Lite solutions
®
System Management Software
®
NOTE: The Riser Slot 1 on the server board is designed for plugging in ONLY the riser adapter. Plugging
in a PCIe* adapter directly into the riser slot may cause permanent server board and/or PCIe* card
damage.
1.1.4 HNS7200APR Compute Module Feature Set
Table 4. Intel® Compute Module HNS7200APR Product Family Feature Set
Single processor socket P
Thermal Design Power (TDP) up to 320W with the 1U LACC
thermal solution
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
Intel® Xeon™ Phi™ x200 Product Family
Single processor socket P (3647 pins)
Thermal Design Power (TDP) up to 230W (Air Cooled Heatsink)
36 lanes of Integrated PCI Express® 3.0 low-latency I/O
NOTE: The table only lists features that are unique to the compute module or different with the server
board.
1. ONLY standard low profile PCIe* cards can be installed in the riser card slots.
One 80x107mm 1U Heatsink-CPUs < 245W TDP
1U Liquid Assisted Air Cooling (LAAC) -CPUs > 245W TDP
o Supports a low-profile adapter in Riser Slot 1
One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector
o Supports a x16 low-profile adapter in Riser Slot 2
o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs
with integrated Intel® Omni-Path Fabric are used
Bridge boards:
o 6G SATA Bridge Board (Default)
Feature
Description
Dimensions (2U)
438mm x 86.9mm x 771/733mm
Node Support
Intel® Compute Module options:
Power Supply
2 x 2130W AC CRPS
System Cooling
3 dual rotor 40 x 56 mm fixed fans per node
PCIe support
Two low profile PCIe cards on riser 1 and 2
Storage
4 x 2.5” SATA drive Note: 2.5” SATA HDD installed in the 3.5” Drive Carrier
System SKUs
Supported for H2204XXLRE chassis only
Label
Description
Label
Description
A
USB 3.0 Por t 1
B
USB 3.0 Por t 2
C
NIC port 1 (RJ45)
D
NIC port 2 (RJ45)
E
POST Code LEDs (8 LEDs)
F
ID LED
G
Status LED
1.1.5 Chassis Feature Set for Intel® Compute Module HNS7200APR
The following table lists a brief description of the 2U H2000-G Chassis Product Family features
17.24” width x 3.42 length x 30.35/28.86” height
HNS7200APR (up to four)
Bridge Board Options:
(1) 6G SATA only RAID 0, 1, 10 SW RAID ESRT2
Note: Intel® Compute Module HNS7200APR is not supported in Intel® Server Chassis H2312XXLR2 and
H2216XXLR2
For additional details on chassis features, refer to the Intel® Server Chassis H2000G Product Family TPS.
1.2 Back Panel Feature Identification
The Intel® Compute Module HNS7200AP product family has the following board rear connector placement
and features.
Figure 3. Intel® Server Board S7200AP Rear Connectors
Label
Description
A
2x7 pin fan control connector
B
8 pin connector for fan 1
C
2x6 pin Minifit Jr. main power output
connector
D
8 pin connector for fan 2
E
12 pin connector for main power input
F
8 pin connector for fan 3
Label
Description
A
2x40 pin card edge connector (to the backplane)
B
2x40 pin card edge connector (to the baseboard slot)
This section helps you identify the components and connectors on the server board. Intel® Server Board
S7200AP features shown. All major features that are called out are common to both boards.
Figure 7. Intel® Server Board S7200AP Features
Figure 8. Intel® Server Board S7200APR
1.6 Intel® Light-Guided Diagnostics
Figure 9. Intel® Light-Guided Diagnostic LEDs – Server Board
The POST Code Diagnostic LEDs on the server board change color or state (off, green, red, and amber)
according to the POST sequence.
The Status LED on the rear of the board shows the overall health of the system (green, blinking green,
blinking amber, amber, and off).
The Identification LED on the rear of the board helps identify the server from among several servers. The
ID LED is off by default, and blue when activated by button or software.
Jumper Name
Description
BMC Force
Update (J2G1)
If pins 2-3 are selected, the Integrated BMC Force Update Mode is enabled. These pins should be selected
on 1-2 for normal system operation.
BIOS Default
(J2B1)
If pins 2-3 are selected, the BIOS settings are restored to the factory defaults on the next reset. These pins
should be selected on 1-2 for normal system operation.
BIOS Recovery
If the system BIOS is corrupted, an onboard backup copy of the BIOS can be loaded using the BIOS
1.7 Configuration and Recovery Jumpers
Figure 10. Configuration and Recovery Jumpers
(J3B3)
Recovery Jumper. To load the backup BIOS image, move the jumper from pins 1-2 (default) to pins 2-3, and
for normal system operation.
Password
Clear(J2B3)
If pins 2-3 are selected, administrator and user passwords are cleared within five to ten seconds after the
system is powered on. These pins should be selected on 1-2 for normal system operation.
ME Force
Update (J3B2)
If pins 2-3 are selected, the ME Force Update Mode is enabled. These pins should be selected on 1-2 for
normal system operation.
power on the system. The system will boot to the backup BIOS image. These pins should be selected on 1-2
1.8 Advanced Management Options
1.8.1 Intel® Remote Management Module 4 Lite
The Intel® Remote Management Module 4 Lite plugs into a dedicated connector on the server board and
provides additional server management functionality to the compute module.
The Intel® Remote Management Module 4 Lite, together with the dedicated management port provides a
dedicated web server for viewing server information and remote control of the compute module. It also
provides Remote KVM Redirection and USB Media Redirection allowing USB devices attached to the remote
system to be used on the managed server.
For instructions on installing the Intel® Remote Management Module 4 Lite, see section 2.10.
2 Hardware Installations and Upgrades
2.1 Before You Begin
Before working with your server product, closely review the Safety Information at the beginning of this
document.
NOTE: Prior to servicing the compute module or chassis, power down the server, unplug all peripheral
devices and the AC power cords.
2.1.1 Tools and Supplies Needed
• Phillips* (cross head) screwdriver (#1 bit and #2 bit)
• T30 Tor x bit screwdriver
• Flat head screwdriver
• Needle nosed pliers
• Anti-static wrist strap and conductive foam pad (recommended)
2.1.2 System Reference
All references to left, right, front, top, and bottom assume that the reader is facing the front of the chassis
as it would be positioned for normal operation.
2.2 Cable Routing
Each compute module is self-contained and can be hot swapped without any impact to other compute
modules. When you add or remove components from the compute module enclosure, ensure that cables
are routed correctly before plugging in the compute module back into the chassis. Use caution to ensure
that cables or wires are not pinched and that the airflow from the fans is not blocked. Use the figures
below to determine the correct cable routing. Section 2.2 applies to both server boards.
Figure 11. Cable Routing
NOTES:
• Orange line: Fan cable connection
• Blue line: Server board power cable connection
• Red line: Fan control signal cable connection
2.3 Removing and Installing the Air Duct
Always operate your compute module with the air duct in place. The air duct is required for proper airflow
within the compute module. Intel® Server Board S7200AP. Section 2.3 applies to both server compute module.
2.3.1 Removing the Air Duct
1. Press and hold both the left and right side buttons of the air duct (See letter A).
2. Rotate the air duct more than 45 degrees and pull it out. (See letter B).
Figure 12. Removing the Air Duct
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