Intel S7200AP, S7200APR, HNS7200AP, HNS7200APR System Integration And Service Manual

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Intel® Server Board S7200AP/APR Intel® Compute Module HNS7200AP/APR Product Family

System Integration and Service Guide

A document providing instruction on installation and removal of subassemblies.

Revision 1.1

April 2018

Datacenter Systems Group

Revision

Number

Oct 2017

0.8

Update with Adams Pass Refresh information

Jan 2018

1.0

Update Processor Information; image modifications; warnings updated.

Updated Intel® Xeon™ Phi™ x205 Product Family CPUs to official marketing name of

Revision History

Date

April 2018 1.1

Intel® Xeon™ Phi™ 72x5 Product Family CPUs

Modifications

Disclaimers

No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or usage in trade.

This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest.

The products and services described may contain defects or errors known as errata which may cause deviations from published specifications. Current characterized errata are available on request.

Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.

*Other names and brands may be claimed as the property of others

重要安全指导

Safety Information

Important Safety Instructions

Read all caution and safety statements in this document before performing any of the instructions. See also Intel Server Boards and Server Chassis Safety Information at

http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.

Wichtige Sicherheitshinweise

Lesen Sie zunächst sämtliche Warnund Sicherheitshinweise in diesem Dokument, bevor Sie eine der Anweisungen ausführen. Beachten Sie hierzu auch die Sicherheitshinweise zu Intel-Serverplatinen und Servergehäusen auf der

http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.

Consignes de sécurité

Lisez attention toutes les consignes de sécurité et les mises en garde indiquées dans ce document avant de suivre toute instruction. Consultez Intel Server Boards and Server Chassis Safety Information sur le site

http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.

Instrucciones de seguridad importantes

Lea todas las declaraciones de seguridad y precaución de este documento antes de realizar cualquiera de las instrucciones. Vea Intel Server Boards and Server Chassis Safety Information en

http://www.intel.com/support/motherboards/server/sb/cs-010770.htm.

在执行任何指令之前，请阅读本文档中的所有注意事项及安全声明。和/或

http://www.intel.com/support/motherboards/server/sb/cs-010770.htm 上的 Intel

Safety Information（《Intel 服务器主板与服务器机箱安全信息》）。

Server Boards and Server Chassis

Warnings

Heed safety instructions: Before working with your server product, whether you are using this guide or any

other resource as a reference, pay close attention to the safety instructions. You must adhere to the assembly instructions in this guide to ensure and maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified in this guide. Use of other products/components will void the UL listing and other regulatory approvals of the product and will most likely result in noncompliance with product regulations in the region(s) in which the product is sold.

System power on/off: Risk of electric shock or fire exist. Do not service the systems if energized by any source of power. The power button DOES NOT turn off the system AC power. To remove power from the system, you must unplug the AC power cords fully from the systems and from the wall outlet. Make sure the AC power cord is unplugged before you open the chassis, add, or remove any components. Hazardous conditions, devices and cables: Hazardous electrical conditions may be present on power, telephone, and communication cables. Turn off the server and disconnect the power cord, telecommunications systems, networks, and modems attached to the server before opening it. Otherwise, personal injury or equipment damage can result.

Liquid Cooling Solutions: Follow the power off guidance. Prior to powering up any compute modules, check the liquid cooling system for leaks and/or damaged parts (e.g. tubing, fittings, and disconnects). Ensure that all power is off prior to disconnecting any cooling quick disconnects. Do not to energize or power up any server node if the liquid cooling system is compromised in any way. To reduce risk of damage to the cooling system, use care when installing or removing server nodes. Avoid excessive force when connecting & disconnecting quick disconnects. Keep cooling tubing clear of pinch points when sliding server nodes.

Installing or removing jumpers: A jumper is a small plastic encased conductor that slips over two jumper pins. Some jumpers have a small tab on top that you can grip with your fingertips or with a pair of fine needle nosed pliers. If your jumpers do not have such a tab, take care when using needle nosed pliers to remove or install a jumper; grip the narrow sides of the jumper with the pliers, never the wide sides. Gripping the wide sides can damage the contacts inside the jumper, causing intermittent problems with the function controlled by that jumper. Take care to grip with, but not squeeze, the pliers or other tool you use to remove a jumper, or you may bend or break the pins on the board.

Electrostatic Discharge (ESD)

Electrostatic discharge can cause damage to your computer or the components within it. ESD can occur without the user feeling a shock while working inside the system chassis or while improperly handling electronic devices like processors, memory or other storage devices, and add-in cards.

Intel recommends the following steps be taken when performing any procedures described within this document or while performing service to any computer system.

• Where available, all system integration and/or service should be performed at a properly equipped ESD

workstation.

• Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive shoes.

• Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge.

• Remove all jewelry.

• Disconnect all power cables and cords attached to the server before performing any integration or

service.

• Touch any unpainted metal surface of the chassis before performing any integration or service.

• Hold all circuit boards and other electronic components by their edges only.

• After removing electronic devices from the system or from their protective packaging, place them

component side up on to a grounded anti-static surface or conductive foam pad. Do not place electronic devices on to the outside of any protective packaging.

Preface

About this document

This document is written for system integrators and service technicians who are responsible for system assembly, server upgrades, server repair, and component replacement.

This document is divided into two major sections. The first half of the document provides detailed instructions on how to install critical components to the system like memory, processor and others. It will guide you through the installation of system components and available accessories. The second half of the document is focused on system service. It provides many reference diagrams used to identify all key physical features of the system. It also provides detailed instructions for the replacement of field replaceable components.

For the latest revision of this document, go to

Document Organization

Chapter 1 Product Features - provides a high level overview of the Intel® Compute Module HNS7200AP.

In this chapter, you will find a list of the compute module features and illustrations identifying the major compute module components.

http://www.intel.com/support

Chapter 2 Hardware Installations and Upgrades - provides instructions on adding and replacing the components. Use this chapter for step-by-step instructions and diagrams for installing or replacing the components such as the processors, memory, and add-in cards, among other components.

Chapter 3 System Software Updates and Configuration - provides instructions on using the utilities that are shipped with the board or that may be required to update the compute module. This includes information for navigating through the BIOS Setup screens, performing a BIOS update, and resetting the password or BIOS defaults.

Chapter 4 Server Utilities - provides instructions for server utilities.

Nomenclature

Throughout this manual “compute module” is the abbreviation of the Intel® Compute Module HNS7200AP or HNS7200APR. It is also referred to as “compute node” or “node”.

For this information or software

Use this Document or Software

For in-depth technical information about this product

Intel ® Server Board S7200AP Product Family and Intel® Compute Module HNS7200AP Product Family Technical Product Specification

For product list and supported Intel spares and accessories

Spares and Accessories List and Configuration Guide

For server configuration guidance and compatibility

Intel

Server Configurator tool

http://serverconfigurator.intel.com

For system power budget guidance

Power Budget Tool

Product Safety and Regulatory document

Intel Server Products – Product Safety and Regulatory Compliance Document

Additional Information and Software

For additional information about this family of products or any of their supported accessories, refer to the following resources available at

The server system has support for several software utilities which can be used to configure system parameters and aid in troubleshooting system issues. All available utilities can be downloaded from the following Intel web site:

http://downloadcenter.intel.com/

http://www.intel.com/support.

Table 1. Server System References

http://www.intel.com/support

Table of Contents

1 Product Features .................................................................................................................................................... 1

1.1 Product Feature Overview ............................................................................................................................................... 2

1.1.1 Server Board Feature Set ....................................................................................................................................... 2

1.1.2 HNS7200AP Compute Module Feature Set .................................................................................................... 3

1.1.3 Chassis Feature Set for Intel® Compute Module HNS7200AP ................................................................ 4

1.1.4 HNS7200APR Compute Module Feature Set ................................................................................................. 6

1.1.5 Chassis Feature Set for Intel® Compute Module HNS7200APR ............................................................. 7

1.2 Back Panel Feature Identification................................................................................................................................. 7

1.3 Power Docking Board Features ..................................................................................................................................... 8

1.4 Bridge Board Feature Features ...................................................................................................................................... 8

1.5 Server Board Features ....................................................................................................................................................... 9

1.6 Intel® Light-Guided Diagnostics ................................................................................................................................. 10

1.7 Configuration and Recovery Jumpers ..................................................................................................................... 11

1.8 Advanced Management Options ............................................................................................................................... 12

1.8.1 Intel® Remote Management Module 4 Lite .................................................................................................. 12

2 Hardware Installations and Upgrades ........................................................................................................... 13

2.1 Before You Begin .............................................................................................................................................................. 13

2.1.1 Tools and Supplies Needed ................................................................................................................................ 13

2.1.2 System Reference ................................................................................................................................................... 13

2.2 Cable Routing .................................................................................................................................................................... 13

2.3 Removing and Installing the Air Duct ...................................................................................................................... 14

2.3.1 Removing the Air Duct .......................................................................................................................................... 14

2.3.2 Installing the Air Duct ........................................................................................................................................... 15

2.4 Processor Assembly Installation and Removal .................................................................................................... 16

2.4.1 Assembling the Processor Heat Sink Module (PHM) ............................................................................... 16

2.4.2 Processor Installation ........................................................................................................................................... 22

2.5 Processor Removal .......................................................................................................................................................... 26

2.5.1 PHM Disassembly ................................................................................................................................................... 27

2.6 Installation and Removal of the 1U LACC .............................................................................................................. 29

2.6.1 Removal of the 1U LACC Assembly ................................................................................................................ 29

2.6.2 Remove the CPU and Carrier Assembly ........................................................................................................ 33

2.6.3 Install the 1U LACC Assembly ........................................................................................................................... 33

2.7 Removing and Installing Riser 1 and Riser 2 ........................................................................................................ 38

2.7.1 Remove Riser 1 ........................................................................................................................................................ 38

2.7.2 Install Riser 1 ............................................................................................................................................................ 38

2.7.3 Remove Riser 2 ........................................................................................................................................................ 39

2.7.4 Install Riser 2 ............................................................................................................................................................ 39

2.8 Installing and Removing an Add-In Card - Riser Slot 1 .................................................................................... 40

2.8.1 Installing a PCIe* Add-In Card Riser 1 ............................................................................................................ 40

2.8.2 Removing a PCIe* Add-In Card Riser 1 .......................................................................................................... 41

2.9 Installing and Removing an Add-In Card - Riser Slot 2 .................................................................................... 43

2.9.1 Installing a PCIe* Add-In Card Riser 2 ............................................................................................................ 43

2.9.2 Removing a PCIe* Add-In Card from Riser 2 ............................................................................................... 45

2.10 Installation and Removal of the Intel® Omni-Path Fabric Processor Kit. .................................................. 46

2.10.1 Fabric Processor Kit Components ................................................................................................................... 46

2.10.2 Fabric Processor Kit Cables ................................................................................................................................ 47

2.10.3 Installing the Fabric Processor Kit ................................................................................................................... 48

2.10.4 Removing the Fabric Processor Kit ................................................................................................................. 51

2.11 Installing and Removing the Memory ...................................................................................................................... 52

2.11.1 Installing the Memory ........................................................................................................................................... 52

2.11.2 Removing the Memory ......................................................................................................................................... 52

2.12 Installing and Removing the Intel® Remote Management Module 4 Lite ................................................. 53

2.12.1 Installing the Intel® RMM4 Lite .......................................................................................................................... 53

2.12.2 Removing the Intel® RMM4 Lite ........................................................................................................................ 53

2.13 Replacing the Bridge Board ......................................................................................................................................... 54

2.13.1 Installing the Bridge Board ................................................................................................................................. 54

2.13.2 Removing the Bridge Board ............................................................................................................................... 54

2.14 Replacing the Server Main Board .............................................................................................................................. 55

2.14.1 Removing the Server Board ............................................................................................................................... 55

2.14.2 Installing the Server Board ................................................................................................................................. 56

2.15 Installing and Removing the Power Docking Board .......................................................................................... 57

2.15.1 Removing the Power Docking Board .............................................................................................................. 57

2.15.2 Installing the Power Docking Board ................................................................................................................ 57

2.16 Replacing the Fan ............................................................................................................................................................ 58

2.16.1 Removing the Fan ................................................................................................................................................... 58

2.16.2 Installing the Fan ..................................................................................................................................................... 58

2.17 Replacing the Backup Battery .................................................................................................................................... 59

2.18 Installing and Removing the Intel® Trusted Platform Module ............................................................................... 60

2.18.1 Installing the TPM ................................................................................................................................................... 60

2.18.2 Removing the TPM ................................................................................................................................................. 60

2.19 Installing and Removing the VGA (Video) Debug Cable ......................................................................................... 61

2.19.1 Installing Video Debug Cable ............................................................................................................................ 61

2.19.2 Removing the Video Debug Cable ................................................................................................................... 62

3 System Software Updates and Configuration .............................................................................................. 63

3.1 Updating the System Software Stack ...................................................................................................................... 63

3.2 Using the BIOS Setup Utility ........................................................................................................................................ 63

4 Server Utilities .................................................................................................................................................... 65

4.1 Intel® System Information Retrieve Utility (Sysinfo) ............................................................................................ 65

4.2 Intel® One Boot Flash Update Utility (OFU) ........................................................................................................... 65

4.3 Intel® System Event Log (SEL) Viewer Utility.......................................................................................................... 65

4.4 Intel® System Configuration Utility (SYSCFG) ........................................................................................................ 65

Appendix A. Technical Reference ...................................................................................................................... 66

System Environmental Specifications .................................................................................................................................... 66

Appendix B. POST Code Diagnostic LED Decoder ......................................................................................... 67

Appendix C. POST Error Codes .......................................................................................................................... 75

Appendix D. System Interconnects S7200AP / H2000G ............................................................................... 78

Appendix E. Regulatory and Compliance Information ................................................................................. 79

Appendix F. Getting Help .................................................................................................................................... 80

Warranty Information ................................................................................................................................................................... 80

Glossary ....................................................................................................................................................................... 81

List of Figures

Figure 1. Intel® Compute Module HNS7200AP Product Family ........................................................................................ 1

Figure 2. Intel® Ser ver Board S7200AP Product Family .................................................................................................... 1

Figure 3. Intel® Ser ver Board S7200AP Rear Connectors .................................................................................................. 7

Figure 4. Intel® Compute Module HNS7200AP Rear Connectors ..................................................................................... 8

Figure 5. Power Docking Board Features ............................................................................................................................. 8

Figure 6. 6G SATA Bridge Board Features ............................................................................................................................ 8

Figure 7. Intel® Ser ver Board S7200AP Features ................................................................................................................ 9

Figure 8. Intel® Ser ver Board S7200APR ............................................................................................................................. 9

Figure 9. Intel® Light-Guided Diagnostic LEDs – Server Board ....................................................................................... 10

Figure 10. Configuration and Recovery Jumpers ............................................................................................................. 11

Figure 11. Cable Routing ...................................................................................................................................................... 13

Figure 12. Removing the Air Duct ....................................................................................................................................... 14

Figure 13. Installing the Air Duct ........................................................................................................................................ 15

Figure 14. Processor Heatsink Module (PHM) and Processor Socket Reference Diagram ......................................... 16

Figure 15. Processor Reference Diagram - Top and Bottom Views of Processor ......................................................... 17

Figure 16. Grasping the Heatsink Correctly ...................................................................................................................... 18

Figure 17. Placing the Processor Heat Sink on to a Flat Surface ................................................................................... 18

Figure 18. Alignment Features ............................................................................................................................................ 19

Figure 19. Processor Carrier Assembly .............................................................................................................................. 20

Figure 20. Processor Carrier Clip Sub-Assembly.............................................................................................................. 20

Figure 21. Orienting Processor Carrier Clip Sub-assembly to Heat Sink ...................................................................... 21

Figure 22. Processor Heat Sink Module (PHM) ................................................................................................................. 21

Figure 23. Processor Heat Sink Location ........................................................................................................................... 22

Figure 24. Plastic processor socket cover removal .......................................................................................................... 23

Figure 25. PHM Alignment to Bolster Plate ....................................................................................................................... 24

Figure 26. Correct Placement .............................................................................................................................................. 25

Figure 27. Installing the PHM .............................................................................................................................................. 25

Figure 28. Uninstalling the PHM ......................................................................................................................................... 26

Figure 29. Plastic processor socket cover Installation .................................................................................................... 26

Figure 30. PHM Disassembly ............................................................................................................................................... 27

Figure 31. Releasing the Processor Carrier Clip from the Heat Sink ............................................................................. 27

Figure 32. Releasing Processor from Carrier ..................................................................................................................... 28

Figure 33. 1U LACC Assembly ............................................................................................................................................. 29

Figure 34. 1U LACC Assembly installed in the system .................................................................................................... 29

Figure 35. Disconnect the Pump Cable (Fan Header J6J2) ............................................................................................. 30

Figure 36. Remove LACC brackets #1 ................................................................................................................................ 30

Figure 37. Remove LACC brackets #2 ................................................................................................................................ 31

Figure 38. Remove LACC brackets #3 ................................................................................................................................ 31

Figure 39. Remove Cold Plate Assembly ........................................................................................................................... 32

Figure 40. Lift out LACC Assembly ..................................................................................................................................... 32

Figure 41. Releasing CPU and Carrier from Cold Plate .................................................................................................... 33

Figure 42. 1U LACC Assembly ............................................................................................................................................. 33

Figure 43. Install CPU and Carrier to Cold LACC Cold Plate ........................................................................................... 34

Figure 44. Install the LACC assembly into the system ..................................................................................................... 35

Figure 45. Install brackets #1 .............................................................................................................................................. 35

Figure 46. Install LACC brackets #2 .................................................................................................................................... 36

Figure 47. Install LACC brackets #3 .................................................................................................................................... 36

Figure 48. Connect the Pump Cable (fan header J6J2) ................................................................................................... 37

Figure 49. Removing Riser 1 ................................................................................................................................................ 38

Figure 50. Installing Riser 1 ................................................................................................................................................. 39

Figure 51. Removing Riser 2 ................................................................................................................................................ 39

Figure 52. Installing Riser 2 ................................................................................................................................................. 40

Figure 53. Installing the PCIe* Add-In Card– Step 1 ........................................................................................................ 40

Figure 54. Installing the PCIe* Add-In Card – Step 2 ....................................................................................................... 41

Figure 55. Installing the PCIe* Add-In Card – Step 3 ....................................................................................................... 41

Figure 56. Removing the PCIe* Add-In Card – Step 1 ...................................................................................................... 42

Figure 57. Removing the PCIe* Add-In Card – Step 2 ...................................................................................................... 42

Figure 58. Removing the PCIe* Add-In Card– Step 3 ....................................................................................................... 43

Figure 59. Installing the PCIe* Add-In Card– Step 1 ........................................................................................................ 44

Figure 60. Installing the PCIe* Add-In Card– Step 2 ........................................................................................................ 44

Figure 61. Installing the PCIe* Add-In Card– Step 3 ........................................................................................................ 44

Figure 62. Removing the PCIe* Add-In Card – Step 1 ...................................................................................................... 45

Figure 63. Lift out the Riser and Add-In-Card– Step 2 ..................................................................................................... 46

Figure 64. Remove the Add-In-Card from Riser 2– Step 3 .............................................................................................. 46

Figure 65. Installing the IFT Carrier .................................................................................................................................... 47

Figure 66. Intel® Omni-Path Sideband Cable Connection ............................................................................................... 47

Figure 67. Intel® Omni-Path Fabric Processor Cable ........................................................................................................ 47

Figure 68. Sideband Cable Connection ............................................................................................................................. 48

Figure 69. Installing the IFT Carrier .................................................................................................................................... 49

Figure 70. Fabric Processor and IFT Cable Connections ................................................................................................. 50

Figure 71. Disconnecting IFP Cables .................................................................................................................................. 51

Figure 72. Installing the Memory........................................................................................................................................ 52

Figure 73. Installing the Intel® RMM4 Lite ......................................................................................................................... 53

Figure 74. Installing the Bridge Board ............................................................................................................................... 54

Figure 75. Removing the Bridge Board .............................................................................................................................. 54

Figure 76. Removing the Cable Connections from the Server Board ............................................................................ 55

Figure 77. Removing the Server Board .............................................................................................................................. 55

Figure 78. Installing the Server Board ............................................................................................................................... 56

Figure 79. Connecting all Cables ........................................................................................................................................ 56

Figure 80. Removing the Power Docking Board ............................................................................................................... 57

Figure 81. Installing the Power Docking Board ................................................................................................................ 57

Figure 82. Removing the Fan ............................................................................................................................................... 58

Figure 83. Installing the Fan ................................................................................................................................................ 58

Figure 84. Replacing the Backup Battery .......................................................................................................................... 59

Figure 85. Installing the Intel® Trusted Platform Module ............................................................................................... 60

Figure 86. Video Cable Routing........................................................................................................................................... 61

Figure 87. Connecting video cable to board VGA connector .......................................................................................... 61

Figure 88. Reseat Riser with video cable ........................................................................................................................... 62

Figure 89. Video Cable Routing........................................................................................................................................... 62

Figure 90. POST Diagnostic LED Location ......................................................................................................................... 67

Figure 91. System Interconnect .......................................................................................................................................... 78

List of Tables

Table 1. Server System References ..................................................................................................................................... vii

Table 2. Intel® Compute Module HNS7200AP Product Family Feature Set .................................................................... 3

Table 3. Intel® Server Board S7200APR (Refresh) Product Family Feature Set .............................................................. 4

Table 4. Intel® Compute Module HNS7200APR Product Family Feature Set .................................................................. 6

Table 5. Processor Carriers .................................................................................................................................................. 17

Table 6. Processor Heat Sinks ............................................................................................................................................. 22

Table 7. BIOS Setup: Keyboard Command Bar ................................................................................................................. 64

Table 8. System Environmental Limits Summary ............................................................................................................. 66

Table 9. POST Progress Code Decoding LED Example .................................................................................................... 68

Table 10. MRC Fatal Error Codes ......................................................................................................................................... 69

Table 11. MRC Progress Codes ............................................................................................................................................ 70

Table 12. POST Progress Codes .......................................................................................................................................... 71

Table 13. POST Error Codes and Messages ....................................................................................................................... 75

Table 14. POST Error Beep (with LED) Codes ................................................................................................................... 77

Tab le 1 5 . Integrated BMC Beep (with LED) Codes ............................................................................................................ 77

1 Product Features

This chapter briefly describes the main features of the Intel® Server Board S7200AP/APR and the Intel® Compute Module HNS7200AP/APR. This includes illustrations of the products, a list of features, and diagrams showing the location of important components and connections. The two main boards are described in this document to include support for several chassis. The document includes updates for Intel® Server Board S7200APR refresh product that is supported in the Intel® Server Chassis H2204XXLRE.

Figure 1. Intel® Compute Module HNS7200AP Product Family

Figure 2. Intel® Server Board S7200AP Product Family

Feature

Description

Processor Support

Intel® Xeon™ Phi™ x200 Product Family

36 lanes of Integrated PCI Express® 3.0 low-latency I/O

Memory Support

Six DIMM slots in total across six memory channels

Max memory 384GB

Chipset

Intel C610 “Wellsburg” Platform Controller Hub (PCH)

External I/O Connections

Two USB 3.0 connectors Two RJ-45 10/100/1000 Mbit Network Interface Controller (NIC) ports

Internal I/O

One USB 2.0 Header

One Serial Port A Header

PCIe Support

PCIe* 3.0 (2.5, 5, 8 GT/s)

Power Connections

• One 2x4 pin main power connector

One 4 pin power connector for disk drive power

System Fan Support

Three 40x56mm double rotor fans One 4 pin CPU fan or liquid cooling pump support header

Video

128MB DDR3 memory

1.1 Product Feature Overview

1.1.1 Server Board Feature Set

Intel® Server Board S7200AP Product Family contains two server board options. Intel® Server Board S7200AP supports Intel® Xeon™ Phi™ x200 CPUs (up to 230w TDP) in Intel® Server Chassis H2312XXLR2 and H2216XXLR2.

Intel® Server Board S7200APR supports both Intel® Xeon™ Phi™ x200 and Intel® Xeon™ Phi™ 72x5 Product Family CPUs (up to 320w TDP) in Intel® Server Chassis H2204XXLRE.

This document describes the servicing of both compute modules. Although, these boards are independent and stand-alone products, there are many features and service steps that are common to each board. These common steps will be identified in its respective section.

The following tables list the common feature set, however, a board will be identified by its product code when a described feature or function is unique to it.

Table 1. Intel® Server Board S7200AP Product Family Feature Set

connectors/headers

 Single processor socket P (3647 pins)  Thermal Design Power (TDP) up to 230W



 Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)  Memory DDR4 data transfer rates of 2400/2666 MT/s  1 DIMM per channel



  

 One TPM Header  One Intel® Omni-Path Fabric Signal Connector  One mSATA Connector  One Bridge Board Connector  One 2x7 pin header for system fan module  One Aux Front Panel Connector  Three 8-pin fan headers for non-Intel chassis support  One 4 pin CPU fan or liquid cooling pump support header  One PSU Control Header  One RMII header for Intel® RMM4 Lite  One internal RGB Video Header



• One 2x2 pin aux. power connector

•

 

 Integrated 2D video graphics controller



Feature

Description

Riser Support

One PCIe Gen3 x16 standard riser connector

On-board storage

controllers and options

Integrated 10-port SATA

o 4 ports to MiniSAS HD connector

Fabric

Dual port Intel® Omni-Path Fabric via

Single Port Intel® Omni-Path Fabric via x16 Gen 3 PCIe Adapter

Network (LAN)

Dual i210 Springvilles

to management traffic.

Server Management

Feature1

Description

Server Board

Intel® Xeon™ Phi™ x200 Product Family

CPUs with Integrated Intel® Omni-Path Fabric supported

Processor TDP Support

Maximum supported Thermal Design Power (TDP) of up to 230W

Heatsink

One 80x107mm 1U Heatsink

Fan

Three 40x56mm dual rotor system fans

Riser Support

One PCIe Gen3 x16 standard riser connector

Compute Module Board

One compute module power docking board

Air Duct

One transparent air duct



o Supports a low-profile adapter in Riser Slot 1

 One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector

o Supports a x16 low-profile adapter in Riser Slot 2

o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs with

integrated Intel® Omni-Path Fabric are used



o 5 ports to bridge board, o 1 port to mSATA



 

 Dual 10/100/1000Gbe RJ45 connectors  NC_SI sideband to BMC. Option to host share or dedicate a Network port

 Onboard Emulex* Pilot III* Controller

 Support for Intel  Support for Intel

 Support for Intel® Intelligent Power Node Manager

Remote Management Module 4 Lite solutions

System Management Software

Xeon™ Phi™ x200 Product Family

NOTE: The Riser Slot 1 on the server board is designed for plugging in ONLY the riser adapter. Plugging in a PCIe* adapter directly into the riser slot may cause permanent server board and/or PCIe* card damage.

1.1.2 HNS7200AP Compute Module Feature Set

Table 2. Intel® Compute Module HNS7200AP Product Family Feature Set

 Single processor socket P (3647 pins)  Thermal Design Power (TDP) up to 230W  36 lanes of Integrated PCI Express® 3.0 low-latency I/O



 One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector

 Bridge boards:



o Supports a low-profile adapter in Riser Slot 1

o Supports a x16 low-profile adapter in Riser Slot 2

o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs

with integrated Intel® Omni-Path Fabric are used

o 6G SATA Bridge Board (Default)

Feature1

Description

Form Factor

Length 14.17” (360m), width 6.81” (173mm)

Feature

Description

Dimensions (2U)

438mm x 86.9mm x 771/733mm

Node Support

Intel® Compute Module options: Power Supply

2 x 2130W AC CRPS

System Cooling

3 dual rotor 40 x 56 mm fixed fans per node

PCIe support

Two low profile PCIe cards on riser 1 and 2

Storage

8 x 2.5” SATA drive Note: 2.5” SATA HDD installed in the 3.5” Drive Carrier

System SKUs

Support for H2312XXLR2 and H2216XXLR2 chassis only

NOTE: The table only lists features that are unique to the compute module or different with the server

board.

1. ONLY standard low profile PCIe* cards can be installed in the riser card slots.

1.1.3 Chassis Feature Set for Intel® Compute Module HNS7200AP

The following table lists a brief description of the 2U H2000G Chassis Product Family features,

17.24” width x 3.42 length x 30.35/28.86” height

HNS7200AP (up to four)

16 x 2.5” SATA drives

Bridge Board Options:

(1) 6G SATA only RAID 0, 1, 10 SW RAID ESRT2

Note: Intel® Compute Module HNS7200AP is not supported in Intel® Server Chassis H2204XXLRE For additional details on chassis features, refer to the Intel® Server Chassis H2000G and H2000P Product

Family TPS and Service Guide.

Table 3. Intel® Server Board S7200APR (Refresh) Product Family Feature Set

Feature

Description

Processor Support

Intel® Xeon™ Phi™ 72x5 Product Family

CPUs with Integrated Intel® Omni-Path Fabric supported

Memory Support

Six DIMM slots in total across six memory channels

Max memory 384GB

Chipset

Intel C610 “Wellsburg” Platform Controller Hub (PCH)

External I/O Connections

Two USB 3.0 connectors Two RJ-45 10/100/1000 Mbit Network Interface Controller (NIC) ports

Internal I/O

One USB 2.0 Header

One Serial Port A Header

PCIe Support

PCIe* 3.0 (2.5, 5, 8 GT/s)

Power Connections

• One 2x4 pin main power connector

One 4 pin power connector for disk drive power

System Fan Support

Three 40x56mm double rotor fans One 4 pin CPU fan or liquid cooling pump support header

Video

128MB DDR3 memory

Riser Support

One PCIe Gen3 x16 standard riser connector

On-board storage

o 4 ports to MiniSAS HD connector

Fabric

connectors/headers

 Single processor socket P  Thermal Design Power (TDP) up to 320W with the 1U LACC thermal

solution

 36 lanes of Integrated PCI Express® 3.0 low-latency I/O

Intel® Xeon™ Phi™ x200 Product Family

 Single processor socket P (3647 pins)  Thermal Design Power (TDP) up to 230W (Air Cooled Heatsink)

 36 lanes of Integrated PCI Express® 3.0 low-latency I/O



 Registered DDR4 (RDIMM), Load Reduced DDR4 (LRDIMM)  Memory DDR4 data transfer rates of 2400/2666 MT/s  1 DIMM per channel



  

 One TPM Header  One Intel® Omni-Path Fabric Signal Connector  One mSATA Connector  One Bridge Board Connector  One 2x7 pin header for system fan module  One Aux Front Panel Connector  Three 8 pin fan headers for third-party chassis support  One 4 pin CPU fan or liquid cooling pump support header  One PSU Control Header  One RMII header for Intel® RMM4 Lite  One internal RGB Video Header



• One 2x2 pin aux. power connector

•

 

 Integrated 2D video graphics controller

 

o Supports a low-profile adapter in Riser Slot 1

 One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector

o Supports a x16 low-profile adapter in Riser Slot 2

controllers and options

 Integrated 10-port SATA

 Single Port Intel® Omni-Path Fabric via x16 Gen 3 PCIe Adapter

o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs with

integrated Intel® Omni-Path Fabric are used

o 5 ports to bridge board, o 1 port to mSATA

Feature

Description

Network (LAN)

Dual i210 Springvilles

to management traffic.

RAID Support

Server Management

Onboard Emulex* Pilot III* Controller

Support for Intel

Intelligent Power Node Manager

Feature1

Description

Server Board

Intel® Xeon™ Phi™ 72x5 Product Family

CPUs with Integrated Intel® Omni-Path Fabric supported

Processor TDP Support

Maximum supported Thermal Design Power (TDP) of up to 320W

Heatsink

Liquid Assisted Air Cooling (LAAC)

Fan

Three 40x56mm dual rotor system fans

Riser Support

One PCIe Gen3 x16 standard riser connector

Compute Module Board

One compute module power docking board

Air Duct

One transparent air duct

Form Factor

Length 14.17” (360m), width 6.81” (173mm)



 Dual 10/100/1000Gbe RJ45 connectors  NC_SI sideband to BMC. Option to host share or dedicate a Network port

 Intel



 Support for Intel  Support for Intel



Embedded Server RAID Technology 2 (ESRT2)

Remote Management Module 4 Lite solutions

System Management Software

1.1.4 HNS7200APR Compute Module Feature Set

Table 4. Intel® Compute Module HNS7200APR Product Family Feature Set

 Single processor socket P  Thermal Design Power (TDP) up to 320W with the 1U LACC

thermal solution

 36 lanes of Integrated PCI Express® 3.0 low-latency I/O

Intel® Xeon™ Phi™ x200 Product Family

 Single processor socket P (3647 pins)  Thermal Design Power (TDP) up to 230W (Air Cooled Heatsink)  36 lanes of Integrated PCI Express® 3.0 low-latency I/O



NOTE: The table only lists features that are unique to the compute module or different with the server

board.

1. ONLY standard low profile PCIe* cards can be installed in the riser card slots.

 One 80x107mm 1U Heatsink-CPUs < 245W TDP  1U Liquid Assisted Air Cooling (LAAC) -CPUs > 245W TDP



o Supports a low-profile adapter in Riser Slot 1

 One PCIe Gen3 x20 HSEC-8 fine-pitch riser connector

o Supports a x16 low-profile adapter in Riser Slot 2

o Supports a x4 low-profile adapter in Riser Slot 2 when CPUs

with integrated Intel® Omni-Path Fabric are used

 Bridge boards:

o 6G SATA Bridge Board (Default)



Feature

Description

Dimensions (2U)

438mm x 86.9mm x 771/733mm

Node Support

Intel® Compute Module options: Power Supply

2 x 2130W AC CRPS

System Cooling

3 dual rotor 40 x 56 mm fixed fans per node

PCIe support

Two low profile PCIe cards on riser 1 and 2

Storage

4 x 2.5” SATA drive Note: 2.5” SATA HDD installed in the 3.5” Drive Carrier

System SKUs

Supported for H2204XXLRE chassis only

Label

Description

Label

Description

USB 3.0 Por t 1

USB 3.0 Por t 2

NIC port 1 (RJ45)

NIC port 2 (RJ45)

POST Code LEDs (8 LEDs)

ID LED

Status LED

1.1.5 Chassis Feature Set for Intel® Compute Module HNS7200APR

The following table lists a brief description of the 2U H2000-G Chassis Product Family features

17.24” width x 3.42 length x 30.35/28.86” height

HNS7200APR (up to four)

Bridge Board Options:

(1) 6G SATA only RAID 0, 1, 10 SW RAID ESRT2

Note: Intel® Compute Module HNS7200APR is not supported in Intel® Server Chassis H2312XXLR2 and H2216XXLR2

For additional details on chassis features, refer to the Intel® Server Chassis H2000G Product Family TPS.

1.2 Back Panel Feature Identification

The Intel® Compute Module HNS7200AP product family has the following board rear connector placement and features.

Figure 3. Intel® Server Board S7200AP Rear Connectors

Label

Description

2x7 pin fan control connector

8 pin connector for fan 1

2x6 pin Minifit Jr. main power output connector

8 pin connector for fan 2

12 pin connector for main power input

8 pin connector for fan 3

Label

Description

2x40 pin card edge connector (to the backplane)

2x40 pin card edge connector (to the baseboard slot)

Figure 4. Intel® Compute Module HNS7200AP Rear Connectors

1.3 Power Docking Board Features

Figure 5. Power Docking Board Features

1.4 Bridge Board Feature Features

Figure 6. 6G SATA Bridge Board Features

1.5 Server Board Features

This section helps you identify the components and connectors on the server board. Intel® Server Board S7200AP features shown. All major features that are called out are common to both boards.

Figure 7. Intel® Server Board S7200AP Features

Figure 8. Intel® Server Board S7200APR

1.6 Intel® Light-Guided Diagnostics

Figure 9. Intel® Light-Guided Diagnostic LEDs – Server Board

The POST Code Diagnostic LEDs on the server board change color or state (off, green, red, and amber) according to the POST sequence.

The Status LED on the rear of the board shows the overall health of the system (green, blinking green, blinking amber, amber, and off).

The Identification LED on the rear of the board helps identify the server from among several servers. The ID LED is off by default, and blue when activated by button or software.

Jumper Name

Description

BMC Force Update (J2G1)

If pins 2-3 are selected, the Integrated BMC Force Update Mode is enabled. These pins should be selected on 1-2 for normal system operation.

BIOS Default (J2B1)

If pins 2-3 are selected, the BIOS settings are restored to the factory defaults on the next reset. These pins should be selected on 1-2 for normal system operation.

BIOS Recovery

If the system BIOS is corrupted, an onboard backup copy of the BIOS can be loaded using the BIOS

1.7 Configuration and Recovery Jumpers

Figure 10. Configuration and Recovery Jumpers

(J3B3)

Recovery Jumper. To load the backup BIOS image, move the jumper from pins 1-2 (default) to pins 2-3, and

for normal system operation.

Password Clear(J2B3)

If pins 2-3 are selected, administrator and user passwords are cleared within five to ten seconds after the system is powered on. These pins should be selected on 1-2 for normal system operation.

ME Force Update (J3B2)

If pins 2-3 are selected, the ME Force Update Mode is enabled. These pins should be selected on 1-2 for normal system operation.

power on the system. The system will boot to the backup BIOS image. These pins should be selected on 1-2

1.8 Advanced Management Options

1.8.1 Intel® Remote Management Module 4 Lite

The Intel® Remote Management Module 4 Lite plugs into a dedicated connector on the server board and provides additional server management functionality to the compute module. The Intel® Remote Management Module 4 Lite, together with the dedicated management port provides a dedicated web server for viewing server information and remote control of the compute module. It also provides Remote KVM Redirection and USB Media Redirection allowing USB devices attached to the remote system to be used on the managed server.

For instructions on installing the Intel® Remote Management Module 4 Lite, see section 2.10.

2 Hardware Installations and Upgrades

2.1 Before You Begin

Before working with your server product, closely review the Safety Information at the beginning of this document.

NOTE: Prior to servicing the compute module or chassis, power down the server, unplug all peripheral devices and the AC power cords.

2.1.1 Tools and Supplies Needed

• Phillips* (cross head) screwdriver (#1 bit and #2 bit)

• T30 Tor x bit screwdriver

• Flat head screwdriver

• Needle nosed pliers

• Anti-static wrist strap and conductive foam pad (recommended)

2.1.2 System Reference

All references to left, right, front, top, and bottom assume that the reader is facing the front of the chassis as it would be positioned for normal operation.

2.2 Cable Routing

Each compute module is self-contained and can be hot swapped without any impact to other compute modules. When you add or remove components from the compute module enclosure, ensure that cables are routed correctly before plugging in the compute module back into the chassis. Use caution to ensure that cables or wires are not pinched and that the airflow from the fans is not blocked. Use the figures below to determine the correct cable routing. Section 2.2 applies to both server boards.

Figure 11. Cable Routing

NOTES:

• Orange line: Fan cable connection

• Blue line: Server board power cable connection

• Red line: Fan control signal cable connection

2.3 Removing and Installing the Air Duct

Always operate your compute module with the air duct in place. The air duct is required for proper airflow within the compute module. Intel® Server Board S7200AP. Section 2.3 applies to both server compute module.

2.3.1 Removing the Air Duct

1. Press and hold both the left and right side buttons of the air duct (See letter A).

2. Rotate the air duct more than 45 degrees and pull it out. (See letter B).

Figure 12. Removing the Air Duct

2.3.2 Installing the Air Duct

NOTES: Ensure that all DIMM latches are closed before installing the air duct.

1. Align the front end of the air duct with the hinges on both sides of the fan bracket (See letter A).

2. Rotate the air duct (See letter B) and lower it down until the left and right side buttons snaps into place.

Figure 13. Installing the Air Duct

2.4 Processor Assembly Installation and Removal

2.4.1 Assembling the Processor Heat Sink Module (PHM)

The processor heat sink module (PHM) refers to the sub-assembly where the heat sink and processor are attached together prior to installation onto the server board.

Figure 14. Processor Heatsink Module (PHM) and Processor Socket Reference Diagram

Procedures described in the following sections must be followed in the order specified to properly assemble the PHM, install it to, or remove it from the server board. These instructions assume that all the PHM components are new and the thermal interface material (TIM) is already applied to the bottom of the heat sink.

Required Tools:

• T-30 Torx screwdriver

• Flat head screwdriver

• Adequate ESD protective gear (wrist strap, ESD mat)

CAUTION: Refer to the “Warning” section at the beginning of this document for detailed ESD precautions.

NOTE: Fabric supported processor models require the use of a Fabric Carrier assembly. Fabric Carrier assemblies are sold separately and can be obtained by ordering the following Intel Accessory Kit - iPC

Carrier Clip Model

iPN*

Carrier Clip Assembly

Standard Processor Carrier

AXX2PFABKIT. Refer to the Product Configuration Guide for this Intel Server product family for additional ordering details.

WARNING: Attempting to use a standard processor carrier clip assembly with a fabric supported processor may result in component damage and/or induce improper assembly of the PHM. See the following table and figures for an overview of the different processor carrier and processors.

Table 5. Processor Carriers

(Default) Included with Systems

H53249-00x

Fabric Processor Carrier

(Accessory)

H53248-00x

NOTE: * For reference only. Intel part numbers (iPN) are not used for ordering purposes. Intel parts that are available as a Spare or Accessory are orderable via Intel Product Codes (iPC).

Figure 15. Processor Reference Diagram - Top and Bottom Views of Processor

WARNING: Damage to the processor heat sink may occur when grasping the heat sink by the longer sides

and squeezing fins together. Processor heat sinks should only be grasped using the shorter edges of the heat sink as shown in the following illustration.

Figure 16. Grasping the Heatsink Correctly

1. Remove the heat sink from its packaging. With the thermal interface material (TIM) facing up, place the

heat sink on to a flat surface as shown in the following illustration.

Figure 17. Placing the Processor Heat Sink on to a Flat Surface

CAUTION: Do not touch the sensitive contacts on the bottom side of the processor at any time

during PHM assembly or installation. In addition, the pins inside the processor socket are extremely sensitive. A damaged processor socket may produce unpredictable system errors

2. If present, carefully remove the plastic protective cover from the bottom side of the processor.

NOTE: The PHM and processor socket include several alignment features as shown in the following illustration to ensure proper assembly and installation. Care should be taken to ensure components are accurately assembled and the PHM is oriented correctly to the processor socket prior to installation.

CAUTION: Handle the processor carefully. Do not touch the bottom-side contacts or components, always grip the processor by its edges.

Figure 18. Alignment Features

3. Orient the processor with the heat spreader side down so its alignment features match those of the

carrier clip as shown in the following figures.

Figure 19. Processor Carrier Assembly

4. Install the processor into the processor carrier clip until it snaps into place.

Figure 20. Processor Carrier Clip Sub-Assembly

CAUTION: A processor can dislodge from the processor carrier clip if the assembly is grasped by

the long narrow edges of the processor clip. The processor carrier assembly should only be grasped using the shorter edges of the assembly.

5. If present, remove the protective film covering the TIM on the bottom side of the heat sink.

6. Orient the processor carrier clip sub-assembly over the processor heat sink so that all corner features

are in alignment.

Figure 21. Orienting Processor Carrier Clip Sub-assembly to Heat Sink

7. Push the processor carrier clip sub-assembly down on to the processor heat sink until it snaps into

place, ensuring all four corners are secure.

Figure 22. Processor Heat Sink Module (PHM)

2.4.2 Processor Installation

iPC - AXXAPHS

Table 6. Processor Heat Sinks

Intel Product Code (iPC) MM# Description

MM# - 942344

1U Standard Ex-Al 80mm x 107mm Heat Sink

Figure 23. Processor Heat Sink Location

1. Remove the plastic processor socket cover. Grasp the socket cover using the finger grips on each end

as shown in the following figure, (See letter A) then carefully pull up to remove (See letter B).

Figure 24. Plastic processor socket cover removal

NOTE: The processor socket cover should be saved for future use.

CAUTION: When re-installing the socket cover, make sure it properly snaps into place. Improper

installation will cause it to become loose and damage the processor socket.

2. Install PHM to Processor socket. a. Align the mounting holes of the PHM (located on diagonal corners) to the bolster plate guide pins

of the processor socket as shown in the following figure.

NOTE: Each of the two guide pins of the bolster plate has a different diameter. Each guide pin will have a matching PHM mounting hole which allows for only one orientation when installed as shown in the following figure. Look for the wide and narrow holes for proper and accurate alignment.

Figure 25. PHM Alignment to Bolster Plate

b. Lower the PHM onto the processor socket assembly.

CAUTION: Processor socket pins are delicate and bend easily. Use extreme care when placing the PHM onto the processor socket.

NOTE: See the illustration below and confirm proper PHM installation by visually checking whether or not the PHM sits level with the processor socket assembly. The PHM is NOT installed properly if it does not sit level with the processor socket assembly. Improperly installed PHMs cannot be fastened down. PHMs can only be fastened down if correctly installed.

Figure 26. Correct Placement

3. Secure PHM to the processor socket assembly.

a) Using a T30 Torx bit screwdriver, securely tighten (12 in-lb.) each nut in the sequence shown on

the label located on the top of the heat sink. Follow the (#1→ #2 → #3→ #4) sequence when tightening. Tighten each screw prior to moving to the next.

Figure 27. Installing the PHM

CAUTION: Failure to tighten the heat sink screws in the specified order may cause damage to the

processor socket assembly. Each heat sink screw should be fully tightened to 12 in-lb torque before securing the next screw in the sequence.

2.5 Processor Removal

WARNING: Processor heat sinks can become extremely hot during normal system operation. Before

attempting to remove the processor from the server board, ensure system power has been fully disconnected and allow the processor heat sinks to fully cool before attempting to remove the PHM from the server board.

1. Using a T30 Torx bit screwdriver, loosen each heat sink nut in the sequence shown on the label

affixed to the top side of the heat sink (#4→ #3 → #2→ #1) (See letter A). Loosen each screw all the way prior to moving to the next.

2. Lift the PHM straight up from the server board until free from the bolster plate guide pins (See letter

B).

Figure 28. Uninstalling the PHM

4. If a processor is not being installed, re-install the plastic processor socket cover.

Figure 29. Plastic processor socket cover Installation

2.5.1 PHM Disassembly

1. Place the PHM (heat sink down) onto a flat surface.

2. To remove the processor and clip sub-assembly from the heat sink, using a flat head screw driver,

carefully release the bond between processor and heat sink as shown in the following illustration.

Figure 30. PHM Disassembly

3. Unlatch the hooks on each corner of the processor carrier clip to free the processor carrier from the

heat sink.

4. Carefully lift the processor sub-assembly away from the heat sink.

Figure 31. Releasing the Processor Carrier Clip from the Heat Sink

5. Remove the processor from the processor carrier by carefully pushing back one of the latches located

on the ends of the processor and rotating the processor up and out of the processor carrier.

Figure 32. Releasing Processor from Carrier

2.6 Installation and Removal of the 1U LACC

Intel® Server Board S7200APR and Intel® Server Compute Module HNS7200APRL product family support the Intel® Xeon™ Phi™ processors Bootable CPUs (up to 320W TDP) in Intel® Server Chassis H2204XXLRE. All Intel® Xeon™ Phi™ Processors x200 or 72x5 CPU SKUs at 245W or greater TDP require use of the Intel® 1U Liquid Assisted Air Cooling (LACC) solution for optimal thermal support. The Intel® Server Board S7200APR product family Technical Product Specfication (TPS) decribes the 1U LAAC in detail. This section of the Service Guide describes the installation and removal of the 1U LACC coolling solution.

Note: Passive Air Cooled Heatsinks are not supported on CPUs with TDPs equal to or higher than 245w regardless of the supported CPU generation.

2.6.1 Removal of the 1U LACC Assembly

Figure 33. 1U LACC Assembly

Figure 34. 1U LACC Assembly installed in the system

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Disconnect the pump cable that is connected to the 4-pin CPU Fan Header (J6J2)

Figure 35. Disconnect the Pump Cable (Fan Header J6J2)

4. Next, remove the LACC Heat Exchanger retaining brackets by removing the 4 screws.

Figure 36. Remove LACC brackets #1

Figure 37. Remove LACC brackets #2

Figure 38. Remove LACC brackets #3

5. Finally, remove the LACC Cold Plate assembly. The LACC cold plate assembly is modeled after the

passive air heatsink assembly. The sequence and method of removing the cold plate is exactly the same as the passive air heatsink. Follow carefully the screw loosening sequence. Refer to the passive air heatsink removal instructions in Section 2.5

for detail.

Figure 39. Remove Cold Plate Assembly

6. Carefully lift the LACC Assembly away from the node. Use two hands to grasp the heat exchanger and

cold plate to safely remove the LACC assembly.

Figure 40. Lift out LACC Assembly

2.6.2 Remove the CPU and Carrier Assembly

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Follow the procedures in Section 2.6.1 for LACC assembly removal

4. Turn the LACC and cold plate assembly over as shown in Figure 41

5. The LACC cold plate assembly is modeled after the passive air heatsink assembly. The sequence and

method of removing the CPU and Carrier is exactly the same as the passive air heatsink. This step is only required if the CPU requires replacement. For simplification, refer to the CPU and Carrier removal instructions in Section 2.5

for detail.

Figure 41. Releasing CPU and Carrier from Cold Plate

2.6.3 Install the 1U LACC Assembly

Figure 42. 1U LACC Assembly

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. The LACC cold plate assembly is modeled after the passive air heatsink assembly. The sequence and

method of installing the CPU and Carrier is exactly the same as the passive air heatsink. This step is only required if the CPU requires replacement or installation. For simplification, refer to the CPU and Carrier installation instructions in Section 2.4

for detail.

Figure 43. Install CPU and Carrier to Cold LACC Cold Plate

4. Carefully place and position the LACC assembly back into the system by using two hands. Ensure that

it is properly aligned and that the cold plate aligns correctly with the CPU socket assembly and guide pins.

Figure 44. Install the LACC assembly into the system

5. Next, align and install the LACC cold plate assembly. Tighten the LACC Cold Plate assembly nuts. The

LACC cold plate assembly is modeled after the passive air heatsink assembly. The sequence and method of tightening the cold plate screws is exactly the same as the passive air heatsink. Follow the tightening sequence carefully. Refer to the passive air cooled heatsink installation instructions in

Section 2.4

for detail.

Figure 45. Install the LACC assembly into the system

6. Install the LACC Heat Exchanger retaining brackets by installing the 4 screws.

Figure 46. Install brackets #1

Figure 47. Install LACC brackets #2

Figure 48. Install LACC brackets #3

7. Connect the pump cable to the 4-pin CPU Fan Header (J6J2)

Figure 49. Connect the Pump Cable (fan header J6J2)

2.7 Removing and Installing Riser 1 and Riser 2

2.7.1 Remove Riser 1

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Loosen the 3 screws (See A )

4. Pull the riser straight up and out of the system (See B and C)

Figure 50. Removing Riser 1

2.7.2 Install Riser 1

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Align and insert Riser 1 into Riser Slot 1 (See A)

4. Ensure that the Riser is all the way down and fully seated (See B)

5. Tighten the 3 screws (See C)

Figure 51. Installing Riser 1

2.7.3 Remove Riser 2

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Loosen the 3 screws (See A )

4. Pull and lift the riser straight up and out of the system (See B and C)

Figure 52. Removing Riser 2

2.7.4 Install Riser 2

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Align and insert Riser 2 into Riser Slot 2 (See A)

4. Ensure that the Riser is all the way down and fully seated (See B)

5. Tighten the 3 screws (See C)

Figure 53. Installing Riser 2

2.8 Installing and Removing an Add-In Card - Riser Slot 1

2.8.1 Installing a PCIe* Add-In Card Riser 1

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Remove Riser 1 See section 2.7.1

4. Remove the filler panel and attach the Add-In Card to the riser card assembly.

5. Insert the PCIe* Add-In Card into the riser slot (See letter A).

Figure 54. Installing the PCIe* Add-In Card– Step 1

6. Align and insert the PCIe* riser assembly into the Riser Slot 1 on the server board (See letter B).

Figure 55. Installing the PCIe* Add-In Card – Step 2

7. Install and tighten the three screws (See letter C).

Figure 56. Installing the PCIe* Add-In Card – Step 3

2.8.2 Removing a PCIe* Add-In Card Riser 1

1. Loosen the three screws (See letter A).

Figure 57. Removing the PCIe* Add-In Card – Step 1

2. Pull the Add-In Card assembly up and out (See letter B).

Figure 58. Removing the PCIe* Add-In Card – Step 2

3. Remove the Add-In Card from the riser (See letter C).

4. Re-install the filler panel

5. Re-install Riser 1 See section 2.7.2

Figure 59. Removing the PCIe* Add-In Card– Step 3

2.9 Installing and Removing an Add-In Card - Riser Slot 2

2.9.1 Installing a PCIe* Add-In Card Riser 2

Note: Riser Slot 2 has two Riser options. Select the appropriate Riser (PCIe*X8 or X16 riser for slot 2) for

your configuration. See the product configuration guide and technical product specification for details.

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Remove Riser 2 See section 2.7.3

4. Remove the filler panel and attach the Add-In Card to the riser card assembly.

5. Insert the PCIe* Add-In Card into the riser slot (See letter A).

Figure 60. Installing the PCIe* Add-In Card– Step 1

6. Align and insert the PCIe riser assembly into the Riser Slot 1 on the server board (See letter B).

Figure 61. Installing the PCIe* Add-In Card– Step 2

7. Ensure that the Add-In Card and Riser are fully seated (See letter C).

8. Tighten the three screws (See letter D).

Figure 62. Installing the PCIe* Add-In Card– Step 3

2.9.2 Removing a PCIe* Add-In Card from Riser 2

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Loosen the three screws (See letter A).

4. Pull straight up on Riser 2 with the PCIe* Add-In Card assembly (See letter B).

Figure 63. Removing the PCIe* Add-In Card – Step 1

5. Lift out the PCIe* Slot 2 Riser with Add-In-Card.

Figure 64. Lift out the Riser and Add-In-Card– Step 2

6. Remove the Add-In Card from the riser (See letter D).

7. Re-install the filler panel

8. Re-install Riser 2 See section 2.7.4

Figure 65. Remove the Add-In-Card from Riser 2– Step 3

2.10 Installation and Removal of the Intel® Omni-Path Fabric

Processor Kit.

The Intel® Xeon™ Phi™ x200 Product Family CPUs with integrated Intel® Omni-Path Fabric is required for use in conjunction with the Intel® Fabric Through (IFT) carrier for full fabric connectivity. The following sections will provide procedures on how to install and remove the optional Intel® Omni-Path Fabric Processor Kit (iPC – AXX2PFABKIT) and the Intel® Xeon™ Phi™ (Fabric) processor. The IFT Carrier card is installed in PCIe* Riser Slot 1. Refer to the S7200AP Family Configuration Guide & Spares/Accessories List for ordering details.

Note: The Intel® Omni-Path Fabric Processor Kit is not supported when Intel® Xeon™ Phi™ 72x5 Product Family CPUs are installed.

2.10.1 Fabric Processor Kit Components

1. The Intel® Omni-Path Fabric Processor Kit consists of the following components:

a) Intel® Fabric Through (IFT) carrier card b) Intel® Omni-Path Fabric Sideband Cable c) Intel® Omni-Path Fabric Processor Cable d) Fabric CPU carrier assembly

Figure 66. Installing the IFT Carrier

2.10.2 Fabric Processor Kit Cables

1. The two cables are included with the kit. Cables are labeled for illustration purposes.

Figure 67. Intel® Omni-Path Sideband Cable Connection

Figure 68. Intel® Omni-Path Fabric Processor Cable

2.10.3 Installing the Fabric Processor Kit

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. See section 2.4.1 for instructions on how to assemble the (processor heat sink module) PHM, fabric

CPU carrier assembly and mount it onto the server board. Note that the fabric carrier clip that comes with the kit must be used with the fabric CPU.

4. Remove the Fabric Processor Kit components

5. For ease of installation, prior to installing the carrier card into Riser 1, install the sideband cable (P2,

black end) into carrier card connector J3A1 on the carrier card (See letter A in figure 51). Leave the other end of the cable (P1, white end) disconnected for later installation into the main board sideband fabric connector J5J2.

6. PCSD customers should ensure that IFT Carrier Card Jumper J1A2 is set for pin position 2-3 for

normal operation.

NOTE: The actual view of the IFT carrier card has been modified in order to illustrate the sideband cable connection (See Figure 51). The card will be rotated 180° and thee IFT carrier ports face down in Riser Slot 1 when installed in the system.

Figure 69. Sideband Cable Connection

7. Install the IFT carrier card.

Note: The IFT card should be installed in PCIe* Slot 1 for normal operation with the Intel® Xeon™ Phi™ (Fabric) processor. The IFT carrier card is not supported in PCIe* Slot 2 when the fabric CPU is installed. When the Intel® Xeon™ Phi™ (Fabric) processor is used in the server system, PCIe* Slot 2 is reduced to x4 lanes (electrical) for PCIe* device connectivity. See the Intel

Server Board S7200AP

and Intel® Compute Module HNS7200AP Product Family Configuration Guide and Technical Product Specification for Riser 2 options.

a) Follow the basic instructions to install an Add-In-Card in Slot 1 as shown in section 2.7.1. Install the

IFT card into Riser Slot 1 card (See Figure 52, letter A). Note that the sideband cable (P2, black end) is already connected to the IFT carrier card prior to installing the carrier card into Riser 1.

b) Install IFT and Riser Slot 1 card into Riser slot 1 (See Figure 52, letter B). c) Secure the riser card (See Figure 52, letter C). d) Once the IFT Carrier Card is fully secured in the system, connect the other end of the sideband cable

(P1, white end) into the main board sideband fabric connector J5J2. Refer back to Figure 51 (See

letter B), Sideband Cable Connection.

Figure 70. Installing the IFT Carrier

5. Install the Intel® Omni-Path Fabric Processor Cable a) Line up the cable CPU connector end and install it vertically onto the Fabric CPU connector. Push

the connector forward toward the substrate until fully engaged. (See letter A)

b) Rotate and snap the cable wire latch into the lock position onto the bolster plate latch posts. c) Insert the two IFP plugs into the IFT carrier slots on the board. When installing the two plugs, the

latch release buttons are marked P1 and P2 will face down in the system. As illustrated, ensure that the connector marked P1 on the cable is inserted into the P1 connector and the P2 plug is inserted into the P2 connector (See letter B). Ensure that the cables are pushed fully forward and are fully engaged.

d) At the rear of the system, plug in the fabric cable. See the Intel® Omni-Path Cables Matrix for a list

of supported cables:

fabrics/omni-path-cables.html

http://www.intel.com/content/www/us/en/high-performance-computing-

Figure 71. Fabric Processor and IFT Cable Connections

2.10.4 Removing the Fabric Processor Kit

1. Disconnect all the cable connections from the IFT carrier and the fabric processor

(See letter A, B and C).

Figure 72. Disconnecting IFP Cables

2. See section 2.8.2

for instructions on how to remove the Intel® Omni-Path / Fabric processor carrier card

from Riser 1.

3. See section 2.5 for instructions on how to remove the processor from the server board.

2.11 Installing and Removing the Memory

2.11.1 Installing the Memory

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Locate the DIMM socket. Make sure the clips at either end of the DIMM socket are pushed outward to

an open position (See letter A).

NOTE: Make sure the retaining clip of the adjacent slot is NOT open and does NOT interfere with each other.

CAUTION: Add-In Cards may need to be removed prior to servicing the DIMMs.

4. Holding the DIMM by the edges, remove it from its anti-static package. Place the DIMM within the DIMM

slot guides. Ensure the DIMM notch is aligned with the DIMM slot key (See letter B).

5. Insert the bottom edge of the DIMM into the socket (See letter C). When the DIMM is inserted, push

down firmly on the top edge of the DIMM until the retaining clips snap into place (See letter D). Ensure the retaining clips are firmly in place (See letter E).

Figure 73. Installing the Memory

2.11.2 Removing the Memory

1. Locate the DIMM socket. Gently spread the retaining clips at either end of the socket. The DIMM will lift

from the socket.

NOTE: It is recommended to remove Riser Cards adjacent to DIMM slots for ease access.

2. Holding the DIMM by the edges, lift it from the socket, and store it in an anti-static package.

2.12 Installing and Removing the Intel® Remote Management

Module 4 Lite

2.12.1 Installing the Intel® RMM4 Lite

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Remove the Intel® RMM4 Lite from its package.

4. Locate the RMM4 Lite connector on the server board next to the Riser Slot 2.

5. Place the Intel® RMM4 Lite over the connector and match the orientation of the Intel® RMM4 Lite to

that of the connector (See letter A).

6. Press the Intel® RMM4 Lite down onto the connector.

Figure 74. Installing the Intel® RMM4 Lite

2.12.2 Removing the Intel® RMM4 Lite

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Carefully grasp the Intel® RMM4 Lite and pull it up until it disengages from the connector.

2.13 Replacing the Bridge Board

2.13.1 Installing the Bridge Board

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Ensure the plastic holder on the front end of the bridge board is attached and seated properly

(See letter A).

4. Insert the rear end of the bridge board into the slot on the server board (See letter B).

5. Secure the bridge board to the side wall with the six screws (See letter C).

Figure 75. Installing the Bridge Board

2.13.2 Removing the Bridge Board

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Remove the six screws (See letter A) on the bridge board.

4. Lift the bridge board straight up to remove it from the server board (See letter B).

Figure 76. Removing the Bridge Board

2.14 Replacing the Server Main Board

2.14.1 Removing the Server Board

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Remove the processors and DIMMs. See section 2.5 and section 2.11.2.

4. Remove the bridge board. See section 2.13.2.

5. Remove the PCIe* Riser and Add-In Card from the Riser Slot 1 if there is any. See section 2.8.2

6. Remove the PCIe* Riser and Add-In Card from the Riser Slot 2 if there is any. See section 2.9.2.

7. Remove the TPM if installed. See section 2.18.2

8. Remove RMM if installed. See section 2.12.2

9. Disconnect the cables from the server board. (See letter A)

Figure 77. Removing the Cable Connections from the Server Board

10. Remove the six screws from the server board (See letter B).

11. Move the board slightly forward, then lift straight up and out of the node enclosure. Be careful not to

damage the components at the rear of the board when removing (See letter C).

Figure 78. Removing the Server Board

2.14.2 Installing the Server Board

1. Carefully lower the server board into the compute module so that the rear I/O connectors of the server

board align with and are fully seated into the matching holes on the compute module back panel.

2. The server board is accurately placed when the two end screws nearest the front edge of the server

board (See letter A) sit securely onto the compute module enclosure standoffs.

3. Install and tighten the six screws (See letter B).

Figure 79. Installing the Server Board

4. Connect all cable connections to the server board.

Figure 80. Connecting all Cables

5. Re-install the bridge board. See section 2.13.1

6. Re-install the PCIe* riser and Add-In Card in Riser Slot 1. See section 2.8.1.

7. Re-install the PCIe* riser and Add-In Card in Riser Slot 2. See section 2.9.1

8. Re-install the processors and DIMMs. See sections 2.4.2 and 2.11.1.

9. Re-install the air duct. See section 2.3.2.

10. Install other components as necessary.

2.15 Installing and Removing the Power Docking Board

2.15.1 Removing the Power Docking Board

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Pull up retaining latch (See letter A) and disconnect all cables from the power docking board (PDB).

4. Remove the four screws (See letter B).

5. Lift the power docking board straight up and out of the enclosure (See letter C).

Figure 81. Removing the Power Docking Board

2.15.2 Installing the Power Docking Board

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Place the power docking board into the compute module base (See letter A).

4. Ensure that the two inside screws have the washer and are inserted first. (See letter B).

5. Secure the power docking board using the four screws (See letter C).

6. Connect all cables to the power docking board and close retainer latch (See letter D).

Figure 82. Installing the Power Docking Board

2.16 Replacing the Fan

2.16.1 Removing the Fan

1. Remove the air duct. See section 2.3.1.

2. Disconnect the fan cables from the power docking board.

3. Pull out the blue rivets from the fan bracket to release the fan.

4. Grasp the fan from the top and pull it out of the fan bracket.

Figure 83. Removing the Fan

2.16.2 Installing the Fan

1. Remove the air duct. See section 2.3.1.

2. Place the fan into the fan bracket.

3. After fans are seated, push in on the blue rivets to secure them into the bracket.

4. Connect the fan cables to the connectors on the power docking board.

Figure 84. Installing the Fan

2.17 Replacing the Backup Battery

The lithium battery on the server board powers the RTC for up to 10 years in the absence of power. When the battery starts to weaken, it loses voltage, and the server settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong. Contact your customer service representative or dealer for a list of approved devices.

• Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type

recommended by the equipment manufacturer. Discard used batteries according to manufacturer's instructions.

• Lithiumbatteri – Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af

samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren.

• Lithiumbatteri – Eksplosjonsfare. Ved utskifting benyttes kun batteri som anbefalt av

apparatfabrikanten. Brukt batteri returneres apparatleverandøren.

• Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som

rekommenderas av apparattillverkaren. Kassera använt batteri enligt fabrikantens instruktion.Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

1. Locate the battery on the server board.

2. Gently press the detent at the rear of the battery housing to release the battery (See letter A).

3. Remove the battery from the plastic socket (See letter B). If necessary a small flat tip screwdriver may

be used. Be careful not to damage the battery housing/socket.

Figure 85. Replacing the Backup Battery

4. Dispose of the battery according to local ordinance.

5. Remove the new lithium battery from its package, and, being careful to observe the correct polarity,

insert it into the battery socket.

6. You will need to run the BIOS Setup to restore the configuration settings to the RTC.

2.18 Installing and Removing the Intel® Trusted Platform Module

The Intel® Trusted Platform Module (TPM) is a hardware-based security device that addresses the growing concern on boot process integrity and offers better data protection. TPM protects the system start-up process by ensuring it is tamper-free before releasing system control to the operating system. A TPM device provides secured storage to store data, such as security keys and passwords. In addition, a TPM device has encryption and hash functions. The Intel® TPM module implements TPM as per TPM PC Client specifications revision 2.0 by the Trusted Computing Group (TCG). Refer to the S7200AP Family Configuration Guide & Spares/Accessories List for ordering details.

2.18.1 Installing the TPM

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Remove the TPM from the package.

4. Locate the TPM board connector on the rear of the server board near the internal video connector.

5. Place the TPM over the board connector and ensure that the TPM connector and mounting hole is

oriented correctly to the board mounting hole. (See letter A).

6. Press the TPM down onto the connector.

7. Secure the TPM to the board by using either the plastic retainer, standard screw, or tamper resistant

screw.

Figure 86. Installing the Intel® Trusted Platform Module

2.18.2 Removing the TPM

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Unmount the TPM from the board by using either the plastic retainer, standard screw, or tamper

resistant screw.

4. Carefully grasp the TPM and pull it up until it disengages from the connector.

2.19 Installing and Removing the VGA (Video) Debug Cable

The S7200AP Video Debug Cable Option is a VGA video cable that connects to the internal header on the S7200AP board and can be routed through the Riser 1 bracket on the rear node panel when used with the HNS7200AP product. The cable is intended for debug use when deploying S7200AP-based systems and is not intended for normal product operation. Refer to the S7200AP Family Configuration Guide & Spares/Accessories List for ordering details.

2.19.1 Installing Video Debug Cable

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Remove the Slot 1 Riser and the PCIe* adapter if there is one installed See section 2.8.2 .

4. Remove the video cable from the package

5. Route the video cable through Riser 1 bracket as shown in Figure 86

Figure 87. Video Cable Routing

6. Plug in the cable into the correct board header (J1B1) prior to installing Riser 1 back into the slot. The

connector is keyed, so ensure that the orientation is correct (See A).

Figure 88. Connecting video cable to board VGA connector

7. Reseat Riser 1 with video cable back into Riser Slot 1. Re-install and tighten all Riser 1 screws.

Figure 89. Reseat Riser with video cable

8. Ensure that video cable is properly routed through to the rear of the system.

Figure 90. Video Cable Routing

2.19.2 Removing the Video Debug Cable

1. Power off the compute module and disconnect the power cable(s).

2. Remove the air duct. See section 2.3.1

3. Follow the procedures to remove PCIe* Riser 1. See section 2.7.1.

4. After lifting Riser 1 up slightly out of the system, unplug the VGA connector from the board.

5. Carefully route the video cable through Riser 1 slot and out of the system.

6. Re-install Riser 1 and/or the PCIe* Add-In Card back into the system. See section 2.7.2

3 System Software Updates and Configuration

3.1 Updating the System Software Stack

The system includes a software stack to operate. This includes a BIOS, BMC firmware, ME firmware, and FRU & SDR data. A default software stack is loaded during the system manufacturing process. However, it may not be the latest available. For best operation and system reliability, it is highly recommended to update the system software stack to the latest available.

The latest system software stack can be downloaded from Intel at the Intel web site http://downloadcenter.intel.com.

At a minimum, after the initial configuration, the system’s FRU and SDR data must be updated to ensure that the embedded platform management subsystem is configured properly. The system’s FRU and SDR data is updated by running the FRUSDR utility. Properly loaded FRU and SDR data allows platform management to monitor the appropriate system sensors which are used to determine proper system cooling, best performance, and accurate error reporting. The FRUSDR utility is included in the platform’s System Update Package (SUP) which can be downloaded from the Intel web site referenced above. The System Update Package will include full system update instructions.

3.2 Using the BIOS Setup Utility

This section describes how to access and navigate the embedded <F2> BIOS Setup utility. This utility can be used to view and configure system settings that determine how the server operates. Entering the BIOS Setup. Refer to the BIOS Setup Guide for all BIOS supported options.

To enter the BIOS Setup using a keyboard (or emulated keyboard), press the <F2> function key during boot time when the OEM or Intel Logo Screen or the POST Diagnostic Screen is displayed. At initial system power on, a USB keyboard will not be functional until the USB controller has been initialized during the power on self-test (POST) process. When the USB controller is initialized, the system will beep once. Only after that time will the key strokes from a USB Keyboard be recognized allowing for access into the <F2> BIOS Setup utility.

The following message will be displayed on the Diagnostic Screen or under the Quiet Boot Logo Screen:

Press <F2> to enter setup, <F6> Boot Menu, <F12> Network Boot

After pressing the <F2> key, the system will eventually load the BIOS Setup utility and display the BIOS Setup Main Menu screen. Should serious system errors occur during the POST process, the regular system boot will stop and the system will load the BIOS Setup utility and display the Error Manager screen. The Error Manager screen will list and provide information about the specific boot errors detected. No Access to the BIOS Setup Utility

If the BIOS Setup utility is not accessible by hitting the <F2> key or other described access methods, it may be necessary to restore the BIOS default settings. Navigating the BIOS Setup Utility

The BIOS Setup utility consists of several menu screens, each holding either informational fields and/or configurable system setup options.

The bottom right portion of each menu screen provides a list of commands that are used to navigate through the Setup utility. These commands are displayed at all times.

Key

Option

Description

<Enter>

Execute

The <Enter> key is used to activate submenus when the selected feature is a submenu, or to display a

pick list, and returns the focus to the parent menu.

<Esc>

Exit

The <Esc> key provides a mechanism for backing out of any field. When the <Esc> key is pressed

Select

The up arrow is used to select the previous value in a pick list, or the previous option in a menu item's

Select

The down arrow is used to select the next value in a menu item’s option list, or a value field’s pick list.

<- ->

Select

The left and right arrow keys are used to move between the major menu pages. The keys have no

<Tab>

Select Field

The <Tab> key is used to move between fields. For example, <Tab> can be used to move from hours to minutes in the time item in the main menu.

Change Value

The minus key on the keypad is used to change the value of the current item to the previous value. This key scrolls through the values in the associated pick list without displaying the full list.

Change

The plus key on the keypad is used to change the value of the current menu item to the next value.

keyboards, but has the same effect.

<F9>

Setup

Pressing the <F9> key causes the following to display:

were before <F9> was pressed without affecting any existing field values.

<F10>

Save and

Pressing the <F10> key causes the following message to display:

were before <F10> was pressed without affecting any existing values.

If no Administrator or User password is used, all available settings are configurable and can be set by anyone with access to the BIOS Setup.

System settings that are not configurable, because of security settings or configuration limits, will be grayed out and are not accessible.

Table 7. BIOS Setup: Keyboard Command Bar

↑

Command

Item

pick list if a selected option has a value field, or to select a subfield for multi-valued features like time and date. If a pick list is displayed, the <Enter> key selects the currently highlighted item, undoes the

while editing any field or selecting features of a menu, the parent menu is re-entered. When the <Esc> key is pressed in any submenu, the parent menu is re-entered. When the <Esc> key is pressed in any major menu, the exit confirmation window is displayed and the user is asked whether changes can be discarded. If “No” is selected and the <Enter> key is pressed, or if the <Esc> key is pressed, the user is returned to where they were before <Esc> was pressed, without affecting any existing settings. If “Yes” is selected and the <Enter> key is pressed, the setup is exited and the BIOS returns to the main System Options Menu screen.

option list. The selected item must then be activated by pressing the <Enter> key.

The selected item must then be activated by pressing the <Enter> key.

effect if a submenu or pick list is displayed.

Value

Defaults

This key scrolls through the values in the associated pick list without displaying the full list. On 106key Japanese keyboards, the plus key has a different scan code than the plus key on the other

If “Yes” is highlighted and <Enter> is pressed, all Setup fields are set to their default values. If “No” is highlighted and <Enter> is pressed, or if the <Esc> key is pressed, the user is returned to where they

Exit

If “Yes” is highlighted and <Enter> is pressed, all changes are saved and the Setup is exited. If “No” is highlighted and <Enter> is pressed, or the <Esc> key is pressed, the user is returned to where they

4 Server Utilities

Intel provides the following utilities for Intel’s server products. The utilities and user’s guides can be downloaded from www.intel.com/support.

4.1 Intel® System Information Retrieve Utility (Sysinfo)

The Intel® System Information Retrieval Utility (Sysinfo) is used for collecting system information. The utility dumps system information, for example, Sensor Data Records, Baseboard FRU, BMC System Event Log, BMC Settings, BIOS Settings, Operating System Event Log, PCI Bus Device Information, RAID settings and RAID log. Log information results may vary between different versions; refer to the detailed information from specific sections.

4.2 Intel® One Boot Flash Update Utility (OFU)

The Intel® One-Boot Flash Update Utility (Intel® OFU) is used to update the BIOS and firmware on the Intel® Server Boards while the operating system is running. The utility may be launched from a command prompt in either the Windows* or Linux* operating systems. This utility can also be executed remotely through a secure network connection using a Telnet Client and Terminal Services in Windows* or using a Telnet Client and Remote Shell under Linux*.

4.3 Intel® System Event Log (SEL) Viewer Utility

The Intel® System Event Log (SEL) Viewer Utility provides the ability to view system event records stored on the server management storage device of a server. The utility displays the SEL records in either a text or a hexadecimal format. The utility also allows you to save SEL entries to a file and load SEL entries from a file for viewing. You can also reload SEL entries from a server and see properties of SEL entries. The SEL entries can be viewed in two modes: interpreted text mode and hex mode.

4.4 Intel® System Configuration Utility (SYSCFG)

The Intel® System Configuration Utility (Syscfg) is a command-line utility that can be used to save and restore BIOS and firmware settings to a file or to set and display individual settings. Refer to the User Guide for a command reference. The User Guide also provides an overview of the features of the module and instructions for configuring the BIOS and management firmware on the Intel’s server products.

Parameter

Limits

Operating Temperature

+10°C to +27°C with the maximum rate of change not to exceed 10°C per hour

Non-Operating Temperature

-40°C to +70°C

Non-Operating Humidity

90%, non-condensing at 27°C

Acoustic noise

Sound power: 7.0BA with hard disk drive stress only at room ambient temperature (23 +/- 2°C)

Shock, operating

Half sine, 2g peak, 11 mSec

Shock, unpackaged

Trapezoidal, 25g, velocity change 175 inches/second (80 lbs. to < 100 lbs.)

Vibration, unpackaged

5 Hz to 500 Hz, 2.20 g RMS random

Shock and vibration, packaged

ISTA (International Safe Transit Association) Test Procedure 3A

ESD

+/-12 KV except I/O port +/- 8 KV per Intel ® Environmental Test Specification

System Cooling Requirement in BT U / H r.

2130 Watt Max – 7263 BTU/hour

Appendix A. Technical Reference

System Environmental Specifications

The following table defines the system level operating and non-operating environmental limits.

Table 8. System Environmental Limits Summary

Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock requirement

mentioned above through its own chassis development and system configuration. It is the responsibility of the system integrator to determine the proper shock level of the board and system if the system integrator chooses different system configuration or different chassis. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.

Appendix B. POST Code Diagnostic LED Decoder

As an aid to assist in troubleshooting a system hang that occurs during a system’s Power-On Self-Tes t (POST) process, the server board includes a bank of eight POST Code Diagnostic LEDs on the back edge of the server board.

During the system boot process, Memory Reference Code (MRC) and System BIOS execute a number of memory initialization and platform configuration processes, each of which is assigned a hex POST code number. As each routine is started, the given POST code number is displayed to the POST Code Diagnostic LEDs on the back edge of the server board.

During a POST system hang, the displayed post code can be used to identify the last POST routine that was run prior to the error occurring, helping to isolate the possible cause of the hang condition.

Each POST code is represented by eight LEDs; four Green and four Amber. The POST codes are divided into two nibbles, an upper nibble and a lower nibble. The upper nibble bits are represented by Amber Diagnostic LEDs #7, #6, #5, #4. The lower nibble bits are represented by Green Diagnostics LEDs #3, #2, #1 and #0. If the bit is set in the upper and lower nibbles, the corresponding LED is lit. If the bit is clear, the corresponding LED is off (Lit LED = 1, Off LED = 0).

Figure 91. POST Diagnostic LED Location

Upper Nibble AMBER LEDs

Lower Nibble GREEN LEDs

MSB

LSB

LED #7

LED #6

LED #5

LED #4

LED #3

LED #2

LED #1

LED #0

OFF

1 0 1 0 1 1 0 0 Ah

NOTE: All POST Diagnostic codes must be read from left to right starting from MSB to LSB in given

numerical order (7-6-5-4-3-2-1-0) when user is facing the back of the system as shown in Error!

Reference source not found.

. Failing to follow this instruction will result on a wrong

interpretation.

In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs are decoded as follows:

Table 9. POST Progress Code Decoding LED Example

LEDs

Status

Results

Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh

Early POST Memory Initialization MRC Diagnostic Codes

Memory Initialization at the beginning of POST includes multiple functions, including: discovery, channel training, validation that the DIMM population is acceptable and functional, initialization of the IMC and other hardware settings, and initialization of applicable RAS configurations.

Below is a brief list of the Diagnostic LED codes displayed during memory initialization by the Memory Reference Code (MRC), the BIOS component responsible for it. There are two types of POST Diagnostic Codes used by the MRC, Fatal Error Codes and Progress Codes.

MRC Fatal Error Codes are necessary because if the Memory Initialization fails badly for some reason – like no usable memory installed – the system would not have the resources to give any other error indication. So in the case of a major failure during Memory Initialization, the system outputs a Fatal Error Code to Port 80 (the Diagnostic LEDs) and executes a Halt. These Fatal Error Halts do not change the System Status LED, and they do not get logged as SEL Events.

The MRC Progress Codes are displays to the Diagnostic LEDs that show the execution point in the MRC operational path at each step. The intent is that if the system hangs during execution of the MRC, the LED display will tell at what point in the code the system was executing.

Be aware that these are Diagnostic LED display codes used in early POST by the MRC. Later in POST, these same Diagnostic LED display codes are used for other BIOS Progress Codes.

Also, MRC Fatal Error Codes and MRC Progress Codes are not controlled by the BIOS and are subject to change based upon changes implemented in the memory reference code.

Error Code

Fatal Error Code Explanation (with MRC Internal Minor Code)

0xE8

No Usable Memory Error:

0xE9

Memory is locked by Intel® Trusted Execution Technology and is inaccessible.

0xEA

DDR4 Channel Training Error:

0xEB

Memory Test Failure:

0xED

DIMM Configuration/Population Error:

0xEF

Indicates a CLTT table structure error.

Table 10. MRC Fatal Error Codes

01h = No memory was detected via SPD read, or invalid config that causes no operable memory. 02h = Memory DIMMs on all channels of all sockets are disabled due to hardware memtest er ro r. 03h = No memory installed. All channels are disabled.

01h = Error on read DQ/DQS (Data/Data Strobe) init 02h = Error on Receive Enable 03h = Error on Write Leveling 04h = Error on write DQ/DQS (Data/Data Strobe)

01h = Software memtest failure. 02h = Hardware memtest failed. 03h = Hardware Memtest failure in Lockstep Channel mode requiring a channel to be disabled. This is a fatal error which requires a reset and calling MRC with a different RAS mode to retry.

01h = Different DIMM types (RDIMM, LRDIMM) are detected installed in the system. 02h = Violation of DIMM population rules. 03h = The third DIMM slot cannot be populated when QR DIMMs are installed. 04h = UDIMMs are not supported. 05h = Unsupported DIMM Voltage.

Should a major memory initialization error occur, preventing the system from booting with data integrity, a beep code is generated, the MRC will display a fatal error code on the diagnostic LEDs, and a system halt command is executed. Fatal MRC error halts do NOT change the state of the System Status LED, and they do NOT get logged as SEL events. The following table lists all MRC fatal errors that are displayed to the Diagnostic LEDs.

NOTE: Fatal MRC errors will display POST error codes that may be the same as BIOS POST progress codes displayed later in the POST process. The fatal MRC codes can be distinguished from the BIOS POST progress codes by the accompanying memory failure beep code of 3 long beeps.

Table 14

Progress Code

Main Sequence

Subsequences/Subfunctions

the JEDEC defined initialization

Table 11. MRC Progress Codes

0xB0 Detect DIMM population

0xB1 Set DDR4 frequency

0xB2 Gather remaining SPD data

0xB3 Program registers on the memory controller level

0xB4 Evaluate RAS modes and save rank information

0xB5 Program registers on the channel level

0xB6 Perform

sequence

0xB7 Train DDR4 ranks



0x01

—n/a—

Read DQ/DQS training



0x02



0x03



0x04



0x05

0xB8 Initialize CLTT/OLTT

0xB9 Hardware memory test and init

0xBA Execute software memor y init

0xBB Program memory map and interleaving

0xBC Program RAS configuration

0xBF MRC is done

Receive Enable training

Write Leveling training

Write DQ/DQS training

DDR channel training done

—n/a—

SEC Phase

First POST code after CPU reset

Microcode load begin

CRAM initialization begin

Pei Cache When Disabled

SEC Core At Power On Begin.

Early CPU initialization during Sec Early SB initialization during Sec Phase.

Early NB initialization during Sec End Of Sec Phase.

Microcode Not Found.

Microcode Not Loaded.

PEI Core

CPU PEIM

NB PEIM

SB PEIM

MRC Progress Codes

Memory Installed

CPU PEIM (CPU Init)

BIOS POST Progress Codes

During the system boot process, the BIOS executes a number of platform configuration processes, each of which is assigned a specific POST Progress Code, a 2-digit hexadecimal number. As each configuration routine is started, the BIOS displays the POST Progress Code on the Diagnostic LEDs found on the back edge of the server board.

To assist in troubleshooting a system hang during the POST process, the POST Progress Code displayed in the Diagnostic LEDs can be used to identify the last POST process to begin execution.

The following table provides a list of all POST progress codes.

Table 12. POST Progress Codes

Progress Code Description

0x01

0x02

0x03

0x04

0x05

0x06

0x07

0x08

0x09

0x0E

0x0F

0x10

0x11

Phase.

PEI Phase

0x15

0x19

At this point the MRC Progress Code sequence is executed See Error! Reference source not found..

0x31

0x32

CPU PEIM (Cache Init)

Dxe IPL started

DXE Core started

DXE NVRAM Init

DXE Setup Init

DXE CPU Init

DXE CPU BSP Select

DXE CPU AP Init

DXE PCI Host Bridge Init

DXE NB Init

DXE NB SMM Init

DXE SB Init

DXE SB SMM Init

DXE SB devices Init

DXE ACPI Init

DXE CSM Init

DXE BDS Started

DXE BDS connect drivers

DXE PCI Bus begin

DXE PCI Bus HPC Init

DXE PCI Bus enumeration

DXE PCI Bus resource requested

DXE PCI Bus assign resource

DXE CON_OUT connect

DXE CON_IN connect

DXE SIO Init

Progress Code Description

0x33

0x4F

DXE Phase

0x60

0x61

0x62

0x63

0x65

0x66

0x68

0x69

0x6A

0x70

0x71

0x72

0x78

0x79

0x80

0x81

0x82

0x83

0x84

0x85

0x86

0x87

0x88

0x89

DXE USB start

DXE USB reset

DXE USB detect

DXE USB enable

DXE IDE begin

DXE IDE reset

DXE IDE detect

DXE IDE enable

DXE SCSI begin

DXE SCSI reset

DXE SCSI detect

DXE SCSI enable

DXE verifying SETUP password

DXE SETUP start

DXE SETUP input wait

DXE Ready to Boot

DXE Legacy Boot

DXE Exit Boot Services

RT Set Virtual Address Map Begin

DXE Legacy Option ROM init

DXE Reset system

DXE USB Hot plug

DXE PCI BUS Hot plug

DXE NVRAM cleanup

DXE ACPI Enable

Clear POST Code

S3 Resume

Progress Code Description

0x8A

0x8B

0x8C

0x8D

0x91

0x92

0x93

0x94

0x95

0x96

0x97

0x98

0x99

0x9B

0x9C

0x9D

0x9E

0x9F

0xC0

0xC2

0xC3

0xC4

0xC5

0xC6

0xC7

0x00

S3 Resume PEIM (S3 started)

S3 Resume PEIM (S3 boot script)

S3 Resume PEIM (S3 Video Repost)

S3 Resume PEIM (S3 OS wake)

PEIM which detected forced Recovery

PEIM which detected User Recover y Recovery PEIM (Recovery started)

Recovery PEIM (Capsule found)

Recovery PEIM (Capsule loaded)

Progress Code Description

0x40

0x41

0x42

0x43

BIOS Recovery

0x46

0x47

0x48

0x49

0x4A

condition

Error Code

Error Message

Response

0012

System RTC date/time not set

Major

0048

Password check failed

Major

0140

PCI component encountered a PERR error

Major

0141

PCI resource conflict

Major

0146

PCI out of resources error

Major

5220

BIOS Settings reset to default settings

Major

5221

Passwords cleared by jumper

Major

5224

Password clear jumper is Set

Major

8130

Processor 01 disabled

Major

8160

Processor 01 unable to apply microcode update

Major

8170

Processor 01 failed Self-Test (BIST)

Major

8180

Processor 01 microcode update not found

Minor

8190

Watchdog timer failed on last boot

Major

Appendix C. POST Error Codes

Most error conditions encountered during POST are reported using POST Error Codes. These codes represent specific failures, warnings, or are informational. POST Error Codes may be displayed in the Error Manager display screen, and are always logged to the System Event Log (SEL). Logged events are available to System Management applications, including Remote and Out of Band (OOB) management.

There are exception cases in early initialization where system resources are not adequately initialized for handling POST Error Code reporting. These cases are primarily Fatal Error conditions resulting from initialization of processors and memory, and they are handed by a Diagnostic LED display with a system halt.

The following table lists the supported POST Error Codes. Each error code is assigned an error type which determines the action the BIOS will take when the error is encountered. Error types include Minor, Major, and Fatal. The BIOS action for each is defined as follows:

Minor: The error message is displayed on the screen or on the Error Manager screen, and an error is logged to the SEL. The system continues booting in a degraded state. The user may want to replace the erroneous unit. The POST Error Pause option setting in the BIOS setup does not have any effect on this error. Major: The error message is displayed on the Error Manager screen, and an error is logged to the SEL. The POST Error Pause option setting in the BIOS setup determines whether the system pauses to the Error Manager for this type of error so the user can take immediate corrective action or the system continues booting.

Note that for 0048 “Password check failed”, the system halts, and then after the next reset/reboot will display the error code on the Error Manager screen.

Fatal: The system halts during POST at a blank screen with the text “Unrecoverable fatal error found. System will not boot until the error is resolved” and “Press <F2> to enter Setup” The POST Error Pause

option setting in the BIOS setup does not have any effect with this class of error.

When the operator presses the F2 key on the keyboard, the error message is displayed on the Error Manager screen, and an error is logged to the SEL with the error code. The system cannot boot unless the error is resolved. The user needs to replace the faulty part and restart the system.

NOTE: The POST error codes in the following table are common to all current generation Intel server platforms. Features present on a given server board/system will determine which of the listed error codes are supported.

Table 13. POST Error Codes and Messages

Error Code

Error Message

Response

8198

OS boot watchdog timer failure

Major

8300

Baseboard management controller f ai led sel f-test

Major

8305

Hot Swap Controller failure

Major

83A0

Management Engine (ME) failed self-test

Major

83A1

Management Engine (ME) Failed to respond.

Major

84F2

Baseboard management controller failed to respond

Major

84F3

Baseboard management controller in update mode

Major

84F4

Sensor data record empty

Major

84FF

System event log full

Minor

8500

Memory component could not be configured in the selected RAS mode

Major

8501

DIMM Population Error

Major

8520

DIMM_A1 failed test/initialization

Major

8523

DIMM_B1 failed test/initialization

Major

8526

DIMM_C1 failed test/initializ ati on

Major

8529

DIMM_D1 failed test/initializ ati on

Major

852C

DIMM_E1 failed test/initialization

Major

852F

DIMM_F1 failed test/initialization

Major

8540

DIMM_A1 disabled

Major

8543

DIMM_B1 disabled

Major

8546

DIMM_C1 disabled

Major

8549

DIMM_D1 disabled

Major

854C

DIMM_E1 disabled

Major

854F

DIMM_F1 disabled

Major

8560

DIMM_A1 encountered a Serial Presence Detection (SPD) failure

Major

8563

DIMM_B1 encountered a Serial Presence Detection (SPD) failure

Major

8566

DIMM_C1 encountered a Serial Presence Detection (SPD) failure

Major

8569

DIMM_D1 encountered a Serial Presence Detection (SPD) failure

Major

856C

DIMM_E1 encountered a Serial Presence Detection (SPD) failure

Major

856F

DIMM_F1 encountered a Serial Presence Detection (SPD) failure

Major

8604

POST Reclaim of non-crit i cal NVR AM variables

Minor

8605

BIOS Settings are corrupted

Major

8606

NVRAM variable space was corrupted and has been reinitialized

Major

Recovery boot has been initiated.

Fatal

92A3

Serial port component was not detected

Major

92A9

Serial port component encountered a resourc e confl ict error

Major

A000

TPM device not detected.

Minor

A001

TPM device missing or not responding.

Minor

A002

TPM device failure.

Minor

A003

TPM device failed self-test.

Minor

A100

BIOS ACM Error

Major

A421

PCI component encountered a SERR error

Fatal

A5A0

PCI Express component encountered a PERR error

Minor

A5A1

PCI Express component encountered an SERR error

Fatal

DXE Boot Services driver: Not enough memory available to shadow a Legacy

Minor

8607

A6A0

Note: The Primary BIOS image may be corrupted or the system may hang during POST. A BIOS update is required.

Option ROM.

Beeps

Error Message

POST Progress Code

Description

USB device action

N/A

Short beep sounded whenever USB device is

1 long

Intel® TXT security

0xAE, 0xAF

System halted because Intel® Trusted Execution 3

Memory error

Multiple

System halted because a fatal error related to the

3 long

CPU mismatch

0xE5, 0xE6

System halted because a fatal error related to the

The following Beep Codes are sounded during BIOS Recovery.

Recovery started

N/A

Recovery boot has been initiated.

Recovery failed

N/A

Recovery has failed. This typically happens so quickly 1-5-2-1

CPU socket

N/A

CPU1 socket is empty, or sockets are populated

1-5-2-4

MSID Mismatch

N/A

MSID mismatch occurs if a processor is installed into 1-5-4-2

Power fault

N/A

DC power unexpectedly lost (power good dropout) –

1-5-4-4

Power control

N/A

Power good assertion timeout – Power unit sensors

1-5-1-2

VR Watchdog

N/A

VR controller DC power on sequence not completed

1-5-1-4

Power Supply

N/A

The system does not power on or unexpectedly

POST Error Beep Codes

The following table lists POST Error Beep Codes. Prior to system video initialization, the BIOS uses these beep codes to inform users of error conditions. The beep code is followed by a user visible code displayed on the Diagnostic LEDs.

The following tables lists POST Error Beep Codes. Prior to system video initialization, the BIOS uses these beep codes to inform users of error conditions. The beep code is followed by a user visible code displayed on the Diagnostic LEDs.

Table 14. POST Error Beep (with LED) Codes

discovered in POST, or inserted or removed during runtime.

violation

and 1

error

The following beep codes are generated by the BMC.

Table 15. Integrated BMC Beep (with LED) Codes

population error

Technology detected a potential violation of system security.

memory was detected.

CPU family/core/cache mismatch was detected.

after recovery is initiated that it sounds like a 2-4 beep code.

incorrectly – CPU1 must be populated before CPU2.

a system board that has incompatible power capabilities.

fault

Timer

Status

Power unit sensors report power unit failure offset.

report soft power control failure offset.

in time.

powers off and a Power Supply Unit (PSU) is present that is an incompatible model with one or more other PSUs in the system.

Appendix D. System Interconnects S7200AP / H2000G

S7200AP / H2000G (12x3.5” Drive Configuration) and system interconnect

Figure 92. System Interconnect

Appendix E. Regulatory and Compliance Information

Refer to the Server Products Regulatory and Safety document for the product regulatory compliance reference. The document can be downloaded from http://www.intel.com/support/server.

Appendix F. Getting Help

If you encounter an issue with your compute module, follow these steps to obtain support:

1. Visit the following Intel support web page:

http://www.intel.com/p/en_US/support/contactsupport This web page provides 24x7 support when you need it to get the latest and most complete technical support information on all Intel Enterprise Server and Storage Platforms. Information available at the support site includes:

 Latest BIOS, firmware, drivers, and utilities  Product documentation, installation and quick start guides  Full product specifications, technical advisories, and errata  Compatibility documentation for memory, hardware Add-In Cards, chassis support matrix, and

operating systems

 Server and chassis accessory parts list for ordering upgrades or spare parts  A searchable knowledgebase to search for product information throughout the support site

2. If you are still unable to obtain a solution to your issue, send an email to Intel’s technical support center

using the online form available at http://www.intel.com/support/feedback.htm?group=server. Lastly, you can contact an Intel support representative using one of the support phone numbers available at http://www.intel.com/support/feedback.htm?group=server (charges may apply). Intel also offers Channel Program members around-the-clock 24x7 technical phone support on Intel’s Server Boards, Server Chassis, Server RAID Controller Cards, and Intel Server Management at http://www.intel.com/reseller/.

NOTE: You will need to log in to the Reseller site to obtain the 24x7 number.

Warranty Information

To obtain warranty information, visit the following Intel web site: http://www.intel.com/p/en_US/support/warranty

Boot strap processor. The processor selected at boot time to be the primary processor in a multi-processor system.

Dual In-line Memory Module, a plug-in memory module with signal and power pins on both sides of the

Keyboard, Video, and Mouse – an attachment that mimics those devices, and connects them to a remote I/O user

Glossary

Acronym Description

AC Alternating Current, a type of electrical current in which the current repeatedly changes direction

ACM Authenticated Code Mode

ACPI Advanced Configuration Power Interface

AP Application Processor

BDS Boot Device Selection

BIB Burn in Board

BIOS Basic Input/Output System – Firmware interface to the system hardware

BIST Built-in Self-Test

BMC Baseboard Management Controller

BSP

BTU/hour A unit of power. 1 watt is approximately 3.41214 BTU/h[, and 1000 BTU/h is approximately 293.071 W

CLT T Closed Loop Thermal Throttling

CMOS Complementary Metal-oxide-semiconductor

CPU Central Processing Unit

CRAM

CSM Compatibility Support Module

DC Direct current, the flow of electric charge is only in one direction.

DIMM

DQ Data Quality

DQS Bi-directional Data Strobe

DXE Driver Execution Environment. Component of Intel® Platform Innovation Framework for EFI architecture

EI Enhanced Intel

ESD Electrostatic Discharge

FRU Field Replaceable Unit

GT/s GigaTransfers per second

HBA Hot Bus Adapter

HPC High Performance Computing

IDE Integrated Drive Electronics, a disk interface standard

Configuration RAM - a programmable bit inside an FPGA that controls its behavior

internal printed circuit board (front and back).

IFT Intel Fabric Through

IMC Integrated Memory Controller – memory controller integrated into the processor chip

IPL Initial Program Load

IPMB Intelligent Platform Management Bus

ISTA International Safe Transit Association

JEDEC Joint Electron Device Engineering Council, industry organization for memory standards

KVM

LAN Local Area Network

LED Light Emitting Diode

Acronym Description

Load Reduced DIMM memor y modules have buffer registers for both address and data between the SDRAM modules and the system's memory controller.

Redundant Array of Inexpensive Disks – provides data security by spreading data over multiple disk drives. Registered DIMM (also called buffered) memory modules have an address buffer register between the SDRAM modules and the system's memory controller.

LOM LAN on Board

LRDIMM

ME Management Engine

MM# Material Management number

MRC Memory Reference Code

MSB Most Significant Bit

MSID

MT/s MegaTransfers per second

NIC Network Interface Card

NVRAM Non-volatile RAM

OEM Original Equipment Manufacturer

OFU One-Boot Flash Update

OLT T Open Loop Thermal Throttling

OOB Out of Band

OS Operating System

PCH

PCI Peripheral Component Interconnect, or PCI Local Bus Standard – also called “Conventional PCI”

PCIe** PCI Express* -- an updated form of PCI offering better throughput and better error management

PEI Pre EFI Initialization. Component of Intel® Platform Innovation Framework for EFI architecture.

PEIM PEI Module

PERR Parity Error

CPU Icc Mismatch

Northbound

Platform Controller Hub

PHM Processor Heatsink Module

POST Power On Self-Tes t – BIOS activity from the time on Power On until Operating System boot begins.

PSU Power Supply Unit

QPI Intel® QuickPath Interconnect

QR Quad Rank – memory DIMM organization, DRAMs organized in four ranks

RAID

RAM Random Access Memory

RAS Reliability, Availability, and Serviceability

RC Raw Class

RDIMM

ROM

RT Runtime. Component of Intel® Platform Innovation Framework for EFI architecture

RTC Real Time Clock

SAD Source Address Decoder

SAS Serial Attached SCSI, a high speed serial data version of SCSI

RAID 0, RAID 1, RAID 10, and RAID 5 are different patterns of data on varying numbers of disks to provide varying degrees of security and performance.

Read-Only Memor y

SATA Serial ATA, a high speed serial data version of the disk ATA interface

The enhanced small form-factor pluggable (SFP+) is an enhanced version of the SFP that supports data rates up to 16 Gbit /s.

Acronym Description

SB Southbound

SBSP System Boot-Strap Processor

SCSI Small Computer System Interface, a connection usually used for disks of various types

SDR Sensor Data Record

SEC Security. Component of Intel® Platform Innovation Framework for EFI architecture

SEL System Event Log

SERR System Error

SFF Small Form Factor

SFP+

SIO Super I/O

SMM System Management Mode

SPD Serial Presence Detect

SUP System Updated Package

TDP Thermal Design Power

TIM Thermal Interface Material

TPM Trusted Platform Module

TXT Intel® Trusted Execution Technology

USB Universal Serial Bus, a standard serial expansion bus meant for connecting peripherals.

VGA

VR Voltage Regulator

Video Graphics Array

Intel S7200AP, S7200APR, HNS7200AP, HNS7200APR System Integration And Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Product Features

1.1 Product Feature Overview

1.1.1 Server Board Feature Set

1.1.2 HNS7200AP Compute Module Feature Set

1.1.3 Chassis Feature Set for Intel® Compute Module HNS7200AP

1.1.4 HNS7200APR Compute Module Feature Set

1.1.5 Chassis Feature Set for Intel® Compute Module HNS7200APR

1.2 Back Panel Feature Identification

1.3 Power Docking Board Features

1.4 Bridge Board Feature Features

1.5 Server Board Features

1.6 Intel® Light-Guided Diagnostics

1.7 Configuration and Recovery Jumpers

1.8 Advanced Management Options

1.8.1 Intel® Remote Management Module 4 Lite

2 Hardware Installations and Upgrades

2.1 Before You Begin

2.1.1 Tools and Supplies Needed

2.1.2 System Reference

2.2 Cable Routing

2.3 Removing and Installing the Air Duct

2.3.1 Removing the Air Duct

2.3.2 Installing the Air Duct

2.4 Processor Assembly Installation and Removal

2.4.1 Assembling the Processor Heat Sink Module (PHM)

2.4.2 Processor Installation

2.5 Processor Removal

2.5.1 PHM Disassembly

2.6 Installation and Removal of the 1U LACC

2.6.1 Removal of the 1U LACC Assembly

2.6.2 Remove the CPU and Carrier Assembly

2.6.3 Install the 1U LACC Assembly

2.7 Removing and Installing Riser 1 and Riser 2

2.7.1 Remove Riser 1

2.7.2 Install Riser 1

2.7.3 Remove Riser 2

2.7.4 Install Riser 2

2.8 Installing and Removing an Add-In Card - Riser Slot 1

2.8.1 Installing a PCIe* Add-In Card Riser 1

2.8.2 Removing a PCIe* Add-In Card Riser 1

2.9 Installing and Removing an Add-In Card - Riser Slot 2

2.9.1 Installing a PCIe* Add-In Card Riser 2

2.9.2 Removing a PCIe* Add-In Card from Riser 2

2.10.1 Fabric Processor Kit Components

2.10.2 Fabric Processor Kit Cables

2.10.3 Installing the Fabric Processor Kit

2.10.4 Removing the Fabric Processor Kit

2.11 Installing and Removing the Memory

2.11.1 Installing the Memory

2.11.2 Removing the Memory

2.12.1 Installing the Intel® RMM4 Lite

2.12.2 Removing the Intel® RMM4 Lite

2.13 Replacing the Bridge Board

2.13.1 Installing the Bridge Board

2.13.2 Removing the Bridge Board

2.14 Replacing the Server Main Board

2.14.1 Removing the Server Board

2.14.2 Installing the Server Board

2.15 Installing and Removing the Power Docking Board

2.15.1 Removing the Power Docking Board

2.15.2 Installing the Power Docking Board

2.16 Replacing the Fan

2.16.1 Removing the Fan

2.16.2 Installing the Fan

2.17 Replacing the Backup Battery

2.18 Installing and Removing the Intel® Trusted Platform Module

2.18.1 Installing the TPM

2.18.2 Removing the TPM

2.19 Installing and Removing the VGA (Video) Debug Cable

2.19.1 Installing Video Debug Cable

2.19.2 Removing the Video Debug Cable

3 System Software Updates and Configuration

3.1 Updating the System Software Stack

3.2 Using the BIOS Setup Utility

4 Server Utilities

4.1 Intel® System Information Retrieve Utility (Sysinfo)