INTEL H55 User Manual

USER'S MANUAL

Intel H55 Express Chipset

Based

M/B for Intel LGA 1156 Processors

NO. G03-HI06-F

Rev: 2.0

Release date: December, 2010

Trademark:

* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation use only , and ar e

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.

TABLE OF CONTENT

ENVIROMENTAL SAFETY INSTRUCTION................................................................iii

USER’S NOTICE.........................................................................................................iv

MANUAL REVISION INFORMATION.........................................................................iv

ITEM CHECK LIST......................................................................................................iv

COOLING SOLUTIONS ..............................................................................................iv

CHAPTER 1

1-1 FEATURES OF MOTHERBOARD .............................................................................1

1-1.1 SPECIAL FEATURES OF MOTHERBOARD...............................................2

1-2 SPECIFICATION.........................................................................................................4

1-3 PERFORMANCE LIST................................................................................................5

1-4 LAYOUT DIAGRAM....................................................................................................6

INTRODUCTION OF H55 EXPRESS CHIPSET MOTHERBOARDS

CHAPTER 2 HARDWARE INSTALLATION

2-1 HARDWARE INSTALLATION STEPS.......................................................................8

2-2 CHECKING MOTHERBOARD'S JUMPER SETTING................................................8

2-3 INSTALLING CPU.......................................................................................................10

2-3-1 GLOSSARY...................................................................................................10

2-3-2

2-3-3 LGA 1156 CPU INSTALLATION GUIDE......................................................11

2-3-4 INTEL REFERENCE THERMAL SOLUTION ASSEMBLY..........................12

2-4 INSTALL MEMORY ....................................................................................................13

2-5 EXPANSION CARDS..................................................................................................14

2-5-1 PROCEDURE FOR EXPANSION CARD INSTALLATION..........................14

2-5-2 ASSIGNING IRQ FOR EXPANSION CARD.................................................14

2-5-3 PCI-EXPRESS SLOT.....................................................................................15

2-5-4 INSTALLING THE CROSSFIRE/SLI BRIDGE CARD ..................................16

2-6 CONNECTORS, HEADERS........................................................................................17

2-6-1 CONNECTORS .............................................................................................17

2-6-2 HEADERS .....................................................................................................20

2-7 STARTING UP YOUR COMPUTER ...........................................................................23

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................24

3-2 GETTING HELP ..........................................................................................................24

3-3 THE MAIN MENU........................................................................................................25

3-4 STANDARD BIOS FEATURES ..................................................................................26

3-5 ADVANCED BIOS FEATURES..................................................................................27

3-5-1 CPU FEATURES ...........................................................................................28

3-6 ADVANCED CHIPSET FEATURES...........................................................................29

3-7 INTEGRATED PERIPHERALS...................................................................................30

3-8 POWER MANAGEMENT SETUP...............................................................................31

3-9 MISCELLANEOUS CONTROL...................................................................................32

3-10 PC HEALTH STATUS.................................................................................................32

3-10-1 SMART FAN CONFIGURATION...............................................................33

3-11 USER OVERCLOCK SETTINGS................................................................................33

3-12 PASSWORD SETTINGS.............................................................................................35

3-13 LOAD OPTIMAL DEFAULTS/LOAD STANDARD DEFAULTS................................35

3-14 SAVE CHANGES AND EXIT/ DISCARD CHANGES AND EXIT................................36

CHAPTER 4 DRIVER & FREE PROGRAM INSTALLATION

MAGIC INSTALL SUPPORTS WINDOWS XP/VISTA/7.....................................................37

4-1 INF INSTALL INTELH55 CHIPSET SYSTEM DRIVER ..................................38

4-2 SOUND INSTALL ALC HD AUDIO CODEC DRIVER............................................39

4-3 REALTEK INSTALL REALTEK GIGABIT ETHERNET NIC DRIVER...............40

4-4 NORTON INSTALL NORTON INTERNET SECURITY 2010..................................41

4-5 PC-HEALTH INSTALL MYGUARD HARDWARE MONITOR UTILITY..................41

4-6 VGA INSTALL INTEL HD VGA DRIVER............................................................42

4-7 DOTNET INSTALL DOTNET....................................................................................43

4-8 IMSS INSTALL IMSS ..........................................................................................43

4-9 AHCI/RAID INSTALL INTEL AHCI /RAID DRIVER...............................................44

4-10 HOW TO UPDATE BIOS ............................................................................................45

4-11 PRO MAGIC PLUS FUNCTION INTRODUCTION.....................................................45

4-12 G.P.I.FUNCTION LED DISPLAY................................................................................47

ABOUT INTEL LGA 1156 CPU SOCKET.................................................10

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from the welding spots’ that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

iii

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARES DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED FOR THE UTILIZATION OF THESE MOTHER-BOARDS TO MEET THE USE R’S REQUIREMENTS. B UT IT WIL L CHANGE, CORRECT AT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

2.0 Second Edition December, 2010

Item Checklist

In t e l H 5 5 E x p r e s s c h i p s e t b a s e d m otherboard

User’s manual

DVD for motherboard utilities

SATA Cable

I/O Back Panel Shield

Intel Core Processor Family Cooling Solutions

As processor technology pushes to faster speeds and higher performance, thermal management becomes increasingly crucial while building computer systems. Maintaining the proper thermal environment is the key to reliable, long-term system operation. The overall goal in providing the proper thermal environment is keeping the processor below its specified maximum case temperature. Heat sinks induce improved processor heat dissipation through increased surface area and concentrated airflow from attached fans. In addition, interface materials allow effective transfers of heat from the processor to the heat sink. For optimum heat transfer, Intel recommends the use of thermal grease and mounting clips to attach the heat sink to the processor. When selecting a thermal solution for your system, please refer to the website below for collection of heat sinks evaluated and recommended by Intel for use with Intel processors. Note, those heat sinks are recommended for maintaining the specified Maximum T case requirement. In addition, this collection is not intended to be a comprehensive listing of all heat sinks that support Intel processors.

Chapter 1

Introduction of H55 Express Chipset Motherboards

1-1 Features of Motherboard

The H55 Express chipset based motherboard series are based on Intel H55 Express chipset technology which supports the innovative Intel LGA 1156 socket Intel® Core™ i7 Quad Processor、Intel® Core™ i5 Quad Processor、Intel® Core™ i3 Dual Processor and Intel® Pentium Processor.

The H55 Express chipset based motherboard series deliver the revolutionary levels of performance enabling vivid, high-definition experiences and multi-tasking responsiveness from state-of-the-art Intel quad-core technologies, AMD CrossFire technology through the high bandwidth of 4 dual-channel DDRIII1066/DDRIII1333 MHz system memories which are expandable to 16 GB capacity and the new generation of PCI Express interface for the latest graphics AMD cards.TheH55 Express chipset motherboard series are absolutely the ultimate solution for game enthusiasts and applications, and it also meets the demanding usage of computing of gaming, multimedia entertainment and business applications.

The motherboard provides six serial ATA2 interfaces of 3.0 Gb / s data transfer rate for six serial ATA devices.

The H55 Express chipset Based motherboard provides dual Gigabit LAN function by using Gigabit LAN chips which supports 10M / 100M / 1Gbps data transfer rate.

Embedded 8-channel HD CODEC is fully compatible with Sound Blaster Pro

standards that offer you with the home cinema quality and absolutely software compatibility.

The H55 Express chipset based motherboard series offer two PCI-Express2.0 x16 graphics slots with PE2 being PCI Express 2.0 x16@16 lane slot while PE3 being PCI Express 2.0 x16@ 4 lane slot. These two graphics slots are fully compatible with the latest AMD CrossFireX Technology to guarantee the fully operational Multi-GPUs graphics function and avoid the possible installation error. One PCI Express x1 I/O slot and two 32-bit PCI slots guarantee the rich connectivity for the I/O of peripherals. And theH55 motherboard is embedded with a mini-PCIE slot that supports WiFi card.

Embedded USB controllers as well as capability of expanding to 10 of USB2.0 functional ports delivering 480Mb/s bandwidth of rich connectivity, these motherboards meet the future USB demands which are also equipped with hardware monitor function on system to monitor and protect your system and maintain your non-stop business computing.

Some special features---

／

G.P.I. Function/3D Audio/DIY Clear/Power on Button/Reset Button

CPU Smart Fan/ CPU Vcore 7-shift/ Debug Port/OC-CON

in this motherboard is designed for power user to use the over-clocking function in more flexible ways. But please be caution that the over-clocking may cause the failure in system reliability. This motherboard provides the guaranteed performance and meets

the demands of the next generation computing. But if you insist to gain more system performance with variety possibilities of the components you choose, please be careful and make sure to read the detailed descriptions of these value added product features, please get them in the coming section.

1-1.1 Special Features of motherboard

CPU Smart Fan--- The Noise Management System

It’s never been a good idea to gain the performance of your system by sacrificing its acoustics. CPU Smart Fan Noise Management System is the answer to control the noise level needed for now-a-day’s high performance computing system. The system will automatically increase the fan speed when CPU operating loading is high, after the CPU is in normal operating condition, the system will low down the fan speed for the silent operating environment. The system can provide the much longer life cycle for both CPU and the system fans for game use and business requirements.

CPU Vcore 7-Shift--- Shift to Higher Performance The CPU voltage can be adjusted up by 7 stages for the precisely over-clocking of extra demanding computing performance.

Debug Port--- The Professional Hardware Diagnosis System Being bugged of abnormal system failure through the tossed and turned nights no more, the embedded Hardware Debug Port offers you the real-time visual system healthy for the demanding usage of computing. No more bugging by unknown system failure and no more time wasted in the first moment of 24-hour nonstop ping business computing, the embedded Debug Port will turn you into a well training hardware professional with the seeing system situation. (The Post Code please refer Appendix)

OC-CON ---High-polymer Solid Electrolysis Aluminum Capacitors The working temperature is from 55 degrees Centigrade below zero to 125 degrees Centigrade, OC-CON capacitors possess superior physical characteristics that can be while reducing the working temperature between 20 degrees Centigrade each time, intact extension 10 times of effective product operation lives, at not rising degrees Centigrade of working temperatures each time a relative one, life of product decline 10% only too.

G.P.I. Function—Green power indicator function The full name of G.P.I technology is Green Power Indicator technology, obviously technology utilized to low power consumption. G.P.I is a technology with remarkable power saving function.

3D Audio—(3D Audio Sound Effect) OP with two-stage Butterworth filter and quadruple noninverting amplifier enhances bass effect under the 100MHz range to perfect audio effect, brings you stunning shock experience in video game, true-to-life simulated feeling when watching films and the greatest touch as that in the concert. There is a 3D Audio button integrated on the board. Press down the button to enable 3D audio effect or press again to disabled it.

DIY Clear

This CMOS Buttons (CMOS1) is to facilitate the clear COMS process for power user overclocking function. The user can easily clear or restore COMS settings by pressing down the button, without taking trouble to remove the case and locate the jumper for

clear CMOS. （Please remove or turn off the power supply before COMS clear）

Power on Button You can easily start the computer by pressing down this button for a few seconds, without troubling yourself to locate the front panel jumpers to find the Power on jumper.

Reset Button

You can easily restart the computer by pressing down this button for a few seconds, without troubling yourself to locate the front panel jumpers to find the reset jumper.

1-2 Specification

Spec Description

Design z Chipset z

CPU Socket

Memory Sockets

Expansion Slots

Serial ATA2

Gigabit LAN

8-CH HD Audio

BIOS z

ATX form factor 4 layers PCB size: 30.5x24.5cm Intel H55 Express Chipset

Intel LGA 1156 socket Intel® Core™ i7 Quad Processor

Intel® Core™ i5 Quad Processor、Intel® Core™ i3 Dual Processor and Intel® Pentium Processor

DDRIII module sockets x 4

Support 4pcs DDRIII 1066MHz/ DDRIII 1333 MHz memory

modules expandable to 16GB.

Support Dual- channel function

PCI-Express2.0 x16 slot 2pcs

PCI-Express2.0 x1 slot 1pcs

32-bit PCI slot 2pcs

z z

Mini PCI-Express

The Intel H55 chipset supports six internal Serial ATA ports

1pcs

for six SATA devices providing 3.0 Gb/sec data transfer rate

Integrated PCI-E Gigabit LAN chip

Supports Fast Ethernet LAN function provide10Mb/100Mb/

1Gb /s data transfer rate

8-channel HD Audio Codec integrated

Support 8-channel 3D surround & Positioning Audio

Audio driver and utility included

AMI 32MB SMT Flash ROM

、

Multi I/O

PS/2 keyboard connector x1

PS/2 Mouse connector x1

HDMI connector x1

VGA connector x1/DV I connector x1

Coaxial S/PDIF Out connector x1

ESATA connector x1 /SATA connectors x6

USB2.0 port x4 and headers x3

RJ-45 LAN connector x1

Audio connector x1 (8-CH Audio)

Serial Port headerx1

HDMI-SPDIF header x1

IR header x 1

CDIN header x1

FP＿AUDIO header x1

)

1-3 Performance List

The following performance data list is the testing result of some popular benchmark testing programs. These data are just referred by users, and there is no responsibility for different testing data values gotten by users (the different Hardware & Software configuration will result in different benchmark testing results.)

Test Environment

CPU I3 540 VGA DRIVER

BIOS T03 MEMORY

VGA

onboard VG

HDD WesternDigtal 160GB SATA

3DMark Vantage 4344

3D Mark 2006 1393 3D Mark 2005 2955

AQUAMRK3

System / CPU / Memor

Graph / HDD 3227

Content Creation Winstone 2004 54.5

Business Winstone 2004 33.5

Business/Hi-end Disk Winmark99 21700

Business/Hi-end Graphic Winmark

SySMark 2004: SISMark Rating(Internet Content Creation / Office Productivity )

SySMark 2004 309

3D Creation / 2D Creation 550

/ Web publication 474

Communication / Document Creation 183

/ Data Analysis 343

6159

Winbench 99 V2.0:

PCMark2005

8519 5421

683

400

acer 2G1333

5157

SiSOFT Sandra 2005 : 1.CPU Arithmetic Benchmark 2.Memory bandwidth Benchmark

3.CPU Multi-Media Benchmark

1.Dhrystone ALU MIPS 45.21

Whetstone FPU iSSE2 FLOPS

2.Int/Float Buffered iSSE2 MB/S

3.Integer/Floating-Point SSE2 IT/S UT2003 Benchmark

uake3 DEMO1 / DEMO2 FPS

Return to Castle Wolfenstein

Super Pi (1M

CPUZ System / CPU Clock

Second 13.369s

FPS

32.02

37.88

9.26

289.2

291.6

189.550140

1-4 Layout Diagram

PS/2 Keyboard

PS/2 Mouse

Connector

HDMI Connector

VGA Connector

DVI Connector

ESATA

Coaxial

SPDIF_OUT

USB Connectors

RJ-45 LAN

USB Connectors

Line-IN

RS-OUT

Line-OUT

CS-OUT

SS-OUT

MIC-IN

PS/2 KB/MS ports

HDMI Connector

VGA Connector

DVI Connector

ESATA

USB ports

Coaxial

SPDIF_OUT

Connector

RJ-45 Over

USB Connector

8 CH HD Audio

IR1 Header

PCI Express2.0 x16

By 1 6 lane

CDIN Header

Audio Decode

PCI Express2.0 x16

By 4 lane

HDMI-SPDIF

3D Audio Button

Over

ort

over

8-CH HD

PCI Slots

ATX 12V

Power Connector

JP11

E-SATA1

JP2

Gigabit LAN Chip

JP5

MINIPCI-E

COM1 Header

Front Panel Audio

CPU Socket

SYSFAN2

4-Pin PWR Connector PCI Express2.0 x1

JP6/JP7/JP8/JP9//JP10

Debug port

USB Headers

CPUFAN1

JBAT

32MB SMT Flash ROM

SYSFAN1

Power LED Header Speaker Header

G.P.I LED

DDR3 Socket x 4 (DIMM1~DIMM4)

ATX Power Conn.

Intel H55 Chipset

Reset Button

CMOS1 Clear Button

Serial-ATAII Connecto

(SATA 1~6)

Jumpers

Jumper Name Description

JBAT CMOS RAM Clear 2-pin Block

JP11 KB/MS Power On Enabled/Disabled 3-pin Block JP2 USB Power On Enabled/Disabled 3-pin Block JP6/JP7/JP8/JP9 PE1/MINIPCI-E select 3-pin Block JP10 MINIPCI-E 3VSB/VCC3 select 3-pin Block

Sockets and Slots

Socket/Slot Name Description

CPU Socket LGA 1156 CPU Socket LGA 1156 CPU Socket DIMM1~DIMM4 PCI1,PC2 PE1 PE2,PE3

DDRIII Module Sockets 240-pin DDRIII Module Sockets PCI Slots 32-bit PCI Local Bus Expansion slots PCI-Express2.0 x 1 Slot PCI-Express2.0 x 1 Expansion Slots PCI-Express 2.0x 16

Slots

PCI-Express2.0 x16 Expansion Slots

Connectors

Connector Name Description

ATXPWR ATX Power Connector 24-pin Block ATX12V ATX 12V Power Connector 8-pin Block J1 Large 4-pin Power Connector 4-pin Block

KB1 PS/2 Keyboard/Mouse Connector 6-pin Female VGA D-Sub Connector 15-pin Connector DVI Digital Visual Interface 24-pin Connector HDMI High-Definition Multimedia 19-pin Connector USB fromUL1 and CN2 USB 2.0 Port Connectors 4-pin Connector

RJ45 LAN from UL1 RJ-45 LAN Port Over USB Connectors. 8-pin Connector AUDIO 8-CH Audio Connector 6 phone jack

SATA~SATA6 Serial ATA2 Connector 7-pin Connector

E-SATA from CN1 External Serial ATA2 Connectors 7-pin Connector SPDIF_ Out Coaxial S/PDIF Out Connector 1-pin Connector

Headers

Header Name Description

FP_AUDIO SPEAKER, MIC header 9-pin Block USB2,USB3, USB4 USB Port Headers 9-pin Block SPEAK PC Speaker header 4-pin Block PWR LED Power LED header 3-pin Block

JW_FP(PWR

LED/Reset/

HD LED/PWR BTN) CPUFAN1 CPUFAN Header 4-pin Block SYSFAN1, SYSFAN2 System FAN Headers 3-pin Block CDIN CD Audio-In Header 4-pin Block IR1 IR Header 5-pin Block COM1 Serial Port Header 9-pin Block HDMI-SPDIF SPDIF-Out header 2-pin Block

Front Panel Header (including Power LED/ IDE activity LED/Reset switch / Power On Button lead)

9-pin Block

Chapter 2

Hardware Installation

WARNING!

Turn off your power when adding or removing expansion cards or other system components. Failure to do so may cause severe damage to both your motherboard and expansion cards.

2-1 Hardware installation Steps

Before using your computer, you had better complete the following steps:

1. Check motherboard jumper setting

2. Install CPU and Fan

3. Install System Memory (DIMM)

4. Install Expansion cards

5. Connect IDE Front Panel /Back Panel cable

6. Connect ATX Power cable

7. Power-On and Load Standard Default

8. Reboot

9. Install Operating System

10. Install Driver and Utility

2-2 Checking Motherboard’s Jumper Setting

(1) CMOS RAM Clear (3-pin): JBAT

A battery must be used to retain the motherboard configuration in CMOS RAM short 1-2 pins of JBAT to store the CMOS data.

To clear the CMOS, follow the procedure below:

1. Turn off the system and unplug the AC power

2. Remove ATX power cable from ATX power connector

3. Locate JBAT and short pins 2-3 for a few seconds

4. Return JBAT to its normal setting by shorting pins 1-2

5. Connect ATX power cable back to ATX power connector

Note: When should clear CMOS

1. Troubleshooting

2. Forget password

3. After over clocking system boot fail

JBATJBAT

1-2 Closed Normal

CMOS RAM Clear Setting

2-3 Closed Clear CMOS

(2) KB/MS Power on Function Enabled/Disabled: JP11

JP11

1-2 Closed KB/MS Power ON Disable (Default)

Keyboard/ M ou se Power On Setting

(3) USB Power On function Enabled/Disabled: JP2

1-2 closed USB Power On Disable

(Default)

USB Power-On Setting

2-3 closed USB Power On Enabled

(4) MINIPCI-E 3VSB/VCC3 Select: JP10

JP11

2-3 Closed KB/MS Power ON Enabled

JP2 JP2

1-2 Close 3VSB

(5) PE1/MINIPCI-E Select：JP6/JP7/JP8/JP9

1-2 Close(all)： PE1

JP10 JP10

2-3 Close VCC3

JP6/JP7/JP8/JP9 JP6/JP7/JP8/JP9

2-3 Close(all)： MINIPCI-E

2-3 Installing CPU

2-3-1 Glossary

Chipset (or core logic) - two or more integrated circuits which control the interfaces

between the system processor, RAM, I/O devises, and adapter cards. Processor slot/socket - the slot or socket used to mount the system processor on the motherboard.

Slot (PCI-E, PCI, RAM) - the slots used to mount adapter cards and system RAM. PCI - Peripheral Component Interconnect - a high speed interface for video cards,

sound cards, network interface cards, and modems; runs at 33MHz. PCI Express2.0- Peripheral Component Interconnect Express2.0, developed in 2003, the speed of each line doubled from the previous PCI-E of 2.5Gbps to 5 Gbps.

Serial Port - a low speed interface typically used for mouse and external modems. Parallel Port - a low speed interface typically used for printers. PS/2 - a low speed interface used for mouse and keyboards. USB - Universal Serial Bus - a medium speed interface typically used for mouse,

keyboards, scanners, and some digital cameras. Sound (interface) - the interface between the sound card or integrated sound connectors and speakers, MIC, game controllers, and MIDI sound devices.

LAN (interface) - Local Area Network - the interface to your local area network. BIOS (Basic Input/Output System) - the program logic used to boot up a computer

and establish the relationship between the various components. Driver - software, which defines the characteristics of a device for use by another device or other software. Processor - the "central processing unit" (CPU); the principal integrated circuit used for doing the "computing" in "personal computer"

Front Side Bus Frequency -

generated by the clock generator for CPU, DRAM and PCI BUS.

CPU L2 Cache -

the flash memory inside the CPU, normal it depend on CPU type.

the working frequency of the motherboard, which is

2-3-2 About Intel LGA 1156 CPU Socket

This motherboard provides an 1156-pin DIP, LGA 1156 Land Grid Array socket, referred to as the LGA 1156 socket.

The CPU that comes with the motherboard should have a cooling FAN attached to prevent overheating. If this is not the case, then purchase a correct cooling FAN before you turn on your system.

NOTED!

To install a CPU, first turn off your system and remove its cover. Locate the LGA 1156 socket and open it by first pulling the level sideways away from the socket then upward to a 135-degree angle. Insert the CPU with the correct orientation as shown below. The notched corner should point toward the end of the level. Because the CPU

Be sure that there is sufficient air circulation across the processor’s heat sink and CPU cooling FAN is working correctly, otherwise it may cause the processor and motherboard overheat and damage, you may install an auxiliary cooling FAN, if necessary.

has a corner pin for two of the four corners, the CPU will only fit in the orientation as shown.

When you install the CPU into the LGA 1156 socket, there’s no force required CPU insertion; then press the level to locate position slightly without any extra force.

Pin-1 Indicator

Alignment key

2-3-3 LGA 1156 CPU Installation Guide

1. Please make sure that CPU socket is facing

towards you and the level is on you left hand side.

2. Press down the level and move it to the left side

to make sure it is freed from the hook and then open it upwards about 135 degree.

3. Open the level upwards about 135 degree and the

metal protection plate will be pulled up at the same time.

4. Remove the plastic protective cap from the

socket. (Put it to the original place if CPU is not installed. Do not touch the metal contact point of the CPU socket).

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