Intel H2224XXKR2, 2HE, 1600W redundant User Manual

REVISION 2.21

OCTOBER 2016

Intel® Server Chassis H2000G Product Family

Technical Product Specification

A document providing an overview of product features, functions, architecture, and support specifications

INTEL® SERVER PRODUCTS AND SOLUTIONS

Revision History Intel® Server Chassis H2000G Product Family TPS

Date

Revision Number

Modifications

August, 2014

1.20

1st External Public Release

November, 2014

1.30

Added S2600TP and HNS2600TP Updated the package dimensions in the Chassis Feature Set table

December, 2014

1.40

Added Appendix C System Configuration Table for Thermal Compatibility

February, 2015

1.41

Updated the System Environmental Limits Summary table and the specification data for the AC Power Supply Unit table

August, 2015

1.50

Added Intel® Server Chassis H2224XXKR2

November, 2015

1.51

Corrected some information

April, 2016

1.60

Added Intel® Server Chassis H2224XXLR2 Added FXX2130PCRPS

May, 2016

2.0

Applied new format version definition

May, 2016

2.10

Added CFM specification for H2224XXKR2 and H2224XXLR2

June, 2016

2.20

Added Intel® Server Chassis H2312XXLR2 and H2216XXLR2 Added S7200AP references

October, 2016

2.21

Added Intel® SATA SSD support for H2224XXKR2 and H2224XXLR2 Typographical corrections

Revision History

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Disclaimers

iii

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, lifesaving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Server Chassis H2000G Product Family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

This document and the software described in it are furnished under license and may only be used or copied in accordance with the terms of the license. The information in this manual is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or any software that may be provided in association with this document.

Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any means without the express written consent of Intel Corporation.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Revision 2.21

Table of Contents Intel® Server Chassis H2000G Product Family TPS

Table of Contents

1. Introduction ........................................................................................................................................ 1

1.1 Chapter Outline .................................................................................................................................... 1

1.2 Server Board Use Disclaimer .......................................................................................................... 2

2. Product Overview .............................................................................................................................. 3

2.1 Chassis Views ........................................................................................................................................ 5

2.2 Environmental Limits ......................................................................................................................... 7

2.3 Chassis Parts ......................................................................................................................................... 8

2.4 Drive and Peripheral Bays ............................................................................................................ 11

2.5 Front Bezel Support ........................................................................................................................ 12

2.6 Rack and Cabinet Mounting Options ....................................................................................... 12

3. Power Subsystem ........................................................................................................................... 13

3.1 Power Supply Overview ................................................................................................................ 13

3.1.1 Power Supply Dimension.............................................................................................................. 13

3.1.2 AC Power Supply Unit General Data ........................................................................................ 14

3.1.3 AC Input Connector ......................................................................................................................... 14

3.1.4 AC Power Cord Specification Requirements ........................................................................ 14

3.1.5 Power Supply Unit DC Output Connector ............................................................................. 15

3.1.6 Handle Retention ............................................................................................................................. 15

3.1.7 LED Marking and Identification .................................................................................................. 16

3.1.8 Power Distribution Module .......................................................................................................... 16

3.1.9 Power Interposer Board ................................................................................................................ 17

3.1.10 Power Cage Output Pin Assignment ........................................................................................ 18

3.2 AC Input Specification .................................................................................................................... 19

3.2.1 Input Voltage and Frequency ...................................................................................................... 19

3.2.2 AC input Power Factor ................................................................................................................... 19

3.2.3 Efficiency .............................................................................................................................................. 19

3.2.4 AC Line Fuse ....................................................................................................................................... 19

3.2.5 AC Line Inrush .................................................................................................................................... 20

3.2.6 AC Line Dropout/Holdup .............................................................................................................. 20

3.2.7 AC Line Fast Transient (EFT) Specification ............................................................................ 20

3.2.8 Hot Plug ................................................................................................................................................ 20

3.2.9 Susceptibility Requirements ........................................................................................................ 21

3.2.10 Electrostatic Discharge Susceptibility ..................................................................................... 21

3.2.11 Fast Transient/Burst........................................................................................................................ 21

3.2.12 Radiated Immunity .......................................................................................................................... 21

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Intel® Server Chassis H2000G Product Family TPS Table of Contents

3.2.13 Surge Immunity ................................................................................................................................. 21

3.2.14 AC Line Transient Specification ................................................................................................. 22

3.2.15 Power Recovery ................................................................................................................................ 22

3.2.16 Voltage Interruptions ..................................................................................................................... 22

3.2.17 AC Line Isolation ............................................................................................................................... 22

3.2.18 AC Power Inlet ................................................................................................................................... 23

3.3 DC Output Specification ................................................................................................................ 24

3.3.1 Output Power/Currents ................................................................................................................. 24

3.3.2 Standby Output ................................................................................................................................ 24

3.3.3 Voltage Regulation .......................................................................................................................... 24

3.3.4 Dynamic Loading .............................................................................................................................. 25

3.3.5 Capacitive Loading .......................................................................................................................... 25

3.3.6 Ripple/Noise ....................................................................................................................................... 25

3.3.7 Grounding............................................................................................................................................ 25

3.3.8 Closed Loop Stability...................................................................................................................... 26

3.3.9 Residual Voltage Immunity in Standby Mode ...................................................................... 26

3.3.10 Common Mode Noise ..................................................................................................................... 26

3.3.11 Soft Starting ....................................................................................................................................... 26

3.3.12 Zero Load Stability Requirement ............................................................................................... 26

3.3.13 Hot Swap Requirement .................................................................................................................. 27

3.3.14 Forced Load Sharing ....................................................................................................................... 27

3.3.15 Timing Requirement ....................................................................................................................... 27

3.4 Power Supply Cold Redundancy Support ............................................................................. 29

3.4.1 1600W CRPS Cold Redundancy ................................................................................................ 29

3.4.2 2130W CRPS Cold Redundancy ................................................................................................ 29

3.5 Control and Indicator Functions ................................................................................................ 30

3.5.1 PSON# Input Signal ......................................................................................................................... 30

3.5.2 PWOK (power good) Output Signal .......................................................................................... 30

3.5.3 SMBAlert# Signal.............................................................................................................................. 31

3.6 Protection Circuits ........................................................................................................................... 32

3.6.1 Current Limit (OCP) ......................................................................................................................... 32

3.6.2 Over Voltage Protection (OVP) ................................................................................................... 32

3.6.3 Over Thermal Protection .............................................................................................................. 32

3.7 PMBus* ................................................................................................................................................. 33

3.7.1 PSU Address Lines A0 .................................................................................................................... 33

3.7.2 Accuracy ............................................................................................................................................... 34

3.8 Power Management Policy ........................................................................................................... 35

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Table of Contents Intel® Server Chassis H2000G Product Family TPS

4. Cooling Subsystem ........................................................................................................................ 36

4.1 Power Supply Fans .......................................................................................................................... 36

4.2 Drive Bay Population Requirement .......................................................................................... 37

5. Drive Support .................................................................................................................................. 38

5.1 Drive Bays Scheme .......................................................................................................................... 38

5.2 Drive Carrier ........................................................................................................................................ 40

5.3 Hot-Swap Drive Support ............................................................................................................... 42

5.3.1 Backplane Feature Set ................................................................................................................... 42

5.3.2 3.5" Hot Swap Backplane Connector Scheme ..................................................................... 43

5.3.3 2.5" Hot Swap Backplane Connector Scheme ..................................................................... 45

5.3.4 SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane .................................................... 47

5.3.5 Backplane Interposer Board ........................................................................................................ 48

5.3.6 Backplane LED Support ................................................................................................................. 49

5.3.7 Backplane Connector Definition ................................................................................................ 50

5.3.8 Backplane Interposer Board Connectors ............................................................................... 54

6. Front Panel Control and Indicators ............................................................................................ 57

6.1 Control Panel Button ...................................................................................................................... 57

6.2 Control Panel LED Indicators ...................................................................................................... 58

6.2.1 Power LED ........................................................................................................................................... 58

6.2.2 Status LED ........................................................................................................................................... 59

6.2.3 ID LED .................................................................................................................................................... 61

Appendix A: Integration and Usage Tips .......................................................................................... 63

Appendix B: Statement of Volatility .................................................................................................. 64

Appendix C: System Configuration Table for Thermal Compatibility ....................................... 65

Glossary ................................................................................................................................................... 73

Reference Documents ........................................................................................................................... 75

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Intel® Server Chassis H2000G Product Family TPS List of Figures

vii

List of Figures

Figure 1. Server Chassis Overview (12 x 3.5” drive bay) ................................................................................ 5

Figure 2. Server Chassis Overview (16 x 2.5” drive bay) ................................................................................ 5

Figure 3. Server Chassis Overview (24 x 2.5” drive bay) ................................................................................ 6

Figure 4. Server Chassis Rear View ......................................................................................................................... 6

Figure 5. Dummy Tray Cover ..................................................................................................................................... 6

Figure 6. Major Server Chassis Parts (12 x 3.5” drive bay) ............................................................................ 8

Figure 7. Major Server Chassis Parts (16 x 2.5” drive bay) ............................................................................ 9

Figure 8. Major Server Chassis Parts (24 x 2.5” drive bay) ......................................................................... 10

Figure 9. 12 x 3.5” Drive Chassis Front View .................................................................................................... 11

Figure 10. 16 x 2.5” Drive Chassis Front View ................................................................................................. 11

Figure 11. 24 x 2.5” Drive Chassis Front View ................................................................................................. 11

Figure 12. Front Bezel ............................................................................................................................................... 12

Figure 13. 1600W and 2130W AC Power Supply Module Overview .................................................... 13

Figure 14. AC Power Supply Unit Dimension Overview .............................................................................. 14

Figure 15. Power Cage Overview .......................................................................................................................... 16

Figure 16. Power Interposer Board Top View ................................................................................................. 17

Figure 17. Power Distribution Board ................................................................................................................... 18

Figure 18. AC Power Cord Specification ............................................................................................................ 23

Figure 19. Turn On/Off Timing (Power Supply Signals) .............................................................................. 28

Figure 20. Power Supply Device Address ......................................................................................................... 33

Figure 21. PMBus Monitoring Accuracy ............................................................................................................. 34

Figure 22. 12 x 3.5” Drive Configuration ........................................................................................................... 38

Figure 23. 16 x 2.5” Drive Configuration ........................................................................................................... 38

Figure 24. 24 x 2.5” Drive Configuration ........................................................................................................... 39

Figure 25. 3.5" Drive Carrier Overview ............................................................................................................... 40

Figure 26. 2.5" Drive Carrier Overview ............................................................................................................... 40

Figure 27. 2.5" Drive/PCIe* SFF Device Carrier Overview ........................................................................... 41

Figure 28. Combo Backplane Kit Device Carrier Identification ................................................................ 41

Figure 29. 3.5" Drive Carrier Support 2.5” SSD ............................................................................................... 41

Figure 30. 3.5" Backplane Component and Connectors (Front View) ................................................... 43

Figure 31. 3.5" Backplane Component and Connectors (Back View) .................................................... 44

Figure 32. 2.5" Backplane Component and Connectors (Front View) ................................................... 45

Figure 33. 2.5" Backplane Component and Connectors (Back View) .................................................... 46

Figure 34. 24 x 2.5" Backplane Component and Connectors (Front View) ......................................... 47

Figure 35. 24 x 2.5" Backplane Component and Connectors (Back View) .......................................... 48

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List of Figures Intel® Server Chassis H2000G Product Family TPS

viii

Figure 36. Backplane Interposer Board Front View ...................................................................................... 49

Figure 37. Backplane Interposer Board Back View ....................................................................................... 49

Figure 38. Drive Tray LED Identification ............................................................................................................ 50

Figure 39. Front Control Panel .............................................................................................................................. 57

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Intel® Server Chassis H2000G Product Family TPS List of Tables

List of Tables

Table 1. Chassis Feature Set ...................................................................................................................................... 3

Table 2. System Environmental Limits Summary ............................................................................................. 7

Table 3. Specification Data for AC Power Supply Unit ................................................................................ 14

Table 4. AC Power Cord Specification ................................................................................................................ 14

Table 5. DC Output Power Connector ................................................................................................................ 15

Table 6. Power Supply Status LED ....................................................................................................................... 16

Table 7. Pin Assignment of Power Output Connector ................................................................................ 18

Table 8. Pin Assignment of Control Signal Connector ................................................................................ 18

Table 9. AC Input Rating ........................................................................................................................................... 19

Table 10. Typical Power Factor ............................................................................................................................. 19

Table 11. Platinum Efficiency Requirement ..................................................................................................... 19

Table 12. AC Power Holdup Requirement ........................................................................................................ 20

Table 13. Performance Criteria ............................................................................................................................. 21

Table 14. AC Line Sag Transient Performance ............................................................................................... 22

Table 15. AC Line Surge Transient Performance ........................................................................................... 22

Table 16. Load Ratings for Single 1600W Power Supply Unit................................................................. 24

Table 17. Voltage Regulation Limits ................................................................................................................... 24

Table 18. Transient Load Requirements ........................................................................................................... 25

Table 19. Capacitive Loading Conditions .......................................................................................................... 25

Table 20. Ripple and Noise ..................................................................................................................................... 25

Table 21. Timing Requirement .............................................................................................................................. 27

Table 22. 1600W CRPS Cold Redundancy Threshold................................................................................. 29

Table 23. 2130W CRPS Cold Redundancy Threshold................................................................................. 30

Table 24. PSON# Signal Characteristics ............................................................................................................ 30

Table 25. PWOK Signal Characteristics ............................................................................................................. 30

Table 26. SMBAlert# Signal Characteristics ..................................................................................................... 31

Table 27. Over Current Protection ....................................................................................................................... 32

Table 28. Over Voltage Protection (OVP) Limits ............................................................................................ 32

Table 29. PSU Addressing ....................................................................................................................................... 33

Table 30. PMBus Accuracy ...................................................................................................................................... 34

Table 31. Power Management Policy ................................................................................................................. 35

Table 32. Air Flow ....................................................................................................................................................... 36

Table 33. Drive Status LED States ........................................................................................................................ 50

Table 34. Drive Activity LED States ...................................................................................................................... 50

Table 35. Backplane Input Power Connector Pin-out ................................................................................. 51

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List of Tables Intel® Server Chassis H2000G Product Family TPS

Table 36. 2-Blade Compute Module Power Connector Pin-out ............................................................. 51

Table 37. 2x40 Pin Connector Pin-out for Compute Module Bridge Board....................................... 52

Table 38. Front Panel Connector Pin-out ......................................................................................................... 53

Table 39. Power Supply Control Connector Pin-out ................................................................................... 53

Table 40. 80 pin Misc. Signal Connector ........................................................................................................... 54

Table 41. 40 pin Misc. Signal Connector ........................................................................................................... 55

Table 42. BIB Power Edge Connector ................................................................................................................. 56

Table 43. Front Panel Connector ......................................................................................................................... 56

Table 44. Front Control Button Function .......................................................................................................... 57

Table 45. Front LED Indicator Functions ........................................................................................................... 58

Table 46. Power LED Operation ............................................................................................................................ 58

Table 47. Status LED State Definitions .............................................................................................................. 59

Table 48. ID LED .......................................................................................................................................................... 61

Table 49. Non-volatile Components List .......................................................................................................... 64

Table 50. Thermal Configuration Table – S2600KP Product Family, Normal Mode ...................... 66

Table 51. Thermal Configuration Table – S2600KP Product Family, Fan Fail Mode ..................... 67

Table 52. Thermal Configuration Table – S2600TP Product Family, Normal Mode ...................... 69

Table 53. Thermal Configuration Table – S2600TP Product Family, Fan Fail Mode...................... 71

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Intel® Server Chassis H2000G Product Family TPS List of Tables

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Intel® Server Chassis H2000G Product Family TPS Introduction

1. Introduction

This Technical Product Specification (TPS) provides chassis specific information detailing the features, functionality, and high-level architecture of the Intel® Server Chassis H2000G product family. You should also reference the following product family TPS to obtain greater details of functionality and architecture of the compute module to be integrated into this server chassis:

 Intel® Server Board S2600KP Product Family  Intel® Compute Module HNS2600KP Product Family  Intel® Server Board S2600TP Product Family  Intel® Compute Module HNS2600TP Product Family  Intel® Server Board S7200AP Product Family  Intel® Compute Module HNS7200AP Product Family

In addition, you can obtain design-level information for specific subsystems by ordering the External Product Specifications (EPS) or External Design Specifications (EDS) for a given subsystem. EPS and EDS documents are not publicly available. They are only made available under NDA with Intel and must be ordered through your local Intel representative. For a complete list of available documents, refer to the Reference Documents section at the end of this document.

The Intel® Server Chassis H2000G product family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Refer to the

Intel® Server Board S2600KP Product Family Specification Update and Intel® Server Board S2600TP Product Family and Intel® Server Board S7200AP Specification Update for published

errata.

1.1 Chapter Outline

This document is divided into the following chapters:

 Chapter 1 – Introduction  Chapter 2 – Product Overview  Chapter 3 – Power Subsystem  Chapter 4 – Cooling Subsystem  Chapter 5 – Drive Support  Chapter 6 – Front Panel Control and Indicators  Appendix A – Integration and Usage Tips  Appendix B – Statement of Volatility  Appendix C – System Configuration Table for Thermal Compatibility  Glossary  Reference Documents

Revision 2.21

Introduction Intel® Server Chassis H2000G Product Family TPS

1.2 Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Product Overview

Feature

Description

Dimensions

H2312XXKR2

H2312XXLR2

3.42 inches (86.9 mm) high

17.24 inches (438 mm) wide

30.35 inches (771 mm) deep

H2216XXKR2 H2216XXLR2

H2224XXKR2

H2224XXLR2

3.42 inches (86.9 mm) high

17.24 inches (438 mm) wide

28.86 inches (733 mm) deep Package Dimensions*

983X577X260 mm

Weight

H2312XXKR2

H2312XXLR2

Net weight 21.5kg, package weight 29.5kg

H2216XXKR2 H2216XXLR2

Net weight 20.5kg, package weight 28.4kg

H2224XXKR2

H2224XXLR2

Net weight 20.64 kg, package weight 28.86 kg

Compute Module Support

H2312XXKR2

H2312XXLR2

H2216XXKR2 H2216XXLR2

Intel® Compute Module HNS2600KP Product Family

Intel® Compute Module HNS2600TP Product Family Intel® Compute Module HNS7200AP Product Family*

H2224XXKR2 H2224XXLR2

Intel® Compute Module HNS2600TP24 Product Family

Intel® Compute Module HNS7200AP Product Family*

Fan

One internal power supply fan for each installed power supply unit

Power Supply Options

1600W or 2130W AC Common Redundant Power Supply (CRPS), 80 plus Platinum, supporting CRPS configuration

Storage Bay Options

12x 3.5-inch SATA/SAS drive bays – H2312XXKR2 and H2312XXLR2 16x 2.5-inch SATA/SAS drive bays – H2216XXKR2 and H2216XXKR2

24x 2.5-inch SAS drive bays (8 x PCIe* SFF) – H2224XXKR2 and H2224XXLR2

2. Product Overview

The Intel® Server Chassis H2000G product family is rack mount 2U server chassis which can support up to four compute modules, purpose-built for high-density and lowest total cost of ownership in dense computing applications, such as HPC and IPDC. The chassis can be used to integrate with four compute modules, supporting up to twelve 3.5" or sixteen 2.5" hot-swap SAS or SATA drives, with 1600 Watts and 2130 Watts Common Redundant Power Supply (CRPS) capability.

This chapter provides a high-level overview of the chassis features. The following chapters provide greater detail for each major chassis component or feature.

Table 1. Chassis Feature Set

*The Intel® Compute Module HNS7200AP product family is only compatible with the Intel® Server Chassis H2000XXLR2 product family

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Note: The package dimensions are the outer dimensions of the package box out of the server chassis.

The Intel® Server Chassis H2000G product family also supports different compute module quantity in the same chassis. The compute module quantity can be at least 1, and up to 4 in one chassis.

WARNING! Be protected before accessing the system from rear side since the temperature of an operating system exit air could be over 70°C (158°F).

Caution: The chassis has limited support on mixed compute module configuration, for example, compute modules based on different server board can be installed in the same chassis for power-on only.

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Intel® Server Chassis H2000G Product Family TPS Product Overview

2.1 Chassis Views

Figure 1. Server Chassis Overview (12 x 3.5” drive bay)

Figure 2. Server Chassis Overview (16 x 2.5” drive bay)

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Figure 3. Server Chassis Overview (24 x 2.5” drive bay)

Figure 4. Server Chassis Rear View

Figure 5. Dummy Tray Cover

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Intel® Server Chassis H2000G Product Family TPS Product Overview

Parameter

Limits

Temperature

Operating

ASHRAE Class A2 – Continuous Operation. 10°C to 35°C (50°F to 95°F) with the maximum rate of change not to exceed 10°C per hour

ASHRAE Class A3 – Includes operation up to 40°C for up to 900 hours per

ASHRAE Class A4 – Includes operation up to 45° for up to 90 hours per year

Non-Operating

-40°C to 70°C (-40°F to 158°F)

Altitude

Operating

Support for operation up to 3050m with ASHRAE class deratings.

Humidity

Non-Operating

50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures from 25°C to 35°C)

Shock

Operating

Half sine, 2g, 11 mSec

Unpackaged

Trapezoidal, 25g, velocity change 175 inches/second

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A

Vibration

Unpackaged

5 Hz to 500 Hz 2.20 g RMS random

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A

AC-DC

Voltage

90 V to 132 V and 180 V to 264 V

Frequency

47 Hz to 63 Hz

Source Interrupt

No loss of data for power line drop-out of 12 mSec

Surge Non-

operating and

operating

Unidirectional

Line to earth Only

AC Leads 2.0 kV

I/O Leads 1.0 kV

ESD

Air Discharged

12.0 kV

Contact Discharge

8.0 kV

2.2 Environmental Limits

The following table defines the system level operating and non-operating environmental limits.

Table 2. System Environmental Limits Summary

Disclaimer Note: Intel ensures the unpackaged server board and chassis meet the shock requirement mentioned above through its own chassis development and configuration. It is the responsibility of the system integrator to determine the proper shock level of the board and chassis if the system integrator chooses different configuration or different chassis. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Front Control Panels

Drive bays

Power Distribution Module

Power Supply Modules

Hot Swap Back Plane (attached to the drive cage)

2.3 Chassis Parts

Note: Not shown – Rack slide rail and power distribution module cover

Figure 6. Major Server Chassis Parts (12 x 3.5” drive bay)

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Intel® Server Chassis H2000G Product Family TPS Product Overview

Front Control Panels

Drive bays

Power Distribution Module

Power Supply Modules

Hot Swap Back Plane (attached to the drive cage)

Note: Not shown – Rack slide rail and power distribution module cover

Figure 7. Major Server Chassis Parts (16 x 2.5” drive bay)

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Front Control Panels

Drive bays

Power Interposer Board (24 x 2.5” drive chassis only)

Power Distribution Module

Power Supply Modules

Hot Swap Backplane (attached to the drive cage)

Note: Not shown – Rack slide rail and power distribution module cover

Figure 8. Major Server Chassis Parts (24 x 2.5” drive bay)

Notes:

1. The blank compute module bay must be covered by a dummy tray cover. When removed,

keep the dummy tray cover properly for future use.

2. The compute module bay in the chassis requires either a compute module being installed

and powered up or a dummy tray cover installed to maintain proper thermal environment for the other running compute modules in the same chassis. In case of a compute module failure, remove the failed compute module, and replace with a dummy tray cover until the new compute module is installed.

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Intel® Server Chassis H2000G Product Family TPS Product Overview

Intel® Server Chassis

H2312XXKR2, H2312XXLR2

Intel® Server Chassis

H2216XXKR2, H2216XXLR2

Intel® Server Chassis

H2224XXKR2, H2224XXLR2

SATA/SAS Drives (3.5-inch)

Up to 12

Not Supported

SATA/SAS Drives (2.5-inch)

Up to 12

Up to 16

Up to 24

(1)

PCIe* SFF Devices

Not Supported

Up to 8

(2)

2.4 Drive and Peripheral Bays

Note (1): Intel® SATA SSDs and 3rd party SAS drives were validated on the H2224XXKR2 and H2224XXLR2 chassis.

Note (2): As the PCIe* SFF device (NVMe SSD) shares the drive slots with SAS drive, so when support 8 NVMe SSD, SAS drive number will decrease from 24 to 16.

Figure 9. 12 x 3.5” Drive Chassis Front View

Figure 10. 16 x 2.5” Drive Chassis Front View

Figure 11. 24 x 2.5” Drive Chassis Front View

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Product Overview Intel® Server Chassis H2000G Product Family TPS

2.5 Front Bezel Support

The Intel® Server Chassis H2000G product family provides front panel bezel. The bezel provides protection to chassis drive bays with a lock to the chassis. The front view of the bezel is as below.

Figure 12. Front Bezel

2.6 Rack and Cabinet Mounting Options

The server chassis is designed to support 19 inches wide by up to 30 inches deep server cabinets. The server chassis bundles with the following Intel® rack mount option:

 The basic slide rail kit (Product order code – AXXELVRAIL) is designed to mount the

chassis into a standard (19 inches wide by up to 30 inches deep) EIA-310D compatible server cabinet.

 The premium quality rails (Product order code – AXXFULLRAIL) can support the travel

distance 780mm, full extension from rack.

Caution: THE MAXIMUM RECOMMENDED SERVER WEIGHT FOR THE RACK RAILS CAN BE FOUND at http://www.intel.com/support/motherboards/server/sb/CS-033655.htm. EXCEEDING THE MAXIMUM RECOMMENDED WEIGHT OR MISALIGNMENT OF THE SERVER MAY RESULT IN FAILURE OF THE RACK RAILS HOLDING THE SERVER. Use of a mechanical assist to install and align server into the rack rails is recommended.

Advisory Note: To support shipment of the server chassis while installed in a rack with the rack mount rail kit, user should ensure the server cabinet and its package can support the shipment under the actual transport conditions.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

3. Power Subsystem

The server chassis supports 1600W and 2130W AC 1+1 hot-swap power supply module and two power distribution boards which can support 2U rack high density server.

3.1 Power Supply Overview

The power supply module has a simple retention mechanism to retain the module self once it is inserted. This mechanism withstands the specified mechanical shock and vibration requirements. The power distribution board is fixed in the chassis with screws. Using existing power supply module provided by vendor with updated PMBus* and custom-made power connector board the server chassis supports four compute modules. The power supply has two outputs: 12V and 12V standby. The input is auto ranging and power factor corrected. The PMBus* features are requirements for AC silver rated box power supply for use in server systems based on the Intel® Server Chassis H2000G product family. This specification is based on the PMBus* Specifications part I and II, revision 1.1.

Figure 13. 1600W and 2130W AC Power Supply Module Overview

3.1.1 Power Supply Dimension

The physical size of the power supply enclosure is 39/40mm x 73.5mm x 265mm. The power supply contains a single 40mm fan. The power supply has a card edge output that interfaces with a 2x25 card edge connector in the chassis. The AC plugs directly into the external face of the power supply.

Revision 2.21

Power Subsystem Intel® Server Chassis H2000G Product Family TPS

1600W Power Supply

2130W Power Supply

Wattage

1600W (Energy Smart)

2130W (Energy Smart)

Voltage

90-264 VAC, auto-ranging, 47 Hz-63 Hz

Heat Dissipation

5459 BTU/hr

7268 BTU/hr

Maximum Inrush Current

Under typical line conditions and over the entire chassis ambient operating range, the inrush current may reach 65 A per power supply for 5 ms

80 Plus rating

Platinum

Cable Type

SJT

Wire Size

16 AWG

Temperature Rating

105º C

Amperage Rating

13A

Figure 14. AC Power Supply Unit Dimension Overview

3.1.2 AC Power Supply Unit General Data

Below is general specification data for AC power supply unit.

Table 3. Specification Data for AC Power Supply Unit

3.1.3 AC Input Connector

The power supply has an internal IEC320 C14 power inlet. The inlet is rated for a minimum of 10A at 250VAC.

3.1.4 AC Power Cord Specification Requirements

The AC power cord used meets the following specification requirements.

Table 4. AC Power Cord Specification

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Cable Type

SJT

PSU Output Connector

GND

A10

+12V

B10

+12V

A11

+12V

B11

+12V

A12

+12V

B12

+12V

A13

+12V

B13

+12V

A14

+12V

B14

+12V

A15

+12V

B15

+12V

A16

+12V

B16

+12V

A17

+12V

B17

+12V

A18

+12V

B18

+12V

A19

PMBus SDA*

B19

A0* (SMBus address)

A20

PMBus SCL*

B20

A1* (SMBus address)

A21

PSON

B21

12V STBY

A22

SMBAlert#

B22

Cold Redundancy Bus*

A23

Return Sense

B23

12V load share bus

A24

+12V Remote Sense

B24

No Connect

A25

PWOK

B25

CRPS Compatibility Check pin*

3.1.5 Power Supply Unit DC Output Connector

The DC output connector pin-out is defined as follows.

Table 5. DC Output Power Connector

3.1.6 Handle Retention

The power supply has a handle to assist extraction. The module is able to be inserted and extracted without the assistance of tools. The power supply also has a latch which retains the power supply into the chassis and prevents the power supply from being inserted or extracted from the chassis when the AC power cord is pulled into the power supply.

The handle protects the operator from any burn hazard through the use of industrial designed plastic handle or equivalent material.

Revision 2.21

* Refer to the spec of CRPS Common Requirements Specification.

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