Intel H2224XXKR2, 2HE, 1600W redundant User Manual

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REVISION 2.21

OCTOBER 2016

Intel® Server Chassis H2000G Product Family

Technical Product Specification

A document providing an overview of product features, functions, architecture, and support specifications

INTEL® SERVER PRODUCTS AND SOLUTIONS

Revision History Intel® Server Chassis H2000G Product Family TPS

Date

Revision Number

Modifications

August, 2014

1.20

1st External Public Release

November, 2014

1.30

Added S2600TP and HNS2600TP Updated the package dimensions in the Chassis Feature Set table

December, 2014

1.40

Added Appendix C System Configuration Table for Thermal Compatibility

February, 2015

1.41

Updated the System Environmental Limits Summary table and the specification data for the AC Power Supply Unit table

August, 2015

1.50

Added Intel® Server Chassis H2224XXKR2

November, 2015

1.51

Corrected some information

April, 2016

1.60

Added Intel® Server Chassis H2224XXLR2 Added FXX2130PCRPS

May, 2016

2.0

Applied new format version definition

May, 2016

2.10

Added CFM specification for H2224XXKR2 and H2224XXLR2

June, 2016

2.20

Added Intel® Server Chassis H2312XXLR2 and H2216XXLR2 Added S7200AP references

October, 2016

2.21

Added Intel® SATA SSD support for H2224XXKR2 and H2224XXLR2 Typographical corrections

Revision History

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Disclaimers

iii

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, lifesaving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Server Chassis H2000G Product Family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

This document and the software described in it are furnished under license and may only be used or copied in accordance with the terms of the license. The information in this manual is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or any software that may be provided in association with this document.

Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any means without the express written consent of Intel Corporation.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Revision 2.21

Table of Contents Intel® Server Chassis H2000G Product Family TPS

Table of Contents

1. Introduction ........................................................................................................................................ 1

1.1 Chapter Outline .................................................................................................................................... 1

1.2 Server Board Use Disclaimer .......................................................................................................... 2

2. Product Overview .............................................................................................................................. 3

2.1 Chassis Views ........................................................................................................................................ 5

2.2 Environmental Limits ......................................................................................................................... 7

2.3 Chassis Parts ......................................................................................................................................... 8

2.4 Drive and Peripheral Bays ............................................................................................................ 11

2.5 Front Bezel Support ........................................................................................................................ 12

2.6 Rack and Cabinet Mounting Options ....................................................................................... 12

3. Power Subsystem ........................................................................................................................... 13

3.1 Power Supply Overview ................................................................................................................ 13

3.1.1 Power Supply Dimension.............................................................................................................. 13

3.1.2 AC Power Supply Unit General Data ........................................................................................ 14

3.1.3 AC Input Connector ......................................................................................................................... 14

3.1.4 AC Power Cord Specification Requirements ........................................................................ 14

3.1.5 Power Supply Unit DC Output Connector ............................................................................. 15

3.1.6 Handle Retention ............................................................................................................................. 15

3.1.7 LED Marking and Identification .................................................................................................. 16

3.1.8 Power Distribution Module .......................................................................................................... 16

3.1.9 Power Interposer Board ................................................................................................................ 17

3.1.10 Power Cage Output Pin Assignment ........................................................................................ 18

3.2 AC Input Specification .................................................................................................................... 19

3.2.1 Input Voltage and Frequency ...................................................................................................... 19

3.2.2 AC input Power Factor ................................................................................................................... 19

3.2.3 Efficiency .............................................................................................................................................. 19

3.2.4 AC Line Fuse ....................................................................................................................................... 19

3.2.5 AC Line Inrush .................................................................................................................................... 20

3.2.6 AC Line Dropout/Holdup .............................................................................................................. 20

3.2.7 AC Line Fast Transient (EFT) Specification ............................................................................ 20

3.2.8 Hot Plug ................................................................................................................................................ 20

3.2.9 Susceptibility Requirements ........................................................................................................ 21

3.2.10 Electrostatic Discharge Susceptibility ..................................................................................... 21

3.2.11 Fast Transient/Burst........................................................................................................................ 21

3.2.12 Radiated Immunity .......................................................................................................................... 21

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Intel® Server Chassis H2000G Product Family TPS Table of Contents

3.2.13 Surge Immunity ................................................................................................................................. 21

3.2.14 AC Line Transient Specification ................................................................................................. 22

3.2.15 Power Recovery ................................................................................................................................ 22

3.2.16 Voltage Interruptions ..................................................................................................................... 22

3.2.17 AC Line Isolation ............................................................................................................................... 22

3.2.18 AC Power Inlet ................................................................................................................................... 23

3.3 DC Output Specification ................................................................................................................ 24

3.3.1 Output Power/Currents ................................................................................................................. 24

3.3.2 Standby Output ................................................................................................................................ 24

3.3.3 Voltage Regulation .......................................................................................................................... 24

3.3.4 Dynamic Loading .............................................................................................................................. 25

3.3.5 Capacitive Loading .......................................................................................................................... 25

3.3.6 Ripple/Noise ....................................................................................................................................... 25

3.3.7 Grounding............................................................................................................................................ 25

3.3.8 Closed Loop Stability...................................................................................................................... 26

3.3.9 Residual Voltage Immunity in Standby Mode ...................................................................... 26

3.3.10 Common Mode Noise ..................................................................................................................... 26

3.3.11 Soft Starting ....................................................................................................................................... 26

3.3.12 Zero Load Stability Requirement ............................................................................................... 26

3.3.13 Hot Swap Requirement .................................................................................................................. 27

3.3.14 Forced Load Sharing ....................................................................................................................... 27

3.3.15 Timing Requirement ....................................................................................................................... 27

3.4 Power Supply Cold Redundancy Support ............................................................................. 29

3.4.1 1600W CRPS Cold Redundancy ................................................................................................ 29

3.4.2 2130W CRPS Cold Redundancy ................................................................................................ 29

3.5 Control and Indicator Functions ................................................................................................ 30

3.5.1 PSON# Input Signal ......................................................................................................................... 30

3.5.2 PWOK (power good) Output Signal .......................................................................................... 30

3.5.3 SMBAlert# Signal.............................................................................................................................. 31

3.6 Protection Circuits ........................................................................................................................... 32

3.6.1 Current Limit (OCP) ......................................................................................................................... 32

3.6.2 Over Voltage Protection (OVP) ................................................................................................... 32

3.6.3 Over Thermal Protection .............................................................................................................. 32

3.7 PMBus* ................................................................................................................................................. 33

3.7.1 PSU Address Lines A0 .................................................................................................................... 33

3.7.2 Accuracy ............................................................................................................................................... 34

3.8 Power Management Policy ........................................................................................................... 35

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Table of Contents Intel® Server Chassis H2000G Product Family TPS

4. Cooling Subsystem ........................................................................................................................ 36

4.1 Power Supply Fans .......................................................................................................................... 36

4.2 Drive Bay Population Requirement .......................................................................................... 37

5. Drive Support .................................................................................................................................. 38

5.1 Drive Bays Scheme .......................................................................................................................... 38

5.2 Drive Carrier ........................................................................................................................................ 40

5.3 Hot-Swap Drive Support ............................................................................................................... 42

5.3.1 Backplane Feature Set ................................................................................................................... 42

5.3.2 3.5" Hot Swap Backplane Connector Scheme ..................................................................... 43

5.3.3 2.5" Hot Swap Backplane Connector Scheme ..................................................................... 45

5.3.4 SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane .................................................... 47

5.3.5 Backplane Interposer Board ........................................................................................................ 48

5.3.6 Backplane LED Support ................................................................................................................. 49

5.3.7 Backplane Connector Definition ................................................................................................ 50

5.3.8 Backplane Interposer Board Connectors ............................................................................... 54

6. Front Panel Control and Indicators ............................................................................................ 57

6.1 Control Panel Button ...................................................................................................................... 57

6.2 Control Panel LED Indicators ...................................................................................................... 58

6.2.1 Power LED ........................................................................................................................................... 58

6.2.2 Status LED ........................................................................................................................................... 59

6.2.3 ID LED .................................................................................................................................................... 61

Appendix A: Integration and Usage Tips .......................................................................................... 63

Appendix B: Statement of Volatility .................................................................................................. 64

Appendix C: System Configuration Table for Thermal Compatibility ....................................... 65

Glossary ................................................................................................................................................... 73

Reference Documents ........................................................................................................................... 75

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Intel® Server Chassis H2000G Product Family TPS List of Figures

vii

List of Figures

Figure 1. Server Chassis Overview (12 x 3.5” drive bay) ................................................................................ 5

Figure 2. Server Chassis Overview (16 x 2.5” drive bay) ................................................................................ 5

Figure 3. Server Chassis Overview (24 x 2.5” drive bay) ................................................................................ 6

Figure 4. Server Chassis Rear View ......................................................................................................................... 6

Figure 5. Dummy Tray Cover ..................................................................................................................................... 6

Figure 6. Major Server Chassis Parts (12 x 3.5” drive bay) ............................................................................ 8

Figure 7. Major Server Chassis Parts (16 x 2.5” drive bay) ............................................................................ 9

Figure 8. Major Server Chassis Parts (24 x 2.5” drive bay) ......................................................................... 10

Figure 9. 12 x 3.5” Drive Chassis Front View .................................................................................................... 11

Figure 10. 16 x 2.5” Drive Chassis Front View ................................................................................................. 11

Figure 11. 24 x 2.5” Drive Chassis Front View ................................................................................................. 11

Figure 12. Front Bezel ............................................................................................................................................... 12

Figure 13. 1600W and 2130W AC Power Supply Module Overview .................................................... 13

Figure 14. AC Power Supply Unit Dimension Overview .............................................................................. 14

Figure 15. Power Cage Overview .......................................................................................................................... 16

Figure 16. Power Interposer Board Top View ................................................................................................. 17

Figure 17. Power Distribution Board ................................................................................................................... 18

Figure 18. AC Power Cord Specification ............................................................................................................ 23

Figure 19. Turn On/Off Timing (Power Supply Signals) .............................................................................. 28

Figure 20. Power Supply Device Address ......................................................................................................... 33

Figure 21. PMBus Monitoring Accuracy ............................................................................................................. 34

Figure 22. 12 x 3.5” Drive Configuration ........................................................................................................... 38

Figure 23. 16 x 2.5” Drive Configuration ........................................................................................................... 38

Figure 24. 24 x 2.5” Drive Configuration ........................................................................................................... 39

Figure 25. 3.5" Drive Carrier Overview ............................................................................................................... 40

Figure 26. 2.5" Drive Carrier Overview ............................................................................................................... 40

Figure 27. 2.5" Drive/PCIe* SFF Device Carrier Overview ........................................................................... 41

Figure 28. Combo Backplane Kit Device Carrier Identification ................................................................ 41

Figure 29. 3.5" Drive Carrier Support 2.5” SSD ............................................................................................... 41

Figure 30. 3.5" Backplane Component and Connectors (Front View) ................................................... 43

Figure 31. 3.5" Backplane Component and Connectors (Back View) .................................................... 44

Figure 32. 2.5" Backplane Component and Connectors (Front View) ................................................... 45

Figure 33. 2.5" Backplane Component and Connectors (Back View) .................................................... 46

Figure 34. 24 x 2.5" Backplane Component and Connectors (Front View) ......................................... 47

Figure 35. 24 x 2.5" Backplane Component and Connectors (Back View) .......................................... 48

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List of Figures Intel® Server Chassis H2000G Product Family TPS

viii

Figure 36. Backplane Interposer Board Front View ...................................................................................... 49

Figure 37. Backplane Interposer Board Back View ....................................................................................... 49

Figure 38. Drive Tray LED Identification ............................................................................................................ 50

Figure 39. Front Control Panel .............................................................................................................................. 57

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Intel® Server Chassis H2000G Product Family TPS List of Tables

List of Tables

Table 1. Chassis Feature Set ...................................................................................................................................... 3

Table 2. System Environmental Limits Summary ............................................................................................. 7

Table 3. Specification Data for AC Power Supply Unit ................................................................................ 14

Table 4. AC Power Cord Specification ................................................................................................................ 14

Table 5. DC Output Power Connector ................................................................................................................ 15

Table 6. Power Supply Status LED ....................................................................................................................... 16

Table 7. Pin Assignment of Power Output Connector ................................................................................ 18

Table 8. Pin Assignment of Control Signal Connector ................................................................................ 18

Table 9. AC Input Rating ........................................................................................................................................... 19

Table 10. Typical Power Factor ............................................................................................................................. 19

Table 11. Platinum Efficiency Requirement ..................................................................................................... 19

Table 12. AC Power Holdup Requirement ........................................................................................................ 20

Table 13. Performance Criteria ............................................................................................................................. 21

Table 14. AC Line Sag Transient Performance ............................................................................................... 22

Table 15. AC Line Surge Transient Performance ........................................................................................... 22

Table 16. Load Ratings for Single 1600W Power Supply Unit................................................................. 24

Table 17. Voltage Regulation Limits ................................................................................................................... 24

Table 18. Transient Load Requirements ........................................................................................................... 25

Table 19. Capacitive Loading Conditions .......................................................................................................... 25

Table 20. Ripple and Noise ..................................................................................................................................... 25

Table 21. Timing Requirement .............................................................................................................................. 27

Table 22. 1600W CRPS Cold Redundancy Threshold................................................................................. 29

Table 23. 2130W CRPS Cold Redundancy Threshold................................................................................. 30

Table 24. PSON# Signal Characteristics ............................................................................................................ 30

Table 25. PWOK Signal Characteristics ............................................................................................................. 30

Table 26. SMBAlert# Signal Characteristics ..................................................................................................... 31

Table 27. Over Current Protection ....................................................................................................................... 32

Table 28. Over Voltage Protection (OVP) Limits ............................................................................................ 32

Table 29. PSU Addressing ....................................................................................................................................... 33

Table 30. PMBus Accuracy ...................................................................................................................................... 34

Table 31. Power Management Policy ................................................................................................................. 35

Table 32. Air Flow ....................................................................................................................................................... 36

Table 33. Drive Status LED States ........................................................................................................................ 50

Table 34. Drive Activity LED States ...................................................................................................................... 50

Table 35. Backplane Input Power Connector Pin-out ................................................................................. 51

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List of Tables Intel® Server Chassis H2000G Product Family TPS

Table 36. 2-Blade Compute Module Power Connector Pin-out ............................................................. 51

Table 37. 2x40 Pin Connector Pin-out for Compute Module Bridge Board....................................... 52

Table 38. Front Panel Connector Pin-out ......................................................................................................... 53

Table 39. Power Supply Control Connector Pin-out ................................................................................... 53

Table 40. 80 pin Misc. Signal Connector ........................................................................................................... 54

Table 41. 40 pin Misc. Signal Connector ........................................................................................................... 55

Table 42. BIB Power Edge Connector ................................................................................................................. 56

Table 43. Front Panel Connector ......................................................................................................................... 56

Table 44. Front Control Button Function .......................................................................................................... 57

Table 45. Front LED Indicator Functions ........................................................................................................... 58

Table 46. Power LED Operation ............................................................................................................................ 58

Table 47. Status LED State Definitions .............................................................................................................. 59

Table 48. ID LED .......................................................................................................................................................... 61

Table 49. Non-volatile Components List .......................................................................................................... 64

Table 50. Thermal Configuration Table – S2600KP Product Family, Normal Mode ...................... 66

Table 51. Thermal Configuration Table – S2600KP Product Family, Fan Fail Mode ..................... 67

Table 52. Thermal Configuration Table – S2600TP Product Family, Normal Mode ...................... 69

Table 53. Thermal Configuration Table – S2600TP Product Family, Fan Fail Mode...................... 71

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Intel® Server Chassis H2000G Product Family TPS List of Tables

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Intel® Server Chassis H2000G Product Family TPS Introduction

1. Introduction

This Technical Product Specification (TPS) provides chassis specific information detailing the features, functionality, and high-level architecture of the Intel® Server Chassis H2000G product family. You should also reference the following product family TPS to obtain greater details of functionality and architecture of the compute module to be integrated into this server chassis:

 Intel® Server Board S2600KP Product Family  Intel® Compute Module HNS2600KP Product Family  Intel® Server Board S2600TP Product Family  Intel® Compute Module HNS2600TP Product Family  Intel® Server Board S7200AP Product Family  Intel® Compute Module HNS7200AP Product Family

In addition, you can obtain design-level information for specific subsystems by ordering the External Product Specifications (EPS) or External Design Specifications (EDS) for a given subsystem. EPS and EDS documents are not publicly available. They are only made available under NDA with Intel and must be ordered through your local Intel representative. For a complete list of available documents, refer to the Reference Documents section at the end of this document.

The Intel® Server Chassis H2000G product family may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Refer to the

Intel® Server Board S2600KP Product Family Specification Update and Intel® Server Board S2600TP Product Family and Intel® Server Board S7200AP Specification Update for published

errata.

1.1 Chapter Outline

This document is divided into the following chapters:

 Chapter 1 – Introduction  Chapter 2 – Product Overview  Chapter 3 – Power Subsystem  Chapter 4 – Cooling Subsystem  Chapter 5 – Drive Support  Chapter 6 – Front Panel Control and Indicators  Appendix A – Integration and Usage Tips  Appendix B – Statement of Volatility  Appendix C – System Configuration Table for Thermal Compatibility  Glossary  Reference Documents

Revision 2.21

Introduction Intel® Server Chassis H2000G Product Family TPS

1.2 Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server building blocks are used together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Product Overview

Feature

Description

Dimensions

H2312XXKR2

H2312XXLR2

3.42 inches (86.9 mm) high

17.24 inches (438 mm) wide

30.35 inches (771 mm) deep

H2216XXKR2 H2216XXLR2

H2224XXKR2

H2224XXLR2

3.42 inches (86.9 mm) high

17.24 inches (438 mm) wide

28.86 inches (733 mm) deep Package Dimensions*

983X577X260 mm

Weight

H2312XXKR2

H2312XXLR2

Net weight 21.5kg, package weight 29.5kg

H2216XXKR2 H2216XXLR2

Net weight 20.5kg, package weight 28.4kg

H2224XXKR2

H2224XXLR2

Net weight 20.64 kg, package weight 28.86 kg

Compute Module Support

H2312XXKR2

H2312XXLR2

H2216XXKR2 H2216XXLR2

Intel® Compute Module HNS2600KP Product Family

Intel® Compute Module HNS2600TP Product Family Intel® Compute Module HNS7200AP Product Family*

H2224XXKR2 H2224XXLR2

Intel® Compute Module HNS2600TP24 Product Family

Intel® Compute Module HNS7200AP Product Family*

Fan

One internal power supply fan for each installed power supply unit

Power Supply Options

1600W or 2130W AC Common Redundant Power Supply (CRPS), 80 plus Platinum, supporting CRPS configuration

Storage Bay Options

12x 3.5-inch SATA/SAS drive bays – H2312XXKR2 and H2312XXLR2 16x 2.5-inch SATA/SAS drive bays – H2216XXKR2 and H2216XXKR2

24x 2.5-inch SAS drive bays (8 x PCIe* SFF) – H2224XXKR2 and H2224XXLR2

2. Product Overview

The Intel® Server Chassis H2000G product family is rack mount 2U server chassis which can support up to four compute modules, purpose-built for high-density and lowest total cost of ownership in dense computing applications, such as HPC and IPDC. The chassis can be used to integrate with four compute modules, supporting up to twelve 3.5" or sixteen 2.5" hot-swap SAS or SATA drives, with 1600 Watts and 2130 Watts Common Redundant Power Supply (CRPS) capability.

This chapter provides a high-level overview of the chassis features. The following chapters provide greater detail for each major chassis component or feature.

Table 1. Chassis Feature Set

*The Intel® Compute Module HNS7200AP product family is only compatible with the Intel® Server Chassis H2000XXLR2 product family

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Note: The package dimensions are the outer dimensions of the package box out of the server chassis.

The Intel® Server Chassis H2000G product family also supports different compute module quantity in the same chassis. The compute module quantity can be at least 1, and up to 4 in one chassis.

WARNING! Be protected before accessing the system from rear side since the temperature of an operating system exit air could be over 70°C (158°F).

Caution: The chassis has limited support on mixed compute module configuration, for example, compute modules based on different server board can be installed in the same chassis for power-on only.

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Intel® Server Chassis H2000G Product Family TPS Product Overview

2.1 Chassis Views

Figure 1. Server Chassis Overview (12 x 3.5” drive bay)

Figure 2. Server Chassis Overview (16 x 2.5” drive bay)

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Figure 3. Server Chassis Overview (24 x 2.5” drive bay)

Figure 4. Server Chassis Rear View

Figure 5. Dummy Tray Cover

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Intel® Server Chassis H2000G Product Family TPS Product Overview

Parameter

Limits

Temperature

Operating

ASHRAE Class A2 – Continuous Operation. 10°C to 35°C (50°F to 95°F) with the maximum rate of change not to exceed 10°C per hour

ASHRAE Class A3 – Includes operation up to 40°C for up to 900 hours per

ASHRAE Class A4 – Includes operation up to 45° for up to 90 hours per year

Non-Operating

-40°C to 70°C (-40°F to 158°F)

Altitude

Operating

Support for operation up to 3050m with ASHRAE class deratings.

Humidity

Non-Operating

50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures from 25°C to 35°C)

Shock

Operating

Half sine, 2g, 11 mSec

Unpackaged

Trapezoidal, 25g, velocity change 175 inches/second

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A

Vibration

Unpackaged

5 Hz to 500 Hz 2.20 g RMS random

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A

AC-DC

Voltage

90 V to 132 V and 180 V to 264 V

Frequency

47 Hz to 63 Hz

Source Interrupt

No loss of data for power line drop-out of 12 mSec

Surge Non-

operating and

operating

Unidirectional

Line to earth Only

AC Leads 2.0 kV

I/O Leads 1.0 kV

ESD

Air Discharged

12.0 kV

Contact Discharge

8.0 kV

2.2 Environmental Limits

The following table defines the system level operating and non-operating environmental limits.

Table 2. System Environmental Limits Summary

Disclaimer Note: Intel ensures the unpackaged server board and chassis meet the shock requirement mentioned above through its own chassis development and configuration. It is the responsibility of the system integrator to determine the proper shock level of the board and chassis if the system integrator chooses different configuration or different chassis. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Front Control Panels

Drive bays

Power Distribution Module

Power Supply Modules

Hot Swap Back Plane (attached to the drive cage)

2.3 Chassis Parts

Note: Not shown – Rack slide rail and power distribution module cover

Figure 6. Major Server Chassis Parts (12 x 3.5” drive bay)

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Intel® Server Chassis H2000G Product Family TPS Product Overview

Front Control Panels

Drive bays

Power Distribution Module

Power Supply Modules

Hot Swap Back Plane (attached to the drive cage)

Note: Not shown – Rack slide rail and power distribution module cover

Figure 7. Major Server Chassis Parts (16 x 2.5” drive bay)

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Product Overview Intel® Server Chassis H2000G Product Family TPS

Front Control Panels

Drive bays

Power Interposer Board (24 x 2.5” drive chassis only)

Power Distribution Module

Power Supply Modules

Hot Swap Backplane (attached to the drive cage)

Note: Not shown – Rack slide rail and power distribution module cover

Figure 8. Major Server Chassis Parts (24 x 2.5” drive bay)

Notes:

1. The blank compute module bay must be covered by a dummy tray cover. When removed,

keep the dummy tray cover properly for future use.

2. The compute module bay in the chassis requires either a compute module being installed

and powered up or a dummy tray cover installed to maintain proper thermal environment for the other running compute modules in the same chassis. In case of a compute module failure, remove the failed compute module, and replace with a dummy tray cover until the new compute module is installed.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Product Overview

Intel® Server Chassis

H2312XXKR2, H2312XXLR2

Intel® Server Chassis

H2216XXKR2, H2216XXLR2

Intel® Server Chassis

H2224XXKR2, H2224XXLR2

SATA/SAS Drives (3.5-inch)

Up to 12

Not Supported

SATA/SAS Drives (2.5-inch)

Up to 12

Up to 16

Up to 24

(1)

PCIe* SFF Devices

Not Supported

Up to 8

(2)

2.4 Drive and Peripheral Bays

Note (1): Intel® SATA SSDs and 3rd party SAS drives were validated on the H2224XXKR2 and H2224XXLR2 chassis.

Note (2): As the PCIe* SFF device (NVMe SSD) shares the drive slots with SAS drive, so when support 8 NVMe SSD, SAS drive number will decrease from 24 to 16.

Figure 9. 12 x 3.5” Drive Chassis Front View

Figure 10. 16 x 2.5” Drive Chassis Front View

Figure 11. 24 x 2.5” Drive Chassis Front View

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Product Overview Intel® Server Chassis H2000G Product Family TPS

2.5 Front Bezel Support

The Intel® Server Chassis H2000G product family provides front panel bezel. The bezel provides protection to chassis drive bays with a lock to the chassis. The front view of the bezel is as below.

Figure 12. Front Bezel

2.6 Rack and Cabinet Mounting Options

The server chassis is designed to support 19 inches wide by up to 30 inches deep server cabinets. The server chassis bundles with the following Intel® rack mount option:

 The basic slide rail kit (Product order code – AXXELVRAIL) is designed to mount the

chassis into a standard (19 inches wide by up to 30 inches deep) EIA-310D compatible server cabinet.

 The premium quality rails (Product order code – AXXFULLRAIL) can support the travel

distance 780mm, full extension from rack.

Caution: THE MAXIMUM RECOMMENDED SERVER WEIGHT FOR THE RACK RAILS CAN BE FOUND at http://www.intel.com/support/motherboards/server/sb/CS-033655.htm. EXCEEDING THE MAXIMUM RECOMMENDED WEIGHT OR MISALIGNMENT OF THE SERVER MAY RESULT IN FAILURE OF THE RACK RAILS HOLDING THE SERVER. Use of a mechanical assist to install and align server into the rack rails is recommended.

Advisory Note: To support shipment of the server chassis while installed in a rack with the rack mount rail kit, user should ensure the server cabinet and its package can support the shipment under the actual transport conditions.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

3. Power Subsystem

The server chassis supports 1600W and 2130W AC 1+1 hot-swap power supply module and two power distribution boards which can support 2U rack high density server.

3.1 Power Supply Overview

The power supply module has a simple retention mechanism to retain the module self once it is inserted. This mechanism withstands the specified mechanical shock and vibration requirements. The power distribution board is fixed in the chassis with screws. Using existing power supply module provided by vendor with updated PMBus* and custom-made power connector board the server chassis supports four compute modules. The power supply has two outputs: 12V and 12V standby. The input is auto ranging and power factor corrected. The PMBus* features are requirements for AC silver rated box power supply for use in server systems based on the Intel® Server Chassis H2000G product family. This specification is based on the PMBus* Specifications part I and II, revision 1.1.

Figure 13. 1600W and 2130W AC Power Supply Module Overview

3.1.1 Power Supply Dimension

The physical size of the power supply enclosure is 39/40mm x 73.5mm x 265mm. The power supply contains a single 40mm fan. The power supply has a card edge output that interfaces with a 2x25 card edge connector in the chassis. The AC plugs directly into the external face of the power supply.

Revision 2.21

Power Subsystem Intel® Server Chassis H2000G Product Family TPS

1600W Power Supply

2130W Power Supply

Wattage

1600W (Energy Smart)

2130W (Energy Smart)

Voltage

90-264 VAC, auto-ranging, 47 Hz-63 Hz

Heat Dissipation

5459 BTU/hr

7268 BTU/hr

Maximum Inrush Current

Under typical line conditions and over the entire chassis ambient operating range, the inrush current may reach 65 A per power supply for 5 ms

80 Plus rating

Platinum

Cable Type

SJT

Wire Size

16 AWG

Temperature Rating

105º C

Amperage Rating

13A

Figure 14. AC Power Supply Unit Dimension Overview

3.1.2 AC Power Supply Unit General Data

Below is general specification data for AC power supply unit.

Table 3. Specification Data for AC Power Supply Unit

3.1.3 AC Input Connector

The power supply has an internal IEC320 C14 power inlet. The inlet is rated for a minimum of 10A at 250VAC.

3.1.4 AC Power Cord Specification Requirements

The AC power cord used meets the following specification requirements.

Table 4. AC Power Cord Specification

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Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Cable Type

SJT

PSU Output Connector

GND

A10

+12V

B10

+12V

A11

+12V

B11

+12V

A12

+12V

B12

+12V

A13

+12V

B13

+12V

A14

+12V

B14

+12V

A15

+12V

B15

+12V

A16

+12V

B16

+12V

A17

+12V

B17

+12V

A18

+12V

B18

+12V

A19

PMBus SDA*

B19

A0* (SMBus address)

A20

PMBus SCL*

B20

A1* (SMBus address)

A21

PSON

B21

12V STBY

A22

SMBAlert#

B22

Cold Redundancy Bus*

A23

Return Sense

B23

12V load share bus

A24

+12V Remote Sense

B24

No Connect

A25

PWOK

B25

CRPS Compatibility Check pin*

3.1.5 Power Supply Unit DC Output Connector

The DC output connector pin-out is defined as follows.

Table 5. DC Output Power Connector

3.1.6 Handle Retention

The power supply has a handle to assist extraction. The module is able to be inserted and extracted without the assistance of tools. The power supply also has a latch which retains the power supply into the chassis and prevents the power supply from being inserted or extracted from the chassis when the AC power cord is pulled into the power supply.

The handle protects the operator from any burn hazard through the use of industrial designed plastic handle or equivalent material.

Revision 2.21

* Refer to the spec of CRPS Common Requirements Specification.

Power Subsystem Intel® Server Chassis H2000G Product Family TPS

Power Supply Condition

LED State

Output ON and OK

Solid GREEN

No AC power to all power supplies

OFF

AC present/Only 12VSB on (PS off) or PS in Cold redundant state

1Hz Blink GREEN

AC cord unplugged or AC power lost; with a second power supply in parallel still with AC input power.

Solid AMBER

Power supply warning events where the power supply continues to operate; high temp, high power, high current, slow fan.

1Hz Blink Amber Power supply critical event causing a shutdown; failure, OCP, OVP, Fan Fail

Solid AMBER

Power supply FW updating

2Hz Blink GREEN

Power Distribution Board 1

Power Distribution Board 2

Power Supply Unit #2 (upper) and #1 (lower)

PSU cage

3.1.7 LED Marking and Identification

The power supply is using a bi-color LED: Amber and Green for status indication. The following table shows the LED states for each power supply operating state.

Table 6. Power Supply Status LED

3.1.8 Power Distribution Module

The power distribution module is at the middle of the chassis and consists of two Power Distribution Boards (PDBs) to support Common Redundant Power Supplies (CRPS).

Following is the Power Distribution Module overview.

Figure 15. Power Cage Overview

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Intel® Server Chassis H2000G Product Family TPS Power Subsystem

2x4 pin 5V Power Connector

2x8 pin 12V Power Connector (to PDB)

12V Power Connector (to backplane)

2x8 pin 12V Power Connector (to PDB)

3.1.9 Power Interposer Board

The power interposer board is only used in 24 x 2.5” drive chassis as the interposer between power distribution board and the backplane.

Figure 16. Power Interposer Board Top View

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Power Subsystem Intel® Server Chassis H2000G Product Family TPS

Main Power Output Connector

Control Signal Connector

Main Power Output Connector

Power Supply Unit Connector

Description

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

Description

PMBus SDA

For A0 addressing

PMBus SCL

PSON#

OCP_SHTDN#

12V Load Share Bus

SMBAlert#

Cold Redundancy Bus

Reserved

PWOK

Reserved

Compatibility Bus

Reserved

+12VSB

Key Pin (removed)

3.1.10 Power Cage Output Pin Assignment

The power cage provides +12V and +12V

output to the server chassis. Each PDB has two

STB

2x9 power output cable to chassis backplane, together with one 2x8 signal control cable for power management. Refer to the following table for PDB pin assignment.

Figure 17. Power Distribution Board

Table 7. Pin Assignment of Power Output Connector

Revision 2.21

Table 8. Pin Assignment of Control Signal Connector

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Parameter

Min

Rated

Max

Start-up VAC

Power-off VAC

110VAC

90 V

rms

100-127 V

rms

140 V

rms

85 VAC± 4VAC

70VAC±5VAC

220VAC

180 V

rms

200-240 V

rms

264 V

rms

85 VAC± 4VAC

70VAC±5VAC

Frequency

47 Hz

50/60 Hz

63 Hz

Output Power

10% Load

20% Load

50% Load

100% Load

Power factor

> 0.80

> 0.90

> 0.95

100% of Maximum

50% of Maximum

20% of Maximum

10% of Maximum

Minimum Efficiency

91%

94%

90%

82%

3.2 AC Input Specification

3.2.1 Input Voltage and Frequency

The power supply operates within all specified limits over the following input voltage range.

Table 9. AC Input Rating

Notes:

1. Maximum input current at low input voltage range is measured at 90VAC, at max load.

2. Maximum input current at high input voltage range is measured at 180VAC, at max load.

3. This requirement is not to be used for determining agency input current markings.

3.2.2 AC input Power Factor

The power supply meets the power factor requirements stated in the Energy Star* Program Requirements for Computer Servers. These requirements are stated below.

Table 10. Typical Power Factor

3.2.3 Efficiency

The following table provides the required minimum efficiency level at various loading conditions. These are provided at different load levels; 100%, 50%, 20%, and 10%. Output is loaded according to the proportional loading method defined by 80 Plus in Generalized Internal Power Supply Efficiency Testing Protocol, Rev 6.4.3.

Table 11. Platinum Efficiency Requirement

3.2.4 AC Line Fuse

The power supply has one line fused in the single line fuse on the line (Hot) wire of the AC input. The line fusing is acceptable for all safety agency requirements. The input fuse is a slow blow type. AC inrush current does not cause the AC line fuse to blow under any conditions. All protection circuits in the power supply do not cause the AC fuse to blow unless a component in the power supply has failed. This includes DC output load short conditions.

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Power Subsystem Intel® Server Chassis H2000G Product Family TPS

Holdup Time

70%

10.6msec

3.2.5 AC Line Inrush

AC line inrush current shall not exceed 65A peak, for up to one-quarter of the AC cycle, after which, the input current should be no more than the specified maximum input current. The peak inrush current shall be less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device).

The power supply meets the inrush requirements for any rated AC voltage, during turn on at any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any duration, and over the specified temperature range (Top).

3.2.6 AC Line Dropout/Holdup

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout the power supply meets dynamic voltage regulation requirements. An AC line dropout of any duration shall not cause tripping of control signals or protection circuits. If the AC dropout lasts longer than the holdup time, the power supply should recover and meet all turn on requirements. The power supply shall meet the AC dropout requirement over rated AC voltages and frequencies. A dropout of the AC line for any duration shall not cause damage to the power supply.

Table 12. AC Power Holdup Requirement

The 12V

output voltage should stay in regulation under its full load (static or dynamic)

STB

during an AC dropout of 70ms min (=12VSB holdup time) whether the power supply is in ON or OFF state (PSON asserted or de-asserted).

3.2.7 AC Line Fast Transient (EFT) Specification

The power supply meets the EN61000-4-5 directive and any additional requirements in IEC1000-4-5: 1995 and the Level 3 requirements for surge-withstand capability, with the

following conditions and exceptions:

 These input transients do not cause any out-of-regulation conditions, such as

overshoot and undershoot, nor do they cause any nuisance trips of any of the power supply protection circuits.

 The surge-withstand test does not produce damage to the power supply.

The supply meets surge-withstand test conditions under maximum and minimum DC-output load conditions.

3.2.8 Hot Plug

The power supply is designed to allow connection into and removal from the chassis without removing power to the chassis. During any phase of insertion, start-up, shutdown, or removal,

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Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Level

Description

The apparatus shall continue to operate as intended. No degradation of performance.

The apparatus shall continue to operate as intended. No degradation of performance beyond spec limits.

Temporary loss of function is allowed provided the function is self-recoverable or can be restored by the operation of the controls.

the power supply does not cause any other like modules in the chassis to deviate outside of their specifications. When AC power is applied, the auxiliary supply shall turn on providing bias power internal to the supply and the 5VSB standby output.

3.2.9 Susceptibility Requirements

The power supply meets the following electrical immunity requirements when connected to a cage with an external EMI filter, which meets the criteria, defined in the SSI document EPS Power Supply Specification. For further information on customer standards, request a copy of the customer Environmental Standards Handbook.

Table 13. Performance Criteria

3.2.10 Electrostatic Discharge Susceptibility

The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-4-2:1995 test standard and performance criteria B defined in Annex B of CISPR 24.

3.2.11 Fast Transient/Burst

The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-4-4:1995 test standard and performance criteria B defined in Annex B of CISPR 24.

3.2.12 Radiated Immunity

The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-4-3:1995 test standard and performance criteria A defined in Annex B of CISPR 24.

3.2.13 Surge Immunity

The power supply is tested with the chassis for immunity to AC Ring wave and AC Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45: 1992.

The pass criteria include the following:

 No unsafe operation is allowed under any condition  All power supply output voltage levels to stay within proper spec levels  No change in operating state or loss of data during and after the test profile  No component damage under any condition

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Power Subsystem Intel® Server Chassis H2000G Product Family TPS

AC Line Sag (10 sec interval between each sagging)

Duration

Sag

Operating AC Voltage

Line

Frequency

Performance Criteria.

0 to ½ AC cycle

95%

Nominal AC Voltage ranges

50/60Hz

No loss of function or performance.

> 1 AC cycle

>30%

Nominal AC Voltage ranges

50/60Hz

Loss of function acceptable, selfrecoverable.

AC Line Surge

Duration

Surge

Operating AC Voltage

Line

Frequency

Performance Criteria

Continuous

10%

Nominal AC Voltages

50/60Hz

No loss of function or performance

0 to ½ AC cycle

30%

Mid-point of nominal AC Voltages

50/60Hz

No loss of function or performance

The power supply complies with the limits defined in EN 55024: 1998 using the IEC 61000-4-5:1995 test standard and performance criteria B defined in Annex B of CISPR 24.

3.2.14 AC Line Transient Specification

AC line transient conditions are defined as “sag” and “surge” conditions. “Sag” conditions are also commonly referred to as “brownout”; these conditions are defined as the AC line voltage

dropping below nominal voltage conditions. “Surge” is defined to refer to conditions when the AC line voltage rises above nominal voltage.

The power supply meets the requirements under the following AC line sag and surge conditions.

Table 14. AC Line Sag Transient Performance

Table 15. AC Line Surge Transient Performance

3.2.15 Power Recovery

The power supply recovers automatically after an AC power failure. AC power failure is defined to be any loss of AC power that exceeds the dropout criteria.

3.2.16 Voltage Interruptions

The power supply complies with the limits defined in EN 55024: 1998/A1: 2001/A2: 2003 using the IEC 61000-4-11: Second Edition: 2004-03 test standard and performance criteria C defined in Annex B of CISPR 24.

3.2.17 AC Line Isolation

The power supply meets all safety agency requirements for dielectric strength. Transformers’ isolation between primary and secondary windings complies with the 3000Vac (4242Vdc) dielectric strength criteria. If the working voltage between primary and secondary dictates a

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Cable Type

SJT

Wire Size

16 AWG

Temperature Rating

105ºC

Amperage Rating

13 A

Voltage Rating

125 V

higher dielectric strength test voltage, the highest test voltage will be used. In addition the insulation chassis complies with reinforced insulation per safety standard IEC 950. Separation between the primary and secondary circuits, and primary to ground circuits, complies with the IEC 950 spacing requirements.

3.2.18 AC Power Inlet

The AC input connector is an IEC 320 C-14 power inlet. This inlet is rated for 10A/250 VAC.

The AC power cord meets the following specification requirements.

Figure 18. AC Power Cord Specification

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Power Subsystem Intel® Server Chassis H2000G Product Family TPS

Parameter

Min

Max

Peak 2

Unit

+12V main (200-240VAC)

0.0

133

175 A +12VSTB 1

0.0

3.5

2.4

Vin

≥100VAC

≥110VAC

≥120VAC

o.max

1130W

1250W

1320W

Parameter

Min

Nom

Max

Unit

Tolerance

+12V

STB

+11.40V

+12.000V

+12.60V

Vrms

±5%

+12V

+11.40V

+12.000V

+12.60V

Vrms

±5%

3.3 DC Output Specification

3.3.1 Output Power/Currents

The following table defines the minimum power and current ratings. The power supply meets both static and dynamic voltage regulation requirements for all conditions.

Table 16. Load Ratings for Single 1600W Power Supply Unit

Power rating for AC low line

Notes:

1. 12V

2. Length of time peak power can be supported based on thermal sensor and assertion of the SMBAlert#

3. The setting of I

4. The power supply must protect itself in case the system doesn't take any action based on SMBAlert/OCW

provides 4.0A peak load with single power supply. The power supply fan is allowed to run in

STB

standby mode for loads > 1.5A.

signal. Minimum peak power duration shall be 20 seconds without asserting the SMBAlert# signal.

< I

needs to be followed to make the CLST work reasonably.

OCP

event.

Peak

OCW

3.3.2 Standby Output

The 12VSB output will be present when an AC input greater than the power supply turn on voltage is applied.

3.3.3 Voltage Regulation

The power supply output voltages stay within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise. These shall be measured at the output connectors.

Table 17. Voltage Regulation Limits

The combined output continuous power of all outputs does not exceed 3200W (1600W from each 1600W power supply unit) or 4260W (2130W from each 2130W power supply unit). Each output has a maximum and minimum current rating. The power supply meets both static and dynamic voltage regulation requirements for the minimum dynamic loading conditions.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Output

 Step Load Size

Load Slew Rate

Test Capacitive Load

+12V

STB

1.0A

0.25 A/sec

20 F

+12V

60% of max load

0.25 A/sec

2000 F

Output

Min

Max

Units

+12V

500

25,000

F

+12V

STB

3100

F

+12V

STB

120mVp-p

The power supply meets only the static load voltage regulation requirements for the minimum static load conditions.

3.3.4 Dynamic Loading

The output voltages remain within limits specified for the step loading and capacitive loading specified in the table below. The load transient repetition rate is tested between 50Hz and 5kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The  step load may occur anywhere within the MIN load to the MAX load conditions.

Table 18. Transient Load Requirements

Note: For dynamic condition +12V min loading is 1A.

3.3.5 Capacitive Loading

The power supply is stable and meets all requirements, with the following capacitive loading conditions.

Table 19. Capacitive Loading Conditions

3.3.6 Ripple/Noise

The maximum allowed ripple/noise output of the power supply is defined in the table below. This is measured over a bandwidth of 10Hz to 20MHz at the power supply output connectors. A 10F tantalum capacitor in parallel with a 0.1F ceramic capacitor is placed at the point of measurement.

Table 20. Ripple and Noise

3.3.7 Grounding

The output ground of the pins of the power supply provides the output power return path. The output connector ground pins are connected to the safety ground (power supply enclosure). This grounding is well designed to ensure passing the max allowed Common Mode Noise levels.

Revision 2.21

Power Subsystem Intel® Server Chassis H2000G Product Family TPS

The power supply is provided with a reliable protective earth ground. All secondary circuits are connected to protective earth ground. Resistance of the ground returns to chassis does not exceed 1.0 m. This path may be used to carry DC current.

3.3.8 Closed Loop Stability

The power supply is unconditionally stable under all line/load/transient load conditions including capacitive load ranges specified in Section 3.3.5. A minimum of 45 degrees phase margin and -10dB-gain margin is required. The power supply manufacturer shall provide proof of the unit’s closed-loop stability with local sensing through the submission of Bode plots. Closed-loop stability must be ensured at the maximum and minimum loads as applicable.

3.3.9 Residual Voltage Immunity in Standby Mode

The power supply is immune to any residual voltage placed on its outputs (typically a leakage voltage through the chassis from standby output) up to 500mV. There is no additional heat generated, nor stressing of any internal components with this voltage applied to any individual or all outputs simultaneously. It also does not trip the protection circuits during turn on.

The residual voltage at the power supply outputs for no load condition will not exceed 100mV when AC voltage is applied and the PSON# signal is de-asserted.

3.3.10 Common Mode Noise

The Common Mode noise on any output does not exceed 350mVp-p over the frequency band of 10Hz to 20MHz.

 The measurement is made across a 100Ω resistor between each of DC outputs,

including ground at the DC power connector and chassis ground (power subsystem enclosure).

 The test setup uses a FET probe such as Tektronix model P6046 or equivalent.

3.3.11 Soft Starting

The power supply contains control circuit which provides monotonic soft start for its outputs without overstress of the AC line or any power supply components at any specified AC line or load conditions.

3.3.12 Zero Load Stability Requirement

When the power subsystem operates in a no load condition, it does not need to meet the output regulation specification, but it must operate without any tripping of over-voltage or other fault circuitry. When the power subsystem is subsequently loaded, it must begin to regulate and source current without fault.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Item

Description

Min.

Max.

Units

vout_rise

Output voltage rise time

5.0 *

70 *

sb_on_delay

Delay from AC being applied to 12VSBbeing within regulation.

1500

ac_on_delay

Delay from AC being applied to all output voltages being within regulation.

3000

vout_holdup

Time 12Vl output voltage stay within regulation after loss of AC.

13 ms T

pwok_holdup

Delay from loss of AC to de-assertion of PWOK

10.6

pson_on_delay

Delay from PSON# active to output voltages within regulation limits.

400

ms T

pson_pwok

Delay from PSON# deactivate to PWOK being de-asserted.

5 ms

pwok_on

Delay from output voltages within regulation limits to PWOK asserted at turn on.

100

500

pwok_off

Delay from PWOK de-asserted to output voltages dropping out of regulation limits.

1 ms

pwok_low

Duration of PWOK being in the de-asserted state during an off/on cycle using AC or the PSON signal.

100 ms

sb_vout

Delay from 12VSBbeing in regulation to O/Ps being in regulation at AC turn on.

1000

3.3.13 Hot Swap Requirement

Hot swapping a power supply is the process of inserting and extracting a power supply from an operating power system. During this process the output voltages remain within the limits with the capacitive load specified. The hot swap test must be conducted when the system is operating under static, dynamic, and zero loading conditions. The power supply will use a latching mechanism to prevent insertion and extraction of the power supply when the AC power cord is inserted into the power supply.

3.3.14 Forced Load Sharing

The +12V output has active load sharing. The output will share within 10% at full load. The failure of a power supply will not affect the load sharing or output voltages of the other supplies still operating. The supplies are able to load share in parallel and operate in a hot-swap/redundant 1+1 configurations. The 12VSBoutput is not required to actively share current between power supplies (passive sharing). The 12VSBoutput of the power supplies is connected together in the system so that a failure or hot swap of a redundant power supply does not cause these outputs to go out of regulation in the system.

3.3.15 Timing Requirement

These are the timing requirements for the power supply operation. The output voltages must rise from 10% to within regulation limits (T

) within 5 to 70ms. For 12VSB, it is allowed to

vout_rise

rise from 1.0 to 25ms. All outputs must rise monotonically. The table below shows the timing requirements for the power supply being turned on and off through the AC input, with PSON held low and the PSON signal, with the AC input applied.

Table 21. Timing Requirement

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Power Subsystem Intel® Server Chassis H2000G Product Family TPS

12VSB_holdup

Time the 12VSBoutput voltage stays within regulation after loss of AC.

70 ms

AC Input

Vout PWOK

12Vsb

PSON

sb_on_delay

AC_on_delay

pwok_on

vout_holdup

pwok_holdup

pson_on_delay

sb_on_delay

pwok_on

pwok_off

pson_pwok

pwok_low

sb_vout

AC turn on/off cycle

PSON turn on/off cycle

5Vsb_holdup

* The 12VSTB output voltage rise time shall be from 1.0ms to 25ms.

Figure 19. Turn On/Off Timing (Power Supply Signals)

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Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Enable (V)

Percent

Power (W)

Disable (V)

Percent

Power (W)

Cold Standby 1 (02h)

3.2

40.00%

640(±5%)

1.44

18.00%

576(±5%)

3.4 Power Supply Cold Redundancy Support

Power supplies that support cold redundancy can be enabled to go into a low-power state (that is, cold redundant state) in order to provide increased power usage efficiency when system loads are such that both power supplies are not needed. When the power subsystem is in Cold Redundant mode, only the needed power supply to support the best power delivery efficiency is ON. Any additional power supply including the redundant power supply, is in Cold Standby state.

Each power supply has an additional signal that is dedicated to supporting Cold Redundancy; CR_BUS. This signal is a common bus between all power supplies in the system. CR_BUS is asserted when there is a fault in any power supply OR the power supplies output voltage falls below the Vfault threshold. Asserting the CR_BUS signal causes all power supplies in Cold Standby state to power ON.

Enabling power supplies to maintain best efficiency is achieved by looking at the Load Share bus voltage and comparing it to a programmed voltage level through a PMBus command.

Whenever there is no active power supply on the Cold Redundancy bus driving a HIGH level on the bus all power supplies are ON no matter their defined Cold Redundant roll (active or Cold Standby). This guarantees that incorrect programming of the Cold Redundancy states of the power supply will never cause the power subsystem to shut down or become over loaded. The default state of the power subsystem is all power supplies ON. There needs to be at least one power supply in Cold Redundant Active state or Standard Redundant state to allow the Cold Standby state power supplies to go into Cold Standby state.

Caution: Installing two Power Supply Units with different wattage ratings on a system is not supported. This will not provide Power Supply Redundancy and causes the system to log multiple errors.

3.4.1 1600W CRPS Cold Redundancy

If the output power is less than 640W (40%), the cold redundant function will be enable. Thus you will see one PSU working normally. The second PSU will be in CR mode. The Power Supply LED is green blinking.

Table 22. 1600W CRPS Cold Redundancy Threshold

3.4.2 2130W CRPS Cold Redundancy

If the output power is less than 852W (40%), the cold redundant function will be enable. Thus you will see one PSU working normally. The second PSU will be in CR mode. The Power Supply LED is green blinking.

Revision 2.21

Power Subsystem Intel® Server Chassis H2000G Product Family TPS

Enable (V)

Percent

Power (W)

Disable (V)

Percent

Power (W)

Cold Standby 1 (02h)

2.839V1

40.00%

852(±5%)

1.115V1

30.00%

639(±5%)

Signal Type

Accepts an open collector/drain input from the system.

Pull-up to VSB located in power supply.

PSON# = Low

PSON# = High or Open

OFF

MIN

MAX

Logic level low (power supply ON)

1.0V

Logic level high (power supply OFF)

2.0V

3.46V

Source current, Vpson = low

4mA

Power up delay: T

pson_on_delay

5msec

400msec

PWOK delay: T

pson_pwok

50msec

Signal Type

PWOK = High

Power OK

PWOK = Low

Power Not OK

Table 23. 2130W CRPS Cold Redundancy Threshold

1A before trigger

3.5 Control and Indicator Functions

The following sections define the input and output signals from the power supply.

Signals that can be defined as low true use the following convention: Signal# = low true.

3.5.1 PSON# Input Signal

The PSON# signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +12V power rail. When this signal is not pulled low by the system, or left open, the outputs (except the +12VSB) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply. Refer to the table below for the timing diagram.

Table 24. PSON# Signal Characteristics

3.5.2 PWOK (power good) Output Signal

PWOK is a power OK signal and will be pulled HIGH by the power supply to indicate that all the outputs are within the regulation limits of the power supply. When any output voltage falls below regulation limits or when AC power has been removed for a time sufficiently long so that power supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. See the table below for a representation of the timing characteristics of PWOK. The start of the PWOK delay time will be inhibited as long as any power supply output is in current limit.

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Table 25. PWOK Signal Characteristics

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Signal Type

MIN

MAX

Logic level low voltage, Isink=400uA

0.4V

Logic level high voltage, Isource=200A

2.4V

3.46V

Sink current, PWOK = low

400uA

Source current, PWOK = high

2mA

PWOK delay: Tpwok_on

100ms

1000ms

PWOK rise and fall time

100sec

Power down delay: T pwok_off

1ms

200msec

Signal Type (Active Low)

Open collector/drain output from power supply.

Pull-up to VSB located in system.

Alert# = High

Alert# = Low

Power Alert to system

MIN

MAX

Logic level low voltage, Isink=4 mA

0 V

0.4 V

Logic level high voltage, Isink=50 A

3.46 V

Sink current, Alert# = low

4 mA

Sink current, Alert# = high

50 A

Alert# rise and fall time

100 s

3.5.3 SMBAlert# Signal

This signal indicates that the power supply is experiencing a problem that the user should investigate. This is asserted due to Critical events or Warning events. The signal will activate in the case of critical component temperature reached a warning threshold, general failure, overcurrent, over-voltage, under-voltage, failed fan. This signal may also indicate the power supply is reaching its end of life or is operating in an environment exceeding the specified limits.

This signal is to be asserted in parallel with LED turning solid Amber or blink Amber.

Table 26. SMBAlert# Signal Characteristics

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Power Subsystem Intel® Server Chassis H2000G Product Family TPS

Output Voltage

Input Voltage Range

1600W Over Current Limits

2130W Over current Limits

+12V

90 – 264VAC

180A min; 200A max

210A min; 230A max

+12V

STB

90 – 264VAC

2.5A min; 3A max

4.5A min; 5.5A max

Output Voltage

MIN (V)

MAX (V)

+12V

13.3

14.5

+12VSB

13.3

14.5

3.6 Protection Circuits

Protection circuits inside the power supply cause only the power supply’s main outputs to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15sec and a PSON# cycle HIGH for 1sec will be able to reset the power supply.

3.6.1 Current Limit (OCP)

The power supply has current limit to prevent the outputs from exceeding the values shown in table below. If the current limits are exceeded, the power supply will shut down and latch off. The latch will be cleared by toggling the PSON# signal or by an AC power interruption. The power supply will not be damaged from repeated power cycling in this condition. 12VSB will be auto-recovered after removing OCP limit.

Table 27. Over Current Protection

3.6.2 Over Voltage Protection (OVP)

The power supply over voltage protection is locally sensed. The power supply will shut down and latch off after an over voltage condition occurs. This latch will be cleared by toggling the PSON# signal or by an AC power interruption. The values are measured at the output of the power supply’s connectors. The voltage will never exceed the maximum levels when measured at the power connectors of the power supply connector during any single point of fail. The voltage will never trip any lower than the minimum levels when measured at the power connector. 12VSB will be auto-recovered after removing OVP limit.

Table 28. Over Voltage Protection (OVP) Limits

3.6.3 Over Thermal Protection

The power supply will be protected against over temperature conditions caused by loss of fan cooling or excessive ambient temperature. In an OTP condition the PSU will shut down. When the power supply temperature drops to within specified limits, the power supply will restore power automatically, while the 12VSB remains always on. The OTP circuit has built in margin so that the power supply will not oscillate on and off due to temperature recovering condition. The OTP trip level has a minimum of 4C of ambient temperature margin.

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PDB addressing Address0

Power supply PMBus* device

B0h

B2h

3.7 PMBus*

The PMBus* features are requirements for power supply unit for use in server systems. This specification is based on the PMBus* specifications part I and II, revision 1.1. The power supply device address locations are shown below.

Figure 20. Power Supply Device Address

The PMBus* from PDB is connected to the BMC of all four compute modules. Only one board BMC is assigned to be the master BMC and communicate with PSU as single point. Other board BMCs receive PSU data from the master BMC. In case the master BMC is down, one of the slave board BMC will be promoted automatically as master BMC and maintain the communication.

3.7.1 PSU Address Lines A0

Address pins A0 is used by end use system to allocate unit address to a power supply in particular slot position.

For redundant systems there are two signals to set the address location of the power supply once it is installed in the system; Address0 and Address1. For non-redundant systems the power supply device address locations align with the Address0/Address1 location of 0/0.

Table 29. PSU Addressing

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Power Subsystem Intel® Server Chassis H2000G Product Family TPS

Output Loading

10% - 20%

> 20% -

50%

> 50% -

100%

READ_PIN and READ_EIN

See graphs below

READ_FAN

+/-500 RPM

READ_IOUT

+/-5%

+/-2%

READ_TEMPERATURE

+/- 3ºC

PMBus Input power monitoring accuracy

1000

950

900

850

800

750

700

650

600

550

500

450

400

350

300

250

200

150

100

37.5

Input power, W

Accuracy, +/- W

0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

Accuracy, +/-%

Accuracy, +/-W Accuracy, +/-%

3.7.2 Accuracy

The sensor commands meet the following accuracy requirements. The accuracies are met over the specified ambient temperature and the full range of rated input voltage.

Table 30. PMBus Accuracy

Revision 2.21

Figure 21. PMBus Monitoring Accuracy

Intel® Server Chassis H2000G Product Family TPS Power Subsystem

Server Chassis Load with

2x 1600W supplies

System Power Redundancy

Mode

System behavior with one PSU AC lost

or failed

System Power Load

<1600W

Unconstrained Redundant Mode

No system throttling. All 4 compute modules work normally.

1600W< current load < 2160W

Optimal Redundant Mode

With BIOS setting “server management - shutdown policy” set to “disable” all compute modules in

the chassis may be throttled to maintain power. This may cause lower performance.

With BIOS “ server management-shutdown policy” set to “enable”, compute module 3 and 4 will shut down while compute module 1 and 2 keep running without throttling. Compute module 1 and compute module 2 will have no performance loss.

>2160W

Non Redundant Mode

All compute modules in the chassis may shut down.

3.8 Power Management Policy

When working with the Intel® Server Board S2600KP/S2600TP/S7200AP, the BMC on each compute module will monitor its fans and temperature for critical failures. When there is a fan failure and a critical temperature event at the same time, the compute module will be powered down. When this occurs, the compute module will need to be manually powered back on.

Additionally on the Intel® Server Board S2600KP product family and Intel® Server Board S2600TP product family and the Intel® Server Board S7200AP product family, the BMC on compute module 3 and compute module 4 will monitor for a power supply over current condition or power supply over temperature condition. If either of these occurs and the Shutdown Policy has been enabled, the compute module will be powered down. When this occurs, the compute module will need to be manually powered back on but if the over current or over temperature event is detected again the compute module will be powered back off.

The following table shows the scheme of system power redundancy mode with compute module behavior.

Table 31. Power Management Policy

The Shutdown Policy setting is only shown on compute module 3 and compute module 4, and is disabled by default but can be enabled or disabled in the BIOS setup Server Management page or by using the Set Shutdown Policy command.

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Cooling Subsystem Intel® Server Chassis H2000G Product Family TPS

Chassis

With Compute Module

Air Flow

H2312XXKR2/LR2

HNS2600KP

45-175CFM

H2216XXKR2/LR2

HNS2600KP

40-217CFM

H2224XXKR2/LR2

HNS2600TP

28-163CFM

H2312XXKR2/LR2

HNS2600TP

45-167CFM

H2216XXKR2/LR2

HNS2600TP

40-209CFM

H2312XXLR2

HNS7200AP

43-200CFM

H2216XXLR2

HNS7200AP

53-240CFM

4. Cooling Subsystem

The cooling subsystem refers to the chassis installed with compute modules. The cooling subsystem contains the fans of each compute module and fans in the power supply units. Both compute module fans and PSU fans work together as a thermal solution to the system.

For each compute module, several components and configuration requirements make up the cooling subsystem. These include processors, chipsets, VR heatsinks, fans, CPU air-duct, and drive bay population. All are necessary to provide and regulate the airflow and air pressure needed to maintain the system thermals when operating at or below the maximum specified thermal limits.

In order to maintain the necessary airflow within the system, you must properly install the air duct, drive carrier, PSU dummy filler and the power distribution module cover.

Each compute module uses a variable fan speed control algorithm to provide adequate cooling for the compute module and whole system at various ambient temperature conditions, under various server workloads, and with the least amount of acoustic noise possible. The fans operate at the lowest speed for any given condition to minimize acoustics.

The following table provides air flow data associated with the different product models within this product family, and is provided for reference purposes only. The data was derived from actual wind tunnel test and measurements using fully configured system. Lesser system configurations may result in totally different results. As such, the CFM data that users get from software may vary from the data listed in the table.

Table 32. Air Flow

4.1 Power Supply Fans

Each power supply module has one non-redundant dual rotor 40x56 mm fan. The fans control the cooling of the power supply and some drive bays. These fans are not replaceable. Therefore, if a power supply fan fails, you must replace the power supply module.

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Intel® Server Chassis H2000G Product Family TPS Cooling Subsystem

4.2 Drive Bay Population Requirement

In order to maintain chassis thermal requirements, you must fully populate all drive bays. Drive carriers used for hot-swap drives must either have a drive installed or not have a drive installed.

If only one power supply unit is used, a PSU dummy filler must be used to prevent recirculation.

IMPORTANT: If the drive bay is missing or not fully populated, the system will not meet the thermal cooling requirements, which will most likely result in degraded performance as a result of throttling or thermal shutdown of the compute module. It is recommended to keep/apply the dummy plastic blocker (as shipped with drive carrier) on any blank drive carrier.

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5. Drive Support

The server chassis product family provides three SKUs to support different types of drives:

 H2312XXKR2/LR2: Supports 12x 3.5" drives  H2216XXKR2/LR2: Supports 16x 2.5" drives  H2224XXKR2/LR2: Supports 24x 2.5" drives

5.1 Drive Bays Scheme

The Intel® Server Chassis H2000G product family can support up to 12 carrier-mounted SATA/SAS 3.5” drives, or 16 carrier-mounted SATA/SAS 2.5" drives or 24 carrier-mounted SAS 2.5" drives. The drives may be “electrically” hot-swapped while the chassis power is applied, but you must take caution before hot-swapping while the compute module is functioning under operating system/application control or data may be lost.

Below are drive configurations of different SKUs of the product family.

Note: Drives routed to the same compute module through the backplane are grouped and numbered ONLY in the figure, not showing on the hardware.

Figure 22. 12 x 3.5” Drive Configuration

Figure 23. 16 x 2.5” Drive Configuration

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Figure 24. 24 x 2.5” Drive Configuration

Note: Replace the faulty drive only with one from the same manufacturer with the same model and capacity.

 For 24 x 2.5” drive configuration, the drive bay is capable of supporting 12 Gbps SAS or

6 Gbps SAS drives. The SAS drives are hot-swappable. The front side of the backplane includes 24 drive interface connectors. All the 24 connectors can support SAS drives, but only the connector #4 and #5 of each compute module are capable of supporting PCIe* SFF devices.

 PCIe* SFF (NVME) SSDs are hot swap / hot plug capable. Support and usage models

are OS dependent.

 For a given compute module, any combination of PCIe* SFF devices and SAS devices

can be supported, as long as the number of PCIe* SFF devices does not exceed two and they are installed into any of the last two drive connectors on the backplane and the remaining drives are SAS drive.

Note: Mixing of PCIe* SFF and SAS devices in an alternating manner is not a recommended configuration.

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5.2 Drive Carrier

Each SATA/SAS hard drive or SSD installed into a backplane is mounted to a hot-swap drive carrier. Drive carriers include a latching mechanism used to assist with drive extraction and drive insertion. There are drive trays to support 2.5” devices and 3.5” devices.

There are three types of drive carrier:

 3.5" drive carrier (shipped in H2312XXKR2/LR2)  2.5" drive carrier (shipped in H2216XXKR2/LR2 and H2224XXKR2/LR2)  2.5" drive/PCIe* SFF device carrier (shipped in H2224XXKR2/LR2)

Figure 25. 3.5" Drive Carrier Overview

Figure 26. 2.5" Drive Carrier Overview

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Intel® Server Chassis H2000G Product Family TPS Drive Support

Figure 27. 2.5" Drive/PCIe* SFF Device Carrier Overview

For H2224XXKR2 and H2224XXLR2, two different drive carriers are included in the drive bay. Drive carriers with a Blue latch are used to identify support of PCIe* SFF devices or SAS drives. Drives carriers with a Green latch are used to identify support of SAS drives only.

Figure 28. Combo Backplane Kit Device Carrier Identification

To maintain system thermals, all drive bays must be populated with a drive carrier mounted

with a hard disk drive, SSD, or supplied drive blank. Drive blanks used with the 3.5” drive tray can also be used to mount a 2.5” SSD into it as shown below.

Figure 29. 3.5" Drive Carrier Support 2.5” SSD

Note: Due to degraded performance and reliability concerns, the use of the 3.5” drive blank as a 2.5” device bracket is intended to support SSD type storage devices only. Installing a 2.5” hard disk drive into the 3.5” drive blank is not supported.

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5.3 Hot-Swap Drive Support

The Intel® Server Chassis H2000G product family supports hot-swap SATA/SAS drives. Drives interface with the passive backplane through a blind mate connection when drives are installed into a drive bay using hot-swap drive carriers.

Each compute module has dedicated Hot Swap Controller (HSC) to manage three or four drives. There are totally four sets of independent Programmable System On Chip (PSOC) on the backplane, to function as HSC respectively to four compute modules.

The following sections describe the feature and connections between the backplane and server board.

5.3.1 Backplane Feature Set

 H2312XXKR2/LR2: 12x SAS/SATA 3.5" drives at 12 Gbps SAS and 6 Gbps SATA or

slower speeds, divided into four groups of three hot-swap drives. Each drive group is associated with one of the four compute modules respectively in the 2U chassis.

 H2216XXKR2/LR2: 16x SAS/SATA 2.5" drives at 12 Gbps SAS and 6 Gbps SATA or

slower speeds, divided into four groups of four hot-swap drives. Each DRIVE group is associated with one of the four compute modules respectively in the 2U chassis.

 H2224XXKR2/LR2: 24 x SAS 2.5" drives at 12 Gbps SAS or slower speeds, divided into

four groups of six hot-swap drives. Each drive group is associated with one of the four compute modules respectively in the 2U chassis.

 One SGPIO SFF-8485 interface per each of the compute module total of four SGPIO on

the backplane.

 Three SMBus interfaces supported on this HSBP:

- SMBus R1: For chassis Temp Sensor and Chassis FRU EEPROM device

- SMBus R5: Connectivity up to two HSBP controllers

- SMBus R7: Connectivity up to two common redundant power supply (CRPS)

module PMBus

 Two front panel connectors; each FP connector provides signals for two compute

modules.

 FRU EEPROM support through external device.  In-application Microcontroller FW updateable over I2C interface. No special hardware

needed for field FW upgrade when used with EPSD Baseboard with BMC support.

 Drive Status LED and Activity LED; four of each per compute module.  Drive Presence detect inputs to the Microcontroller; four of each per compute module.  5V_MAIN VR (switcher regulator) from P12V_MAIN and 5V_AUX VR (switcher regulator)

from P12V_STBY for drive power and for the compute modules. This HSBP is intended to be used with 12V only main power subsystems.

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Intel® Server Chassis H2000G Product Family TPS Drive Support

SATA/SAS connectors for Compute Module 1

SATA/SAS connectors for Compute Module 2

SATA/SAS connectors for Compute Module 3

SATA/SAS connectors for Compute Module 4

5.3.2 3.5" Hot Swap Backplane Connector Scheme

The following diagrams show the layout of major components and connectors for 3.5" Hot Swap backplane.

Figure 30. 3.5" Backplane Component and Connectors (Front View)

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2-blade compute module power connector for compute module 4

2x40 pin bridge board connector for compute module 4

2x8 pin power supply input connector

2x7 pin power control cable connector

2-blade compute module power connector for compute module 3

2x40 pin bridge board connector for compute module 3

2x40 pin bridge board connector for compute module 1

20-pin front panel cable connector for compute module 1, 3

2-blade compute module power connector for compute module 1

2x8 pin power supply input connector

2x40 pin bridge board connector for compute module 2

2-blade compute module power connector for compute module 2

20-pin front panel cable connector for compute module 2, 4

Figure 31. 3.5" Backplane Component and Connectors (Back View)

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Intel® Server Chassis H2000G Product Family TPS Drive Support

SATA/SAS connectors for Compute Module 1

SATA/SAS connectors for Compute Module 2

SATA/SAS connectors for Compute Module 3

SATA/SAS connectors for Compute Module 4

5.3.3 2.5" Hot Swap Backplane Connector Scheme

The following diagrams show the layout of major components and connectors for 2.5" Hot Swap backplane.

Figure 32. 2.5" Backplane Component and Connectors (Front View)

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Drive Support Intel® Server Chassis H2000G Product Family TPS

2-Blade Compute Module Power connector for Compute Module 4

2x40 pin Bridge Board connector for Compute Module 4

2x8 pin Power supply input connector

2x7 pin Power Control cable connector

2x8 pin Power supply input connector

2-Blade Compute Module Power connector for Compute Module 3

2x40 pin Bridge Board connector for Compute Module 3

2x40 pin Bridge Board connector for Compute Module 1

20-pin Front Panel cable connector for Compute Module 1, 3

2-Blade Compute Module Power connector for Compute Module 1

2x8 pin Power supply input connector

2x40 pin Bridge Board connector for Compute Module 2

2-Blade Compute Module Power connector for Compute Module 2

20-pin Front Panel cable connector for Compute Module 2, 4

Figure 33. 2.5" Backplane Component and Connectors (Back View)

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Intel® Server Chassis H2000G Product Family TPS Drive Support

SAS 0-3 SFF-8680 connectors (Compute Module 1)

SAS 4-5 / PCIe* SFF 0-1 SFF-8639 connectors (Compute Module 1)

SAS 6-9 SFF-8680 connectors (Compute Module 3)

SAS 10-11 / PCIe* SFF 2-3 SFF-8639 connectors (Compute Module 3)

SAS 12-15 SFF-8680 connectors (Compute Module 2)

SAS 16-17 / PCIe* SFF 4-5 SFF-8639 connectors (Compute Module 2)

SAS 18-21 SFF-8680 connectors (Compute Module 4)

SAS 22-23 / PCIe* SFF 6-7 SFF-8639 connectors (Compute Module 4)

5.3.4 SAS/PCIe* SFF Combo 24 x 2.5" Hot Swap Backplane

The SAS/PCIe* SFF combo 24 x 2.5" hot swap backplane is capable of supporting a combination of both SAS hard drives, SAS SSDs, and up to eight PCIe* SFF (Small Form Factor) (NVMe) devices. The following diagrams show the layout of major components and connectors for 2.5" Hot Swap backplane.

Figure 34. 24 x 2.5" Backplane Component and Connectors (Front View)

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Power Mate Pin (to BIB)

80 pin Misc Signal Connector (to BIB)

100 pin bridge board connector

2x7 pin power control cable connector (to PDB)

2x4 pin P5V power cable connector (to PIB)

Power Mate Pin (to BIB)

100 pin bridge board connector

Power Mate Pin (to BIB)

12V power connector (to PIB)

100 pin bridge board connector

Power Mate Pin (to BIB)

Figure 35. 24 x 2.5" Backplane Component and Connectors (Back View)

5.3.5 Backplane Interposer Board

The backplane interposer board (BIB) is only used in 24 x 2.5” drive chassis as the interposer between the backplane and the power docking board to connect the power and miscellaneous (misc.) signals from the backplane to the compute modules. Two backplane interposer boards are pre-assembled with the 24 x 2.5” drive backplane in the server chassis to support four compute modules.

The BIB is a completely passive board, which contains connectors on both sides of the board to connect to the backplane on the front side and the power docking board on the back side.

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Intel® Server Chassis H2000G Product Family TPS Drive Support

80 pin Misc Signal Connector (to backplane)

Power Mate Pin Hole (to backplane)

Power Edge Connector (to top compute module power docking board)

40 pin Misc. Signal Connector (to top compute module power docking board)

Front Panel Connector

40 pin Misc. Signal Connector (to bottom compute module power docking board)

Power Edge Connector (to bottom compute module power docking board)

Front Panel Connector

Two front panel connectors with the same signals routed are placed on the BIB for easy of cabling to the front panel on each side of the chassis.

Figure 36. Backplane Interposer Board Front View

Figure 37. Backplane Interposer Board Back View

5.3.6 Backplane LED Support

Each drive tray includes separate LED indicators for drive Activity and drive Status. Light pipes integrated into the drive tray assembly direct light emitted from LEDs mounted next to each

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Amber

Off

No access and no fault

Solid On

Hard Drive Fault has occurred

Blink

RAID rebuild in progress (1 Hz), Identify (2 Hz)

Green

Condition

Drive Type

Behavior

Power on with no drive activity SAS/PCIe SFF

LED stays on

SATA

LED stays off

Power on with drive activity SAS/PCIe SFF

LED blinks off when processing a command

SATA

LED blinks on when processing a command

Power on and drive spun down SAS/PCIe SFF

LED stays off

SATA

LED stays off

Power on and drive spinning up SAS

LED blinks

SATA/PCIe SFF

LED stays off

Amber Status LED

Green Activity LED

2.5” drive tray

Amber Status LED

Green Activity LED

3.5” drive tray

drive connector on the backplane to the drive tray faceplate, making them visible from the front of the system.

Figure 38. Drive Tray LED Identification

Table 33. Drive Status LED States

Note: With Intel® Compute Module HNS2600TP Product Family, the drive status LED only supports SAS/SATA hard drives or SSDs. It stays off for PCIe* SFF devices.

Table 34. Drive Activity LED States

Note: The drive activity LED is driven by signals coming from the drive itself. Drive vendors may choose to operate the activity LED differently from what is described in the table above. Should the activity LED on a given drive type behave differently than what is described, customers should reference the drive vendor specifications for the specific drive model to determine what the expected drive activity LED operation should be.

5.3.7 Backplane Connector Definition

The backplanes include several different connectors. This section defines the purpose and pin-out associated with each connector.

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Intel® Server Chassis H2000G Product Family TPS Drive Support

Signal Description

P12V_NODEx

GND

P12V_NODEx

GND

P12V_NODEx

GND

P12V_NODEx

GND

P12V_NODEx

GND

P12V_NODEx

GND

P12V_NODEx

GND

P12V_NODEx

GND

Signal Description

Lower Blade (Circuit 1)

GND

Upper Blade (Circuit 2)

P12V

5.3.7.1 2x8 Pin Power Input Connector

The backplane is powered by +12V and +12V

from PDB of CRPS. The input power is

STB

distributed by backplane to all four compute modules.

Table 35. Backplane Input Power Connector Pin-out

Note: Each compute module has a separate power plane on backplane (P12V_NODEx).

5.3.7.2 2-Blade Compute Module Power Connector

The backplane provides main power to compute module through 2-Blade power connector.

Table 36. 2-Blade Compute Module Power Connector Pin-out

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Signal Description

5V_AUX

SATA0_TXN

USB2_OC

SATA0_TXP

GND

SATA0_RXN

NODE_Present_N (GND)

SATA0_RXP

ALL_NODE_OFF

GND

spare

USB2_P0P

GND

USB2_P0N

IPMB-Data

GND

IPMB-Clk

FP HDD_ACT_LED_N

GND

FP Activity LED_N

SMBUS_R1 DATA

FP Health LEDA_N

SMBUS_R1 CLK

FP Health LEDG_N

GND

FP PWR LED_N

SMBUS_R5 DATA

FP ID LED_N

SMBUS_R5 CLK

FP ID BTN_N

GND

FP RST BTN_N

SMBUS_R7 DATA

FP PWR BTN_N

SMBUS_R7 CLK

FP NMI BTN_N

GND

SPA_SOUT_N

PMBUS Alert_N

SPA_SIN_N

NODEx_ON_N

ID3

SGPIO DATA IN

ID2

SGPIO Data Out

ID1

SGPIO LD

ID0

SPKR

SGPIO CLK

GND

SAS3_RX

SAS3_TX

SAS3_RX

SAS3_TX

GND

SAS2_TX

SAS2_RX

SAS2_TX

SAS2_RX

GND

SAS1_RX

SAS1_TX

SAS1_RX

SAS1_TX

GND

5.3.7.3 2x40 Pin Bridge Board Connector

The compute module provides four SATA/SAS ports to backplane, together with front panel control signals and SMBus.

Table 37. 2x40 Pin Connector Pin-out for Compute Module Bridge Board

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Signal Description

SAS0_TX

SAS0_RX

SAS0_TX

SAS0_RX

GND

3.3V

Signal Description

GND

FP1_PWR_BTN_N

FP1_RST_BTN_N

FP1_ID_BTN_N

P5VSB

FP1_PWR_LED_N

FP1_HEALTH_LEDG_N

FP1_HEALTH_LEDA_N

FP1_ACTIVITY_LED_N

FP1_ID_LED_N

GND

FP2_PWR_BTN_N

FP2_RST_BTN_N

FP2_ID_BTN_N

P3V3SB

FP2_PWR_LED_N

FP2_HEALTH_LEDG_N

FP2_HEALTH_LEDA_N

FP2_ACTIVITY_LED_N

FP2_ID_LED_N

Signal Description

SMBUS_R7_DATA

5.3.7.4 20-Pin Front Panel Connector

The backplanes provide connectors for front panel control signals. Each connector integrates the control signals of two compute modules.

Table 38. Front Panel Connector Pin-out

5.3.7.5 2x7 Pin Power Supply Control Signal Connector

The backplanes provide power supply control signals, together with PMBus functionality integrated.

Revision 2.21

Table 39. Power Supply Control Connector Pin-out

Drive Support Intel® Server Chassis H2000G Product Family TPS

Signal Description

SMBUS_R7_CLK

PSON_N

PMBUS_ALERT_N

12V RS_RTN

PWROK

12V RS

Reserved

PDU1-12VSB

PDU2-12VSB

Reserved

Signal Description

N1_PE_SMB_CLK

N1_PE_SMB_DATA

GND

N1_FM_ALL_NODE_OFF

P5V_STBY

GND

N1_SMB_IPMB_5VSTBY_BP_DATA

P3V3_STBY

N1_SMB_IPMB_5VSTBY_BP_CLK

Reserve

GND

Reserve

N1_SMB_SENSOR_3V3STBY_BP_DATA

Reserve

N1_SMB_SENSOR_3V3STBY_BP_CLK

Reserve

GND

Reserve

N1_SMB_HSBP_3V3_BP_DATA

Reserve

N1_SMB_HSBP_3V3_BP_CLK

N1_FM_IBMC_NODEID_1

GND

N1_FM_IBMC_NODEID_0

N1_SMB_PMBUS_BP_DATA

GND

N1_SMB_PMBUS_BP_CLK

N1_SGPIO_SAS12G_1_CLOCK_R1

GND

N1_IRQ_SML1_PMBUS_ALERT_N

N1_SGPIO_SAS12G_0_CLK

N1_FM_NODE_ON_N

N1_SGPIO_SAS12G_0_LD

N1_SGPIO_SAS12G_1_DATAIN1_R1

N1_SGPIO_SAS12G_0_Data_Out

N1_SGPIO_SAS12G_1_DATAOUT0_R1

N1_PWROK

N1_SGPIO_SAS12G_1_LOAD_R1

PE_SMB_CLK

PE_SMB_DATA

GND

FM_ALL_NODE_OFF

Reserve

GND

Reserve

SMB_IPMB_5VSTBY_BP_DATA

Reserve

SMB_IPMB_5VSTBY_BP_CLK

Reserve

GND

Reserve

SMB_SENSOR_3V3STBY_BP_DATA

Reserve

SMB_SENSOR_3V3STBY_BP_CLK

Reserve

GND

5.3.8 Backplane Interposer Board Connectors

Table 40. 80 pin Misc. Signal Connector

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Drive Support

Signal Description

Reserve

SMB_HSBP_3V3_BP_DATA

Reserve

SMB_HSBP_3V3_BP_CLK

FM_IBMC_NODEID_1

GND

FM_IBMC_NODEID_0

SMB_PMBUS_BP_DATA

GND

SMB_PMBUS_BP_CLK

SGPIO_SAS12G_1_CLOCK_R1

GND

IRQ_SML1_PMBUS_ALERT_N

SGPIO_SAS12G_0_CLK

FM_NODE_ON_N

SGPIO_SAS12G_0_LD

SGPIO_SAS12G_1_DATAIN1_R1

SGPIO_SAS12G_0_Data_Out

SGPIO_SAS12G_1_DATAOUT0_R1

PWROK

SGPIO_SAS12G_1_LOAD_R1

Signal Description

PE_SMB_CLK

PE_SMB_DATA

GND

FM_ALL_NODE_OFF

FP HDD_ACT_LED_N

GND

FP Activity LED_N

SMB_IPMB_5VSTBY_BP_DATA

FP Health LEDA_N

SMB_IPMB_5VSTBY_BP_CLK

FP Health LEDG_N

GND

FP_PWR_LED_BUF_R_N

SMB_SENSOR_3V3STBY_BP_DATA

FP_ID_LED_BUF_R_N

SMB_SENSOR_3V3STBY_BP_CLK

FP_ID_BTN_R_N

GND

FP_RST_BTN_R_N

SMB_HSBP_3V3_BP_DATA

FP_PWR_BTN_R_N

SMB_HSBP_3V3_BP_CLK

FM_IBMC_NODEID_1

GND

FM_IBMC_NODEID_0

SMB_PMBUS_BP_DATA

GND

SMB_PMBUS_BP_CLK

SGPIO_SAS12G_1_CLOCK_R1

GND

IRQ_SML1_PMBUS_ALERT_N

SGPIO_SAS12G_0_CLK

FM_NODE_ON_N

SGPIO_SAS12G_0_LD

SGPIO_SAS12G_1_DATAIN1_R1

SGPIO_SAS12G_0_Data_Out

SGPIO_SAS12G_1_DATAOUT0_R1

PWROK

SGPIO_SAS12G_1_LOAD_R1

Table 41. 40 pin Misc. Signal Connector

Revision 2.21

Drive Support Intel® Server Chassis H2000G Product Family TPS

Signal Description

P12V

GND

Signal Description

GND

FP_PORTx_PWR_BTN_N

FP_PORTx_RST_BTN_N

FP_PORTx_ID_BTN_N

P5V_AUX

FP_PORTx_PWR_LED_N

FP_PORTx_HEALTH_LEDG_N

FP_PORTx_HEALTH_LEDA_N

FP_PORTx_ACT_LED_N

FP_PORTx_ID_LED_N

GND

FP_PORTy_PWR_BTN_N

FP_PORTy_RST_BTN_N

FP_PORTy_ID_BTN_N

P3V3_AUX

FP_PORTy_PWR_LED_N

FP_PORTy_HEALTH_LEDG_N

FP_PORTy_HEALTH_LEDA_N

FP_PORTy_ACT_LED_N

FP_PORTy_ID_LED_N

Table 42. BIB Power Edge Connector

Table 43. Front Panel Connector

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Front Panel Control and Indicators

Feature

Function

Power Button with Power LED

Toggles the compute module power on/off. This button also integrates the power LED.

Compute Module ID Button with ID LED

Toggles between ID LED on and off.

6. Front Panel Control and Indicators

The Intel® Server Chassis H2000G product family Front Control Panel is integrated with rack handles at the both sides of the chassis. Each control panel contains two sets of compute module control buttons and status LEDs. The control panel assembly is pre-assembled and fixed with the rack handles.

Figure 39. Front Control Panel

6.1 Control Panel Button

The following table lists the control panel features and functions. The control panel features a compute module power button.

Table 44. Front Control Button Function

Revision 2.21

Front Panel Control and Indicators Intel® Server Chassis H2000G Product Family TPS

LED Indicator

Color

Condition

What it describes

Power

Green

Power On/ACPI S0 state

Green

Blink

Sleep/ACPI S1 state

Off

Power Off /ACPI S5 state

LAN (i350 Dual NIC)

Green

LAN Link no Access

Green

Blink

LAN Activity

Off

No Link

Compute Module Status

Green

Compute Module Ready/No Alarm

Green

Blink

Compute Module ready, but degraded: redundancy lost such as the power supply or fan failure; noncritical temp/voltage threshold; battery failure; or predictive power supply failure.

Amber

Critical Alarm: Critical power modules failure, critical fans failure, voltage (power supply), critical temperature and voltage

Amber

Blink

Non-Critical Alarm: Redundant fan failure, redundant power module failure, non-critical temperature and voltage

Off

Power off: Compute Module unplugged

Power on: Compute Module powered off and in standby, no prior degraded\non-critical\critical state

State

Power Mode

LED

Description

Power Off

Non-ACPI

Off

Compute module power is off and the BIOS has not initialized the chipset.

6.2 Control Panel LED Indicators

The control panel houses independent two LEDs and two button integrated LEDs for each compute module, which are viewable to display the compute module’s operating status. The following table identifies each LED and describes their functionality.

Table 45. Front LED Indicator Functions

Notes:

1. Blink rate is ~1 Hz at 50% duty cycle.

2. It is also off when the compute module is powered off (S5) or in a sleep state (S1).

3. The power LED sleep indication is maintained on standby by the chipset. If the compute module is

powered down without going through the BIOS, the LED state in effect at the time of power off is restored when the compute module is powered on until the BIOS clear it.

4. If the compute module is not powered down normally, it is possible the Power LED will blink at the same

time the compute module status LED is off due to a failure or configuration change that prevents the BIOS from running.

6.2.1 Power LED

Table 46. Power LED Operation

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Front Panel Control and Indicators

State

Power Mode

LED

Description

Power On

Non-ACPI

Solid On

Compute module power is on but the BIOS has not yet initialized the chipset.

ACPI

Off

Mechanical is off and the operating system has not saved any context to the drive.

S1 Sleep

ACPI

Blink

DC power is still on. The operating system has saved context and gone into a level of low-power state.

ACPI

Solid On

Compute module and the operating system are up and running.

Color

State

Criticality

Description

Off

System is not operating

Not ready

 System is powered off (AC and/or DC).  System is in EuP Lot6 Off Mode.  System is in S5 Soft-Off State.

Green

Solid on

Indicates that the System is running (in S0 State) and its

status is ‘Healthy’. The system is not exhibiting any

errors. AC power is present and BMC has booted and manageability functionality is up and running.

After a BMC reset, and in conjunction with the Chassis ID solid ON, the BMC is booting Linux*. Control has been passed from BMC uBoot to BMC Linux* itself. It will be in this state for ~10-~20 seconds.

Note: Blink rate is ~ 1Hz at 50% duty cycle.

6.2.2 Status LED

The control panel includes a bi-color Status LED. The Status LED on the control panel is tied directly to the Status LED on the server board (if present). This LED indicates the current health of the compute module. Possible LED states include solid green, blinking green, blinking amber, and solid amber.

When the compute module is powered down (transitions to the DC-off state or S5), the BMC is still on standby power and retains the sensor and front panel Status LED state established before the power-down event.

When AC power is first applied to the compute module, the Status LED turns solid amber and then immediately changes to blinking green to indicate that the BMC is booting. If the BMC boot process completes with no errors, the Status LED will change to solid green.

When power is first applied to the compute module and 5V-STBY is present, the BMC controller on the server board requires 15-20 seconds to initialize. During this time, the compute module status LED will be solid on, both amber and green. Once BMC initialization has completed, the status LED will stay green solid on. If power button is pressed before BMC initialization completes, the compute module will not boot to POST.

Table 47. Status LED State Definitions

Revision 2.21

Front Panel Control and Indicators Intel® Server Chassis H2000G Product Family TPS

Color

State

Criticality

Description

Green

~1 Hz blink

Degraded - system is operating in a degraded state although still functional, or system is operating in a redundant state but with an impending failure warning

System degraded:

 Redundancy loss such as power-supply or fan.

Applies only if the associated platform sub-system has redundancy capabilities.

 Fan warning or failure when the number of fully

operational fans is less than minimum number needed to cool the system.

 Non-critical threshold crossed – Temperature

(including HSBP temp), voltage, input power to power supply, output current for main power rail from power supply and Processor Thermal Control (Therm Ctrl) sensors.

 Power supply predictive failure occurred while

redundant power supply configuration was present.

 Unable to use all of the installed memory (more

than 1 DIMM installed).

 Correctable Errors over a threshold and migrating to

a spare DIMM (memory sparing). This indicates that the system no longer has spared DIMMs (a redundancy lost condition). Corresponding DIMM LED lit.

 In mirrored configuration, when memory mirroring

takes place and system loses memory redundancy.

 Battery failure.  BMC executing in uBoot. (Indicated by Chassis ID

blinking at 3Hz). System in degraded state (no manageability). BMC uBoot is running but has not transferred control to BMC Linux*. Server will be in this state 6-8 seconds after BMC reset while it pulls the Linux* image into flash.

 BMC Watchdog has reset the BMC.  Power Unit sensor offset for configuration error is

asserted.

 HDD HSC is off-line or degraded.

Amber

~1 Hz blink

Non-critical - System is operating in a degraded state with an impending failure warning, although still functioning

Non-fatal alarm – system is likely to fail:

 Critical threshold crossed – Voltage, temperature

(including HSBP temp), input power to power supply, output current for main power rail from power supply and PROCHOT (Therm Ctrl) sensors.

 VRD Hot asserted.  Minimum number of fans to cool the system not

present or failed

 Hard drive fault  Power Unit Redundancy sensor – Insufficient

resources offset (indicates not enough power supplies present)

 In non-sparing and non-mirroring mode if the

threshold of correctable errors is crossed within the window

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Front Panel Control and Indicators

Color

State

Criticality

Description

Amber

Solid on

Critical, non-recoverable – System is halted

Fatal alarm – system has failed or shut down:

 CPU CATERR signal asserted  MSID mismatch detected (CATERR also asserts for

this case).

 CPU 1 is missing  CPU Thermal Trip  No power good – power fault  DIMM failure when there is only 1 DIMM present and

hence no good memory present.

 Runtime memory uncorrectable error in non-

redundant mode.

 DIMM Thermal Trip or equivalent  SSB Thermal Trip or equivalent  CPU ERR2 signal asserted  BMC/Video memory test failed. (Chassis ID shows

blue/solid-on for this condition)

 Both uBoot BMC FW images are bad. (Chassis ID

shows blue/solid-on for this condition)

 240VA fault  Fatal Error in processor initialization:

- Processor family not identical

- Processor model not identical

- Processor core/thread counts not identical

- Processor cache size not identical

- Unable to synchronize processor frequency

- Unable to synchronize QPI link frequency

 Uncorrectable memory error in a non-redundant

mode

State

LED State

Identify active through button

Solid on

Identify active through command

~1 Hz blink

Off

6.2.3 ID LED

The ID LED provides a visual indication of the server board or compute module being serviced. The state of the ID LED is affected by the following:

 Toggled by the ID button  Controlled by the Chassis Identify command (IPMI)

Revision 2.21

Table 48. ID LED

Front Panel Control and Indicators Intel® Server Chassis H2000G Product Family TPS

There is no precedence or lock-out mechanism for the control sources. When a new request arrives, all previous requests are terminated. For example, if the ID LED is blinking and the chassis ID button is pressed, then the ID LED changes to solid on. If the button is pressed again with no intervening commands, the ID LED turns off.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Appendix A: Integration and Usage Tips

Appendix A: Integration and Usage Tips

Before attempting to integrate and configure your chassis, you should reference this section, which provides a list of useful information.

 Remove the dummy tray cover before installing the compute module.  Install the dummy tray cover when respective compute module is plugged out.  Fans in the compute modules are not hot-swappable.  You must use the air duct to maintain compute module thermals.  To maintain system thermals, you must populate all drive bays with either a drive or

drive blank.

 You must remove AC power from the compute module before service.

You can download the latest documentation, drivers, and software from the Intel Support website at http://www.intel.com/support.

Revision 2.21

Appendix B: Statement of Volatility Intel® Server Chassis H2000G Product Family TPS

Component Type

Size

Board Location

User Data

Name

Non-Volatile

256 Bytes

UM801

PSU Firmware

Non-Volatile

512 Bytes

U6N2

12 x 3.5” HSBP FRU

Non-Volatile

512 Bytes

U504

16 x 2.5” HSBP FRU

Non-Volatile

512 Bytes

U1A2

24 x 2.5” HSBP FRU

Appendix B: Statement of Volatility

This section describes the volatile and non-volatile components on the HSBP and Power Supply Unit of the server chassis. It is not the intention of this document to include any components not directly included in the server chassis, such as the server board, processors, memory, drives, or add-in cards.

Chassis Board Components

The server chassis contains several components that can be used to store data. A list of components for the HSBP and Power Supply Unit of the server chassis is included in the table below. The sections below the table provide additional information about the fields in this table.

Table 49. Non-volatile Components List

Component Type

Non-volatile: Non-volatile memory is persistent, and is not cleared when power is removed from the chassis. Non-Volatile memory must be erased to clear data. The exact method of clearing these areas varies by the specific component. Some areas are required for normal operation of the server, and clearing these areas may render the server board inoperable.

Size

The size of each component includes sizes in bits, Kbits, bytes, kilobytes (KB) or megabytes (MB).

Board Location

The physical location of each component is specified in the Board Location column. The board location information corresponds to information on the board silkscreen.

User Data

The flash components on the server boards do not store user data from the operating system. No operating system level data is retained in any listed components after AC power is removed. The persistence of information written to each component is determined by its type as described in the table.

Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Appendix C: System Configuration Table for Thermal Compatibility

Appendix C: System Configuration Table for Thermal Compatibility

This section provides system configuration compatibility data based on various supported system operating thermal limits. Two tables are provided for each of the server board. The first table identifies supported system configurations while the system is in “normal” operating mode; all systems fans are present, on-line, and operational. The second table identifies supported system configurations while the system is in a “fan fail” mode; one system fan is no longer on-line or operational, fan redundancy is lost.

The following notes communicate support criteria associated with specific configurations identified in the following tables. Each relevant note to a configuration is identified by reference number in the table.

"●" = Full Support without limitation " " (Blank Cell) = Configuration Not supported

Thermal Configuration Tables – Intel® Server Board S2600KP Product Family

Notes:

1. 27°C is limited to elevations of 900m or less.

2. Quad Port IO Modules cannot be installed simultaneously with PCI Cards.

3. Processor - 135W - 4/6/8/16C, 120W-14C and 145W - 14/18C may have some performance impact.

4. Processors - There may be some performance impact during fan failures.

5. For A3/A4 individual PS selection:

1) For dual power supply configuration, power budget must fit within single power supply rated load and be installed in dual configuration, or

2) For single power supply configuration, power budget must be sized with 30% margin to single power supply rated load.

6. When identifying memory in the table, only Rank and Width are required. Capacity is not required.

7. Processor limited to 120W to support 1.5W AOC cable. Processor limited to 120W and memory limited to DRx4 to support

2W AOC cable.

8. Supported with one HDD per node configuration.

9. Fan fail is not supported at A3/A4.

Revision 2.21 65

Appendix C: System Configuration Table for Thermal Compatibility Intel® Server Chassis H2000G Product Family TPS

Intel® Server

Chassis

H2216XXKR2

Intel® Server Chassis

H2312XXKR2

ASHRAE (See

note 1)

Classifications

27C

A4 Max Ambient

35C

40C

45C

27C

35C

40C

45C

<-- See note 1

PS (See note 5)

Power Supplies

See Note 5

EP Processors

(See notes 3

and 4)

EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3)

●

● ● ●

<-- see note 4

EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E5-2670 V3)

●

● ● ●

<-- see note 4

EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E5-2650 V3)

● ● ●

● ●

●

<-- see note 4 EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3)

● ● ● ● ● ● ●

<-- see note 4

EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3, E5-2620 V3, E5-2609 V3, E5-2603 V3)

● ● ● ● ● ● ●

●

<-- see note 4

EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E52643 V3, E5-2637 V3)

●

● <-- see note 4

EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3)

● ● ●

● ●

●

<-- see note 4

EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3)

● ● ● ● ● ● ●

●

<-- See notes 3 and 4

EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3)

● ● ● ● ● ● ●

●

<-- See notes 3 and 4

EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E52699 V3)

●

● <-- See notes 3

and 4

EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3)

●

● <-- See notes 3

and 4

EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E5-2683 V3)

●

● <-- See notes 3

and 4

Memory Type

(See note 6)

RDIMM-2Rx8,1Rx4

● ● ● ● ● ● ●

●

RDIMM-DRx4

● ● ● ● ● ● ●

●

LRDIMM-QRx4 DDP

● ● ● ● ● ● ●

Add-in Cards

(See note 2)

PCI Cards with 100LFM/55C spec

● ● ● ● ● ● ●

●

PCI Cards With 200LFM/55C spec

●

● ● ●

<-- See note 2

Table 50. Thermal Configuration Table – S2600KP Product Family, Normal Mode

66 Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Appendix C: System Configuration Table for Thermal Compatibility

Intel® Server

Chassis

H2216XXKR2

Intel® Server Chassis

H2312XXKR2

ASHRAE (See

note 1)

Classifications

27C

A4 Max Ambient

35C

40C

45C

27C

35C

40C

45C

<-- See note 1

PCI Cards With 300LFM/55C spec

●

<-- See note 2

Module (See

note 2)

AXX10GBTWLIOM - Dual 10GBASE-T IO Module

● ● ● ● ● ● ●

●

AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module

● ● ● ● ● ● ●

●

AXX1FDRIBIOM - Single Port FDR Infiniband IO Module

● ● ● ● ● ● ●

●

AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module

● ● ● ● ● ● ●

●

AXX4P1GBPWLIOM - Quad Port 1GbE IO Module

● ● ● ● ● ● ●

●

<-- See note 2

QSFP Cables

(See note 7)

Passive Cable

● ● ● ● ● ● ●

●

Active Optical Cable (1.5W)

●

7 Active Optical Cable (2W)

●

<-- See note 7

Intel® Server

Chassis

H2216XXKR2

Intel® Server

Chassis

H2312XXKR2

ASHRAE (See

note 1)

Classifications

27C

Max Ambient

35C

27C

35C

<-- See note 1

PS (See note 5)

Power Supplies

See Note 5

EP Processors

(See notes 3

and 4)

EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3)

●

<-- see note 4

EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E5-2670 V3)

●

<-- see note 4

EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E5-2650 V3)

●

<-- see note 4

EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3)

●

<-- see note 4

EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3, E5-2620 V3, E5-2609 V3, E5-2603 V3)

●

<-- see note 4

EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E5-2643 V3, E52637 V3)

●

<-- see note 4

EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3)

●

<-- see note 4

Table 51. Thermal Configuration Table – S2600KP Product Family, Fan Fail Mode

Revision 2.21 67

Appendix C: System Configuration Table for Thermal Compatibility Intel® Server Chassis H2000G Product Family TPS

Intel® Server

Chassis

H2216XXKR2

Intel® Server

Chassis

H2312XXKR2

ASHRAE (See

note 1)

Classifications

27C

Max Ambient

35C

27C

35C

<-- See note 1

EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3)

●

<-- See notes 3 and 4

EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3)

●

<-- See notes 3 and 4

EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E5-2699 V3)

●

<-- See notes 3 and 4

EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3)

●

<-- See notes 3 and 4

EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E5-2683 V3)

●

<-- See notes 3 and 4

Memory Type

(See note 6)

RDIMM-2Rx8,1Rx4

●

RDIMM-DRx4

●

LRDIMM-QRx4 DDP

●

Add-in Cards

(See note 2)

PCI Cards with 100LFM/55C spec

●

PCI Cards with 200LFM/55C spec

PCI Cards with 300LFM/55C spec

<-- See note 2

Module (See

note 2)

AXX10GBTWLIOM - Dual 10GBASE-T IO Module

●

AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module

●

AXX1FDRIBIOM - Single Port FDR Infiniband IO Module

●

AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module

●

AXX4P1GBPWLIOM - Quad Port 1GbE IO Module

●

<-- See note 2

QSFP Cables

(See note 7)

Passive Cable

●

Active Optical Cable (1.5W)

●

Active Optical Cable (2W)

●

<-- See note 7

68 Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Appendix C: System Configuration Table for Thermal Compatibility

Intel® Server Chassis

H2216XXKR2

Intel® Server Chassis

H2312XXKR2

Intel® Server Chassis

H2224XXKR2

ASHRAE

(See

note 1)

Classifications

27C

Max Ambient

35C

27C

40C

45C

27C

35C

40C

45C

27C

35C

40C

45C

<-- See note 1

PS (See

note 5)

Power Supplies

See Note 5

Processo

rs (See

notes 3

and 4)

EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3)

● ● ● ● ●

● ●

EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E52670 V3)

● ● ● ● ●

● ●

EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E52650 V3)

● ● ● ● ●

● ●

Thermal Configuration Tables – Intel® Server Board S2600TP Product Family

Notes:

1. 27°C is limited to elevations of 900m or less.

2. Quad Port IO Modules cannot be installed simultaneously with PCI Cards.

3. Processor - 135W - 4/6/8/16C, 120W-14C and 145W - 14/18C may have some performance impact.

4. Processors - There may be some performance impact during fan failures.

5. For A3/A4 individual PS selection:

1) For dual power supply configuration, power budget must fit within single power supply rated load and be installed in dual configuration, or

2) For single power supply configuration, power budget must be sized with 30% margin to single power supply rated load.

6. When identifying memory in the table, only Rank and Width are required. Capacity is not required.

7. Processor limited to 90W to support 1.5W AOC cable. Processor limited to 90W and memory limited to DRx4 to support 2W

AOC cable.

8. Supported with one HDD per node configuration.

9. Fan fail is not supported at A3/A4.

Table 52. Thermal Configuration Table – S2600TP Product Family, Normal Mode

Revision 2.21 69

Appendix C: System Configuration Table for Thermal Compatibility Intel® Server Chassis H2000G Product Family TPS

Intel® Server Chassis

H2216XXKR2

Intel® Server Chassis

H2312XXKR2

Intel® Server Chassis

H2224XXKR2

ASHRAE

(See

note 1)

Classifications

27C

Max Ambient

35C

27C

40C

45C

27C

35C

40C

45C

27C

35C

40C

45C

<-- See note 1

EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3)

● ● ● ● ● ● ●

3,4

● ● ●

3,4

EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3, E52620 V3, E5-2609 V3, E52603 V3)

● ● ● ● ● ● ●

3,4

● ● ●

3,4

3 EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E5-2643 V3, E5-2637 V3)

3,4 ● 3,4

3,4 EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3)

● ● ● ● ●

● ●

EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3)

● ● ● ● ● ● ●

3,4

● ● ●

3,4

EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3)

● ● ● ● ● ● ●

3,4

● ● ●

3,4

EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E5-2699 V3)

3,4 ● 3,4

3,4 EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3)

3,4 ● 3,4

3,4

EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E52683 V3)

3,4 ● 3,4

3,4

Memory

Type

(See

note 6)

RDIMM-2Rx8,1Rx4

● ● ● ● ● ● ● ● ● ● ● ● ●

●

RDIMM-DRx4

● ● ● ● ● ● ● ● ● ● ● ● ●

●

LRDIMM-QRx4 DDP

● ● ● ● ● ● ●

● ● ● ●

●

Add-in

Cards

(See

note 2)

PCI Cards with 100LFM/55C spec

● ● ● ● ● ● ● ● ● ● ● ● ●

●

PCI Cards With 200LFM/55C spec

●

8 ● 8

<-- See note 2

70 Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Appendix C: System Configuration Table for Thermal Compatibility

Intel® Server Chassis

H2216XXKR2

Intel® Server Chassis

H2312XXKR2

Intel® Server Chassis

H2224XXKR2

ASHRAE

(See

note 1)

Classifications

27C

Max Ambient

35C

27C

40C

45C

27C

35C

40C

45C

27C

35C

40C

45C

<-- See note 1

PCI Cards With 300LFM/55C spec

● 8 8

<-- See note 2

Module

(See

note 2)

AXX10GBTWLIOM - Dual 10GBASE-T IO Module

● ● ● ● ● ● ● ● ● ● ● ● ●

●

AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module

● ● ● ● ● ● ● ● ● ● ● ● ●

●

AXX1FDRIBIOM - Single Port FDR Infiniband IO Module

● ● ● ● ● ● ● ● ● ● ● ● ●

●

AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module

● ● ● ● ● ● ● ● ● ● ● ● ●

●

AXX4P1GBPWLIOM - Quad Port 1GbE IO Module

● ● ● ● ● ● ● ● ● ● ● ● ●

●

<-- See note 2

QSFP

Cables

(See

note 7)

Passive Cable

● ● ● ● ● ● ● ● ● ● ● ● ●

●

Active Optical Cable (1.5W)

●

Active Optical Cable (2W)

● ● 7

● 7

<-- See note 7

Intel® Server

Chassis

H2216XXKR2

Intel® Server

Chassis

H2312XXKR2

Intel® Server

Chassis

H2224XXKR2

ASHRAE

(See note 1)

Classifications

27C

Max Ambient

35C

27C

35C

27C

35C

<-- See note 1

PS (See

note 5)

Power Supplies

See Note 5

Processors

EP, 135w, 12C (Intel® Xeon® processor E5-2690 V3)

3,4

EP, 120w, 12C (Intel® Xeon® processor E5-2680 V3, E5-2670 V3)

3,4

EP, 105w, 10C (Intel® Xeon® processor E5-2660 V3, E5-2650 V3)

3,4

Table 53. Thermal Configuration Table – S2600TP Product Family, Fan Fail Mode

Revision 2.21 71

Appendix C: System Configuration Table for Thermal Compatibility Intel® Server Chassis H2000G Product Family TPS

Intel® Server

Chassis

H2216XXKR2

Intel® Server

Chassis

H2312XXKR2

Intel® Server

Chassis

H2224XXKR2

ASHRAE

(See note 1)

Classifications

27C

Max Ambient

35C

27C

35C

27C

35C

<-- See note 1

(See notes 3

and 4)

EP, 90w, 8C (Intel® Xeon® processor E5-2640 V3)

3,4

EP, 85w,8C,6C (Intel® Xeon® processor E5-2630 V3, E5-2620 V3, E52609 V3, E5-2603 V3)

3,4

EP, 135w, 8C,6C,4C (Intel® Xeon® processor E5-2667 V3, E5-2643 V3, E5-2637 V3)

3,4

3,4 3,4

EP, 105w, 4C (Intel® Xeon® processor E5-2623 V3)

3,4

EP, 65w, 12C (Intel® Xeon® processor E5-2650L V3)

3,4

EP, 55w, 8C (Intel® Xeon® processor E5-2630L V3)

3,4

EP, 145w, 14C,18C (Intel® Xeon® processor E5-2697 V3, E5-2699 V3)

3,4

3,4 3,4

EP, 135w, 16C (Intel® Xeon® processor E5-2698 V3)

3,4

3,4 3,4

EP, 120w, 14C (Intel® Xeon® processor E5-2695 V3, E5-2683 V3)

3,4

3,4 3,4

Memory

Type (See

note 6)

RDIMM-2Rx8,1Rx4

●

● ● ●

●

RDIMM-DRx4

●

● ● ●

●

LRDIMM-QRx4 DDP

●

● ● ●

●

Add-in

Cards (See

note 2)

PCI Cards with 100LFM/55C spec

●

PCI Cards with 200LFM/55C spec

PCI Cards with 300LFM/55C spec

<-- See note 2

Module (See

note 2)

AXX10GBTWLIOM - Dual 10GBASE-T IO Module

●

● ● ●

●

AXX10GBNIAIOM - Dual SFP+ port 10GbE IO Module

●

● ● ●

●

AXX1FDRIBIOM - Single Port FDR Infiniband IO Module

●

● ● ●

●

AXX2FDRIBIOM - Dual Port FDR Infiniband IO Module

●

● ● ●

●

AXX4P1GBPWLIOM - Quad Port 1GbE IO Module

●

● ● ●

●

<-- See note 2

QSFP

Cables (See

note 7)

Passive Cable

●

● ● ●

●

Active Optical Cable (1.5W)

●

● 7 ●

Active Optical Cable (2W)

●

● 7 ●

<-- See note 7

72 Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Glossary

Term

Definition

ACPI

Advanced Configuration and Power Interface

BIOS

Basic Input/Output System

BMC

Baseboard Management Controller

Bridge

Circuitry connecting one computer bus to another, allowing an agent on one to access the other

Byte

8-bit quantity

EEPROM

Electrically Erasable Programmable Read-Only Memory

EPS

External Product Specification

FRU

Field Replaceable Unit

1024MB

GPIO

General Purpose I/O

HSC

Hot-Swap Controller

Hertz (1 cycle/second)

I2C

Inter-Integrated Circuit Bus

ICH

I/O Controller Hub

Internet Protocol

IPMB

Intelligent Platform Management Bus

Infrared

1024 bytes

LAN

Local Area Network

LED

Light Emitting Diode

1024KB

milliseconds

NIC

Network Interface Controller

NMI

Non-maskable Interrupt

POST

Power-On Self Test

SSI

Server System Infrastructure

Glossary

Revision 2.21 73

Glossary Intel® Server Chassis H2000G Product Family TPS

Term

Definition

VRD

Voltage Regulator Down

74 Revision 2.21

Intel® Server Chassis H2000G Product Family TPS Reference Documents

Reference Documents

Refer to the following documents for additional information:

 Intel  Intel

Server Chassis H2000G Product Family Service Guide

Server Board S2600KP Product Family and Intel® Compute Module HNS2600KP Product Family Technical Product

Specification

 Intel  Intel® Server Board S2600KP Product Family and Intel® Server Chassis H2000G Product Family Specification Update  Intel

Server Board S2600KP Product Family and Intel® Compute Module HNS2600KP Product Family Service Guide

Server Board S2600TP Product Family and Intel® Compute Module HNS2600TP Product Family Technical Product

Specification

 Intel  Intel® Server Board S2600TP Product Family and Intel® Server Chassis H2000G Product Family Specification Update

Server Board S2600TP Product Family and Intel® Compute Module HNS2600TP Product Family Service Guide

Revision 2.21 75

Intel H2224XXKR2, 2HE, 1600W redundant User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual