Intel H2000 Technical Product Specification

Revision 1.5

Intel

Server Chassis H2000 Family

Technical Product Specification

Intel order number: G59059-006

April, 2015

Enterprise Platforms and Services Division

Revision History Intel® Server Chassis H2000 Family TPS

Date

Revision Number

Modifications

 Updated link to Rail Specification.  Updated warning message on PSU configuration.

July, 2013

1.4

Updated chassis usage model.

Revision History

February, 2012 1.0 Initial release . July, 2012 1.1 Updated safety notice for rail kit. August, 2012 1.2 Updated power redundancy mode.

November, 2012 1.3

April, 2015 1.5 Updated LAN (i350 Dual NIC) LED behavior.

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Intel® Server Chassis H2000 Family TPS Disclaimers

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Intel

may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

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Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel

literature, may be obtained by calling 1-800-548-4725, or go to:

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reserves these for future definition and shall have no

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iii

Table of Contents Intel® Server Chassis H2000 Family TPS

Table of Contents

1. Introduction ........................................................................................................................ 1

1.1 Chapter Outline ...................................................................................................... 1

1.2 Server Board Use Disclaimer ................................................................................. 2

2. Product Overview ............................................................................................................... 3

2.1 Chassis Views ........................................................................................................ 4

2.2 Chassis Dimensions ............................................................................................... 5

2.3 System Level Environmental Limits ........................................................................ 5

2.4 Chassis Parts ......................................................................................................... 6

2.5 Hard Drive and Peripheral Bays ............................................................................. 7

2.6 Front Bezel Support ............................................................................................... 8

2.7 Rack and Cabinet Mounting Options ...................................................................... 8

3. Power Sub-System ........................................................................................................... 10

3.1 Mechanical Overview ........................................................................................... 10

3.1.1 AC Power Supply Unit Dimension Overview ........................................................ 10

3.1.2 AC Power Supply Unit General Data .................................................................... 11

3.1.3 AC input connector ............................................................................................... 11

3.1.4 AC Power Cord Specification Requirements ........................................................ 11

3.1.5 Power Supply Unit DC Output Connector ............................................................. 11

3.1.6 Handle Retention ................................................................................................. 12

3.1.7 LED Marking and Identification ............................................................................. 12

3.1.8 Power Cage with Power Distribution Board .......................................................... 13

3.1.9 Power Cage Output Pin Assignment .................................................................... 14

3.2 AC Input Specification .......................................................................................... 16

3.2.1 Input Voltage And Frequency ............................................................................... 16

3.2.2 AC input Power Factor ......................................................................................... 16

3.2.3 Efficiency .............................................................................................................. 17

3.2.4 AC Line Fuse ....................................................................................................... 17

3.2.5 AC Line Inrush ..................................................................................................... 17

3.2.6 AC Line Dropout/Holdup ...................................................................................... 18

3.2.7 AC Line Fast Transient (EFT) Specification .......................................................... 18

3.2.8 Hot Plug ............................................................................................................... 18

3.2.9 Susceptability Requirements ................................................................................ 18

3.2.10 Electrostatic Discharge Susceptibility ................................................................... 19

3.2.11 Fast Transient/Burst ............................................................................................. 19

3.2.12 Radiated Immunity ............................................................................................... 19

3.2.13 Surge Immunity .................................................................................................... 19

3.2.14 AC Line Transient Specification ........................................................................... 19

3.2.15 Power Recovery ................................................................................................... 20

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3.2.16 Voltage Interruptions ............................................................................................ 20

3.2.17 AC Line Isolation .................................................................................................. 20

3.2.18 AC Power Inlet ..................................................................................................... 21

3.3 DC Ouput Specification ........................................................................................ 21

3.3.1 Output Power/Currents ......................................................................................... 21

3.3.2 Standby Output .................................................................................................... 22

3.3.3 Voltage Regulation ............................................................................................... 22

3.3.4 Dynamic Loading ................................................................................................. 22

3.3.5 Capacitive Loading ............................................................................................... 23

3.3.6 Ripple/Noise ......................................................................................................... 23

3.3.7 Grounding ............................................................................................................ 23

3.3.8 Closed Loop Stability ............................................................................................ 24

3.3.9 Residual Voltage Immunity in Standby Mode ....................................................... 24

3.3.10 Common Mode Noise ........................................................................................... 24

3.3.11 Soft Starting ......................................................................................................... 24

3.3.12 Zero Load Stability Requirement .......................................................................... 24

3.3.13 Hot Swap Requirement ........................................................................................ 24

3.3.14 Forced Load Sharing ............................................................................................ 25

3.3.15 Timing Requirement ............................................................................................. 25

3.4 Power Supply Cold Redundancy Support ............................................................. 26

3.4.1 1200W CRPS Cold Redundancy .......................................................................... 27

3.4.2 1600W CRPS Cold Redundancy .......................................................................... 28

3.5 Control And Indicator Functions ........................................................................... 28

3.5.1 PSON# Input Signal ............................................................................................. 28

3.5.2 PWOK(power good) Output Signal ....................................................................... 28

3.5.3 SMBAlert# Signal ................................................................................................. 29

3.6 Protection circuits ................................................................................................. 30

3.6.1 Curren t Limit (OCP).............................................................................................. 30

3.6.2 Over Voltage Protection (OVP) ............................................................................ 30

3.6.3 Over Thermal protection ....................................................................................... 30

3.7 PMBus* ................................................................................................................ 31

3.7.1 PSU Address Lines A0 ......................................................................................... 31

3.7.2 Accuracy .............................................................................................................. 32

3.8 Power Management Policy ................................................................................... 33

4. Cooling Sub-System......................................................................................................... 35

4.1 Power Supply Fan ................................................................................................ 35

4.2 Drive Bay Population Requirement ....................................................................... 35

5. Hard Disk Drive Support .................................................................................................. 36

5.1 Hard Disk Drive Bays Scheme ............................................................................. 36

5.2 Hard Drive Carrier ................................................................................................ 37

5.3 Hot-Swap Hard Drive Support .............................................................................. 37

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5.3.1 Backplane Feature set: ........................................................................................ 38

5.3.2 Backplane Block Diagram .................................................................................... 38

5.3.3 3.5" Hot Swap Backplane Connector scheme ...................................................... 39

5.3.4 2.5" Hot Swap Backplane Connector scheme ...................................................... 40

5.3.5 Backplane LED Support ....................................................................................... 42

5.3.6 Backplane Connector Definition ........................................................................... 43

6. Front Panel Control and Indicators ................................................................................. 48

6.1 Control Panel Button ............................................................................................ 49

6.2 Control Panel LED Indicators ............................................................................... 49

6.2.1 Power/Sleep LED ................................................................................................. 50

6.2.2 System Status LED .............................................................................................. 50

6.2.3 System Status LED – BMC Initialization ............................................................... 52

Appendix A: Integration and Usage Tips .............................................................................. 53

Glossary .................................................................................................................................. 54

Reference Documents ............................................................................................................ 57

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Intel® Server Chassis H2000 Family TPS List of Figures

List of Figures

Figure 1. Chassis Overview (H2312xx SKU) ............................................................................... 4

Figure 2. Power Supply Scheme (Rear View) ............................................................................. 4

Figure 3. Dummy Tray Cover ...................................................................................................... 4

Figure 4. Major Chassis Parts ..................................................................................................... 7

Figure 5. Intel Figure 6. Intel

Figure 7. Chassis Bezel Front View ............................................................................................ 8

Figure 8. AC Power Supply Unit Dimension Overview .............................................................. 10

Figure 9. Power Cage Overview ............................................................................................... 14

Figure 10. Power distribution board ........................................................................................... 15

Figure 11. AC Power Cord Specification ................................................................................... 21

Figure 12. Turn On/Off Timing (Power Supply Signals) ............................................................. 26

Server Chassis H2312xx Drive Bay Front View .................................................. 8

Server Chassis H2216xx Drive Bay Front View .................................................. 8

Figure 13. Power Supply Device Address ................................................................................. 31

Figure 14. PMBus Monitoring Accuracy .................................................................................... 33

Figure 15. HDD Scheme for H2312xx ....................................................................................... 36

Figure 16. HDD Scheme for H2216xx ....................................................................................... 36

Figure 17. 3.5" HDD Assembly Overview .................................................................................. 37

Figure 18. 2.5" HDD Assembly Overview .................................................................................. 37

Figure 19. Passive Backplane Block Diagram (for one node) .................................................... 39

Figure 20. 3.5" Backplane Component and Connectors (Front View) ........................................ 39

Figure 21. 3.5" Backplane Component and Connectors (Back View) ........................................ 40

Figure 22. 2.5" Backplane Component and Connectors (Front View) ........................................ 41

Figure 23. 2.5" Backplane Component and Connectors (Back View) ........................................ 41

Figure 24. Hard Drive Carrier LED ............................................................................................ 42

Figure 25. Front Control Panel .................................................................................................. 49

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List of Tables Intel® Server Chassis H2000 Family TPS

List of Tables

Table 1. Chassis Feature Set ...................................................................................................... 3

Table 2. Chassis SKU Matrix ...................................................................................................... 3

Table 3. Chassis Dimension (SKU: H2312xxJR/KR) ................................................................... 5

Table 4. Chassis Dimension (SKU: H2216xxJR/KR) ................................................................... 5

Table 5. System Environmental Limits Summary ........................................................................ 5

Table 6. Specification Data for AC Power Supply Unit .............................................................. 11

Table 7. AC power cord specification ........................................................................................ 11

Table 8. DC Output Power Connector ....................................................................................... 11

Table 9. Power Supply Status LED ........................................................................................... 13

Table 10. Pin assignment of power ouput connector ................................................................. 15

Table 11. Pin assignment of control signal connector................................................................ 16

Table 12. AC input rating .......................................................................................................... 16

Table 13. Typical power factor .................................................................................................. 17

Table 14. Platinum Efficiency Requirement ............................................................................... 17

Table 15. AC Power Holdup Reuqirement ................................................................................. 18

Table 16. Performance Criteria ................................................................................................. 19

Table 17. AC Line Sag Transient Performance ......................................................................... 20

Table 18. AC Line Surge Transient Performance ...................................................................... 20

Table 19. Load Ratings for single power supply unit ................................................................. 21

Table 20. Voltage Regulation Limits .......................................................................................... 22

Table 21. Transient Load Requirements ................................................................................... 22

Table 22. Capacitive Loading Conditions .................................................................................. 23

Table 23. Ripple and Noise ....................................................................................................... 23

Table 24. Timing Requirement .................................................................................................. 25

Table 25. 1200W CRPS Cold Redundancy Threshold. ............................................................. 27

Table 26. 1600W CRPS Cold Redundancy Threshold. ............................................................. 28

Table 27. PSON# Signal Characteristics. .................................................................................. 28

Table 28. PWOK Signal Characteristics .................................................................................... 29

Table 29. SMBAlert# Signal Characteristics .............................................................................. 29

Table 30. Over Current Protection............................................................................................. 30

Table 31. Over Voltage Protection (OVP) Limits ....................................................................... 30

Table 32. PSU addressing ........................................................................................................ 32

Table 33. PMBus Accuracy ....................................................................................................... 32

Table 34. Power Management Policy ........................................................................................ 33

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Table 35. Hard Drive Carrier Status LED Functions .................................................................. 42

Table 36. Hard Drive Carrier Activity LED Functions ................................................................. 42

Table 37. Backplane Input Power Connector Pin-out ................................................................ 43

Table 38. 2-Blade Compute Node Power Connector Pin-out..................................................... 43

Table 39. 2x40 Pin Connector Pin-out for Node Bridge Board ................................................... 44

Table 40. Front Panel Connector Pin-out .................................................................................. 46

Table 41. Power Supply Control Connector Pin-out .................................................................. 47

Table 42. Front Control Button Function.................................................................................... 49

Table 43. Front LED Indicator Functions ................................................................................... 49

Table 44. Power LED Operation ............................................................................................... 50

Table 45. System Status LED Operation ................................................................................... 50

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List of Tables Intel® Server Chassis H2000 Family TPS

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Intel® Server Chassis H2000 Family TPS Introduction

1.1

Chapter Outline

1. Introduction

This Technical Product Specification (TPS) provides system specific information detailing the features, functionality, and high-level architecture of the Intel You should also reference the Intel

Server System H2000JF, H2000WP, H2000LP Family

Server Chassis H2000 family.

Technical Product Specification to obtain greater detail of functionality and archit ecture of the server board integrated in this server system.

In addition, you can obtain design-level information for specific sub-systems by ordering the External Product Specifications (EPS) or External Design Specifications (EDS) for a given subsystem. EPS and EDS documents are not publicly available. They are only made available under NDA with Intel

and must be ordered through your local Intel® representative. For a complete list of available documents, refer to the Reference Documents section at the end of this document.

The Intel may cause the product to deviate from published specifications. Refer to the Intel

S2600JF/Intel

Server Chassis H2000 may contain design defects or errors known as errata which

Server System H2000JF Specification Update for published errata.

Server Board

This document is divided into the following chapters:

 Chapter 1 – Introduction  Chapter 2 – Product Overview  Chapter 3 – Power Sub-System  Chapter 4 – Cooling Sub-System  Chapter 5 – Hard Disk Drive Support  Chapter 6 – Front Panel Control and Indicators  Appendix A – Integration and Usage Tips  Glossary  Reference Documents

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Introduction Intel® Server Chassis H2000 Family TPS

1.2

Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel its own chassis development and testing that when Intel

server building blocks are used

ensures through

together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel

developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

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Intel® Server Chassis H2000 Family TPS Product Overview

Feature

Description

Hard Disk Drive

12x 3.5-inch SATA/SAS HDD bays or 16x 2.5-inch SATA/SAS HDD bays.

System Power

1200w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC, supporting

Chassis SKU

3.5" HDD support

2.5" HDD support

1200W CRPS

H2312xxJR

H2216xxJR

1600W CRPS

H2312xxKR

H2216xxKR

2. Product Overview

The Intel® Server Chassis H2000 family includes two major SKUs: H2312xxJR/KR and H2216xxJR/KR, which are supporting rack mount 2U 4-node server systems, purpose-built for high-density and lowest total cost of ownership in dense computing applications, such as HPC and IPDC. The chassis can be used to integrate with four units of node trays which are built with

Intel

Server Board S2600JF, S2600WP or S2400LP, supports up to twelve 3.5" or sixteen 2.5" hot-swap SAS or SATA hard drives, with 1200 Watts or 1600 Watts Common Redundant Power Supply(CRPS) capability .

This chapter provides a high-level overview of the chassis features. The following chapters provide greater detail for each major chassis component or feature.

Table 1. Chassis Featu re Set

Supported

CRPS configuration, or 1600w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC, supporting

CRPS configuration. Chassis.

Table 2. Chassis SKU Matrix

Caution: Installing two Power Supply Units with different wattage ratings on a system is not supported. This will not provide Power Supply Redundancy and causes the system to log multiple errors.

The Intel® Server Chassis H2000 family supports node trays which are built with Intel® Server Board S2600JF, S2600WP, or S2400LP.

The Intel

Server Chassis H2000 family also supports different node quantity in the same

chassis. The compute node quantity can be at least 1, and up to 4 in one chassis.

Caution: The chassis doesn’t support mixed node configuration, for example, compute nodes based on different Intel® Server Board S2600JF, S2600WP, or S2400LP cannot be installed in the same chassis.

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Product Overview Intel® Server Chassis H2000 Family TPS

2.1

Chassis Views

Figure 1. Chassis Overview (H2312xx SKU)

Figure 2. Power Supply Scheme (Rear View)

Figure 3. Dummy Tray Cover

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Intel® Server Chassis H2000 Family TPS Product Overview

2.2

Chassis Dimensions

Height

87.9 mm

3.46"

Width

438 mm

17.24"

Depth

771 mm

30.35"

Height

87.9 mm

3.46"

Width

438 mm

17.24"

Depth

733 mm

28.86"

2.3

System Level Environmental Limits

Parameter

Limits

Table 3. Chassis Dimension (SKU: H2312xxJR/KR)

Table 4. Chassis Dimension (SKU: H2216xxJR/KR)

The following table defines the system level operating and non-operatin g environmental limits.

Table 5. System Environmental Limits Summary

Temperature Operating 10ºC to 35ºC (50ºF to 95ºF) with the maximum rate of change not to exceed 10°C

per hour Non-Operating -40º C to 70º C (-40º F to 149º F) Humidity Non-Operating 50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures

from 25°C to 35°C) Shock Operating Half sine, 2g, 11 mSec Unpackaged Trapezoidal, 25g, velocity change is based on packaged weight Packaged Product Weight: ≥ 40 to < 80

Non-palletized Free Fall Height = 18 inches

Palletized (single product) Free Fall Height = NA Vibration Unpackaged 5 Hz to 500 Hz 2.20 g RMS random Packaged 5 Hz to 500 Hz 1.09 g RMS random AC-DC Voltage 90 V to 132 V and 180 V to 264 V Frequency 47 Hz to 63 Hz Source

Interrupt

No loss of data for power line drop-out of 12 mSec

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Product Overview Intel® Server Chassis H2000 Family TPS

Parameter

Limits

-16 to 3048 m (-50 to 10,000 ft.) Note: For altitudes above 2950 feet, the

2.4

Chassis Parts

Surge Non-

operating and operating

Line to earth

Only

ESD Air Discharged 12.0 kV Contact

Discharge Altitude Operating

Storage -16 to 10,600 m (-50 to 35,000 ft.)

Unidirectional

AC Leads 2.0 kV I/O Leads 1.0 kV DC Leads 0.5 kV

8.0 kV

maximum operating temperature is de-rated 1°F/550 ft.

Disclaimer Note: Intel® ensures the unpackaged server board and system meet the shock requirement mentioned above through its own chassis development and system configuration. It is the responsibility of the system integrator to determine the proper shock level of the board and system if the system integrator chooses different system configuration or different chassis. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.

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Intel® Server Chassis H2000 Family TPS Product Overview

2.5

Hard Drive and Peripheral Bays

Intel® Server System H2312xx

Intel® Server System H2216xx

Slim-line SATA Optical Drive

Not Supported

Internal USB Floppy Drive

Not Supported

SATA/SAS Hard Disk Drives (3.5-inch)

Up to Twelve

Not Supported

SATA/SAS Hard Disk Drives (2.5-inch)

Not Supported

Up to Sixteen

A Front Control Panel B HDD bays C Upper and Lower Power Distribution Boards D Common Redundant Power Supply E Hot Swap Back Plane

Note: Not shown - Rack slide rail, and top cover.

Figure 4. Major Chassis Parts

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Product Overview Intel® Server Chassis H2000 Family TPS

2.6

Front Bezel Support

2.7

Rack and Cabinet Mounting Options

Figure 5. Intel

Figure 6. Intel® Server Chassis H2216xx Drive Bay Front View

Server Chassis H2312xx Drive Bay Front View

Intel® Server Chassis H2000 family provides front panel bezel. The bezel provides protection to system HDD bays with a lock to chassis. The front view of the bezel is as below.

Figure 7. Chassis Bezel Front View

The chassis was designed to support 19 inches wide by up to 30 inches deep server cabinets. The system bundles with the following Intel

rack mount option:

 A basic slide rail kit (Product order code – AXXELVRAIL) is designed to mount the

chassis into a standard (19 inches by up to 30 inches deep) EIA-310D compatible server cabinet.

Caution: THE MAXIMUM RECOMMENDED SERVER W EIGHT FOR THE RACK RAILS CAN BE FOUND at http://www.intel.com/support/motherboards/server/sb/CS-033655.htm. EXCEEDING THE MAXIMUM RECOMMENDED WEIGHT OR MISALIGNMENT OF THE SERVER MAY RESULT IN FAILURE OF THE RACK RAILS HOLDING THE SERVER. Us e of a

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Intel® Server Chassis H2000 Family TPS Product Overview

mechanical assist to install and align server into the rack rails is recommended.

Advisory Note: The AXXELVRAIL value rack mount rail kit is not designed to support shipment of the server system while installed in a rack.

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Power Sub-System Intel® Server Chassis H2000 Family TPS

3.1

Mechanical Overview

3.1.1

AC Power Supply Unit Dimension Overview

3. Power Sub-System

The system supports AC 1+1 hot swap power supply module and two power distribution board which can support 2U rack high density server system. Two different power supply units are supported: 1200W and 1600W. The single power supply module has Platinum level energy efficiency, dem onstr ating climat e saver with silver rating.

The power supply module has a simple retention mechanism to retain the module self once it is inserted. This mechanism shall withstand the specified mechanical shock and vibration requirements. The power distribution board will be fixed in the chassis with screws. This specification defines a 1+1 hot swap redundancy power supply that supports 2U server system. Using existing power supply module provided by vendor with updated PMBus* and custommade power connector board to support four computing nodes. The power supply shall have two outputs: 12V and 12VSB. The input shall be auto ranging and power factor corrected. The PMBus* features included in this specification are requirements for AC silver rated box power supply for use in server systems based on Intel specification is based on the PMBus* Specifications part I and II, revision 1.1.

Server Chassis H2000 Family. This

The casing dimension is W 73.5mm x L 265.0mm x H 39/40mm. The power supply contains a single 40mm fan. The power supply has a card edge output that interfaces with a 2x25 card edge connector in the system. The AC plugs directly into the external face of the power supply.

Figure 8. AC Power Supply Unit Dimension Overview

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Intel® Server Chassis H2000 Family TPS Power Sub-System

3.1.2

AC Power Supply Unit General Data

Wattage

1200W/1600W (Energy Smart)

Voltage

90 – 264 VAC, auto-ranging, 47 Hz-63 Hz

Heat Dissipation

2560 BTU/hr

Maximum Inrush Current

Under typical line conditions and over the entire system A per power supply for 5 ms

80 Plus rating

Platinum

Climate Saver (CS) rating

Platinum

3.1.3

AC input connector

3.1.4

AC Power Cord Specification Requirements

Cable Type

SJT

Wire Size

16 AWG

Temperature Rating

105º C

Amperage Rating

13A

Cable Type

SJT

3.1.5

Power Supply Unit DC Output Connector

PSU Output Connector

GND

Below is general specification data for AC Power Supply Unit.

Table 6. Specification Data for AC Power Supply Unit

ambient operating range, the inrush current may reach 65

The power supply has an internal IEC320 C14 power inlet. The inlet is rated for a minimum of 10A at 250VAC.

The AC power cord used must meet the following specification requirements:

Table 7. AC power cord specification

The DC output connector pin-out is defined as follows:

Table 8. DC Output Power Connector

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+ 47 hidden pages

Intel H2000 Technical Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual

Chapter Outline

1. Introduction

Server Board Use Disclaimer

2. Product Overview

Chassis Views

Chassis Dimensions

System Level Environmental Limits

Chassis Parts

Hard Drive and Peripheral Bays

Front Bezel Support

Rack and Cabinet Mounting Options

Mechanical Overview

AC Power Supply Unit Dimension Overview

3. Power Sub-System

AC Power Supply Unit General Data

AC input connector

AC Power Cord Specification Requirements

Power Supply Unit DC Output Connector