Intel H2000 Technical Product Specification

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Revision 1.5

Intel

Server Chassis H2000 Family

Technical Product Specification

Intel order number: G59059-006

April, 2015

Enterprise Platforms and Services Division

Revision History Intel® Server Chassis H2000 Family TPS

Date

Revision Number

Modifications

 Updated link to Rail Specification.  Updated warning message on PSU configuration.

July, 2013

1.4

Updated chassis usage model.

Revision History

February, 2012 1.0 Initial release . July, 2012 1.1 Updated safety notice for rail kit. August, 2012 1.2 Updated power redundancy mode.

November, 2012 1.3

April, 2015 1.5 Updated LAN (i350 Dual NIC) LED behavior.

ii Revision 1.5

Intel order number: G59059-006

Intel® Server Chassis H2000 Family TPS Disclaimers

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Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

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iii

Table of Contents Intel® Server Chassis H2000 Family TPS

Table of Contents

1. Introduction ........................................................................................................................ 1

1.1 Chapter Outline ...................................................................................................... 1

1.2 Server Board Use Disclaimer ................................................................................. 2

2. Product Overview ............................................................................................................... 3

2.1 Chassis Views ........................................................................................................ 4

2.2 Chassis Dimensions ............................................................................................... 5

2.3 System Level Environmental Limits ........................................................................ 5

2.4 Chassis Parts ......................................................................................................... 6

2.5 Hard Drive and Peripheral Bays ............................................................................. 7

2.6 Front Bezel Support ............................................................................................... 8

2.7 Rack and Cabinet Mounting Options ...................................................................... 8

3. Power Sub-System ........................................................................................................... 10

3.1 Mechanical Overview ........................................................................................... 10

3.1.1 AC Power Supply Unit Dimension Overview ........................................................ 10

3.1.2 AC Power Supply Unit General Data .................................................................... 11

3.1.3 AC input connector ............................................................................................... 11

3.1.4 AC Power Cord Specification Requirements ........................................................ 11

3.1.5 Power Supply Unit DC Output Connector ............................................................. 11

3.1.6 Handle Retention ................................................................................................. 12

3.1.7 LED Marking and Identification ............................................................................. 12

3.1.8 Power Cage with Power Distribution Board .......................................................... 13

3.1.9 Power Cage Output Pin Assignment .................................................................... 14

3.2 AC Input Specification .......................................................................................... 16

3.2.1 Input Voltage And Frequency ............................................................................... 16

3.2.2 AC input Power Factor ......................................................................................... 16

3.2.3 Efficiency .............................................................................................................. 17

3.2.4 AC Line Fuse ....................................................................................................... 17

3.2.5 AC Line Inrush ..................................................................................................... 17

3.2.6 AC Line Dropout/Holdup ...................................................................................... 18

3.2.7 AC Line Fast Transient (EFT) Specification .......................................................... 18

3.2.8 Hot Plug ............................................................................................................... 18

3.2.9 Susceptability Requirements ................................................................................ 18

3.2.10 Electrostatic Discharge Susceptibility ................................................................... 19

3.2.11 Fast Transient/Burst ............................................................................................. 19

3.2.12 Radiated Immunity ............................................................................................... 19

3.2.13 Surge Immunity .................................................................................................... 19

3.2.14 AC Line Transient Specification ........................................................................... 19

3.2.15 Power Recovery ................................................................................................... 20

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3.2.16 Voltage Interruptions ............................................................................................ 20

3.2.17 AC Line Isolation .................................................................................................. 20

3.2.18 AC Power Inlet ..................................................................................................... 21

3.3 DC Ouput Specification ........................................................................................ 21

3.3.1 Output Power/Currents ......................................................................................... 21

3.3.2 Standby Output .................................................................................................... 22

3.3.3 Voltage Regulation ............................................................................................... 22

3.3.4 Dynamic Loading ................................................................................................. 22

3.3.5 Capacitive Loading ............................................................................................... 23

3.3.6 Ripple/Noise ......................................................................................................... 23

3.3.7 Grounding ............................................................................................................ 23

3.3.8 Closed Loop Stability ............................................................................................ 24

3.3.9 Residual Voltage Immunity in Standby Mode ....................................................... 24

3.3.10 Common Mode Noise ........................................................................................... 24

3.3.11 Soft Starting ......................................................................................................... 24

3.3.12 Zero Load Stability Requirement .......................................................................... 24

3.3.13 Hot Swap Requirement ........................................................................................ 24

3.3.14 Forced Load Sharing ............................................................................................ 25

3.3.15 Timing Requirement ............................................................................................. 25

3.4 Power Supply Cold Redundancy Support ............................................................. 26

3.4.1 1200W CRPS Cold Redundancy .......................................................................... 27

3.4.2 1600W CRPS Cold Redundancy .......................................................................... 28

3.5 Control And Indicator Functions ........................................................................... 28

3.5.1 PSON# Input Signal ............................................................................................. 28

3.5.2 PWOK(power good) Output Signal ....................................................................... 28

3.5.3 SMBAlert# Signal ................................................................................................. 29

3.6 Protection circuits ................................................................................................. 30

3.6.1 Curren t Limit (OCP).............................................................................................. 30

3.6.2 Over Voltage Protection (OVP) ............................................................................ 30

3.6.3 Over Thermal protection ....................................................................................... 30

3.7 PMBus* ................................................................................................................ 31

3.7.1 PSU Address Lines A0 ......................................................................................... 31

3.7.2 Accuracy .............................................................................................................. 32

3.8 Power Management Policy ................................................................................... 33

4. Cooling Sub-System......................................................................................................... 35

4.1 Power Supply Fan ................................................................................................ 35

4.2 Drive Bay Population Requirement ....................................................................... 35

5. Hard Disk Drive Support .................................................................................................. 36

5.1 Hard Disk Drive Bays Scheme ............................................................................. 36

5.2 Hard Drive Carrier ................................................................................................ 37

5.3 Hot-Swap Hard Drive Support .............................................................................. 37

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5.3.1 Backplane Feature set: ........................................................................................ 38

5.3.2 Backplane Block Diagram .................................................................................... 38

5.3.3 3.5" Hot Swap Backplane Connector scheme ...................................................... 39

5.3.4 2.5" Hot Swap Backplane Connector scheme ...................................................... 40

5.3.5 Backplane LED Support ....................................................................................... 42

5.3.6 Backplane Connector Definition ........................................................................... 43

6. Front Panel Control and Indicators ................................................................................. 48

6.1 Control Panel Button ............................................................................................ 49

6.2 Control Panel LED Indicators ............................................................................... 49

6.2.1 Power/Sleep LED ................................................................................................. 50

6.2.2 System Status LED .............................................................................................. 50

6.2.3 System Status LED – BMC Initialization ............................................................... 52

Appendix A: Integration and Usage Tips .............................................................................. 53

Glossary .................................................................................................................................. 54

Reference Documents ............................................................................................................ 57

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Intel® Server Chassis H2000 Family TPS List of Figures

List of Figures

Figure 1. Chassis Overview (H2312xx SKU) ............................................................................... 4

Figure 2. Power Supply Scheme (Rear View) ............................................................................. 4

Figure 3. Dummy Tray Cover ...................................................................................................... 4

Figure 4. Major Chassis Parts ..................................................................................................... 7

Figure 5. Intel Figure 6. Intel

Figure 7. Chassis Bezel Front View ............................................................................................ 8

Figure 8. AC Power Supply Unit Dimension Overview .............................................................. 10

Figure 9. Power Cage Overview ............................................................................................... 14

Figure 10. Power distribution board ........................................................................................... 15

Figure 11. AC Power Cord Specification ................................................................................... 21

Figure 12. Turn On/Off Timing (Power Supply Signals) ............................................................. 26

Server Chassis H2312xx Drive Bay Front View .................................................. 8

Server Chassis H2216xx Drive Bay Front View .................................................. 8

Figure 13. Power Supply Device Address ................................................................................. 31

Figure 14. PMBus Monitoring Accuracy .................................................................................... 33

Figure 15. HDD Scheme for H2312xx ....................................................................................... 36

Figure 16. HDD Scheme for H2216xx ....................................................................................... 36

Figure 17. 3.5" HDD Assembly Overview .................................................................................. 37

Figure 18. 2.5" HDD Assembly Overview .................................................................................. 37

Figure 19. Passive Backplane Block Diagram (for one node) .................................................... 39

Figure 20. 3.5" Backplane Component and Connectors (Front View) ........................................ 39

Figure 21. 3.5" Backplane Component and Connectors (Back View) ........................................ 40

Figure 22. 2.5" Backplane Component and Connectors (Front View) ........................................ 41

Figure 23. 2.5" Backplane Component and Connectors (Back View) ........................................ 41

Figure 24. Hard Drive Carrier LED ............................................................................................ 42

Figure 25. Front Control Panel .................................................................................................. 49

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List of Tables Intel® Server Chassis H2000 Family TPS

List of Tables

Table 1. Chassis Feature Set ...................................................................................................... 3

Table 2. Chassis SKU Matrix ...................................................................................................... 3

Table 3. Chassis Dimension (SKU: H2312xxJR/KR) ................................................................... 5

Table 4. Chassis Dimension (SKU: H2216xxJR/KR) ................................................................... 5

Table 5. System Environmental Limits Summary ........................................................................ 5

Table 6. Specification Data for AC Power Supply Unit .............................................................. 11

Table 7. AC power cord specification ........................................................................................ 11

Table 8. DC Output Power Connector ....................................................................................... 11

Table 9. Power Supply Status LED ........................................................................................... 13

Table 10. Pin assignment of power ouput connector ................................................................. 15

Table 11. Pin assignment of control signal connector................................................................ 16

Table 12. AC input rating .......................................................................................................... 16

Table 13. Typical power factor .................................................................................................. 17

Table 14. Platinum Efficiency Requirement ............................................................................... 17

Table 15. AC Power Holdup Reuqirement ................................................................................. 18

Table 16. Performance Criteria ................................................................................................. 19

Table 17. AC Line Sag Transient Performance ......................................................................... 20

Table 18. AC Line Surge Transient Performance ...................................................................... 20

Table 19. Load Ratings for single power supply unit ................................................................. 21

Table 20. Voltage Regulation Limits .......................................................................................... 22

Table 21. Transient Load Requirements ................................................................................... 22

Table 22. Capacitive Loading Conditions .................................................................................. 23

Table 23. Ripple and Noise ....................................................................................................... 23

Table 24. Timing Requirement .................................................................................................. 25

Table 25. 1200W CRPS Cold Redundancy Threshold. ............................................................. 27

Table 26. 1600W CRPS Cold Redundancy Threshold. ............................................................. 28

Table 27. PSON# Signal Characteristics. .................................................................................. 28

Table 28. PWOK Signal Characteristics .................................................................................... 29

Table 29. SMBAlert# Signal Characteristics .............................................................................. 29

Table 30. Over Current Protection............................................................................................. 30

Table 31. Over Voltage Protection (OVP) Limits ....................................................................... 30

Table 32. PSU addressing ........................................................................................................ 32

Table 33. PMBus Accuracy ....................................................................................................... 32

Table 34. Power Management Policy ........................................................................................ 33

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Intel® Server Chassis H2000 Family TPS List of Tables

Table 35. Hard Drive Carrier Status LED Functions .................................................................. 42

Table 36. Hard Drive Carrier Activity LED Functions ................................................................. 42

Table 37. Backplane Input Power Connector Pin-out ................................................................ 43

Table 38. 2-Blade Compute Node Power Connector Pin-out..................................................... 43

Table 39. 2x40 Pin Connector Pin-out for Node Bridge Board ................................................... 44

Table 40. Front Panel Connector Pin-out .................................................................................. 46

Table 41. Power Supply Control Connector Pin-out .................................................................. 47

Table 42. Front Control Button Function.................................................................................... 49

Table 43. Front LED Indicator Functions ................................................................................... 49

Table 44. Power LED Operation ............................................................................................... 50

Table 45. System Status LED Operation ................................................................................... 50

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List of Tables Intel® Server Chassis H2000 Family TPS

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Intel® Server Chassis H2000 Family TPS Introduction

1.1

Chapter Outline

1. Introduction

This Technical Product Specification (TPS) provides system specific information detailing the features, functionality, and high-level architecture of the Intel You should also reference the Intel

Server System H2000JF, H2000WP, H2000LP Family

Server Chassis H2000 family.

Technical Product Specification to obtain greater detail of functionality and archit ecture of the server board integrated in this server system.

In addition, you can obtain design-level information for specific sub-systems by ordering the External Product Specifications (EPS) or External Design Specifications (EDS) for a given subsystem. EPS and EDS documents are not publicly available. They are only made available under NDA with Intel

and must be ordered through your local Intel® representative. For a complete list of available documents, refer to the Reference Documents section at the end of this document.

The Intel may cause the product to deviate from published specifications. Refer to the Intel

S2600JF/Intel

Server Chassis H2000 may contain design defects or errors known as errata which

Server System H2000JF Specification Update for published errata.

Server Board

This document is divided into the following chapters:

 Chapter 1 – Introduction  Chapter 2 – Product Overview  Chapter 3 – Power Sub-System  Chapter 4 – Cooling Sub-System  Chapter 5 – Hard Disk Drive Support  Chapter 6 – Front Panel Control and Indicators  Appendix A – Integration and Usage Tips  Glossary  Reference Documents

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Introduction Intel® Server Chassis H2000 Family TPS

1.2

Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and power delivery components that need adequate airflow to cool. Intel its own chassis development and testing that when Intel

server building blocks are used

ensures through

together, the fully integrated system will meet the intended thermal requirements of these components. It is the responsibility of the system integrator who chooses not to use Intel

developed server building blocks to consult vendor datasheets and operating parameters to determine the amount of air flow required for their specific application and environmental conditions. Intel Corporation cannot be held responsible if components fail or the server board does not operate correctly when used outside any of their published operating or non-operating limits.

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Intel® Server Chassis H2000 Family TPS Product Overview

Feature

Description

Hard Disk Drive

12x 3.5-inch SATA/SAS HDD bays or 16x 2.5-inch SATA/SAS HDD bays.

System Power

1200w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC, supporting

Chassis SKU

3.5" HDD support

2.5" HDD support

1200W CRPS

H2312xxJR

H2216xxJR

1600W CRPS

H2312xxKR

H2216xxKR

2. Product Overview

The Intel® Server Chassis H2000 family includes two major SKUs: H2312xxJR/KR and H2216xxJR/KR, which are supporting rack mount 2U 4-node server systems, purpose-built for high-density and lowest total cost of ownership in dense computing applications, such as HPC and IPDC. The chassis can be used to integrate with four units of node trays which are built with

Intel

Server Board S2600JF, S2600WP or S2400LP, supports up to twelve 3.5" or sixteen 2.5" hot-swap SAS or SATA hard drives, with 1200 Watts or 1600 Watts Common Redundant Power Supply(CRPS) capability .

This chapter provides a high-level overview of the chassis features. The following chapters provide greater detail for each major chassis component or feature.

Table 1. Chassis Featu re Set

Supported

CRPS configuration, or 1600w AC Common Redundant Power Supply (CRPS), 80 plus Platinum with PFC, supporting

CRPS configuration. Chassis.

Table 2. Chassis SKU Matrix

Caution: Installing two Power Supply Units with different wattage ratings on a system is not supported. This will not provide Power Supply Redundancy and causes the system to log multiple errors.

The Intel® Server Chassis H2000 family supports node trays which are built with Intel® Server Board S2600JF, S2600WP, or S2400LP.

The Intel

Server Chassis H2000 family also supports different node quantity in the same

chassis. The compute node quantity can be at least 1, and up to 4 in one chassis.

Caution: The chassis doesn’t support mixed node configuration, for example, compute nodes based on different Intel® Server Board S2600JF, S2600WP, or S2400LP cannot be installed in the same chassis.

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Product Overview Intel® Server Chassis H2000 Family TPS

2.1

Chassis Views

Figure 1. Chassis Overview (H2312xx SKU)

Figure 2. Power Supply Scheme (Rear View)

Figure 3. Dummy Tray Cover

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Intel® Server Chassis H2000 Family TPS Product Overview

2.2

Chassis Dimensions

Height

87.9 mm

3.46"

Width

438 mm

17.24"

Depth

771 mm

30.35"

Height

87.9 mm

3.46"

Width

438 mm

17.24"

Depth

733 mm

28.86"

2.3

System Level Environmental Limits

Parameter

Limits

Table 3. Chassis Dimension (SKU: H2312xxJR/KR)

Table 4. Chassis Dimension (SKU: H2216xxJR/KR)

The following table defines the system level operating and non-operatin g environmental limits.

Table 5. System Environmental Limits Summary

Temperature Operating 10ºC to 35ºC (50ºF to 95ºF) with the maximum rate of change not to exceed 10°C

per hour Non-Operating -40º C to 70º C (-40º F to 149º F) Humidity Non-Operating 50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures

from 25°C to 35°C) Shock Operating Half sine, 2g, 11 mSec Unpackaged Trapezoidal, 25g, velocity change is based on packaged weight Packaged Product Weight: ≥ 40 to < 80

Non-palletized Free Fall Height = 18 inches

Palletized (single product) Free Fall Height = NA Vibration Unpackaged 5 Hz to 500 Hz 2.20 g RMS random Packaged 5 Hz to 500 Hz 1.09 g RMS random AC-DC Voltage 90 V to 132 V and 180 V to 264 V Frequency 47 Hz to 63 Hz Source

Interrupt

No loss of data for power line drop-out of 12 mSec

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Product Overview Intel® Server Chassis H2000 Family TPS

Parameter

Limits

-16 to 3048 m (-50 to 10,000 ft.) Note: For altitudes above 2950 feet, the

2.4

Chassis Parts

Surge Non-

operating and operating

Line to earth

Only

ESD Air Discharged 12.0 kV Contact

Discharge Altitude Operating

Storage -16 to 10,600 m (-50 to 35,000 ft.)

Unidirectional

AC Leads 2.0 kV I/O Leads 1.0 kV DC Leads 0.5 kV

8.0 kV

maximum operating temperature is de-rated 1°F/550 ft.

Disclaimer Note: Intel® ensures the unpackaged server board and system meet the shock requirement mentioned above through its own chassis development and system configuration. It is the responsibility of the system integrator to determine the proper shock level of the board and system if the system integrator chooses different system configuration or different chassis. Intel Corporation cannot be held responsible, if components fail or the server board does not operate correctly when used outside any of its published operating or non-operating limits.

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Intel® Server Chassis H2000 Family TPS Product Overview

2.5

Hard Drive and Peripheral Bays

Intel® Server System H2312xx

Intel® Server System H2216xx

Slim-line SATA Optical Drive

Not Supported

Internal USB Floppy Drive

Not Supported

SATA/SAS Hard Disk Drives (3.5-inch)

Up to Twelve

Not Supported

SATA/SAS Hard Disk Drives (2.5-inch)

Not Supported

Up to Sixteen

A Front Control Panel B HDD bays C Upper and Lower Power Distribution Boards D Common Redundant Power Supply E Hot Swap Back Plane

Note: Not shown - Rack slide rail, and top cover.

Figure 4. Major Chassis Parts

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Product Overview Intel® Server Chassis H2000 Family TPS

2.6

Front Bezel Support

2.7

Rack and Cabinet Mounting Options

Figure 5. Intel

Figure 6. Intel® Server Chassis H2216xx Drive Bay Front View

Server Chassis H2312xx Drive Bay Front View

Intel® Server Chassis H2000 family provides front panel bezel. The bezel provides protection to system HDD bays with a lock to chassis. The front view of the bezel is as below.

Figure 7. Chassis Bezel Front View

The chassis was designed to support 19 inches wide by up to 30 inches deep server cabinets. The system bundles with the following Intel

rack mount option:

 A basic slide rail kit (Product order code – AXXELVRAIL) is designed to mount the

chassis into a standard (19 inches by up to 30 inches deep) EIA-310D compatible server cabinet.

Caution: THE MAXIMUM RECOMMENDED SERVER W EIGHT FOR THE RACK RAILS CAN BE FOUND at http://www.intel.com/support/motherboards/server/sb/CS-033655.htm. EXCEEDING THE MAXIMUM RECOMMENDED WEIGHT OR MISALIGNMENT OF THE SERVER MAY RESULT IN FAILURE OF THE RACK RAILS HOLDING THE SERVER. Us e of a

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Intel® Server Chassis H2000 Family TPS Product Overview

mechanical assist to install and align server into the rack rails is recommended.

Advisory Note: The AXXELVRAIL value rack mount rail kit is not designed to support shipment of the server system while installed in a rack.

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Power Sub-System Intel® Server Chassis H2000 Family TPS

3.1

Mechanical Overview

3.1.1

AC Power Supply Unit Dimension Overview

3. Power Sub-System

The system supports AC 1+1 hot swap power supply module and two power distribution board which can support 2U rack high density server system. Two different power supply units are supported: 1200W and 1600W. The single power supply module has Platinum level energy efficiency, dem onstr ating climat e saver with silver rating.

The power supply module has a simple retention mechanism to retain the module self once it is inserted. This mechanism shall withstand the specified mechanical shock and vibration requirements. The power distribution board will be fixed in the chassis with screws. This specification defines a 1+1 hot swap redundancy power supply that supports 2U server system. Using existing power supply module provided by vendor with updated PMBus* and custommade power connector board to support four computing nodes. The power supply shall have two outputs: 12V and 12VSB. The input shall be auto ranging and power factor corrected. The PMBus* features included in this specification are requirements for AC silver rated box power supply for use in server systems based on Intel specification is based on the PMBus* Specifications part I and II, revision 1.1.

Server Chassis H2000 Family. This

The casing dimension is W 73.5mm x L 265.0mm x H 39/40mm. The power supply contains a single 40mm fan. The power supply has a card edge output that interfaces with a 2x25 card edge connector in the system. The AC plugs directly into the external face of the power supply.

Figure 8. AC Power Supply Unit Dimension Overview

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Intel® Server Chassis H2000 Family TPS Power Sub-System

3.1.2

AC Power Supply Unit General Data

Wattage

1200W/1600W (Energy Smart)

Voltage

90 – 264 VAC, auto-ranging, 47 Hz-63 Hz

Heat Dissipation

2560 BTU/hr

Maximum Inrush Current

Under typical line conditions and over the entire system A per power supply for 5 ms

80 Plus rating

Platinum

Climate Saver (CS) rating

Platinum

3.1.3

AC input connector

3.1.4

AC Power Cord Specification Requirements

Cable Type

SJT

Wire Size

16 AWG

Temperature Rating

105º C

Amperage Rating

13A

Cable Type

SJT

3.1.5

Power Supply Unit DC Output Connector

PSU Output Connector

GND

Below is general specification data for AC Power Supply Unit.

Table 6. Specification Data for AC Power Supply Unit

ambient operating range, the inrush current may reach 65

The power supply has an internal IEC320 C14 power inlet. The inlet is rated for a minimum of 10A at 250VAC.

The AC power cord used must meet the following specification requirements:

Table 7. AC power cord specification

The DC output connector pin-out is defined as follows:

Table 8. DC Output Power Connector

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Power Sub-System Intel® Server Chassis H2000 Family TPS

PSU Output Connector

GND

A10

+12V

B10

+12V

A11

+12V

B11

+12V

A12

+12V

B12

+12V

A13

+12V

B13

+12V

A14

+12V

B14

+12V

A15

+12V

B15

+12V

A16

+12V

B16

+12V

A17

+12V

B17

+12V

A18

+12V

B18

+12V

A19

PMBus SDA*

B19

A0* (SMBus address)

A20

PMBus SCL*

B20

A1* (SMBus address)

A21

PSON

B21

12V STBY

A22

SMBAlert#

B22

Cold Redundancy Bus*

A23

Return Sense

B23

12V load share bus

A24

+12V Remote Sense

B24

No Connect

A25

PWOK

B25

CRPS Compatibility Check pin*

3.1.6

Handle Retention

3.1.7

LED Marking and Identification

The power supply has a handle to assist extraction. The module is able to be inserted and extracted without the assistance of tools. The power supply also has a latch which retains the power supply into the system and prevents the power supply from being inserted or extracted from the system when the AC power cord is pulled into the power supply.

The handle protects the operator from any burn hazard through the use of industrial designed plastic handle or equivalent material.

The power supply is using a bi-color LED: Amber and Green for status indication. Below are table showing the LED states for each power supply operating state.

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*: Refer to the spec of CRPS Common Requirements Specification.

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Intel® Server Chassis H2000 Family TPS Power Sub-System

Power Supply Condition

LED State

Output ON and OK

Solid GREEN

No AC power to all power supplies

OFF

AC present/Only 12VSB on (PS off) or PS in Cold

1Hz Blink GREEN

AC cord unplugged or AC power lost; with a second

Solid AMBER

Power supply warning events where the power supply Power supply critical event causing a shutdown; failure,

Solid AMBER

Power supply FW updating

2Hz Blink GREEN

3.1.8

Power Cage with Power Distribution Board

Table 9. Power Supply Status LED

redundant state

power supply in parallel still with AC input power.

continues to operate; high temp, high power, high current, slow fan.

OCP, OVP, Fan Fail

1Hz Blink Amber

The power cage is at the middle of the chassis, consists of two Power Distribution Boards (PDB) to support Common Redundant Power Supplies (CRPS).

Caution: Installing two Power Supply Units with different wattage ratings on a system is not supported. This will not provide Power Supply Redundancy and causes the system to log multiple errors.

Following is the power system overview:

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Power Sub-System Intel® Server Chassis H2000 Family TPS

Power Distribution Board 1

Power Distribution Board 2

Power Supply Unit #2(upper) and #1(lower)

3.1.9

Power Cage Output Pin Assignment

Figure 9. Power Cage Overview

The power cage provides +12V and +12V

output to the system. Each PDB has two 2x9

STB

power output cable to system backplane, together with one 2x8 signal control cable for power management. Refer to below table for PDB pin assignment.

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Intel® Server Chassis H2000 Family TPS Power Sub-System

Main Power Output Connector P1

Power Supply Unit Connector

Control Signal Connector

Main Power Output Connector P2

Description

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

GND

+12V

Figure 10. Power distribution board

Table 10. Pin assignment of power ouput connector

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Power Sub-System Intel® Server Chassis H2000 Family TPS

Description

PMBus SDA

A0 (SMBus Address)

PMBus SCL

A1 (SMBus Address)

PSON#

12V Load Share Bus

SMBAlert#

Cold Redundancy Bus

Return Sense

PWOK

+12V Remote Sense

Compatibility Bus

Reserved

+12VSB

Key Pin (removed)

3.2

AC Input Specification

3.2.1

Input Voltage And Frequency

Parameter

Min Rated

Max

Start up VAC

Power Off VAC

110VAC

90 V

100-127 V

140 V

85 VAC± 4VAC

70VAC±5VAC

220VAC

180 V

200-240 V

264 V

Frequency

47 Hz

50/60 Hz

63 Hz

3.2.2

AC input Power Factor

Table 11. Pin assignment of control signal connector

The power supply must operate within all specified limits over the following input voltage range. Harmonic distortion of up to 10% THD must not cause the power supply to go out of specific limits. The power supply shall be capable of start-up (power-on) with full rated power load, at line voltage as low as 90VAC.

Table 12. AC input rating

rms

Note:

1. Maximum input current at low input voltage range shall be measured at 90VAC, at max load.

2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

rms

3. This requirement is not to be used for determining agency input current markings.

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Intel® Server Chassis H2000 Family TPS Power Sub-System

Output power

10% load

20% load

50% load

100% load

Power factor

> 0.80

> 0.90

> 0.95

3.2.3

Efficiency

Minimum Efficiency

3.2.4

AC Line Fuse

3.2.5

AC Line Inrush

The power supply must meet the power factor requirements stated in the Energy Star® Program Requirements for Computer Servers. These requirements are stated below.

Table 13. Typical power factor

Note: Tested at 230Vac, 50Hz and 60Hz and 115VAC, 60Hz. Tested according to Generalized

Internal Power Supply Efficiency Testing Protocol, Rev 6.4.3. This is posted at

http://efficientpowersupplies.epri.com/methods.asp.

The following table provides the required minimum efficiency level at various loading conditions. These are provided at three different load levels; 100%, 50%, 20%, and 10%. Output shall be load according to the proportional loading method defined by 80 Plus in Generalized Internal Power Supply Efficiency Testing Protocol, Rev 6.4.3. This is posted at:

http://efficientpowersupplies.epri.com/methods.asp

Table 14. Platinum Efficiency Requirement

100% of maximum 50% of maximum 20% of maximum 10% of maximum

91% 94% 90% 82%

The power supply must pass with enough margins to make sure in production all power supplies meet these efficiency requirements.

The power supply shall have one line fused in the single line fuse on the line (Hot) wire of the AC input. The line fusing shall be acceptable for all safety agency requirements. The input fuse shall be a slow blow type. AC inrush current shall not cause the AC line fuse to blow under any conditions. All protection circuits in the power supply shall not cause the AC fuse to blow unless a component in the power supply has failed. This includes DC output load short conditions.

AC line inrush current shall not exceed 65A peak, for up to on e-quarter of the AC cycle, after which, the input current should be no more than the specified maximum input current. The peak inrush current shall be less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device).

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Power Sub-System Intel® Server Chassis H2000 Family TPS

3.2.6

AC Line Dropout/Holdup

Holdup time

70%

10.6msec

3.2.7

AC Line Fast Transient (EFT) Specification

3.2.8

Hot Plug

3.2.9

Susceptability Requirements

The power supply must meet the inrush requirements for any rated AC voltage, during turn on at any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any duration, and over the specified temperature range (T

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout the power supply must meet dynamic voltage regulation requirements. An AC line dropout of any duration shall not cause tripping of control signals or protection circuits. If the AC dropout lasts longer than the holdup time the power supply should recover and meet all turn on requirements. The power supply shall meet the AC dropout requirement over rated AC voltages and frequencies. A dropout of the AC line for any duration shall not cause damage to the power supply.

Table 15. AC Power Holdup Reuqirement

The 12V

output voltage should stay in regulation under its full load (static or dynamic) during

STB

an AC dropout of 70ms min (=12VSB holdup time) whether the power supply is in ON or OFF state (PSON asserted or de-asserted).

The power supply shall meet the EN61000-4-5 directive and any additional requirements in IEC1000-4-5: 1995 and the Level 3 requirements for surge-withstand capability, with the following conditions and exceptions:

 These input transients must not cause any out-of-regulation conditions, such as

overshoot and undershoot, nor must it cause any nuisance trips of any of the power supply protection circuits.

 The surge-withstand test must not produce damage to the power supply. The supply must meet surge-withstand test conditions under maximum and minimum DC-output load conditions.

Power supply shall be designed to allow connection into and removal from the system without removing power to the system. During any phase of insertion, start-up, shutdown, or removal, the power supply shall not cause any other like modules in the system to deviate outside of their specifications. When AC power is applied, the auxiliary supply shall turn on providing bias power internal to the supply and the 5VSB standby output.

The power supply shall meet the following electrical immunity requirements when connected to

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Intel® Server Chassis H2000 Family TPS Power Sub-System

Level

Description

The apparatus shall continue to operate as intended. No degradation of performance.

The apparatus shall continue to operate as intended. No degradation of performance beyond

Temporary loss of function is allowed provided the function is self-r ec ov erable or can be restored

3.2.10

Electrostatic Discharge Susceptibility

3.2.11

Fast Transient/Burst

3.2.12

Radiated Immunity

3.2.13

Surge Immunity

3.2.14

AC Line Transient Specification

a cage with an external EMI filter, which meets the criteria, defined in the SSI document EPS Power Supply Specification. For further information on customer standards please request a copy of the customer Environmental Standards Handbook.

Table 16. Performance Criteria

spec limits.

by the operation of the controls.

The power supply shall comply with the limits defined in EN 55024: 1998 using the IEC 610004-2:1995 test standard and performance criteria B defined in Annex B of CISPR 24.

The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-44:1995 test standard and performance criteria B defined in Annex B of CISPR 24.

The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-43:1995 test standard and performance criteria A defined in Annex B of CISPR 24.

The power supply shall be tested with the system for immunity to AC Ring wave and AC Unidirectional wave, both up to 2kV, per EN 55024:1998, EN 61000-4-5:1995 and ANSI C62.45:

1992. The pass criteria include the following:

1. No unsafe operation is allowed under any condition

2. All power supply output voltage levels to stay within proper spec levels

3. No change in operating state or loss of data during and after the test profile

4. No component damage under any condition

The power supply shall comply with the limits defined in EN55024: 1998 using the IEC 61000-45:1995 test standard and performance criteria B defined in Annex B of CISPR 24.

AC line transient conditions shall be defined as “sag” and “surge” conditions. “Sag” conditions are also commonly referred to as “brownout”; these conditions will be defined as the AC line

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Power Sub-System Intel® Server Chassis H2000 Family TPS

AC Line Sag (10 sec interval between each sagging)

Duration

Sag

Operating AC Voltage

Line

Frequency

Performance Criteria.

0 to ½ AC

Nominal AC Voltage

Loss of function acceptable, self-

3.2.15

Power Recovery

3.2.16

Voltage Interruptions

3.2.17

AC Line Isolation

AC Line Surge

Duration

Surge

Operating AC Voltage

Line Frequency

Performance Criteria

No loss of function or

0 to ½ AC

Mid-point of nominal AC

No loss of function or

voltage dropping below nominal voltage conditions. “Surge” will be defined to refer to conditions when the AC line voltage rises above nominal voltage.

The power supply shall meet the requirements under the following AC line sag and surge conditions.

Table 17. AC Line Sag Transient Performance

cycle

> 1 AC cycle >30%

Continuous 10% Nominal AC Voltages 50/60Hz

cycle

95%

30%

ranges

Table 18. AC Line Surge Transient Performance

Voltages

50/60Hz No loss of function or performance.

50/60Hz

recoverable.

performance

The power supply shall recover automatically after an AC power failure. AC power failure is defined to be any loss of AC power that exceeds the dropout criteria.

The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC 61000-4-11: Second Edition: 2004-03 test standard and performance criteria C defined in Annex B of CISPR 24.

The power supply shall meet all safety agency requirements for dielectric strength. Transformers’ isolation between primary and secondary windings must comply with the 3000Vac (4242Vdc) dielectric strength criteria. If the working voltage between primary and secondary dictates a higher dielectric strength test voltage the highest test voltage should be

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Intel® Server Chassis H2000 Family TPS Power Sub-System

3.2.18

AC Power Inlet

Cable Type

SJT

Wire Size

16 AWG

Temperature Rating

105º C

Amperage Rating

13 A

Voltage Rating

125 V

3.3

DC Ouput Specification

3.3.1

Output Power/Currents

Parameter

Min

Max

Peak

2,3

Unit

PSU SKU

1200W

1600W

1200W

1600W

+12V main (100-127VAC)

0.0

110

used. In addition the insulation system must comply with reinforced insulation per safety standard IEC 950. Separation between the primary and secondary circuits, and primary to ground circuits, must comply with the IEC 950 spacing requirements.

The AC input connector should be an IEC 320 C-14 power inlet. This inlet is rated for 10A/250 VAC.

The AC power cord must meet the following specification requirements:

Figure 11. AC Power Cord Specifica tion

The following table defines the minimum power and current ratings. The power supply must meet both static and dynamic voltage regulation requirements for all conditions.

Table 19. Load Ratings for single power supply unit

+12V main (200-240VAC) 0.0 100 133 133 175 A

+12V

Notes:

Revision 1.5 21

0.0 3.0 3.5 3.5 2.4 A

STB

Intel order number: G59059-006

Power Sub-System Intel® Server Chassis H2000 Family TPS

3.3.2

Standby Output

3.3.3

Voltage Regulation

Parameter

Min

Nom

Max

Unit

Tolerance

+12V

+11.40V

+12.000V

+12.60V

Vrms

±5%

+12V

+11.40V

+12.000V

+12.60V

Vrms

±5%

3.3.4

Dynamic Loading

Output

∆ Step Load Size

Load Slew Rate

Test capacitive Load

+12V

1.0A

0.25 A/µsec

20 µF

+12V

60% of max load

0.25 A/µsec

2000 µF

1. 12V

2. Peak combined power for all outputs shall not ex ceed 160 0 W (for 1200W PSU) and 2100W (for 1600W PSU)

3. Length of time peak power can be supported is based on thermal sensor and assertion of the SMBAlert#

must provide 4.0A with two power supplies in parallel. The power supply fan is allowed to run in

STB

standby mode for loads > 1.5A.

signal. Minimum peak power duration shall be 20 seconds without asserting the SMBAlert# signal.

The 12VSB output shall be present when an AC input greater than the power supply turn on voltage is applied.

The power supply output voltages must stay within the following voltage limits when operating at steady state and dynamic loading conditions. These limits include the peak-peak ripple/noise. These shall be measured at the output connectors.

Table 20. Voltage Regulation Limits

STB

The combined output continuous power of all outputs shall not exceed 3200W (1600W from each power supply unit). Each output has a maximum and minimum current rating shown in below table. The power supply shall meet both static and dynamic voltage regulation requirements for the minimum dynamic loading conditions. The power supply shall meet only the static load voltage regulation requirements for the minimum static load conditions.

The output voltages shall remain within limits specified for the step loading and capacitive loading specified in the table below. The load transient repetition rate shall be tested between 50Hz and 5kHz at duty cycles ranging from 10%-90%. The load transient repetition rate is only a test specification. The ∆ step load may occur anywhere within the MIN load to the MAX load conditions.

Table 21. Transient Load Requirements

STB

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Intel® Server Chassis H2000 Family TPS Power Sub-System

3.3.5

Capacitive Loading

Output

Min

Max

Units

+12V

500

25,000

µF

+12V

3100

µF

3.3.6

Ripple/Noise

+12V

STB

120mVp-p

3.3.7

Grounding

Note: For dynamic condition +12V min loading is 1A.

The power supply must be stable and meet all requirements, with the following capacitive loading conditions.

Table 22. Capacitive Loading Conditions

STB

The maximum allowed ripple/noise output of the power supply is defined in below table. This is measured over a bandwidth of 10Hz to 20MHz at the power supply output connectors. A 10µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor is placed at the point of measurement.

Table 23. Ripple and Noise

The output ground of the pins of the power supply provides the output power return path. The output connector ground pins shall be connected to the safety ground (power supply enclosure). This grounding should be well designed to ensure passing the max allowed Common Mode Noise levels.

The power supply shall be provided with a reliable protective earth ground. All secondary circuits shall be connected to protective earth ground. Resistance of the ground returns to chassis shall not exceed 1.0 mΩ. This path may be used to carry DC current.

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Power Sub-System Intel® Server Chassis H2000 Family TPS

3.3.8

Closed Loop Stability

3.3.9

Residual Voltage Immunity in Standby Mode

3.3.10

Common Mode Noise

3.3.11

Soft Starting

3.3.12

Zero Load Stability Requirement

3.3.13

Hot Swap Requirement

The power supply shall be unconditionally stable under all line/load/transient load conditions including capacitive load ranges specified in section 3.3.5. A minimum of: 45 degrees phase margin and -10dB-gain margin is required. The power supply manufacturer shall provide proof of the unit’s closed-loop stability with local sensing through the submission of Bode plots. Closed-loop stability must be ensured at the maximum and minimum loads as applicable.

The power supply should be immune to any residual voltage placed on its outputs (typically a leakage voltage through the system from standby output) up to 500mV. There shall be no additional heat generated, nor stressing of any internal components with this voltage applied to any individual or all outputs simultaneously. It also should not trip the protection circuits during turn on.

The residual voltage at the power supply outputs for no load condition shall not exceed 100mV when AC voltage is applied and the PSON# signal is de-asserted.

The Common Mode noise on any output shall not exceed 350mVp-p over the frequency band of 10Hz to 20MHz.

The Power Supply shall contain control circuit which provides monotonic soft start for its outputs without overstress of the AC line or any power supply components at any specified AC line or load conditions.

When the power subsystem operates in a no load condition, it does not need to meet the output regulation specification, but it must operate without any tripping of over-voltage or other fault circuitry. When the power subsystem is subsequently loaded, it must begin to regulate and source current without fault.

1. The measurement shall be made across a 100Ω resistor between each of DC outputs, including ground at the DC power connector and chassis ground (power subsystem enclosure).

2. The test set-up shall use a FET probe such as Tektronix model P6046 or equivalent.

Hot swapping a power supply is the process of inserting and extracting a power supply from an operating power system. During this process the output voltages shall remain within the limits with the capacitive load specified. The hot swap test must be conducted when the system is operating under static, dynamic, and zero loading conditions. The power supply shall use a

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Intel® Server Chassis H2000 Family TPS Power Sub-System

3.3.14

Forced Load Sharing

3.3.15

Timing Requirement

Item

Description

Min.

Max.

Units

5.0 *

70 *

1500

3000

10.6

Delay from PSON# active to output voltages within regulation

400

100

500

latching mechanism to prevent insertion and extraction of the power supply when the AC power cord is inserted into the power supply.

The +12V output will have active load sharing. The output will share within 10% at full load. The failure of a power supply should not affect the load sharing or output voltages of the other supplies still operating. The supplies must be able to load share in parallel and operate in a hotswap/redundant 1+1 configurations. The 12VSBoutput is not required to actively share current between power supplies (passive sharing). The 12VSBoutput of the power supplies are connected together in the system so that a failure or hot swap of a redundant power supply does not cause these outputs to go out of regulation in the system.

These are the timing requirements for the power supply operation. The output voltages must rise from 10% to within regulation limits (T

) within 5 to 70ms. For 12VSB, it is allowed to

vout_rise

rise from 1.0 to 25ms. All outputs must rise monotonically. Table below shows the timing requirements for the power supply being turned on and off through the AC input, with PSON held low and the PSON signal, with the AC input applied.

vout_rise

sb_on_delay

ac_on_delay

vout_holdup

pwok_holdup

pson_on_delay

pson_pwok

pwok_on

Table 24. Timing Requirement

Output voltage rise time Delay from AC being applied to 12VSBbeing within regulation.

Delay from AC being applied to all output voltages being within regulation.

Time 12Vl output voltage stay within regulation after loss of AC.

Delay from loss of AC to de-assertion of PWOK

limits.

Delay from PSON# deactivate to PWOK being de-asserted.

Delay from output voltages within regulation limits to PWOK asserted at turn on.

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Power Sub-System Intel® Server Chassis H2000 Family TPS

Item

Description

Min.

Max.

Units

Delay from PWOK de-asserted to output voltages dropping out

Duration of PWOK being in the de-asserted state during an

100

Delay from 12VSBbeing in regulation to O/Ps being in

1000

AC Input

Vout

PWOK

12Vsb

PSON

sb_on_delay

AC_on_delay

pwok_on

vout_holdup

pwok_holdup

pson_on_delay

sb_on_delay

pwok_on

pwok_off

pson_pwok

pwok_low

sb_vout

AC turn on/off cycle

PSON turn on/off cycle

5Vsb_holdup

3.4

Power Supply Cold Redundancy Support

pwok_off

of regulation limits.

pwok_low

off/on cycle using AC or the PSON signal.

sb_vout

regulation at AC turn on.

Time the 12VSBoutput voltage stays within regulation after loss

12VSB_holdup

of AC.

Note: * The 12V

output voltage rise time shall be from 1.0ms to 25ms.

STB

Figure 12. Turn On/Off Timing (Power Supply Signals)

Power supplies that support cold redundancy can be enabled to go into a low-power state (that is, cold redundant state) in order to provide increased power usage efficiency when system loads are such that both power supplies are not needed. When the power subsystem is in Cold Redundant mode, only the needed power supply to support the best power delivery efficiency is ON. Any additional power supplies; including the redundant power supply, is in Cold

26 Revision 1.5

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Intel® Server Chassis H2000 Family TPS Power Sub-System

3.4.1

1200W CRPS Cold Redundancy

Enable (V)

percent

power (W)

Disable (V)

percent

power (W)

Cold

3.2

40.00%

480(±5%)

1.44

18.00%

432(±5%)

Standby state.

Each power supply has an additional signal that is dedicated to supporting Cold Redundancy; CR_BUS. This signal is a common bus between all power supplies in the system. CR_BUS is asserted when there is a fault in any power supply OR the power supplies output voltage falls below the Vfault threshold. Asserting the CR_BUS signal causes all power supplies in Cold Standby state to power ON.

Enabling power supplies to maintain best efficiency is achieved by looking at the Load Share bus voltage and comparing it to a programmed voltage level through a PMBus command.

Whenever there is no active power supply on the Cold Redundancy bus driving a HIGH level on the bus all power supplies are ON no matter their defined Cold Redundant roll (active or Cold Standby). This guarantees that incorrect programming of the Cold Redundancy states of the power supply will never cause the power subsystem to shut down or become over loaded. The default state of the power subsystem is all power supplies ON. There needs to be at least one power supply in Cold Redundant Active state or Standard Redundant state to allow the Cold Standby state power supplies to go into Cold Standby state.

Caution: Installing two Power Supply Units with different wattage ratings on a system is not supported. This will not provide Power Supply Redundancy and causes the system to log multiple errors.

If the output power is less than 480W (40%). the Cold redundant function will be enable. Thus you will see one PSU working normal. The second PSU will be CR mode. The Power Supply LED is green blinking.

Table 25. 1200W CRPS Cold Redundancy Threshold.

Standby 1

(02h)

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Power Sub-System Intel® Server Chassis H2000 Family TPS

3.4.2

1600W CRPS Cold Redundancy

Enable (V)

percent

power (W)

Disable (V)

percent

power (W)

Cold

3.2

40.00%

640(±5%)

1.44

18.00%

576(±5%)

3.5

Control And Indicator Functions

3.5.1

PSON# Input Signal

Signal Type

Accepts an open collector/drain input from the system. Pull-up

to VSB located in power supply.

PSON# = Low

PSON# = High or Open

OFF

MIN

MAX

Logic level low (power supply ON)

1.0V

Logic level high (power supply OFF)

2.0V

3.46V

Source current, Vpson = low

4mA

Power up delay: T

5msec

400msec

PWOK delay: T

50msec

3.5.2

PWOK(power good) Output Signal

If the output power is less than 640W (40%). the Cold redundant function will be enable. Thus you will see one PSU working normal. The second PSU will be CR mode. The Power Supply LED is green blinking.

Table 26. 1600W CRPS Cold Redundancy Threshold.

Standby 1

(02h)

The following sections define the input and output signals from the power supply. Signals that can be defined as low true use the following convention: Signal

= low true.

The PSON# signal is required to remotely turn on/off the power supply. PSON# is an active low signal that turns on the +12V power rail. When this signal is not pulled low by the system, or left open, the outputs (except the +12VSB) turn off. This signal is pulled to a standby voltage by a pull-up resistor internal to the power supply. Refer to below table for the timing diagram.

Table 27. PSON# Signal Characteristics.

pson_on_delay

pson_pwok

PWOK is a power OK signal and will be pulled HIGH by the power supply to indicate that all the outputs are within the regulation limits of the power supply. When any output voltage falls below regulation limits or when AC power has been removed for a time sufficiently long so that power supply operation is no longer guaranteed, PWOK will be de-asserted to a LOW state. See the table below for a representation of the timing characteristics of PWOK. The start of the PWOK

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Intel® Server Chassis H2000 Family TPS Power Sub-System

Signal Type

PWOK = High

Power OK

PWOK = Low

Power Not OK

MIN

MAX

Logic level low voltage, Isink=400uA

0.4V

Logic level high voltage, Isource=200µA

2.4V

3.46V

Sink current, PWOK = low

400uA

Source current, PWOK = high

2mA

PWOK delay: Tpwok_on

100ms

1000ms

PWOK rise and fall time

100µsec

Power down delay: T pwok_off

1ms

200msec

3.5.3

SMBAlert# Signal

Signal Type (Active Low)

Open collector/drain output from power supply. Pull-

up to VSB located in system.

Alert# = High

Alert# = Low

Power Alert to system

MIN

MAX

Logic level low voltage, Isink=4 mA

0 V

0.4 V

Logic level high voltage, Isink=50 µA

3.46 V

delay time shall inhibited as long as any power supply output is in current limit.

Table 28. PWOK Signal C haracteristics

This signal indicates that the power supply is experiencing a problem that the user should investigate. This shall be asserted due to Critical events or Warning events. The signal shall activate in the case of critical component temperature reached a warning threshold, general failure, over-current, over-voltage, under-voltage, failed fan. This signal may also indicate the power supply is reaching its end of life or is operating in an environment exceeding the specified limits.

This signal is to be asserted in parallel with LED turning solid Amber or blink Amber.

Table 29. SMB Alert# Si gnal Characteristics

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Power Sub-System Intel® Server Chassis H2000 Family TPS

Sink current, Alert# = low

4 mA

Sink current, Alert# = high

50 µA

Alert# rise and fall time

100 µs

3.6

Protection circuits

3.6.1

Current Limit (OCP)

Output VOLTAGE

Input voltage range

OVER CURRENT LIMITS

PSU SKU 1200W

1600W

+12V

90 – 264VAC

140A min; 170A max

180A min; 200A max

+12V

90 – 264VAC

2.5A min; 3A max

3.6.2

Over Voltage Protection (OVP)

Output Voltage

MIN (V)

MAX (V)

+12V

13.3

14.5

+12VSB

13.3

14.5

3.6.3

Over Thermal protection

Protection circuits inside the power supply shall cause only the power supply’s main outputs to shut down. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15sec and a PSON

cycle HIGH for 1sec shall be able to reset the power supply.

The power supply shall have current limit to prevent the outputs from exceeding the values shown in table below. If the current limits are exceeded the power supply shall shutdown and latch off. The latch will be cleared by toggling the PSON

signal or by an AC power interruption. The power supply shall not be damaged from repeated power cycling in this condition. 12VSB will be auto-recovered after removing OCP limit.

Table 30. Over Current Protection

STB

The power supply over voltage protection shall be locally sensed. The power supply shall shutdown and latch off after an over voltage condition occurs. This latch shall be cleared by toggling the PSON

signal or by an AC power interruption. The values are measured at the output of the power supply’s connectors. The voltage shall never exceed the maximum levels when measured at the power connectors of the power supply connector during any single point of fail. The voltage shall never trip any lower than the minimum levels when measured at the power connector. 12VSBwill be auto-recovered after removing OVP limit.

Table 31. Over Voltage Protection (OVP) Limits

The power supply will be protected against over temperature conditions caused by loss of fan

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Intel® Server Chassis H2000 Family TPS Power Sub-System

3.7 PMBus*

3.7.1

PSU Address Lines A0

cooling or excessive ambient temperature. In an OTP condition the PSU will shut down. When the power supply temperature drops to within specified limits, the power supply shall restore power automatically, while the 12VSB remains always on. The OTP circuit must have built in margin such that the power supply will not oscillate on and off due to temperature recovering condition. The OTP trip level shall have a minimum of 4°C of ambient temperature margin.

The PMBus* features are requirements for power supply unit for use in server systems. This specification is based on the PMBus* specifications part I and II, revision 1.1. The power supply device address locations are shown below:

Figure 13. Power Supply Device Address

The PMBus* from PDB is connected to BMC of all four nodes. Only one board BMC is assigned to be the master BMC and communicate with PSU as single point. Other board BMCs receive PSU data from the master BMC. In case the master BMC is down, one of the slave board BMC will be promoted automatically as master BMC and maintain the communication.

Address pins A0 is used by end use system to allocate unit address to a power supply in particular slot position.

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Power Sub-System Intel® Server Chassis H2000 Family TPS

PDB addressing Address0

Power supply PMBus* device

B0h

B2h

3.7.2

Accuracy

Output Loading

10% - 20%

> 20% - 50%

> 50% - 100%

For redundant systems there are two signals to set the address location of the power supply once it is installed in the system; Address0 and Address1. For non-redundant systems the power supply device address locations should align with the Address0/Address1 location of 0/0.

Table 32. PSU addressing

The sensor commands shall meet the following accuracy requirements. The accuracies shall be met over the specified ambient temperature and the full range of rated input voltage.

Table 33. PMBus Accuracy

READ_PIN and READ_EIN See graphs below

READ_FAN +/-500 RPM

READ_IOUT +/-5% +/-2% +/-2%

READ_TEMPERATURE +/- 3ºC

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Intel® Server Chassis H2000 Family TPS Power Sub-System

PMBus Input power monitoring ac c uracy

1000

950

900

850

800

750

700

650

600

550

500

450

400

350

300

250

200

150

100

37.5

Input power, W

Accuracy, +/- W

0.0%

1.0%

2.0%

3.0%

4.0%

5.0%

6.0%

Accuracy, +/-%

Accuracy, +/-W Accuracy, +/-%

3.8

Power Management Policy

Intel® Server System H2000

Load with 2x 1200W

supplies

Intel® Server System H2000

Load with 2x 1600W

supplies

System Power Redundancy

Mode

System behavior with one PSU AC lost or

failed

System Power Load

<1200W

<1600W

Figure 14. PMBus Monitoring Accuracy

When working with Intel® Server Board S2600JF, the BMC on each node will monitor its fans and temperature for critical failures. When there is a fan failure and a critical temperature event at the same time the node will be powered down. When this occurs the node will need to be manually powered back on.

Additionally on Intel

Server Board S2600JF/S2600WP/S2400LP, the BMC on node 3 and node 4 will monitor for a power supply over current condition or power supply over temperature condition. If either of these occur and the Shutdown Policy has been enabled then the node will be powered down. When this occurs the node will need to be manually powered back on but if the over current or over temperature event is detected again the node will be powered back off.

The following table shows the scheme of system power redundancy mode with node behavior:

Table 34. Power Management Policy

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Power Sub-System Intel® Server Chassis H2000 Family TPS

Redundant Mode

work normally.

1200W< current load < 1800W

1600W< current load < 2160W

With BIOS setting “server

>1800W

>2160W

All nodes in the system may

management - shutdown policy” set to “disable” all nodes in the system may be throttled to maintain power. This may cause lower performance.

Optimal Redundant Mode

With BIOS “ server managem e nt -shutdown policy” set to “enable” , Nodes 3 and 4 will shut down while Nodes 1 and 2 keep running without throttling. Node 1 and Node 2 will have no performance loss.

Non Redundant Mode

shutdown

The Shutdown Policy setting is only shown on Node 3 and Node 4, and is disabled by default but can be enabled or disabled in the BIOS setup Server Management page or by using the Set Shutdown Policy command.

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Intel® Server Chassis H2000 Family TPS Cooling Sub-System

4.1

Power Supply Fan

4.2

Drive Bay Population Requirement

4. Cooling Sub-System

The chassis cooling system contains the fan cooling sub-system of each node tray and common fan cooling in the power supply units. Both node fans and PSU fans work together as thermal solution to the chassis.

For each node, several components and configuration requirements make up the cooling subsystem. These include processors, chipsets, VR heatsinks, system fan module, CPU air-duct, and drive bay population. All are necessary to provide and regulate the air flow and air pressure needed to maintain the system’s thermals when operating at or below the maximum specified thermal limits.

In order to maintain the necessary airflow within the system, you must properly install the airduct, HDD dummy carrier, PSU dummy f iller and the top cover.

Each node uses a variable fan speed control engine to provide adequate cooling for the node and whole system at various ambient temperature conditions, under various server workloads, and with the least amount of acoustic noise possible. The fans operate at the lowest speed for any given condition to minimize acoustics.

Note: The server system does not support redundant cooling fans. If any of the node fans fail, you must power down the respective node as soon as possible to replace the fan.

Each power supply module supports one non-redundant dual rotor 40 mm fan. The fans control the cooling of the power supply and some drive bays. These fans are not replaceable. Therefore, if a power supply fan fails, you must replace the power supply module.

In order to maintain system thermal requirements, you must fully populate all hard drive bays. Hard drive trays used for hot-swap drives must either have a hard drive installed or not have a hard drive installed.

If only one power supply unit is used, a PSU dummy filler must be used to match the airflow requirement.

IMPORTANT: If the drive bay is missing or not fully populated, the system will not meet the thermal cooling requirements of the processor, which will most likely result in degraded performance as a result of throttling or thermal shutdown of the system. It is recommended to keep/apply the dummy plastic blocker(as shipped with HDD carrier) on any blank HDD carrier.

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Hard Disk Drive Support Intel® Server Chassis H2000 Family TPS

5.1

Hard Disk Drive Bays Scheme

5. Hard Disk Drive Support

The server system provides two SKUs to support different types of Hard Disk Drives (HDD):

 H2312xx: Supports 12x 3.5" HDD  H2216xx: Supports 16x 2.5" HDD

The server system H2000 chassis can support up to twelve carrier-mounted SATA/SAS 3.5-inch hard disk drives, or sixteen carrier-mounted SATA/SAS 2.5" hard disk drives. The drives may be “electrically” hot-swapped while the system power is applied, but you must take caution before hot-swapping while the system is functioning under operating system/application control or data may be lost.

Below are hard disk drive distribution schemes on different SKUs of H2000 chassis family.

Figure 15. HDD Scheme for H2312xx

Figure 16. HDD Scheme for H2216xx

Note: Replace the faulty drive only with one fr om the same manufacturer with the same model

and capacity.

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Intel® Server Chassis H2000 Family TPS Hard Disk Drive Support

5.2

Hard Drive Carrier

5.3

Hot-Swap Hard Drive Support

There are two types of HDD carriers for two chassis SKUs respectively:

Figure 17. 3.5" HDD Assembly Overview

Figure 18. 2.5" HDD Assembly Overview

Hot-swap drive carriers make insertion and extraction of the drive from the system very simple. Each type of drive carrier has its own latching mechanism, which is used to both insert and extract drives from the chassis and lock the carrier in place. Each type of drive carrier supports two light pipes to direct light from the drive status LEDs on the backplane to the carrier’s face allowing it to be viewable from the front of the system.

Both the Intel® Server C hassis H2312xx and H2216xx can support hot-swap SATA/SAS hard drives. Hard drives interface with the passive backplane through a blind mate connection when drives are installed into a hard drive bay using hot-swap drive carriers.

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Hard Disk Drive Support Intel® Server Chassis H2000 Family TPS

5.3.1

Backplane Feature set:

5.3.2

Backplane Block Diagram

Each compute node in the system has dedicated Hot Swap Controller (HSC) to manage three or four HDDs. There are totally four sets of independent Programmable System On Chip (PSOC) on the backplane, to function as HSC respectively to four compute nodes.

The following sections describe the feature and connections between the backplane and server board.

 Common HSBP Microcontroller Cypress* PSoC 1 part  H2312xxJR/KR: 12x SAS/SATA 3.5" HDDs at 6Gb/s SAS/SATA or slower speeds,

divided into four groups of three hot swap hard drives. Each HDD group is associated with one of the four compute nodes respectively in the 2U chassis.

 H2216xx/JR/KR: 16x SAS/SATA 2.5" HDDs at 6Gb/s SAS/SATA or slower speeds,

divided into 4 groups of four hot swap hard drives. Each HDD group is associated with one of the four compute nodes respectively in the 2U chassis.

 One SGPIO SFF-8485 interface per compute node, total of four SGPIO on the

backplane.

 Three SMB interfaces supported on the HSBP:

o SMBUS R1 - For chassis temp sensor and chassis FRU EEPROM

device.

o SMBUS R5 - Connectivity to up to two HSBP controllers and one shared

12V current monitoring device.

o SMBUS R7 - Connectivity to up to two common redundant power supply

(CRPS) module PMBus.

 Integrated front panel control connectors  Status LED and Activity LED for each hard disk drive.

 5V_AUX switcher regulator (from 12V and 12VSB) for HDD power and for compute

nodes.

 Each grouping of HDD slots has switches for 5V and 12V power, only when

corresponding compute node is plugged in and operating will power be provided to the HDDs.

 3.3V switcher regulator (from 12V) to power microcontroller, SAS/SATA re-drivers on the

bridge board and various other components.

 3.3V_AUX linear regulator (from 5V_AUX) for temp sensor, and chassis FRU EEPROM

located on the HSBP.

 Four 80-pin bridge board connectors, one per compute node.  Four compute node main power connectors, one per compute node.  Four 2x9pin power cable connections and one 2x9pin power control cable connections.

These cables are routing to two power distribution boards (PDB).

 Shared speaker for all compute nodes.

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Intel® Server Chassis H2000 Family TPS Hard Disk Drive Support

5.3.3

3.5" Hot Swap Backplane Connector scheme

SATA/SAS connectors for Node 1

SATA/SAS connectors for Node 2

SATA/SAS connectors for Node 3

SATA/SAS connectors for Node 4

Figure 19. Passive Backplane Block Diagram (for one node)

The following diagrams show the layout of major components and connectors for 3.5" Hot Swap backplane.

Revision 1.5 39

Figure 20. 3.5" Backplane Component and Connectors (Front View)

Intel order number: G59059-006

Hard Disk Drive Support Intel® Server Chassis H2000 Family TPS

20-pin Front Panel cable connector for Node 2, 4

2Blade Compute Node Power connector for Node 4

2x40 pin Bridge Board connector for Node 4

2x9 pin Power supply input connector

2x7 pin Power Control cab le c onne ctor

2Blade Compute Node Power connector for Node 3

2x40 pin Bridge Board connector for Node 3

2x40 pin Bridge Board connector for Node 1

20-pin Front Panel cable connector for Node 1, 3

2Blade Compute Node Power connector for Node 1

2x9 pin Power supply input connector

2x40 pin Bridge Board connector for Node 2

2Blade Compute Node Power connector for Node 2

5.3.4

2.5" Hot Swap Backplane Connector scheme

Figure 21. 3.5" Backplane Component and Connectors (Back View)

The following diagrams show the layout of major components and connectors for 2.5" Hot Swap backplane.

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Intel® Server Chassis H2000 Family TPS Hard Disk Drive Support

SATA/SAS connectors for Node 1

SATA/SAS connectors for Node 2

SATA/SAS connectors for Node 3

SATA/SAS connectors for Node 4

2Blade Compute Node Power connector for Node 4

2x40 pin Bridge Board connector for Node 4

2x9 pin Power supply input connector

2x7 pin Power Control cab le c onne ctor

2x9 pin Power supply input connector

2Blade Compute Node Power connector for Node 3

2x40 pin Bridge Board connector for Node 3

2x40 pin Bridge Board connector for Node 1

20-pin Front Panel cable connector for Node 1, 3

2Blade Compute Node Power connector for Node 1

2x9 pin Power supply input connector

2x40 pin Bridge Board connector for Node 2

2Blade Compute Node Power connector for Node 2

20-pin Front Panel cable connector for Node 2, 4

Figure 22. 2.5" Backplane Component and Connectors (Front View)

Figure 23. 2.5" Backplane Component and Connectors (Back View)

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Hard Disk Drive Support Intel® Server Chassis H2000 Family TPS

5.3.5

Backplane LED Support

Off

No access and no fault

Solid On

Hard Drive Fault has occurred

Blink

Raid rebuild in progress (1hz) Identify (2hz)

Condition

Drive Type

Behavior

Power on with no drive activity.

SAS

LED stays on

SATA

LED stays off

Power on with drive activity.

SAS

LED blinks off when processing a command

SATA

LED blinks off when processing a command

Power on and drive spun down.

SAS

LED stays off

SATA

LED stays off

Power on and drive spinning up.

SAS

LED blinks

SATA

LED stays off

The backplanes support both HDD online and activity/fault LEDs for each of the hard drive connectors. A light duct in HDD tray is used to conduct LED light to front panel. The following lists LED functionality.

Figure 24. Hard Drive Carrier LED

General HDD LED functionality is displayed below:

Table 35. Hard Drive Carrier Status LED Functions

Table 36. Hard Drive Carrier

Activity LED Functions

Green

Amber

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Intel® Server Chassis H2000 Family TPS Hard Disk Drive Support

5.3.6

Backplane Connector Definition

Signal Description

P12V

GND

P12V

GND

P12V

GND

P12V

GND

P12V

GND

P12V

GND

P12V

GND

P12V

GND

P12V

GND

Signal Description

Lower Blade (Circuit 1)

GND

The backplanes include several different connectors. This section defines the purpose and pin out associated with each.

1. 2x9 Pin Power Input Connector The backplane is powered by +12V and +12V

distributed by backplane to all four nodes.

Table 37. Backplane Input Power Connector Pin-out

from PDB of CRPS. The input power is

STB

2. 2-Blade Compute Node Power Connector The backplane provides main power to compute node through 2-Blade power connector.

Table 38. 2-Blade Compute Node Power Connector Pin-out

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Hard Disk Drive Support Intel® Server Chassis H2000 Family TPS

GND

Upper Blade (Circuit 2)

P12V

Signal Description

5V_AUX

SATA0_TXN

USB2_OC

SATA0_TXP

GND

SATA0_RXN

NODE_Present_N (GND)

SATA0_RXP

ALL_NODE_OFF

GND

spare

USB2_P0P

GND

USB2_P0N

IPMB-Data

GND

IPMB-Clk

FP HDD_ACT_LED_N

GND

FP Activity LED_N

SMBUS_R1 DATA

FP Health LEDA_N

3. 2x40 Pin Bridge Board Connector The Compute Node provides four SATA/SAS ports (in SCU0) to backplane, together with front

panel control signals and SMBus.

Table 39. 2x40 Pin Connector Pin-out for Node Bridge Board

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Intel® Server Chassis H2000 Family TPS Hard Disk Drive Support

Signal Description

SMBUS_R1 CLK

FP Health LEDG_N

GND

FP PWR LED_N

SMBUS_R5 DATA

FP ID LED_N

SMBUS_R5 CLK

FP ID BTN_N

GND

FP RST BTN_N

SMBUS_R7 DATA

FP PWR BTN_N

SMBUS_R7 CLK

FP NMI BTN_N

GND

SPA_SOUT_N

PMBUS Alert_N

SPA_SIN_N

NODEx_ON_N

ID3

SGPIO DATA IN

ID2

SGPIO Data Out

ID1

SGPIO LD

ID0

SPKR

SGPIO CLK

GND

SAS3_RX

SAS3_TX

SAS3_RX

SAS3_TX

GND

SAS2_TX

SAS2_RX

SAS2_TX

SAS2_RX

GND

SAS1_RX

SAS1_TX

SAS1_RX

SAS1_TX

GND

SAS0_TX

SAS0_RX

SAS0_TX

SAS0_RX

GND

3.3V

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Hard Disk Drive Support Intel® Server Chassis H2000 Family TPS

Signal Description

GND

FP1_PWR_BTN_N

FP1_RST_BTN_N

FP1_ID_BTN_N

P5VSB

FP1_PWR_LED_N

FP1_HEALTH_LEDG_N

FP1_HEALTH_LEDA_N

FP1_ACTIVITY_LED_N

FP1_ID_LED_N

GND

FP2_PWR_BTN_N

FP2_RST_BTN_N

FP2_ID_BTN_N

P3V3SB

FP2_PWR_LED_N

FP2_HEALTH_LEDG_N

FP2_HEALTH_LEDA_N

FP2_ACTIVITY_LED_N

FP2_ID_LED_N

4. 20-Pin Front Panel Connector The backplanes provide connectors for front panel control signals. Each connector integrates

the control signals of two compute nodes.

Table 40. Front Panel Connector Pin-out

5. 2x7 Pin Power Supply Control Signal Connector The backplanes provide power supply control signals, together with PMBus

functionality integrated.

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Intel® Server Chassis H2000 Family TPS Hard Disk Drive Support

Signal Description

SMBUS_R7_DATA

SMBUS_R7_CLK

PSON_N

PMBUS_ALERT_N

12V RS_RTN

PWROK

12V RS

Reserved

PDU1-12VSB

PDU2-12VSB

Reserved

Table 41. Power Supply Control Connector Pin-out

Revision 1.5 47

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Intel® Server Chassis H2000 Family TPS Front Panel Control and Indicators

System Power Button with LED

System ID LED Button

System Status LED

Network Link/Activity LED

6. Front Panel Control and Indicators

The Intel® Server Chassis H2000 family Front Control Panel is integrated with rack handles at the both sides of the chassis. Each control panel contains two sets of node control buttons and status LEDs. The control panel assembly is pre-assembled and fixed with the rack handles.

48 Revision 1.5

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Front Panel Control and Indicators Intel® Server Chassis H2000 Family TPS

6.1

Control Panel Button

6.2

Control Panel LED Indicators

LED Indicator

Color

Condition

What it describes

Power

Green

Power On/ACPI S0 state

Green

Blink

Sleep/ACPI S1 state

Off

Power Off /ACPI S5 state

LAN (i350 Dual NIC)

Green

Blink

LAN Activity

Off

No Link/Activity

System Status

Green

System Ready/No Alarm

Green

Blink

System ready, but degraded: redundancy lost such Amber

Critical Alarm: Critical power modules failure, critical

Amber

Blink

Non-Critical Alarm: Redundant fan failure, redundant

Off

Power off: System unplugged

Feature

Function

Toggles the system power on/off. This button also integrates the power LED.

Figure 25. Front Control Panel

The following table lists the control panel features and functions. The control panels features a system power button.

Table 42. Front Control Button Function

Power Button with Power LED System ID Button with ID LED Toggles between ID LED on and off

The control panel houses independent two LEDs and two button integrated LEDs for each node, which are viewable to display the system’s operating status. The following table identifies each LED and describes their functionality.

Table 43. Front LED Indicator Functions

as the power supply or fan failure; non-critical temp/voltage threshold; battery failure; or predictive power supply failure.

fans failure, voltage (power supply), critical temperature and voltage

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power module failure, non-critical temperature and voltage

Power on: System powered off and in standby, no prior degraded\non-critical\critical stat e

Intel® Server Chassis H2000 Family TPS Front Panel Control and Indicators

6.2.1

Power/Sleep LED

6.2.2

System Status LED

Color

State

Criticality

Description

Off

N/A

Not ready

Power off or BMC initialization completes if no degraded, non-

Green/

Both Solid

Not ready

Pre DC Power On – 15-20 second BMC Initialization when AC is Green

Solid on

System ready

State

Power Mode

LED

Description

Power Off

Non-ACPI

Off

System power is off and the BIOS has not initialized the chipset.

Power On

Non-ACPI

Solid On

System power is on but the BIOS has not yet initialized the chipset.

ACPI

Off

Mechanical is off and the operating system has not saved any context to the hard disk.

S1 Sleep

ACPI

Blink

DC power is still on. The operating system has saved context and gone into a level of low-power state.

ACPI

Solid On

System and the operating system are up and running.

Notes:

1. Blink rate is ~1 Hz at 50% duty cycle.

2. It is also off when the system is powered off (S5) or in a sleep state (S1).

3. The power LED sleep indication is maintained on standby by the chipset. If the system is powered down without going through the BIOS, the LED state in effect at the time of power off is restored when the system is powered on until the BIOS clear it.

4. If the system is not powered down normally, it is possible the Power LED will blink at the same ti me the system status LED is off due to a failure or configuration change that prevents the BIOS from running.

Table 44. Power LED Operation

Note: Blink rate is ~ 1Hz at 50% duty cycle.

Table 45. System Status LED Operation

critical, critical, or non-recover able conditions exist after power cable plug in.

Amber

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applied to the server. The system will not POST until BMC initialization completes.

Front Panel Control and Indicators Intel® Server Chassis H2000 Family TPS

Color

State

Criticality

Description

Green

Blink

Degraded

BIOS detected

Amber

Blink

Non-critical

Non-fatal alarm – system is likely to fail

Amber

Solid on

Critical, non-

Fatal alarm – system has failed or shutdown

1. Unable to use all of the installed memory (more than one DIMM installed).

2. In a mirrored configuration, when memory mirroring takes place and system loses memory re d undan cy . This is not cov ered b y

(2).

3. PCI Express* correctable link errors.

4. Integrated BMC detected

5. One of redundant power supplies not present.

6. CPU disabled – if there are two CPUs and one CPU is disabled.

7. Fan alarm – Fan failure. Number of operational fans should be more than minimum number needed to cool the system.

8. Non-critical threshold crossed – Temperature, voltage, power nozzle, power gauge, and PROCHOT2 (Therm Ctrl) sensors.

9. Battery failure.

10. Predictive failure when the system has redundant power supplies.

BIOS Detected

1. In non-mirroring mode, if the threshold of ten correctable errors is crossed within the window.

2. PCI Express* uncorrectable link errors.

Integrated BMC Detected

1. Critical threshold crossed – Voltage, temperature, power nozzle, power gauge, and PROCHOT (Therm Ctrl) sensors.

2. VRD Hot asserted.

3. One of the redundant power supplies failed.

4. Minimum number of fans to cool the system are not present or have failed.

Notes:

1. The BIOS detects these conditions and sends a Set Fault Indication command to the Integrated BMC to provide the contribution to the system status LED.

2. Blink rate is ~ 1Hz at 50% duty cycle.

Revision 1.5 51

recoverable

BIOS Detected

1. DIMM failure when there is one DIMM present and no good memory is present.

2. Run-time memory uncorrectable error in non-redundant mode.1

3. CPU configuration error (for instance, processor stepping mismatch).

Integrated BMC Detected

11. CPU CATERR signal asserted.

12. CPU 1 is missing.

13. CPU THERMTRIP.

14. System cooling fan failure.

15. No power good – redundant power fault.  Power Unit Redundancy sensor – Insufficient resources

offset (indicates not enough power supplies are present).

Intel order number: G59059-006

Intel® Server Chassis H2000 Family TPS Front Panel Control and Indicators

6.2.3

System Status LED – BMC Initialization

When power is first applied to the system and 5V-STBY is present, the BMC controller on the server board requires 15-20 seconds to initialize. During this time, the system status LED will be solid on, both amber and green. Once BMC initialization has completed, the status LED will stay green solid on. If power button is pressed before BMC initialization completes, the system will not boot to POST.

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Intel® Server Chassis H2000 Family TPS Appendix A: Integration and Usage Tips

Appendix A: Integration and Usage Tips

Before attempting to integrate and configure your system, you should reference this section, which provides a list of useful information.

 Remove dummy tray cover before install node tray.  Install dummy tray cover when respective node tray is plugged out.  System fans in node trays are not hot-swappable.  You must use the CPU/memory air-duct to maintain system thermals.  To maintain system thermals, you must populate all hard drive bays with either a hard

drive or drive blank.

 You must remove AC power from the system prior to opening the chassis for service

You can download the latest system documentation, drivers, and system software from the

Intel

Support website at http://www.intel.com/p/en_US/support/highlights/server/H2000JF.

Revision 1.5

Intel order number: G59059-006

Intel® Server Chassis H2000 Family TPS Glossary

Term

Definition

ACPI

Advanced Configuration and Power Interface

Application Processor

APIC

Advanced Programmable Interrupt Control

ASIC

Application Specific Integrated Circuit

ASMI

Advanced Server Management Interface

BIOS

Basic Input/Output System

BIST

Built-In Self Test

BMC

Baseboard Management Controller

Bridge

Circuitry connecting one computer bus to another, allowing an agent on one to access the other

BSP

Bootstrap Processor

Byte

8-bit quantity.

CBC

Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they CEK

Common Enabling Kit

CHAP

Challenge Handshake Authentication Protocol

CMOS

In terms of this specification, this describ es the PC-AT compatible region of battery-backed 128 bytes DPC

Direct Platform Control

EEPROM

Electrically Erasable Programmable Read-Only Memory

EHCI

Enhanced Host Controller Interface

EMP

Emergency Management Port

EPS

External Product Specification

ESB2-E

Enterprise South Bridge 2

FBD

Fully Buffered DIMM

FMB

Flexible Mother Board

FRB

Fault Resilient Booting

FRU

Field Replaceable Unit

FSB

Front Side Bus

1024MB

GPIO

General Purpose I/O

GTL

Gunning Transceiver Logic

HSC

Hot-Swap Controller

Hertz (1 cycle/second)

I2C

Inter-Integrated Circuit Bus

Intel® Architecture

IBF

Input Buffer

ICH

I/O Controller Hub

ICMB

Intelligent Chassis Management Bus

IERR

Internal Error

IFB

I/O and Firmware Bridge

INTR

Interrupt

Glossary

bridge the IPMB buses of multiple chassis.)

of memory, which normally resides on the server board

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Glossary Intel® Server Chassis H2000 Family TPS

Term

Definition

Internet Protocol

IPMB

Intelligent Platform Management Bus

IPMI

Intelligent Platform Management Interface

Infrared

ITP

In-Target Probe

1024 bytes

KCS

Keyboard Controller Style

LAN

Local Area Network

LCD

Liquid Crystal Display

LED

Light Emitting Diode

LPC

Low Pin Count

LUN

Logical Unit Number

MAC

Media Access Control

1024KB

MCH

Memory Controller Hub

MD2

Message Digest 2 – Hashing Algorithm

MD5

Message Digest 5 – Hashing Algorithm – Higher Security

milliseconds

MTTR

Memory Type Range Register

Mux

Multiplexor

NIC

Network Interface Controller

NMI

Non-maskable Interrupt

OBF

Output Buffer

OEM

Original Equipment Manufacturer

Ohm

Unit of electrical resistance

PEF

Platform Event Filtering

PEP

Platform Event Paging

PIA

Platform Information Area (This feature configures the firmware for the platform hardware.)

PLD

Programmable Logic Device

PMI

Platform Management Interrupt

POST

Power-On Self Test

PSMI

Power Supply Management Interface

PWM

Pulse-Width Modulation

RAM

Random Access Memory

RASUM

Reliability, Availability, Serviceability, Usability, and Manageability

RISC

Reduced Instruction Set Computing

RMM4

Remote Management Module – 4th generation

RMM4 NIC

Remote Management Module – 4th generation dedicated management NIC

ROM

Read Only Memory

RTC

Real-Time Clock (Component of ICH peripheral chip on the server board.)

SDR

Sensor Data Record

SECC

Single Edge Connector Cartridge

Revision 1.5

Intel order number: G59059-006

Intel® Server Chassis H2000 Family TPS Glossary

Term

Definition

SEEPROM

Serial Electrically Erasable Programmable Read-Only Memory

SEL

System Event Log

SIO

Server Input/Output

SMI

Server Management Interrupt (SMI is the highest priority non-maskable interrupt.)

SMM

Server Management Mode

SMS

Server Management Software

SNMP

Simple Network Management Protocol

SSI

Server System Infrastructure

TBD

To Be Determined

TIM

Thermal Interface Material

UART

Universal Asynchronous Receiver/Transmitter

UDP

User Datagram Protocol

UHCI

Universal Host Controller Interface

UTC

Universal time coordinate

VID

Voltage Identification

VRD

Voltage Regulator Down

Word

16-bit quantity

ZIF

Zero Insertion Force

56 Revision 1.5

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Reference Documents Intel® Server Chassis H2000 Family TPS

Reference Documents

Refer to the following documents for additional information:

 Intel

Server Board S2600JF Technical Product Specification (Intel® Order Code:

G31608)

 Intel

Server System H2000JF Technical Product Specification (Intel® Order Code:

G39462)

 Intel

Server Board S2600WP Technical Product Specification (Intel® Order Code:

G44057)

 Intel

Server System S2000WP Technical Product Specification (Intel® Order Code:

52418)

 Intel

Server Board S2400LP Technical Product Specification (Intel® Order Code:

G52803)

 Intel

Server System S2400LP Technical Product Specification (Intel® Order Code:

G59328)

 ACPI 3.0: http://www.acpi.info/spec.htm  IPMI 2.0  Data Center Management Interface Specification v1.0, May 1, 2008:

www.intel.com/go/dcmi

 PCI Bus Power Management Interface Specification 1.1: http://www.pcisig.com/  PCI Express* Base Specification Rev 2.0 Dec 06: http://www.pcisig.com/  PCI Express* Card Electromechanical Specification Rev 2.0: http://www.pcisig.com/  PMBus*: http://pmbus.org  SATA 2.6: http://www.sata-io.org/  SMBIOS 2.4  SSI-EEB 3.0: http://www.ssiforum.org  USB 1.1: http://www.usb.org  USB 2.0: http://www.usb.org  Windows Logo/SDG 3.0  Intel

Dynami c Power Technology Node Manager 1.5 External Interface

Specification using IPMI, 2007. Intel Corporation.

 Node Power and Thermal Management Architecture Specification v1.5, rev.0.79.

2007, Intel Corporation.

 Intel

Server System Integrated Baseboard Management Controller Core External

Product Specification, 2007 Intel Corporation.

 Intel

Revision 1.5

Thurley Server Platform Services IPMI Commands Specification, 2007. Intel

Intel order number: G59059-006

Intel® Server Chassis H2000 Family TPS Reference Documents

Corporation.

 Intel

Server Safety and Regulatory, 2011. Intel Corporation. (Intel Order Code:

G23122)

 Intelligent Platform Management Bus Communications Protocol Specification,

Version 1.0, 1998. Intel Corporation, Hewlett-Packard* Company, NEC* Corporation,

Dell* Computer Corporation.

 Platform Environmental Control Interface (PECI) Specification, Version 2.0. Intel

Corporation.

 Platform Management FRU Information Storage Definition, Version 1.0, Revision 1.2,

2002. Intel Corporation, Hewlett-Packard* Com pany, NEC* Corporation, Dell*

Computer Corporation: http://developer.intel.com/design/servers/ipmi/spec.htm

58 Revision 1.5

Intel order number: G59059-006

Intel H2000 Technical Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual

Chapter Outline

1. Introduction

Server Board Use Disclaimer

2. Product Overview

Chassis Views

Chassis Dimensions

System Level Environmental Limits

Chassis Parts

Hard Drive and Peripheral Bays

Front Bezel Support

Rack and Cabinet Mounting Options

Mechanical Overview

AC Power Supply Unit Dimension Overview

3. Power Sub-System

AC Power Supply Unit General Data

AC input connector

AC Power Cord Specification Requirements

Power Supply Unit DC Output Connector

Handle Retention

LED Marking and Identification

Power Cage with Power Distribution Board

Power Cage Output Pin Assignment

AC Input Specification

Input Voltage And Frequency

AC input Power Factor

Efficiency

AC Line Fuse

AC Line Inrush

AC Line Dropout/Holdup

AC Line Fast Transient (EFT) Specification

Hot Plug

Susceptability Requirements

Electrostatic Discharge Susceptibility

Fast Transient/Burst

Radiated Immunity

Surge Immunity

AC Line Transient Specification

Power Recovery

Voltage Interruptions

AC Line Isolation

AC Power Inlet

DC Ouput Specification

Output Power/Currents

Standby Output

Voltage Regulation

Dynamic Loading

Capacitive Loading

Ripple/Noise

Grounding

Closed Loop Stability

Residual Voltage Immunity in Standby Mode

Common Mode Noise

Soft Starting

Zero Load Stability Requirement

Hot Swap Requirement

Forced Load Sharing

Timing Requirement

Power Supply Cold Redundancy Support

1200W CRPS Cold Redundancy

1600W CRPS Cold Redundancy

Control And Indicator Functions

PSON# Input Signal

PWOK(power good) Output Signal

SMBAlert# Signal

Protection circuits

Current Limit (OCP)

Over Voltage Protection (OVP)

Over Thermal protection

3.7 PMBus*

PSU Address Lines A0

Accuracy

Power Management Policy

Power Supply Fan

Drive Bay Population Requirement

4. Cooling Sub-System

Hard Disk Drive Bays Scheme