Intel Core i7-2600, Core i7-2700K, Core i5-2550K, Core i5-2500K, Core i5-2500S Datasheet

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Page 1

2nd Generation Intel® Core™ Processor Family Desktop, Intel

Pentium

Processor Family Desktop,

and Intel

Celeron® Processor

Family Desktop

Datasheet, Volume 1

Supporting Intel® Core™ i7, i5, and i3 Desktop Processor Series

Supporting Intel Supporting Intel

This is Volume 1 of 2

June 2013

Pentium® Processor G800 and G600 Series

Celeron® Processor G500 and G400 Series

Document Number: 324641-008

Page 2

Legal Lines and Disclaimers

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

All products, platforms, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. All dates specified are target dates, are provided for planning purposes only and are subject to change.

No computer system can provide absolute security under all conditions. Intel a computer system with Intel Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor, an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing Group and specific software for some uses. For more information, see http://www.intel.com/technology/security/

Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor

Intel (VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Active Management Technology requires the computer system to have an Intel(R) AMT-enabled chipset, network hardware

Intel and software, as well as connection with a power source and a corporate network connection. Setup requires configuration by the purchaser and may require scripting with the management console or further integration into existing security frameworks to enable certain functionality. It may also require modifications of implementation of new business processes. With regard to notebooks, Intel AMT may not be available or certain capabilities may be limited over a host OS-based VPN or when connecting wirelessly, on battery power, sleeping, hibernating or powered off. For more information, see http://www.intel.com/technology/

Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code

Trusted Execution Technology (Intel® TXT) requires

platform-technology/intel-amt/

Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technologyenabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see htp://www.intel.com/info/hyperthreading.

Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost

“Intel Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see http://www.intel.com/

technology/turboboost.”

Enhanced Intel

SpeedStep® Technology See the Processor Spec Finder or contact your Intel representative for more information.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel

64 architecture. Performance will vary depending on your hardware and software

configurations. Consult with your system vendor for more information.

Code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user.

Intel, Intel Core, Celeron, Pentium, Speedstep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

2 Datasheet, Volume 1

Page 3

1Introduction..............................................................................................................9

1.1 Processor Feature Details ................................................................................... 11

1.1.1 Supported Technologies .......................................................................... 11

1.2 Interfaces ........................................................................................................ 11

1.2.1 System Memory Support ......................................................................... 11

1.2.2 PCI Express* ......................................................................................... 12

1.2.3 Direct Media Interface (DMI).................................................................... 13

1.2.4 Platform Environment Control Interface (PECI)........................................... 14

1.2.5 Processor Graphics ................................................................................. 14

1.2.6 Intel

1.3 Power Management Support ............................................................................... 15

1.3.1 Processor Core....................................................................................... 15

1.3.2 System ................................................................................................. 15

1.3.3 Memory Controller.................................................................................. 15

1.3.4 PCI Express* ......................................................................................... 15

1.3.5 Direct Media Interface (DMI).................................................................... 15

1.3.6 Processor Graphics Controller................................................................... 15

1.4 Thermal Management Support ............................................................................ 15

1.5 Package ........................................................................................................... 16

1.6 Terminology ..................................................................................................... 16

1.7 Related Documents ........................................................................................... 18

2Interfaces................................................................................................................ 19

2.1 System Memory Interface .................................................................................. 19

2.1.1 System Memory Technology Supported ..................................................... 19

2.1.2 System Memory Timing Support............................................................... 21

2.1.3 System Memory Organization Modes......................................................... 21

2.1.4 Rules for Populating Memory Slots............................................................ 22

2.1.5 Technology Enhancements of Intel

2.1.6 Memory Type Range Registers (MTRRs) Enhancement................................. 23

2.1.7 Data Scrambling .................................................................................... 23

2.2 PCI Express* Interface....................................................................................... 24

2.2.1 PCI Express* Architecture ....................................................................... 24

2.2.2 PCI Express* Configuration Mechanism ..................................................... 26

2.2.3 PCI Express* Port................................................................................... 26

2.2.4 PCI Express* Lanes Connection................................................................ 27

2.3 Direct Media Interface (DMI)............................................................................... 27

2.3.1 DMI Error Flow....................................................................................... 27

2.3.2 Processor / PCH Compatibility Assumptions................................................ 27

2.3.3 DMI Link Down ...................................................................................... 28

2.4 Processor Graphics Controller (GT) ...................................................................... 28

2.4.1 3D and Video Engines for Graphics Processing............................................ 29

Flexible Display Interface (Intel® FDI) ............................................. 14

2.1.3.1 Single-Channel Mode................................................................. 21

2.1.3.2 Dual-Channel Mode – Intel

2.1.5.1 Just-in-Time Command Scheduling.............................................. 23

2.1.5.2 Command Overlap .................................................................... 23

2.1.5.3 Out-of-Order Scheduling............................................................ 23

2.2.1.1 Transaction Layer ..................................................................... 25

2.2.1.2 Data Link Layer ........................................................................ 25

2.2.1.3 Physical Layer .......................................................................... 25

2.4.1.1 3D Engine Execution Units ......................................................... 29

Flex Memory Technology Mode ........... 21

Fast Memory Access (Intel® FMA).......... 23

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2.4.1.2 3D Pipeline...............................................................................29

2.4.1.3 Video Engine ............................................................................30

2.4.1.4 2D Engine ................................................................................30

2.4.2 Processor Graphics Display ......................................................................31

2.4.2.1 Display Planes ..........................................................................31

2.4.2.2 Display Pipes ............................................................................32

2.4.2.3 Display Ports ............................................................................32

2.4.3 Intel

Flexible Display Interface (Intel® FDI) .............................................32

2.4.4 Multi-Graphics Controller Multi-Monitor Support ..........................................32

2.5 Platform Environment Control Interface (PECI) ......................................................33

2.6 Interface Clocking..............................................................................................33

2.6.1 Internal Clocking Requirements ................................................................33

3 Technologies............................................................................................................35

3.1 Intel® Virtualization Technology (Intel® VT) ..........................................................35

3.1.1 Intel® Virtualization Technology (Intel® VT) for

3.1.2 Intel® Virtualization Technology (Intel® VT) for

3.1.3 Intel

3.1.4 Intel

3.1.5 Intel

3.2 Intel

IA-32, Intel (Intel

I/O (Intel

Trusted Execution Technology (Intel® TXT) .................................................38

Virtualization Technology (Intel® VT) for Directed

64 and Intel® Architecture

VT-x) Objectives..........................................................................35

64 and Intel® Architecture

VT-x) Features ............................................................................36

VT-d) Objectives ....................................................................36

VT-d) Features.......................................................................37

VT-d) Features Not Supported..................................................37

3.3 Intel® Hyper-Threading Technology (Intel® HT Technology) ....................................38

3.4 Intel® Turbo Boost Technology ............................................................................39

3.4.1 Intel

Turbo Boost Technology Frequency..................................................39

3.4.2 Intel® Turbo Boost Technology Graphics Frequency.....................................39

3.5 Intel® Advanced Vector Extensions (Intel® AVX)....................................................40

3.6 Intel

Advanced Encryption Standard New Instructions (Intel® AES-NI) ...................40

3.6.1 PCLMULQDQ Instruction ..........................................................................40

3.7 Intel® 64 Architecture x2APIC .............................................................................40

4 Power Management .................................................................................................43

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................44

4.1.1 System States........................................................................................44

4.1.2 Processor Core / Package Idle States.........................................................44

4.1.3 Integrated Memory Controller States.........................................................44

4.1.4 PCI Express* Link States .........................................................................44

4.1.5 Direct Media Interface (DMI) States ..........................................................45

4.1.6 Processor Graphics Controller States .........................................................45

4.1.7 Interface State Combinations ...................................................................45

4.2 Processor Core Power Management......................................................................46

4.2.1 Enhanced Intel

SpeedStep® Technology ..................................................46

4.2.2 Low-Power Idle States.............................................................................46

4.2.3 Requesting Low-Power Idle States ............................................................48

4.2.4 Core C-states .........................................................................................48

4.2.4.1 Core C0 State ...........................................................................48

4.2.4.2 Core C1/C1E State ....................................................................49

4.2.4.3 Core C3 State ...........................................................................49

4.2.4.4 Core C6 State ...........................................................................49

4.2.4.5 C-State Auto-Demotion..............................................................49

4.2.5 Package C-States ...................................................................................50

4 Datasheet, Volume 1

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4.2.5.1 Package C0.............................................................................. 51

4.2.5.2 Package C1/C1E ....................................................................... 51

4.2.5.3 Package C3 State...................................................................... 52

4.2.5.4 Package C6 State...................................................................... 52

4.3 Integrated Memory Controller (IMC) Power Management ........................................ 52

4.3.1 Disabling Unused System Memory Outputs ................................................ 52

4.3.2 DRAM Power Management and Initialization............................................... 53

4.3.2.1 Initialization Role of CKE............................................................ 54

4.3.2.2 Conditional Self-Refresh ............................................................ 54

4.3.2.3 Dynamic Power-down Operation ................................................. 55

4.3.2.4 DRAM I/O Power Management.................................................... 55

4.4 PCI Express* Power Management ........................................................................ 55

4.5 Direct Media Interface (DMI) Power Management .................................................. 55

4.6 Graphics Power Management .............................................................................. 56

4.6.1 Intel® Rapid Memory Power Management (Intel® RMPM)

(also known as CxSR) ............................................................................. 56

4.6.2 Intel

4.6.3 Graphics Render C-State ......................................................................... 56

4.6.4 Intel

Graphics Performance Modulation Technology (Intel® GPMT) .............. 56

Smart 2D Display Technology (Intel® S2DDT) .................................. 56

4.6.5 Intel® Graphics Dynamic Frequency.......................................................... 57

4.7 Thermal Power Management............................................................................... 57

5 Thermal Management.............................................................................................. 59

6 Signal Description ................................................................................................... 61

6.1 System Memory Interface Signals........................................................................ 62

6.2 Memory Reference and Compensation Signals ....................................................... 63

6.3 Reset and Miscellaneous Signals.......................................................................... 64

6.4 PCI Express*-Based Interface Signals .................................................................. 65

6.5 Intel® Flexible Display Interface (Intel® FDI) Signals ............................................. 65

6.6 Direct Media Interface (DMI) Signals.................................................................... 66

6.7 Phase Lock Loop (PLL) Signals ............................................................................ 66

6.8 Test Access Points (TAP) Signals ......................................................................... 66

6.9 Error and Thermal Protection Signals ................................................................... 67

6.10 Power Sequencing Signals .................................................................................. 67

6.11 Processor Power Signals..................................................................................... 68

6.12 Sense Signals ................................................................................................... 68

6.13 Ground and Non-Critical to Function (NCTF) Signals............................................... 68

6.14 Processor Internal Pull-Up / Pull-Down Resistors.................................................... 69

7 Electrical Specifications........................................................................................... 71

7.1 Power and Ground Lands.................................................................................... 71

7.2 Decoupling Guidelines........................................................................................ 71

7.2.1 Voltage Rail Decoupling........................................................................... 71

7.3 Processor Clocking (BCLK[0], BCLK#[0]).............................................................. 72

7.3.1 Phase Lock Loop (PLL) Power Supply......................................................... 72

7.4 V

Voltage Identification (VID) .......................................................................... 72

7.5 System Agent (SA) VCC VID............................................................................... 76

7.6 Reserved or Unused Signals................................................................................ 76

7.7 Signal Groups ................................................................................................... 77

7.8 Test Access Port (TAP) Connection....................................................................... 78

7.9 Storage Conditions Specifications ........................................................................ 79

7.10 DC Specifications .............................................................................................. 80

7.10.1 Voltage and Current Specifications............................................................ 80

7.11 Platform Environmental Control Interface (PECI) DC Specifications........................... 86

7.11.1 PECI Bus Architecture ............................................................................. 86

7.11.2 DC Characteristics .................................................................................. 87

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7.11.3 Input Device Hysteresis...........................................................................87

8 Processor Pin and Signal Information ......................................................................89

8.1 Processor Pin Assignments..................................................................................89

9 DDR Data Swizzling................................................................................................109

Figures

1-1 Desktop Platform System Block Diagram Example .......................................................10

2-1 Intel® Flex Memory Technology Operation..................................................................22

2-2 PCI Express* Layering Diagram.................................................................................24

2-3 Packet Flow through the Layers.................................................................................25

2-4 PCI Express* Related Register Structures in the Processor............................................26

2-5 PCI Express* Typical Operation 16 lanes Mapping........................................................27

2-6 Processor Graphics Controller Unit Block Diagram ........................................................28

2-7 Processor Display Block Diagram ...............................................................................31

4-1 Power States ..........................................................................................................43

4-2 Idle Power Management Breakdown of the Processor Cores ..........................................47

4-3 Thread and Core C-State Entry and Exit .....................................................................47

4-4 Package C-State Entry and Exit.................................................................................51

7-1 Example for PECI Host-clients Connection...................................................................86

7-2 Input Device Hysteresis ...........................................................................................87

8-1 Socket Pinmap (Top View, Upper-Left Quadrant) .........................................................90

8-2 Socket Pinmap (Top View, Upper-Right Quadrant) .......................................................91

8-3 Socket Pinmap (Top View, Lower-Left Quadrant) .........................................................92

8-4 Socket Pinmap (Top View, Lower-Right Quadrant) .......................................................93

Tables

1-1 PCI Express* Supported Configurations in Desktop Products .........................................12

1-2 Terminology ...........................................................................................................16

1-3 Related Documents .................................................................................................18

2-1 Supported UDIMM Module Configurations ...................................................................20

2-2 Supported SO-DIMM Module Configurations (AIO Only) ................................................20

2-3 DDR3 System Memory Timing Support.......................................................................21

2-4 Reference Clock ......................................................................................................33

4-1 System States ........................................................................................................44

4-2 Processor Core / Package State Support.....................................................................44

4-3 Integrated Memory Controller States .........................................................................44

4-4 PCI Express* Link States..........................................................................................44

4-5 Direct Media Interface (DMI) States...........................................................................45

4-6 Processor Graphics Controller States..........................................................................45

4-7 G, S, and C State Combinations ................................................................................45

4-8 Coordination of Thread Power States at the Core Level.................................................47

4-9 P_LVLx to MWAIT Conversion....................................................................................48

4-10 Coordination of Core Power States at the Package Level ...............................................50

6-1 Signal Description Buffer Types.................................................................................61

6-2 Memory Channel A Signals .......................................................................................62

6-3 Memory Channel B Signals .......................................................................................63

6-4 Memory Reference and Compensation........................................................................63

6-5 Reset and Miscellaneous Signals................................................................................64

6-6 PCI Express* Graphics Interface Signals.....................................................................65

6-7 Intel

6-8 Direct Media Interface (DMI) Signals – Processor to PCH Serial Interface ........................66

6-9 Phase Lock Loop (PLL) Signals ..................................................................................66

6-10 Test Access Points (TAP) Signals ...............................................................................66

Flexible Display Interface (Intel® FDI) ..............................................................65

6 Datasheet, Volume 1

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6-11 Error and Thermal Protection Signals......................................................................... 67

6-12 Power Sequencing Signals........................................................................................ 67

6-13 Processor Power Signals .......................................................................................... 68

6-14 Sense Signals......................................................................................................... 68

6-15 Ground and Non-Critical to Function (NCTF) Signals .................................................... 68

6-16 Processor Internal Pull-Up / Pull-Down Resistors ......................................................... 69

7-1 VR 12.0 Voltage Identification Definition .................................................................... 73

7-2 VCCSA_VID configuration ........................................................................................ 76

7-3 Signal Groups 1...................................................................................................... 77

7-4 Storage Condition Ratings........................................................................................ 79

7-5 Processor Core Active and Idle Mode DC Voltage and Current Specifications.................... 80

7-6 Processor System Agent I/O Buffer Supply DC Voltage and Current Specifications ........... 82

7-7 Processor Graphics VID based (V

) Supply DC Voltage and Current Specifications ........ 83

AXG

7-8 DDR3 Signal Group DC Specifications ........................................................................ 84

7-9 Control Sideband and TAP Signal Group DC Specifications ............................................ 85

7-10 PCI Express* DC Specifications................................................................................. 85

7-11 PECI DC Electrical Limits.......................................................................................... 87

8-1 Processor Pin List by Pin Name ................................................................................. 94

9-1 DDR Data Swizzling Table – Channel A .................................................................... 110

9-2 DDR Data Swizzling Table – Channel B .................................................................... 111

Datasheet, Volume 1 7

Page 8

Revision History

Revision

Number

001 Initial release

•Added Intel® Core™ i5-2405S, i5-2310, and i3-2105 processors

002

•Added Intel Pentium

•Added Intel® Core™ i5-2320, i3-2125, i3-2130, and i3-2120T processors

003

•Added Intel G540, G530, G530T, and G440 processors

•Added Intel

004

005

006

007

008

•Added Intel® Core™ i7-2700K processor

•Added Intel® Celeron® G460 processor

•Added Intel® Core™ i5-2550K, i5-2450P, i5-2380P processors

•Added Intel® Pentium® G645, G645T processors

•Added Intel

•Added Intel® Celeron® G470 processors

Description

Pentium® processor family desktop – Intel®

G850, G840, G620, and G620T processors

Celeron® processor family desktop – Intel® Celeron

Pentium® G860, G630, and G630T processors

Celeron® G555, G550T, G465 processors

§ §

Revision

Date

January

2011

May 2011

September

2011

October

2011

December

2011

January

2012

September

2012

June 2013

8 Datasheet, Volume 1

Page 9

Introduction

1 Introduction

The 2nd Generation Intel® Core™ processor family desktop, Intel® Pentium® processor family desktop, and Intel® Celeron® processor family desktop are the next generation of 64-bit, multi-core desktop processor built on 32- nanometer process technology. Based on a new micro-architecture, the processor is designed for a two-chip platform consisting of a processor and Platform Controller Hub (PCH). The platform enables higher performance, lower cost, easier validation, and improved x-y footprint. The processor includes Integrated Display Engine, Processor Graphics, PCI Express* ports, and Integrated Memory Controller. The processor is designed for desktop platforms. It supports up to 12 Processor Graphics execution units (EUs). The processor is offered in an 1155-land LGA package. Figure 1-1 shows an example desktop platform block diagram.

This document provides DC electrical specifications, signal integrity, differential signaling specifications, pinout and signal definitions, interface functional descriptions, thermal specifications, and additional feature information pertinent to the implementation and operation of the processor on its respective platform.

Note: Throughout this document, 2nd Generation Intel

Intel

Pentium® processor family desktop, and Intel® Celeron® processor family

Core™ processor family desktop,

desktop may be referred to as simply the processor.

Note: Throughout this document, the Intel

Intel

Core™ i7-2700K, i7-2600K, i7-2600S, and i7-2600 processors.

Intel

Core™ i5-2550K, i5-2500K, i5-2500S, i5-2500T, i5-2500, i5-2450P, i5-2400,

Core™ i7 desktop processor series refers to the

Core™ i5 desktop processor series refers to the

i5-2405S, i5-2400S, i5-2390T, i5-2380P, i5-2320, i5-2310, and i5-2300 processors.

Note: Throughout this document, the Intel

Intel

Core™ i3-2130, i3-2125, i3-2120, i3-2120T, i3-2105, i3-2100, and i3-2100T

Core™ i3 desktop processor series refers to the

processors.

Note: Throughout this document, the Intel

Pentium® G870, G860, G860T, G850, G840, G645, G645T, G640, G540T, G630,

Intel

Pentium® processor family desktop refers to the

G630T, G620, and G620T processors.

Throughout this document, the Intel

Intel

Celeron® G555, G550, G550T, G540, G540T, G530, G530T, G470, G465, G460,

Celeron® processor family desktop refers to the

and G440 processors.

Note: Throughout this document, the Intel

6 Series Chipset Platform Controller Hub may

also be referred to as “PCH”.

Note: Some processor features are not available on all platforms. Refer to the processor

specification update for details.

Datasheet, Volume 1 9

Page 10

Figure 1-1. Desktop Platform System Block Diagram Example

DMI2 x4

Discrete Graphics

(PEG)

Analog CRT

Gigabit

Network Connection

USB 2.0

Intel® HD Audio

FWH

Super I/O

Serial ATA

DDR3

PCI Express* 2.0

1 x16 or 2x8

8 PCI Express* 2.0 x1

Ports

(5 GT/s)

SPI

Digital Display x 3

PCI Express*

SPI Flash x 2

LPC

SMBUS 2.0

GPIO

LVDS Flat Panel

WiFi / WiMax

Controller Link 1

Processor

PECI

Platform

Controller

Hub (PCH)

Intel®

Management

Engine

PCI

Introduction

10 Datasheet, Volume 1

Page 11

Introduction

1.1 Processor Feature Details

• Four or two execution cores

• A 32-KB instruction and 32-KB data first-level cache (L1) for each core

• A 256-KB shared instruction/data second-level cache (L2) for each core

• Up to 8-MB shared instruction/data third-level cache (L3), shared among all cores

1.1.1 Supported Technologies

•Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)

•Intel

•Intel® Streaming SIMD Extensions 4.1 (Intel® SSE4.1)

•Intel

•Intel® 64 Architecture

• Execute Disable Bit

•Intel

•Intel® Advanced Vector Extensions (Intel® AVX)

•Intel

• PCLMULQDQ Instruction

Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel®

Architecture (Intel

Active Management Technology 7.0 (Intel® AMT 7.0)

Trusted Execution Technology (Intel® TXT)

Streaming SIMD Extensions 4.2 (Intel® SSE4.2)

Hyper-Threading Technology (Intel® HT Technology)

Turbo Boost Technology

Advanced Encryption Standard New Instructions (Intel® AES-NI)

VT-x)

1.2 Interfaces

1.2.1 System Memory Support

• Two channels of unbuffered DDR3 memory with a maximum of two UDIMMs or SODIMMs (for AIO) per channel

• Single-channel and dual-channel memory organization modes

• Data burst length of eight for all memory organization modes

• Memory DDR3 data transfer rates of 1066 MT/s and 1333 MT/s

• 64-bit wide channels

• DDR3 I/O Voltage of 1.5 V

• The type of memory supported by the processor is dependent on the PCH SKU in the target platform

— Desktop PCH platforms support non-ECC un-buffered DIMMs only

— All In One platforms (AIO) support SO-DIMMs

• Maximum memory bandwidth of 10.6 GB/s in single-channel mode or 21 GB/s in dual-channel mode assuming DDR3 1333 MT/s

• 1Gb, 2Gb, and 4Gb DDR3 DRAM technologies are supported

— Using 4Gb device technologies, the largest memory capacity possible is 32 GB,

assuming Dual Channel Mode with four x8 dual ranked unbuffered DIMM memory configuration.

Datasheet, Volume 1 11

Page 12

• Up to 64 simultaneous open pages, 32 per channel (assuming 8 ranks of 8 bank devices)

• Command launch modes of 1n/2n

• On-Die Termination (ODT)

• Asynchronous ODT

•Intel

Fast Memory Access (Intel® FMA)

— Just-in-Time Command Scheduling —Command Overlap — Out-of-Order Scheduling

1.2.2 PCI Express*

• PCI Express* port(s) are fully-compliant with the PCI Express Base Specification, Revision 2.0.

Table 1-1. PCI Express* Supported Configurations in Desktop Products

• Processor with desktop PCH supported configurations

Configuration Organization Desktop

12x8Graphics, I/O

2 1x16 Graphics, I/O

Introduction

• The port may negotiate down to narrower widths

— Support for x16/x8/x4/x1 widths for a single PCI Express mode

• 2.5 GT/s and 5.0 GT/s PCI Express* frequencies are supported

• Gen1 Raw bit-rate on the data pins of 2.5 GT/s, resulting in a real bandwidth per pair of 250 MB/s given the 8b/10b encoding used to transmit data across this interface. This also does not account for packet overhead and link maintenance.

• Maximum theoretical bandwidth on the interface of 4 GB/s in each direction simultaneously, for an aggregate of 8 GB/s when x16 Gen 1

• Gen 2 Raw bit-rate on the data pins of 5.0 GT/s, resulting in a real bandwidth per pair of 500 MB/s given the 8b/10b encoding used to transmit data across this interface. This also does not account for packet overhead and link maintenance.

• Maximum theoretical bandwidth on the interface of 8 GB/s in each direction simultaneously, for an aggregate of 16 GB/s when x16 Gen 2

• Hierarchical PCI-compliant configuration mechanism for downstream devices

• Traditional PCI style traffic (asynchronous snooped, PCI ordering)

• PCI Express* extended configuration space. The first 256 bytes of configuration space aliases directly to the PCI Compatibility configuration space. The remaining portion of the fixed 4-KB block of memory-mapped space above that (starting at 100h) is known as extended configuration space.

• PCI Express* Enhanced Access Mechanism; accessing the device configuration space in a flat memory mapped fashion

• Automatic discovery, negotiation, and training of link out of reset

• Traditional AGP style traffic (asynchronous non-snooped, PCI-X Relaxed ordering)

• Peer segment destination posted write traffic (no peer-to-peer read traffic) in Virtual Channel 0

— DMI -> PCI Express* Port 0

12 Datasheet, Volume 1

Page 13

Introduction

• 64-bit downstream address format, but the processor never generates an address above 64 GB (Bits 63:36 will always be zeros)

• 64-bit upstream address format, but the processor responds to upstream read transactions to addresses above 64 GB (addresses where any of Bits 63:36 are nonzero) with an Unsupported Request response. Upstream write transactions to addresses above 64 GB will be dropped.

• Re-issues Configuration cycles that have been previously completed with the Configuration Retry status

• PCI Express* reference clock is 100-MHz differential clock

• Power Management Event (PME) functions

• Dynamic width capability

• Message Signaled Interrupt (MSI and MSI-X) messages

• Polarity inversion

Note: The processor does not support PCI Express* Hot-Plug.

1.2.3 Direct Media Interface (DMI)

• DMI 2.0 support

• Four lanes in each direction

• 5 GT/s point-to-point DMI interface to PCH is supported

• Raw bit-rate on the data pins of 5.0 GB/s, resulting in a real bandwidth per pair of 500 MB/s given the 8b/10b encoding used to transmit data across this interface. Does not account for packet overhead and link maintenance.

• Maximum theoretical bandwidth on interface of 2 GB/s in each direction simultaneously, for an aggregate of 4 GB/s when DMI x4

• Shares 100-MHz PCI Express* reference clock

• 64-bit downstream address format, but the processor never generates an address above 64 GB (Bits 63:36 will always be zeros)

• Supports the following traffic types to or from the PCH

—DMI -> DRAM — DMI -> processor core (Virtual Legacy Wires (VLWs), Resetwarn, or MSIs only) — Processor core -> DMI

• APIC and MSI interrupt messaging support

— Message Signaled Interrupt (MSI and MSI-X) messages

• Downstream SMI, SCI and SERR error indication

• Legacy support for ISA regime protocol (PHOLD/PHOLDA) required for parallel port DMA, floppy drive, and LPC bus masters

• DC coupling – no capacitors between the processor and the PCH

• Polarity inversion

• PCH end-to-end lane reversal across the link

• Supports Half Swing “low-power/low-voltage”

Datasheet, Volume 1 13

Page 14

1.2.4 Platform Environment Control Interface (PECI)

The PECI is a one-wire interface that provides a communication channel between a PECI client (the processor) and a PECI master. The processors support the PECI 3.0 Specification.

1.2.5 Processor Graphics

• The Processor Graphics contains a refresh of the sixth generation graphics core enabling substantial gains in performance and lower power consumption.

• Next Generation Intel Clear Video Technology HD support is a collection of video playback and enhancement features that improve the end user’s viewing experience.

— Encode/transcode HD content — Playback of high definition content including Blu-ray Disc* — Superior image quality with sharper, more colorful images — Playback of Blu-ray disc S3D content using HDMI (V.1.4 with 3D)

• DirectX* Video Acceleration (DXVA) support for accelerating video processing

— Full AVC/VC1/MPEG2 HW Decode

• Advanced Scheduler 2.0, 1.0, XPDM support

• Windows* 7, XP, Windows Vista*, OSX, Linux OS Support

• DX10.1, DX10, DX9 support

•OGL 3.0 support

• Switchable graphics support on desktop AIO platforms with MxM solutions only

Introduction

1.2.6 Intel® Flexible Display Interface (Intel® FDI)

• For SKUs with graphics, Intel FDI carries display traffic from the Processor Graphics in the processor to the legacy display connectors in the PCH

• Based on DisplayPort standard

• Two independent links – one for each display pipe

• Four unidirectional downstream differential transmitter pairs

— Scalable down to 3X, 2X, or 1X based on actual display bandwidth

requirements

— Fixed frequency 2.7 GT/s data rate

• Two sideband signals for Display synchronization

— FDI_FSYNC and FDI_LSYNC (Frame and Line Synchronization)

• One Interrupt signal used for various interrupts from the PCH

— FDI_INT signal shared by both Intel FDI Links

• PCH supports end-to-end lane reversal across both links

• Common 100-MHz reference clock

14 Datasheet, Volume 1

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Introduction

1.3 Power Management Support

1.3.1 Processor Core

• Full support of Advanced Configuration and Power Interface (ACPI) C-states as implemented by the following processor C-states

— C0, C1, C1E, C3, C6

• Enhanced Intel SpeedStep

1.3.2 System

• S0, S3, S4, S5

1.3.3 Memory Controller

• Conditional self-refresh (Intel® Rapid Memory Power Management (Intel® RMPM))

• Dynamic power-down

1.3.4 PCI Express*

Tec h n ol o gy

• L0s and L1 ASPM power management capability

1.3.5 Direct Media Interface (DMI)

• L0s and L1 ASPM power management capability

1.3.6 Processor Graphics Controller

•Intel® Rapid Memory Power Management (Intel® RMPM) – CxSR

•Intel® Graphics Performance Modulation Technology (Intel® GPMT)

• Intel Smart 2D Display Technology (Intel S2DDT)

• Graphics Render C-State (RC6)

1.4 Thermal Management Support

• Digital Thermal Sensor

• Intel Adaptive Thermal Monitor

• THERMTRIP# and PROCHOT# support

• On-Demand Mode

• Memory Thermal Throttling

• External Thermal Sensor (TS-on-DIMM and TS-on-Board)

• Render Thermal Throttling

• Fan speed control with DTS

Datasheet, Volume 1 15

Page 16

1.5 Package

• The processor socket type is noted as LGA 1155. The package is a 37.5 x 37.5 mm Flip Chip Land Grid Array (FCLGA 1155).

Note: See the 2nd Generation Intel

Celeron® Processor, and LGA1155 Socket Thermal Mechanical Specifications and

Intel Design Guidelines for complete details on package.

1.6 Terminology

Table 1-2. Terminology (Sheet 1 of 2)

Term Description

ACPI Advanced Configuration and Power Interface

AIO All In One

BLT Block Level Transfer

CRT Cathode Ray Tube

DDR3 Third-generation Double Data Rate SDRAM memory technology

DMA Direct Memory Access

DMI Direct Media Interface

DP DisplayPort*

DTS Digital Thermal Sensor

Enhanced Intel SpeedStep

EU Execution Unit

Execute Disable Bit

IMC Integrated Memory Controller

Intel

Intel Technology

Intel

IOV I/O Virtualization

ITPM Integrated Trusted Platform Module

LCD Liquid Crystal Display

LVD S

NCTF

Technology

64 Technology 64-bit memory extensions to the IA-32 architecture

FDI Intel® Flexible Display Interface

TXT Intel® Trusted Execution Technology

Virtualization

VT-d

Technology that provides power management capabilities to laptops.

The Execute Disable bit allows memory to be marked as executable or nonexecutable, when combined with a supporting operating system. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel Developer's Manuals for more detailed information.

Processor virtualization which when used in conjunction with Virtual Machine Monitor software enables multiple, robust independent software environments inside a single platform.

Intel

Virtualization Technology (Intel® VT) for Directed I/O. Intel VT-d is a hardware assist, under system software (Virtual Machine Manager or OS) control, for enabling I/O device virtualization. Intel VT-d also brings robust security by providing protection from errant DMAs by using DMA remapping, a key feature of Intel VT-d.

Low Voltage Differential Signaling. A high speed, low power data transmission standard used for display connections to LCD panels.

Non-Critical to Function. NCTF locations are typically redundant ground or noncritical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.

Introduction

Core™ Processor, Intel® Pentium® Processor, and

64 and IA-32 Architectures Software

16 Datasheet, Volume 1

Page 17

Introduction

Table 1-2. Terminology (Sheet 2 of 2)

Term Description

Platform Controller Hub. The new, 2009 chipset with centralized platform

PCH

PECI Platform Environment Control Interface

PEG

Processor The 64-bit, single-core or multi-core component (package).

Processor Core

Processor Graphics Intel

Rank

SCI System Control Interrupt. Used in ACPI protocol.

Storage Conditions

TAC Thermal Averaging Constant.

TAP Test Access Point

TDP Thermal Design Power.

AXG

CCIO

CCPLL

CCSA

DDQ

VLD Variable Length Decoding.

x1 Refers to a Link or Port with one Physical Lane.

x16 Refers to a Link or Port with sixteen Physical Lanes.

x4 Refers to a Link or Port with four Physical Lanes.

x8 Refers to a Link or Port with eight Physical Lanes.

capabilities including the main I/O interfaces along with display connectivity, audio features, power management, manageability, security and storage features.

PCI Express* Graphics. External Graphics using PCI Express* Architecture. A high-speed serial interface whose configuration is software compatible with the existing PCI specifications.

The term “processor core” refers to Si die itself which can contain multiple execution cores. Each execution core has an instruction cache, data cache, and 256-KB L2 cache. All execution cores share the L3 cache.

Processor Graphics

A unit of DRAM corresponding four to eight devices in parallel. These devices are usually, but not always, mounted on a single side of a SO-DIMM.

A non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor landings should not be connected to any supply voltages, have any I/Os biased or receive any clocks. Upon exposure to “free air” (that is, unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material.

Graphics core power supply.

Processor core power supply.

High Frequency I/O logic power supply

PLL power supply

System Agent (memory controller, DMI, PCIe controllers, and display engine) power supply

DDR3 power supply.

Processor ground.

Datasheet, Volume 1 17

Page 18

1.7 Related Documents

Refer to Ta bl e 1 -3 for additional information.

Table 1-3. Related Documents

Document Document Number/ Location

2nd Generation Intel Processor Family Desktop, and Intel Datasheet, Volume 2

2nd Generation Intel Processor Family Desktop, and Intel Specification Update

2nd Generation Intel Processor Family Desktop, and Intel and LGA1155 Socket Thermal Mechanical Specifications and Design Guidelines

6 Series Chipset and Intel® C200 Series Chipset Datasheet www.intel.com/Assets/PDF/datas

Intel

6 Series Chipset and Intel® C200 Series Chipset Thermal

Mechanical Specifications and Design Guidelines Advanced Configuration and Power Interface Specification 3.0 http://www.acpi.info/ PCI Local Bus Specification 3.0 http://www.pcisig.com/specifica-

Intel

TXT Measured Launched Environment Developer’s Guide http://www.intel.com/technology

Intel

64 Architecture x2APIC Specification http://www.intel.com/products/pr

PCI Express* Base Specification 2.0 http://www.pcisig.com DDR3 SDRAM Specification http://www.jedec.org DisplayPort* Specification http://www.vesa.org

Intel

64 and IA-32 Architectures Software Developer's Manuals http://www.intel.com/products/pr

Volume 1: Basic Architecture 253665 Volume 2A: Instruction Set Reference, A-M 253666 Volume 2B: Instruction Set Reference, N-Z 253667 Volume 3A: System Programming Guide 253668 Volume 3B: System Programming Guide 253669

Core™ Processor Family Desktop, Intel®Pentium®

Celeron® Processor Family Desktop

Celeron® Processor Family Desktop,

Introduction

http://download.intel.com/design

/processor/datashts/324642.pdf

http://download.intel.com/design

/processor/specupdt/324643.pdf

http://download.intel.com/design

/processor/designex/324644.pdf

heet/324645.pdf

www.intel.com/Assets/PDF/desig

nguide/324647.pdf

tions

/security

ocessor/manuals/

ocessor/manuals/index.htm

§ §

18 Datasheet, Volume 1

Page 19

Interfaces

2 Interfaces

This chapter describes the interfaces supported by the processor.

2.1 System Memory Interface

2.1.1 System Memory Technology Supported

The Integrated Memory Controller (IMC) supports DDR3 protocols with two independent, 64-bit wide channels each accessing one or two DIMMs. The type of memory supported by the processor is dependant on the PCH SKU in the target platform. Refer to Chapter 1 for supported memory configuration details.

It supports a maximum of two DDR3 DIMMs per-channel; thus, allowing up to four device ranks per-channel.

• DDR3 Data Transfer Rates

— 1066 MT/s (PC3-8500), 1333 MT/s (PC3-10600)

• DDR3 SO-DIMM Modules

— Raw Card A – Dual Ranked x16 unbuffered non-ECC

— Raw Card B – Single Ranked x8 unbuffered non-ECC

— Raw Card C – Single Ranked x16 unbuffered non-ECC

— Raw Card F – Dual Ranked x8 (planar) unbuffered non-ECC

• Desktop PCH platform DDR3 DIMM Modules

— Raw Card A – Single Ranked x8 unbuffered non-ECC — Raw Card B – Dual Ranked x8 unbuffered non-ECC — Raw Card C – Single Ranked x16 unbuffered non-ECC

• Advanced Server/Workstation PCH platforms DDR3 DIMM Modules:

— Raw Card A – Single Ranked x8 unbuffered non-ECC — Raw Card B – Dual Ranked x8 unbuffered non-ECC — Raw Card C – Single Ranked x16 unbuffered non-ECC — Raw Card D – Single Ranked x8 unbuffered ECC — Raw Card E – Dual Ranked x8 unbuffered ECC

• Essential/Standard Server PCH platforms DDR3 DIMM Modules:

— Raw Card D – Single Ranked x8 unbuffered ECC

— Raw Card E – Dual Ranked x8 unbuffered ECC

DDR3 DRAM Device Technology: 1-Gb, 2-Gb, and 4 Gb DDR3 DRAM Device technologies and addressing are supported.

Datasheet, Volume 1 19

Page 20

Table 2-1. Supported UDIMM Module Configurations

Interfaces

Raw Card

Version

DIMM

Capacity

1 GB 1 Gb 128 M X 8 8 2 14/10 8 8 K

2 GB 2 Gb 128 M X 16 8 2 14/10 8 16 K

2 GB 1 Gb 128 M X 8 16 2 14/10 8 8 K

4 GB 2 Gb 256 M X 8 16 2 15/10 8 8 K

8 GB 4 Gb 512 M X 8 16 2 16/10 8 8 K

512 MB 1 Gb 64 M X 16 4 1 13/10 8 16 K

1 GB 2 Gb 128 M X 16 4 1 14/10 8 16 K

DRAM Device

Technology

Unbuffered/Non-ECC Supported DIMM Module Configurations

Note: DIMM module support is based on availability and is subject to change.

DRAM

Organization

# of

DRAM

Devices

# of

Physical

Device

Ranks

# of

Row/Col

Address

Bits

Table 2-2. Supported SO-DIMM Module Configurations (AIO Only)

Raw Card

Version

DIMM

Capacity

1 GB 1 Gb 64 M x 16 8 2 13/10 8 8K

2 GB 2 Gb 128 M x 16 8 2 14/10 8 8K

1 GB 1 Gb 128 M x 8 8 1 14/10 8 8K

2 GB 2 Gb 256 M x 8 8 1 15/10 8 8K

512 MB 1 Gb 64 M x 16 4 1 13/10 8 8K

1 GB 2 Gb 128 M x 16 4 1 14/10 8 8K

2 GB 1 Gb 128 M x 8 16 2 14/10 8 8K

4 GB 2 Gb 256 M x 8 16 2 15/10 8 8K

8 GB 4 Gb 512 M x 8 16 2 16/ 10 8 8K

DRAM Device

Technology

DRAM

Organization

# of

DRAM

Devices

# of

Physical

Device

Ranks

# of

Row/Col

Address Bits

1,2

# of

Banks

Inside

DRAM

# of Banks

Inside

DRAM

Page Size

Notes:

1. System memory configurations are based on availability and are subject to change.

2. Interface does not support ULV/LV memory modules or ULV/LV DIMMs.

20 Datasheet, Volume 1

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Interfaces

2.1.2 System Memory Timing Support

The IMC supports the following DDR3 Speed Bin, CAS Write Latency (CWL), and command signal mode timings on the main memory interface:

•tCL = CAS Latency

•t

• CWL = CAS Write Latency

• Command Signal modes = 1n indicates a new command may be issued every clock

Table 2-3. DDR3 System Memory Timing Support

= Activate Command to READ or WRITE Command delay

RCD

= PRECHARGE Command Period

and 2n indicates a new command may be issued every 2 clocks. Command launch mode programming depends on the transfer rate and memory configuration.

Segment

All Desktop

segments

Notes:

1. System memory timing support is based on availability and is subject to change.

Transfer

Rate

(MT/s)

1066

1333 9 9 9 7

tCL

(tCK)

7776

8886

tRCD

(tCK)

tRP

(tCK)

CWL

(tCK) DPC

CMD

Mode

11n/2n

22n

11n/2n

22n

11n/2n

22n

2.1.3 System Memory Organization Modes

The IMC supports two memory organization modes—single-channel and dual-channel. Depending upon how the DIMM Modules are populated in each memory channel, a number of different configurations can exist.

2.1.3.1 Single-Channel Mode

In this mode, all memory cycles are directed to a single-channel. Single-channel mode is used when either Channel A or Channel B DIMM connectors are populated in any order, but not both.

2.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode

Notes

The IMC supports Intel Flex Memory Technology Mode. Memory is divided into a symmetric and an asymmetric zone. The symmetric zone starts at the lowest address in each channel and is contiguous until the asymmetric zone begins or until the top address of the channel with the smaller capacity is reached. In this mode, the system runs with one zone of dual-channel mode and one zone of single-channel mode, simultaneously, across the whole memory array.

Note: Channels A and B can be mapped for physical channels 0 and 1 respectively or vice

versa; however, channel A size must be greater or equal to channel B size.

Datasheet, Volume 1 21

Page 22

Figure 2-1. Intel

CH BCH A

B B

Non interleaved access

Dual channel interleaved access

TOM

B – The largest physical memory amount of the sm aller size memory module C – The remaining physical mem ory amount of the larger size mem ory module

Flex Memory Technology Operation

Interfaces

2.1.3.2.1 Dual-Channel Symmetric Mode

Dual-Channel Symmetric mode, also known as interleaved mode, provides maximum performance on real world applications. Addresses are ping-ponged between the channels after each cache line (64-byte boundary). If there are two requests, and the second request is to an address on the opposite channel from the first, that request can be sent before data from the first request has returned. If two consecutive cache lines are requested, both may be retrieved simultaneously since they are ensured to be on opposite channels. Use Dual-Channel Symmetric mode when both Channel A and Channel B DIMM connectors are populated in any order, with the total amount of memory in each channel being the same.

When both channels are populated with the same memory capacity and the boundary between the dual channel zone and the single channel zone is the top of memory, IMC operates completely in Dual-Channel Symmetric mode.

Note: The DRAM device technology and width may vary from one channel to the other.

2.1.4 Rules for Populating Memory Slots

In all modes, the frequency of system memory is the lowest frequency of all memory modules placed in the system, as determined through the SPD registers on the memory modules. The system memory controller supports one or two DIMM connectors per channel. The usage of DIMM modules with different latencies is allowed, but in that case, the worst latency (per channel) will be used. For dual-channel modes, both channels must have a DIMM connector populated and for single-channel mode, only a single-channel may have one or both DIMM connectors populated.

Note: In a 2 DIMM Per Channel (2DPC) daisy chain layout memory configuration, the furthest

DIMM from the processor of any given channel must always be populated first.

22 Datasheet, Volume 1

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Interfaces

2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)

The following sections describe the Just-in-Time Scheduling, Command Overlap, and Out-of-Order Scheduling Intel FMA technology enhancements.

2.1.5.1 Just-in-Time Command Scheduling

The memory controller has an advanced command scheduler where all pending requests are examined simultaneously to determine the most efficient request to be issued next. The most efficient request is picked from all pending requests and issued to system memory Just-in-Time to make optimal use of Command Overlapping. Thus, instead of having all memory access requests go individually through an arbitration mechanism forcing requests to be executed one at a time, they can be started without interfering with the current request allowing for concurrent issuing of requests. This allows for optimized bandwidth and reduced latency while maintaining appropriate command spacing to meet system memory protocol.

2.1.5.2 Command Overlap

Command Overlap allows the insertion of the DRAM commands between the Activate, Precharge, and Read/Write commands normally used, as long as the inserted commands do not affect the currently executing command. Multiple commands can be issued in an overlapping manner, increasing the efficiency of system memory protocol.

2.1.5.3 Out-of-Order Scheduling

While leveraging the Just-in-Time Scheduling and Command Overlap enhancements, the IMC continuously monitors pending requests to system memory for the best use of bandwidth and reduction of latency. If there are multiple requests to the same open page, these requests would be launched in a back to back manner to make optimum use of the open memory page. This ability to reorder requests on the fly allows the IMC to further reduce latency and increase bandwidth efficiency.

2.1.6 Memory Type Range Registers (MTRRs) Enhancement

The processor has 2 additional MTRRs (total 10 MTRRs). These additional MTRRs are specially important in supporting larger system memory beyond 4 GB.

2.1.7 Data Scrambling

The memory controller incorporates a DDR3 Data Scrambling feature to minimize the impact of excessive di/dt on the platform DDR3 VRs due to successive 1s and 0s on the data bus. Past experience has demonstrated that traffic on the data bus is not random and can have energy concentrated at specific spectral harmonics creating high di/dt that is generally limited by data patterns that excite resonance between the package inductance and on-die capacitances. As a result, the memory controller uses a data scrambling feature to create pseudo-random patterns on the DDR3 data bus to reduce the impact of any excessive di/dt.

Datasheet, Volume 1 23

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2.2 PCI Express* Interface

Transaction

Data Link

Physical

Logical Sub-block

Electrical Sub-block

RX TX

Transaction

Data Link

Physical

Logical Sub-block

Electrical Sub-block

RX TX

This section describes the PCI Express interface capabilities of the processor. See the PCI Express Base Specification for details of PCI Express.

The number of PCI Express controllers is dependent on the platform. Refer to Chapter 1 for details.

2.2.1 PCI Express* Architecture

Compatibility with the PCI addressing model is maintained to ensure that all existing applications and drivers operate unchanged.

The PCI Express configuration uses standard mechanisms as defined in the PCI Plug-and-Play specification. The initial recovered clock speed of 1.25 GHz results in

2.5 Gb/s/direction that provides a 250 MB/s communications channel in each direction (500 MB/s total). That is close to twice the data rate of classic PCI. The fact that 8b/10b encoding is used accounts for the 250 MB/s where quick calculations would imply 300 MB/s. The external graphics ports support Gen2 speed as well. At 5.0 GT/s, Gen 2 operation results in twice as much bandwidth per lane as compared to Gen 1 operation. When operating with two PCIe controllers, each controller can be operating at either 2.5 GT/s or 5.0 GT/s.

Interfaces

Figure 2-2. PCI Express* Layering Diagram

The PCI Express architecture is specified in three layers—Transaction Layer, Data Link Layer, and Physical Layer. The partitioning in the component is not necessarily along these same boundaries. Refer to Figure 2-2 for the PCI Express Layering Diagram.

24 Datasheet, Volume 1

PCI Express uses packets to communicate information between components. Packets are formed in the Transaction and Data Link Layers to carry the information from the transmitting component to the receiving component. As the transmitted packets flow through the other layers, they are extended with additional information necessary to

Page 25

Interfaces

Sequence

Number

Framing Header Data ECRC LCRC Framing

Transaction Layer

Data Link Layer

Physical Layer

handle packets at those layers. At the receiving side, the reverse process occurs and packets get transformed from their Physical Layer representation to the Data Link Layer representation and finally (for Transaction Layer Packets) to the form that can be processed by the Transaction Layer of the receiving device.

Figure 2-3. Packet Flow through the Layers

2.2.1.1 Transaction Layer

The upper layer of the PCI Express architecture is the Transaction Layer. The Transaction Layer's primary responsibility is the assembly and disassembly of Transaction Layer Packets (TLPs). TLPs are used to communicate transactions, such as read and write, as well as certain types of events. The Transaction Layer also manages flow control of TLPs.

2.2.1.2 Data Link Layer

The middle layer in the PCI Express stack, the Data Link Layer, serves as an intermediate stage between the Transaction Layer and the Physical Layer. Responsibilities of Data Link Layer include link management, error detection, and error correction.

The transmission side of the Data Link Layer accepts TLPs assembled by the Transaction Layer, calculates and applies data protection code and TLP sequence number, and submits them to Physical Layer for transmission across the Link. The receiving Data Link Layer is responsible for checking the integrity of received TLPs and for submitting them to the Transaction Layer for further processing. On detection of TLP error(s), this layer is responsible for requesting retransmission of TLPs until information is correctly received, or the Link is determined to have failed. The Data Link Layer also generates and consumes packets that are used for Link management functions.

2.2.1.3 Physical Layer

The Physical Layer includes all circuitry for interface operation, including driver and input buffers, parallel-to-serial and serial-to-parallel conversion, PLL(s), and impedance matching circuitry. It also includes logical functions related to interface initialization and maintenance. The Physical Layer exchanges data with the Data Link Layer in an implementation-specific format, and is responsible for converting this to an appropriate serialized format and transmitting it across the PCI Express Link at a frequency and width compatible with the remote device.

Datasheet, Volume 1 25

Page 26

2.2.2 PCI Express* Configuration Mechanism

PCI-PCI Bridge

representing

root PCI

Express* ports

(Device 1 and

Device 6)

PCI Compatible

Host Bridge

Device

(Device 0)

PCI

Express*

Device

PEG0

DMI

The PCI Express (external graphics) link is mapped through a PCI-to-PCI bridge structure.

Figure 2-4. PCI Express* Related Register Structures in the Processor

Interfaces

PCI Express extends the configuration space to 4096 bytes per-device/function, as compared to 256 bytes allowed by the Conventional PCI Specification. PCI Express configuration space is divided into a PCI-compatible region (that consists of the first 256 bytes of a logical device's configuration space) and an extended PCI Express region (that consists of the remaining configuration space). The PCI-compatible region can be accessed using either the mechanisms defined in the PCI specification or using the enhanced PCI Express configuration access mechanism described in the PCI Express Enhanced Configuration Mechanism section.

The PCI Express Host Bridge is required to translate the memory-mapped PCI Express configuration space accesses from the host processor to PCI Express configuration cycles. To maintain compatibility with PCI configuration addressing mechanisms, it is recommended that system software access the enhanced configuration space using

32-bit operations (32-bit aligned) only. See the PCI Express Base Specification for

details of both the PCI-compatible and PCI Express Enhanced configuration mechanisms and transaction rules.

2.2.3 PCI Express* Port

The PCI Express interface on the processor is a single, 16-lane (x16) port that can also

be configured at narrower widths. The PCI Express port is compliant with the PCI

Express Base Specification, Revision 2.0.

26 Datasheet, Volume 1

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Interfaces

1 X 16 Controller

Lane 0

Lane 1

Lane 2

Lane 3

Lane 4

Lane 5

Lane 6

Lane 7

Lane 8

Lane 9

Lane 10

Lane 11

Lane 12

Lane 13

Lane 14

Lane 15

1 X 8 Controller

1 X 4 Controller

2.2.4 PCI Express* Lanes Connection

Figure 2-5 demonstrates the PCIe lanes mapping.

Figure 2-5. PCI Express* Typical Operation 16 lanes Mapping

2.3 Direct Media Interface (DMI)

Note: Only DMI x4 configuration is supported.

2.3.1 DMI Error Flow

2.3.2 Processor / PCH Compatibility Assumptions

Datasheet, Volume 1 27

Direct Media Interface (DMI) connects the processor and the PCH. Next generation DMI2 is supported.

DMI can only generate SERR in response to errors, never SCI, SMI, MSI, PCI INT, or GPE. Any DMI related SERR activity is associated with Device 0.

The processor is compatible with the Intel not compatible with any previous PCH products.

6 Series Chipset PCH. The processor is

Page 28

2.3.3 DMI Link Down

Vertex

Fetch

VS/GS

Setup/Rasterize

Hierachical Z

Hardware Clipper

EU EU

Unified Execution Unit Array

Texture

Unit

Pixel

Backend

Full MPEG2, VC1, AVC Decode Fixed Function Post Processing

Full AVC Encode

Partial MPEG2, VC1 Encode

Multi-Format Decode/Encode

Additional Post Processing

The DMI link going down is a fatal, unrecoverable error. If the DMI data link goes to data link down, after the link was up, then the DMI link hangs the system by not allowing the link to retrain to prevent data corruption. This link behavior is controlled by the PCH.

Downstream transactions that had been successfully transmitted across the link prior to the link going down may be processed as normal. No completions from downstream, non-posted transactions are returned upstream over the DMI link after a link down event.

2.4 Processor Graphics Controller (GT)

New Graphics Engine Architecture includes 3D compute elements, Multi-format hardware-assisted decode/encode Pipeline, and Mid-Level Cache (MLC) for superior high definition playback, video quality, and improved 3D performance and Media.

Display Engine in the Uncore handles delivering the pixels to the screen. GSA (Graphics in System Agent) is the primary Channel interface for display memory accesses and “PCI-like” traffic in and out.

Interfaces

Figure 2-6. Processor Graphics Controller Unit Block Diagram

28 Datasheet, Volume 1

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Interfaces

2.4.1 3D and Video Engines for Graphics Processing

The 3D graphics pipeline architecture simultaneously operates on different primitives or on different portions of the same primitive. All the cores are fully programmable, increasing the versatility of the 3D Engine. The Gen 6.0 3D engine provides the following performance and power-management enhancements:

• Up to 12 Execution units (EUs)

•Hierarchal-Z

• Video quality enhancements

2.4.1.1 3D Engine Execution Units

• Supports up to 12 EUs. The EUs perform 128-bit wide execution per clock.

• Support SIMD8 instructions for vertex processing and SIMD16 instructions for pixel processing.

2.4.1.2 3D Pipeline

2.4.1.2.1 Vertex Fetch (VF) Stage

The VF stage executes 3DPRIMITIVE commands. Some enhancements have been included to better support legacy D3D APIs as well as SGI OpenGL*.

2.4.1.2.2 Vertex Shader (VS) Stage

The VS stage performs shading of vertices output by the VF function. The VS unit produces an output vertex reference for every input vertex reference received from the VF unit, in the order received.

2.4.1.2.3 Geometry Shader (GS) Stage

The GS stage receives inputs from the VS stage. Compiled application-provided GS programs, specifying an algorithm to convert the vertices of an input object into some output primitives. For example, a GS shader may convert lines of a line strip into polygons representing a corresponding segment of a blade of grass centered on the line. Or it could use adjacency information to detect silhouette edges of triangles and output polygons extruding out from the edges.

2.4.1.2.4 Clip Stage

The Clip stage performs general processing on incoming 3D objects. However, it also includes specialized logic to perform a Clip Test function on incoming objects. The Clip Test optimizes generalized 3D Clipping. The Clip unit examines the position of incoming vertices, and accepts/rejects 3D objects based on its Clip algorithm.

2.4.1.2.5 Strips and Fans (SF) Stage

The SF stage performs setup operations required to rasterize 3D objects. The outputs from the SF stage to the Windower stage contain implementation-specific information required for the rasterization of objects and also supports clipping of primitives to some extent.

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2.4.1.2.6 Windower/IZ (WIZ) Stage

The WIZ unit performs an early depth test, which removes failing pixels and eliminates unnecessary processing overhead.

The Windower uses the parameters provided by the SF unit in the object-specific rasterization algorithms. The WIZ unit rasterizes objects into the corresponding set of pixels. The Windower is also capable of performing dithering, whereby the illusion of a higher resolution when using low-bpp channels in color buffers is possible. Color dithering diffuses the sharp color bands seen on smooth-shaded objects.

2.4.1.3 Video Engine

The Video Engine handles the non-3D (media/video) applications. It includes support for VLD and MPEG2 decode in hardware.

2.4.1.4 2D Engine

The 2D Engine contains BLT (Block Level Transfer) functionality and an extensive set of 2D instructions. To take advantage of the 3D during engine’s functionality, some BLT functions make use of the 3D renderer.

Interfaces

2.4.1.4.1 Processor Graphics VGA Registers

The 2D registers consists of original VGA registers and others to support graphics modes that have color depths, resolutions, and hardware acceleration features that go beyond the original VGA standard.

2.4.1.4.2 Logical 128-Bit Fixed BLT and 256 Fill Engine

This BLT engine accelerates the GUI of Microsoft Windows* operating systems. The 128-bit BLT engine provides hardware acceleration of block transfers of pixel data for many common Windows operations. The BLT engine can be used for the following:

• Move rectangular blocks of data between memory locations

• Data alignment

• To perform logical operations (raster ops)

The rectangular block of data does not change, as it is transferred between memory locations. The allowable memory transfers are between: cacheable system memory and frame buffer memory, frame buffer memory and frame buffer memory, and within system memory. Data to be transferred can consist of regions of memory, patterns, or solid color fills. A pattern is always 8 x 8 pixels wide and may be 8, 16, or 32 bits per pixel.

The BLT engine expands monochrome data into a color depth of 8, 16, or 32 bits. BLTs can be either opaque or transparent. Opaque transfers move the data specified to the destination. Transparent transfers compare destination color to source color and write according to the mode of transparency selected.

Data is horizontally and vertically aligned at the destination. If the destination for the BLT overlaps with the source memory location, the BLT engine specifies which area in memory to begin the BLT transfer. Hardware is included for all 256 raster operations (source, pattern, and destination) defined by Microsoft, including transparent BLT.

The BLT engine has instructions to invoke BLT and stretch BLT operations, permitting software to set up instruction buffers and use batch processing. The BLT engine can perform hardware clipping during BLTs.

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Interfaces

Memory Host Interface

(Outside of Display Engine)

Display

Arbiter

Display

Planes & VGA

Display

Pipe A

Display

Pipe B

Display

Port

Control

Display

Port

Control

Intel

FDI (Tx

Side)

DMI

PCH Display Engine

2.4.2 Processor Graphics Display

The Processor Graphics controller display pipe can be broken down into three components:

• Display Planes

• Display Pipes

• DisplayPort and Intel FDI

Figure 2-7. Processor Display Block Diagram

2.4.2.1 Display Planes

A display plane is a single displayed surface in memory and contains one image (desktop, cursor, overlay). It is the portion of the display hardware logic that defines the format and location of a rectangular region of memory that can be displayed on display output device and delivers that data to a display pipe. This is clocked by the Core Display Clock.

2.4.2.1.1 Planes A and B

Planes A and B are the main display planes and are associated with Pipes A and B respectively. The two display pipes are independent, allowing for support of two independent display streams. They are both double-buffered, which minimizes latency and improves visual quality.

2.4.2.1.2 Sprite A and B

Sprite A and Sprite B are planes optimized for video decode, and are associated with Planes A and B respectively. Sprite A and B are also double-buffered.

2.4.2.1.3 Cursors A and B

Cursors A and B are small, fixed-sized planes dedicated for mouse cursor acceleration,

Datasheet, Volume 1 31

and are associated with Planes A and B respectively. These planes support resolutions up to 256 x 256 each.

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2.4.2.1.4 Video Graphics Array (VGA)

VGA is used for boot, safe mode, legacy games, etc. It can be changed by an application without OS/driver notification, due to legacy requirements.

2.4.2.2 Display Pipes

The display pipe blends and synchronizes pixel data received from one or more display planes and adds the timing of the display output device upon which the image is displayed. This is clocked by the Display Reference clock inputs.

The display pipes A and B operate independently of each other at the rate of 1 pixel per clock. They can attach to any of the display ports. Each pipe sends display data to the PCH over the Intel Flexible Display Interface (Intel FDI).

2.4.2.3 Display Ports

The display ports consist of output logic and pins that transmit the display data to the associated encoding logic and send the data to the display device (that is, LVDS, HDMI*, DVI, SDVO, and so on). All display interfaces connecting external displays are now repartitioned and driven from the PCH.

Interfaces

2.4.3 Intel® Flexible Display Interface (Intel® FDI)

The Intel Flexible Display Interface (Intel® FDI) is a proprietary link for carrying display traffic from the Processor Graphics controller to the PCH display I/Os. Intel® FDI supports two independent channels—one for pipe A and one for pipe B.

• Each channel has four transmit (Tx) differential pairs used for transporting pixel and framing data from the display engine.

• Each channel has one single-ended LineSync and one FrameSync input (1-V CMOS signaling).

• One display interrupt line input (1-V CMOS signaling).

•Intel

• Common 100-MHz reference clock.

• Each channel transports at a rate of 2.7 Gbps.

• PCH supports end-to-end lane reversal across both channels (no reversal support

FDI may dynamically scalable down to 2X or 1X based on actual display

bandwidth requirements.

required in the processor).

2.4.4 Multi-Graphics Controller Multi-Monitor Support

The processor supports simultaneous use of the Processor Graphics Controller (GT) and a x16 PCI Express Graphics (PEG) device.

The processor supports a maximum of 2 displays connected to the PEG card in parallel with up to 2 displays connected to the PCH.

Note: When supporting Multi Graphics controllers Multi-Monitors, “drag and drop” between

monitors and the 2x8 PEG is not supported.

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Interfaces

2.5 Platform Environment Control Interface (PECI)

The PECI is a one-wire interface that provides a communication channel between a PECI client (processor) and a PECI master. The processor implements a PECI interface to:

• Allow communication of processor thermal and other information to the PECI master.

• Read averaged Digital Thermal Sensor (DTS) values for fan speed control.

2.6 Interface Clocking

2.6.1 Internal Clocking Requirements

Table 2-4. Reference Clock

Reference Input Clock Input Frequency Associated PLL

BCLK[0]/BCLK#[0] 100 MHz Processor/Memory/Graphics/PCIe/DMI/FDI

§ §

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Interfaces

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Technologies

3 Technologies

This chapter provides a high-level description of Intel technologies implemented in the processor.

The implementation of the features may vary between the processor SKUs.

Details on the different technologies of Intel processors and other relevant external notes are located at the Intel technology web site: http://www.intel.com/technology/

3.1 Intel® Virtualization Technology (Intel® VT)

Intel Virtualization Technology (Intel® VT) makes a single system appear as multiple independent systems to software. This allows multiple, independent operating systems to run simultaneously on a single system. Intel VT comprises technology components to support virtualization of platforms based on Intel architecture microprocessors and chipsets. Intel Virtualization Technology (Intel VT-x) added hardware support in the processor to improve the virtualization performance and robustness. Intel Virtualization Technology for Directed I/O (Intel VT-d) adds chipset hardware implementation to support and improve I/O virtualization performance and robustness.

Intel VT-x specifications and functional descriptions are included in the Intel IA-32 Architectures Software Developer’s Manual, Volume 3B and is available at:

64 and

http://www.intel.com/products/processor/manuals/index.htm

The Intel VT-d specification and other VT documents can be referenced at:

http://www.intel.com/technology/virtualization/index.htm

3.1.1 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture

(Intel

Intel VT-x provides hardware acceleration for virtualization of IA platforms. Virtual Machine Monitor (VMM) can use Intel VT-x features to provide improved a reliable virtualized platform. By using Intel VT-x, a VMM is:

• Robust: VMMs no longer need to use paravirtualization or binary translation. This

• Enhanced: Intel VT enables VMMs to run 64-bit guest operating systems on IA x86

• More reliable: Due to the hardware support, VMMs can now be smaller, less

• More secure: The use of hardware transitions in the VMM strengthens the isolation

VT-x) Objectives

means that they will be able to run off-the-shelf OSs and applications without any special steps.

processors.

complex, and more efficient. This improves reliability and availability and reduces the potential for software conflicts.

of VMs and further prevents corruption of one VM from affecting others on the same system.

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3.1.2 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Features

The processor core supports the following Intel VT-x features:

• Extended Page Tables (EPT)

— EPT is hardware assisted page table virtualization

— It eliminates VM exits from guest OS to the VMM for shadow page-table

maintenance

• Virtual Processor IDs (VPID)

— Ability to assign a VM ID to tag processor core hardware structures (such as

TLBs)

— This avoids flushes on VM transitions to give a lower-cost VM transition time

and an overall reduction in virtualization overhead.

• Guest Preemption Timer

— Mechanism for a VMM to preempt the execution of a guest OS after an amount

of time specified by the VMM. The VMM sets a timer value before entering a guest

— The feature aids VMM developers in flexibility and Quality of Service (QoS)

assurances

• Descriptor-Table Exiting

— Descriptor-table exiting allows a VMM to protect a guest OS from internal

(malicious software based) attack by preventing relocation of key system data structures like IDT (interrupt descriptor table), GDT (global descriptor table), LDT (local descriptor table), and TSS (task segment selector).

— A VMM using this feature can intercept (by a VM exit) attempts to relocate

these data structures and prevent them from being tampered by malicious software.

Technologies

3.1.3 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Objectives

The key Intel VT-d objectives are domain-based isolation and hardware-based virtualization. A domain can be abstractly defined as an isolated environment in a platform to which a subset of host physical memory is allocated. Virtualization allows for the creation of one or more partitions on a single system. This could be multiple partitions in the same operating system, or there can be multiple operating system instances running on the same system – offering benefits such as system consolidation, legacy migration, activity partitioning, or security.

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Technologies

3.1.4 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features

The processor supports the following Intel VT-d features:

• Memory controller and Processor Graphics comply with Intel® VT-d 1.2 specification.

•Two VT-d DMA remap engines.

— iGraphics DMA remap engine

—DMI/PEG

• Support for root entry, context entry, and default context

• 39-bit guest physical address and host physical address widths

• Support for 4K page sizes only

• Support for register-based fault recording only (for single entry only) and support for MSI interrupts for faults

• Support for both leaf and non-leaf caching

• Support for boot protection of default page table

• Support for non-caching of invalid page table entries

• Support for hardware based flushing of translated but pending writes and pending reads, on IOTLB invalidation

• Support for page-selective IOTLB invalidation

• MSI cycles (MemWr to address FEEx_xxxxh) not translated

— Translation faults result in cycle forwarding to VBIOS region (byte enables

masked for writes). Returned data may be bogus for internal agents, PEG/DMI interfaces return unsupported request status

• Interrupt Remapping is supported

• Queued invalidation is supported.

• VT-d translation bypass address range is supported (Pass Through)

Note: Intel VT-d Technology may not be available on all SKUs.

3.1.5 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features Not Supported

The following features are not supported by the processor with Intel VT-d:

• No support for PCISIG endpoint caching (ATS)

• No support for Intel VT-d read prefetching/snarfing (that is, translations within a cacheline are not stored in an internal buffer for reuse for subsequent translations).

• No support for advance fault reporting

• No support for super pages

• No support for Intel VT-d translation bypass address range (such usage models need to be resolved with VMM help in setting up the page tables correctly)

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Technologies

3.2 Intel® Trusted Execution Technology (Intel® TXT)

Intel Trusted Execution Technology (Intel TXT) defines platform-level enhancements that provide the building blocks for creating trusted platforms.

The Intel TXT platform helps to provide the authenticity of the controlling environment such that those wishing to rely on the platform can make an appropriate trust decision. The Intel TXT platform determines the identity of the controlling environment by accurately measuring and verifying the controlling software.

Another aspect of the trust decision is the ability of the platform to resist attempts to change the controlling environment. The Intel TXT platform will resist attempts by software processes to change the controlling environment or bypass the bounds set by the controlling environment.

Intel TXT is a set of extensions designed to provide a measured and controlled launch of system software that will then establish a protected environment for itself and any additional software that it may execute.

These extensions enhance two areas:

• The launching of the Measured Launched Environment (MLE)

• The protection of the MLE from potential corruption

The enhanced platform provides these launch and control interfaces using Safer Mode Extensions (SMX).

The SMX interface includes the following functions:

• Measured/Verified launch of the MLE

• Mechanisms to ensure the above measurement is protected and stored in a secure location

• Protection mechanisms that allow the MLE to control attempts to modify itself

For more information, refer to the Intel Developer’s Guide in http://www.intel.com/technology/security.

TXT Measured Launched Environment

3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)

The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology), that allows an execution core to function as two logical processors. While some execution resources (such as caches, execution units, and buses) are shared, each logical processor has its own architectural state with its own set of general-purpose registers and control registers. This feature must be enabled using the BIOS and requires operating system support.

Intel recommends enabling Intel HT Technology with Microsoft Windows 7*, Microsoft Windows Vista*, Microsoft Windows* XP Professional/Windows* XP Home, and disabling Intel HT Technology using the BIOS for all previous versions of Windows operating systems. For more information on Intel HT Technology, see

http://www.intel.com/technology/platform-technology/hyper-threading/.

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Technologies

3.4 Intel® Turbo Boost Technology

Intel® Turbo Boost Technology is a feature that allows the processor core to opportunistically and automatically run faster than its rated operating frequency/render clock if it is operating below power, temperature, and current limits. The Intel Turbo Boost Technology feature is designed to increase performance of both multi-threaded and single-threaded workloads. Maximum frequency is dependant on the SKU and number of active cores. No special hardware support is necessary for Intel Turbo Boost Technology. BIOS and the OS can enable or disable Intel Turbo Boost Technology. Compared with previous generation products, Intel Turbo Boost Technology will increase the ratio of application power to TDP. Thus, thermal solutions and platform cooling that are designed to less than thermal design guidance might experience thermal and performance issues since more applications will tend to run at the maximum power limit for significant periods of time.

Note: Intel Turbo Boost Technology may not be available on all SKUs.

3.4.1 Intel® Turbo Boost Technology Frequency

The processor’s rated frequency assumes that all execution cores are running an application at the thermal design power (TDP). However, under typical operation, not all cores are active. Therefore, most applications are consuming less than the TDP at the rated frequency. To take advantage of the available thermal headroom, the active cores can increase their operating frequency.

To determine the highest performance frequency amongst active cores, the processor takes the following into consideration:

• The number of cores operating in the C0 state.

• The estimated current consumption.

• The estimated power consumption.

•The temperature.

Any of these factors can affect the maximum frequency for a given workload. If the power, current, or thermal limit is reached, the processor will automatically reduce the frequency to stay with its TDP limit.

Note: Intel Turbo Boost Technology processor frequencies are only active if the operating

system is requesting the P0 state. For more information on P-states and C-states, refer to Chapter 4, “Power Management”.

3.4.2 Intel® Turbo Boost Technology Graphics Frequency

Graphics render frequency is selected by the processor dynamically based on graphics workload demand. The processor can optimize both processor and Processor Graphics performance by managing power for the overall package. For the Processor Graphics, this allows an increase in the render core frequency and increased graphics performance for graphics intensive workloads. In addition, during processor intensive workloads when the graphics power is low, the processor core can increase its frequency higher within the package power limit. Enabling Intel Turbo Boost Technology will maximize the performance of the processor core and the graphics render frequency within the specified package power levels.

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Technologies

3.5 Intel® Advanced Vector Extensions (Intel® AVX)

Intel Advanced Vector Extensions (Intel AVX) is the latest expansion of the Intel instruction set. It extends the Intel Streaming SIMD Extensions (Intel SSE) from 128bit vectors into 256-bit vectors. Intel AVX addresses the continued need for vector floating-point performance in mainstream scientific and engineering numerical applications, visual processing, recognition, data-mining/synthesis, gaming, physics, cryptography and other areas of applications. The enhancement in Intel AVX allows for improved performance due to wider vectors, new extensible syntax, and rich functionality including the ability to better manage, rearrange, and sort data. For more information on Intel AVX, see http://www.intel.com/software/avx

3.6 Intel® Advanced Encryption Standard New

Instructions (Intel

The processor supports Advanced Encryption Standard New Instructions (Intel AES-NI) that are a set of Single Instruction Multiple Data (SIMD) instructions that enable fast and secure data encryption and decryption based on the Advanced Encryption Standard (AES). Intel AES-NI are valuable for a wide range of cryptographic applications; such as, applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption. AES is broadly accepted as the standard for both government and industry applications, and is widely deployed in various protocols.

Intel AES-NI consists of six Intel SSE instructions. Four instructions, AESENC, AESENCLAST, AESDEC, and AESDELAST facilitate high performance AES encryption and decryption. The other two, AESIMC and AESKEYGENASSIST, support the AES key expansion procedure. Together, these instructions provide a full hardware for supporting AES, offering security, high performance, and a great deal of flexibility.

3.6.1 PCLMULQDQ Instruction

The processor supports the carry-less multiplication instruction, PCLMULQDQ. PCLMULQDQ is a Single Instruction Multiple Data (SIMD) instruction that computes the 128-bit carry-less multiplication of two, 64-bit operands without generating and propagating carries. Carry-less multiplication is an essential processing component of several cryptographic systems and standards. Hence, accelerating carry-less multiplication can significantly contribute to achieving high speed secure computing and communication.

AES-NI)

3.7 Intel® 64 Architecture x2APIC

The x2APIC architecture extends the xAPIC architecture that provides a key mechanism for interrupt delivery. This extension is intended primarily to increase processor addressability.

Specifically, x2APIC:

• Retains all key elements of compatibility to the xAPIC architecture

— delivery modes

— interrupt and processor priorities

— interrupt sources

— interrupt destination types

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Technologies

• Provides extensions to scale processor addressability for both the logical and physical destination modes

• Adds new features to enhance performance of interrupt delivery

• Reduces complexity of logical destination mode interrupt delivery on link based architectures

The key enhancements provided by the x2APIC architecture over xAPIC are the following:

• Support for two modes of operation to provide backward compatibility and extensibility for future platform innovations

— In xAPIC compatibility mode, APIC registers are accessed through a memory

mapped interface to a 4 KB page, identical to the xAPIC architecture.

— In x2APIC mode, APIC registers are accessed through Model Specific Register

(MSR) interfaces. In this mode, the x2APIC architecture provides significantly increased processor addressability and some enhancements on interrupt delivery.

• Increased range of processor addressability in x2APIC mode

— Physical xAPIC ID field increases from 8 bits to 32 bits, allowing for interrupt

processor addressability up to 4G-1 processors in physical destination mode. A processor implementation of x2APIC architecture can support fewer than 32bits in a software transparent fashion.

— Logical xAPIC ID field increases from 8 bits to 32 bits. The 32-bit logical x2APIC

ID is partitioned into two sub-fields—a 16-bit cluster ID and a 16-bit logical ID within the cluster. Consequently, ((2^20) -16) processors can be addressed in logical destination mode. Processor implementations can support fewer than 16 bits in the cluster ID sub-field and logical ID sub-field in a software agnostic fashion.

• More efficient MSR interface to access APIC registers

— To enhance inter-processor and self directed interrupt delivery as well as the

ability to virtualize the local APIC, the APIC register set can be accessed only through MSR based interfaces in the x2APIC mode. The Memory Mapped IO (MMIO) interface used by xAPIC is not supported in the x2APIC mode.

• The semantics for accessing APIC registers have been revised to simplify the programming of frequently-used APIC registers by system software. Specifically, the software semantics for using the Interrupt Command Register (ICR) and End Of Interrupt (EOI) registers have been modified to allow for more efficient delivery and dispatching of interrupts.

The x2APIC extensions are made available to system software by enabling the local x2APIC unit in the “x2APIC” mode. To benefit from x2APIC capabilities, a new Operating System and a new BIOS are both needed, with special support for the x2APIC mode.

The x2APIC architecture provides backward compatibility to the xAPIC architecture and forward extendibility for future Intel platform innovations.

Note: Intel x2APIC technology may not be available on all processor SKUs.

For more information, refer to the Intel

64 Architecture x2APIC Specification at

http://www.intel.com/products/processor/manuals/

§ §

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Technologies

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Power Management

G0 – Working

S0 – CPU Fully powered on

C0 – Active mode

C1 – Auto halt

C1E – Auto h a lt, low freq, lo w voltag e

C3 – L1/L2 caches flush, clocks off

C6 – save core states before shutdown

C7 – similar to C6, L3 flush

G1 – Sleepin g

S3 cold – Sleep – Suspend To Ram (STR)

S4 – Hibernate – Suspend To Disk (STD), Wakeup on PCH

S5 – Soft Off – no power, Wakeup on PCH

G3 – Mechanical Off

* Note: Power states availability may vary between the different SKUs

4 Power Management

This chapter provides information on the following power management topics:

• Advanced Configuration and Power Interface (ACPI) States

• Processor Core

• Integrated Memory Controller (IMC)

• PCI Express*

• Direct Media Interface (DMI)

• Processor Graphics Controller

Figure 4-1. Power States

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Power Management

4.1 Advanced Configuration and Power Interface (ACPI) States Supported

The ACPI states supported by the processor are described in this section.

4.1.1 System States

Table 4-1. System States

State Description

G0/S0 Full On

G1/S3-Cold Suspend-to-RAM (STR). Context saved to memory (S3-Hot is not supported by the processor).

G1/S4 Suspend-to-Disk (STD). All power lost (except wakeup on PCH).

G2/S5 Soft off. All power lost (except wakeup on PCH). Total reboot.

G3 Mechanical off. All power removed from system.

4.1.2 Processor Core / Package Idle States

Table 4-2. Processor Core / Package State Support

State Description

C0 Active mode, processor executing code

C1 AutoHALT state

C1E AutoHALT state with lowest frequency and voltage operating point

C6 Execution cores in this state save their architectural state before removing core voltage.

Execution cores in C3 flush their L1 instruction cache, L1 data cache, and L2 cache to the L3 shared cache. Clocks are shut off to each core.

4.1.3 Integrated Memory Controller States

Table 4-3. Integrated Memory Controller States

State Description

Power up CKE asserted. Active mode

Pre-charge

Power-down

Active Power-

Down

Self-Refresh CKE de-asserted using device self-refresh

CKE de-asserted (not self-refresh) with all banks closed

CKE de-asserted (not self-refresh) with minimum one bank active

4.1.4 PCI Express* Link States

Table 4-4. PCI Express* Link States

State Description

L0 Full on – Active transfer state

L0s First Active Power Management low power state – Low exit latency

L1 Lowest Active Power Management – Longer exit latency

L3 Lowest power state (power-off) – Longest exit latency

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Power Management

4.1.5 Direct Media Interface (DMI) States

Table 4-5. Direct Media Interface (DMI) States

State Description

L0 Full on – Active transfer state

L0s First Active Power Management low power state – Low exit latency

L1 Lowest Active Power Management – Longer exit latency

L3 Lowest power state (power-off) – Longest exit latency

4.1.6 Processor Graphics Controller States

Table 4-6. Processor Graphics Controller States

State Description

D0 Full on, display active

D3 Cold Power-off

4.1.7 Interface State Combinations

Table 4-7. G, S, and C State Combinations

Global

(G) State

G0 S0 C0 Full On On Full On

G0 S0 C1/C1E Auto-Halt On Auto-Halt

G0 S0 C3 Deep Sleep On Deep Sleep

G0 S0 C6 Deep Power-down On Deep Power-down

G1 S3 Power off Off, except RTC Suspend to RAM

G1 S4 Power off Off, except RTC Suspend to Disk

G2 S5 Power off Off, except RTC Soft Off

G3 NA Power off Power off Hard off

Sleep

(S) State

Processor

Package

Processor State System Clocks Description

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4.2 Processor Core Power Management

While executing code, Enhanced Intel SpeedStep Technology optimizes the processor’s frequency and core voltage based on workload. Each frequency and voltage operating point is defined by ACPI as a P-state. When the processor is not executing code, it is idle. A low-power idle state is defined by ACPI as a C-state. In general, lower power C-states have longer entry and exit latencies.

4.2.1 Enhanced Intel® SpeedStep® Technology

The following are the key features of Enhanced Intel SpeedStep Technology:

• Multiple frequency and voltage points for optimal performance and power efficiency. These operating points are known as P-states.

• Frequency selection is software controlled by writing to processor MSRs. The voltage is optimized based on the selected frequency and the number of active processor cores.

— If the target frequency is higher than the current frequency, V

in steps to an optimized voltage. This voltage is signaled by the SVID bus to the voltage regulator. Once the voltage is established, the PLL locks on to the target frequency.

— If the target frequency is lower than the current frequency, the PLL locks to the

target frequency, then transitions to a lower voltage by signaling the target voltage on SVID bus.

— All active processor cores share the same frequency and voltage. In a multi-

core processor, the highest frequency P-state requested amongst all active cores is selected.

— Software-requested transitions are accepted at any time. If a previous

transition is in progress, the new transition is deferred until the previous transition is completed.

• The processor controls voltage ramp rates internally to ensure glitch-free transitions.

• Because there is low transition latency between P-states, a significant number of transitions per-second are possible.

Power Management

is ramped up

4.2.2 Low-Power Idle States

When the processor is idle, low-power idle states (C-states) are used to save power. More power savings actions are taken for numerically higher C-states. However, higher C-states have longer exit and entry latencies. Resolution of C-states occur at the thread, processor core, and processor package level. Thread-level C-states are available if Intel HT Technology is enabled.

Caution: Long term reliability cannot be assured unless all the Low Power Idle States are

enabled.

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Power Management

Processor Package State

Core 1 State

Thread 1Thread 0

Core 0 State

Thread 1Thread 0

C1 C1E C6C3

MWAIT(C1), HLT

MWAIT(C6),

P_LVL3 I/O Read

MWAIT(C3),

P_LV2 I/O Read

MWAIT(C1), HLT

(C1E Enabled)

Figure 4-2. Idle Power Management Breakdown of the Processor Cores

Entry and exit of the C-States at the thread and core level are shown in Figure 4-3.

Figure 4-3. Thread and Core C-State Entry and Exit

While individual threads can request low power C-states, power saving actions only take place once the core C-state is resolved. Core C-states are automatically resolved by the processor. For thread and core C-states, a transition to and from C0 is required before entering any other C-state.

Table 4-8. Coordination of Thread Power States at the Core Level

Processor Core

C-State

C0 C0 C0 C0 C0

Thread 0

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Note:

1. If enabled, the core C-state will be C1E if all enabled cores have also resolved a core C1 state or higher.

C1 C0 C1

C3 C0 C1

C6 C0 C1

Thread 1

C0 C1 C3 C6

C3 C3

C3 C6

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Power Management

4.2.3 Requesting Low-Power Idle States

The primary software interfaces for requesting low power idle states are through the MWAIT instruction with sub-state hints and the HLT instruction (for C1 and C1E). However, software may make C-state requests using the legacy method of I/O reads from the ACPI-defined processor clock control registers, referred to as P_LVLx. This method of requesting C-states provides legacy support for operating systems that initiate C-state transitions using I/O reads.

For legacy operating systems, P_LVLx I/O reads are converted within the processor to the equivalent MWAIT C-state request. Therefore, P_LVLx reads do not directly result in I/O reads to the system. The feature, known as I/O MWAIT redirection, must be enabled in the BIOS.

Note: The P_LVLx I/O Monitor address needs to be set up before using the P_LVLx I/O read

interface. Each P-LVLx is mapped to the supported MWAIT(Cx) instruction as shown in

Tab l e 4 -9 .

Table 4-9. P_LVLx to MWAIT Conversion

P_LVLx MWAIT(Cx) Notes

P_LVL2 MWAIT(C3)

P_LVL3 MWAIT(C6) C6. No sub-states allowed.

The BIOS can write to the C-state range field of the PMG_IO_CAPTURE MSR to restrict the range of I/O addresses that are trapped and emulate MWAIT like functionality. Any P_LVLx reads outside of this range does not cause an I/O redirection to MWAIT(Cx) like request. They fall through like a normal I/O instruction.

Note: When P_LVLx I/O instructions are used, MWAIT substates cannot be defined. The

MWAIT substate is always zero if I/O MWAIT redirection is used. By default, P_LVLx I/O redirections enable the MWAIT 'break on EFLAGS.IF’ feature that triggers a wakeup on an interrupt, even if interrupts are masked by EFLAGS.IF.

4.2.4 Core C-states

The following are general rules for all core C-states, unless specified otherwise:

• A core C-State is determined by the lowest numerical thread state (such as Thread 0 requests C1E while Thread 1 requests C3, resulting in a core C1E state). See

Tab l e 4 -7 .

• A core transitions to C0 state when:

— An interrupt occurs — There is an access to the monitored address if the state was entered using an

MWAIT instruction

• For core C1/C1E, core C3, and core C6, an interrupt directed toward a single thread wakes only that thread. However, since both threads are no longer at the same core C-state, the core resolves to C0.

• A system reset re-initializes all processor cores.

4.2.4.1 Core C0 State

The normal operating state of a core where code is being executed.

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4.2.4.2 Core C1/C1E State

C1/C1E is a low power state entered when all threads within a core execute a HLT or MWAIT(C1/C1E) instruction.

A System Management Interrupt (SMI) handler returns execution to either Normal

state or the C1/C1E state. See the Intel

Developer’s Manual, Volume 3A/3B: System Programmer’s Guide for more information.

While a core is in C1/C1E state, it processes bus snoops and snoops from other threads. For more information on C1E, see Section 4.2.5.2.

4.2.4.3 Core C3 State

Individual threads of a core can enter the C3 state by initiating a P_LVL2 I/O read to the P_BLK or an MWAIT(C3) instruction. A core in C3 state flushes the contents of its L1 instruction cache, L1 data cache, and L2 cache to the shared L3 cache, while maintaining its architectural state. All core clocks are stopped at this point. Because the core’s caches are flushed, the processor does not wake any core that is in the C3 state when either a snoop is detected or when another core accesses cacheable memory.

4.2.4.4 Core C6 State

Individual threads of a core can enter the C6 state by initiating a P_LVL3 I/O read or an MWAIT(C6) instruction. Before entering core C6, the core will save its architectural state to a dedicated SRAM. Once complete, a core will have its voltage reduced to zero volts. During exit, the core is powered on and its architectural state is restored.

4.2.4.5 C-State Auto-Demotion

In general, deeper C-states such as C6 have long latencies and have higher energy entry/exit costs. The resulting performance and energy penalties become significant when the entry/exit frequency of a deeper C-state is high. Therefore, incorrect or inefficient usage of deeper C-states have a negative impact on power. To increase residency and improve power in deeper C-states, the processor supports C-state autodemotion.

64 and IA-32 Architecture Software

There are two C-State auto-demotion options:

•C6 to C3

• C6/C3 To C1

The decision to demote a core from C6 to C3 or C3/C6 to C1 is based on each core’s immediate residency history. Upon each core C6 request, the core C-state is demoted to C3 or C1 until a sufficient amount of residency has been established. At that point, a core is allowed to go into C3/C6. Each option can be run concurrently or individually.

This feature is disabled by default. BIOS must enable it in the PMG_CST_CONFIG_CONTROL register. The auto-demotion policy is also configured by this register.

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4.2.5 Package C-States

The processor supports C0, C1/C1E, C3, and C6 power states. The following is a summary of the general rules for package C-state entry. These apply to all package Cstates unless specified otherwise:

• A package C-state request is determined by the lowest numerical core C-state amongst all cores.

• A package C-state is automatically resolved by the processor depending on the core idle power states and the status of the platform components.

— Each core can be at a lower idle power state than the package if the platform

does not grant the processor permission to enter a requested package C-state.

— The platform may allow additional power savings to be realized in the

processor.

— For package C-states, the processor is not required to enter C0 before entering

any other C-state.

The processor exits a package C-state when a break event is detected. Depending on the type of break event, the processor does the following:

• If a core break event is received, the target core is activated and the break event message is forwarded to the target core.

— If the break event is not masked, the target core enters the core C0 state and

the processor enters package C0.

• If the break event was due to a memory access or snoop request.

— But the platform did not request to keep the processor in a higher package C-

state, the package returns to its previous C-state.

— And the platform requests a higher power C-state, the memory access or snoop

request is serviced and the package remains in the higher power C-state.

Power Management

Table 4-10. Coordination of Core Power States at the Package Level

Core 1

C3 C3

C3 C6

Package C-State

C0 C0 C0 C0 C0

Core 0

Note:

1. If enabled, the package C-state will be C1E if all cores have resolved a core C1 state or higher.

C1 C0 C1 C3 C0 C1 C6 C0 C1

C0 C1 C3 C6

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Figure 4-4. Package C-State Entry and Exit

4.2.5.1 Package C0

This is the normal operating state for the processor. The processor remains in the normal state when at least one of its cores is in the C0 or C1 state or when the platform has not granted permission to the processor to go into a low power state. Individual cores may be in lower power idle states while the package is in C0.

4.2.5.2 Package C1/C1E

No additional power reduction actions are taken in the package C1 state. However, if the C1E sub-state is enabled, the processor automatically transitions to the lowest supported core clock frequency, followed by a reduction in voltage.

The package enters the C1 low power state when:

• At least one core is in the C1 state.

• The other cores are in a C1 or lower power state.

The package enters the C1E state when:

• All cores have directly requested C1E using MWAIT(C1) with a C1E sub-state hint.

• All cores are in a power state lower that C1/C1E but the package low power state is limited to C1/C1E using the PMG_CST_CONFIG_CONTROL MSR.

• All cores have requested C1 using HLT or MWAIT(C1) and C1E auto-promotion is enabled in IA32_MISC_ENABLES.

No notification to the system occurs upon entry to C1/C1E.

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4.2.5.3 Package C3 State

A processor enters the package C3 low power state when:

• At least one core is in the C3 state.

• The other cores are in a C3 or lower power state, and the processor has been granted permission by the platform.

• The platform has not granted a request to a package C6 state but has allowed a package C6 state.

In package C3-state, the L3 shared cache is valid.

4.2.5.4 Package C6 State

A processor enters the package C6 low power state when:

• At least one core is in the C6 state.

• The other cores are in a C6 or lower power state, and the processor has been granted permission by the platform.

In package C6 state, all cores have saved their architectural state and have had their core voltages reduced to zero volts. The L3 shared cache is still powered and snoopable in this state. The processor remains in package C6 state as long as any part of the L3 cache is active.

Power Management

4.3 Integrated Memory Controller (IMC) Power Management

The main memory is power managed during normal operation and in low-power ACPI Cx states.

4.3.1 Disabling Unused System Memory Outputs

Any system memory (SM) interface signal that goes to a memory module connector in which it is not connected to any actual memory devices (such as DIMM connector is unpopulated, or is single-sided) is tri-stated. The benefits of disabling unused SM signals are:

• Reduced power consumption.

• Reduced possible overshoot/undershoot signal quality issues seen by the processor I/O buffer receivers caused by reflections from potentially un-terminated transmission lines.

When a given rank is not populated, the corresponding chip select and CKE signals are not driven.

At reset, all rows must be assumed to be populated, until it can be proven that they are not populated. This is due to the fact that when CKE is tristated with an DIMM present, the DIMM is not ensured to maintain data integrity.

SCKE tri-state should be enabled by BIOS where appropriate, since at reset all rows must be assumed to be populated.

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4.3.2 DRAM Power Management and Initialization

The processor implements extensive support for power management on the SDRAM interface. There are four SDRAM operations associated with the Clock Enable (CKE) signals that the SDRAM controller supports. The processor drives four CKE pins to perform these operations.

The CKE is one of the power-save means. When CKE is off the internal DDR clock is disabled and the DDR power is reduced. The power-saving differs according the selected mode and the DDR type used. For more information, please refer to the IDD table in the DDR specification.

The DDR specification defines 3 levels of power-down that differ in power-saving and in wakeup time:

1. Active power-down (APD): This mode is entered if there are open pages when

de-asserting CKE. In this mode the open pages are retained. Power-saving in this mode is the lowest. Power consumption of DDR is defined by IDD3P. Exiting this mode is fined by tXP – small number of cycles.

2. Precharged power-down (PPD): This mode is entered if all banks in DDR are

precharged when de-asserting CKE. Power-saving in this mode is intermediate – better than APD, but less than DLL-off. Power consumption is defined by IDD2P1. Exiting this mode is defined by tXP. Difference from APD mode is that when wakingup all page-buffers are empty

3. DLL-off: In this mode the data-in DLLs on DDR are off. Power-saving in this mode

is the best among all power-modes. Power consumption is defined by IDD2P1. Exiting this mode is defined by tXP, but also tXPDLL (10 – 20 according to DDR type) cycles until first data transfer is allowed.

The processor supports 5 different types of power-down. The different modes are the power-down modes supported by DDR3 and combinations of these. The type of CKE power-down is defined by the configuration. The are options are:

1. No power-down

2. APD: The rank enters power-down as soon as idle-timer expires, no matter what is the bank status

3. PPD: When idle timer expires the MC sends PRE-all to rank and then enters powerdown

4. DLL-off: same as option (2) but DDR is configured to DLL-off

5. APD, change to PPD (APD-PPD): Begins as option (1), and when all page-close timers of the rank are expired, it wakes the rank, issues PRE-all, and returns to PPD APD, change to DLL-off (APD_DLLoff) – Begins as option (1), and when all pageclose timers of the rank are expired, it wakes the rank, issues PRE-all and returns to DLL-off power-down

The CKE is determined per rank when it is inactive. Each rank has an idle-counter. The idle-counter starts counting as soon as the rank has no accesses, and if it expires, the rank may enter power-down while no new transactions to the rank arrive to queues. The idle-counter begins counting at the last incoming transaction arrival.

It is important to understand that since the power-down decision is per rank, the MC can find many opportunities to power-down ranks even while running memory intensive applications, and savings are significant (may be a few watts, according to the DDR specification). This is significant when each channel is populated with more ranks.

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Selection of power modes should be according to power-performance or thermal tradeoffs of a given system:

• When trying to achieve maximum performance and power or thermal consideration is not an issue: use no power-down.

• In a system that tries to minimize power-consumption, try to use the deepest power-down mode possible – DLL-off or APD_DLLoff.

• In high-performance systems with dense packaging (that is, complex thermal design) the power-down mode should be considered in order to reduce the heating and avoid DDR throttling caused by the heating.

Control of the power-mode through CRB-BIOS: The BIOS selects by default no-powerdown. There are knobs to change the power-down selected mode.

Another control is the idle timer expiration count. This is set through PM_PDWN_config bits 7:0 (MCHBAR +4CB0). As this timer is set to a shorter time, the MC will have more opportunities to put DDR in power-down. The minimum recommended value for this register is 15. There is no BIOS hook to set this register. Customers who choose to change the value of this register can do it by changing the BIOS. For experiments, this register can be modified in real time if BIOS did not lock the MC registers.

Note: In APD, APD-PPD, and APD-DLLoff there is no point in setting the idle-counter in the

same range of page-close idle timer.

Another option associated with CKE power-down is the S_DLL-off. When this option is enabled, the SBR I/O slave DLLs go off when all channel ranks are in power-down. (Do not confuse it with the DLL-off mode, in which the DDR DLLs are off). This mode requires to define the I/O slave DLL wakeup time.

4.3.2.1 Initialization Role of CKE

During power-up, CKE is the only input to the SDRAM that has its level recognized (other than the DDR3 reset pin) once power is applied. It must be driven LOW by the DDR controller to make sure the SDRAM components float DQ and DQS during powerup. CKE signals remain LOW (while any reset is active) until the BIOS writes to a configuration register. Using this method, CKE is ensured to remain inactive for much longer than the specified 200 micro-seconds after power and clocks to SDRAM devices are stable.

4.3.2.2 Conditional Self-Refresh

Intel Rapid Memory Power Management (Intel RMPM) conditionally places memory into self-refresh in the package C3 and C6 low-power states. Intel RMPM functionality depends on the graphics/display state (relevant only when processor graphics is being used), as well as memory traffic patterns generated by other connected I/O devices. The target behavior is to enter self-refresh as long as there are no memory requests to service.

When entering the S3 – Suspend-to-RAM (STR) state or S0 conditional self-refresh, the processor core flushes pending cycles and then enters all SDRAM ranks into selfrefresh. The CKE signals remain LOW so the SDRAM devices perform self-refresh.

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4.3.2.3 Dynamic Power-down Operation

Dynamic power-down of memory is employed during normal operation. Based on idle conditions, a given memory rank may be powered down. The IMC implements aggressive CKE control to dynamically put the DRAM devices in a power-down state.

The processor core controller can be configured to put the devices in active power- down (CKE de-assertion with open pages) or precharge power-down (CKE de-assertion

with all pages closed). Precharge power-down provides greater power savings but has a bigger performance impact, since all pages will first be closed before putting the devices in power-down mode.

If dynamic power-down is enabled, all ranks are powered up before doing a refresh cycle and all ranks are powered down at the end of refresh.

4.3.2.4 DRAM I/O Power Management

Unused signals should be disabled to save power and reduce electromagnetic interference. This includes all signals associated with an unused memory channel. Clocks can be controlled on a per SO-DIMM basis. Exceptions are made for per SODIMM control signals such as CS#, CKE, and ODT for unpopulated SO-DIMM slots.

The I/O buffer for an unused signal should be tri-stated (output driver disabled), the input receiver (differential sense-amp) should be disabled, and any DLL circuitry related ONLY to unused signals should be disabled. The input path must be gated to prevent spurious results due to noise on the unused signals (typically handled automatically when input receiver is disabled).

4.4 PCI Express* Power Management

• Active power management support using L0s, and L1 states.

• All inputs and outputs disabled in L2/L3 Ready state.

Note: PEG interface does not support Hot Plug. Note: Power impact may be observed when PEG link disable power management state is

used.

4.5 Direct Media Interface (DMI) Power Management

• Active power management support using L0s/L1 state.

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4.6 Graphics Power Management

4.6.1 Intel® Rapid Memory Power Management (Intel® RMPM) (also known as CxSR)

The Intel Rapid Memory Power Management puts rows of memory into self refresh mode during C3/C6 to allow the system to remain in the lower power states longer. Desktop processors routinely save power during runtime conditions by entering the C3, C6 state. Intel RMPM is an indirect method of power saving that can have a significant effect on the system as a whole.

4.6.2 Intel® Graphics Performance Modulation Technology (Intel® GPMT)

Intel Graphics Power Modulation Technology (Intel GPMT) is a method for saving power in the graphics adapter while continuing to display and process data in the adapter. This method will switch the render frequency and/or render voltage dynamically between higher and lower power states supported on the platform based on render engine workload.

In products where Intel Technology) is supported and enabled, the functionality of Intel GPMT will be maintained by Intel Tec h no l og y ).

Graphics Dynamic Frequency (also known as Turbo Boost

4.6.3 Graphics Render C-State

Render C-State (RC6) is a technique designed to optimize the average power to the graphics render engine during times of idleness of the render engine. Render C-state is entered when the graphics render engine, blitter engine and the video engine have no workload being currently worked on and no outstanding graphics memory transactions. When the idleness condition is met, the Integrated Graphics will program the VR into a low voltage state (~0.4 V) through the SVID bus.

4.6.4 Intel® Smart 2D Display Technology (Intel® S2DDT)

Intel S2DDT reduces display refresh memory traffic by reducing memory reads required for display refresh. Power consumption is reduced by less accesses to the IMC. S2DDT is only enabled in single pipe mode.

Intel S2DDT is most effective with:

• Display images well suited to compression, such as text windows, slide shows, and so on. Poor examples are 3D games.

• Static screens such as screens with significant portions of the background showing 2D applications, processor benchmarks, and so on, or conditions when the processor is idle. Poor examples are full-screen 3D games and benchmarks that flip the display image at or near display refresh rates.

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4.6.5 Intel® Graphics Dynamic Frequency

Intel® Graphics Dynamic Frequency Technology is the ability of the processor and graphics cores to opportunistically increase frequency and/or voltage above the ensured processor and graphics frequency for the given part. Intel® Graphics Dynamic Frequency Technology is a performance feature that makes use of unused package power and thermals to increase application performance. The increase in frequency is determined by how much power and thermal budget is available in the package, and the application demand for additional processor or graphics performance. The processor core control is maintained by an embedded controller. The graphics driver dynamically adjusts between P-States to maintain optimal performance, power, and thermals. The graphics driver will always place the graphics engine in its lowest possible P-State; thereby, acting in the same capacity as Intel GPMT.

4.7 Thermal Power Management

See Section 4.6 for all graphics thermal power management-related features.

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5 Thermal Management

For thermal specifications and design guidelines, refer to the 2nd Generation Intel® Core™ Processor Family Desktop, Intel® Pentium® Processor Family Desktop, and Intel® Celeron® Processor Family Desktop, and LGA1155 Socket Thermal and Mechanical Specifications and Design Guidelines.

§ §

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Signal Description

6 Signal Description

This chapter describes the processor signals. They are arranged in functional groups according to their associated interface or category. The following notations are used to describe the signal type.

Notations Signal Type

IInput Pin

OOutput Pin

I/O Bi-directional Input/Output Pin

The signal description also includes the type of buffer used for the particular signal (see

Ta b le 6 -1 ).

Table 6-1. Signal Description Buffer Types

Signal Description

PCI Express*

DMI

CMOS CMOS buffers. 1.1-V tolerant

DDR3 DDR3 buffers: 1.5-V tolerant

Ref Voltage reference signal

Asynchronous

PCI Express interface signals. These signals are compatible with PCI Express* 2.0 Signalling Environment AC Specifications and are AC coupled. The buffers are not

3.3-V tolerant. Refer to the PCIe specification.

Direct Media Interface signals. These signals are based on PCI Express* 2.0 Signaling Environment AC Specifications (5 GT/s), but are DC coupled. The buffers are not

3.3-V tolerant.

Analog reference or output. May be used as a threshold voltage or for buffer compensation

Signal has no timing relationship with any reference clock.

Notes:

1. Qualifier for a buffer type.

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6.1 System Memory Interface Signals

Table 6-2. Memory Channel A Signals

Signal Description

Signal Name Description

SA_BS[2:0]

SA_WE#

SA_RAS#

SA_CAS#

SA_DQS[8:0]

SA_DQS#[8:0]

SA_DQ[63:0]

SA_MA[15:0]

SA_CK[3:0]

SA_CK#[3:0]

SA_CKE[3:0]

SA_CS#[3:0]

SA_ODT[3:0]

Bank Select: These signals define which banks are selected within each SDRAM rank.

Write Enable Control Signal: This signal is used with SA_RAS# and SA_CAS# (along with SA_CS#) to define the SDRAM Commands.

RAS Control Signal: This signal is used with SA_CAS# and SA_WE# (along with SA_CS#) to define the SRAM Commands.

CAS Control Signal: This signal is used with SA_RAS# and SA_WE# (along with SA_CS#) to define the SRAM Commands.

Data Strobes: SA_DQS[8:0] and its complement signal group make up a differential strobe pair. The data is captured at the crossing point of SA_DQS[8:0] and its SA_DQS#[8:0] during read and write transactions.

Data Bus: Channel A data signal interface to the SDRAM data bus. I/O

Memory Address: These signals are used to provide the multiplexed

row and column address to the SDRAM. SDRAM Differential Clock: Channel A SDRAM Differential clock signal

pair. The crossing of the positive edge of SA_CK and the negative edge of its complement SA_CK# are used to sample the command and control signals on the SDRAM.

SDRAM Inverted Differential Clock: Channel A SDRAM Differential clock signal-pair complement.

Clock Enable: (1 per rank). Used to:

• Initialize the SDRAMs during power-up

• Power-down SDRAM ranks

• Place all SDRAM ranks into and out of self-refresh during STR

Chip Select: (1 per rank). Used to select particular SDRAM components during the active state. There is one Chip Select for each SDRAM rank.

On Die Termination: Active Termination Control. O

Direction/

Buffer Type

DDR3

I/O

DDR3

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Signal Description

Table 6-3. Memory Channel B Signals

Signal Name Description

SB_BS[2:0]

SB_WE#

SB_RAS#

SB_CAS#

SB_DQS[8:0]

SB_DQS#[8:0]

SB_DQ[63:0]

SB_MA[15:0]

SB_CK[3:0]

SB_CK#[3:0]

SB_CKE[3:0]

SB_CS#[3:0]

SB_ODT[3:0]

Bank Select: These signals define which banks are selected within each SDRAM rank.

Write Enable Control Signal: This signal is used with SB_RAS# and SB_CAS# (along with SB_CS#) to define the SDRAM Commands.

RAS Control Signal: This signal is used with SB_CAS# and SB_WE# (along with SB_CS#) to define the SRAM Commands.

CAS Control Signal: This signal is used with SB_RAS# and SB_WE# (along with SB_CS#) to define the SRAM Commands.

Data Strobes: SB_DQS[8:0] and its complement signal group make up a differential strobe pair. The data is captured at the crossing point of SB_DQS[8:0] and its SB_DQS#[8:0] during read and write transactions.

Data Bus: Channel B data signal interface to the SDRAM data bus. I/O

Memory Address: These signals are used to provide the multiplexed

row and column address to the SDRAM. SDRAM Differential Clock: Channel B SDRAM Differential clock signal

pair. The crossing of the positive edge of SB_CK and the negative edge of its complement SB_CK# are used to sample the command and control signals on the SDRAM.

SDRAM Inverted Differential Clock: Channel B SDRAM Differential clock signal-pair complement.

Clock Enable: (1 per rank). Used to:

• Initialize the SDRAMs during power-up.

• Power-down SDRAM ranks.

• Place all SDRAM ranks into and out of self-refresh during STR.

Chip Select: (1 per rank). Used to select particular SDRAM components during the active state. There is one Chip Select for each SDRAM rank.

On Die Termination: Active Termination Control. O

Direction/

Buffer Type

DDR3

I/O

DDR3

6.2 Memory Reference and Compensation Signals

Table 6-4. Memory Reference and Compensation

Signal Name Description

SM_VREF

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DDR3 Reference Voltage: This provides reference voltage to the DDR3 interface and is defined as V

DDQ

/2.

Direction/

Buffer Type

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6.3 Reset and Miscellaneous Signals

Table 6-5. Reset and Miscellaneous Signals

Signal Description

Signal Name Description

Configuration Signals: The CFG signals have a default value of '1' if not

terminated on the board.

•CFG[1:0]: Reserved configuration lane. A test point may be placed on

the board for this lane.

• CFG[2]: PCI Express* Static x16 Lane Numbering Reversal

— 1 = Normal operation — 0 = Lane numbers reversed

• CFG[3]: Reserved

CFG[17:0]

• CFG[4]: Reserved configuration lane. A test point may be placed on

the board for this lane.

• CFG[6:5]: PCI Express Bifurcation

Note1

— 00 = 1 x8, 2 x4 PCI Express — 01 = Reserved

— 10 = 2 x8 PCI Express — 11 = 1 x16 PCI Express

• CFG[17:7]: Reserved configuration lanes. A test point may be placed

on the board for these lands.

FC_x

PM_SYNC

RESET#

RSVD

RSVD_NCTF

SM_DRAMRST#

FC signals are signals that are available for compatibility with other processors. A test point may be placed on the board for these lands.

Power Management Sync: A sideband signal to communicate power management status from the platform to the processor.

Platform Reset pin driven by the PCH I

RESERVED: All signals that are RSVD and RSVD_NCTF must be left unconnected on the board.

DDR3 DRAM Reset: Reset signal from processor to DRAM devices. One common to all channels.

Direction/

Buffer Type

CMOS

No Connect Non-Critical

to Function

CMOS

Notes:

1. PCIe bifurcation support varies with the processor and PCH SKUs used.

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6.4 PCI Express*-Based Interface Signals

Table 6-6. PCI Express* Graphics Interface Signals

Signal Name Description

PEG_ICOMPI

PEG_ICOMPO

PEG_RCOMPO

PEG_RX[15:0]

PEG_RX#[15:0]

PE_RX[3:0]

PE_RX#[3:0]

PEG_TX[15:0]

PEG_TX#[15:0]

PE_TX[3:0]

PE_TX#[3:0]

Notes:

PCI Express Input Current Compensation I

PCI Express Current Compensation I

PCI Express Resistance Compensation I

PCI Express Receive Differential Pair

PCI Express Transmit Differential Pair

Direction/ Buffer Type

PCI Express

1. PE_TX[3:0] and PE_RX[3:0] are only used for platforms that support 20 PCIe lanes.

6.5 Intel® Flexible Display Interface (Intel® FDI) Signals

Table 6-7. Intel® Flexible Display Interface (Intel® FDI)

Signal Name Description

Flexible Display Interface Frame Sync – Pipe A I

FDI0_FSYNC[0]

FDI0_LSYNC[0]

FDI_TX[7:0]

FDI_TX#[7:0]

FDI1_FSYNC[1]

FDI1_LSYNC[1]

FDI_INT

Intel

Flexible Display Interface Line Sync – Pipe A I

Intel

Flexible Display Interface Transmit Differential Pairs O

Intel

Flexible Display Interface Frame Sync – Pipe B I

Intel

Flexible Display Interface Line Sync – Pipe B I

Intel

Flexible Display Interface Hot Plug Interrupt I

Direction/

Buffer Type

Asynchronous

CMOS

FDI

CMOS

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Signal Description

6.6 Direct Media Interface (DMI) Signals

Table 6-8. Direct Media Interface (DMI) Signals – Processor to PCH Serial Interface

Signal Name Description

DMI_RX[3:0]

DMI_RX#[3:0]

DMI_TX[3:0]

DMI_TX#[3:0]

DMI Input from PCH: Direct Media Interface receive differential pair. I

DMI Output to PCH: Direct Media Interface transmit differential pair. O

Direction/

Buffer Type

6.7 Phase Lock Loop (PLL) Signals

Table 6-9. Phase Lock Loop (PLL) Signals

Signal Name Description

BCLK

BCLK#

Differential bus clock input to the processor I

Direction/

Buffer Type

Diff Clk

6.8 Test Access Points (TAP) Signals

DMI

Table 6-10. Test Access Points (TAP) Signals

Signal Name Description

Breakpoint and Performance Monitor Signals: These signals are

BPM#[7:0]

BCLK_ITP

BCLK_ITP#

DBR#

PRDY#

PREQ#

TCK

TDI

TDO

TMS

TRST#

outputs from the processor that indicate the status of breakpoints and programmable counters used for monitoring processor performance.

These pins are connected in parallel to the top side debug probe to enable debug capacities.

DBR# is used only in systems where no debug port is implemented on the system board. DBR# is used by a debug port interposer so that an in-target probe can drive system reset.

PRDY# is a processor output used by debug tools to determine processor debug readiness.

PREQ# is used by debug tools to request debug operation of the processor.

TCK (Test Clock): This signal provides the clock input for the processor Test Bus (also known as the Test Access Port). TCK must be driven low or allowed to float during power on Reset.

TDI (Test Data In): This signal transfers serial test data into the processor. TDI provides the serial input needed for JTAG specification support.

TDO (Test Data Out): This signal transfers serial test data out of the processor. TDO provides the serial output needed for JTAG specification support.

TMS (Test Mode Select): A JTAG specification support signal used by debug tools.

TRST# (Test Reset): This signal resets the Test Access Port (TAP) logic. TRST# must be driven low during power on Reset.

Direction/

Buffer Type

I/O

CMOS

Asynchronous

CMOS

Asynchronous

CMOS

Open Drain

CMOS

66 Datasheet, Volume 1

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Signal Description

6.9 Error and Thermal Protection Signals

Table 6-11. Error and Thermal Protection Signals

Signal Name Description

Catastrophic Error: This signal indicates that the system has

experienced a catastrophic error and cannot continue to operate. The processor will set this for non-recoverable machine check errors or other unrecoverable internal errors.

CATERR#

PECI

PROCHOT#

THERMTRIP#

On the processor, CATERR# is used for signaling the following types of errors:

• Legacy MCERRs – CATERR# is asserted for 16 BCLKs.

• Legacy IERRs – CATERR# remains asserted until warm or cold reset.

PECI (Platform Environment Control Interface): A serial sideband interface to the processor, it is used primarily for thermal, power, and error management.

Processor Hot: PROCHOT# goes active when the processor temperature monitoring sensor(s) detects that the processor has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. This signal can also be driven to the processor to activate the TCC.

Thermal Trip: The processor protects itself from catastrophic overheating by use of an internal thermal sensor. This sensor is set well above the normal operating temperature to ensure that there are no false trips. The processor will stop all execution when the junction temperature exceeds approximately 130 °C. This is signaled to the system by the THERMTRIP# pin.

6.10 Power Sequencing Signals

Table 6-12. Power Sequencing Signals

Direction/

Buffer Type

CMOS

I/O

Asynchronous

CMOS Input/

Open-Drain

Output

Asynchronous

CMOS

Signal Name Description

SM_DRAMPWROK Processor Input: Connects to PCH

SM_DRAMPWROK

UNCOREPWRGOOD

SKTOCC#

Datasheet, Volume 1 67

DRAMPWROK.

The processor requires this input signal to be a clean indication that the V within specifications. This requirement applies, regardless of the Sstate of the processor. 'Clean' implies that the signal will remain low (capable of sinking leakage current), without glitches, from the time that the power supplies are turned on until they come within specification. The signal must then transition monotonically to a high state. This is connected to the PCH PROCPWRGD signal.

SKTOCC# (Socket Occupied): Pulled down directly (0 Ohms) on the processor package to ground. There is no connection to the processor silicon for this signal. System board designers may use this signal to determine if the processor is present.

CCSA

, V

CCIO

, V

AXG

, and V

, power supplies are stable and

DDQ

Direction/

Buffer Type

Asynchronous

CMOS

Asynchronous

CMOS

Page 68

6.11 Processor Power Signals

Table 6-13. Processor Power Signals

Signal Description

Signal Name Description

VCC Processor core power rail Ref

VCCIO Processor power for I/O Ref

VDDQ Processor I/O supply voltage for DDR3 Ref

VCCAXG Graphics core power supply. Ref

VCCPLL VCCPLL provides isolated power for internal processor PLLs Ref

VCCSA System Agent power supply Ref

VIDSOUT

VIDSCLK

VIDALERT#

VCCSA_VID Voltage selection for VCCSA O

VIDALERT#, VIDSCLK, and VIDSCLK comprise a three signal serial synchronous interface used to transfer power management information between the processor and the voltage regulator controllers. This serial VID interface replaces the parallel VID interface on previous processors.

6.12 Sense Signals

Table 6-14. Sense Signals

Signal Name Description

VCC_SENSE VSS_SENSE

VAXG_SENSE

VSSAXG_SENSE

VCCIO_SENSE

VSS_SENSE_VCCIO

VDDQ_SENSE

VSSD_SENSE

VCCSA_SENSE

VCC_SENSE and VSS_SENSE provide an isolated, low impedance connection to the processor core voltage and ground. They can be used to sense or measure voltage near the silicon.

VAXG_SENSE and VSSAXG_SENSE provide an isolated, low impedance connection to the V be used to sense or measure voltage near the silicon.

VCCIO_SENSE and VSS_SENSE_VCCIO provide an isolated, low impedance connection to the processor V They can be used to sense or measure voltage near the silicon.

VDDQ_SENSE and VSSD_SENSE provides an isolated, low impedance connection to the V be used to sense or measure voltage near the silicon.

VCCSA_SENSE provide an isolated, low impedance connection to the processor system agent voltage. It can be used to sense or measure voltage near the silicon.

voltage and ground. They can

AXG

voltage and ground.

CCIO

voltage and ground. They can

DDQ

Direction/

Buffer Type

I/O

CMOS

Direction/

Buffer Type

Analog

6.13 Ground and Non-Critical to Function (NCTF) Signals

Table 6-15. Ground and Non-Critical to Function (NCTF) Signals

Signal Name Description

VSS Processor ground node GND

VSS_NCTF

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Non-Critical to Function: These pins are for package mechanical reliability.

Direction/

Buffer Type

Page 69

Signal Description

6.14 Processor Internal Pull-Up / Pull-Down Resistors

Table 6-16. Processor Internal Pull-Up / Pull-Down Resistors

Signal Name Pull-Up / Pull-Down Rail Value

BPM[7:0] Pull Up VCCIO 65–165 Ω

PRDY# Pull Up VCCIO 65–165 Ω

PREQ# Pull Up VCCIO 65–165 Ω

TCK Pull Down VSS 5–15 kΩ

TDI Pull Up VCCIO 5–15 kΩ

TMS Pull Up VCCIO 5–15 kΩ

TRST# Pull Up VCCIO 5–15 kΩ

CFG[17:0] Pull Up VCCIO 5–15 kΩ

§ §

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Signal Description

70 Datasheet, Volume 1

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Electrical Specifications

7 Electrical Specifications

7.1 Power and Ground Lands

The processor has VCC, VDDQ, VCCPLL, VCCSA, VCCAXG, VCCIO and VSS (ground) inputs for on-chip power distribution. All power lands must be connected to their respective processor power planes, while all VSS lands must be connected to the system ground plane. Use of multiple power and ground planes is recommended to reduce I*R drop. The VCC and VCCAXG lands must be supplied with the voltage determined by the processor Serial Voltage IDentification (SVID) interface. A new serial VID interface is implemented on the processor. Tab l e 7- 1 specifies the voltage level for the various VIDs.

7.2 Decoupling Guidelines

Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large current swings between low- and full-power states. This may cause voltages on power planes to sag below their minimum values, if bulk decoupling is not adequate. Larger bulk storage (C supply current during longer lasting changes in current demand (for example, coming out of an idle condition). Similarly, capacitors act as a storage well for current when entering an idle condition from a running condition. To keep voltages within specification, output decoupling must be properly designed.

), such as electrolytic capacitors,

BULK

Caution: Design the board to ensure that the voltage provided to the processor remains within

the specifications listed in Tab le 7 - 5. Failure to do so can result in timing violations or reduced lifetime of the processor.

7.2.1 Voltage Rail Decoupling

The voltage regulator solution needs to provide:

• bulk capacitance with low effective series resistance (ESR).

• a low interconnect resistance from the regulator to the socket.

• bulk decoupling to compensate for large current swings generated during poweron, or low-power idle state entry/exit.

The power delivery solution must ensure that the voltage and current specifications are met, as defined in Tab le 7 - 5.

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Electrical Specifications

7.3 Processor Clocking (BCLK[0], BCLK#[0])

The processor uses a differential clock to generate the processor core operating frequency, memory controller frequency, system agent frequencies, and other internal clocks. The processor core frequency is determined by multiplying the processor core ratio by the BCLK frequency. Clock multiplying within the processor is provided by an internal phase locked loop (PLL) that requires a constant frequency input, with exceptions for Spread Spectrum Clocking (SSC).

The processor’s maximum non-turbo core frequency is configured during power-on reset by using its manufacturing default value. This value is the highest non-turbo core multiplier at which the processor can operate. If lower maximum speeds are desired, the appropriate ratio can be configured using the FLEX_RATIO MSR.

7.3.1 Phase Lock Loop (PLL) Power Supply

An on-die PLL filter solution is implemented on the processor. Refer to Ta b le 7 - 6 for DC specifications.

7.4 VCC Voltage Identification (VID)

The processor uses three signals for the serial voltage identification interface to support automatic selection of voltages. Tab l e 7 -1 specifies the voltage level corresponding to the eight bit VID value transmitted over serial VID. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to a low voltage level. If the voltage regulation circuit cannot supply the voltage that is requested, the voltage regulator must disable itself. VID signals are CMOS push/pull drivers. Refer to Tab l e 7 -9 for the DC specifications for these signals. The VID codes will change due to temperature and/or current load changes in order to minimize the power of the part. A voltage range is provided in

Tab l e 7 -5 . The specifications are set so that one voltage regulator can operate with all

supported frequencies.

Individual processor VID values may be set during manufacturing so that two devices at the same core frequency may have different default VID settings. This is shown in the VID range values in Tabl e 7 -5 . The processor transitioning to an adjacent VID and its associated voltage. This will represent a DC shift in the loadline.

See the VR12/IMVP7 SVID Protocol for further details.

provides the ability to operate while

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Electrical Specifications

Table 7-1. VR 12.0 Voltage Identification Definition (Sheet 1 of 3)

VID7VID6VID5VID4VID3VID2VID1VID

HEX V

CC_MAX

0 0 0 0 0 0 0 0 0 0 0.00000 1 0 0 0 0 0 0 0 8 0 0.88500

0 0 0 0 0 0 0 1 0 1 0.25000 1 0 0 0 0 0 0 1 8 1 0.89000

0 0 0 0 0 0 1 0 0 2 0.25500 1 0 0 0 0 0 1 0 8 2 0.89500

0 0 0 0 0 0 1 1 0 3 0.26000 1 0 0 0 0 0 1 1 8 3 0.90000

0 0 0 0 0 1 0 0 0 4 0.26500 1 0 0 0 0 1 0 0 8 4 0.90500

0 0 0 0 0 1 0 1 0 5 0.27000 1 0 0 0 0 1 0 1 8 5 0.91000

0 0 0 0 0 1 1 0 0 6 0.27500 1 0 0 0 0 1 1 0 8 6 0.91500

0 0 0 0 0 1 1 1 0 7 0.28000 1 0 0 0 0 1 1 1 8 7 0.92000

0 0 0 0 1 0 0 0 0 8 0.28500 1 0 0 0 1 0 0 0 8 8 0.92500

0 0 0 0 1 0 0 1 0 9 0.29000 1 0 0 0 1 0 0 1 8 9 0.93000

0 0 0 0 1 0 1 0 0 A 0.29500 1 0 0 0 1 0 1 0 8 A 0.93500

0 0 0 0 1 0 1 1 0 B 0.30000 1 0 0 0 1 0 1 1 8 B 0.94000

0 0 0 0 1 1 0 0 0 C 0.30500 1 0 0 0 1 1 0 0 8 C 0.94500

0 0 0 0 1 1 0 1 0 D 0.31000 1 0 0 0 1 1 0 1 8 D 0.95000

0 0 0 0 1 1 1 0 0 E 0.31500 1 0 0 0 1 1 1 0 8 E 0.95500

0 0 0 0 1 1 1 1 0 F 0.32000 1 0 0 0 1 1 1 1 8 F 0.96000

0 0 0 1 0 0 0 0 1 0 0.32500 1 0 0 1 0 0 0 0 9 0 0.96500

0 0 0 1 0 0 0 1 1 1 0.33000 1 0 0 1 0 0 0 1 9 1 0.97000

0 0 0 1 0 0 1 0 1 2 0.33500 1 0 0 1 0 0 1 0 9 2 0.97500

0 0 0 1 0 0 1 1 1 3 0.34000 1 0 0 1 0 0 1 1 9 3 0.98000

0 0 0 1 0 1 0 0 1 4 0.34500 1 0 0 1 0 1 0 0 9 4 0.98500

0 0 0 1 0 1 0 1 1 5 0.35000 1 0 0 1 0 1 0 1 9 5 0.99000

0 0 0 1 0 1 1 0 1 6 0.35500 1 0 0 1 0 1 1 0 9 6 0.99500

0 0 0 1 0 1 1 1 1 7 0.36000 1 0 0 1 0 1 1 1 9 7 1.00000

0 0 0 1 1 0 0 0 1 8 0.36500 1 0 0 1 1 0 0 0 9 8 1.00500

0 0 0 1 1 0 0 1 1 9 0.37000 1 0 0 1 1 0 0 1 9 9 1.01000

0 0 0 1 1 0 1 0 1 A 0.37500 1 0 0 1 1 0 1 0 9 A 1.01500

0 0 0 1 1 0 1 1 1 B 0.38000 1 0 0 1 1 0 1 1 9 B 1.02000

0 0 0 1 1 1 0 0 1 C 0.38500 1 0 0 1 1 1 0 0 9 C 1.02500

0 0 0 1 1 1 0 1 1 D 0.39000 1 0 0 1 1 1 0 1 9 D 1.03000

0 0 0 1 1 1 1 0 1 E 0.39500 1 0 0 1 1 1 1 0 9 E 1.03500

0 0 0 1 1 1 1 1 1 F 0.40000 1 0 0 1 1 1 1 1 9 F 1.04000

0 0 1 0 0 0 0 0 2 0 0.40500 1 0 1 0 0 0 0 0 A 0 1.04500

0 0 1 0 0 0 0 1 2 1 0.41000 1 0 1 0 0 0 0 1 A 1 1.05000

0 0 1 0 0 0 1 0 2 2 0.41500 1 0 1 0 0 0 1 0 A 2 1.05500

0 0 1 0 0 0 1 1 2 3 0.42000 1 0 1 0 0 0 1 1 A 3 1.06000

0 0 1 0 0 1 0 0 2 4 0.42500 1 0 1 0 0 1 0 0 A 4 1.06500

0 0 1 0 0 1 0 1 2 5 0.43000 1 0 1 0 0 1 0 1 A 5 1.07000

0 0 1 0 0 1 1 0 2 6 0.43500 1 0 1 0 0 1 1 0 A 6 1.07500

0 0 1 0 0 1 1 1 2 7 0.44000 1 0 1 0 0 1 1 1 A 7 1.08000

0 0 1 0 1 0 0 0 2 8 0.44500 1 0 1 0 1 0 0 0 A 8 1.08500

0 0 1 0 1 0 0 1 2 9 0.45000 1 0 1 0 1 0 0 1 A 9 1.09000

0 0 1 0 1 0 1 0 2 A 0.45500 1 0 1 0 1 0 1 0 A A 1.09500

VID7VID6VID5VID4VID3VID2VID1VID

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Table 7-1. VR 12.0 Voltage Identification Definition (Sheet 2 of 3)

VID7VID6VID5VID4VID3VID2VID1VID

0 0 1 0 1 0 1 1 2 B 0.46000 1 0 1 0 1 0 1 1 A B 1.10000

0 0 1 0 1 1 0 0 2 C 0.46500 1 0 1 0 1 1 0 0 A C 1.10500

0 0 1 0 1 1 0 1 2 D 0.47000 1 0 1 0 1 1 0 1 A D 1.11000

0 0 1 0 1 1 1 0 2 E 0.47500 1 0 1 0 1 1 1 0 A E 1.11500

0 0 1 0 1 1 1 1 2 F 0.48000 1 0 1 0 1 1 1 1 A F 1.12000

0 0 1 1 0 0 0 0 3 0 0.48500 1 0 1 1 0 0 0 0 B 0 1.12500

0 0 1 1 0 0 0 1 3 1 0.49000 1 0 1 1 0 0 0 1 B 1 1.13000

0 0 1 1 0 0 1 0 3 2 0.49500 1 0 1 1 0 0 1 0 B 2 1.13500

0 0 1 1 0 0 1 1 3 3 0.50000 1 0 1 1 0 0 1 1 B 3 1.14000

0 0 1 1 0 1 0 0 3 4 0.50500 1 0 1 1 0 1 0 0 B 4 1.14500

0 0 1 1 0 1 0 1 3 5 0.51000 1 0 1 1 0 1 0 1 B 5 1.15000

0 0 1 1 0 1 1 0 3 6 0.51500 1 0 1 1 0 1 1 0 B 6 1.15500

0 0 1 1 0 1 1 1 3 7 0.52000 1 0 1 1 0 1 1 1 B 7 1.16000

0 0 1 1 1 0 0 0 3 8 0.52500 1 0 1 1 1 0 0 0 B 8 1.16500

0 0 1 1 1 0 0 1 3 9 0.53000 1 0 1 1 1 0 0 1 B 9 1.17000

0 0 1 1 1 0 1 0 3 A 0.53500 1 0 1 1 1 0 1 0 B A 1.17500

0 0 1 1 1 0 1 1 3 B 0.54000 1 0 1 1 1 0 1 1 B B 1.18000

0 0 1 1 1 1 0 0 3 C 0.54500 1 0 1 1 1 1 0 0 B C 1.18500

0 0 1 1 1 1 0 1 3 D 0.55000 1 0 1 1 1 1 0 1 B D 1.19000

0 0 1 1 1 1 1 0 3 E 0.55500 1 0 1 1 1 1 1 0 B E 1.19500

0 0 1 1 1 1 1 1 3 F 0.56000 1 0 1 1 1 1 1 1 B F 1.20000

0 1 0 0 0 0 0 0 4 0 0.56500 1 1 0 0 0 0 0 0 C 0 1.20500

0 1 0 0 0 0 0 1 4 1 0.57000 1 1 0 0 0 0 0 1 C 1 1.21000

0 1 0 0 0 0 1 0 4 2 0.57500 1 1 0 0 0 0 1 0 C 2 1.21500

0 1 0 0 0 0 1 1 4 3 0.58000 1 1 0 0 0 0 1 1 C 3 1.22000

0 1 0 0 0 1 0 0 4 4 0.58500 1 1 0 0 0 1 0 0 C 4 1.22500

0 1 0 0 0 1 0 1 4 5 0.59000 1 1 0 0 0 1 0 1 C 5 1.23000

0 1 0 0 0 1 1 0 4 6 0.59500 1 1 0 0 0 1 1 0 C 6 1.23500

0 1 0 0 0 1 1 1 4 7 0.60000 1 1 0 0 0 1 1 1 C 7 1.24000

0 1 0 0 1 0 0 0 4 8 0.60500 1 1 0 0 1 0 0 0 C 8 1.24500

0 1 0 0 1 0 0 1 4 9 0.61000 1 1 0 0 1 0 0 1 C 9 1.25000

0 1 0 0 1 0 1 0 4 A 0.61500 1 1 0 0 1 0 1 0 C A 1.25500

0 1 0 0 1 0 1 1 4 B 0.62000 1 1 0 0 1 0 1 1 C B 1.26000

0 1 0 0 1 1 0 0 4 C 0.62500 1 1 0 0 1 1 0 0 C C 1.26500

0 1 0 0 1 1 0 1 4 D 0.63000 1 1 0 0 1 1 0 1 C D 1.27000

0 1 0 0 1 1 1 0 4 E 0.63500 1 1 0 0 1 1 1 0 C E 1.27500

0 1 0 0 1 1 1 1 4 F 0.64000 1 1 0 0 1 1 1 1 C F 1.28000

0 1 0 1 0 0 0 0 5 0 0.64500 1 1 0 1 0 0 0 0 D 0 1.28500

0 1 0 1 0 0 0 1 5 1 0.65000 1 1 0 1 0 0 0 1 D 1 1.29000

0 1 0 1 0 0 1 0 5 2 0.65500 1 1 0 1 0 0 1 0 D 2 1.29500

0 1 0 1 0 0 1 1 5 3 0.66000 1 1 0 1 0 0 1 1 D 3 1.30000

0 1 0 1 0 1 0 0 5 4 0.66500 1 1 0 1 0 1 0 0 D 4 1.30500

0 1 0 1 0 1 0 1 5 5 0.67000 1 1 0 1 0 1 0 1 D 5 1.31000

HEX V

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VID7VID6VID5VID4VID3VID2VID1VID

HEX V

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Table 7-1. VR 12.0 Voltage Identification Definition (Sheet 3 of 3)

VID7VID6VID5VID4VID3VID2VID1VID

HEX V

CC_MAX

0 1 0 1 0 1 1 0 5 6 0.67500 1 1 0 1 0 1 1 0 D 6 1.31500

0 1 0 1 0 1 1 1 5 7 0.68000 1 1 0 1 0 1 1 1 D 7 1.32000

0 1 0 1 1 0 0 0 5 8 0.68500 1 1 0 1 1 0 0 0 D 8 1.32500

0 1 0 1 1 0 0 1 5 9 0.69000 1 1 0 1 1 0 0 1 D 9 1.33000

0 1 0 1 1 0 1 0 5 A 0.69500 1 1 0 1 1 0 1 0 D A 1.33500

0 1 0 1 1 0 1 1 5 B 0.70000 1 1 0 1 1 0 1 1 D B 1.34000

0 1 0 1 1 1 0 0 5 C 0.70500 1 1 0 1 1 1 0 0 D C 1.34500

0 1 0 1 1 1 0 1 5 D 0.71000 1 1 0 1 1 1 0 1 D D 1.35000

0 1 0 1 1 1 1 0 5 E 0.71500 1 1 0 1 1 1 1 0 D E 1.35500

0 1 0 1 1 1 1 1 5 F 0.72000 1 1 0 1 1 1 1 1 D F 1.36000

0 1 1 0 0 0 0 0 6 0 0.72500 1 1 1 0 0 0 0 0 E 0 1.36500

0 1 1 0 0 0 0 1 6 1 0.73000 1 1 1 0 0 0 0 1 E 1 1.37000

0 1 1 0 0 0 1 0 6 2 0.73500 1 1 1 0 0 0 1 0 E 2 1.37500

0 1 1 0 0 0 1 1 6 3 0.74000 1 1 1 0 0 0 1 1 E 3 1.38000

0 1 1 0 0 1 0 0 6 4 0.74500 1 1 1 0 0 1 0 0 E 4 1.38500

0 1 1 0 0 1 0 1 6 5 0.75000 1 1 1 0 0 1 0 1 E 5 1.39000

0 1 1 0 0 1 1 0 6 6 0.75500 1 1 1 0 0 1 1 0 E 6 1.39500

0 1 1 0 0 1 1 1 6 7 0.76000 1 1 1 0 0 1 1 1 E 7 1.40000

0 1 1 0 1 0 0 0 6 8 0.76500 1 1 1 0 1 0 0 0 E 8 1.40500

0 1 1 0 1 0 0 1 6 9 0.77000 1 1 1 0 1 0 0 1 E 9 1.41000

0 1 1 0 1 0 1 0 6 A 0.77500 1 1 1 0 1 0 1 0 E A 1.41500

0 1 1 0 1 0 1 1 6 B 0.78000 1 1 1 0 1 0 1 1 E B 1.42000

0 1 1 0 1 1 0 0 6 C 0.78500 1 1 1 0 1 1 0 0 E C 1.42500

0 1 1 0 1 1 0 1 6 D 0.79000 1 1 1 0 1 1 0 1 E D 1.43000

0 1 1 0 1 1 1 0 6 E 0.79500 1 1 1 0 1 1 1 0 E E 1.43500

0 1 1 0 1 1 1 1 6 F 0.80000 1 1 1 0 1 1 1 1 E F 1.44000

0 1 1 1 0 0 0 0 7 0 0.80500 1 1 1 1 0 0 0 0 F 0 1.44500

0 1 1 1 0 0 0 1 7 1 0.81000 1 1 1 1 0 0 0 1 F 1 1.45000

0 1 1 1 0 0 1 0 7 2 0.81500 1 1 1 1 0 0 1 0 F 2 1.45500

0 1 1 1 0 0 1 1 7 3 0.82000 1 1 1 1 0 0 1 1 F 3 1.46000

0 1 1 1 0 1 0 0 7 4 0.82500 1 1 1 1 0 1 0 0 F 4 1.46500

0 1 1 1 0 1 0 1 7 5 0.83000 1 1 1 1 0 1 0 1 F 5 1.47000

0 1 1 1 0 1 1 0 7 6 0.83500 1 1 1 1 0 1 1 0 F 6 1.47500

0 1 1 1 0 1 1 1 7 7 0.84000 1 1 1 1 0 1 1 1 F 7 1.48000

0 1 1 1 1 0 0 0 7 8 0.84500 1 1 1 1 1 0 0 0 F 8 1.48500

0 1 1 1 1 0 0 1 7 9 0.85000 1 1 1 1 1 0 0 1 F 9 1.49000

0 1 1 1 1 0 1 0 7 A 0.85500 1 1 1 1 1 0 1 0 F A 1.49500

0 1 1 1 1 0 1 1 7 B 0.86000 1 1 1 1 1 0 1 1 F B 1.50000

0 1 1 1 1 1 0 0 7 C 0.86500 1 1 1 1 1 1 0 0 F C 1.50500

0 1 1 1 1 1 0 1 7 D 0.87000 1 1 1 1 1 1 0 1 F D 1.51000

0 1 1 1 1 1 1 0 7 E 0.87500 1 1 1 1 1 1 1 0 F E 1.51500

0 1 1 1 1 1 1 1 7 F 0.88000 1 1 1 1 1 1 1 1 F F 1.52000

VID7VID6VID5VID4VID3VID2VID1VID

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7.5 System Agent (SA) VCC VID

The VCCSA is configured by the processor output pin VCCSA_VID.

VCCSA_VID output default logic state is low for the processors; logic high is reserved for future compatibility.

Tab l e 7 -2 specifies the different VCCSA_VID configurations.

Table 7-2. VCCSA_VID configuration

Processor Family VCCSA_VID Selected VCCSA

2nd Generation Intel

Pentium® processor family desktop,

Intel

Celeron® processor family desktop

Future Intel processors 1 Note 1

Core™ processor family desktop,

Electrical Specifications

0 0.925 V

Notes:

1. Some of V

configurations are reserved for future Intel processor families.

CCSA

7.6 Reserved or Unused Signals

The following are the general types of reserved (RSVD) signals and connection guidelines:

• RSVD – These signals should not be connected.

• RSVD_NCTF – These signals are non-critical to function and may be left unconnected

Arbitrary connection of these signals to VCC, V to any other signal (including each other) may result in component malfunction or incompatibility with future processors. See Chapter 8 for a land listing of the processor and the location of all reserved signals.

For reliable operation, always connect unused inputs or bi-directional signals to an appropriate signal level. Unused active high inputs should be connected through a resistor to ground (V

). Unused outputs maybe left unconnected; however, this may

interfere with some Test Access Port (TAP) functions, complicate debug probing, and prevent boundary scan testing. A resistor must be used when tying bi-directional signals to power or ground. When tying any signal to power or ground, a resistor will also allow for system testability. For details see Ta b le 7 - 9.

CCIO

, V

DDQ

, V

CCPLL

, V

CCSA, VCCAXG, VSS

, or

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7.7 Signal Groups

Signals are grouped by buffer type and similar characteristics as listed in Tab l e 7 -3 . The buffer type indicates which signaling technology and specifications apply to the signals. All the differential signals, and selected DDR3 and Control Sideband signals have OnDie Termination (ODT) resistors. There are some signals that do not have ODT and need to be terminated on the board.

Table 7-3. Signal Groups (Sheet 1 of 2)

Signal Group Type Si gnals

System Reference Clock

Differential CMOS Input BCLK[0], BCLK#[0]

DDR3 Reference Clocks

Differential DDR3 Output

DDR3 Command Signals

Single Ended DDR3 Output

DDR3 Data Signals

Single ended DDR3 Bi-directional SA_DQ[63:0], SB_DQ[63:0]

Differential DDR3 Bi-directional

TAP (ITP/XDP)

Single Ended CMOS Input TCK, TDI, TMS, TRST#

Single Ended CMOS Output TDO

Single Ended Asynchronous CMOS Output TAPPWRGOOD

Control Sideband

Single Ended CMOS Input CFG[17:0]

Single Ended

Single Ended Asynchronous CMOS Output THERMTRIP#, CATERR#

Single Ended Asynchronous CMOS Input

Single Ended Asynchronous Bi-directional PECI

Single Ended

Power/Ground/Other

Asynchronous CMOS/Open Drain Bi-directional

CMOS Input Open Drain Output Bi-directional CMOS Input

/Open Drain Output

Power VCC, VCC_NCTF, VCCIO, VCCPLL, VDDQ, VCCAXG

Ground VSS

No Connect and test point RSVD, RSVD_NCTF, RSVD_TP, FC_x

SA_CK[3:0], SA_CK#[3:0] SB_CK[3:0], SB_CK#[3:0]

SA_RAS#, SB_RAS#, SA_CAS#, SB_CAS# SA_WE#, SB_WE# SA_MA[15:0], SB_MA[15:0] SA_BS[2:0], SB_BS[2:0] SM_DRAMRST# SA_CS#[3:0], SB_CS#[3:0] SA_ODT[3:0], SB_ODT[3:0] SA_CKE[3:0], SB_CKE[3:0]

SA_DQS[8:0], SA_DQS#[8:0] SB_DQS[8:0], SB_DQS#[8:0]

PROCHOT#

SM_DRAMPWROK, UNCOREPWRGOOD RESET#

VIDALERT# VIDSCLK VIDSOUT

, PM_SYNC,

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Electrical Specifications

Table 7-3. Signal Groups (Sheet 2 of 2)

Signal Group Type Signals

Sense Points

Other SKTOCC#, DBR#

PCI Express*

Differential PCI Express Input

Differential PCI Express Output

Single Ended Analog Input PEG_ICOMP0, PEG_COMPI, PEG_RCOMP0

DMI

Differential DMI Input DMI_RX[3:0], DMI_RX#[3:0]

Differential DMI Output DMI_TX[3:0], DMI_TX#[3:0]

Intel

FDI

Single Ended FDI Input FDI_FSYNC[1:0], FDI_LSYNC[1:0], FDI_INT

Differential FDI Output FDI_TX[7:0], FDI_TX#[7:0]

Single Ended Analog Input FDI_COMPIO, FDI_ICOMPO

Notes:

1. Refer to Chapter 6 and Chapter 8 for signal description details.

2. SA and SB refer to DDR3 Channel A and DDR3 Channel B.

3. The maximum rise/fall time for UNCOREPWRGOOD is 20 ns.

VCC_SENSE, VSS_SENSE, VCCIO_SENSE, VSS_SENSE_VCCIO, VAXG_SENSE, VSSAXG_SENSE

PEG_RX[15:0], PEG_RX#[15:0], PE_RX[3:0], PE_RX#[3:0]

PEG_TX[15:0], PEG_TX#[15:0], PE_TX[3:0], PE_TX#[3:0]

All Control Sideband Asynchronous signals are required to be asserted/de-asserted for at least 10 BCLKs with a maximum Trise/Tfall of 6 ns for the processor to recognize the proper signal state. See Section 7.10 for the DC specifications.

7.8 Test Access Port (TAP) Connection

Due to the voltage levels supported by other components in the Test Access Port (TAP) logic, Intel recommends the processor be first in the TAP chain, followed by any other components within the system. A translation buffer should be used to connect to the rest of the chain unless one of the other components is capable of accepting an input of the appropriate voltage. Two copies of each signal may be required with each driving a different voltage level.

The processor supports Boundary Scan (JTAG) IEEE 1149.1-2001 and IEEE 1149.62003 standards. Some small portion of the I/O pins may support only one of these standards.

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7.9 Storage Conditions Specifications

Environmental storage condition limits define the temperature and relative humidity that the device is exposed to while being stored in a moisture barrier bag. The specified storage conditions are for component level prior to board attach.

Ta b le 7 -4 specifies absolute maximum and minimum storage temperature limits that

represent the maximum or minimum device condition beyond which damage, latent or otherwise, may occur. The table also specifies sustained storage temperature, relative humidity, and time-duration limits. These limits specify the maximum or minimum device storage conditions for a sustained period of time. Failure to adhere to the following specifications can affect long term reliability of the processor.

Table 7-4. Storage Condition Ratings

Symbol Parameter Min Max Notes

The non-operating device storage

absolute storage

sustained storage

short term storage

sustained storage

Time

sustained storage

Time

short term storage

temperature. Damage (latent or otherwise) may occur when exceeded for any length of time.

The ambient storage temperature (in shipping media) for a sustained period of time

The ambient storage temperature (in shipping media) for a short period of time.

The maximum device storage relative humidity for a sustained period of time.

A prolonged or extended period of time; typically associated with customer shelf life.

A short-period of time. 0 hours 72 hours

-25 °C 125 °C 1, 2, 3, 4

-5 °C 40 °C 5, 6

-20°C 85°C

60% at 24 °C 6, 7

0 Months 30 Months 7

Notes:

1. Refers to a component device that is not assembled in a board or socket and is not electrically connected to a voltage reference or I/O signal.

2. Specified temperatures are not to exceed values based on data collected. Exceptions for surface mount reflow are specified by the applicable JEDEC standard. Non-adherence may affect processor reliability.

3. T

absolute storage

moisture barrier bags, or desiccant.

4. Component product device storage temperature qualification methods may follow JESD22-A119 (low temp) and JESD22-A103 (high temp) standards when applicable for volatile memory.

5. Intel branded products are specified and certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C and Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C.) Post board attach storage temperature limits are not specified for non-Intel branded boards.

6. The JEDEC J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

7. Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by T

applies to the unassembled component only and does not apply to the shipping media,

sustained storage

and customer shelf life in applicable Intel boxes and bags.

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7.10 DC Specifications

The processor DC specifications in this section are defined at the processor pads, unless noted otherwise. See Chapter 8 for the processor land listings and

Chapter 6 for signal definitions. Voltage and current specifications are detailed in Tab l e 7 -5 , Tab le 7 - 6, and Ta bl e 7 -7 .

The DC specifications for the DDR3 signals are listed in Tab l e 7 -8 Control Sideband and Test Access Port (TAP) are listed in Ta b le 7 -9 .

Tab l e 7 -5 through Tab le 7 - 7 list the DC specifications for the processor and are valid

only while meeting the thermal specifications (as specified in the Thermal / Mechanical Specifications and Guidelines), clock frequency, and input voltages. Care should be taken to read all notes associated with each parameter.

7.10.1 Voltage and Current Specifications

Table 7-5. Processor Core Active and Idle Mode DC Voltage and Current Specifications

(Sheet 1 of 2)

Symbol Pa rameter Min Typ Max Unit Note

VID VID Range 0.2500 — 1.5200 V 2

CC,BOOT

Ripple

VCC Loadline Slope 2011D, 2011C, 2011B (processors

VCC

with 95 W, 65 W, and 45 W TDPs)

Tolerance Band

2011D, 2011C, 2011B (processors with 95 W, 65 W, and 45 W TDPs)

TOB

VCC

TOB

PS0 PS1 PS2

Ripple: 2011D, 2011C, 2011B (processors

with 95 W, 65 W, and 45 W TDPs)

PS0 PS1 PS2

VCC Loadline Slope 2011A (processors with 35 W TDP)

Tolerance Band

2011A (processors with 35 W TDP)

PS0 PS1 PS2

Ripple: 2011A (processors with 35 W TDP)

PS0 PS1 PS2

Default V power up

2011D (processors with 95 W TDPs) I

2011C (processors with 65 W TDP) I

voltage for initial

1.7 mΩ 3, 5, 6

3, 5, 6,

±16 ±13

±11.5

±7

±10

-10/+25

2.9 mΩ

19 19

11.5

±10 ±10

-10/+25

—0 —V

— — 112 A 4

——75A4

3, 5, 6,

7, 8

3, 5, 6,

7, 8

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Table 7-5. Processor Core Active and Idle Mode DC Voltage and Current Specifications

(Sheet 2 of 2)

Symbol Parameter Min Typ Max Unit Note

CC_TDC

Notes:

1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.

2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).

3. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 20-MHz bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1-MΩ minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.

4. ICC_MAX specification is based on the V

5. The V

6. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must also be taken from processor VCC_SENSE and VSS_SENSE lands.

7. PSx refers to the voltage regulator power state as set by the SVID protocol.

8. 2011A (processors with 35 W TDP) loadline slope, TOB, and ripple specifications allow for a cost reduced voltage regulator for boards supporting only the 2011A (processors with 35 W TDP). 2011A (processors with 35 W TDP) processors may also use the loadline slope, TOB, and ripple specifications for the 2011D (processors with 95 W TDP), 2011C (processors with 65 W TDP), and 2011B (processors with 45 W TDP).

2011B (processors with 45 W TDP) I

2011A (processors with 35 W TDP) I

2011D (processors with 95 W TDPs) Sustained I

2011C (processors with 65 W TDP) Sustained I

2011B (processors with 45 W TDP) Sustained I

2011A (processors with 35 W TDP) Sustained I

specifications represent static and transient limits.

loadline at worst case (highest) tolerance and ripple.

——60A4

——35A4

——85A4

——55A4

——40A4

——25A4

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Table 7-6. Processor System Agent I/O Buffer Supply DC Voltage and Current

Specifications

Symbol Parameter Min Typ Max Unit Note

CCSA

DDQ

CCPLL

CCIO

SA_TDC

DDQ

DDQ_TDC

DDQ_STANDBY

CC_VCCPLL

CC_VCCPLL_TDC

CC_VCCIO

CC_VCCIO_TDC

Voltage for the system agent 0.879 0.925 0.971 V 2

Processor I/O supply voltage for DDR3

PLL supply voltage (DC + AC specification)

Processor I/O supply voltage for other than DDR3

1.425 1.5 1.575 V

1.71 1.8 1.89 V

-2/-3% 1.05 +2/+3% V 3

Current for the system agent — — 8.8 A

Sustained current for the system agent

Processor I/O supply current for DDR3

Processor I/O supply sustained current for DDR3

Processor I/O supply standby current for DDR3

——8.2A

— — 4.75 A

—— 1A

PLL supply current — — 1.5 A

PLL sustained supply current — — 0.93 A

Processor I/O supply current — — 8.5 A

Processor I/O supply sustained current

——8.5A

Notes:

2. V

3. ±5% total. Minimum of ±2% DC and 3% AC at the sense point. di/dt = 50 A/us with 150 ns step.

must be provided using a separate voltage source and not be connected to VCC. This specification is

CCSA

measured at VCCSA_SENSE.

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Table 7-7. Processor Graphics VID based (V

Specifications

Symbol Parameter Min Typ Max Unit Note

GFX_VID

AXG

Range

AXG

TOB

AXG

Ripple

AXG

AXG_TDC

Notes:

1. V

2. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical

3. The V

4. The loadlines specify voltage limits at the die measured at the VAXG_SENSE and VSSAXG_SENSE lands.

5. PSx refers to the voltage regulator power state as set by the SVID protocol.

6. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at

is VID based rail.

CCAXG

data. These specifications will be updated with characterized data from silicon measurements at a later date.

AXG_MIN

Voltage regulation feedback for voltage regulator circuits must also be taken from processor VAXG_SENSE and VSSAXG_SENSE lands.

manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor during a power management event (Adaptive Thermal Monitor, Enhanced Intel SpeedStep Technology, or Low Power States).

GFX_VID Range for V

Loadline Slope 4.1 mΩ 3, 4

CCAXG

Tolerance Band

CCAXG

PS0, PS1 PS2

Ripple:

PS0 PS1 PS2

Current for Processor Graphics core

Sustained current for Processor Graphics core

and V

loadlines represent static and transient limits.

AXG_MAX

) Supply DC Voltage and Current

AXG

0.2500 — 1.5200 V 1

11.5

±10 ±10

-10/+15

——35 A

——25 A

mV 3, 4, 5

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Table 7-8. DDR3 Signal Group DC Specifications

Symbol Parameter Min Typ Max Units Notes

ON_UP(DQ)

ON_DN(DQ)

ODT(DQ)

ODT(DC)

ON_UP(CK)

ON_DN(CK)

ON_UP(CMD)

ON_DN(CMD)

ON_UP(CTL)

ON_DN(CTL)

IL_SM_DRAMP

WROK

IH_SM_DRAMP

WROK

Input Low Voltage — — SM_VREF – 0.1 V 2,4

Input High Voltage SM_VREF + 0.1 — — V 3

Output Low Voltage

Output High Voltage

—

/ 2)* (R

DDQ

/(RON+R

– ((V

DDQ

(RON/(RON+R

DDQ

TERM

))

/ 2)*

TERM

—6

))

—V4,6

DDR3 data buffer pull-up resistance 24.31 28.6 32.9 Ω 5

DDR3 data buffer pull-down resistance

DDR3 on-die termination equivalent resistance for data signals

22.88 28.6 34.32 Ω 5

41.5

100

117

Ω 7

DDR3 on-die termination DC working point (driver set to receive mode)

DDR3 clock buffer pull-up resistance

DDR3 clock buffer pull-down resistance

DDR3 command buffer pull-up resistance

DDR3 command buffer pull-down resistance

DDR3 control buffer pull-up resistance

DDR3 control buffer pull-down resistance

Input Low Voltage for SM_DRAMPWROK

Input High Voltage for SM_DRAMPWROK

0.43*V

DDQ

0.5*V

DDQ

20.8 26 28.6 Ω 5

20.8 26 31.2 Ω 5

16 20 23 Ω 5

16 20 24 Ω 5

16 20 23 Ω 5

16 20 24 Ω 5

——V

*.55 +0.1 — — V 9

DDQ

0.56*V

*.55 – 0.1 V 9

DDQ

Input Leakage Current (DQ, CK) 0V

0.2*V

0.8*V V

DDQ

——

± 0.75 ± 0.55

± 0.9 ± 1.4

Input Leakage Current (CMD, CTL) 0V

0.2*V

0.8*V V

DDQ

——

± 0.85 ± 0.65

± 1.1

± 1.65

1,9

Notes:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low

2. V

value.

is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high

3. V

value.

4. V

and VOH may experience excursions above V

signal quality specifications.

5. This is the pull up/down driver resistance.

6. R

7. The minimum and maximum values for these signals are programmable by BIOS to one of the two sets.

8. DDR3 values are pre-silicon estimations and subject to change.

9. SM_DRAMPWROK must have a maximum of 15 ns rise or fall time over V

is the termination on the DIMM and in not controlled by the processor.

TERM

must be monotonic.

. However, input signal drivers must comply with the

DDQ

* 0.55 ±200 mV and edge

DDQ

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Table 7-9. Control Sideband and TAP Signal Group DC Specifications

Symbol Parameter Min Max Units Notes

Notes:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. The V

3. For V

4. V

Input Low Voltage — V

Input High Voltage V

Output Low Voltage — V

Output High Voltage V

Buffer on Resistance 23 73 Ω

Input Leakage Current — ±200 μA3

referred to in these specifications refers to instantaneous V

CCIO

between “0” V and V

and VOH may experience excursions above V

signal quality specifications.

. Measured when the driver is tristated.

CCIO

* 0.7 — V 2, 4

CCIO

* 0.9 — V 2, 4

CCIO

* 0.3 V 2

CCIO

* 0.1 V 2

CCIO

. However, input signal drivers must comply with the

Table 7-10. PCI Express* DC Specifications

Symbol Parameter Min Typ Max Units Notes

TX-DIFF-p-p Low

TX-DIFF-p-p

TX_CM-AC-p

TX_CM-AC-p-p

TX-DIFF-DC

RX-DC

RX-DIFF-DC

RX-DIFFp-p

RX_CM-AC-p

PEG_ICOMPO Comp Resistance 24.75 25 25.25 Ω 4, 5

PEG_COMPI Comp Resistance 24.75 25 25.25 Ω 4, 5

PEG_RCOMPO Comp Resistance 24.75 25 25.25 Ω 4, 5

Notes:

1. Refer to the PCI Express Base Specification for more details.

2. V

TX-AC-CM-PP

at least 10^

3. As measured with compliance test load. Defined as 2*|V

4. COMP resistance must be provided on the system board with 1% resistors.

5. PEG_ICOMPO, PEG_COMPI, PEG_RCOMPO are the same resistor.

6. RMS value.

7. Measured at Rx pins into a pair of 50-Ω terminations into ground. Common mode peak voltage is defined by the expression: max{|(Vd+ - Vd-) - V-CMDC|}.

8. DC impedance limits are needed to ensure Receiver detect.

9. The Rx DC Common Mode Impedance must be present when the Receiver terminations are first enabled to ensure that the Receiver Detect occurs properly. Compensation of this impedance can start immediately and the 15 Rx Common Mode Impedance (constrained by RLRX-CM to 50 Ω ±20%) must be within the specified range by the time Detect is entered.

10. Low impedance defined during signaling. Parameter is captured for 5.0 GHz by RLTX-DIFF.

11. These are pre-silicon estimates and are subject to change.

Low differential peak to peak Tx voltage swing

0.4 0.5 0.6 V 3

Differential peak to peak Tx voltage swing 0.8 1 1.2 V 3

Tx AC Peak Common Mode Output Voltage (Gen1 only)

Tx AC Peak Common Mode Output Voltage (Gen2 only)

— — 20 mV 1, 2, 6

— — 100 mV 1, 2

DC Differential Tx Impedance (Gen1 only) 80 90 120 Ω 1, 10

DC Common Mode Rx Impedance 40 45 60 Ω 1, 8, 9

DC Differential Rx Impedance (Gen1 only) 80 90 120 Ω 1

Differential Rx input Peak to Peak Voltage (Gen1 only)

Differential Rx input Peak to Peak Voltage (Gen2 only)

0.175 — 1.2 V 1

0.12 — 1.2 V 1

Rx AC peak Common Mode Input Voltage 150 — — mV 1, 7

and V

UI.

TX-AC-CM-P

are defined in the PCI Express Base Specification. Measurement is made over

– V

TXD+

TXD-

1,11

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7.11 Platform Environmental Control Interface (PECI) DC Specifications

PECI is an Intel proprietary interface that provides a communication channel between Intel processors and chipset components to external thermal monitoring devices. The processor contains a Digital Thermal Sensor (DTS) that reports a relative die temperature as an offset from Thermal Control Circuit (TCC) activation temperature. Temperature sensors located throughout the die are implemented as analog-to-digital converters calibrated at the factory. PECI provides an interface for external devices to read the DTS temperature for thermal management and fan speed control. More

detailed information is provided in the Platform Environment Control Interface (PECI) Specification.

7.11.1 PECI Bus Architecture

The PECI architecture based on wired OR bus that the clients (as processor PECI) can pull up high (with strong drive).

The idle state on the bus is near zero.

Figure 7-1 demonstrates PECI design and connectivity, while the host/originator can be

3rd party PECI host, and one of the PECI clients is the processor PECI device.

Figure 7-1. Example for PECI Host-clients Connection

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Electrical Specifications

PECI High Range

PECI Low Range

Valid Input Signal Range

Minimum Hysteresis

TTD

Maximum V

Minimum V

Maximum V

Minimum V

PECI Ground

7.11.2 DC Characteristics

The PECI interface operates at a nominal voltage set by V specifications shown in Ta b le 7 - 11 is used with devices normally operating from a V interface supply. V

nominal levels will vary between processor families. All PECI

CCIO

devices will operate at the V system. For specific nominal V

Table 7-11. PECI DC Electrical Limits

Symbol Definition and Conditions M in Max Units Notes

Rup

hysteresis

bus

Cpad

Ileak000 leakage current at 0V — 0.6 mA 2

Ileak025 leakage current at 0.25*V

Ileak050 leakage current at 0.50*V

Ileak075 leakage current at 0.75*V

Ileak100 leakage current at V

Notes:

1. V

CCIO

2. The leakage specification applies to powered devices on the PECI bus.

3. The PECI buffer internal pull up resistance measured at 0.75*V

Internal pull up resistance 15 45 Ohm 3

Input Voltage Range -0.15 V

Hysteresis 0.1 * V

Negative-Edge Threshold Voltage 0.275 * V

Positive-Edge Threshold Voltage 0.550 * V

Bus Capacitance per Node N/A 10 pF

Pad Capacitance 0.7 1.8 pF

supplies the PECI interface. PECI behavior does not affect V

. The set of DC electrical

CCIO

level determined by the processor installed in the

CCIO

levels, refer to Tab l e 7 -6 .

CCIO

N/A V

0.500 * V

0.725 * V

CCIO

min/max specifications.

CCIO

—0.4mA2

—0.2mA2

—0.13mA2

—0.10mA2

CCIO

7.11.3 Input Device Hysteresis

The input buffers in both client and host models must use a Schmitt-triggered input design for improved noise immunity. Use Figure 7-2 as a guide for input buffer design.

Figure 7-2. Input Device Hysteresis

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Processor Pin and Signal Information

8 Processor Pin and Signal

Information

8.1 Processor Pin Assignments

The processor pinmap quadrants are shown in Figure 8-1 through Figure 8-4. Tab le 8 - 1 provides a listing of all processor pins ordered alphabetically by pin name.

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Processor Pin and Signal Information

40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21

VSS_N CTF SA_DQ[37]

VSS

SA_BS[0]

VDDQ

SA_CK#[2]

VDDQ

SA_CK[0] SA_MA[1]

VDDQ

NCTF

SA_DQ[33]

VSS

SA_DQ[36]

RSVD

SA_ODT[3 ] SA_MA[13]

VDDQ

SA_CS#[2] SA_WE# SA_BS[1 ] SA_CK[2] SA_CK#[3] SA_CK#[0] SA_MA[2] SA_MA[3]

VSS_NCT F

VSS

SA_DQS[4]

SA_DQS#[4]

VSS

RSVD VDDQ

SA_CS#[1] SA_ODT[0] SA_CAS#

VDDQ

SA_MA[10] SA_MA[0] SA_CK[3]

VDDQ VDDQ

SA_MA[4 ] SA_MA[8]

VDDQ

NCTF

SA_DQ[34] SA_DQ[38] SA_DQ[39] SA_DQ[35] SA_DQ[32]

VSS

SA_CS#[3] SA_ODT[1]

VDDQ

SA_ODT[2 ] SA_CS#[0] SA_RAS#

VDDQ

VSS

SA_CK#[1] SA_CK[1]

VDDQ

SA_MA[7] SA_MA[11]

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

SB_CS#[3]

VSS

SA_MA[5] SA_MA[6] SA_MA[9] SA_MA[12]

SA_DQ[40] SA_DQ[44] SA_DQ[45] SA_DQ[41]

VSS

SB_DQ[46] SB_DQ[47]

SB_DQS#[5]

SB_DQ[44] SB_DQ[45]

VSS

SB_DQ[33] SB_DQ[32]

VSS

SB_MA[13] SB_WE #

VDDQ VDDQ VDDQ VDDQ

VSS

SA_DQS#[5 ]

SA_DQS[5]

VSS VSS

SB_DQ[42] SB_DQ[43] SB_DQS[5] SB_DQ[40] SB_DQ[41]

VSS

SB_DQ[37] SB_DQ[36]

VSS

SB_ODT[1]

VSS

SB_RAS# SB_BS[0]

VSS

SB_CK[3]

SA_DQ[47] SA_DQ[46] SA_DQ[42] SA_DQ[43]

VSS VSS VSS VSS VSS VSS VSS

SB_DQS[4]

SB_DQS#[4]

VSS

SB_CS#[1] SB_CS#[0]

VSS

SB_MA[10]

VSS

SB_CK#[3]

VSS VSS VSS VSS VSS

SB_DQ[54] SB_DQ[52]

SB_DQS#[6]

SB_DQ[48] SB_DQ[49]

VSS

SB_DQ[39] SB_DQ[38]

VSS

SB_ODT[2]

VSS

SB_BS[1]

VSS

SB_CK#[2]

VSS

SA_DQ[48] SA_DQ[52] SA_DQ[53] SA_DQ[49]

VSS

SB_DQ[50] SB_DQ[55] SB_DQS[6] SB_DQ[51] SB_DQ[53]

VSS

SB_DQ[35] SB_DQ[34]

VSS

SB_ODT[0] SB_CS#[2]

VSS

SB_CK[2] SB_ CK#[0] SB_CK[0]

VSS

SA_DQS#[6 ]

SA_DQS[6]

VSS VSS VSS VSS VSS VSS VSS

VCCIO VCCIO

VSS

VCCIO

SB_ODT[3] SB_CAS# SB_ MA[0]

VCCIO

VSS

VCCIO

SA_DQ[55] SA_DQ[54] SA_DQ[50] SA_DQ[51]

VSS

SB_DQ[60] SB_DQ[61] SKTOCC#

VCCIO

RSVD RSVD RSVD

VCCIO

VSS

VCCIO

VSS

VDDQ VDDQ

SM_VREF

VSS

VSS VSS VSS VSS VSS

SB_DQ[56] SB_DQ[57]

VSS

SA_DQ[56] SA_DQ[60] SA_DQ[61] SA_DQ[57]

VSS

SB_DQS[7]

SB_DQS#[7]

VCCIO

VSS

SA_DQS#[7 ]

SA_DQS[7]

VSS VSS

SB_DQ[63]

VSS

SB_DQ[62]

SA_DQ[63] SA_DQ[62] SA_DQ[58] SA_DQ[59]

VSS

SB_DQ[59] SB_DQ[58]

VSS

VSS VSS VSS

RSVD

VSS

RSVD RSVD

VSS

VCCAXG VCCAXG VCCAXG VCCAXG VCCAXG VCCAXG VCCAXG VCCAX G

VSS VSS VSS VSS VSS VSS

Figure 8-1. Socket Pinmap (Top View, Upper-Left Quadrant)

90 Datasheet, Volume 1

Page 91

Processor Pin and Signal Information

20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

VSS

SB_MA[9] SB _MA[1 4]

SB_CKE[1]

VSS

RSVD RSVD

VSS

RSVD

SA_DQ[31]

VSS

SA_DQ[24]

VSS

SA_DQ[23]

VSS

RSVD_NCTF

SM_DRAM RST#

SB_BS[2]

VSS

SB_CKE[2]

VSS

RSVD RSVD

VSS VSS

SA_DQ[30]

SA_DQS#[3 ]

SA_DQ[29]

VSS

SA_DQ[19] SA_DQS[2] SA_DQ[17 ] RSVD_NCTF

SA_BS[2]

SA_CKE[0] SA_CKE[3]

VSS

SB_MA[15]

SB_CKE[3]

VSS

SA_DQS[8]

SA_DQS#[8 ]

VSS VSS

SA_DQ[26] SA_DQS[3] SA_DQ[28 ]

VSS

SA_DQ[18]

SA_DQS#[2 ]

VSS

SA_DQ[16] RSVD_NCTF

SA_MA[14]

VDDQ

SA_CKE[2 ] S B_MA[11]

SB_CKE[0 ]

VSS

RSVD RSVD RSVD RSVD RSVD

SA_DQ[27]

VSS

SA_DQ[25]

VSS

SA_DQ[22]

VSS

SA_DQ[21] SA_DQ[20]

VSS

SA_MA[15] SA_CKE[1] SB_MA[12]

VSS VSS VSS

RSVD

VSS VSS

RSVD

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS

VDDQ

VSS VSS VSS

RSVD RSVD

VSS

SB_DQ[26] SB_DQ[30]

VSS

SB_DQ[19] SB_DQ[23] SB_DQS[2] SB_DQ[17] SB_DQ[21]

VSS

SA_DQ[11] SA_DQ[10] SA_DQ[14] SA_DQ[15]

RSVD

SB_MA[4] SB_MA[5]

VSS

RSVD RSVD

VSS

SB_DQ[27] SB_DQ[31]

VSS

SB_DQ[18] SB_DQ[22]

SB_DQS#[2]

SB_DQ[16] SB_DQ[20]

VSS VSS

SA_DQS[1]

SA_DQS#[1 ]

VSS

RSVD

VSS

SB_MA[8]

VSS

SB_DQS[8]

SB_DQS#[8]

VSS

SB_DQS[3]

SB_DQS#[3]

VSS VSS VSS VSS VSS VSS VSS

SA_D Q[9]

SA_DQ[13] SA_DQ[12]

SA_DQ [8]

SB_MA[1] SB_MA[2] SB_MA[6]

VSS

RSVD RSVD

VSS

SB_DQ[25] SB_DQ[24]

VSS

SB_DQ[10] SB_DQ[15] SB_DQS[1]

SB_DQ [9]

SB_DQ[13]

VSS VSS VSS VSS VSS

SB_CK[1]

VSS

SB_MA[7]

VSS

RSVD RSVD

VSS

SB_DQ[29] SB_DQ[28]

VSS

SB_DQ[11] SB_DQ[14]

SB_DQS#[1]

SB_DQ [8]

SB_DQ[12]

VSS

SA_DQ[3] SA_DQ[2] SA_DQ[6] SA_DQ[7]

SB_CK#[1]

VCCIO

SB_MA[3]

VCCIO

VSS

VCCIO

VSS VSS

VCCPLL VCCPLL

VSS VSS VSS VSS VSS VSS VSS

SA_DQS[0]

SA_DQS#[0 ]

VSS

VDDQ

SM_D RAM PW RO K

VSS

VCCIO VCCIO

VSS

VDDQ VDDQ

VSS

RSVD

SB_DQ[2]

SB_DQ[3] SB_DQ[7] SB_DQ[6]

VSS

SA_DQ[1] SA_DQ[0] SA_DQ[4] SA_DQ[5]

VSS

SB_DQS[0]

SB_DQS#[0]

VSS

FC_ AH4

VSS VSS

FC_A H1

SB_DQ[1] SB_DQ[0] SB_DQ[5] SB_DQ[4]

RSVD

FD I_I NT

FDI_TX[7]

FDI_ TX #[7 ]

VCCIO

VSS VSS VSS

RSVD

FDI_TX[6]

FDI_ TX# [6 ]

VSS

FDI_ TX# [5 ]

FDI_TX[5]

RSVD

FDI_FSYNC[1] FDI_LSYNC[1]

VSS

FDI_COMPIO FDI_ICOMPO

VSS

FDI_TX[4]

FDI_ TX# [4 ]

VSS

FDI_TX[3]

FDI_ TX #[3 ]

FDI_TX[2]

FDI_ TX #[2 ]

FDI_TX[0]

FDI_ TX #[0 ]

VSS

FDI_FSYNC[0] FDI_LSYNC[0]

FDI_ TX #[1 ]

FDI_TX[1]

VSS

VCCIO RSVD RSVD

VSS

VCCIO_SENSE VSSIO_SENSE

DMI_ TX#[3] DMI_TX[3]

VSS

DMI_ RX #[3]

DMI_RX[3]

VCCIO

Figure 8-2. Socket Pinmap (Top View, Upper-Right Quadrant)

Datasheet, Volume 1 91

Page 92

Processor Pin and Signal Information

VCCAXG VCCAXG VCCAXG VCCA XG VCCAXG VCCAXG

VSS VSS VSS VSS VSS VSS VSS VSS

VCCAXG VCCAXG VCCAXG VCCAX G VCCAXG VCCAXG VCCAXG VCCAXG

RSVD

VSS

RSVD

VSS

RSVD

VSS

RSVD

VSS

RSVD

VSS

RSVD

VSS

RSVD

VCCSA_VID[0]

RSVD

CFG [15] CFG[13] CFG[12] CFG[14] CFG[11]

CFG[5] RSVD RSVD

TCK VSS

CFG [10]

VSS

CFG[7]

VSS

RSVD

VSS

VSSAXG_SENSE

VCC

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

TDI

TDO

TMS

CF G[6] C FG[4] CF G[9] RSVD RSVD

VCCAXG_SENSE

RSVD

VCC

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

PREQ#

VSS

PRDY#

VSS

CFG[3]

VSS

RSVD

VSS

PROC_SEL

RSVD

VCC

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

UNCOREPWRGOOD

TRS T# C FG[8] CF G[2] C FG[1]

PECI RSVD RSVD

VSS

RSVD

VCC

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

BPM# [0]

VSS

BPM#[ 1]

VSS

CFG[0]

VSS

PRO CH OT#

VSS

VCC VCC VC C

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

BPM#[3] BPM#[4] BPM#[2]

CFG[16] CFG[17]

THE R MTR I P#

VSS

VCC VC C VCC VCC

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

BPM# [7]

VSS

BPM#[ 5]

VSS

RESET #

VSS

VCCVCCVCCVCCVCC

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

BPM# [6]

DBR#

PM_SYNC CATERR#

VSS

VCC VCC VC C

VSS

VCC VC C

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

RSVD

VSS

RSVD

VSS

VCC VC C VCC VCC

VSS

VCC VC C

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

RSVD RSVD RSVD

VID SCLK

VCC

VSS

VCC VC C

VSS

VCC VC C

VSS

VCC VC C

VSS

VCC VCC

VSS

VCC VCC

RSVD

VSS

VIDSO UT

VSS_SENSE

VSS

VCC VC C

VSS

VCC VC C

VSS

VCC VC C

VSS

VCC VCC

VSS

NCTF

VIDALERT#

VCC_SENSE

VSS VSS

VCC VC C

VSS

VCC VCC

VSS

40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21

Figure 8-3. Socket Pinmap (Top View, Lower-Left Quadrant)

92 Datasheet, Volume 1

Page 93

Processor Pin and Signal Information

VSS

DMI_ TX#[2] DMI_TX[2]

VSS

DMI_ RX #[2]

DMI_RX[2]

DMI_ TX#[1] DMI_TX[1]

VSS

DMI_RX[0]

DMI_ RX #[0]

VCCIO

BCLK[0]

BCLK#[0 ]

VCCIO

DMI_TX[0] DMI_TX#[0]

VSS

DMI_ RX #[1]

DMI_RX[1]

VSS VSS

VSS

VCCIO

PE_ TX #[ 3 ]

PE_TX[3]

VCCIO VCCIO

PE_RX[3]

PE_ R X #[3 ]

PE_ TX #[ 1 ]

PE_TX[1]

VSS VSS

PE_RX[2]

PE_ R X #[2 ]

VCCSA_SENSE

VSS

VCCIO

PE_TX[2]

PE _TX #[ 2 ]

VCCIO VCCIO

PE_RX[1]

PE_ R X #[1 ]

PE_TX[0]

PE _TX #[ 0 ]

VSS VSS

PE _R X #[0 ]

PE_RX[0]

VSS VSS

VSS

VCCIO

PEG_TX#[15]

PE G_ TX[ 1 5 ]

VCCIO VCCIO

PEG_RX#[15] PEG_RX[15]

VSS

VCC VCC

VSS

VCC VCC VC C

VCCIO VCCSA VCCSA VCCSA

VSS

PEG _ TX[ 1 3 ]

PEG_TX#[13]

VSS VSS

PEG_RX#[14] PEG_RX[14]

VSS VSS

VSS

VCC VCC

VSS

VCC VCC VC C VCC

VCCSA VCCSA

VSS

RSVD

VSS

VCCIO

PEG _ TX[ 1 4 ]

PEG_TX#[14]

VCCIO VCCIO

PEG_RX#[13] PEG_RX[13]

VSS

VCC VCC

VSS

VCC VCC

VSS VSS VSS

VCCSA VCCSA RSVD

PEG_TX#[11]

PE G_ TX[ 1 1 ]

VSS VSS

PEG_RX#[12] PEG_RX[12]

VSS VSS

VSS

VCC VCC

VSS

VCC VCC

PEG_TX[4] PEG_TX#[4 ]

VCC

VSS

VCCSA RSVD V CCIO VCCIO

PEG_TX#[12]

PE G_ TX[ 1 2 ]

VCCIO VCCIO

PEG_RX#[11] PEG_RX[11]

VSS

VCC VCC

VSS

VCC VCC VC C VCC

VCCSA VCCSA VCC SA

VSS

RSVD RSVD

VSS VSS

PEG_RX#[10] PEG_RX[10]

VSS VSS

VSS

VCC VCC

VSS

VCC VCC

PEG_TX[2] PEG_TX#[2 ]

VSS VSS

PEG_TX[9] PEG_TX#[9 ]

VSS VSS

PEG_TX#[10]

PE G_ TX[ 1 0 ]

VCCIO VCCIO

PEG_RX[9]

PEG_RX#[9]

VSS

VCC VCC

VSS

VCC VCC

VSS VSS

PE G_ TX[ 3 ] PE G_ TX #[ 3 ]

VSS VSS

PEG_TX[8] PEG_TX#[8 ]

VSS VSS

PEG_RX[8]

PEG_RX#[8]

VSS VSS

VSS

VCC VCC

VSS

VCC VCC

PEG_TX[1] PEG_TX#[1 ]

VSS VSS

PEG_RX[3]

PEG_RX#[3]

VSS VSS

PEG_TX[7] PEG_TX#[7 ]

VCCIO VCCIO

PEG_RX[7]

PEG_RX#[7]

VSS

VCC VCC

VSS

VCC VCC VC C VCC

PEG_RX[1]

PEG_RX#[1]

VCCIO

VSS

PEG_TX[5] PEG_TX#[5 ]

VCCIO

VSS VSS

PE G_ TX[ 6 ]

VSS

NCTF

VSS

VCC VCC

VSS

VCC VCC

PE G_ TX#[ 0 ] PE G _ TX[ 0 ]

VSS VSS

PEG_RX[2]

PEG_RX#[2]

VSS VSS

PEG_RX[5]

PEG_RX#[5] PEG_RCOMPO

PE G_ TX#[ 6 ]

NCTF

VCC

VSS

VCC VCC

VSS VSS

PEG_RX#[0]

PEG_RX[0]

VSS

VCCIO

PEG_RX[4]

PEG_RX#[4]

VSS

PEG_ICOMPO

PE G_ CO MPI

VSS_N CTF

VCC

VSS

VCC VCC VC C VCC VC C

VCCIO VCCIO

PEG_RX#[6]

PEG_RX[6] VSS_NCTF

20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

Figure 8-4. Socket Pinmap (Top View, Lower-Right Quadrant)

Datasheet, Volume 1 93

Page 94

Processor Pin and Signal Information

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

BCLK_ITP C40 Diff Clk I

BCLK_ITP# D40 Diff Clk I

BCLK[0] W2 Diff Clk I

BCLK#[0] W1 Diff Clk I

BPM#[0] H40 GTL I/O

BPM#[1] H38 GTL I/O

BPM#[2] G38 GTL I/O

BPM#[3] G40 GTL I/O

BPM#[4] G39 GTL I/O

BPM#[5] F38 GTL I/O

BPM#[6] E40 GTL I/O

BPM#[7] F40 GTL I/O

CATERR# E37 GTL O

CFG[0] H36 CMOS I

CFG[1] J36 CMOS I

CFG[10] M38 CMOS I

CFG[11] N36 CMOS I

CFG[12] N38 CMOS I

CFG[13] N39 CMOS I

CFG[14] N37 CMOS I

CFG[15] N40 CMOS I

CFG[16] G37 CMOS I

CFG[17] G36 CMOS I

CFG[2] J37 CMOS I

CFG[3] K36 CMOS I

CFG[4] L36 CMOS I

CFG[5] N35 CMOS I

CFG[6] L37 CMOS I

CFG[7] M36 CMOS I

CFG[8] J38 CMOS I

CFG[9] L35 CMOS I

DBR# E39 Async CMOS O

DMI_RX[0] W5 DMI I

DMI_RX[1] V3 DMI I

DMI_RX[2] Y3 DMI I

DMI_RX[3] AA4 DMI I

DMI_RX#[0] W4 DMI I

DMI_RX#[1] V4 DMI I

DMI_RX#[2] Y4 DMI I

DMI_RX#[3] AA5 DMI I

DMI_TX[0] V7 DMI O

DMI_TX[1] W7 DMI O

DMI_TX[2] Y6 DMI O

DMI_TX[3] AA7 DMI O

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

DMI_TX#[0] V6 DMI O

DMI_TX#[1] W8 DMI O

DMI_TX#[2] Y7 DMI O

DMI_TX#[3] AA8 DMI O

FC_AH1 AH1 N/A O

FC_AH4 AH4 N/A O

FDI_COMPIO AE2 Analog I

FDI_FSYNC[0] AC5 CMOS I

FDI_FSYNC[1] AE5 CMOS I

FDI_ICOMPO AE1 Analog I

FDI_INT AG3 CMOS I

FDI_LSYNC[0] AC4 CMOS I

FDI_LSYNC[1] AE4 CMOS I

FDI_TX[0] AC8 FDI O

FDI_TX[1] AC2 FDI O

FDI_TX[2] AD2 FDI O

FDI_TX[3] AD4 FDI O

FDI_TX[4] AD7 FDI O

FDI_TX[5] AE7 FDI O

FDI_TX[6] AF3 FDI O

FDI_TX[7] AG2 FDI O

FDI_TX#[0] AC7 FDI O

FDI_TX#[1] AC3 FDI O

FDI_TX#[2] AD1 FDI O

FDI_TX#[3] AD3 FDI O

FDI_TX#[4] AD6 FDI O

FDI_TX#[5] AE8 FDI O

FDI_TX#[6] AF2 FDI O

FDI_TX#[7] AG1 FDI O

NCTF A38

NCTF AU40

NCTF AW38

NCTF C2

NCTF D1

PE_RX[0] P3 PCI Express I

PE_RX[1] R2 PCI Express I

PE_RX[2] T4 PCI Express I

PE_RX[3] U2 PCI Express I

PE_RX#[0] P4 PCI Express I

PE_RX#[1] R1 PCI Express I

PE_RX#[2] T3 PCI Express I

PE_RX#[3] U1 PCI Express I

PE_TX[0] P8 PCI Express O

PE_TX[1] T7 PCI Express O

94 Datasheet, Volume 1

Page 95

Processor Pin and Signal Information

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

PE_TX[2] R6 PCI Express O

PE_TX[3] U5 PCI Express O

PE_TX#[0] P7 PCI Express O

PE_TX#[1] T8 PCI Express O

PE_TX#[2] R5 PCI Express O

PE_TX#[3] U6 PCI Express O

PECI J35 Async I/O

PEG_COMPI B4 Analog I

PEG_ICOMPO B5 Analog I

PEG_RCOMPO C4 Analog I

PEG_RX[0] B11 PCI Express I

PEG_RX[1] D12 PCI Express I

PEG_RX[10] H3 PCI Express I

PEG_RX[11] J1 PCI Express I

PEG_RX[12] K3 PCI Express I

PEG_RX[13] L1 PCI Express I

PEG_RX[14] M3 PCI Express I

PEG_RX[15] N1 PCI Express I

PEG_RX[2] C10 PCI Express I

PEG_RX[3] E10 PCI Express I

PEG_RX[4] B8 PCI Express I

PEG_RX[5] C6 PCI Express I

PEG_RX[6] A5 PCI Express I

PEG_RX[7] E2 PCI Express I

PEG_RX[8] F4 PCI Express I

PEG_RX[9] G2 PCI Express I

PEG_RX#[0] B12 PCI Express I

PEG_RX#[1] D11 PCI Express I

PEG_RX#[10] H4 PCI Express I

PEG_RX#[11] J2 PCI Express I

PEG_RX#[12] K4 PCI Express I

PEG_RX#[13] L2 PCI Express I

PEG_RX#[14] M4 PCI Express I

PEG_RX#[15] N2 PCI Express I

PEG_RX#[2] C9 PCI Express I

PEG_RX#[3] E9 PCI Express I

PEG_RX#[4] B7 PCI Express I

PEG_RX#[5] C5 PCI Express I

PEG_RX#[6] A6 PCI Express I

PEG_RX#[7] E1 PCI Express I

PEG_RX#[8] F3 PCI Express I

PEG_RX#[9] G1 PCI Express I

PEG_TX[0] C13 PCI Express O

PEG_TX[1] E14 PCI Express O

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

PEG_TX[2] G14 PCI Express O

PEG_TX[3] F12 PCI Express O

PEG_TX[4] J14 PCI Express O

PEG_TX[5] D8 PCI Express O

PEG_TX[6] D3 PCI Express O

PEG_TX[7] E6 PCI Express O

PEG_TX[8] F8 PCI Express O

PEG_TX[9] G10 PCI Express O

PEG_TX[10] G5 PCI Express O

PEG_TX[11] K7 PCI Express O

PEG_TX[12] J5 PCI Express O

PEG_TX[13] M8 PCI Express O

PEG_TX[14] L6 PCI Express O

PEG_TX[15] N5 PCI Express O

PEG_TX#[0] C14 PCI Express O

PEG_TX#[1] E13 PCI Express O

PEG_TX#[2] G13 PCI Express O

PEG_TX#[3] F11 PCI Express O

PEG_TX#[4] J13 PCI Express O

PEG_TX#[5] D7 PCI Express O

PEG_TX#[6] C3 PCI Express O

PEG_TX#[7] E5 PCI Express O

PEG_TX#[8] F7 PCI Express O

PEG_TX#[9] G9 PCI Express O

PEG_TX#[10] G6 PCI Express O

PEG_TX#[11] K8 PCI Express O

PEG_TX#[12] J6 PCI Express O

PEG_TX#[13] M7 PCI Express O

PEG_TX#[14] L5 PCI Express O

PEG_TX#[15] N6 PCI Express O

PM_SYNC E38 CMOS I

PRDY# K38 Async GTL O

PREQ# K40 Async GTL I

PROC_SEL

PROCHOT# H34 Async GTL I/O

RESET# F36 CMOS I

RSVD AB6

RSVD AB7

RSVD AD37

RSVD AE6

RSVD AF4

RSVD AG4

RSVD AJ11

RSVD AJ29

K32 N/A O

Datasheet, Volume 1 95

Page 96

Processor Pin and Signal Information

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

RSVD AJ30

RSVD AJ31

RSVD AN20

RSVD AP20

RSVD AT1 1

RSVD AT1 4

RSVD AU10

RSVD AV34

RSVD AW34

RSVD AY10

RSVD C38

RSVD C39

RSVD D38

RSVD H7

RSVD H8

RSVD J33

RSVD J34

RSVD J9

RSVD K34

RSVD K9

RSVD L31

RSVD L33

RSVD L34

RSVD L9

RSVD M34

RSVD N33

RSVD N34

RSVD P35

RSVD P37

RSVD P39

RSVD R34

RSVD R36

RSVD R38

RSVD R40

RSVD

RSVD_NCTF AV1

RSVD_NCTF AW2

RSVD_NCTF AY3

RSVD_NCTF B39

SA_BS[0] AY29 DDR3 O

SA_BS[1] AW28 DDR3 O

J31

AD34

AD35

K31

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

SA_BS[2] AV20 DDR3 O

SA_CAS# AV30 DDR3 O

SA_CK[0] AY25 DDR3 O

SA_CK[1] AU24 DDR3 O

SA_CK[2] AW27 DDR3 O

SA_CK[3] AV26 DDR3 O

SA_CK#[0] AW25 DDR3 O

SA_CK#[1] AU25 DDR3 O

SA_CK#[2] AY27 DDR3 O

SA_CK#[3] AW26 DDR3 O

SA_CKE[0] AV19 DDR3 O

SA_CKE[1] AT 19 D DR3 O

SA_CKE[2] AU18 DDR3 O

SA_CKE[3] AV18 DDR3 O

SA_CS#[0] AU29 DDR3 O

SA_CS#[1] AV32 DDR3 O

SA_CS#[2] AW30 DDR3 O

SA_CS#[3] AU33 DDR3 O

SA_DQ[0] AJ3 DDR3 I/O

SA_DQ[1] AJ4 DDR3 I/O

SA_DQ[2] AL3 DDR3 I/O

SA_DQ[3] AL4 DDR3 I/O

SA_DQ[4] AJ2 DDR3 I/O

SA_DQ[5] AJ1 DDR3 I/O

SA_DQ[6] AL2 DDR3 I/O

SA_DQ[7] AL1 DDR3 I/O

SA_DQ[8] AN1 DDR3 I/O

SA_DQ[9] AN4 DDR3 I/O

SA_DQ[10] AR3 DDR3 I/O

SA_DQ[11] AR4 DDR3 I/O

SA_DQ[12] AN2 DDR3 I/O

SA_DQ[13] AN3 DDR3 I/O

SA_DQ[14] AR2 DDR3 I/O

SA_DQ[15] AR1 DDR3 I/O

SA_DQ[16] AV2 DDR3 I/O

SA_DQ[17] AW3 DDR3 I/O

SA_DQ[18] AV5 DDR3 I/O

SA_DQ[19] AW5 DDR3 I/O

SA_DQ[20] AU2 DDR3 I/O

SA_DQ[21] AU3 DDR3 I/O

SA_DQ[22] AU5 DDR3 I/O

SA_DQ[23] AY5 DDR3 I/O

SA_DQ[24] AY7 DDR3 I/O

SA_DQ[25] AU7 DDR3 I/O

96 Datasheet, Volume 1

Page 97

Processor Pin and Signal Information

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

SA_DQ[26] AV9 DDR3 I/O

SA_DQ[27] AU9 DDR3 I/O

SA_DQ[28] AV7 DDR3 I/O

SA_DQ[29] AW7 DDR3 I/O

SA_DQ[30] AW9 DDR3 I/O

SA_DQ[31] AY9 DDR3 I /O

SA_DQ[32] AU35 DDR3 I/O

SA_DQ[33] AW37 DDR3 I/O

SA_DQ[34] AU39 DDR3 I/O

SA_DQ[35] AU36 DDR3 I/O

SA_DQ[36] AW35 DDR3 I/O

SA_DQ[37] AY36 DDR3 I/O

SA_DQ[38] AU38 DDR3 I/O

SA_DQ[39] AU37 DDR3 I/O

SA_DQ[40] AR40 DDR3 I/O

SA_DQ[41] AR37 DDR3 I/O

SA_DQ[42] AN38 DDR3 I/O

SA_DQ[43] AN37 DDR3 I/O

SA_DQ[44] AR39 DDR3 I/O

SA_DQ[45] AR38 DDR3 I/O

SA_DQ[46] AN39 DDR3 I/O

SA_DQ[47] AN40 DDR3 I/O

SA_DQ[48] AL40 DDR3 I/O

SA_DQ[49] AL37 DDR3 I/O

SA_DQ[50] AJ38 DDR3 I/O

SA_DQ[51] AJ37 DDR3 I/O

SA_DQ[52] AL39 DDR3 I/O

SA_DQ[53] AL38 DDR3 I/O

SA_DQ[54] AJ39 DDR3 I/O

SA_DQ[55] AJ40 DDR3 I/O

SA_DQ[56] AG40 DDR3 I/O

SA_DQ[57] AG37 DDR3 I/O

SA_DQ[58] AE38 DDR3 I/O

SA_DQ[59] AE37 DDR3 I/O

SA_DQ[60] AG39 DDR3 I/O

SA_DQ[61] AG38 DDR3 I/O

SA_DQ[62] AE39 DDR3 I/O

SA_DQ[63] AE40 DDR3 I/O

SA_DQS[0] AK3 DDR3 I/O

SA_DQS[1] AP3 DDR3 I/O

SA_DQS[2] AW4 DDR3 I/O

SA_DQS[3] AV8 DDR3 I/O

SA_DQS[4] AV37 DDR3 I/O

SA_DQS[5] AP38 DDR3 I/O

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

SA_DQS[6] AK38 DDR3 I/O

SA_DQS[7] AF38 DDR3 I/O

SA_DQS[8] AV13 DDR3 I/O

SA_DQS#[0] AK2 DDR3 I/O

SA_DQS#[1] AP2 DDR3 I/O

SA_DQS#[2] AV4 D DR3 I/O

SA_DQS#[3] AW8 DDR3 I/O

SA_DQS#[4] AV36 DDR3 I/O

SA_DQS#[5] AP39 DDR3 I/O

SA_DQS#[6] AK39 DDR3 I/O

SA_DQS#[7] AF39 DDR3 I/O

SA_DQS#[8] AV12 DDR3 I/O

RSVD AU12 DDR3 I/O

RSVD AU14 DDR3 I/O

RSVD AW13 D DR3 I/O

RSVD AY13 DDR3 I/O

RSVD AU13 DDR3 I/O

RSVD AU11 DDR3 I/O

RSVD AY12 DDR3 I/O

RSVD AW12 D DR3 I/O

SA_MA[0] AV 27 DDR3 O

SA_MA[1] AY24 DDR 3 O

SA_MA[2] AW24 DD R3 O

SA_MA[3] AW23 DD R3 O

SA_MA[4] AV 23 DDR3 O

SA_MA[5] AT24 DDR3 O

SA_MA[6] AT23 DDR3 O

SA_MA[7] AU22 DDR3 O

SA_MA[8] AV 22 DDR3 O

SA_MA[9] AT22 DDR3 O

SA_MA[10] AV28 DDR3 O

SA_MA[11] AU21 DDR3 O

SA_MA[12] AT21 DDR 3 O

SA_MA[13] AW3 2 DDR3 O

SA_MA[14] AU20 DDR3 O

SA_MA[15] AT20 DDR 3 O

SA_ODT[0] AV3 1 DDR3 O

SA_ODT[1] AU32 DDR3 O

SA_ODT[2] AU30 DDR3 O

SA_ODT[3] AW33 DDR3 O

SA_RAS# AU28 DDR3 O

SA_WE# AW29 DDR3 O

SB_BS[0] AP23 DDR3 O

SB_BS[1] AM24 DDR3 O

Datasheet, Volume 1 97

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Processor Pin and Signal Information

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

SB_BS[2] AW17 DDR3 O

SB_CAS# AK25 DDR3 O

SB_CK[0] AL21 DDR3 O

SB_CK[1] AL20 DDR3 O

SB_CK[2] AL23 DDR3 O

SB_CK[3] AP21 DDR3 O

SB_CK#[0] AL22 DDR3 O

SB_CK#[1] AK20 DDR3 O

SB_CK#[2] AM22 DDR3 O

SB_CK#[3] AN21 DDR3 O

SB_CKE[0] AU16 DDR3 O

SB_CKE[1] AY15 DDR3 O

SB_CKE[2] AW15 DDR3 O

SB_CKE[3] AV15 DDR3 O

SB_CS#[0] AN25 DDR3 O

SB_CS#[1] AN26 DDR3 O

SB_CS#[2] AL25 DDR3 O

SB_CS#[3] AT26 DDR3 O

SB_DQ[0] AG7 DDR3 I/O

SB_DQ[1] AG8 DDR3 I/O

SB_DQ[2] AJ9 DDR3 I/O

SB_DQ[3] AJ8 DDR3 I/O

SB_DQ[4] AG5 DDR3 I/O

SB_DQ[5] AG6 DDR3 I/O

SB_DQ[6] AJ6 DDR3 I/O

SB_DQ[7] AJ7 DDR3 I/O

SB_DQ[8] AL7 DDR3 I/O

SB_DQ[9] AM7 DDR3 I/O

SB_DQ[10] AM10 DDR3 I/O

SB_DQ[11] AL10 DDR3 I/O

SB_DQ[12] AL6 DDR3 I/O

SB_DQ[13] AM6 DDR3 I/O

SB_DQ[14] AL9 DDR3 I/O

SB_DQ[15] AM9 DDR3 I/O

SB_DQ[16] AP7 DDR3 I/O

SB_DQ[17] AR7 DDR3 I/O

SB_DQ[18] AP10 DDR3 I/O

SB_DQ[19] AR10 DDR3 I/O

SB_DQ[20] AP6 DDR3 I/O

SB_DQ[21] AR6 DDR3 I/O

SB_DQ[22] AP9 DDR3 I/O

SB_DQ[23] AR9 DDR3 I/O

SB_DQ[24] AM12 DDR3 I/O

SB_DQ[25] AM13 DDR3 I/O

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

SB_DQ[26] AR13 DDR3 I/O

SB_DQ[27] AP13 DDR3 I/O

SB_DQ[28] AL12 DDR3 I/O

SB_DQ[29] AL13 DDR3 I/O

SB_DQ[30] AR12 DDR3 I/O

SB_DQ[31] AP12 DDR3 I/O

SB_DQ[32] AR28 DDR3 I/O

SB_DQ[33] AR29 DDR3 I/O

SB_DQ[34] AL28 DDR3 I/O

SB_DQ[35] AL29 DDR3 I/O

SB_DQ[36] AP28 DDR3 I/O

SB_DQ[37] AP29 DDR3 I/O

SB_DQ[38] AM28 DDR3 I/O

SB_DQ[39] AM29 DDR3 I/O

SB_DQ[40] AP32 DDR3 I/O

SB_DQ[41] AP31 DDR3 I/O

SB_DQ[42] AP35 DDR3 I/O

SB_DQ[43] AP34 DDR3 I/O

SB_DQ[44] AR32 DDR3 I/O

SB_DQ[45] AR31 DDR3 I/O

SB_DQ[46] AR35 DDR3 I/O

SB_DQ[47] AR34 DDR3 I/O

SB_DQ[48] AM32 DDR3 I/O

SB_DQ[49] AM31 DDR3 I/O

SB_DQ[50] AL35 DDR3 I/O

SB_DQ[51] AL32 DDR3 I/O

SB_DQ[52] AM34 DDR3 I/O

SB_DQ[53] AL31 DDR3 I/O

SB_DQ[54] AM35 DDR3 I/O

SB_DQ[55] AL34 DDR3 I/O

SB_DQ[56] AH35 DDR3 I/O

SB_DQ[57] AH34 DDR3 I/O

SB_DQ[58] AE34 DDR3 I/O

SB_DQ[59] AE35 DDR3 I/O

SB_DQ[60] AJ35 DDR3 I/O

SB_DQ[61] AJ34 DDR3 I/O

SB_DQ[62] AF33 DDR3 I/O

SB_DQ[63] AF35 DDR3 I/O

SB_DQS[0] AH7 DDR3 I/O

SB_DQS[1] AM8 DDR3 I/O

SB_DQS[2] AR8 DDR3 I/O

SB_DQS[3] AN13 DDR3 I/O

SB_DQS[4] AN29 DDR3 I/O

SB_DQS[5] AP33 DDR3 I/O

98 Datasheet, Volume 1

Page 99

Processor Pin and Signal Information

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

SB_DQS[6] AL33 DDR3 I/O

SB_DQS[7] AG35 DDR3 I/O

SB_DQS[8] AN16 DDR3 I/O

SB_DQS#[0] AH6 DDR3 I/O

SB_DQS#[1] AL8 DDR3 I/O

SB_DQS#[2] AP8 DDR3 I/O

SB_DQS#[3] AN12 DDR3 I/O

SB_DQS#[4] AN28 DDR3 I/O

SB_DQS#[5] AR33 DDR3 I/O

SB_DQS#[6] AM33 DDR3 I/O

SB_DQS#[7] AG34 DDR3 I/O

SB_DQS#[8] AN15 DDR3 I/O

RSVD AL16 DDR3 I/O

RSVD AM16 DDR3 I/O

RSVD AP16 DDR3 I/O

RSVD AR16 DDR3 I/O

RSVD AL15 DDR3 I/O

RSVD AM15 DDR3 I/O

RSVD AR15 DDR3 I/O

RSVD AP15 DDR3 I/O

SB_MA[0] AK24 DDR3 O

SB_MA[1] AM20 DDR3 O

SB_MA[2] AM19 DDR3 O

SB_MA[3] AK18 DDR3 O

SB_MA[4] AP19 DDR3 O

SB_MA[5] AP18 DDR3 O

SB_MA[6] AM18 DDR3 O

SB_MA[7] AL18 DDR3 O

SB_MA[8] AN18 DDR3 O

SB_MA[9] AY17 DDR 3 O

SB_MA[10] AN23 DDR3 O

SB_MA[11] AU17 DDR3 O

SB_MA[12] AT18 DDR 3 O

SB_MA[13] AR26 DDR3 O

SB_MA[14] AY 16 DDR 3 O

SB_MA[15] AV16 DDR3 O

SB_ODT[0] AL26 DDR3 O

SB_ODT[1] AP26 DDR3 O

SB_ODT[2] AM26 DDR3 O

SB_ODT[3] AK26 DDR3 O

SB_RAS# AP24 DDR3 O

SB_WE# AR25 DDR3 O

SKTOCC# AJ33 Analog O

SM_DRAMPWROK AJ19 Async CMOS I

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

SM_DRAMRST# AW18 DDR3 O

SM_VREF AJ22 Analog I

TCK M40 TAP I

TDI L40 TAP I

TDO L39 TAP O

THERMTRIP# G35 Async CMOS O

TMS L38 TAP I

TRST# J39 TAP I

UNCOREPWRGOOD J40 Async CMOS I

VCC A12 PWR

VCC A13 PWR

VCC A14 PWR

VCC A15 PWR

VCC A16 PWR

VCC A18 PWR

VCC A24 PWR

VCC A25 PWR

VCC A27 PWR

VCC A28 PWR

VCC B15 PWR

VCC B16 PWR

VCC B18 PWR

VCC B24 PWR

VCC B25 PWR

VCC B27 PWR

VCC B28 PWR

VCC B30 PWR

VCC B31 PWR

VCC B33 PWR

VCC B34 PWR

VCC C15 PWR

VCC C16 PWR

VCC C18 PWR

VCC C19 PWR

VCC C21 PWR

VCC C22 PWR

VCC C24 PWR

VCC C25 PWR

VCC C27 PWR

VCC C28 PWR

VCC C30 PWR

VCC C31 PWR

VCC C33 PWR

VCC C34 PWR

Datasheet, Volume 1 99

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Processor Pin and Signal Information

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

VCC C36 PWR

VCC D13 PWR

VCC D14 PWR

VCC D15 PWR

VCC D16 PWR

VCC D18 PWR

VCC D19 PWR

VCC D21 PWR

VCC D22 PWR

VCC D24 PWR

VCC D25 PWR

VCC D27 PWR

VCC D28 PWR

VCC D30 PWR

VCC D31 PWR

VCC D33 PWR

VCC D34 PWR

VCC D35 PWR

VCC D36 PWR

VCC E15 PWR

VCC E16 PWR

VCC E18 PWR

VCC E19 PWR

VCC E21 PWR

VCC E22 PWR

VCC E24 PWR

VCC E25 PWR

VCC E27 PWR

VCC E28 PWR

VCC E30 PWR

VCC E31 PWR

VCC E33 PWR

VCC E34 PWR

VCC E35 PWR

VCC F15 PWR

VCC F16 PWR

VCC F18 PWR

VCC F19 PWR

VCC F21 PWR

VCC F22 PWR

VCC F24 PWR

VCC F25 PWR

VCC F27 PWR

VCC F28 PWR

Table 8-1. Processor Pin List by Pin

Name

Pin Name Pin # Buffer Type Dir.

VCC F30 PWR

VCC F31 PWR

VCC F32 PWR

VCC F33 PWR

VCC F34 PWR

VCC G15 PWR

VCC G16 PWR

VCC G18 PWR

VCC G19 PWR

VCC G21 PWR

VCC G22 PWR

VCC G24 PWR

VCC G25 PWR

VCC G27 PWR

VCC G28 PWR

VCC G30 PWR

VCC G31 PWR

VCC G32 PWR

VCC G33 PWR

VCC H13 PWR

VCC H14 PWR

VCC H15 PWR

VCC H16 PWR

VCC H18 PWR

VCC H19 PWR

VCC H21 PWR

VCC H22 PWR

VCC H24 PWR

VCC H25 PWR

VCC H27 PWR

VCC H28 PWR

VCC H30 PWR

VCC H31 PWR

VCC H32 PWR

VCC J12 PWR

VCC J15 PWR

VCC J16 PWR

VCC J18 PWR

VCC J19 PWR

VCC J21 PWR

VCC J22 PWR

VCC J24 PWR

VCC J25 PWR

VCC J27 PWR

100 Datasheet, Volume 1

Intel Core i7-2600, Core i7-2700K, Core i5-2550K, Core i5-2500K, Core i5-2500S Datasheet

Contents

Tables

Revision History

1 Introduction

1.1 Processor Feature Details

1.1.1 Supported Technologies

1.2 Interfaces

1.2.1 System Memory Support

1.2.2 PCI Express*

1.2.3 Direct Media Interface (DMI)

1.2.4 Platform Environment Control Interface (PECI)

1.2.5 Processor Graphics

1.2.6 Intel® Flexible Display Interface (Intel® FDI)

1.3 Power Management Support

1.3.1 Processor Core

1.3.2 System

1.3.3 Memory Controller

1.3.4 PCI Express*

1.3.5 Direct Media Interface (DMI)

1.3.6 Processor Graphics Controller

1.4 Thermal Management Support

1.5 Package

1.6 Terminology

1.7 Related Documents

2 Interfaces

2.1 System Memory Interface

2.1.1 System Memory Technology Supported

2.1.2 System Memory Timing Support

2.1.3 System Memory Organization Modes

2.1.3.1 Single-Channel Mode

2.1.3.2 Dual-Channel Mode – Intel® Flex Memory Technology Mode

2.1.4 Rules for Populating Memory Slots

2.1.5 Technology Enhancements of Intel® Fast Memory Access (Intel® FMA)

2.1.5.1 Just-in-Time Command Scheduling

2.1.5.2 Command Overlap

2.1.5.3 Out-of-Order Scheduling

2.1.6 Memory Type Range Registers (MTRRs) Enhancement

2.1.7 Data Scrambling

2.2 PCI Express* Interface

2.2.1 PCI Express* Architecture

2.2.1.1 Transaction Layer

2.2.1.2 Data Link Layer

2.2.1.3 Physical Layer

2.2.2 PCI Express* Configuration Mechanism

2.2.3 PCI Express* Port

2.2.4 PCI Express* Lanes Connection

2.3 Direct Media Interface (DMI)

2.3.1 DMI Error Flow

2.3.2 Processor / PCH Compatibility Assumptions

2.3.3 DMI Link Down

2.4 Processor Graphics Controller (GT)

2.4.1 3D and Video Engines for Graphics Processing

2.4.1.1 3D Engine Execution Units

2.4.1.2 3D Pipeline

2.4.1.3 Video Engine

2.4.1.4 2D Engine

2.4.2 Processor Graphics Display

2.4.2.1 Display Planes

2.4.2.2 Display Pipes

2.4.2.3 Display Ports

2.4.3 Intel® Flexible Display Interface (Intel® FDI)

2.4.4 Multi-Graphics Controller Multi-Monitor Support

2.5 Platform Environment Control Interface (PECI)

2.6 Interface Clocking

2.6.1 Internal Clocking Requirements

3 Technologies

3.1 Intel® Virtualization Technology (Intel® VT)

3.1.2 Intel® Virtualization Technology (Intel® VT) for IA-32, Intel® 64 and Intel® Architecture (Intel® VT-x) Features

3.1.3 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Objectives

3.1.4 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features

3.1.5 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d) Features Not Supported

3.2 Intel® Trusted Execution Technology (Intel® TXT)

3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)

3.4 Intel® Turbo Boost Technology

3.4.1 Intel® Turbo Boost Technology Frequency

3.4.2 Intel® Turbo Boost Technology Graphics Frequency

3.5 Intel® Advanced Vector Extensions (Intel® AVX)

3.6.1 PCLMULQDQ Instruction

3.7 Intel® 64 Architecture x2APIC