Intel BLKDH57DD, BOXDH57DD, DH57DD Technical Product Specification
Intel® Desktop Board
DH57DD
Technical Product Specification
Order Number: E91083-001US
The Intel® Desktop Board DH57DD may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DH57DD Specification Update.
March 2010
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DH57DD Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board DH57DD with BIOS
identifier JGIBX10J.86A.
Changes to this specification will be published in the Intel Desktop Board DH57DD Specification
Update before being incorporated into a revision of this document.
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®
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desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
March 2010
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Copyright © 2010, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DH57DD.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DH57DD and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DH57DD
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DH57DD Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 Intel® H57 Express Chipset ............................................................... 15
1.6 System Memory .............................................................................. 15
1.6.1 Memory Configurations ......................................................... 16
1.7 Graphics Subsystem ........................................................................ 18
1.7.1 Integrated Graphics.............................................................. 18
1.7.2 PCI Express x16 Graphics ...................................................... 19
1.8 USB............................................................................................... 19
1.9 SATA Interfaces .............................................................................. 20
1.10 Legacy I/O Controller....................................................................... 20
1.10.1 Serial Port ........................................................................... 20
1.11 Audio Subsystem............................................................................. 21
1.11.1 Audio Subsystem Software .................................................... 21
1.11.2 Audio Connectors and Headers ............................................... 22
1.12 LAN Subsystem............................................................................... 23
1.12.1 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.13 Real-Time Clock Subsystem .............................................................. 25
1.14 Hardware Management Subsystem .................................................... 25
1.14.1 Hardware Monitoring and Fan Control...................................... 25
1.14.2 Fan Monitoring..................................................................... 26
1.14.3 Chassis Intrusion Detection.................................................... 26
1.14.4 Thermal Monitoring .............................................................. 27
1.15 Power Management ......................................................................... 28
1.15.1 ACPI................................................................................... 28
1.15.2 Hardware Support ................................................................ 31
1.15.3 ENERGY STAR* 5.0, E-Standby, and ErP Compliance ................. 35
2 Technical Reference
2.1 Memory Resources .......................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.1.2 Memory Map........................................................................ 39
2.2 Connectors and Headers................................................................... 39
2.2.1 Back Panel Connectors .......................................................... 40
2.2.2 Component-side Connectors and Headers ................................ 41
2.3 Jumper Block .................................................................................. 51
2.4 Mechanical Considerations ................................................................ 53
v
Intel Desktop Board DH57DD Technical Product Specification
2.4.1 Form Factor......................................................................... 53
2.5 Electrical Considerations ................................................................... 54
2.5.1 Power Supply Considerations ................................................. 54
2.5.2 Fan Header Current Capability................................................ 55
2.5.3 Add-in Board Considerations .................................................. 55
2.6 Thermal Considerations .................................................................... 56
2.7 Reliability ....................................................................................... 59
2.8 Environmental ................................................................................ 59
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 System Management BIOS (SMBIOS)................................................. 63
3.3 Legacy USB Support ........................................................................ 63
3.4 BIOS Updates ................................................................................. 64
3.4.1 Language Support ................................................................ 64
3.4.2 Custom Splash Screen .......................................................... 65
3.5 BIOS Recovery................................................................................ 65
3.6 Boot Options................................................................................... 66
3.6.1 Optical Drive Boot ................................................................ 66
3.6.2 Network Boot....................................................................... 66
3.6.3 Booting Without Attached Devices........................................... 66
3.6.4 Changing the Default Boot Device During POST ........................ 66
3.7 BIOS Security Features .................................................................... 67
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 Front-panel Power LED Blink Codes .................................................... 70
4.4 BIOS Error Messages ....................................................................... 70
4.5 Port 80h POST Codes ....................................................................... 71
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 77
5.1.1 Safety Standards.................................................................. 77
5.1.2 European Union Declaration of Conformity Statement................ 78
5.1.3 Product Ecology Statements................................................... 79
5.1.4 EMC Regulations .................................................................. 250H83
76H5.1.5 Product Certification Markings (Board Level)............................. 251H84
77H5.2 Battery Disposal Information............................................................. 252H85
vi
Contents
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration........................................... 17
4. Back Panel Audio Connectors ............................................................ 22
5. LAN Connector LED Locations............................................................ 24
6. Thermal Sensors and Fan Headers ..................................................... 27
7. Location of the Standby Power LED.................................................... 34
8. Detailed System Memory Address Map ............................................... 38
9. Back Panel Connectors ..................................................................... 40
10. Component-side Connectors and Headers ........................................... 41
11. Connection Diagram for Front Panel Header ........................................ 48
12. Connection Diagram for Front Panel USB Headers ................................ 50
13. Connection Diagram for IEEE 1394a Header ........................................ 50
14. Location of the Jumper Block............................................................. 51
15. Board Dimensions ........................................................................... 53
16. Localized High Temperature Zones..................................................... 57
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. HDMI Port Status Conditions ............................................................. 18
5. DVI Port Status Conditions................................................................ 19
6. Audio Jack Retasking Support ........................................................... 21
7. LAN Connector LED States................................................................ 24
8. Effects of Pressing the Power Switch .................................................. 28
9. Power States and Targeted System Power........................................... 29
10. Wake-up Devices and Events ............................................................ 30
11. System Memory Map ....................................................................... 39
12. Component-side Connectors and Headers Shown in Figure 10................ 42
13. Serial Port Header ........................................................................... 43
14. S/PDIF Header ................................................................................ 43
15. Front Panel Audio Header for Intel HD Audio........................................ 43
16. Front Panel Audio Header for Passive AC ’97 Audio ............................... 43
17. Intel HD Audio Link Header............................................................... 44
18. Front Panel USB Headers.................................................................. 44
19. SATA Connectors............................................................................. 44
20. Chassis Intrusion Header.................................................................. 44
21. Processor (4-Pin) Fan Header............................................................ 45
22. Front and Rear Chassis Fan Headers .................................................. 45
23. Intel Remote PC Assist Technology Header.......................................... 45
24. Back Panel CIR Emitter (Output) Header............................................. 45
25. Front Panel CIR Receiver (Input) Header............................................. 45
26. Processor Core Power Connector........................................................ 46
27. Main Power Connector...................................................................... 47
vii
Intel Desktop Board DH57DD Technical Product Specification
28. Front Panel Header .......................................................................... 48
29. States for a One-Color Power LED...................................................... 49
30. Alternate Front Panel Power LED Header............................................. 49
31. BIOS Setup Configuration Jumper Settings.......................................... 52
32. Recommended Power Supply Current Values ....................................... 54
33. Fan Header Current Capability........................................................... 55
34. Thermal Considerations for Components ............................................. 58
35. Tcontrol Values for Components ........................................................ 58
36. Environmental Specifications............................................................. 59
37. BIOS Setup Program Menu Bar.......................................................... 62
38. BIOS Setup Program Function Keys.................................................... 62
39. Acceptable Drives/Media Types for BIOS Recovery ............................... 65
40. Boot Device Menu Options ................................................................ 66
41. Supervisor and User Password Functions............................................. 67
42. BIOS Beep Codes ............................................................................ 69
43. Front-panel Power LED Blink Codes.................................................... 70
44. BIOS Error Messages ....................................................................... 70
45. Port 80h POST Code Ranges.............................................................. 71
46. Port 80h POST Codes ....................................................................... 72
47. Typical Port 80h POST Sequence........................................................ 75
48. Safety Standards............................................................................. 77
49. Lead-Free Board Markings ................................................................ 82
50. EMC Regulations ............................................................................. 318H83
144H51. Product Certification Markings ........................................................... 319H84
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Chipset
Memory
Graphics
Audio
Peripheral
Interfaces
Legacy I/O Control Nuvoton W83677i Super I/O controller for serial port support
BIOS
microATX (9.6 inches by 9.6 inches [243.84 millimeters by 243.84 millimeters])
®
• Intel
Intel
Hub (PCH)
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Dual Channel DDR3 1333 MHz and DDR3 1066 MHz support
• Support for 1 Gb and 2 Gb memory technology
• Support for up to 16 GB of system memory with four DIMMs using 2 Gb
• Support for non-ECC memory
• Integrated graphics support for processors with Intel HD Graphics:
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
• 10-channel (7.1+2) Intel
• 8-channel (7.1) Intel High Definition Audio via the HDMI interface
• Fourteen USB 2.0 ports:
• Five internal Serial ATA (SATA) 3.0 Gb/s ports
• One external SATA (eSATA) back panel connector
• One serial port header
• Two front panel IEEE 1394a ports
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Core™ i7, Intel® Core™ i5, Intel® Core™ i3, Intel® Pentium® processors,
and Intel
― Integrated graphics processing (processors with Intel
― External graphics interface controller
― Integrated memory controller
memory technology
― High Definition Multimedia Interface* (HDMI*)
― DVI-I
codec
― Six ports are implemented with stacked back panel connectors
― Eight front panel ports are implemented with four dual-port internal
and SMBIOS
®
Xeon® processor 3400 series in an LGA1156 socket:
®
Graphics (Intel
®
H57 Express Chipset consisting of the Intel
headers
®
BIOS resident in the SPI Flash device
HD Graphics))
®
High Definition Audio via the Realtek* ALC889 audio
®
High Definition
®
H57 Platform Controller
continued
9
Intel Desktop Board DH57DD Technical Product Specification
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82578DC Gigabit
Expansion
Capabilities
Hardware Monitor
Subsystem
• Support for PCI* Local Bus Specification Revision 2.3
• Support for PCI Express*
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, serial, USB ports, and
Consumer IR
Ethernet Controller
• One PCI Express 2.0 x16 add-in card connector
• Two PCI Express 1.0 x1 bus add-in card connectors
• One Conventional PCI bus add-in card connector
®
• Intel
Quiet System Technology (Intel® QST) implemented through Intel®
Management Engine (Intel
®
ME) in the Intel H57 PCH
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Two fan headers using PWM control
• 4-pin header for the processor fan
• 4-wire and 3-wire (linear) fan speed control support for the front and rear
chassis fans
• Support for Platform Environmental Control Interface (PECI)
10
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DH57DD.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Intel Desktop Board DH57DD Technical Product Specification
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Descript
A Conventional PCI bus add-in card connector
B PCI Express x1 add-in card connector
C Front panel IEEE 1394a header
D Front panel IEEE 1394a header
E PCI Express x1 add-in card connector
F Battery
G PCI Express x16 add-in card connector
H Back panel connectors
I Processor core power connector (2 x 2)
J Rear chassis fan header
K LGA1156 processor socket
L Processor fan header
M Channel A DIMM 0 socket
N Channel B DIMM 0 socket
O Front chassis fan header
P Consumer IR receiver (input) header
Q Consumer IR emitter (output) header
R Chassis intrusion header
S Main power connector (2 x 12)
T Piezoelectric speaker
U SATA connectors
V Intel Remote Assist PC header
W Alternate front panel power LED header
X Front panel header
Y Front panel USB header
Z Standby power LED
AA Front panel USB header
BB Front panel USB header
CC Front panel USB header
DD BIOS setup configuration jumper block
EE Intel H57 Express Chipset
FF Intel High Definition Audio Link header
GG Serial port header
HH S/PDIF header
II Front panel audio header
ion
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
13
Intel Desktop Board DH57DD Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No floppy drive connector
• No parallel port connector
• No PS/2 connector
• No PATA interface
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH57DD http://www.intel.com/products/motherboard/DH57DD/index.htm
Desktop Board Support http://www.intel.com/support/motherboards/desktop
Available configurations for the Intel
Desktop Board DH57DD
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://www.intel.com/products/motherboard/DH57DD/index.htm
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, Intel
Pentium processors, and Intel Xeon processor 3400 series processors in an LGA1156
socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 87 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 54 for information on power supply requirements for this board.
14
Product Description
1.5 Intel
®
H57 Express Chipset
The Intel H57 Express Chipset consisting of the Intel H57 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network,
display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized
controller for the board’s I/O paths.
For information about Refer to
The Intel H57 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6 System Memory
The board has four DIMM sockets and supports the following memory features:
• Four independent memory channels with interleaved mode support
• Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization and single-sided DIMMs with x16 organization
• 16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 37 for information on the total amount of addressable
memory.
• Minimum total system memory: 512MB using 1 Gb x16 module
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
512 MB SS 1 Gbit 1 Gb x16/empty 4
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
Configuration
(Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
15
Intel Desktop Board DH57DD Technical Product Specification
For information about… Refer to:
Tested Memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.6.1 Memory Configurations
The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processor 3400 series processors support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
16
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
17
Intel Desktop Board DH57DD Technical Product Specification
1.7 Graphics Subsystem
The board supports system graphics through either Intel HD Graphics or a PCI
Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
(FDI) for processors with Intel HD Graphics.
1.7.1.1 Intel
The Intel HD graphics controller features the following:
• 3D Features
⎯ DirectX10* and OpenGL* 2.1 compliant
⎯ Shader Model 4.0
• Video
⎯ Hi-Definition content at up to 1080p resolution
⎯ Hardware accelerated MPEG-2, VC-1/WMV, and H.264/AVC Hi-Definition video
formats
⎯ Intel
⎯ Dynamic Video Memory Technology (DVMT) 5.0 support
⎯ Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
®
High Definition Graphics (Intel® HD Graphics)
®
Clear Video HD Technology with Advanced Video Processing
1.7.1.2 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports eight full range channels at 24-bit/96kHz audio of lossless
audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum
supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the
HDMI 1.3 specification.
The HDMI port is enabled for POST whenever a monitor is attached, regardless of the
VGA and DVI-I connector status.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
HDMI port will behave as described in Table 4.
Table 4. HDMI Port Status Conditions
PCI Express x16 Connector Status HDMI Port Status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
PCI Express x4, x8, or x16 add-in card installed Disabled
18
Product Description
1.7.1.3 Digital Visual Interface (DVI-I)
The DVI-I port supports both digital and analog DVI displays. The maximum
supported resolution is 1900 x 1200 (WUXGA). The DVI port is compliant with the
DVI 1.0 specification. DVI analog output can also be converted to VGA using a
DVI-VGA converter.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in Table 5.
Table 5. DVI Port Status Conditions
PCI Express x16 Connector Status
No add-in card installed Enabled Enabled
Non-video PCI Express x1 add-in card
installed
PCI Express x16 add-in card installed Disabled Disabled
Note: DVI analog output can also be converted to VGA with a DVI-VGA converter.
DVI Digital (DVI-D)
Port Status
Enabled Enabled
DVI Analog (DVI-A)
Port Status
(Note)
1.7.1.3.1 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA).
The VGA port is enabled for POST whenever a monitor is attached, regardless of the
HDMI and DVI-I connector status.
1.7.2 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processor 3400 series processors in an LGA1156 socket support discrete add in
graphics cards via the PCI Express 2.0 x16 graphics connector:
• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is
8 GB/s in each direction, simultaneously, when operating in x16 mode.
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is
4 GB/s in each direction, simultaneously, when operating in x16 mode.
1.8 USB
The board supports up to fourteen USB 2.0 ports through two EHCI host controllers on
the PCH that allow the use of EHCI-compatible drivers.
The port arrangement is as follows:
• Six ports are implemented with stacked back panel connectors
• Eight front panel ports are implemented with four dual-port internal headers
19
Intel Desktop Board DH57DD Technical Product Specification
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 40
The location of the front panel USB headers Figure 10, page 41
1.9 SATA Interfaces
The board provides five internal SATA connectors (black) and one external SATA
connector through the PCH, which support one device per connector.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3 Gb/s per port. A point-to-point interface is used for host to device connections,
unlike Parallel ATA (PATA) IDE which supports a master/slave configuration and two
devices per channel.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard
Conventional PCI bus resource steering is used. Native mode is the preferred mode
for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 41
.
1.10 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• One serial port
• Serial IRQ interface compatible with serialized IRQ support for Conventional PCI
bus systems
• Intelligent power management, including a programmable wake-up event interface
• One back panel CIR emitter header
• One front panel CIR receiver header
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.10.1 Serial Port
The serial port is implemented as a 10-pin header on the board. The serial port
supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port header Figure 10, page 41
20
Product Description
1.11 Audio Subsystem
The board supports Intel High Definition Audio through the Realtek ALC889 audio
codec as well as through the HDMI interface.
The ALC889-based audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port.
• Stereo input and output via back panel jacks
• Headphone and Mic in functions for front panel audio jacks
• 108 dB Signal-to-Noise ratio (SNR) playback (DAC) quality and 104 dB SNR
recording (ADC) quality
• Content Protection for Full Rate loss-less DVD Audio and Blu-ray Disc* audio
content playback (with selected versions of media player software)
The audio subsystem supports the following audio interfaces:
• 7.1 analog back panel audio connectors
• Optical S/PDIF-out audio connector
• S/PDIF header (support for optical or coaxial S/PDIF output)
• Front panel audio header with support for Intel HD Audio and AC ‘97 audio
• Intel High Definition Audio link header
NOTE
Systems built with an AC ‘97 audio front panel will not be able to obtain the Microsoft
Windows Vista logo.
Table 6 lists the supported functions of the front panel and back panel audio jacks.
Table 6. Audio Jack Retasking Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default
Rear Black Default
Rear Orange Default
Microphone
Head-
phones
Front
Speakers Line In
Side
Surround
Rear
Surround
Center/
Sub
1.11.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
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Intel Desktop Board DH57DD Technical Product Specification
1.11.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals
for front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow)
• HD Audio Link header
For information about Refer to
The locations of the front panel audio header and S/PDIF header Figure 10, page 41
The signal names of the front panel audio header Table 15 and Table 16, page 43
The signal names of the S/PDIF header Table 14, page 43
The signal names of the HD Audio Link header Table 17, page 44
The back panel audio connectors Section 2.2.1, page 40
1.11.2.1 Back Panel Audio Connectivity
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Rear surround
B Center channel and LFE (subwoofer)
C S/PDIF out (optical)
D Line in
E Mic in/side surround
F Line out/front speakers
Figure 4. Back Panel Audio Connectors
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Product Description
The back panel audio connectors are configurable through the audio device drivers.
For information about Refer to
The back panel audio connectors Section 2.2.1, page 40
The front panel headphone output is supported through a separate audio channel pair
allowing multi-streaming audio configurations such as simultaneous surround playback
and stereo audio conferencing (through back panel speakers and front panel headset,
respectively).
1.12 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82578DC Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• RJ-45 LAN connector with integrated status LEDs
The Intel 82578DC Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• PCI Express link
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
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Intel Desktop Board DH57DD Technical Product Specification
1.12.1 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link/Activity LED (green)
B Link Speed LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 7 describes the LED states when the board is powered up and the LAN
su
bsystem is operating.
Table 7. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link/Activity Green
Link Speed Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected or negotiated.
Green 100 Mbits/s data rate is selected or negotiated.
Yellow 1000 Mbits/s data rate is selected or negotiated.
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Product Description
1.13 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with power applied via the power
supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
1.14 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Hardware monitoring and fan control
• Fan Monitoring
• Chassis intrusion detection
• Thermal monitoring
1.14.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Intel Quiet System Technology, delivering acoustically-optimized thermal
management
• Thermal sensors in the processor and PCH, as well as near the CPU voltage
regulators and system memory
• Monitoring of five system voltages (+5 V, +12 V, +3.3 V, Memory V-SM and
+V
CCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control for all fans that can adjust fan speed
as needed
25
Intel Desktop Board DH57DD Technical Product Specification
1.14.2 Fan Monitoring
Fan monitoring can be observed through the BIOS setup user interface, Intel® Desktop
Utilities, or third-party software.
For information about Refer to
The functions of the fan headers Section 1.15.2.2, page 32
1.14.3 Chassis Intrusion Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 10, page 41
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1.14.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Product Description
Item Description
A Rear chassis fan header
B Thermal diode, located on processor die
C Processor fan header
D Front chassis fan header
E Thermal diode, located on the Intel H57 PCH
Figure 6. Thermal Sensors and Fan Headers
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