Intel BOXDG965OTMKR, DG965OT Specification
Intel® Desktop Board
DG965OT
Technical Product Specification
The Intel® Desktop Board DG965OT may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG965OT Specification Update.
August 2006
Order Number: D56012-001US
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DG965OT Technical Product
Specification.
This product specification applies to only the standard Intel® Desktop Board DG965OT with
BIOS identifier MQ96510A.86A.
Changes to this specification will be published in the Intel Desktop Board DG965OT Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
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to any such patents, trademarks, copyrights, or other intellectual property rights.
August 2006
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
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Intel, the Intel logo, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries
in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2006, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board DG965OT. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG965OT and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
®
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DG965OT Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Manufacturing Options .......................................................... 11
1.1.3 Board Layout ....................................................................... 12
1.1.4 Block Diagram ..................................................................... 14
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.4.1 Memory Configurations ......................................................... 17
1.5 Intel® G965 Express Chipset ............................................................. 23
1.5.1 Intel G965 Graphics Subsystem.............................................. 23
1.5.2 USB ................................................................................... 26
1.5.3 Serial ATA Interfaces ............................................................ 26
1.5.4 Parallel IDE Interface ............................................................ 27
1.5.5 Real-Time Clock, CMOS SRAM, and Battery .............................. 28
1.6 Legacy I/O Controller ....................................................................... 28
1.6.1 Serial Port........................................................................... 28
1.6.2 Parallel Port......................................................................... 28
1.6.3 Diskette Drive Controller ....................................................... 29
1.6.4 Keyboard and Mouse Interface (Optional) ................................ 29
1.7 Audio Subsystem............................................................................. 30
1.7.1 Audio Subsystem Software .................................................... 31
1.7.2 Audio Connectors and Headers ............................................... 31
1.8 LAN Subsystem ............................................................................... 32
1.8.1 Intel® 82566DC Gigabit Ethernet Controller ............................. 32
1.8.2 LAN Subsystem Software....................................................... 33
1.8.3 RJ-45 LAN Connector with Integrated LEDs .............................. 33
1.9 Hardware Management Subsystem .................................................... 34
1.9.1 Hardware Monitoring and Fan Control...................................... 34
1.9.2 Fan Monitoring..................................................................... 34
1.9.3 Chassis Intrusion and Detection.............................................. 34
1.9.4 Thermal Monitoring .............................................................. 35
1.10 Power Management ......................................................................... 36
1.10.1 ACPI .................................................................................. 36
1.10.2 Hardware Support ................................................................ 38
2 Technical Reference
2.1 Memory Map................................................................................... 43
2.1.1 Addressable Memory............................................................. 43
2.2 DMA Channels................................................................................. 45
2.3 Fixed I/O Map ................................................................................. 46
2.4 PCI Configuration Space Map ............................................................ 47
2.5 Interrupts ...................................................................................... 48
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Intel Desktop Board DG965OT Technical Product Specification
2.6 DMA Channels................................................................................. 49
2.7 PCI Interrupt Routing Map ................................................................ 49
2.8 Connectors and Headers................................................................... 50
2.8.1 Back Panel Connectors .......................................................... 51
2.8.2 Component-side Connectors and Headers ................................ 52
2.9 Jumper Block .................................................................................. 60
2.10 Mechanical Considerations ................................................................ 61
2.10.1 Form Factor......................................................................... 61
2.10.2 I/O Shield ........................................................................... 62
2.11 Electrical Considerations................................................................... 64
2.11.1 DC Loading.......................................................................... 64
2.11.2 Fan Header Current Capability................................................ 64
2.11.3 Add-in Board Considerations .................................................. 65
2.11.4 Power Supply Considerations ................................................. 65
2.12 Thermal Considerations.................................................................... 66
2.13 Reliability....................................................................................... 68
2.14 Environmental ................................................................................ 69
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 71
3.2 BIOS Flash Memory Organization ....................................................... 72
3.3 Resource Configuration .................................................................... 72
3.3.1 PCI Autoconfiguration ........................................................... 72
3.3.2 PCI IDE Support................................................................... 73
3.4 System Management BIOS (SMBIOS)................................................. 73
3.5 Legacy USB Support ........................................................................ 74
3.6 BIOS Updates ................................................................................. 74
3.6.1 Language Support ................................................................ 75
3.6.2 Custom Splash Screen .......................................................... 75
3.7 BIOS Recovery................................................................................ 75
3.8 Boot Options................................................................................... 76
3.8.1 CD-ROM Boot ...................................................................... 76
3.8.2 Network Boot....................................................................... 76
3.8.3 Booting Without Attached Devices........................................... 76
3.8.4 Changing the Default Boot Device During POST ........................ 76
3.9 Adjusting Boot Speed....................................................................... 77
3.9.1 Peripheral Selection and Configuration..................................... 77
3.9.2 BIOS Boot Optimizations ....................................................... 77
3.10 BIOS Security Features .................................................................... 78
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 79
4.2 BIOS Beep Codes ............................................................................ 79
4.3 BIOS Error Messages ....................................................................... 79
4.4 Port 80h POST Codes ....................................................................... 80
vi
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 85
5.1.1 Safety Regulations................................................................ 85
5.1.2 European Union Declaration of Conformity Statement................ 86
5.1.3 Product Ecology Statements................................................... 88
5.1.4 EMC Regulations .................................................................. 91
5.1.5 Product Certification Markings (Board Level)............................. 92
5.2 Battery Disposal Information............................................................. 93
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel and DIMM Configuration........................................... 18
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 19
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 20
7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 21
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21
9. Flex Mode Configuration with Two DIMMs............................................ 22
10. Front/Back Panel Audio Connector Options.......................................... 31
11. LAN Connector LED Locations............................................................ 33
12. Thermal Sensors and Fan Headers ..................................................... 35
13. Location of the Standby Power Indicator LED....................................... 42
14. Detailed System Memory Address Map ............................................... 44
15. Back Panel Connectors ..................................................................... 51
16. Component-side Connectors and Headers ........................................... 52
17. Connection Diagram for Front Panel Header ........................................ 57
18. Connection Diagram for Front Panel USB Headers ................................ 59
19. Connection Diagram for IEEE 1394a Header ........................................ 59
20. Location of the Jumper Block............................................................. 60
21. Board Dimensions ........................................................................... 61
22. I/O Shield Dimensions for boards with PS/2 Ports................................. 62
23. I/O Shield Dimensions for boards without PS/2 Ports ............................ 63
24. Localized High Temperature Zones..................................................... 67
Tables
1. Feature Summary............................................................................ 10
2. Manufacturing Options ..................................................................... 11
3. Board Components Shown in Figure 1 ................................................ 13
4. Supported Memory Configurations ..................................................... 16
5. Memory Operating Frequencies ......................................................... 17
6. Audio Jack Retasking Support ........................................................... 30
7. LAN Connector LED States ................................................................ 33
8. Effects of Pressing the Power Switch .................................................. 36
9. Power States and Targeted System Power........................................... 37
10. Wake-up Devices and Events ............................................................ 38
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Intel Desktop Board DG965OT Technical Product Specification
11. System Memory Map ....................................................................... 45
12. DMA Channels................................................................................. 45
13. I/O Map ......................................................................................... 46
14. PCI Configuration Space Map ............................................................ 47
15. Interrupts ...................................................................................... 48
16. DMA Channels................................................................................. 49
17. PCI Interrupt Routing Map ................................................................ 50
18. Component-side Connectors and Headers Shown in Figure 16................ 53
19. HD Audio Link Header ...................................................................... 54
20. Front Panel Audio Header ................................................................. 54
21. Serial ATA Connectors ...................................................................... 54
22. Serial Port Header ........................................................................... 54
23. Chassis Intrusion Header .................................................................. 55
24. Front and Rear Chassis Fan Headers .................................................. 55
25. Processor Fan Header ...................................................................... 55
26. Processor Core Power Connector........................................................ 56
27. Main Power Connector...................................................................... 56
28. Front Panel Header .......................................................................... 57
29. States for a One-Color Power LED ...................................................... 58
30. States for a Two-Color Power LED ...................................................... 58
31. BIOS Setup Configuration Jumper Settings.......................................... 60
32. DC Loading Characteristics ............................................................... 64
33. Fan Header Current Capability........................................................... 64
34. Thermal Considerations for Components ............................................. 68
35. Desktop Board DG965OT Environmental Specifications ......................... 69
36. BIOS Setup Program Menu Bar .......................................................... 72
37. BIOS Setup Program Function Keys.................................................... 72
38. Acceptable Drives/Media Types for BIOS Recovery ............................... 75
39. Boot Device Menu Options ................................................................ 76
40. Supervisor and User Password Functions............................................. 78
41. Beep Codes .................................................................................... 79
42. BIOS Error Messages ....................................................................... 79
43. Port 80h POST Code Ranges.............................................................. 80
44. Port 80h POST Codes ....................................................................... 81
45. Typical Port 80h POST Sequence........................................................ 84
46. Safety Regulations........................................................................... 85
47. Lead-Free Board Markings ................................................................ 90
48. EMC Regulations ............................................................................. 91
49. Product Certification Markings ........................................................... 92
viii
1 Product Description
What This Chapter Contains
1.1 Overview...................................................................................................10
1.2 Online Support...........................................................................................
1.3 Processor ..................................................................................................
1.4 System Memory .........................................................................................
1.5 Intel
1.6 Legacy I/O Controller..................................................................................
1.7 Audio Subsystem........................................................................................
1.8 LAN Subsystem..........................................................................................
1.9 Hardware Management Subsystem ...............................................................
1.10 Power Management ....................................................................................
®
G965 Express Chipset........................................................................23
15
15
16
28
30
32
34
36
9
Intel Desktop Board DG965OT Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DG965OT.
Table 1. Feature Summary
Form Factor microATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
Processor Support for the following:
®
• Intel
• Intel
• Intel
• Intel
Memory
Chipset
Audio 8-channel (7.1) audio subsystem using the SigmaTel* STAC9271D audio codec
Video Intel® GMA X3000 onboard graphics subsystem
Legacy I/O
Control
USB Support for USB 2.0 devices
Peripheral
Interfaces
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DC Gigabit
BIOS
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs
• Support for up to 8 GB of system memory using DDR2 667 or DDR2 533 DIMMs
• Support for up to 4 GB of system memory using DDR2 800 DIMMs
Intel
• Intel
• Intel
and Dolby* Home Theater certification
Legacy I/O controller for diskette drive, serial, parallel, and optional PS/2* ports
• 10 USB ports
• Two IEEE-1394a interfaces: one back panel connector and one front-panel
• Six Serial ATA IDE interfaces
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
• One diskette drive interface
• One serial port
• One parallel port
Ethernet Controller
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Core™2 Duo processor in an LGA775 socket with a 1066 or
800 MHz system bus
®
Pentium® D processor in an LGA775 socket with an 800 or
533 MHz system bus
®
Pentium® 4 processor in an LGA775 socket with an 800 or
533 MHz system bus
®
Celeron® D processor in an LGA775 socket with a 533 MHz system bus
®
G965 Express Chipset, consisting of:
®
82G965 Graphics and Memory Controller Hub (GMCH)
®
82801HH I/O Controller Hub (ICH8DH)
header
®
BIOS (resident in the SPI Flash device)
and SMBIOS
continued
10
Product Description
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
• Support for PCI Local Bus Specification Revision 2.3
• Support for PCI Express* Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
• Support for Intel
• One PCI Express x16 bus add-in card connector
• One PCI Express x1 bus add-in card connectors
• Two PCI Conventional* bus connectors
®
• Intel
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
Quiet System Technology implemented through the ICH8
Manageability Engine
®
Quick Resume Technology Drivers (Intel® QRTD)
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is
available in all marketing channels. Please contact your Intel representative to
determine which manufacturing options are available to you.
Table 2. Manufacturing Options
PS/2 ports
For information about Refer to
Available configurations for the Desktop Board DG965OT Section 1.2, page 15
Back panel PS/2 ports for mouse and keyboard connection
11
Intel Desktop Board DG965OT Technical Product Specification
1.1.3 Board Layout
Figure 1 shows the location of the major components.
DD
CC
BB
AA
A
C
B
E
D
F
G
H
I
J
Z
Y
K
L
U
R
T
V
W
X
S
Q
P
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.
M
N
O
OM18470
12
Table 3. Board Components Shown in Figure 1
Item/callout
from
Figure 1 Description
A IEEE-1394a header
B Front panel audio header
C PCI Conventional bus add-in card connector
D PCI Express x1 connector
E PCI Express x16 connector
F Back panel connectors
G Processor core power connector
H Rear chassis fan header
I LGA775 processor socket
J Intel 82G965 GMCH
K Processor fan header
L DIMM Channel A sockets
M Serial port header
N DIMM Channel B sockets
O Diskette drive connector
P Main Power connector
Q Battery
R Front chassis fan header
S Chassis intrusion header
T Intel 82801HH I/O Controller Hub (ICH8DH)
U BIOS Setup configuration jumper block
V Auxiliary front panel power LED header
W Front panel header
X Serial ATA connectors [6]
Y Front panel USB header
Z Speaker
AA Front panel USB header
BB Parallel ATE IDE connector
CC PCI Conventional bus add-in card connector
DD High Definition Audio Link header
Product Description
13
Intel Desktop Board DG965OT Technical Product Specification
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas.
PCI Express x1 Slot 1
Parallel ATA
IDE
Connector
LGA775
Processor
Socket
PCI Express
x16
Connector
PCI Express
x16 Interface
Display
Interface
VGA
Port
Channel A
DIMMs (2)
Channel B
DIMMs (2)
IEEE-1394a
Connector/Header
PCI Slot 1
Intel G965 Express Chipset
PCI Express x1 Interface
Parallel ATA
IDE
Controller
System Bus
(1066/800/533
MHz)
Intel 82G965
Graphics and
Memory
Controller Hub
(GMCH)
Dual-Channel
Memory Bus
SMBus
IEEE-1394a
Controller
PCI Bus
DMI Interconnect
PCI
Bus
Gigabit Ethernet
Controller
USB
Legacy
I/O
Controller
LPC
Bus
Intel 82801HH
I/O Controller Hub
(ICH8DH)
Serial ATA
IDE Interface
Audio
Codec
High Definition Audio Link
LAN
Connector
Back Panel/Front
Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse*
PS/2 Keyboard*
Diskette Drive
Connector
Serial
Peripheral
Interface (SPI)
Flash Device
Serial ATA IDE
Connectors (6)
Mic In
Line Out
Line In/Retasking Jack
Line Out/Retasking Jack
Mic In/Retasking Jack
Surround Left-Right/
Retasking Jack
Center Channel/LFE/
Retasking Jack
S/PDIF Out (Optical)
PCI Slot 2
14
SMBus
* = Optional
Figure 2. Block Diagram
High Definition
Audio Link
Header
OM18487
OM18487
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel® Desktop Board DG965OT
under “Desktop Board Products” or
“Desktop Board Support”
Available configurations for the
Desktop Board DG965OT
Processor data sheets http://www.intel.com/products/index.htm
ICH8DH addressing http://developer.intel.com/design/chipsets/datashts
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Supported video modes http://www.intel.com/design/motherbd/ot/ot_documentation.htm
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/ot/ot_available.htm
1.3 Processor
The board is designed to support the following processors:
• Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
• Intel Pentium D processor in an LGA775 processor socket with an 800 or
533 MHz system bus
• Intel Pentium 4 processor in an LGA775 processor socket with an 800 or
533 MHz system bus
• Intel Celeron D processor in an LGA775 processor socket with a 533 MHz
system bus
Product Description
See the Intel web site listed below for the most up-to-date list of supported
processors.
For information about… Refer to:
Supported processors http://www.intel.com/design/motherbd/ot/ot_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can
damage the board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.8.2.2, page 56
15
Intel Desktop Board DG965OT Technical Product Specification
1.4 System Memory
The board has four DIMM sockets and support the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 8 GB maximum total system memory using DDR2 667 or DDR2 533 DIMMs;
4 GB maximum total system memory using DDR2 800 DIMMs. Refer to
Section
memory.
• Minimum total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 800, DDR2 667, or DDR2 533 MHz SDRAM DIMMs
• DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
A minimum of 512 MB of system memory is required to fully enable both the onboard
graphics and the manageability engine.
2.1.1 on page 43 for information on the total amount of addressable
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Type
DDR2 533 256 Mbit 128 MB 512 MB 2 GB
DDR2 533 512 Mbit 256 MB 1 GB 4 GB
DDR2 533 1 Gbit 512 MB 2 GB 8 GB
DDR2 667 256 Mbit 128 MB 512 MB 2 GB
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 256 Mbit 128 MB 512 MB 2 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
16
Product Description
NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or
less than the processor system bus frequency. For example, if DDR2 800 memory is
used with a 533 MHz system bus frequency processor, the memory will operate at
533 MHz.
Table 5 lists the resulting operating memory frequencies based on the
combination of DIMMs and processors.
Table 5. Memory Operating Frequencies
DIMM Type Processor system bus frequency Resulting memory frequency
DDR2 533 533 MHz 533 MHz
DDR2 533 800 MHz 533 MHz
DDR2 533 1066 MHz 533 MHz
DDR2 667 533 MHz 533 MHz
DDR2 667 800 MHz 667 MHz
DDR2 667 1066 MHz 667 MHz
DDR2 800 533 MHz 533 MHz
DDR2 800 800 MHz 800 MHz
DDR2 800 1066 MHz 800 MHz
1.4.1 Memory Configurations
The Intel 82G965 GMCH supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
17
Intel Desktop Board DG965OT Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels
are black.
Figure 3. Memory Channel and DIMM Configuration
INTEGRATOR’S NOTE
#
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
ICH8DH Manageability Engine feature.
18
Product Description
1.4.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the
DIMM0 (blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM18339
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the capacity of the single
DIMM in the DIMM0 (blue) socket of Channel B.
512 MB
1 GB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM18340
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
19
Intel Desktop Board DG965OT Technical Product Specification
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the combined capacity of the
two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1
of both channels.
512 MB
1 GB
1 GB
512 MB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18341
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
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Product Description
1.4.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory
throughput.
Figure 7 shows a single channel configuration using one DIMM. In this example, only
the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18344
Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM
Figure 8 shows a single channel configuration using three DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A does not equal the capacity of the
single DIMM in the DIMM0 (blue) socket of Channel B.
512 MB
1 GB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Figure 8. Single Channel (Asymmetric) Mode Configuration with Three
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM18343
DIMMs
21
Intel Desktop Board DG965OT Technical Product Speci fication
1.4.1.3 Flex Mode Configuration
NOTE
✏
The use of flex mode requires DIMMs to be installed in both channels.
Figure 9 shows a flex mode configuration using two DIMMs. The operation is as
follows:
• The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB o f the
DIMM in the Channel B, DIMM 0 socket operate together in dual channel mode.
• The remaining (upper) 512 MB of the DIMM in Channel B operates in single channel
mode.
512 MB
1 GB
Figure 9. Flex Mode Configuration with Two DIMMs
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18404
22
Product Description
1.5 Intel® G965 Express Chipset
The Intel G965 Express chipset consists of the following devices:
• Intel 82G965 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
• Intel 82801HH I/O Controller Hub (ICH8DH) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D and display capabilities. The ICH8DH is a centralized controller for
the board’s I/O paths.
For information about Refer to
The Intel G965 Express chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
1.5.1 Intel G965 Graphics Subsystem
The Intel G965 Express chipset contains two separate, mutually exclusive graphics
options. Either the GMA X3000 graphics controller (contained within the 82G965
GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express
x16 add-in card is installed, the GMA X3000 graphics controller is disabled.
1.5.1.1 Intel® GMA X3000 Graphics Controller
The Intel GMA X3000 graphics controller features the following:
• 667 MHz core frequency
• High performance 3-D setup and render engine
• High quality texture engine
⎯ DX9.0c* & DX10 and OpenGL 1.5 compliant
⎯ Hardware Pixel Shader 3.0
⎯ Vertex Shader Model 3.0
⎯ 32-bit and 16-bit Full Precision Floating Point Operations
⎯ Occlusion query
⎯ 128-bit floating point texture formats
⎯ Bilinear, trilinear, and anisotropic MipMap filtering
⎯ Shadow maps and double sided stencils
⎯ Alpha and luminance maps
⎯ Texture color-keying/chroma-keying
⎯ Cubic environment reflection mapping
⎯ Enhanced texture blending functions
23
Intel Desktop Board DG965OT Technical Product Specification
• 3D Graphics Rendering enhancements
⎯ 1.3 dual texture GigaPixel/sec fill rate
⎯ 16 and 32 bit color
⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz
⎯ Vertex cache
⎯ Anti-aliased lines
⎯ OpenGL* version 1.5 support with vertex buffer and EXT_Shadow extensions
• 2D Graphics enhancements
⎯ 8, 16, and 32 bit color
⎯ Optimized 256-bit BLT engine
⎯ Color space conversion
⎯ Anti-aliased lines
• Video
⎯ Hardware motion compensation for MPEG2 and HD video
⎯ Software DVD at 30 fps full screen
⎯ Motion adaptive de-interlacing
• Display
⎯ Integrated 24-bit 400 MHz RAMDAC
⎯ Up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ DVI specification 1.0 compliant
⎯ Dual independent display options with digital display
⎯ 180-degree hardware screen rotation
⎯ Hardware color cursor support
⎯ Supports TMDS transmitters or TV-out encoders
⎯ HDCP support
⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media
Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display
connections
⎯ Supports flat panels up to 2048 x 1536 at 75 Hz (when in dual-channel mode)
or digital CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/MEC)
⎯ Two multiplexed SDVO port interfaces with 270 MHz pixel clocks using an
ADD2/MEC card
Dynamic Video Memory Technology (DVMT) support up to 256 MB
•
• Intel
®
Zoom Utility
24
Product Description
1.5.1.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. DVMT returns system memory back to the operating system when the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.5.1.3 Configuration Modes
A list of supported modes for the Intel GMA X3000 graphics controller is available as a
downloadable document.
For information about Refer to
Supported video modes for the board Section 1.2, page 15
1.5.1.4 Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
200 MHz pixel clock to the PCI Express x16 connector. The SDVO ports can be paired
for a dual channel configuration to support up to a 400 MHz pixel clock. When an
ADD2/MEC card is detected, the Intel GMA X3000 graphics controller is enabled and
the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the
SDVO ports to be accessed by the ADD2/MEC card. An ADD2/MEC card can either be
configured to support simultaneous display with the primary VGA display or can be
configured to support dual independent display as an extended desktop configuration
with different color depths and resolutions. ADD2/MEC cards can be designed to
support the following configurations:
• TV-Out (composite video)
• Transition Minimized Differential Signaling (TMDS) for DVI 1.0
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• VGA output
• HDTV output
• HDMI/UDI support (when used with the HD Audio Link)
25
Intel Desktop Board DG965OT Technical Product Specification
1.5.2 USB
The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.
The ICH8DH provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Four ports are routed to two separate front panel USB headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 15, page 51
The location of the front panel USB headers Figure 16, page 52
1.5.3 Serial ATA Interfaces
The board provides six Serial ATA (SATA) connectors, which support one device per
connector.
1.5.3.1 Serial ATA Support
The ICH8DH’s Serial ATA controller offers six independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of six Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or
power supplies equipped with low-voltage power connectors.
For more information, see:
For information about Refer to
The location of the Serial ATA connectors Figure 16, page 52
26
http://www.serialata.org/.
Product Description
1.5.3.2 Serial ATA RAID
The ICH8DH supports the following RAID (Redundant Array of Independent Drives)
levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
1.5.4 Parallel IDE Interface
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up
to 88 MB/sec.
• ATA-133: DMA protocol on IDE bus allows host and target throttling. The ATA-133
logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer
rates in excess of 100 MB/sec.
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to
reduce reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended
Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate
and translation mode to the BIOS.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 16, page 52
27
Intel Desktop Board DG965OT Technical Product Specification
1.5.5 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one.
1.6 Legacy I/O Controller
The I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
Figure 1 on page 12 shows the location of the battery.
The BIOS Setup program provides configuration options for the I/O controller.
1.6.1 Serial Port
The board has one serial port header located on the component side of the board. The
serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port header Figure 16, page 52
The signal names of the serial port header Table 22, page 54
1.6.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS
Setup program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 15, page 51
28
Product Description
1.6.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to
configure the diskette drive interface.
For information about Refer to
The location of the diskette drive connector Figure 16, page 52
1.6.4 Keyboard and Mouse Interface (Optional)
The optional PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported
in the top PS/2 connector. Power to the computer should be turned off before a
keyboard or mouse is connected or disconnected.
For information about Refer to
The location of the optional keyboard and mouse connectors Figure 15, page 51
29
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