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Intel® Desktop Board
DG43RK
Technical Product Specification
Order Number: E89497-001US
The Intel® Desktop Board DG43RK may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DG43RK Specification Update.
March 2010
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Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DG43RK Technical Product
Specification.
This product specification applies to only the standard Intel® Desktop Board DG43RK with BIOS
identifier RKG4310H.86A.
Changes to this specification will be published in the Intel Desktop Board DG43RK Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
March 2010
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, the Intel logo, Core, Pentium, Xeon, and Celeron are registered trademarks of Intel Corporation or its
subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2010, Intel Corporation. All rights reserved.
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Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board DG43RK. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DG43RK and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel Desktop Board DG43RK Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb Gigabit (1,073,741,824 bits)
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilobit (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048,576 bits)
Mb/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
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Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel® G43 Express Chipset............................................................... 19
1.6.1 Intel G43 Graphics Subsystem ............................................... 19
1.6.2 USB ................................................................................... 22
1.6.3 ATA Support ........................................................................ 23
1.7 Real-Time Clock Subsystem .............................................................. 24
1.8 Legacy I/O Controller ....................................................................... 25
1.8.1 Serial Port........................................................................... 25
1.8.2 Parallel Port......................................................................... 25
1.9 Audio Subsystem............................................................................. 26
1.9.1 Audio Subsystem Software .................................................... 27
1.9.2 Audio Connectors and Headers ............................................... 27
1.10 LAN Subsystem............................................................................... 28
1.10.1 Broadcom BCM57788 Gigabit Ethernet Controller ...................... 28
1.10.2 LAN Subsystem Software....................................................... 28
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 29
1.11 Hardware Management Subsystem .................................................... 30
1.11.1 Hardware Monitoring and Fan Control...................................... 30
1.11.2 Fan Monitoring..................................................................... 30
1.11.3 Chassis Intrusion Detection.................................................... 30
1.11.4 Thermal Monitoring .............................................................. 31
1.12 Power Management ......................................................................... 32
1.12.1 ACPI................................................................................... 32
1.12.2 Hardware Support ................................................................ 35
1.12.3 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 39
2 Technical Reference
2.1 Memory Map................................................................................... 41
2.1.1 Addressable Memory............................................................. 41
2.2 Connectors and Headers................................................................... 44
2.2.1 Back Panel Connectors .......................................................... 45
2.2.2 Component-side Connectors and Headers ................................ 46
2.3 BIOS Configuration Jumper Block....................................................... 56
2.4 Mechanical Considerations ................................................................ 58
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Intel Desktop Board DG43RK Technical Product Specification
2.4.1 Form Factor......................................................................... 58
2.5 Electrical Considerations ................................................................... 59
2.5.1 Power Supply Considerations ................................................. 59
2.5.2 Fan Header Current Capability................................................ 59
2.5.3 Add-in Board Considerations .................................................. 60
2.6 Thermal Considerations .................................................................... 60
2.7 Reliability ....................................................................................... 62
2.8 Environmental ................................................................................ 62
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 63
3.2 BIOS Flash Memory Organization ....................................................... 64
3.3 Resource Configuration .................................................................... 64
3.3.1 PCI* Autoconfiguration.......................................................... 64
3.4 System Management BIOS (SMBIOS)................................................. 65
3.5 Legacy USB Support ........................................................................ 66
3.6 BIOS Updates ................................................................................. 67
3.6.1 Language Support ................................................................ 67
3.6.2 Custom Splash Screen .......................................................... 67
3.7 BIOS Recovery................................................................................ 68
3.8 Boot Options................................................................................... 68
3.8.1 Optical Drive Boot ................................................................ 68
3.8.2 Network Boot....................................................................... 68
3.8.3 Booting Without Attached Devices........................................... 69
3.8.4 Changing the Default Boot Device During POST ........................ 69
3.9 Adjusting Boot Speed....................................................................... 69
3.9.1 Peripheral Selection and Configuration..................................... 69
3.9.2 BIOS Boot Optimizations ....................................................... 70
3.10 BIOS Security Features .................................................................... 71
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 73
4.2 BIOS Beep Codes ............................................................................ 73
4.3 Front-panel Power LED Blink Codes .................................................... 74
4.4 BIOS Error Messages ....................................................................... 74
4.5 Port 80h POST Codes ....................................................................... 75
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 81
5.1.1 Safety Standards.................................................................. 81
5.1.2 European Union Declaration of Conformity Statement................ 82
5.1.3 Product Ecology Statements................................................... 83
5.1.4 EMC Regulations .................................................................. 87
5.1.5 Product Certification Markings (Board Level)............................. 88
5.2 Battery Disposal Information............................................................. 89
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Contents
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration........................................... 18
4. Back Panel Audio Connectors ............................................................ 27
5. LAN Connector LED Locations............................................................ 29
6. Thermal Sensors and Fan Headers ..................................................... 31
7. Location of the Standby Power Indicator LED....................................... 38
8. Detailed System Memory Address Map ............................................... 42
9. Back Panel Connectors ..................................................................... 45
10. Component-side Connectors and Headers ........................................... 46
11. Connection Diagram for Front Panel Header ........................................ 52
12. Connection Diagram for Front Panel USB Headers ................................ 54
13. Connection Diagram for IEEE 1394a Header ........................................ 55
14. Location of the BIOS Configuration Jumper Block ................................. 56
15. Board Dimensions ........................................................................... 58
16. Localized High Temperature Zones..................................................... 61
Tables
1. Feature Summary.............................................................................. 9
2. Board Components Shown in Figure 1 ................................................ 12
3. Supported Memory Configurations ..................................................... 16
4. HDMI Port Status Conditions ............................................................. 21
5. DVI Port Status Conditions................................................................ 21
6. Audio Jack Retasking Support ........................................................... 26
7. LAN Connector LED States................................................................ 29
8. Effects of Pressing the Power Switch .................................................. 32
9. Power States and Targeted System Power........................................... 33
10. Wake-up Devices and Events ............................................................ 34
11. System Memory Map ....................................................................... 43
12. Component-side Connectors and Headers Shown in Figure 10................ 47
13. Front Panel Audio Header for HD Audio............................................... 48
14. Front Panel Audio Header for AC ’97 Audio .......................................... 48
15. Serial ATA Connectors...................................................................... 48
16. Serial Port Header ........................................................................... 48
17. Parallel Port Header ......................................................................... 49
18. S/PDIF Header ................................................................................ 49
19. Chassis Intrusion Header.................................................................. 50
20. Processor (4-Pin) Fan Header............................................................ 50
21. Front and Rear Chassis Fan Headers .................................................. 50
22. Processor Core Power Connector........................................................ 51
23. Main Power Connector...................................................................... 51
24. Front Panel Header .......................................................................... 52
25. States for a One-Color Power LED...................................................... 53
26. States for a Two-Color Power LED...................................................... 53
27. Alternate Front Panel Power LED Header............................................. 54
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Intel Desktop Board DG43RK Technical Product Specification
28. BIOS Setup Configuration Jumper Settings.......................................... 57
29. Recommended Power Supply Current Values ....................................... 59
30. Fan Header Current Capability........................................................... 59
31. Thermal Considerations for Components ............................................. 61
32. Intel Desktop Board DG43RK Environmental Specifications.................... 62
33. BIOS Setup Program Menu Bar.......................................................... 64
34. BIOS Setup Program Function Keys.................................................... 64
35. Acceptable Drives/Media Types for BIOS Recovery ............................... 68
36. Boot Device Menu Options ................................................................ 69
37. Supervisor and User Password Functions............................................. 71
38. BIOS Beep Codes ............................................................................ 73
39. Front-panel Power LED Blink Codes.................................................... 74
40. BIOS Error Messages ....................................................................... 74
41. Port 80h POST Code Ranges.............................................................. 75
42. Port 80h POST Codes ....................................................................... 76
43. Typical Port 80h POST Sequence........................................................ 79
44. Safety Standards............................................................................. 81
45. Lead-Free Board Markings ................................................................ 86
46. EMC Regulations ............................................................................. 87
47. Product Certification Markings ........................................................... 88
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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of Intel Desktop Board DG43RK.
Table 1. Feature Summary
Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor Support for the following:
Memory
Chipset
Audio 10-channel (7.1 + 2) audio subsystem using Realtek ALC888S-VC high definition
Video Integrated graphics:
Legacy I/O Control ITE* IT8721F based Legacy I/O controller for hardware management and serial,
®
• Intel
• Intel
• Intel
• Intel® Celeron® Dual-Core processor 400/1000 Series in an LGA775 socket
• Intel
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for up to 8 GB of system memory using non-ECC DDR3 800, 1066, or
Intel
• Intel
• Intel
audio codec
• Intel
• External graphics:
parallel, and PS/2* ports
Core™2 Quad processor Q6000/Q8000/Q9000 Series in an LGA775
socket
®
Core™2 Duo processor E4000/E6000/E7000/E8000 Series in an LGA775
socket
®
Pentium® Dual-Core processor E2000/E5000 Series in an LGA775 socket
®
Xeon® processor 3000/X3000 Series in an LGA775 socket
1333 (OC) MHz DIMMs
®
G43 Express Chipset, consisting of:
®
82G43 Graphics and Memory Controller Hub (GMCH)
®
82801JIB I/O Controller Hub (Intel ICH10)
®
Graphics Media Accelerator X4500 (Intel® GMA X4500) onboard graphics
subsystem with support for:
― Analog displays (via a DVI-I to VGA adapter)
― Digital displays (DVI-I and HDMI)
― PCI Express x16 add-in graphics card connector
― PCI Express x1 add-in graphics card connectors
― Conventional PCI* bus add-in graphics card connector
continued
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Intel Desktop Board DG43RK Technical Product Specification
Table 1. Feature Summary (continued)
Peripheral
Interfaces
LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the Broadcom* BCM57788
BIOS
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
• Twelve USB 2.0 ports:
― Six ports are implemented with stacked back panel connectors
― Six ports are routed to three separate front panel headers
• Two IEEE 1394a ports:
― One back panel port
― One front panel header
• Four internal Serial ATA (SATA) interfaces
• One Parallel ATA (PATA) connector
• One parallel port header
• One serial port header
• PS/2 keyboard/mouse port on the back panel
Gigabit Ethernet Controller
®
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI* Local Bus Specification Revision 2.3
• Support for PCI Express* Revision 1.1
• Suspend to RAM support
• Wake on PCI, PCI Express, PS/2 devices, serial port, front panel, USB ports,
• One PCI Express 2.0 x16 bus add-in card connector
• Two PCI Express 1.0 x1 bus add-in card connectors
• One Conventional PCI bus connector
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
BIOS (resident in the SPI Flash device)
and SMBIOS
and LAN
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1.1.2 Board Layout
Figure 1 shows the location of the board’s major components.
Product Description
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
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Intel Desktop Board DG43RK Technical Product Specification
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1 Descript
A Front panel audio header
B Conventional PCI bus add-in card connector
C Speaker
D PCI Express x1 connector
E PCI Express x16 connector
F Battery
G PCI Express x1 connector
H Back panel connectors
I Processor core power connector (2 x 2)
J Rear chassis fan header
K LGA775 processor socket
L Intel 82G43 GMCH
M Processor fan header
N DIMM Channel A sockets
O DIMM Channel B sockets
P Front chassis fan header
Q Parallel port header
R Standby power LED
S Main power connector (2 x 12)
T Parallel ATA connector
U BIOS setup configuration jumper block
V Intel 82801JIB I/O Controller Hub (Intel ICH10)
W Alternate front panel Power LED header
X Serial ATA connectors (4)
Y Front panel header
Z Front panel USB header
AA Front panel USB header
BB Front panel USB header
CC Serial port header
DD Chassis intrusion header
EE Front panel IEEE 1394a header
FF S/PDIF header
ion
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1.1.3 Block Diagram
Figure 2 is a block diagram of the board’s major functional areas.
Product Description
Figure 2. Block Diagram
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Intel Desktop Board DG43RK Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel® Desktop Board products, with specific changes
including (but not limited to) the following:
• No floppy drive connector
• No parallel port connector on the back panel
• No serial port connector on the back panel
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DG43RK http://www.intel.com/products/motherboard/DG43RK/index.htm
Desktop Board Support http://www.intel.com/support/motherboards/desktop
Available configurations for the Intel
Desktop Board DG43RK
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://www.intel.com/products/motherboard/DG43RK/index.htm
025414.htm
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Product Description
1.4 Processor
The board is designed to support the following processors:
®
• Intel
• Intel
• Intel
• Intel
• Intel
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W. The processors listed above are only
supported when falling within the wattage requirements of the board. See the Intel
web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
Core™2 Quad processor Q6000/Q8000/Q9000 Series in an LGA775 socket
®
Core™2 Duo processor E4000/E6000/E7000/E8000 Series in an LGA775
socket
®
Pentium® Dual-Core processor E2000/E5000 Series in an LGA775 socket
®
Celeron® Dual-Core processor 400/1000 Series in an LGA775 socket
®
Xeon® processor 3000/X3000 Series in an LGA775 socket
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.3, page 51
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Intel Desktop Board DG43RK Technical Product Specification
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 800 MHz, DDR3 1066 MHz, and DDR3 1333 (OC) MHz SDRAM DIMMs
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 8 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
Configuration
(Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
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Product Description
1.5.1 Memory Configurations
The Intel 82G43 GMCH supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/
cs-011965.htm
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Intel Desktop Board DG43RK Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
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Product Description
1.6 Intel
The Intel G43 Express chipset consists of the following devices:
• Intel 82G43 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
• Intel 82801JIB I/O Controller Hub (Intel ICH10)
The GMCH component provides interfaces to the CPU, memory, and the DMI
interconnect. The component also provides integrated graphics capabilities supporting
3D, 2D, and display capabilities. Intel ICH10 is a centralized controller for the board’s
I/O paths.
The chipset supports the following features:
• Onboard graphics
• Dynamic Video Memory Technology
• USB
• Serial ATA
For information about Refer to
The Intel G43 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
G43 Express Chipset
1.6.1 Intel G43 Graphics Subsystem
The Intel G43 Express chipset contains two separate, mutually exclusive graphics
options. Either the Intel GMA X4500 graphics controller (contained within the Intel
82G43 GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI
Express x16 add-in card is installed, the Intel GMA X4500 graphics controller is
disabled.
1.6.1.1 Intel
®
Graphics Media Accelerator X4500 Graphics
Controller
The Intel GMA X4500 graphics controller features the following:
• High quality texture engine
⎯ DirectX10* and OpenGL* 2.0 compliant
⎯ Shader Model 4.0
• 3D Graphics Rendering enhancements
⎯ 1.6 dual texture GigaPixel/s max fill rate
⎯ 16-bit and 32-bit color
⎯ Vertex cache
• Video
⎯ Hi-Definition playback (partial hardware acceleration for MPEG-2, full hardware
acceleration for VC1 and AVC)
⎯ Dynamic Video Memory Technology (DVMT) 5.0 uses system memory based on
the operating system and the amount of memory installed
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Intel Desktop Board DG43RK Technical Product Specification
• Display
⎯ Supports digital and analog displays up to 1920 x 1200 at 60 Hz refresh
(WUXGA) and 2560 x 1600 at 60 Hz refresh (WQXGA) respectively; also
supports 1920 x 1080 resolution for full High Definition video playback quality
⎯ Dual independent display support (HDMI and DVI-I)
1.6.1.2 Dynamic Video Memory Technology (DVMT 5.0)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. The amount of system memory
allocated to DVMT varies depending on the amount of total system memory installed
as well as the operating system being used. For Windows Vista*, a minimum of
128 MB can be allocated to DVMT and a maximum of over 2 GB can be allocated to
DVMT with the correct amount of memory installed. DVMT returns system memory
back to the operating system when the additional system memory is no longer
required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Configuration Modes
The video modes supported by this board are based on the Extended Display
Identification Data (EDID) modes of the monitor to which the system is connected.
Standard monitors are assumed.
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Product Description
1.6.1.4 High-Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high-definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports 8-channel digital audio. The HDMI port is compliant with the
HDMI 1.3 specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
HDMI port will behave as described in Table 4.
Table 4. HDMI Port Status Conditions
PCI Express x16 Connector Status HDMI Port Status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
PCI Express x4, x8, or x16 add-in card installed Disabled
ADD2 or MEC/ADD2+ card installed Disabled
1.6.1.5 Digital Visual Interface (DVI)
The DVI-I port supports both digital and analog DVI displays. The maximum
supported resolution is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI port is
compliant with the DVI 1.0 specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in Table 5.
Table 5. DVI Port Status Conditions
PCI Express x16 Connector Status
No add-in card installed Enabled Enabled
Non-video PCI Express x1 add-in card
installed
PCI Express x4, x8, or x16 add-in card
installed
ADD2 or MEC card installed Disabled Enabled
NOTE
DVI Digital (DVI-D)
Port Status
Enabled Enabled
Disabled Disabled
DVI Analog (DVI-A)
Port Status
DVI analog output can also be converted to VGA with a DVI to VGA adapter.
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Intel Desktop Board DG43RK Technical Product Specification
1.6.1.6 Advanced Digital Display (ADD2/MEC/ADD2+) Card
Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
400 MHz pixel clock to the PCI Express x16 connector. When an ADD2/MEC/ADD2+
card is detected, the Intel GMA X4500HD graphics controller is enabled and the PCI
Express x16 connector is configured for SDVO mode. SDVO mode enables the SDVO
ports to be accessed by the ADD2/MEC/ADD2+ card. An ADD2/MEC/ADD2+ card can
either be configured to support simultaneous display or can be configured to support
dual independent display as an extended desktop configuration with different color
depths and resolutions with DVI analog output only. ADD2/MEC/ADD2+ cards can be
designed to support the following configurations:
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• HDTV output
1.6.1.7 PCI Express x16 Graphics
The GMCH also supports add in discrete graphics card via the PCI Express 2.0 graphics
connector.
• PCI Express 2.0 x16:
⎯ Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (500 MB/s total). Maximum theoretical bandwidth on interface of
4 GB/s in each direction simultaneously, for an aggregate of 8 GB/s when
operating in x16 mode.
⎯ Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (1000 MB/s total). Maximum theoretical bandwidth on interface of
8 GB/s in each direction simultaneously, for an aggregate of 16 GB/s when
For information about Refer to
PCI Express technology http://www.pcisig.com
operating in x16 mode.
1.6.2 USB
The board supports up to twelve USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers.
The Intel ICH10 provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Six ports are routed to three separate front panel USB headers
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 45
The location of the front panel USB headers Figure 10, page 46
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Product Description
1.6.3 ATA Support
The board provides five ATA interface connectors:
• One PATA connector that supports two devices
• Four SATA connectors that support one device per connector
1.6.3.1 PATA Interface
The discrete PATA controller has one bus-mastering PATA interface that is accessible
through a 44-pin connector. The PATA interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/s.
• Ultra DMA: DMA protocol on ATA bus supporting host and target throttling and
transfer rates of up to 33 MB/s.
• ATA-66: DMA protocol on ATA bus supporting host and target throttling and
transfer rates of up to 66 MB/s. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
• ATA-100: DMA protocol on ATA bus allows host and target throttling. The
controller’s ATA-100 logic can achieve read transfer rates up to 100 MB/s and write
transfer rates up to 88 MB/s.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The PATA interface also supports ATAPI devices (such as optical drives) and ATA
devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector
(ECHS) translation modes. The drive reports the transfer rate and translation mode to
the BIOS.
For information about Refer to
The location of the PATA connector Figure 10, page 46
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Intel Desktop Board DG43RK Technical Product Specification
1.6.3.2 SATA Interfaces
The Intel ICH10 SATA controller offers four independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gb/s on each port. One device can be installed on each
port for a maximum of four SATA devices. A point-to-point interface is used for host
to device connections, unlike PATA which supports a master/slave configuration and
two devices on each channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller supports IDE and AHCI (Microsoft Windows Vista only)
configuration and can operate in both legacy and native modes. In legacy mode,
standard ATA I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode,
standard Conventional PCI bus resource steering is used. Native mode is the
preferred mode for configurations using the Windows* XP and Windows Vista
operating systems.
For information about Refer to
Obtaining AHCI driver Section 1.3, page 14
The location of the SATA connectors Figure 10, page 46
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
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Product Description
1.8 Legacy I/O Controller
The Legacy I/O controller provides the following features:
• One serial port header
• One parallel port header
• PS/2-style keyboard or mouse interface
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Serial Port
The board has one serial port header located on the component side of the board. The
serial port supports data transfers at speeds up to 115.2 kb/s with BIOS support.
For information about Refer to
The location of the serial port header Figure 10, page 46
The signal names of the serial port header Table 16, page 48
1.8.2 Parallel Port
The parallel port is implemented as a 26-pin header on the board. Use the BIOS
Setup program to set the parallel port mode.
For information about Refer to
The location of the parallel port header Figure 10, page 46
The signal names of the parallel port header Table 17, on page 49
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Intel Desktop Board DG43RK Technical Product Specification
1.9 Audio Subsystem
The audio subsystem consists of the following:
• Intel 82801JIB (Intel ICH10)
• Realtek ALC888S-VC audio codec
The audio subsystem supports the following audio interfaces:
• S/PDIF header
• Front panel audio header with support for Intel
Audio) and AC ’97 audio
• Back panel audio connectors
NOTE
Systems built with an AC ‘97 audio front panel will not be able to obtain the Microsoft
Windows Vista logo.
Table 6 lists the supported functions of the front panel and back panel audio jacks.
®
High Definition Audio (Intel® HD
Table 6. Audio Jack Retasking Support
Audio Jack
FP Green Default Ctrl panel
FP Pink Default
Rear Blue Ctrl panel Default Ctrl panel
Rear Green Ctrl panel Default
Rear Pink Default
Rear Black Default
Rear Orange Default
Microphone
Head-
phones
Front
Speaker Line In
Side
Surround
Rear
Surround
Center/
Sub
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Product Description
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 14
1.9.2 Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Surround left/right channel audio out/retasking jack
B Center channel and LFE (subwoofer) audio out
C Line in
D Line out
E Mic in
F S/PDIF digital audio out (optical)
Figure 4. Back Panel Audio Connectors
For information about Refer to
The location of the front panel audio header Figure 10, page 46
The signal names of the front panel audio header Table 13, page 48
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Intel Desktop Board DG43RK Technical Product Specification
1.10 LAN Subsystem
The LAN subsystem consists of the following:
• Broadcom BCM57788 Gigabit Ethernet Controller (10/100/1000 Mb/s)
• Intel 82801JIB (Intel ICH10)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between Intel ICH10 and the LAN controller
• Conventional PCI bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.10.1 Broadcom BCM57788 Gigabit Ethernet Controller
The Broadcom BCM57788 Gigabit Ethernet Controller supports the following features:
• PCI Express link
• 10/100/1000 IEEE 802.3 compliant
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
1.10.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.2, page 14
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Product Description
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 7 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 7. LAN Connector LED States
LED Color State Condition
N/A Off LAN link is not established
Link (A)
Speed (B)
Green
N/A Off 10 Mb/s data rate
Green On 100 Mb/s data rate
Yellow On 1000 Mb/s data rate
On LAN link is established
Blinking LAN activity occurring
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Intel Desktop Board DG43RK Technical Product Specification
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.11.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Fan speed control controllers and sensors integrated into the Intel ICH10
• Remote thermal diode sensor for ambient temperature sensing
• Thermal sensors in the processor, Intel 82G43 GMCH, and Intel 82801JIB ICH10
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 V, +1.125 V, and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed according to thermal conditions
1.11.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.12.2.2, page 36
1.11.3 Chassis Intrusion Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 10, page 46
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1.11.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Product Description
Item Description
A Rear chassis fan header
B Thermal diode, located on the processor die
C Processor fan header
D Thermal diode, located on the GMCH die
E Front chassis fan header
F Thermal diode, located on the Intel ICH10 die
Figure 6. Thermal Sensors and Fan Headers
NOTE
The minimum thermal reporting threshold for the GMCH is 66 °C. The GMCH thermal
sensor will display 66 °C until the temperature rises above this point.
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Intel Desktop Board DG43RK Technical Product Specification
1.12 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB (S1 and S3 only)
⎯ Power Management Event signal (PME#) wake-up support
⎯ WAKE# signal wake-up support
⎯ Wake from PS/2 device
⎯ Wake from serial port
1.12.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 10 on page 34)
• Support for a front panel power and sleep mode switch
Table 8 lists the system states based on how long the power switch is pressed,
dependi
g on how ACPI is configured with an ACPI-aware operating system.
n
Table 8. Effects of Pressing the Power Switch
If the system is in this
state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
…and the power switch
is pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than four seconds Fail safe power-off
Less than four seconds Wake-up
More than four seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
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Product Description
1.12.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 9 lists the power states supported by the board along with the associated
system power targets. See the AC
various system and power states.
Table 9. Power States and Targeted System Power
PI specificat
ion for a complete description of the
Global
States
G0 – working
state
G0 – idle state S0 – idle state C3 – sleep D0 Full power < 50 W
G0 – idle state S0 – idle state C4 – deep
G1 – sleeping
state
G1 – sleeping
state
G1 – sleeping
state
G2/S5 S5 – Soft off.
G3 –
mechanical off.
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system inclusive of Wake
on LAN allowance of 0.7 W. Intel Management Engine Interface (Intel MEI) is assumed to be in Wake on
LAN mode.
Sleeping States
S0 – working C0 – working D0 – working
S1 – Processor
stopped
S3 – Suspend to
RAM. Context
saved to RAM.
S4 – Suspend to
disk. Context
saved to disk.
Context not saved.
Cold boot is
required.
No power to the
system.
Processor
States
sleep
C1 – stop
grant
No power D3 – no power
No power D3 – no power
No power D3 – no power
No power D3 – no power for
Device States
state.
D0 Full power < 50 W
D1, D2, D3 –
device
specification
specific.
except for
wake-up logic.
except for
wake-up logic.
except for
wake-up logic.
wake-up logic,
except when
provided by
battery or
external source.
Targeted System
Power
Full power > 50 W
5 W < power < 50 W
Power < 4.7 W
Power < 2.7 W
Power < 2.7 W
No power to the system.
Service can be performed
safely.
(Note 1)
(Note 2)
(Note 2)
(Note 2)
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Intel Desktop Board DG43RK Technical Product Specification
1.12.1.2 Wake-up Devices and Events
Table 10 lists the devices or specific events that can wake the computer from specific
states.
Table 10. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
LAN S1, S3, S4, S5
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
RTC alarm S1, S3, S4, S5
Serial port S1, S3
USB S1, S3
WAKE# signal S1, S3, S4, S5
PS/2 port S1, S3, S4, S5
Notes:
• S4 implies operating system support only.
• USB ports are turned off during S4/S5 states.
• The PCI Express WAKE# signal is controlled by the enable/disable option in the BIOS.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
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Product Description
1.12.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB (S1 and S3 only)
• Power Management Event signal (PME#) wake-up support
• WAKE# signal wake-up support
• Wake from PS/2 devices
• Wake from serial port
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB technologies from an ACPI state requires an operating
system that provides full ACPI support.
1.12.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the main power connector Figure 10, page 46
The signal names of the main power connector Table 23, page 51
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Intel Desktop Board DG43RK Technical Product Specification
1.12.2.2 Fan Headers
The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• The processor fan header is wired to a fan tachometer input. The front and rear fan
headers each have independent tachometer input to the hardware monitoring and
fan control device. All fan headers support closed-loop fan control that can adjust
the fan speed according to thermal conditions.
• All fan headers have a +12 V DC connection.
• The system fan headers support auto-detection for 4-pin and 3-pin system fans. If
a 4-pin system fan is detected, PWM control is used. If a 3-pin fan is detected,
linear voltage control is used.
For information about Refer to
The locations of the fan headers and thermal sensors Figure 6, page 31
The signal names of the fan headers Table 20, page 50
1.12.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
• The PCI Express WAKE# signal
• The PCI bus PME# signal for PCI 2.3 compliant LAN designs
⎯ By Ping
⎯ Magic Packet
• The onboard LAN subsystem
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Product Description
1.12.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 10 on page 34 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PC
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
I Bus Power Managem
ent Interface Specification. Add-in
1.12.2.5 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and support in the operating system.
1.12.2.6 PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).
1.12.2.7 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
1.12.2.8 Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1, S3, S4, or S5 state. When
the computer is in an S4 state, any key can be used to wake the computer provided a
supported operating system is installed. When the computer is in the S5 state, the
only PS/2 activity that will wake the computer is the either the alt-PrtScrn key
combination or the “Power” key that is available on some keyboards. The BIOS can be
used to toggle between either of the key combinations.
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Intel Desktop Board DG43RK Technical Product Specification
1.12.2.9 Wake from Serial Port
Serial port activity wakes the computer from an ACPI S1 or S3 state.
1.12.2.10 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power Indicator LED
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Product Description
1.12.3 ENERGY STAR* 5.0, e-Standby, and ErP
Compliance
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Intel Desktop Board DG43RK meets the following program requirements in an
adequate system configuration, including appropriate selection of an efficient power
supply:
• Energy Star v5.0, category B
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2009 (ErP)
For information about Refer to
ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainable-productpolicy/ecodesign/index_en.htm
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Intel Desktop Board DG43RK Technical Product Specification
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2 Technical Reference
2.1 Memory Map
2.1.1 Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for Conventional PCI bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/ SPI Flash (32 Mb)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• GMCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI
Express add-in cards
• Base graphics memory support (1 MB or 8 MB)
• Intel MEI single channel (8 MB) or dual channel (16 MB)
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Intel Desktop Board DG43RK Technical Product Specification
The amount of installed memory that can be used will vary based on add-in cards,
BIOS settings, and operating system installed. Figure 8 shows a schematic of the
system memory map. All installed system memory can be used when there is no
overlap of system addresses.
Figure 8. Detailed System Memory Address Map
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Technical Reference
Table 11 lists the system memory map.
Table 11. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 8388608 K 100000 - 3FFFFFFFF 8191 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the Conventional
PCI bus). Dependent on video
adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
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Intel Desktop Board DG43RK Technical Product Specification
2.2 Connectors and Headers
CAUTION
Only the following connectors have overcurrent protection: Back panel and front panel
USB, PS/2, and IEEE 1394a.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB or IEEE 1394 header single wire connectors
may eventually overload the overcurrent protection and cause damage to the board.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
This section describes the board’s connectors and headers. The connectors and
headers can be divided into these groups:
• Back panel I/O connectors (see page 45)
• Component-side connectors and headers (see page 46)
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2.2.1 Back Panel Connectors
Figure 9 shows the location of the back panel connectors.
Item Description
A PS/2 keyboard/mouse port
B USB ports (2)
C DVI-I output
D HDMI output
E IEEE 1394a connector
F USB ports (2)
G LAN
H USB ports (2)
I Surround left/right channel audio out/
retasking jack
J Center channel and LFE (subwoofer)
audio out
K S/PDIF digital audio out (optical)
L Line in
M Line out
N Mic in
Technical Reference
NOTES
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
The PS/2 port supports both keyboard and mouse but not concurrently. Auto-detection
of device type will occur during POST and cannot be changed until the next restart.
Figure 9. Back Panel Connectors
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Intel Desktop Board DG43RK Technical Product Specification
2.2.2 Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
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Technical Reference
Table 12 lists the component-side connectors and headers identified in Figure 10.
Table 12. Component-side Connectors and Headers Shown in Figure 10
Item/callout
from Figure 10 Descript
A Front panel audio header
B Conventional PCI bus add-in card connector
C PCI Express x1 connector
D PCI Express x16 connector
E Battery
F PCI Express x1 connector
G Processor core power connector (2 x 2)
H Rear chassis fan header
I Processor fan header
J Front chassis fan header
K Parallel port header
L Main power connector (2 x 12)
M Parallel ATA connector
N Alternate front panel Power LED header
O Serial ATA connectors (4)
P Front panel header
Q Front panel USB header
R Front panel USB header
S Front panel USB header
T Serial port header
U Chassis intrusion header
V Front panel IEEE 1394a header
W S/PDIF header
ion
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Intel Desktop Board DG43RK Technical Product Specification
2.2.2.1 Signal Tables for the Connectors and Headers
Table 13. Front Panel Audio Header for HD Audio
Pin Signal Name Pin Signal Name
1 [Port 1] Left channel 2 Ground
3 [Port 1] Right channel 4 PRESENCE# (Dongle present)
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 14. Front Panel Audio Header for AC ’97 Audio
Pin Signal Name Pin Signal Name
1 MIC 2 AUD_GND
3 MIC_BIAS 4 AUD_GND
5 FP_OUT_R 6 FP_RETURN_R
7 N/A 8 Key (no pin)
9 FP_OUT_L 10 FP_RETURN_L
Table 15. Serial ATA Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 16. Serial Port Header
Pin Signal Name Pin Signal Name
1 DCD (Data Carrier Detect) 2 RXD# (Receive Data)
3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready)
5 Ground 6 DSR (Data Set Ready)
7 RTS (Request to Send) 8 CTS (Clear to Send)
9 RI (Ring Indicator) 10 Key (no pin)
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Table 17. Parallel Port Header
Pin Standard Signal Name ECP Signal Name EPP Signal Name
1 STROBE# STROBE# WRITE#
2 AUTOFD# AUTOFD#, HOSACK DATASTB#
3 PD0 PD0 PD0
4 FAULT# FAULT#, PERIPHREQST# FAULT#
5 PD1 PD1 PD1
6 INT# INT#, REVERSERQST# RESET#
7 PD2 PD2 PD2
8 SLCTIN# SLCTIN# ADDRSTB#
9 PD3 PD3 PD3
10 GROUND GROUND GROUND
11 PD4 PD4 PD4
12 GROUND GROUND GROUND
13 PD5 PD5 PD5
14 GROUND GROUND GROUND
15 PD6 PD6 PD6
16 GROUND GROUND GROUND
17 PD7 PD7 PD7
18 GROUND GROUND GROUND
19 ACK# ACK# INTR
20 GROUND GROUND GROUND
21 BUSY BUSY#, PERIPHACK WAIT#
22 GROUND GROUND GROUND
23 PERROR PE, ACKREVERSE# PE
24 GROUND GROUND GROUND
25 SELECT SELECT SELECT
26 KEY (no pin) KEY (no pin) KEY (no pin)
Technical Reference
Table 18. S/PDIF Header
Pin Signal Name
1 Ground
2 S/PDIF out
3 Key (no pin)
4 +5 VDC
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Intel Desktop Board DG43RK Technical Product Specification
Table 19. Chassis Intrusion Header
Pin Signal Name
1 Intruder#
2 Ground
Table 20. Processor (4-Pin) Fan Header
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Table 21. Front and Rear Chassis Fan Headers
Pin 4-Wire Support Pin 3-Wire Support
1 Ground 3 Ground
2 +12 V 2 FAN_POWER
3 FAN_TACH 1 FAN_TACH
4 FAN_CONTROL N/A N/A
2.2.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
• PCI Express 2.0 x16: one PCI Express 2.0 x16 connector supporting simultaneous
transfer speeds up to 8 GB/s of peak bandwidth per direction and up to 16 GB/s
concurrent bandwidth.
• PCI Express 1.1 x1: two PCI Express 1.1 x1 connectors. The x1 interface
supports simultaneous transfer speeds up to 250 MB/s of peak bandwidth per
direction and up to 2 GB/s concurrent bandwidth.
• Conventional PCI (rev 2.3 compliant) bus: one Conventional PCI bus add-in card
connector.
Note the following considerations for the Conventional PCI bus connector:
• The Conventional PCI bus connector is bus master capable.
• SMBus signals are routed to the Conventional PCI bus connector. This enables
Conventional PCI bus add-in boards with SMBus support to access sensor data on
the desktop board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
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2.2.2.3 Power Supply Connectors
The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 22. Processor Core Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
Table 23. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V
12 2 x 12 connector detect
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
(Note)
23 +5 V
(Note)
24 Ground
(Note)
(Note)
For information about Refer to
Power supply considerations Section 2.5.1, page 59
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2.2.2.4 Front Panel Header
This section describes the functions of the front panel header. Table 24 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 24. Front Panel Header
Pin Signal
In/
Out Description
Pin Signal
In/
Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED
pull-up to +5 V
3 HDA# Out Hard disk active
LED
2 HDR_BLNK_GRN Out Front panel green
LED
4 HDR_BLNK_YEL Out Front panel yellow
LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
Figure 11. Connection Diagram for Front Panel Header
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2.2.2.4.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
• A Serial ATA hard drive connected to an onboard Serial ATA connector
• A Parallel ATA hard drive connected to an onboard Parallel ATA connector
2.2.2.4.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 25 shows the
possible states for a one-color LED. Table 26 shows the possible states for a two-color
LED.
Table 25. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Table 26. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 25 and Table 26 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
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2.2.2.5 Alternate Front Panel Power LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 27. Alternate Front Panel Power LED Header
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
2.2.2.6 Front Panel USB Headers
Figure 12 is a connection diagram for the front panel USB headers.
NOTE
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
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2.2.2.7 Front Panel IEEE 1394a Header
Figure 13 is a connection diagram for the IEEE 1394a header.
NOTE
• The +12 V DC power on the IEEE 1394a header is fused.
• The IEEE 1394a header provides one IEEE 1394a port.
Technical Reference
Figure 13. Connection Diagram for IEEE 1394a Header
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Intel Desktop Board DG43RK Technical Product Specification
2.3 BIOS Configuration Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 14 shows the location of the BIOS configuration jumper block. The jumper
determines the BIOS Setup program’s mode. Table 28 lists the jumper settings for the
three modes: normal
mode and the computer is powered-up, the BIOS compares the processor version and
the microcode version in the BIOS and reports if the two match.
, confi
gure, and recovery. When the jumper is set to configure
Figure 14. Location of the BIOS Configuration Jumper Block
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Table 28. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal 1-2
The BIOS uses current configuration information and passwords
for booting.
Technical Reference
321
Configure 2-3
321
Recovery None
321
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
The BIOS attempts to recover the BIOS configuration. See
Section 3.7 for more information on BIOS recovery.
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2.4 Mechanical Considerations
2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters]. Location of the I/O connectors and mounting holes are in
compliance with the ATX specification.
58
Figure 15. Board Dimensions
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Technical Reference
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section 1.4
on page 15 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive,
one optical drive, and all board peripherals enabled, the minimum recommended
power supply is 135W. Table 29 lists the recommended power supply current values.
Table 29. Recommended Power Supply Current Values
Output Voltage
Current
3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB
4.2 5.4 7.2 4.0 0.2 0.5
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 30 lists the current capability of the fan headers.
Table 30. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
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Intel Desktop Board DG43RK Technical Product Specification
2.5.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all three
expansion slots filled) must not exceed 8 A.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 16) can reach a temperature of up to 85
an open chassis.
o
C in
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Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel 82G43 GMCH
D Intel 82801JIB (Intel ICH10)
Figure 16. Localized High Temperature Zones
Table 31 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 31. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82G43 GMCH 103 oC (under bias)
Intel 82801JIB (Intel ICH10) 112 oC (under bias)
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Intel Desktop Board DG43RK Technical Product Specification
For information about Refer to
Processor datasheets and specification updates Section 1.2, page 14
Intel G43 Express chipset datasheets, specification updates,
and design guides
http://www.intel.com/products/chip
sets/index.htm
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia SR-332,
Method I Case 1 50% electrical stress, 40 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 40 ºC. The Intel Desktop Board
DG43RK MTBF is 393,925 hours.
2.8 Environmental
Table 32 lists the environmental specifications for the board.
Table 32. Intel Desktop Board DG43RK Environmental Specifications
Parameter Specification
Temperature
Non-Operating
Operating
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product weight (pounds) Free fall (inches) Velocity change
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
-20 °C to +70 °C at 95% humidity
0 °C to +50 °C at 90% humidity
(inches/second²)
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3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
RKG4310H.86A.
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 56 shows how to put the board in configure mode.
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Table 33 lists the BIOS Setup program menu features.
Table 33. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features and
power supply
controls
Table 34 lists the function keys available for menu screens.
Table 34. BIOS Setup Program Function Keys
Selects boot
options
Saves or
discards
changes to
Setup
program
options
BIOS Setup Program
Function Key
<←> or <→>
<↑> or <↓>
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
Description
Selects a different menu screen (Moves the cursor left or right)
Selects an item (Moves the cursor up or down)
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mb (4096 KB)
flash memory device.
3.3 Resource Configuration
3.3.1 PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
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Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
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3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel
Toolkit.
®
Integrator
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating system’s
installation instructions.
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Overview of BIOS Features
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel
• Intel
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about Refer to
BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb/
®
Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.
®
Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB drive), or an optical drive.
CS-022312.htm.
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Check the
Intel web site for details.
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit or Intel
Integrator Assistant that are available from Intel can be used to create a custom
splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about
Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
Additional Intel® software tools http://developer.intel.com/products/motherboard/DG43RK/tools.htm
Refer to
and
http://developer.intel.com/design/motherbd/software.htm
®
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3.7 BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 35 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 35. Acceptable Drives/Media Types for BIOS Recovery
Media Type Can be used for BIOS recovery?
Optical drive connected to the Serial ATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the
legacy diskette drive interface
For information about Refer to
BIOS recovery http://support.intel.com/support/motherboards/desktop/
sb/CS-023360.htm
No
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.8.1 Optical Drive Boot
Booting from the optical drive is supported in compliance to the El Torito bootable
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the
optical drive is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt
to boot from the next defined drive.
3.8.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
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3.8.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that, after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.8.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup program’s
Boot Device Priority Submenu). Table 36 lists the boot device menu options.
Table 36. Boot Device Menu Options
Boot Device Menu Function Keys Description
<↑> or <↓>
<Enter> Exits the menu, saves changes, and boots from the selected
<Esc> Exits the menu without saving changes
Selects a default boot device
device
3.9 Adjusting Boot Speed
These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” in less than
eight seconds that minimizes hard drive startup delays.
• Select an optical drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
• Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
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3.9.2 BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
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Overview of BIOS Features
3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 37 shows the effects of setting the supervisor password and user password.
T
is table is for reference only and is not displayed on the screen.
h
Table 37. Supervisor and User Password Functions
Password
Set
Neither Can change all
Supervisor
only
User only N/A Can change all
Supervisor
and user set
Note: If no password is set, any user can change all Setup options.
Supervisor
Mode
options
Can change all
options
Can change all
options
(Note)
User Mode
Can change all
options
Can change a
limited number
of options
options
Can change a
limited number
of options
(Note)
Setup Options
None None None
Supervisor Password Supervisor None
Enter Password
Clear User Password
Supervisor Password
Enter Password
Password
to Enter
Setup
User User
Supervisor or
user
Password
During
Boot
Supervisor or
user
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Intel Desktop Board DG43RK Technical Product Specification
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4 Error Messages and Beep Codes
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information
during POST.
For information about Refer to
The location of the onboard speaker Figure 1, page 11
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s
speaker to beep an error message describing the problem (see Table 38).
Table 38. BIOS Beep Codes
Type Pattern Frequency
Processor initialization
complete
POST complete One 0.5 second beep when POST completes. 3270 Hz
BIOS update in progress None
Video error On-off (0.5 seconds each) two times, then
Memory error On-off (0.5 seconds each) three times, then
Thermal trip warning On-off (0.5 seconds each) four times, then
One 0.5 second beep when the CPU initialization
process completes.
3.0 second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
3.0 second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
3.0 second pause (off), entire pattern repeats
(beeps and pause) until the sixteenth beep, then
ends.
3270 Hz
3270 Hz
When no VGA option ROM is
found.
1280 Hz
1280 Hz
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4.3 Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 39).
Table 39. Front-panel Power LED Blink Codes
Type Pattern Note
Processor initialization
complete
POST complete On when the system powers up, then off for
BIOS update in progress Off when the update begins, then on for
Video error On-off (0.5 seconds each) two times, then
Memory error On-off (0.5 seconds each) three times, then
Thermal trip warning On-off (0.5 seconds each) four times, then
On when the system powers up, then off for
0.5 seconds.
0.5 seconds.
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
3.0 second pause (off), entire pattern repeats
(blink and pause) until the system is powered
off.
3.0 second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
3.0 second pause (off), entire pattern repeats
(blinks and pause) until the sixteenth blink, then
ends.
When no VGA option ROM is
found.
4.4 BIOS Error Messages
Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem. Table 40 lists the error messages and provides a
brief description of each.
Table 40. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
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Error Messages and Beep Codes
4.5 Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
• Table 41 lists the Port 80h POST code ranges
• Table 42 lists the Port 80h POST codes themselves
• Table 43 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 41. Port 80h POST Code Ranges
Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF E0 – EE: Miscellaneous codes. See Table 42.
EF: Boot/S3 resume failure.
F0 – FF: FF processor exception.
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Intel Desktop Board DG43RK Technical Product Specification
Table 42. Port 80h POST Codes
POST Code Description of POST Operation
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
28 Testing memory
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
58 Resetting USB bus
59 Reserved for USB
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
5C Resetting SMBus
5D Reserved for SMBus
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
Host Processor
Chipset
Memory
PCI Bus
USB
ATA/ATAPI/SATA
SMBus
Local Console
Remote Console
continued
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Error Messages and Beep Codes
Table 42. Port 80h POST Codes (continued)
POST Code Description of POST Operation
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detection etc.)
B3 Enabling/configuring a fixed media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
Dy Trying boot selection y (y=0 to 15)
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
Keyboard (PS/2 or USB)
Mouse (PS/2 or USB)
Fixed Media
Removable Media
BDS
PEI Core
DXE Core
continued
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Intel Desktop Board DG43RK Technical Product Specification
Table 42. Port 80h POST Codes (continued)
POST Code Description of POST Operation
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
Runtime Phase/EFI OS Boot
DXE Drivers
PEIMs/Recovery
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Table 43. Typical Port 80h POST Sequence
POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
5A Resetting PATA/SATA bus and all devices
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
5A Resetting PATA/SATA bus and all devices
28 Testing memory
90 Resetting keyboard
94 Clearing keyboard input buffer
E7 Waiting for user input
01 INT 19
00 Ready to boot
Error Messages and Beep Codes
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Intel Desktop Board DG43RK Technical Product Specification
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5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance
This section contains the following regulatory compliance information for Intel Desktop
Board DG43RK:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards
Intel Desktop Board DG43RK complies with the safety standards stated in Table 44
when correctly installed in a compatible host system.
Table 44. Safety Standards
Standard Title
CSA/UL 60950-1, First Edition Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second
Edition
IEC 60950-1:2005, Second
Edition
Information Technology Equipment – Safety - Part 1: General
Requirements (European Union)
Information Technology Equipment – Safety - Part 1: General
Requirements (International)
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Intel Desktop Board DG43RK Technical Product Specification
5.1.2 European Union Declaration of Conformity
Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DG43RK is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC και 2006/95/EC.
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv
előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
iami Dyrektyw Unii Europejskiej
Polski
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC
& 2006/95/EC.
Niniejszy produkt jest zgodny z postanow
ien
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Regulatory Compliance and Battery Disposal Information
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC a 2006/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.
5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
for the
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Intel Desktop Board DG43RK Technical Product Specification
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology
para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
pour en
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology
untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology
(em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
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Regulatory Compliance and Battery Disposal Information
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology
за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
5.1.3.3 Lead Free Desktop Board
This Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Desktop Board is referred to as “Lead-free second level
interconnect.” The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Table 45 shows the various forms of the “Lead-Free 2
appears on the board and accompanying collateral.
nd
Level Interconnect” mark as it
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Intel Desktop Board DG43RK Technical Product Specification
Table 45. Lead-Free Board Markings
Description Mark
Lead-Free 2
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
nd
Level Interconnect:
or
or
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Regulatory Compliance and Battery Disposal Information
5.1.4 EMC Regulations
Intel Desktop Board DG43RK complies with the EMC regulations stated in Table 46
when correctly installed in a compatible host system.
Table 46. EMC Regulations
Regulation Title
FCC 47 CFR Part 15,
Subpart B
ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022:2006 Limits and methods of measurement of Radio Interference Characteristics
EN55024:1998 Information Technology Equipment – Immunity Characteristics Limits and
EN55022:2006 Australian Communications Authority, Standard for Electromagnetic
CISPR 22:2005
+A1:2005 +A2:2006
CISPR 24:1997
+A1:2001 +A2:2002
VCCI V-3/2007.04,
V-4/2007.04
KN-22, KN-24 Korean Communications Commission – Framework Act on
CNS 13438:2006 Bureau of Standards, Metrology and Inspection (Taiwan)
Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio
Frequency Devices. (USA)
of Information Technology Equipment. (European Union)
methods of measurement. (European Union)
Compatibility. (Australia and New Zealand)
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
Information Technology Equipment – Immunity Characteristics – Limits and
Methods of Measurement. (International)
Voluntary Control for Interference by Information Technology Equipment.
(Japan)
Telecommunications and Radio Waves Act (South Korea)
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
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Intel Desktop Board DG43RK Technical Product Specification
Korean Class B statement translation: this is household equipment that is certified to
comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
5.1.5 Product Certification Markings (Board Level)
Intel Desktop Board DG43RK has the product certification markings shown in
Table 47:
Table 47. Product Certification Markings
Description Mark
UL joint US/Canada Recognized Component mark..
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to European Union (EU) EMC directive and
Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum
Management (NZ RSM) C-tick mark.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea KCC (Korean Communications Commission) mark.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
V-0
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Regulatory Compliance and Battery Disposal Information
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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