Intel BOXDG41AN, DG41AN Technical Product Specification

Intel® Desktop Board DG41AN

Technical Product Specification

Order Number: E96323-001US

The Intel® Desktop Board DG41AN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG41AN Specification Update.

June 2010

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board DG41AN Technical Product Specification

This product specification applies to only the standard Intel® Desktop Board DG41AN with BIOS identifier ANG4110H.86A.

Changes to this specification will be published in the Intel Desktop Board DG41AN Specification Update before being incorporated into a revision of this document.

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desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal

June 2010

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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

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Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the

Intel

Desktop Board DG41AN.

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop Board DG41AN and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the Intel Desktop Board DG41AN 2 A map of the resources of the Intel Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

iii

Intel Desktop Board DG41AN Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1 Product Description

1.1 Overview.......................................................................................... 9

1.1.1 Feature Summary .................................................................. 9

1.1.2 Board Layout ....................................................................... 11

1.1.3 Block Diagram ..................................................................... 13

1.2 Legacy Considerations...................................................................... 14

1.3 Online Support................................................................................ 14

1.4 Processor ....................................................................................... 14

1.5 System Memory .............................................................................. 15

1.5.1 Memory Configurations ......................................................... 17

1.6 Intel® G41 Express Chipset............................................................... 19

1.6.1 Intel G41 Graphics Subsystem ............................................... 19

1.6.2 USB ................................................................................... 21

1.6.3 Serial ATA Interfaces ............................................................ 21

1.7 Real-Time Clock Subsystem .............................................................. 22

1.8 Legacy I/O Controller ....................................................................... 22

1.8.1 Serial Port Interface.............................................................. 22

1.8.2 PS/2 Keyboard/Mouse Interface ............................................. 23

1.9 Audio Subsystem............................................................................. 23

1.9.1 Audio Subsystem Software .................................................... 24

1.9.2 Audio Connectors and Headers ............................................... 24

1.10 LAN Subsystem............................................................................... 25

1.10.1 LAN Subsystem Software....................................................... 25

1.10.2 RJ-45 LAN Connector with Integrated LEDs .............................. 26

1.11 Hardware Management Subsystem .................................................... 27

1.11.1 Hardware Monitoring and Fan Control...................................... 27

1.11.2 Fan Monitoring..................................................................... 27

1.11.3 Chassis Intrusion and Detection.............................................. 27

1.11.4 Thermal Monitoring .............................................................. 28

1.12 Power Management ......................................................................... 29

1.12.1 ACPI................................................................................... 29

1.12.2 Hardware Support ................................................................ 32

2 Technical Reference

2.1 Memory Map................................................................................... 37

2.1.1 Addressable Memory............................................................. 37

2.2 Connectors and Headers................................................................... 40

2.2.1 Back Panel Connectors .......................................................... 41

2.2.2 Component-side Connectors and Headers ................................ 42

2.3 Jumper Block .................................................................................. 50

2.4 Mechanical Considerations ................................................................ 52

2.4.1 Form Factor......................................................................... 52

2.5 Electrical Considerations ................................................................... 53

2.5.1 Power Supply Considerations ................................................. 53

2.5.2 Fan Header Current Capability................................................ 54

2.5.3 Add-in Board Considerations .................................................. 54

2.6 Thermal Considerations .................................................................... 54

2.7 Reliability ....................................................................................... 56

2.8 Environmental ................................................................................ 57

3 Overview of BIOS Features

3.1 Introduction ................................................................................... 59

3.2 BIOS Flash Memory Organization ....................................................... 60

3.3 Resource Configuration .................................................................... 60

3.3.1 PCI Autoconfiguration ........................................................... 60

3.4 System Management BIOS (SMBIOS)................................................. 61

3.5 Legacy USB Support ........................................................................ 61

3.6 BIOS Updates ................................................................................. 62

3.6.1 Language Support ................................................................ 62

3.6.2 Custom Splash Screen .......................................................... 63

3.7 BIOS Recovery................................................................................ 63

3.8 Boot Options................................................................................... 64

3.8.1 Optical Drive Boot ................................................................ 64

3.8.2 Network Boot....................................................................... 64

3.8.3 Booting Without Attached Devices........................................... 64

3.8.4 Changing the Default Boot Device During POST ........................ 64

3.9 Adjusting Boot Speed....................................................................... 65

3.9.1 Peripheral Selection and Configuration..................................... 65

3.9.2 BIOS Boot Optimizations ....................................................... 65

3.10 BIOS Security Features .................................................................... 66

4 Error Messages and Beep Codes

4.1 Speaker ......................................................................................... 67

4.2 BIOS Beep Codes ............................................................................ 67

4.3 Front-panel Power LED Blink Codes .................................................... 68

4.4 BIOS Error Messages ....................................................................... 68

4.5 Port 80h POST Codes ....................................................................... 69

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 75

5.1.1 Safety Standards.................................................................. 75

5.1.2 European Union Declaration of Conformity Statement................ 76

5.1.3 Product Ecology Statements................................................... 77

5.1.4 EMC Regulations .................................................................. 79

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 82

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 83

5.2 Battery Disposal Information............................................................. 84

Contents

Figures

1. Major Board Components.................................................................. 11

2. Block Diagram ................................................................................ 13

3. Memory Channel Configuration and DIMM Configuration........................ 18

4. Back Panel Audio Connectors ............................................................ 24

5. LAN Connector LED Locations............................................................ 26

6. Thermal Sensors and Fan Headers ..................................................... 28

7. Location of the Standby Power Indicator LED....................................... 35

8. Detailed System Memory Address Map ............................................... 38

9. Back Panel Connectors ..................................................................... 41

10. Component-side Connectors and Headers ........................................... 42

11. Connection Diagram for Front Panel Header ........................................ 47

12. Connection Diagram for Front Panel USB Headers ................................ 49

13. Location of the Jumper Block............................................................. 50

14. Board Dimensions ........................................................................... 52

15. Localized High Temperature Zones..................................................... 55

Tables

1. Feature Summary.............................................................................. 9

2. Board Components Shown in Figure 1 ................................................ 12

3. Supported Memory Configurations ..................................................... 16

4. Audio Jack Support.......................................................................... 23

5. LAN Connector LED States................................................................ 26

6. Effects of Pressing the Power Switch .................................................. 29

7. Power States and Targeted System Power........................................... 30

8. Wake-up Devices and Events ............................................................ 31

9. System Memory Map ....................................................................... 39

10. Component-side Connectors and Headers Shown in Figure 10................ 43

11. Serial ATA Connectors...................................................................... 44

12. Chassis Intrusion Header.................................................................. 44

13. Serial Port Header ........................................................................... 44

14. Front Chassis Fan Header ................................................................. 44

15. Processor Fan Header ...................................................................... 44

16. Front Panel Audio Header for Intel® HD Audio...................................... 45

17. Front Panel Audio Header for AC ’97 Audio .......................................... 45

18. Auxiliary Front Panel Power/Sleep LED Header..................................... 45

19. Processor Core Power Connector........................................................ 46

20. Main Power Connector...................................................................... 46

21. Front Panel Header .......................................................................... 47

22. States for a One-Color Power LED...................................................... 48

23. States for a Two-Color Power LED...................................................... 48

24. Auxiliary Front Panel Power LED Header.............................................. 48

25. BIOS Setup Configuration Jumper Settings.......................................... 51

26. Recommended Power Supply Current Values ....................................... 53

27. Fan Header Current Capability........................................................... 54

28. Thermal Considerations for Components ............................................. 56

vii

29. Intel Desktop Board DG41AN Environmental Specifications.................... 57

30. BIOS Setup Program Menu Bar.......................................................... 60

31. BIOS Setup Program Function Keys.................................................... 60

32. Acceptable Drives/Media Types for BIOS Recovery ............................... 63

33. Boot Device Menu Options ................................................................ 64

34. Supervisor and User Password Functions............................................. 66

35. BIOS Beep Codes ............................................................................ 67

36. Front-panel Power LED Blink Codes.................................................... 68

37. BIOS Error Messages ....................................................................... 68

38. Port 80h POST Code Ranges.............................................................. 69

39. Port 80h POST Codes ....................................................................... 70

40. Typical Port 80h POST Sequence........................................................ 73

41. Safety Standards............................................................................. 75

42. EMC Regulations ............................................................................. 79

43. Regulatory Compliance Marks............................................................ 83

viii

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel® Desktop Board DG41AN.

Table 1. Feature Summary

Form Factor Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]) Processor Support for the following 65 W TDP processors:

Memory

Chipset

Video Intel® Graphics Media Accelerator X4500 (Intel

Audio 5.1+2-channel audio subsystem using the Realtek* ALC888VC audio codec

Legacy I/O Control

Peripheral Interfaces

LAN Support 10/100/1000 Mbits/sec LAN subsystem using a Realtek RTL8111E Gigabit Ethernet

BIOS

• Intel

• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 800 MHz, 1066 MHz, and 1333 (Overclocked (OC)) MHz

• Support for up to 4 GB of system memory

Intel

• Intel

subsystem

Winbond W83627DHG-P based Legacy I/O controller for hardware management, serial, parallel, and PS/2* ports

• Eight USB 2.0 ports: four back panel connectors and two front panel headers for

• Three Serial ATA (SATA) interfaces

• One PS/2 keyboard/mouse port on back panel

• One serial port header (may require specialized chassis or cable for use)

• Parallel port on back panel

Controller

• Intel BIOS (resident in the SPI Flash device)

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

Celeron® processor E1000/E3000 series in an LGA775 socket

Celeron® processor 400 Sequence in an LGA775 socket

Pentium® processor E2000/E5000/E6000 series in an LGA775 socket

Core™2 Duo processor E4000/E5000/E6000/E8000 series in an LGA775

socket

Core™2 Quad Q8000s/Q9000s series in an LGA775 socket

Xeon® processor 3000/E3000 series in an LGA775 socket

DIMMs

Note: DDR3 1333 MHz memory runs at 1066 MHz by default until manually overclocked through the system BIOS.

G41 Express Chipset, consisting of:

82G41 Graphics and Memory Controller Hub (GMCH)

82801GB I/O Controller Hub (ICH7)

GMA X4500) onboard graphics

support of four ports

and SMBIOS

continued

Intel Desktop Board DG41AN Technical Product Specification

Table 1. Feature Summary (continued)

Instantly Available PC Technology

Expansion Capabilities

Hardware Monitor Subsystem

• Support for PCI* Local Bus Specification Revision 2.3

• Suspend to RAM support

• Wake on PCI, LAN, serial port, front panel, PS/2 device, and USB ports

• One Conventional PCI bus connector

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Two fan headers

• Two fan sense inputs used to monitor fan activity

1.1.2 Board Layout

Figure 1 shows the location of the major components.

Product Description

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Intel Desktop Board DG41AN Technical Product Specification

Table 2. Board Components Shown in Figure 1

Item/callout from Figure 1 Descri

A Back panel connectors B Processor core power connector (2 x 2) C Front panel USB header D Front panel USB header

E Alternate front panel power LED header

F BIOS Setup configuration jumper block G LGA775 processor socket H Front chassis fan header

I Processor fan header J Front panel header

K Main Power connector (2 x 12)

L Standby power LED M Battery N Piezoelectric speaker O DIMM Channel A socket

P DIMM Channel B socket Q Intel 82G41 GMCH R Intel 82801GB I/O Controller Hub (ICH7) S Serial ATA connectors (3)

T Conventional PCI bus add-in connector U Front panel audio header V Chassis intrusion header W Serial port header

ption

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas.

Product Description

Figure 2. Block Diagram

Intel Desktop Board DG41AN Technical Product Specification

1.2 Legacy Considerations

This board differs from other Intel® Desktop Board products, with specific changes including (but not limited to) the following:

• No serial port on the back panel

• No diskette drive connector

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board D425KT and Intel Desktop Board D425KTW

Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for the Intel

Desktop Board D425KT and Intel Desktop Board D425KTW

Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration information http://www.intel.com/support/go/buildit

http://www.intel.com/products/motherboard/index.htm

http://ark.intel.com

025414.htm

1.4 Processor

The board is designed to support the following processors:

• Intel

Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 65 W. The processors listed above are only supported when falling within the wattage requirements of the board. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

socket

Celeron® processor E1000/E3000 series in an LGA775 socket Celeron® processor 400 Sequence in an LGA775 socket Pentium® processor E2000/E5000/E6000 series in an LGA775 socket Core™2 Duo processor E4000/E5000/E6000/E8000 series in an LGA775

Core™2 Quad Q8000s/Q9000s series in an LGA 775 socket Xeon® processor 3000/E3000 series in an LGA775 socket

Product Description

INTEGRATOR’S NOTE

Use only ATX12V-compliant power supplies.

For information about

Power supply connectors Section 2.2.2.4, page 46

Refer to

1.5 System Memory

The board has two DIMM sockets and supports the following memory features:

• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the

voltage to support higher performance DDR3 SDRAM DIMMs

• Dual channel interleaved mode support

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMs with x16 organization are not supported.

• 4 GB maximum total system memory (with two 2 GB DIMMs). Refer to

Section 2.1.1 on page 37 for information on the total amount of addressable memory.

• Minimum total system memory: 512 MB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 800 MHz, DDR3 1066 MHz, and DDR3 1333 (overclocking required) MHz

SDRAM DIMMs

Note: DDR3-1333 memory operates at 1066 MHz by default until manually

overclocked through the system BIOS.

CAUTION

Altering PC memory frequency, voltage and/or latency may: (i) reduce system stability and useful life of the system, memory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the memory beyond its specifications. Intel assumes no responsibility that the memory, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with the memory manufacturer for warranty and additional details.

Intel Desktop Board DG41AN Technical Product Specification

The Desktop Board supports multiple processor and memory speeds. It is important to understand that not all memory speeds are supported with all processor speeds. Memory speed cannot exceed the Front Side Bus (FSB) speed of the processor. Table 3 lists the supported processor FSB and memory speeds.

Table 3.

Processor FSB DDR3-800 Memory DDR3-1066 Memory DDR3-1066 Memory

800 MHz Memory runs at

1066 MHz Memory runs at

1333 MHz Memory runs at

Processor and Memory Speeds

Memory runs at

800 MHz

800 MHz; cannot be overclocked

Memory runs at

800 MHz; cannot be

1066 MHz

overclocked

Memory runs at 800 MHz; cannot be overclocked

1066 MHz; cannot

be overclocked

Memory runs at 800 MHz; cannot be overclocked

Memory runs at 1066 MHz; cannot be overclocked

Memory may be overclocked to 1333 MHz; memory runs at 1066 MHz

 NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This enables the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

Table 4 lists the supported DIMM configurations.

Table 4. Supported Memory Configurations

DIMM Capacity

1024 MB Single-sided 1 Gbit 1 Gb x8/empty 8 2048 MB Double-sided 1 Gbit 1 Gb x8/1 Gb x8 16 2048 MB Single-sided 2 Gbit 2 Gb x8/empty 8

Note: 4 GB DIMM modules are not supported.

For information about… Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/

Configuration

(Note)

SDRAM Density

SDRAM Organization Front-side/Back-side

CS-025414.htm

Number of SDRAM Devices

Product Description

1.5.1 Memory Configurations

The Intel 82G41 GMCH supports the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for

real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel

bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Flex mode. This mode provides the most flexible performance characteristics.

The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 4 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Intel Desktop Board DG41AN Technical Product Specification

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel Configuration and DIMM Configuration

INTEGRATOR’S NOTE

Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated.

Product Description

1.6 Intel

The Intel G41 Express chipset consists of the following devices:

• Intel 82G41 Graphics and Memory Controller Hub (GMCH) with Direct Media

Interface (DMI) interconnect

• Intel 82801GB I/O Controller Hub (ICH7) with DMI interconnect The GMCH component provides interfaces to the processor, memory, PCI, and the DMI

interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D, and display capabilities. The ICH7 is a centralized controller for the board’s I/O paths.

The chipset supports the following features:

• Onboard graphics

• Dynamic Video Memory Technology

• USB

• Serial ATA

For information about Refer to

The Intel G41 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

G41 Express Chipset

1.6.1 Intel G41 Graphics Subsystem

The Intel G41 Express chipset contains two separate graphics options. Either the Intel Graphics Media Accelerator X4500 (Intel GMA X4500) graphics controller (contained within the 82G41 GMCH) is used, or a PCI graphics card can be used. When a PCI graphics card is installed, the Intel GMA X4500 graphics controller defaults to a secondary display device and may be available for video output with the operating system.

1.6.1.1 Intel

Graphics Media Accelerator X4500 Graphics

Controller

The Intel GMA X4500 graphics controller features the following:

• High quality texture engine ⎯ DirectX10* and OpenGL* 2.0 compliant ⎯ Shader Model 4.0

• 3D Graphics Rendering enhancements ⎯ 1.6 dual texture GigaPixel/s maximum fill rate ⎯ 16-bit and 32-bit color ⎯ Vertex cache

• Video ⎯ High Definition content at up to 1080p resolution ⎯ Dynamic Video Memory Technology (DVMT) 5.0 uses system memory based on

the operating system and the amount of memory installed

Intel Desktop Board DG41AN Technical Product Specification

• Display ⎯ Supports digital and analog displays up to 2048 x 1536 at 75 Hz refresh

(QXGA); also supports 1920 x 1080 resolution for full High Definition video playback quality

⎯ Dual independent display support

1.6.1.2 Dynamic Video Memory Technology (DVMT 5.0)

DVMT enables enhanced graphics and memory performance through highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. The amount of system memory allocated to DVMT varies depending on the amount of total system memory installed as well as the operating system being used. For Microsoft Windows Vista*, a minimum of 128 MB can be allocated to DVMT and a maximum of over 2 GB can be allocated to DVMT with the correct amount of memory installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem.

DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions.



NOTE

The use of DVMT requires operating system driver support.

1.6.1.3 Configuration Modes

The video modes supported by this board are based on the Extended Display Identification Data (EDID) modes of the monitor to which the system is connected. Standard monitors are assumed.

1.6.1.4 Analog Display (VGA)

The VGA port supports analog displays. The maximum supported resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate.

The VGA port is enabled for POST whenever a monitor is attached, regardless of the DVI-D connector status.

1.6.1.5 Digital Visual Interface (DVI-D)

The DVI-D port supports digital DVI displays. The maximum supported resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate. The DVI port is compliant with the DVI 1.0 specification.

Product Description

1.6.2 USB

The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers.

The ICH7 provides the USB controller for all ports. The port arrangement is as follows:

• Four ports are implemented with stacked back panel connectors

• Four ports are routed to two separate front panel USB headers

For information about Refer to

The location of the USB connectors on the back panel Figure 9, page 41 The location of the front panel USB headers Figure 10, page 42

1.6.3 Serial ATA Interfaces

The board provides three Serial ATA (SATA) connectors, which support one device per connector.

1.6.3.1 Serial ATA Support

The board’s Serial ATA controller offers three independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gb/s per port. One device can be installed on each port for a maximum of three Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.

For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard Conventional PCI bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP operating system.



NOTE

Many Serial ATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/

For information about Refer to

The location of the Serial ATA connectors Figure 10, page 42

Intel Desktop Board DG41AN Technical Product Specification

1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

 NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.

1.8 Legacy I/O Controller

The I/O controller provides the following features:

• One serial port header

• One parallel port

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• PS/2-style keyboard/mouse interface

• Intelligent power management, including a programmable wake-up event interface

• PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

1.8.1 Serial Port Interface

The serial port header is located on the component side of the board. The serial port supports data transfers at speeds up to 115.2 kbits/s with BIOS support.

For information about Refer to

The location of the serial port header Figure 10, page 42 The serial port header signal mapping Table 14, page 44

1.8.2 PS/2 Keyboard/Mouse Interface

The one PS/2 keyboard/mouse connector is located on the back panel.

Product Description



NOTE

Power to the computer should be turned off before a keyboard is connected or disconnected.

For information about Refer to

The location of the keyboard/mouse connector Figure 9, page 41

1.9 Audio Subsystem

The onboard audio subsystem consists of the following:

• Intel 82801GB (ICH7)

• Realtek ALC888VC audio codec

• Back panel audio connectors

• Component-side audio headers/connectors: ⎯ Front panel audio header with support for Intel

HD Audio) and AC ’97 audio

The audio subsystem supports the following features:

• A signal-to-noise (S/N) ratio of 95 dB

• Independent 5.1 audio playback from back panel connectors and stereo playback

from the Intel High Definition Audio front panel header

High Definition Audio (Intel®



NOTE

Systems built with an AC ‘97 front panel will not be able to obtain the Microsoft Windows Vista logo.

Table 5 lists the supported functions of the front panel and back panel audio jacks.

Table 5. Audio Jack Support

Audio Jack

Front panel – Green No No No No Yes Front panel – Pink No No No Yes No Back panel – Blue Yes Yes No No No Back panel – Green No No No No Yes Back panel – Pink No No Yes Yes No

Supports

Line in?

Supports

Rear

Surround?

Supports

Center/

LFE?

Supports

Micro-

phone?

Supports

Line Out

Head-

phones or

Speaker?

Intel Desktop Board DG41AN Technical Product Specification

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and drivers Section 1.3, page 14

1.9.2 Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors.

The front/back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio ports are shown in Figure 4.

Item Description

A Line in B Line out C Mic in

Figure 4. Back Panel Audio Connectors



NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about Refer to

The location of the front panel audio header Figure 10, page 42 The signal names of the front panel audio header Table 17, page 45 The back panel audio connectors Section 2.2.1, page 41

Product Description

1.10 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82801GB ICH7

• Realtek RTL8111E Gigabit Ethernet controller for 10/100/1000 Mbits/s Ethernet

LAN connectivity

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between ICH7 and the LAN controller

• Conventional PCI bus power management ⎯ ACPI technology support ⎯ LAN wake capabilities

• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

1.10.1 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers Section 1.2, page 14

Intel Desktop Board DG41AN Technical Product Specification

1.10.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item Description

A Link LED (Green) B Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 6. LAN Connector LED States

LED LED Color LED State Condition

Off LAN link is not established.

Link Green

Data Rate Green/Yellow

On LAN link is established. Blinking LAN activity is occurring. Off 10 Mbits/s data rate is selected. Green 100 Mbits/s data rate is selected. Yellow 1000 Mbits/s data rate is selected.

Product Description

1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Fan monitoring and control

• Thermal and voltage monitoring

• Chassis intrusion detection

1.11.1 Hardware Monitoring and Fan Control

The features of the hardware monitoring and fan control include:

• The Legacy I/O Controller smart fan control, delivering acoustically-optimized thermal management

• Fan speed control controllers and sensors integrated into the Legacy I/O Controller

• Four thermal sensors (processor, 82G41 GMCH, 82801GB ICH7, and a remote

thermal sensor)

• Power supply monitoring of five voltages (+12 V, +5 V, +3.3 V, +1.125 V, and +VCCP) to detect levels above or below acceptable values

• Thermally monitored closed-loop fan control, for both fans, that can adjust the fan speed according to thermal conditions

1.11.2 Fan Monitoring

Fan monitoring can be implemented using third-party software. The level of monitoring and control is dependent on the I/O controller used with the board.

For information about Refer to

The functions of the fan headers Section 1.12.2.2, page 33 Location of the fan headers Figure 6, page 28

1.11.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.

For information about Refer to

The location of the chassis intrusion header Figure 10, page 42

Intel Desktop Board DG41AN Technical Product Specification

1.11.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.

Item Description

A Thermal diode, located on the processor die B Front chassis fan C Processor fan D Thermal diode, located on the GMCH die E Thermal diode, located on the ICH7 die

Figure 6. Thermal Sensors and Fan Headers



NOTE

The minimum thermal reporting threshold for the GMCH is 66 °C. The GMCH thermal sensor will display 66 °C until the temperature rises above this point.

Product Description

1.12 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Wake from PS/2 device ⎯ Power Management Event signal (PME#) wake-up support ⎯ Wake from serial port

1.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake-up events (see Table 9 on page 31)

• Support for a front panel power and sleep mode switch

Table 7 lists the system states based on how long the power switch is pressed, dependi

ng on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch

If the system is in this state…

Off (ACPI G2/G5 – Soft off)

On (ACPI G0 – working state)

Sleep (ACPI G1 – sleeping state)

…and the power switch is pressed for

Less than four seconds Power-on

Less than four seconds Soft-off/Standby

More than four seconds Fail safe power-off

Less than four seconds Wake-up

More than four seconds Power-off

…the system enters this state

(ACPI G0 – working state)

(ACPI G1 – sleeping state)

(ACPI G2/G5 – Soft off)

(ACPI G0 – working state)

(ACPI G2/G5 – Soft off)

Intel Desktop Board DG41AN Technical Product Specification

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 8 lists the power states supported by the board along with the associated system power targets. See the AC various system and power states.

Table 8. Power States and Targeted System Power

PI specification for a complete description of the

Global States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off. AC power is disconnected from the computer.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

Sleeping States

S0 – working C0 – working D0 – working

S1 – Processor stopped

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved. Cold boot is required.

No power to the system.

Processor States

C1 – stop grant

No power D3 – no power

No power D3 – no power for

Device States

state. D1, D2, D3 –

device specification specific.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System Power

Full power > 30 W

5 W < power < 52.5 W

Power < 5 W

No power to the system. Service can be performed safely.

(Note 1)

(Note 2)

Product Description

1.12.1.2 Wake-up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.

Table 9. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state

LAN S1, S3, S4, S5 PME# signal S1, S3, S4, S5 Power switch S1, S3, S4, S5 PS/2 devices S1, S3, RTC alarm S1, S3, S4, S5 Serial port S1, S3 USB S1, S3

Note: S4 implies operating system support only.

(Note)



NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

Intel Desktop Board DG41AN Technical Product Specification

1.12.2 Hardware Support

CAUTION

Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

The board provides several power management hardware features, including:

• Power connector

• Fan headers

• LAN wake capabilities

• Instantly Available PC technology

• Wake from USB

• Wake from PS/2 device

• PME# signal wake-up support

• Wake from serial port

LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.



NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the main power connector Figure 10, page 42 The signal names of the main power connector Table 21, page 46

Product Description

1.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:

• The fans are on when the board is in the S0 state.

• The fans are off when the board is off or in the S3, S4, or S5 state.

• The processor fan header is wired to a fan tachometer input. The front fan header

has independent tachometer input to the hardware monitoring and fan control device. All fan headers support closed-loop fan control that can adjust the fan speed according to thermal conditions.

• All fan headers have a +12 V DC connection.

For information about Refer to

The locations of the fan headers and thermal sensors Figure 6, page 28 The signal names of the processor fan header Table 16, page 44 The signal names of the chassis fan header

Table 15, page 44

1.12.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. The board supports LAN wake capabilities with ACPI in the following ways:

• The Wake# signal for PCI Express compliant LAN designs

• The onboard LAN subsystem

Intel Desktop Board DG41AN Technical Product Specification

1.12.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 31 lists the devices and events that can wake the computer from the S3 state.

The board supports the PC boards that also support this specification can participate in power management and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and PCI 2.3 compliant add-in cards and drivers.

I Bus Power Management Interface Specification. Add-in

1.12.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S1 or S3 state.



NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.12.2.6 Wake from PS/2 Device

PS/2 device activity wakes the computer from an ACPI S1 or S3 state.

1.12.2.7 PME# Signal Wake-up Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).

1.12.2.8 Wake from Serial Port

Serial Port activity wakes the computer from an ACPI S1 or S3 state.

Product Description

1.12.2.9 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED (green) shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the standby power indicator LED.

CAUTION

If AC power has been switched off and the standby power indicator LED is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.

Figure 7. Location of the Standby Power Indicator LED

Intel Desktop Board DG41AN Technical Product Specification

2 Technical Reference

2.1 Memory Map

2.1.1 Addressable Memory

The board utilizes 4 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 4 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash (8 Mbits)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• Front side bus interrupts (17 MB)

• GMCH base address registers, internal graphics ranges

• Memory-mapped I/O that is dynamically allocated for Conventional PCI add-in

cards

• Base graphics memory support (1 MB or 8 MB)



NOTE

System resources and hardware (such as PCI) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.

Intel Desktop Board DG41AN Technical Product Specification

The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the syst

em memory map. All installed

system memory can be used when there is no overlap of system addresses.

Figure 8. Detailed System Memory Address Map

Table 10 lists the system memory map.

Table 10. System Memory Map

Technical Reference

Address Range (decimal)

1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS

640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory

Address Range (hex)

Size

Description

memory (open to the PCI bus). Dependent on video adapter used.

memory manager software)

Intel Desktop Board DG41AN Technical Product Specification

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: Back panel and front panel USB and PS/2.

The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors/headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.



NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups:

• Back panel I/O connectors (see page 41)

• Component-side connectors and headers (see page 42)

2.2.1 Back Panel Connectors

Figure 9 shows the locations of the back panel connectors.

Item Description

A PS/2 keyboard/mouse port B USB ports (2) C VGA port D Parallel port E DVI-D port F LAN G USB ports (2) H Line in I Mic in J Line out

Technical Reference

Figure 9. Back Panel Connectors

Intel Desktop Board DG41AN Technical Product Specification

2.2.2 Component-side Connectors and Headers

Figure 10 shows the locations of the component-side connectors and headers.

Figure 10. Component-side Connectors and Headers

Technical Reference

Table 11 lists the component-side connectors and headers identified in Figure 10.

Table 11. Component-side Connectors and Headers Shown in Figure 10

Item/callout from Figure 1 Descri

A Processor core power connector (2 x 2) B Front panel USB header C Front panel USB header D Alternate front panel power LED header

E Front chassis fan header

F Processor fan header G Front panel header H Main power connector (2 x 12)

I Serial ATA connectors (3) J Conventional PCI bus add-in card connector

K Front panel audio header

L Chassis intrusion header M Serial port header

ption

Intel Desktop Board DG41AN Technical Product Specification

2.2.2.1 Signal Tables for the Connectors and Headers

Table 12. Serial ATA Connectors

Pin Signal Name

1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground

Table 13. Chassis Intrusion Header

Pin Signal Name

1 Intruder 2 Ground

Table 14. Serial Port Header

Pin Signal Name Pin Signal Name

1 DCD 2 RXD# 3 TXD# 4 DTR 5 Ground 6 DSR 7 RTS 8 CTS 9 RI 10 Key (no pin)

Table 15. Front Chassis Fan Header

Pin Signal Name

1 Ground 2 +12 V (control) 3 Tach

Table 16. Processor Fan Header

Pin Signal Name

1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL

Table 17. Front Panel Audio Header for Intel® HD Audio

Pin Signal Name Pin Signal Name

1 [Port 1] Left channel 2 Ground 3 [Port 1] Right channel 4 PRESENCE# (Dongle present) 5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN 7 SENSE_SEND (Jack detection) 8 Key (no pin) 9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN

Table 18. Front Panel Audio Header for AC ’97 Audio

Pin Signal Name Pin Signal Name

1 MIC 2 AUD_GND 3 MIC_BIAS 4 AUD_GND 5 FP_OUT_R 6 FP_RETURN_R 7 AUD_5V 8 KEY (no pin) 9 FP_OUT_L 10 FP_RETURN_L

Technical Reference

2.2.2.2 Add-in Card Connectors

The board has one Conventional PCI bus add-in card connector. Note the following considerations for the Conventional PCI bus connector:

• The Conventional PCI bus connector is bus master capable.

• SMBus signals are routed to the Conventional PCI bus connector. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on the board. The specific SMBus signals are as follows:

⎯ The SMBus clock line is connected to pin A40. ⎯ The SMBus data line is connected to pin A41.

2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header.

Table 19. Auxiliary Front Panel Power/Sleep LED Header

Pin Signal Name In/Out Description

1 HDR_BLNK_GRN Out Front panel green LED 2 Not connected 3 HDR_BLNK_YEL Out Front panel yellow LED

Intel Desktop Board DG41AN Technical Product Specification

2.2.2.4 Power Supply Connectors

The board has the following power supply connectors:

• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10

connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the leftmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected.

• Processor core power – a 2 x 2 connector. This connector provides power

directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.

Table 20. Processor Core Power Connector

Pin Signal Name Pin Signal Name

1 Ground 2 Ground 3 +12 V 4 +12 V

Table 21. Main Power Connector

Pin Signal Name Pin Signal Name

1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 12

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

+12 V 2 x 12 connector detect

(Note)

23 24

+5 V Ground

(Note)

For information about Refer to

Power supply considerations Section 2.5.1, page 53

Technical Reference

2.2.2.5 Front Panel Header

This section describes the functions of the front panel header. Table 22 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header.

Table 22. Front Panel Header

Pin Signal

Hard Drive Activity LED Power LED

1 HD_PWR Out Hard disk LED pull-up

3 HDA# Out Hard disk active LED 4 HDR_BLNK_

5 Ground Ground 6 FPBUT_IN In Power switch 7 FP_RESET# In Reset switch 8 Ground Ground

9 +5 V Power 10 N/C Not connected

In/ Out Description

to +5 V

Reset Switch On/Off Switch

Power Not Connected

Pin Signal

2 HDR_BLNK_

GRN

YEL

In/ Out Description

Out Front panel green

Out Front panel yellow

LED

Figure 11. Connection Diagram for Front Panel Header

2.2.2.5.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a Serial ATA hard drive connected to an onboard Serial ATA connector.

Intel Desktop Board DG41AN Technical Product Specification

2.2.2.5.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.

2.2.2.5.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 23 shows the possible states for a one-color LED. Table 24 shows the possible states for a two-color LED.

Table 23. States for a One-Color Power LED

LED State Description

Off Power off/sleeping Steady Green Running

Table 24. States for a Two-Color Power LED

LED State Description

Off Power off Steady Green Running Steady Yellow Sleeping

 NOTE

The colors listed in Table 23 and Table 24 are suggested colors only. Actual LED colors are chassis-specific.

2.2.2.5.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.

2.2.2.6 Auxiliary Front Panel Power LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header.

Table 25. Auxiliary Front Panel Power LED Header

Pin Signal Name In/Out Description

1 HDR_BLNK_GRN Out Front panel green LED 2 Not connected 3 HDR_BLNK_YEL Out Front panel yellow LED

Technical Reference

2.2.2.7 Front Panel USB Headers

Figure 12 is a connection diagram for the front panel USB headers.

INTEGRATOR’S NOTES

• The +5 V DC power on the front panel USB headers is fused.

• Use only a front panel USB connector that conforms to the USB 2.0 specification

for high-speed USB devices.

Figure 12. Connection Diagram for Front Panel USB Headers

Intel Desktop Board DG41AN Technical Product Specification

2.3 Jumper Block

CAUTION

Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 13 shows the location of the jumper block. The jumper determines the BIOS Setup program’s mode. Table 26 lists the jumper settings for the three modes: normal computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.

, configure, and recovery. When the jumper is set to configure mode and the

Figure 13. Location of the Jumper Block

Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration

Normal 1-2

Configure 2-3

Recovery None

The BIOS uses current configuration information and passwords for booting.

After the POST runs, Setup runs automatically. The maintenance menu is displayed.

The BIOS attempts to recover the BIOS configuration. See Section 3.7 for more information on BIOS recovery.

Technical Reference

Intel Desktop Board DG41AN Technical Product Specification

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into a Mini-ITX form-factor chassis. Figure 14 illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.70 inches by 6.70 inches [170.18 millimeters by

170.18 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the Mini-ITX specification. The mounting holes also comply with the standard ATX form factor specification, allowing the board to be mounted in a standard ATX or Micro-ATX chassis.

Figure 14. Board Dimensions

Technical Reference

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the Mini-ITX form

factor specification.

• The potential relation between 3.3 VDC and +5 VDC power rails

• The current capability of the +5 VSB line

• All timing parameters

• All voltage tolerances

For example, for a system consisting of a supported 65 W processor (see Section 1.3 on page 14 for a list of supported processors), 1 GB DDR3 RAM, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is Plus 80 250 W. Table 27 lists the recommended power supply current val

ues.

Table 27. Recommended Power Supply Current Values

5 V 12 V1 12 V2 -12 V 5 VSB

Output Voltage

Current

3.3 V

12 A 10 A 10 A 0.3 A 2.5 A

14 A

Intel Desktop Board DG41AN Technical Product Specification

2.5.2 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.

Table 28 lists the current capability of the fan headers.

Table 28. Fan Header Current Capability

Fan Header Maximum Available Current

Processor fan 2.0 A Front chassis fan 1.5 A

2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for add-in boards.

2.6 Thermal Considerations

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website:

http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 15) can reach a temperature of up to 95 an open chassis.

C in

Technical Reference

Figure 15 shows the locations of the localized high temperature zones.

Item Description

A Processor voltage regulator area B Processor C Intel 82G41 GMCH D Intel 82801GB (ICH7)

Figure 15. Localized High Temperature Zones

Intel Desktop Board DG41AN Technical Product Specification

Table 29 provides maximum case temperatures for the board components that are

sitive to thermal changes. The operating temperature, current load, or operating

sen frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 29. Thermal Considerations for Components

Component Maximum Case Temperature

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel 82G41 GMCH 102 oC (under bias) Intel 82801GB (ICH7) 108 oC (under bias)

For information about Refer to

Processor datasheets and specification updates Section 1.2, page 14

2.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements.

The MTBF data is calculated from predicted data at 55 ºC. The Intel Desktop Board DG41AN MTBF is 355,455 hours.

2.8 Environmental

Table 30 lists the environmental specifications for the board.

Table 30. Intel Desktop Board DG41AN Environmental Specifications

Parameter Specification

Temperature

Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/s² Packaged Half sine 2 millisecond Product weight (pounds) Free fall (inches) Velocity change (inches/s²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

-20 °C to +70 °C 0 °C to +55 °C

Technical Reference

Intel Desktop Board DG41AN Technical Product Specification

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as ANG4110H.86A

When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.

The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.

Maintenance Main Advanced Security Power Boot Exit



NOTE

The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 50 shows how to put the board in configure mode.

Intel Desktop Board DG41AN Technical Product Specification

Table 31 lists the BIOS Setup program menu features.

Table 31. BIOS Setup Program Menu Bar

Maintenance Main Advanced Security Power Boot Exit

Clears passwords and displays processor information

Displays processor and memory configuration

Configures advanced features available through the chipset

Sets passwords and security features

Configures power management features and power supply controls

Table 32 lists the function keys available for menu screens.

Table 32. BIOS Setup Program Function Keys

Selects boot options

Saves or discards changes to Setup program options

BIOS Setup Program Function Key

<←> or <→> <↑> or <↓> <Tab> Selects a field (Not implemented) <Enter> Executes command or selects the submenu <F9> Load the default configuration values for the current menu <F10> Save the current values and exits the BIOS Setup program <Esc> Exits the menu

Description

Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down)

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit (1024 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI Autoconfiguration

The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.

Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to

enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB

keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB

devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

7. Additional USB legacy feature options can be access by using Intel

Toolkit.

Integrator

Intel Desktop Board DG41AN Technical Product Specification

To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions.

3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.

Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.

F7 switch allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.

Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.



NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.

For information about Refer to

BIOS update utilities http://support.intel.com/support/motherboards/desktop/s

b/CS-022312.htm.

3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English.

3.6.2 Custom Splash Screen

Overview of BIOS Features

During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator Toolkit or Intel Integrator Assistant that are available from Intel can be used to create a custom splash screen.



NOTE

If you add a custom splash screen, it will share space with the Intel branded logo.

For information about

Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/ Additional Intel® software tools http://developer.intel.com/products/motherboard/DG41AN/tools.htm

Refer to

and

http://developer.intel.com/design/mo

therbd/software.htm

3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 33 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 33. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?

Optical drive connected to the Serial ATA interface Yes USB removable drive (a USB flash drive, for example) Yes USB diskette drive (with a 1.44 MB diskette) No USB hard disk drive No

For information about Refer to

BIOS recovery http://support.intel.com/support/motherboards/desktop/

sb/CS-023360.htm

Intel Desktop Board DG41AN Technical Product Specification

3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority Submenu). Table 34 lists the boot device menu options.

Table 34. Boot Device Menu Options

Boot Device Menu Function Keys Description

<↑> or <↓> <Enter> Exits the menu, saves changes, and boots from the selected

<Esc> Exits the menu without saving changes

Selects a default boot device

device

Overview of BIOS Features

3.9 Adjusting Boot Speed

These factors affect system boot speed:

• Selecting and configuring peripherals properly

• Optimized BIOS boot parameters

3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:

• Choose a hard drive with parameters, such as “power-up to data ready” in less

than eight seconds, that minimize hard drive startup delays.

• Select an optical drive with a fast initialization rate. This rate can influence POST

execution time.

• Eliminate unnecessary add-in adapter features, such as logo displays, screen

repaints, or mode changes in POST. These features may add time to the boot process.

• Try different monitors. Some monitors initialize and communicate with the BIOS

more quickly, which enables the system to boot more quickly.

3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the

POST does not first seek a diskette drive, which saves about one second from the POST execution time.

• In the Peripheral Configuration submenu, disable the LAN device if it will not be

used. This can reduce up to four seconds of option ROM boot time.



NOTE

It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).

Intel Desktop Board DG41AN Technical Product Specification

3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the

Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options in the

BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password

prompt of the BIOS Setup program allows the user restricted access to Setup.

• If both the supervisor and user passwords are set, users can enter either the

supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password

prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user

passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to

16 characters in length.

Table 35 shows the effects of setting the supervisor password and user password. T

his table is for reference only and is not displayed on the screen.

Table 35. Supervisor and User Password Functions

Password Set

Neither Can change all

Supervisor only

User only N/A Can change all

Supervisor and user set

Note: If no password is set, any user can change all Setup options.

Supervisor Mode

options Can change all

options

Can change all options

(Note)

User Mode

Can change all options

Can change a limited number of options

options Can change a

limited number of options

(Note)

Setup Options

None None None

Supervisor Password Supervisor None

Enter Password Clear User Password

Supervisor Password Enter Password

Password to Enter Setup

User User

Supervisor or user

Password During Boot

Supervisor or user

4 Error Messages and Beep Codes

4.1 Speaker

The board-mounted speaker provides audible error code (beep code) information during POST.

For information about Refer to

The location of the onboard speaker Figure 1, page 11

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 36).

Table 36. BIOS Beep Codes

Type Pattern Frequency

Processor initialization complete

POST complete One 0.5 second beep when POST completes. 3270 Hz BIOS update in progress None Video error On-off (0.5 seconds each) two times, then

Memory error On-off (0.5 seconds each) three times, then

Thermal trip warning On-off (0.5 seconds each) four times, then

One 0.5 second beep when the CPU initialization process completes.

3.0 second pause (off), entire pattern repeats (beeps and pause) until the system is powered off.

3.0 second pause (off), entire pattern repeats (beeps and pause) until the sixteenth beep, then ends.

3270 Hz

3270 Hz When no VGA option ROM is found.

1280 Hz

Intel Desktop Board DG41AN Technical Product Specification

4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 37).

Table 37. Front-panel Power LED Blink Codes

Type Pattern Note

Processor initialization complete

POST complete On when the system powers up, then off for

BIOS update in progress Off when the update begins, then on for

Video error On-off (0.5 seconds each) two times, then

Memory error On-off (0.5 seconds each) three times, then

Thermal trip warning On-off (0.5 seconds each) four times, then

On when the system powers up, then off for

0.5 seconds.

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.

3.0 second pause (off), entire pattern repeats (blink and pause) until the system is powered off.

3.0 second pause (off), entire pattern repeats (blinks and pause) until the system is powered off.

3.0 second pause (off), entire pattern repeats (blinks and pause) until the sixteenth blink, then ends.

When no VGA option ROM is found.

4.4 BIOS Error Messages

Whenever a recoverable error occurs during POST, the BIOS displays an error message describing the problem. Table 38 lists the error messages and provides a brief description of each.

Table 38. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.

Memory Size Decreased Memory size has decreased since the last boot. If no memory

was removed, then memory may be bad.

No Boot Device Available System did not find a device to boot.

Error Messages and Beep Codes

4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.



NOTE

The POST card must be installed in PCI bus connector 1.

The following tables provide information about the POST codes generated by the BIOS.

• Table 39 lists the Port 80h POST code ranges

• Table 40 lists the Port 80h POST codes themselves

• Table 41 lists the Port 80h POST sequence



NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 39. Port 80h POST Code Ranges

Range Category/Subsystem

00 – 0F Debug codes: Can be used by any PEIM/driver for debug. 10 – 1F Host Processors: 1F is an unrecoverable processor error. 20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected. 30 – 3F Recovery: 3F indicated recovery failure. 40 – 4F Reserved for future use. 50 – 5F I/O Buses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI. 60 – 6F Reserved for future use (for new busses). 70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error. 80 – 8F Reserved for future use (new output console codes). 90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error. A0 – AF Reserved for future use (new input console codes). B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error. C0 – CF Reserved for future use. D0 – DF Boot device selection. E0 – FF E0 – EE: Miscellaneous codes. See Table 40.

EF: boot/S3 resume failure. F0 – FF: FF processor exception.

Intel Desktop Board DG41AN Technical Product Specification

Table 40. Port 80h POST Codes

POST Code Description of POST Operation

Host Processor 10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor Cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization Chipset 21 Initializing a chipset component Memory 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 24 Programming timing parameters in the memory controller and the DIMMs 25 Configuring memory 26 Optimizing memory settings 27 Initializing memory, such as ECC init 28 Testing memory PCI Bus 50 Enumerating PCI busses 51 Allocating resources to PCI bus 52 Hot Plug PCI controller initialization 53 – 57 Reserved for PCI Bus USB 58 Resetting USB bus 59 Reserved for USB ATA/ATAPI/SATA 5A Resetting PATA/SATA bus and all devices 5B Reserved for ATA SMBus 5C Resetting SMBus 5D Reserved for SMBus Local Console 70 Resetting the VGA controller 71 Disabling the VGA controller 72 Enabling the VGA controller Remote Console 78 Resetting the console controller 79 Disabling the console controller 7A Enabling the console controller

continued

Error Messages and Beep Codes

Table 40. Port 80h POST Codes (continued)

POST Code Description of POST Operation

Keyboard/Mouse (PS/2 or USB) 90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self Test (PS/2 only) Mouse (USB) 98 Resetting mouse 99 Disabling mouse 9A Detecting presence of mouse 9B Enabling mouse Fixed Media B0 Resetting fixed media B1 Disabling fixed media B2 Detecting presence of a fixed media (IDE hard drive detection etc.) B3 Enabling/configuring a fixed media Removable Media B8 Resetting removable media B9 Disabling removable media BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.) BC Enabling/configuring a removable media BDS Dy Trying boot selection y (y=0 to 15) PEI Core E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN

EFI_SW_PEI_PC_HANDOFF_TO_NEXT) E2 Permanent memory found E1, E3 Reserved for PEI/PEIMs DXE Core E4 Entered DXE phase E5 Started dispatching drivers E6 Started connecting drivers

continued

Intel Desktop Board DG41AN Technical Product Specification

Table 40. Port 80h POST Codes (continued)

POST Code Description of POST Operation

DXE Drivers E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Option ROMs Runtime Phase/EFI OS Boot F4 Entering Sleep state F5 Exiting Sleep state F8 EFI boot service ExitBootServices ( ) has been called F9 EFI runtime service SetVirtualAddressMap ( ) has been called FA EFI runtime service ResetSystem ( ) has been called PEIMs/Recovery 30 Crisis Recovery has initiated per User request 31 Crisis Recovery has initiated by software (corrupt flash) 34 Loading recovery capsule 35 Handing off control to the recovery capsule 3F Unable to recover

Table 41. Typical Port 80h POST Sequence

POST Code Description

21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting application processor initialization 13 SMM initialization 50 Enumerating PCI busses 51 Allocating resourced to PCI bus 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling Video BIOS 58 Resetting USB bus 5A Resetting PATA/SATA bus and all devices 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PATA/SATA bus and all devices 28 Testing memory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for user input 01 INT 19 00 Ready to boot

Error Messages and Beep Codes

Intel Desktop Board DG41AN Technical Product Specification

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop Board DG41AN:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification markings

5.1.1 Safety Standards

The Intel Desktop Board DG41AN complies with the safety standards stated in Table 42 when correctly installed in a compatible host system.

Table 42. Safety Standards

Standard Title

CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (USA and Canada)

EN 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (European Union)

IEC 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (International)

Intel Desktop Board DG41AN Technical Product Specification

5.1.2 European Union Declaration of Conformity

Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DG41AN is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 2004/108/EC, 2006/95/EC και 2002/95/EC.

Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai Irányelv előírásainak.

Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 2004/108/EC, 2006/95/EC, & 2002/95/EC.

Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC.

Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem.

Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas.

Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC.

Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC.

Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc.

中文

作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用处理。

请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der

http://www.intel.com/intel/other/ehs/product_ecology

for the

Intel Desktop Board DG41AN Technical Product Specification

Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha

implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology

para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis

en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc.

日本語

pour en

インテルでは、環境保護活動の一環として、使い終えたインテルブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクルプログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in

tel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology

untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.

Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology

(em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

Regulatory Compliance and Battery Disposal Information

Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт

http://www.intel.com/intel/other/ehs/product_ecology

за информацией об этой

программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen

http://www.intel.com/intel/other/ehs/product_ecology

Web sayfasına gidin.

5.1.4 EMC Regulations

The Intel Desktop Board DG41AN complies with the EMC regulations stated in Table 43 when correctly installed in a compatible host system.

Table 43. EMC Regulations

Regulation Title

FCC 47 CFR Part 15, Subpart B

ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada) EN55022 Limits and methods of measurement of Radio Interference Characteristics

EN55024 Information Technology Equipment – Immunity Characteristics Limits and

EN55022 Australian Communications Authority, Standard for Electromagnetic

CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of

CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and

VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.

KN-22, KN-24 Korean Communications Commission – Framework Act on

CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA)

of Information Technology Equipment. (European Union)

methods of measurement. (European Union)

Compatibility. (Australia and New Zealand)

Information Technology Equipment. (International)

Methods of Measurement. (International)

(Japan)

Telecommunications and Radio Waves Act (South Korea)

Intel Desktop Board DG41AN Technical Product Specification

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit other than the one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel

Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Regulatory Compliance and Battery Disposal Information

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas..

Intel Desktop Board DG41AN Technical Product Specification

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.

Intel Desktop Board DG41AN meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply:

• Energy Star v5.0, category A

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2009 (ErP)

For information about Refer to

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/ Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/

pg02100300.asp

European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s

ustainable-business/sustainable-productpolicy/ecodesign/index_en.htm

Regulatory Compliance and Battery Disposal Information

5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DG41AN has the regulatory compliance marks shown in Table 44.

Table 44. Regulatory Compliance Marks

Description Mark

UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive, Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

KCC (Korean Communications Commission) EMC certification mark. Includes adjacent KCC certification number: CPU-DG41AN (B).

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer’s recognition mark. Consists of a unique UL recognized manufacturer’s logo, along with a flammability rating (solder side).

China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years.

V-0

Intel Desktop Board DG41AN Technical Product Specification

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRÉCAUTION

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

OBS!

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

VARO

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Compliance and Battery Disposal Information

PRECAUCIÓN

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Προσοχή

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel Desktop Board DG41AN Technical Product Specification

AWAS

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

OSTRZEŻENIE

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

PRECAUŢIE

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ

При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

UYARI

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Compliance and Battery Disposal Information

Intel Desktop Board DG41AN Technical Product Specification

Intel BOXDG41AN, DG41AN Technical Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual