Intel BOXDC53427HYE User Manual 2
Intel® NUC
Board D53427RKE
Technical Product Specification
May 2013
Order Number: G97389-001
The Intel NUC Board D53427RKE may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel NUC Board D53427RKE Specification Update.
Revision History
Revision Revision History Date
001 First release of the Intel® NUC Board D53427RKE Technical Pro d uc t
Specification
Disclaimer
This product spec ification applies to only the standard In tel® NUC Board with BIOS identifier
RKPPT10H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED I N C ONNEC TION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPER TY R IGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATI NG TO FI TNESS FOR A PARTIC U LA R PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER IN TELLECTU A L PR O PERTY RIGHT. UNLESS
OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED
FOR ANY APPLICATION IN WHICH THE FAILURE O F THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJUR Y OR DEATH MAY OCCUR.
®
All Intel
computers (PC) fo r installation in homes, offices, schools, co mputer rooms, and si mila r locations. The
suitability of this pr o duct for other PC or embedded no n-PC ap plications or other e nv ironments, such as
medical, industrial, alarm systems, test equipment, e tc . ma y not be supported w ithout further evaluation b y
Intel.
Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other
intellectual proper ty rights that relate to the p resented subject matte r. The furnishing of d ocuments and
other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise,
to any such patents, trad e marks, copyrig hts , o r other intellectual property rights.
Intel may make change s to specifications and product descr ip ti o ns at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoever for
conflicts or inco mpatibilities arising from future changes to the m .
Intel NUC Boards may contain design def e c ts o r errors kno w n a s errata, which may cause the product to
deviate from p ub lis he d specifications. C ur rent characterized errata are available o n request.
Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our
product order.
Intel and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries .
* Other names and b rands may be claimed a s the property of others.
Copyright 2013, Intel Corpor ation. All rights reser v e d.
NUC Boards are e v al uate d as Information Techno l o gy Equipment (I.T.E.) fo r use in personal
May 2013
Board Identification Information
Basic Intel® NUC Board D53427RKE Identification Information
AA Revision BIOS Revision Notes
G87790-400 RKPPT10H.86A.0017 1,2
Notes:
1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.
®
2. The Intel
of the following c o m p onents:
Device Stepping S-Spec Numbers
Intel Core i5-3427U L1 SR0N7
Intel BD82QS77 C1 5A002U
QS77 PCH and Intel® Core™ i5-3427U processor used on this AA revision consists
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See www.intel.com/nextunitofcomputing
for the latest documentation.
iii
Intel NUC D53427RKE Technical Product Specification
iv
Preface
3
The features supported by the BIOS Setup program
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board D53427RKE.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel NUC Board
D53427RKE and its components to the vendors, system integrators, and o ther
engineers and technician s who n eed this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardwar e used on Intel NUC Board D53427RKE
2 A map of the resou r ces of the Intel NUC Board
4 A description of the BIOS error messa ges , beep c odes , and POST codes
5 Regulatory compliance and battery disposal information
®
NUC
Typographical Conventions
This section cont ains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications o f this type.
Notes, Cautions, and Warnings
NOTE
Notes call attentio n to important information.
CAUTION
Cautions are included to help you avoid damaging hard w are or losing data.
v
Intel NUC D53427RKE Technical Product Specification
Other Common Notation
# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kb Kilob it (1024 bits)
kb/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mb Megabit (1,048 ,576 bits)
Mb/s Megabits per second
TDP Thermal Design Powe r
xxh An address or d ata v al ue ending with a lowercase h ind i c ate s a he x a d e c im al value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the p roperty of thei r
respective owners.
vi
Contents
Revision History
Disclaimer ................................................................................................ ii
Board Identification Information .................................................................. iii
Errata ...................................................................................................... iii
Preface
Intended Audience ..................................................................................... v
What This Document Contains ..................................................................... v
Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout (Top) ............................................................... 13
1.1.3 Board Layout (Bottom) .......................................................... 15
1.1.4 Block Diagram ...................................................................... 17
1.2 Online Support ................................................................................. 18
1.3 Processor ........................................................................................ 18
1.4 System Memory ............................................................................... 19
1.4.1 Memory Configurations .......................................................... 20
1.5 Intel
1.6 Graphics Subsystem ......................................................................... 23
1.7 Real-Time Clock Subsyst em ............................................................... 26
1.8 LAN Subsystem ................................................................................ 26
1.9 Hardware Management Subsystem ..................................................... 29
1.10 Power Management .......................................................................... 31
1.11 Intel
®
QS77 Express Chipset .............................................................. 22
1.5.1 Direct Media Interface (DMI) .................................................. 22
1.5.2 Display Interfaces ................................................................. 22
1.6.1 Integrated Graphics ............................................................... 23
1.6.2 USB ..................................................................................... 25
1.6.3 AHCI Mode ........................................................................... 25
1.8.1 Intel
®
82579LM Gigabit Ethernet Controller .............................. 27
1.8.2 LAN Subsystem Software ....................................................... 27
1.8.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
Hardware Monitoring ............................................................. 29
1.9.1
1.9.2 Fan Monitoring ...................................................................... 29
1.9.3 Thermal Solution ................................................................... 30
1.10.1 ACPI .................................................................................... 31
1.10.2 Hardware Support ................................................................. 33
®
Security and Manageability Technologies .................................... 36
1.11.1 Intel
1.11.2 Intel
®
vPro™ Technology ........................................................ 36
®
Small Busi n ess Techn ology ............................................ 39
vii
Intel NUC D53427RKE Technical Product Specification
2 Technical Reference
2.1 Memory Resources ........................................................................... 41
2.1.1 Addressable Memory ............................................................. 41
2.2 Connectors and Headers .................................................................... 42
2.2.1 Back Panel Connectors ........................................................... 43
2.2.2 Connectors and Headers (Bottom) ........................................... 44
2.3 BIOS Setup Configuration Jumper ....................................................... 52
2.4 Intel
®
Management Engine BIOS Extension (Intel® MEBX) Reset Header . 53
2.5 Mechanical Considerations ................................................................. 55
2.5.1 Form Factor .......................................................................... 55
2.6 Electrical Considerations .................................................................... 56
2.6.1 Power Supply Considerations .................................................. 56
2.6.2 Fan Header Current Capability ................................................ 57
2.7 Thermal Considerations ..................................................................... 57
2.8 Reliability......................................................................................... 60
2.9 Environmental .................................................................................. 60
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 61
3.2 BIOS Flash Memory Organization ........................................................ 62
3.3 System Management BIOS (SMBIOS) ................................................. 62
3.4 Legacy USB Support ......................................................................... 62
3.5 BIOS Updates .................................................................................. 63
3.5.1 Language Support ................................................................. 63
3.5.2 Custom Splash Screen ........................................................... 64
3.6 BIOS Recovery ................................................................................. 64
3.7 Boot Options .................................................................................... 65
3.7.1 Network Boot ........................................................................ 65
3.7.2 Booting Without Attached Devices ........................................... 65
3.7.3 Changing the Default Boot Device During POST ......................... 65
3.8 Hard Disk Drive Password Security Feature .......................................... 66
BIOS Security Features ..................................................................... 67
3.9
4 Error Messages and Blink Codes
4.1 Front-panel Power LED Blink Codes ..................................................... 69
4.2 BIOS Error Messages ........................................................................ 69
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 71
5.1.1 Safety Standards................................................................... 71
5.1.2 European Union Declaration of Conformity Statement ................ 72
5.1.3 Product Ecology Statements ................................................... 73
5.1.4 EMC Regulations ................................................................... 74
5.1.5 ENERGY STAR* 5.2, e-Standby, and ErP Compliance ................. 76
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 77
5.2 Battery Disposal Information .............................................................. 78
viii
Contents
Figures
1. Major Board Components (Top) .......................................................... 13
2. Major Board Components (Bottom) ..................................................... 15
3. Block Diagram .................................................................................. 17
4. Memory Channel and SO-DIMM Configuration ...................................... 21
5. LAN Connector LED Locations ............................................................. 28
6. Thermal Solution and Fan Header ....................................................... 30
7. Location of the Standby Power LED ..................................................... 35
8. Back Panel Connectors ...................................................................... 43
9. Connectors and Headers (Bottom) ...................................................... 44
10. Connection Diagram for Front Panel Header ......................................... 50
11. Connection Diagram for Front Panel USB 2.0 Dual-Port Header............... 51
12. Location of the BIOS Configuration Setup Jumper ................................. 52
13. Intel MEBX Reset Header ................................................................... 54
14. Board Dimensions ............................................................................. 55
15. Localized High Temperature Zones ..................................................... 58
16. Intel Visual BIOS H om e Scr een .......................................................... 61
Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Components Shown in Figure 2 .......................................................... 16
4. Supported Memory Configurations ...................................................... 19
5. Triple Display Configuration Resolutions .............................................. 24
6. LAN Connector LED States ................................................................. 28
7. Effects of Pressing the Power Switch ................................................... 31
8. Power States and Targeted System Power ........................................... 32
9. Wake-up Devices and Events ............................................................. 33
10. Connectors and Headers Shown in Figure 10 ........................................ 45
11. PCI Express Full-/
12. Dual-Port Front Panel USB 2.0 Header ................................................. 48
13. 19 V Internal Power Supply Connector ................................................ 49
14. Front Panel Header ........................................................................... 49
15. States for a One-Color Power LED ....................................................... 50
16. BIOS Setup Configuration Jumper Settings .......................................... 53
17. Intel MEBX Reset Header Signals ........................................................ 54
18. Fan Header Current Capability ............................................................ 57
19. Thermal Considerations for Components .............................................. 59
20. Tcontrol Values for Components ......................................................... 59
21. Environmental Specifications .............................................................. 60
22. Acceptable Drives/Media Types for BIOS Recovery ................................ 64
23. Boot Device Menu Options ................................................................. 65
24. Master Key and User Hard Drive Password Functions ............................ 66
25. Supervisor and User Password Functions ............................................. 67
26. Front-panel Power LED Blink Codes ..................................................... 69
Half-Mini Card Connector .......................................... 46
ix
Intel NUC D53427RKE Technical Product Specification
27. BIOS Error Messages ........................................................................ 69
28. Safety Standards .............................................................................. 71
29. EMC Regulations ............................................................................... 74
30. Regulatory Compliance Marks ............................................................ 77
x
Intel
®
QS77 Express Chipset consisting of the Intel® QS77 Express Platf orm
Integrated gr aphics support for processo rs with Intel® Graphics Technology:
USB 2.0 ports:
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Graphics
Audio Intel® High Definition Audio via the HDMI v1.4a and Display Port 1.1a interfaces
Peripheral
Interfaces
Expansion
Capabilities
Intel® Visual BIOS
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
• Soldered-down Intel® Core™ i5-3427U processor with up to 17 W TDP
― Integrated gra p hic s
― Integrated memo r y controller
• Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Mod ule
(SO-DIMM) sockets
• Support for DDR3 1600 MHz and DDR3 1333 MHz SO-DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb
memory technology
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Controller Hub (PCH )
•
― One High Definitio n Multime dia Interface* (HDMI*) back panel connec tor
― Two mini DisplayPort* back panel connectors
through the PCH
•
― Two front panel p o rts are implemented through one dual-port inte rnal
header
― Two ports are im p le m e nte d w ith vertical back panel connectors
― One port is reserved for the PCI Express * Half-Mini Card
― One port is reserved for the PCI Expres s F ull -Mini Card
• One front panel USB 3.0 port is impl e me nte d through an external co nne c to r
(blue)
• One PCI Express Half-Mini Card connector
• One PCI Express Full-Mini Card connector
• Intel® Visual BIOS r e s ident in the Serial Peripheral Interface (SPI) Flash
device
• Support for Advanced Conf i g uration and Power I nte r face (ACPI), Plug and
Play, and System Management BIOS (SMBIOS)
continued
11
Intel NUC D53427RKE Technical Product Specification
®
Intel® Active Management Tec hno l o gy (Intel® AMT) 8.0
Table 1. Feature Summary (continued)
LAN Support
Hardware Monitor
Subsystem
Intel® Security and
Manageability
Technologies
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel
Ethernet Controller
Hardware monitoring subsystem, based on a Nuvoton NCT5577D embedded
controller, including:
• Voltage sense to detect out of range p ower supply voltages
• Thermal sense to detect out of range thermal values
• One processor fan header
• Fan sense input used to monitor fan activity
• Simple fan speed control
•
• Intel® Virtualization (Intel® VT)
®
• Intel
• Intel
• Intel
• Intel
Virtualization for D irected I/O (Inte l® VT-d)
®
Trusted Execution Te c hnology (Intel® TXT)
®
Identity Protec ti o n Te c hnology (Intel® IPT)
®
Anti-Theft Technology (Intel® AT)
• Trusted Platform Module (TPM)
®
• Intel
Small Business Techno lo gy (Intel® SBT)
82579LM Gigabit
12
Product Description
1.1.2 Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of Intel NUC
Board D53427RKE.
Figure 1. Major Board Components (Top)
13
Intel NUC D53427RKE Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item from Figure 1 Description
A Standby power LED
B Battery
C Processor fan header
D Onboard power button
E Power LED
F Hard Disk Drive LED
G Thermal solution
14
Product Description
1.1.3 Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of Intel NUC
Board D53427RKE.
Figure 2. Major Board Components (Bottom)
15
Intel NUC D53427RKE Technical Product Specification
Table 3. Components Shown in Figure 2
Item from
Figure 2
A Back panel connectors
B PCI Express Full-Mini Card connector
C PCI Express Half-Mini Card connector
D Front panel dual-port USB 2.0 header
E Fro nt panel USB 3.0 port
F BIOS setup co nf i g uration jumper
G Front panel header
H Intel
I DDR3 SO-DIMM 2 socket
J DDR3 SO-DIMM 1 socket
K Internal DC power connector
Description
®
Management Engine BIOS Extension (Intel
®
MEBX) Reset header
16
1.1.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Product Description
Figure 3. Block Diagram
17
Intel NUC D53427RKE Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel NUC Board D53427RKE http://www.intel.com/products/motherboard/index.htm
NUC Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available config ur a tio ns for Intel NUC
Board D53427RKE
Chipset informatio n
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration info r m ation http://www.intel.com/support/go/buildit
http://ark.intel.com
https://wwwssl.intel.com/content/www/us/en/chipsets/performancechipsets/chipsets.html
025414.htm
1.3 Processor
The board has a soldered-down Intel Core i5-3427 processor with Integrated Graphics
Technology and integrated memory controller.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.
18
Product Description
Capacity
Configuration
Density
Front-side/Back-side
Devices
2048 MB
DS
1 Gbit
128 M x8/128 M x8
16
2048 MB
SS
2 Gbit
256 M x8/empty
8
4096 MB
DS
2 Gbit
256 M x8/256 M x8
16
8192 MB
DS
4 Gbit
512 M x8/512 M x8
16
1.4 System Memory
The board has two 204-pin SO-DIMM sockets and supports the following memory
features:
• 1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts
• Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided SO-DIMMs
• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 1024 MB
• Non-ECC SO-DIMMs
• Serial Presence Detect
• DDR3 1600 MHz and DDR3 1333 MHz SDRAM SO-DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with SO-DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and progr a m the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the SO-DIMMs may not function under
the determined frequency.
Table 4 lists the supported SO-DIMM configurations.
Table 4. Supported Memory Configurations
SO-DIMM
1024 MB SS 1 Gbit 128 M x8/empty 8
4096 MB SS 4 Gbit 512 M x8/empty 8
Note: “DS” refers to double-sided memo ry modules (containing tw o rows of SDRAM) and “SS” refers to
single-sided memor y modules (containing o ne r ow of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
(Note)
SDRAM
SDRAM Organization
/CS-025414.htm
Number of SDRAM
19
Intel NUC D53427RKE Technical Product Specification
1.4.1 Memory Configurations
The processor supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both SO-DIMM channels are equal. Technology and device width can
vary from one channel to the other but the installed memory capacity for each
channel must be equal. If different speed SO-DIMMs are used between channels,
the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is use d when only a
single SO-DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed SO-DIMMs
are used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Config uration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
20
Product Description
Figure 4 illustrates the memory channel and SO-DIMM configuration.
Figure 4. Memory Channel and SO-DIMM Configuration
21
Intel NUC D53427RKE Technical Product Specification
1.5 Intel
Intel QS77 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces.
The Intel QS77 Express Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel QS77 chipset
Resources used by the chipset Chapter 2
®
QS77 Express Chipset
http://www.intel.com/products/desktop/chipsets/index.htm
1.5.1 Direct Media Interface (DMI)
Direct Media Interface (DMI) is the chip-to-chip connection between the processor and
PCH. This high-speed interface integrates advanced priority-based servicing allo wing
for concurrent traffic and true isochronous transfer capabilities.
1.5.2 Display Interfaces
Display is divided between the processor and the PCH. The processor houses the
memory interface, display planes, and pipes while the PCH has transcoder and display
interface or ports. The PCH receives the display data over Intel
Interface (Intel
and sends the data through the display inter face.
®
FDI) and transcodes the data as per the display techno logy protocol
®
Flexible Display
1.5.2.1 Intel
Intel FDI connects the display engine in the processor with the display interfaces on
the PCH. The display data from the frame buffer is processed in the display engine of
the processor and sent to the PCH over the Intel FDI where it is transcoded as per the
display protocol and driven to the d isplay monitor.
®
Flexible Display Interconnect (Intel
®
FDI)
1.5.2.2 High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized
copy or unreceptive between a source (computer, digital set top boxes, etc.) a nd the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDM I).
22
1.6 Graphics Subsystem
The board support s graphics through Intel Graphics Technology.
1.6.1 Integrated Graphics
The board supports integra ted graphics through Intel FDI.
Product Description
1.6.1.1 Intel
The Intel HD graphics controller features the following:
• 3D Features
DirectX* 10.1 and OpenGL* 3.0 compliant
DirectX 11.0 CS4.0 only
Shader Model 4.0
• Video
High-Definition content at up to 1080p res olution
Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video
formats
Intel HD Technology with Advanced Hardware Video Transcoding
Blu-ray* S3D via HDMI 1.4a
Dynamic Video Memory Technology (DVMT) 5.0 support
Support of up to 1.7 GB Video Memory with 4 GB and above syst em memory
configuration
®
High Definition (Intel® HD) Graphics
1.6.1.2 Video Memory Allocation
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically
allocating system memory for use as graphics memory to balance 2D/3D graphics and
system performance. If your computer is configured to use DVMT, graphics memory is
allocated based on system requirements and application demands (up to the
configured maximum amount). When memory is no longer needed by an application,
the dynamically allocated portion of memory is returned to the operating system for
other uses.
1.6.1.3 High Definition Multimedia Interface* (HDMI*)
The HDMI por t supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. Each port is compatible with all ATSC and DVB
HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of
lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The
maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is com pliant
with the HDMI 1.4a specification.
23
Intel NUC D53427RKE Technical Product Specification
1.6.1.3.1 Integrated Audio Provided by the HDMI Interface
The following audio technologies are supported by the HDMI 1.4a interface directly
from the PCH:
• AC-3 - Dolby* Digital
• Dolby Digital Plus
• DTS-HD*
• Dolby TrueHD, DTS-HD Master Audio*, (Lossless Blu-ray Disc* Audio Format
• LPCM, 192 kHz/24-bit, 8 Channel
1.6.1.4 DisplayPort*
DisplayPort is a digital communicat ion inte rface that utilizes differentia l signaling to
achieve a high bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPort is suitable for display
connections between consumer electronics devices such as high definition optical disc
players, set top boxes, and TV displays. The DisplayPort interface supports the 1.1a
specification. There are two mini DisplayPort connectors on the back panel.
DisplayPort’s maximum supported display resolution is 2560 x 1600 @ 60 Hz refresh
rate with a 16:10 aspect ra tio (WQXGA).
For information about Refer to
DisplayPort technology http://www.displayport.org
1.6.1.4.1 Integrated Audio Provided by the DisplayPort Interfaces
The mini DisplayPort interfaces supp ort LPCM 96 KHz/24-bit, 2-channel audio directly
through the PCH.
NOTE
The PCH only supports one audio stream at a time over DisplayPort. Dual audio
signals are not suppo rted.
1.6.1.4.2 Triple Display Configurations
For triple display configurations, at least tw o displays must be connecte d to native
DisplayPort monitors. Use of DisplayPort converter s will not allow triple display
outputs.
Table 5. Triple Display Configuration Resolutions
Active Display Active Display Active Display
DisplayPort
2560 x 1600 at 60 Hz
DisplayPort
1920 x 1200 at 60 Hz
HDMI*
1080P at 60 Hz
24
Product Description
1.6.1.5 High-bandwidth Digital Content Protection (HDCP)
HDCP is the technology for protecting high definition content against unauthorized
copy or intercep tion between a source (computer, digital set top boxes, etc.) and the
sink (panels, monitor, and TVs). The PCH supports HDCP 1.4 for content protection
over wired displays (HDMI and DisplayPort).
1.6.2 USB
The board support s USB 2.0/3.0 ports. The port arrangement is as follows:
• USB 2.0 ports:
Two front panel ports are implemented through one dual-port internal header
Two ports are implemented with vertical back panel connectors
One port is reserved for the PCI Express Half-Mini Card
One port is reserved for the PCI Express Full-Mini Card
• One front panel USB 3.0 port is implemented through an external connector (blue)
All USB 2.0/3.0 ports are high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB c onnectors on the back panel Figure 9, page 43
The location of the front panel USB headers Figure 2, page 15
1.6.3 AHCI Mode
The board support s AHCI storage mode via the Intel QS77 Express Chipset.
NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft Windows 7
and Windows 8 include the necessary AHCI drivers without the need to install separate
AHCI drivers during the operating system installation process, however, it is always
good practice to update the AHCI drivers to the latest available by Intel.
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