The Intel® Desktop Board D946GZIS may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D946GZIS Specification Update.
September 2006
Order Number: D56025-002US
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D946GZIS Technical Product
Specification.
-002 Second release of the Intel® Desktop Board D946GZIS Technical Product
Specification. Removed references to DDR2 800 memory support.
This product specification applies to only the standard Intel® Desktop Board D946GZIS with
BIOS identifier TS94610J.86A.
Changes to this specification will be published in the Intel Desktop Board D946GZIS
Specification Update before being incorporated into a revision of this document.
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®
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July 2006
September 2006
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conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D946GZIS. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
D946GZIS and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the bard
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
®
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
Figure 1 shows the location of the major components.
W
A
C
B
D
E
F
Z
Y
G
X
H
I
V
U
T
S
O
P
Q
R
N
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
M
J
K
L
OM18377
12
Table 2. Board Components Shown in Figure 1
Item/callout
from
Figure 1 Description
A Front panel audio header
B PCI Express x1 connector
C PCI Express x16 connector
D Back panel connectors
E Processor core power connector
F Rear chassis fan header
G LGA775 processor socket
H Intel 82946GZ GMCH
I Processor fan header
J DIMM Channel A socket
K DIMM Channel B socket
L Main Power connector
M Diskette drive connector
N Parallel ATE IDE connector
O Battery
P Front chassis fan header
Q Chassis intrusion header
R Auxiliary front panel power LED header
S Front panel header
T Serial ATA connectors [4]
U Intel 82801GB I/O Controller Hub (ICH7)
V Front panel USB headers [2]
W PCI Conventional bus add-in card connectors [2]
X Speaker
Y BIOS Setup configuration jumper block
Z High Definition Audio Link header
Figure 2 is a block diagram of the major functional areas.
PCI Express x1 Interface
PCI Express x1 Slot 1
Parallel ATA
IDE
Connector
LGA775
Processor
Socket
PCI Express
x16 Interface
PCI Express
x16
Connector
Parallel ATA Interface
System Bus
(1066/800/533
MHz)
Intel 946GZ Express
Chipset
Intel 82946GZ
Graphics and
Memory
Controller Hub
(GMCH)
Controller
Intel 82801GB
I/O Controller Hub
(ICH7)
DMI Interconnect
USB
Legacy
I/O
LPC
Bus
Back Panel/Front
Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Diskette Drive
Connector
Serial
Peripheral
Interface (SPI)
Flash Device
VGA
Port
Channel A
DIMM
Channel B
DIMM
PCI Slot 1
PCI Slot 2
Display Interface
Dual-Channel
Memory Bus
PCI Bus
SMBus
SMBus
Figure 2. Block Diagram
LAN Connect
Interface
High Definition Audio Link
Serial ATA
IDE Interface
Audio
Codec
10/100
LAN PLC
Serial ATA IDE
Connectors (4)
Mic In
Line Out
Line In/Retasking Jack
Line Out/Retasking Jack
Mic In/Retasking Jack
High Definition
LAN
Connector
Audio Link
Header
OM18438
14
Product Description
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel® Desktop Board D946GZIS
under “Desktop Board Products” or
“Desktop Board Support”
Available configurations for the
Desktop Board D946GZIS
Processor data sheets http://www.intel.com/products/index.htm
ICH7 addressing http://developer.intel.com/design/chipsets/datashts
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Supported video modes http://www.intel.com/design/motherbd/is/is_documentation.htm
The board has two DIMM sockets and support the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
•4 GB maximum total system memory. Refer to Section
2.1.1 on page 43 for
information on the total amount of addressable memory.
• Minimum total system memory: 128 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 667 or DDR2 533 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Maximum capacity
with two identical
x8 Double-sided
DIMMs
16
Product Description
NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or
less than the processor system bus frequency. For example, if DDR2 667 memory is
used with a 533 MHz system bus frequency processor, the memory will operate at
533 MHz.
Table 4 lists the resulting operating memory frequencies based on the
combination of DIMMs and processors.
Table 4. Memory Operating Frequencies
DIMM Type Processor system bus frequency Resulting memory frequency
The Intel 82946GZ GMCH supports two types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
1.4.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory
throughput.
Figure 5 shows a single channel configuration using one DIMM. In this example, only
Channel A is populated. Channel B is not populated.
2 GB
Channel A, DIMM 0
Channel B, DIMM 0
OM18380
Figure 5. Single Channel (Asymmetric) Mode Configuration with One DIMM
Figure 6 shows a single channel configuration using two DIMMs. In this example, the
capacity of the DIMM in Channel A does not equal the capacity of the DIMM in
Channel B.
2 GB
Channel A, DIMM 0
Figure 6. Single Channel (Asymmetric) Mode Configuration with Two DIMMs
20
1 GB
Channel B, DIMM 0
OM18381
Product Description
1.5 Intel® 946GZ Express Chipset
The Intel 946GZ Express chipset consists of the following devices:
•Intel 82946GZ Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
•Intel 82801GB I/O Controller Hub (ICH7) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D and display capabilities. The ICH7 is a centralized controller for the
board’s I/O paths.
For information about Refer to
The Intel 946GZ Express chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
1.5.1 Intel 946GZ Graphics Subsystem
The Intel 946GZ Express chipset contains two separate, mutually exclusive graphics
options. Either the GMA 3000 graphics controller (contained within the 82946GZ
GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI
Express x16 add-in card is installed, the GMA 3000 graphics controller is disabled.
1.5.1.1 Intel® GMA 3000 Graphics Controller
The Intel GMA 3000 graphics controller features the following:
• 667 MHz core frequency
• High performance 3-D setup and render engine
• High quality texture engine
⎯ DX9*/DX10 Compliant Hardware Shader Model 3.0
⎯ 32-bit full precision floating point operations
⎯ 128-bit floating point texture formats
⎯ Alpha and luminance maps
⎯ Texture color-keying/chroma-keying
⎯ Cubic environment reflection mapping
⎯ Enhanced texture blending functions
• 3D Graphics rendering enhancements
⎯ 1.3 dual texture GigaPixel/sec fill rate
⎯ 16 and 32 bit color
⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 60 Hz
⎯ Vertex cache
⎯ Anti-aliased lines
⎯ OpenGL* version 1.5 support with vertex buffer and EXT_Shadow extensions
• 2D Graphics enhancements
⎯ 8, 16, and 32 bit color
⎯ Optimized 256-bit BLT engine
⎯ Color space conversion
⎯ Anti-aliased lines
• Video
⎯ Hardware motion compensation and iDCT for MPEG2
⎯ Software DVD at 30 fps full screen
• Display
⎯ Integrated 24-bit 400 MHz RAMDAC
⎯ Up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ DDC2B compliant interface with Advanced Digital Display 2 or 2+ card
(ADD2/ADD2+), support for TV-out/TV-in and DVI digital display connections
⎯ Supports flat panels up to 2048 x 1536 at 75 Hz (when in dual-channel mode)
or digital CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/MEC)
⎯ Two multiplexed SDVO port interfaces with 270 MHz pixel clocks using an
ADD2/MEC card
•Dynamic Video Memory Technology (DVMT) support up to 256 MB
®
•Intel
Zoom Utility
1.5.1.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. Up to 128 MB can be allocated to DVMT on systems that have 256 MB but
less than 512 MB of total installed system memory. Up to 64 MB can be allocated to
DVMT when less than 256 MB of system memory is installed. DVMT returns system
memory back to the operating system when the additional system memory is no
longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
22
Product Description
1.5.1.3 Configuration Modes
A list of supported modes for the Intel GMA 3000 graphics controller is available as a
downloadable document.
For information about Refer to
Supported video modes for the board Section 1.2, page 15
1.5.1.4 Advanced Digital Display (ADD2/ADD2+) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
200 MHz pixel clock to the PCI Express x16 connector. The SDVO ports can be paired
for a dual channel configuration to support up to a 400 MHz pixel clock. When an
ADD2/ADD2+ card is detected, the Intel GMA 3000 graphics controller is enabled and
the PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the
SDVO ports to be accessed by the ADD2/ADD2+ card. An ADD2/ADD2+ card can
either be configured to support simultaneous display with the primary VGA display or
can be configured to support dual independent display as an extended desktop
configuration with different color depths and resolutions. ADD2/ADD2+ cards can be
designed to support the following configurations:
• TV-Out (composite video)
• Transition Minimized Differential Signaling (TMDS) for DVI 1.0
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• VGA output
• HDTV output
• HDMI/UDI support (when used with the HD Audio Link)
1.5.2 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers.
The ICH7 provides the USB controller for all ports. The port arrangement is as
follows:
• Four ports are implemented with stacked back panel connectors
• Four ports are routed to two separate front panel USB headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 13, page 51
The location of the front panel USB headers Figure 14, page 52
The board provides four Serial ATA (SATA) connectors, which support one device per
connector.
1.5.3.1 Serial ATA Support
The ICH7’s Serial ATA controller offers four independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of four Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or
power supplies equipped with low-voltage power connectors.
For more information, see:
For information about Refer to
The location of the Serial ATA connectors Figure 14, page 52
http://www.serialata.org/.
24
Product Description
1.5.4 Parallel IDE Interface
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The
Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
•Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
•ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
•ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up
to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended
Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate
and translation mode to the BIOS.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 14, page 52
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one.
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
Figure 1 on page 12 shows the location of the battery.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
26
Product Description
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
27
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