Intel BOXD910GLDW - Desktop Board D910GLDW, BOXD910GLDWL - Desktop Board D910GLDWL, D910GLDW Specification

Intel® Desktop Board D910GLDW
Technical Product Specification
The Intel® Desktop Board D910GLDW may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D910GLDW Specification Update.
October 2004 Order Number: C88966-002
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D910GLDW Technical Product Specification.
-002 Second release of the Intel® Desktop Board D910GLDW Technical Product Specification.
September 2004
October 2004
This product specification applies to only standard Intel
®
Desktop Board D910GLDW with BIOS
identifier WB91X10J.86A. Changes to this specification will be published in the Intel Desktop Board D910GLDW
Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
®
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from: Intel Corporation
P.O. Box 5937 Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others. Copyright © 2004, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for the Intel It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board D910GLDW and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D910GLDW 2 A map of the resources of the Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes
Desktop Board D910GLDW.
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
#
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D910GLDW Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D910GLDW, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area. GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 PCI Bus Terminology Change........................................................................................9
1.2 Overview......................................................................................................................10
1.2.1 Feature Summary..........................................................................................10
1.2.2 Manufacturing Options ..................................................................................11
1.2.3 Board Layout.................................................................................................12
1.2.4 Block Diagram...............................................................................................14
1.3 Online Support.............................................................................................................15
1.4 Processor.....................................................................................................................15
1.5 System Memory...........................................................................................................15
1.5.1 Memory Configurations .................................................................................17
1.6 Intel® 910GL Chipset...................................................................................................19
1.6.1 Intel 910GL Graphics Controller....................................................................19
1.6.2 USB...............................................................................................................20
1.6.3 IDE Support...................................................................................................20
1.6.4 Real-Time Clock, CMOS SRAM, and Battery................................................22
1.7 PCI Express Connector................................................................................................22
1.8 I/O Controller................................................................................................................23
1.8.1 Serial Port......................................................................................................23
1.8.2 Parallel Port...................................................................................................23
1.8.3 Diskette Drive Controller................................................................................23
1.8.4 Keyboard and Mouse Interface .....................................................................23
1.9 Audio Subsystem.........................................................................................................24
1.9.1 Audio Subsystem Software ...........................................................................24
1.9.2 Audio Connectors..........................................................................................24
1.9.3 Intel® High Definition Audio Subsystem........................................................25
1.10 LAN Subsystem (Optional)...........................................................................................26
1.10.1 Intel® 82562EZ Physical Layer Interface Device...........................................26
1.10.2 Alert Standard Format (ASF) Support...........................................................27
1.10.3 LAN Subsystem Software..............................................................................27
1.11 Hardware Management Subsystem.............................................................................28
1.11.1 Hardware Monitoring and Fan Control ASIC.................................................28
1.11.2 Thermal Monitoring........................................................................................29
1.11.3 Fan Monitoring...............................................................................................30
1.11.4 Fan Speed Control (Intel® Precision Cooling Technology) ...........................30
1.11.5 Chassis Intrusion and Detection....................................................................30
1.12 Power Management.....................................................................................................30
1.12.1 ACPI..............................................................................................................31
1.12.2 Hardware Support .........................................................................................33
2 Technical Reference
2.1 Introduction ..................................................................................................................37
2.2 Memory Map................................................................................................................37
2.3 Fixed I/O Map...............................................................................................................38
2.4 DMA Channels.............................................................................................................39
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Intel Desktop Board D910GLDW Technical Product Specification
2.5 PCI Configuration Space Map......................................................................................39
2.6 Interrupts......................................................................................................................40
2.7 PCI Conventional Interrupt Routing Map .....................................................................41
2.8 Connectors...................................................................................................................42
2.8.1 Back Panel Connectors.................................................................................42
2.8.2 Component-side Connectors.........................................................................44
2.9 Jumper Block ...............................................................................................................52
2.10 Mechanical Considerations..........................................................................................53
2.10.1 Form Factor...................................................................................................53
2.10.2 I/O Shield.......................................................................................................54
2.11 Electrical Considerations..............................................................................................55
2.11.1 DC Loading....................................................................................................55
2.11.2 Add-in Board Considerations.........................................................................55
2.11.3 Fan Connector Current Capability.................................................................55
2.11.4 Power Supply Considerations .......................................................................56
2.12 Thermal Considerations...............................................................................................57
2.13 Reliability......................................................................................................................59
2.14 Environmental ..............................................................................................................60
2.15 Regulatory Compliance................................................................................................61
2.15.1 Safety Regulations ........................................................................................61
2.15.2 EMC Regulations...........................................................................................61
2.15.3 European Union Declaration of Conformity Statement..................................62
2.15.4 Product Ecology Statements.........................................................................63
2.15.5 Product Certification Markings (Board Level)................................................64
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................65
3.2 BIOS Flash Memory Organization ...............................................................................66
3.3 Resource Configuration ...............................................................................................66
3.3.1 PCI Autoconfiguration....................................................................................66
3.3.2 PCI IDE Support............................................................................................66
3.4 System Management BIOS (SMBIOS) ........................................................................67
3.5 Legacy USB Support....................................................................................................67
3.6 BIOS Updates..............................................................................................................68
3.6.1 Language Support.........................................................................................68
3.6.2 Custom Splash Screen..................................................................................68
3.7 Boot Options ................................................................................................................69
3.7.1 CD-ROM Boot ...............................................................................................69
3.7.2 Network Boot.................................................................................................69
3.7.3 Booting Without Attached Devices................................................................69
3.7.4 Changing the Default Boot Device During POST..........................................69
3.8 Fast Booting Systems with Intel® Rapid BIOS Boot ....................................................70
3.8.1 Peripheral Selection and Configuration.........................................................70
3.8.2 Intel Rapid BIOS Boot ...................................................................................70
3.9 BIOS Security Features ...............................................................................................71
vi
4 Error Messages and Beep Codes
4.1 BIOS Error Messages..................................................................................................73
4.2 Port 80h POST Codes .................................................................................................75
4.3 Bus Initialization Checkpoints ......................................................................................79
4.4 Speaker .......................................................................................................................80
4.5
BIOS Beep Codes........................................................................................................80
Figures
1. Board Components......................................................................................................12
2. Block Diagram..............................................................................................................14
3. Memory Channel Configuration ...................................................................................17
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs ..............................18
5. Single Channel (Asymmetric) Mode Configuration with One DIMM.............................18
6. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......25
7. High Definition Audio Subsystem Block Diagram ........................................................25
8. LAN Connector LED Locations....................................................................................26
9. Thermal Monitoring......................................................................................................29
10. Location of the Standby Power Indicator LED .............................................................36
11. Back Panel Connectors................................................................................................42
12. Component-side Connectors.......................................................................................44
13. Connection Diagram for Front Panel Connector..........................................................49
14. Connection Diagram for Front Panel USB Connectors................................................50
15. Connection Diagram for IEEE 1394a Connector .........................................................51
16. Location of the Jumper Block.......................................................................................52
17. Board Dimensions........................................................................................................53
18. I/O Shield Dimensions..................................................................................................54
19. Processor Heatsink Airflow..........................................................................................57
20. Localized High Temperature Zones.............................................................................58
Contents
Tables
1. Feature Summary ........................................................................................................10
2. Manufacturing Options.................................................................................................11
3. Board Components Shown in Figure 1........................................................................13
4. Supported Memory Configurations ..............................................................................16
5. LAN Connector LED States .........................................................................................26
6. Effects of Pressing the Power Switch ..........................................................................31
7. Power States and Targeted System Power .................................................................32
8. Wake-up Devices and Events......................................................................................33
9. System Memory Map ...................................................................................................37
10. I/O Map .......................................................................................................................38
11. DMA Channels.............................................................................................................39
12. PCI Configuration Space Map......................................................................................39
13. Interrupts......................................................................................................................40
14. PCI Interrupt Routing Map ...........................................................................................41
15. Back Panel Connectors Shown in Figure 11................................................................43
16. Component-side Connectors Shown in Figure 12 .......................................................45
17. Front Panel Audio Connector.......................................................................................46
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Intel Desktop Board D910GLDW Technical Product Specification
18. Front Chassis Fan and Rear Chassis Fan Connectors................................................46
19. Processor Fan Connector............................................................................................46
20. Chassis Intrusion Connector........................................................................................46
21. Serial ATA Connectors.................................................................................................46
22. Main Power Connector.................................................................................................47
23. ATX12V Power Connector...........................................................................................47
24. Auxiliary Front Panel Power/Sleep LED Connector.....................................................48
25. Front Panel Connector.................................................................................................48
26. States for a One-Color Power LED..............................................................................49
27. States for a Two-Color Power LED..............................................................................49
28. BIOS Setup Configuration Jumper Settings.................................................................52
29. DC Loading Characteristics .........................................................................................55
30. Fan Connector Current Capability................................................................................55
31. Thermal Considerations for Components ....................................................................59
32. Environmental Specifications.......................................................................................60
33. Safety Regulations.......................................................................................................61
34. EMC Regulations.........................................................................................................61
35. Product Certification Markings.....................................................................................64
36. BIOS Setup Program Menu Bar...................................................................................66
37. BIOS Setup Program Function Keys............................................................................66
38. Boot Device Menu Options ..........................................................................................69
39. Supervisor and User Password Functions...................................................................71
40. BIOS Error Messages..................................................................................................73
41. Uncompressed INIT Code Checkpoints.......................................................................75
42. Boot Block Recovery Code Checkpoints .....................................................................75
43. Runtime Code Uncompressed in F000 Shadow RAM.................................................76
44. Bus Initialization Checkpoints ......................................................................................79
45. Upper Nibble High Byte Functions...............................................................................79
46. Lower Nibble High Byte Functions...............................................................................80
47. Beep Codes .................................................................................................................80
viii
1 Product Description
What This Chapter Contains
1.1 PCI Bus Terminology Change........................................................................................9
1.2 Overview......................................................................................................................10
1.3 Online Support.............................................................................................................15
1.4 Processor.....................................................................................................................15
1.5 System Memory...........................................................................................................15
1.6 Intel® 910GL Chipset...................................................................................................19
1.7 PCI Express Connector................................................................................................22
1.8 I/O Controller................................................................................................................23
1.9 Audio Subsystem.........................................................................................................24
1.10 LAN Subsystem (Optional)...........................................................................................26
1.11 Hardware Management Subsystem.............................................................................28
1.12 Power Management.....................................................................................................30
1.1 PCI Bus Terminology Change
Previous generations of Intel® Desktop Boards used an add-in card connector referred to as PCI. This generation of Intel Desktop Boards adds a new technology for add-in cards: PCI Express*. The 32-bit parallel bus previously referred to as PCI is now called PCI Conventional.
9
Intel Desktop Board D910GLDW Technical Product Specification
1.2 Overview
1.2.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board D910GLDW.
Table 1. Feature Summary
Form Factor
Processor Memory
Chipset
Video Audio I/O Control USB Peripheral
Interfaces
BIOS
Instantly Available PC Technology
microATX Form Factor (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters]) Support for an Intel
®
Celeron
®
processor in an LGA775 socket
Two DDR SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR 400 MHz and DDR 333 MHz DIMMs
Support for up to 2 GB of system memory
®
Intel
910GL Chipset, consisting of:
®
Intel
Intel
82910GL Graphics Memory Controller Hub (GMCH)
®
82801FB I/O Controller Hub (ICH6)
4 Mbit Firmware Hub (FWH)
®
GMA900 onboard graphics subsystem
Intel
®
High Definition Audio subsystem using the Realtek ALC860 audio codec
Intel LPC Bus I/O controller Support for USB 2.0 devices
Eight USB ports
One serial port
One parallel port
Four Serial ATA interfaces
One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
One diskette drive interface
PS/2* keyboard and mouse ports
4 Mbit FWH
®
Intel
Rapid BIOS Boot
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS
Support for PCI Local Bus Specification Revision 2.2
Support for PCI Express Revision 1.0a
Suspend to RAM support
Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
continued
10
Table 1. Feature Summary (continued)
Expansion Capabilities
Hardware Monitor Subsystem
Two PCI Conventional bus add-in card connectors (SMBus routed to PCI Conventional bus connector 2)
One PCI Express x1 bus add-in card connector
Hardware monitoring and fan control ASIC
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Three fan connectors
Three fan sense inputs used to monitor fan activity
Fan speed control
1.2.2 Manufacturing Options
Table 2 describes the manufacturing options on the Desktop Board D910GLDW. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.
Table 2. Manufacturing Options
IEEE-1394a Interface
LAN Support
IEEE-1394a controller and two IEEE-1394a connectors
10/100 Mbits/sec LAN subsystem using the Intel® 82562EZ Platform LAN Connect (PLC) device
Product Description
For information about Refer to
Available configurations for the Desktop Board D910GLDW Section 1.3, page 15
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Intel Desktop Board D910GLDW Technical Product Specification
1.2.3 Board Layout
Figure 1 shows the location of the major components on the Desktop Board D910GLDW.
DD
CC
BB AA
BC
D EA
F
G
H
Z
I J
K
Y
L
UW
R
Figure 1. Board Components
Table 3 lists the components identified in Figure 1.
M
NOPX QVST
OM17306
12
Table 3. Board Components Shown in Figure 1
Item/Callout from Figure 1 Description
A B C D E F G H
I
J K L
M N O
P
Q R
S T
U
V
W
X Y Z
AA BB CC DD
Realtek ALC860 audio codec Front panel audio connector (Yellow) PCI Conventional bus add-in card connectors Rear chassis fan connector Back panel connectors +12V power connector (ATX12V) LGA775 processor socket Hardware monitoring and fan control ASIC Processor fan connector Intel 82910GL GMCH DIMM Channel A socket DIMM Channel B socket I/O controller Power connector Diskette drive connector Parallel ATE IDE connector Battery Chassis intrusion connector BIOS Setup configuration jumper block 4 Mbit Firmware Hub (FWH) Front chassis fan connector Serial ATA connectors Auxiliary front panel power LED connector Front panel connector Front panel USB connectors Intel 82801FB I/O Controller Hub (ICH6) Front panel IEEE-1394a connectors (optional) IEEE-1394a controller (optional) Speaker PCI Express x1 bus add-in card connector
Product Description
13
Intel Desktop Board D910GLDW Technical Product Specification
1.2.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
PCI Express x1 Slot 1
Parallel ATA
IDE Connector
LGA775
Processor Socket
VGA
Port
Channel A
DIMM
Channel B
DIMM
Display Interface
PCI Express
Parallel ATA
IDE Interface
System Bus
(533 MHz)
Intel 82910GL
Graphics and
Memory Controller
Hub (GMCH)
Dual-Channel
Memory Bus
SMBus
x1 Interface
USB
LPC Bus
I/O
Controller
LPC Bus
Intel 82801FB
I/O Controller Hub
(ICH6)
DMI Interconnect
Back Panel/Front Panel
USB Ports
Serial Ports
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Diskette Drive
Connector
4 Mbit
Firmware Hub
(FWH)
Intel 910GL Chipset
Interface
LAN Connect
10/100 LAN PLC (Optional)
LAN
Connector
(Optional)
IEEE-1394a Connectors
(Optional)
PCI Slot 1
PCI Slot 2
= connector or socket
PCI Bus
PCI Bus
SMBus
Hardware Monitoring
and Fan Control AS IC
Figure 2. Block Diagram
Serial ATA
IDE Interface
High Definit ion Audio Link
Mic In/Retasking Jack B
Audio
Codec
Line In/Retasking Jack C
Line Out/Retasking Jack D
Retasking Jack E [Port 1] Retasking Jack F [Port 2]
Serial ATA IDE Connectors (4)
OM17307
14
Product Description
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D910GLDW under “Desktop Board Products” or “Desktop Board Support”
Available configurations for the Desktop Board D910GLDW
Processor data sheets http://www.intel.com/design/litcentr ICH6 addressing http://developer.intel.com/design/chipsets/datashts Custom splash screens http://intel.com/design/motherbd/gen_indx.htm Audio software and utilities http://www.intel.com/design/motherbd LAN software and drivers http://www.intel.com/design/motherbd
http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/dw/dw_available.htm
1.4 Processor
The board is designed to support an Intel Celeron processor in an LGA775 processor socket with a 533 MHz system bus. See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors for the D910GLDW board http://www.intel.com/design/motherbd/dw/dw_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.8.2.1, page 47
1.5 System Memory
The board has two DIMM sockets and supports the following memory features:
2.5 V (only) DDR SDRAM DIMMs with gold-plated contacts
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
2 GB maximum total system memory
Minimum total system memory: 128 MB
Non-ECC DIMMs
Serial Presence Detect
DDR 400 MHz and DDR 333 MHz SDRAM DIMMs
15
Intel Desktop Board D910GLDW Technical Product Specification
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM Capacity
128 MB SS 256 Mbit 16 M x 16/empty 4 256 MB SS 256 Mbit 32 M x 8/empty 8 256 MB SS 512 Mbit 32 M x 16/empty 4 512 MB DS 256 Mbit 32 M x 8/32 M x 8 16 512 MB SS 512 Mbit 64 M x 8/empty 8 512 MB SS 1 Gbit 64 M x 16/empty 4 1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16 1024 MB SS 1 Gbit 128 M x 8/empty 8 2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
Configuration
SDRAM Density
SDRAM Organization Front-side/Back-side
Number of SDRAM Devices
16
Product Description
1.5.1 Memory Configurations
The Intel 82910GL GMCH supports two types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
Channel A, DIMM 0
Channel B, DIMM 0
Figure 3. Memory Channel Configuration
OM17308
17
Intel Desktop Board D910GLDW Technical Product Specification
1.5.1.1 Dual Channel (Interleaved) Mode Configuration
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM sockets of both channels are populated with identical DIMMs.
1 GB
1 GB
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Channel A, DIMM 0
Channel B, DIMM 0
OM17309
1.5.1.2 Single Channel (Asymmetric) Mode Configuration
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 5 shows a single channel configuration using one DIMM. In this example, only the Channel A DIMM socket is populated. Channel B is not populated.
256 MB
Figure 5. Single Channel (Asymmetric) Mode Configuration with One DIMM
Channel A, DIMM 0
Channel B, DIMM 0
OM17310
18
Product Description
1.6 Intel® 910GL Chipset
The Intel 910GL chipset consists of the following devices:
Intel 82910GL Graphics Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect
Intel 82801FB I/O Controller Hub (ICH6) with DMI interconnect
Firmware Hub (FWH)
The GMCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and the DMI interconnect. The ICH6 is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.
For information about Refer to
The Intel 910GL chipset http://developer.intel.com/ Resources used by the chipset Chapter 2
1.6.1 Intel 910GL Graphics Controller
The Intel GMA900 graphics controller features the following:
Integrated graphics controller 32 bpp (Bits Per Pixel) graphics engine 333 MHz core frequency 256-bit 2-D engine 32-bit 3-D engine Motion video acceleration Pixel Shader 2.0 4-pixel pipes DirectX 9.0 Hardware Acceleration Software Vertex Shader
Up to 2048 x 1536 at 75 Hz refresh
High performance 3-D setup and render engine
High quality/performance texture engine
Display Integrated 24-bit 400 MHz RAMDAC DDC2B compliant interface
Video hardware motion compensation for software MPEG2 decode
Dynamic Video Memory Technology (DVMT) support up to 224 MB
Intel
For information about Refer to
DVMT Section 0, page 20 Obtaining graphics software and utilities Section 1.3, page 15
®
Zoom Utility
19
Intel Desktop Board D910GLDW Technical Product Specification
1.6.1.1 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through Direct AGP, and highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 224 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. Up to 128 MB can be allocated to DVMT on systems that have 256 MB but less than 512 MB of total installed system memory. Up to 64 MB can be allocated to DVMT when less than 256 MB of system memory is installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.2 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers.
The ICH6 provides the USB controller for all ports. The port arrangement is as follows:
Four ports are implemented with dual stacked back panel connectors adjacent to the audio connectors
Four ports are routed to two separate front panel USB connectors
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 11, page 42 The location of the front panel USB connectors Figure 12, page 44
1.6.3 IDE Support
The board provides five IDE interface connectors:
One parallel ATA IDE connector that supports two devices
Four serial ATA IDE connectors that support one device per connector
20
Product Description
1.6.3.1 Parallel ATE IDE Interface
The ICH6’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes:
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH6’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The board supports Laser Servo (LS-120) diskette technology through the Parallel ATA IDE interfaces. An LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:
ARMD-FDD (ATAPI removable media device – floppy disk drive)
ARMD-HDD (ATAPI removable media device – hard disk drive)
For information about Refer to
The location of the Parallel ATA IDE connector Figure 12, page 44
1.6.3.2 Serial ATA Interfaces
The ICH6’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems.
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Intel Desktop Board D910GLDW Technical Product Specification
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors Figure 12, page 44
1.6.4 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.
1.7 PCI Express Connector
The board provides one PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to 500 MBytes/sec.
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the underlying PCI Express architecture is compatible with PCI Conventional compliant operating systems. Additional features of the PCI Express interface includes the following:
Support for the PCI Express enhanced configuration mechanism
Automatic discovery, link training, and initialization
Support for Active State Power Management (ASPM)
SMBus 2.0 support
Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
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Product Description
1.8 I/O Controller
The I/O controller provides the following features:
One serial port
One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.44 MB or 2.88 MB diskette drive
Intelligent power management, including a programmable wake-up event interface
PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Serial Port
The board supports one serial port connector, Serial port A, located on the back panel. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 11, page 42
1.8.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 11, page 42
1.8.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface.
For information about Refer to
The location of the diskette drive connector Figure 12, page 44
1.8.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 11, page 42
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Intel Desktop Board D910GLDW Technical Product Specification
1.9 Audio Subsystem
The board supports the Intel High Definition audio subsystem based on the Realtek ALC860 codec. The audio subsystem supports the following features:
Advanced jack sense (front and rear panel) that enables the audio codec to recognize the device that is connected to an audio port. All jacks are capable of retasking according to user’s definition, or can be automatically switched depending on the recognized device type.
Stereo input and output for all jacks.
A signal-to-noise (S/N) ratio of 90 dB.
INTEGRATOR’S NOTE
#
For the front panel jack sensing and automatic retasking feature to function, a front panel daughter card that is designed for Intel High Definition Audio must be used. Otherwise, an AC ’97 style audio front panel connector will be assumed and the Line Out and Mic In functions will be permanent.
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 15
1.9.2 Audio Connectors
The board contains audio connectors on both the back panel and the component side of the board. The front panel audio connector (located on the component-side of the board) is a 2 x 5-pin connector that provides mic in and line out signals for front panel audio connectors.
For information about Refer to
The location of the front panel audio connector. Figure 12, page 44 The signal names of the front panel audio connector Table 17, page 46
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