Intel BLKDG45FC, DG45FC Technical Product Specification

Intel® Desktop Board DG45FC

Technical Product Specification

The Intel® Desktop Board DG45FC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG45FC Specification Update.

une 2008

Order Number: E35964-001US

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board DG45FC Technical Product Specification.

This product specification applies to only the standard Intel® Desktop Board DG45FC with BIOS identifier IDG4510H.86A.

Changes to this specification will be published in the Intel Desktop Board DG45FC Specification Update before being incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

June 2008

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

desktop boards may contain design defects or errors known as errata, which may cause the product

Intel to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:

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Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DG45FC. It describes the standard product and available manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop Board DG45FC and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the board 2 A map of the resources of the board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings



NOTE

Notes call attention to important information.

INTEGRATOR’S NOTES

Integrator’s notes are used to call attention to information that may be useful to system integrators.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

iii

Intel Desktop Board DG45FC Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1,073,741,824 bits) KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1 Product Description .............................................................. 9

1.1 Overview.......................................................................................... 9

1.1.1 Feature Summary .................................................................. 9

1.1.2 Board Layout ....................................................................... 11

1.1.3 Block Diagram ..................................................................... 13

1.2 Legacy Considerations...................................................................... 14

1.3 Online Support................................................................................ 14

1.4 Processor ....................................................................................... 14

1.5 System Memory .............................................................................. 16

1.5.1 Memory Configurations ......................................................... 17

1.6 Intel® G45 Express Chipset .............................................................. 19

1.6.1 Intel G45 Graphics Subsystem ............................................... 19

1.6.2 Intel® Viiv™ Processor Technology.......................................... 21

1.6.3 USB ................................................................................... 21

1.6.4 Serial ATA Interfaces ............................................................ 22

1.7 Real-Time Clock Subsystem .............................................................. 23

1.8 Legacy I/O Controller ....................................................................... 23

1.8.1 Consumer Infrared (CIR)....................................................... 24

1.8.2 Serial Port........................................................................... 24

1.9 Audio Subsystem............................................................................. 25

1.9.1 Audio Subsystem Software .................................................... 26

1.9.2 Audio Connectors and Headers ............................................... 26

1.10 LAN Subsystem............................................................................... 27

1.10.1 Intel® 82567LF Gigabit Ethernet Controller............................... 27

1.10.2 LAN Subsystem Software....................................................... 28

1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28

1.11 Hardware Management Subsystem .................................................... 29

1.11.1 Hardware Monitoring and Fan Control...................................... 29

1.11.2 Fan Monitoring..................................................................... 29

1.11.3 Chassis Intrusion and Detection.............................................. 29

1.11.4 Thermal Monitoring .............................................................. 30

1.12 Power Management ......................................................................... 31

1.12.1 ACPI................................................................................... 31

1.12.2 Hardware Support ................................................................ 34

1.12.3 ENERGY STAR* .................................................................... 38

2 Technical Reference............................................................ 39

2.1 Memory Map................................................................................... 39

2.1.1 Addressable Memory............................................................. 39

2.2 Connectors and Headers................................................................... 42

2.2.1 Back Panel Connectors .......................................................... 43

2.2.2 Component-side Connectors and Headers ................................ 44

2.3 Jumper Block .................................................................................. 53

Intel Desktop Board DG45FC Technical Product Specification

2.4 Mechanical Considerations ................................................................ 55

2.4.1 Form Factor......................................................................... 55

2.5 Electrical Considerations ................................................................... 56

2.5.1 Power Supply Considerations ................................................. 56

2.5.2 Fan Header Current Capability................................................ 57

2.5.3 Add-in Board Considerations .................................................. 58

2.6 Thermal Considerations .................................................................... 58

2.7 Reliability ....................................................................................... 60

2.8 Environmental ................................................................................ 60

3 Overview of BIOS Features ................................................. 61

3.1 Introduction ................................................................................... 61

3.2 BIOS Flash Memory Organization ....................................................... 62

3.3 Resource Configuration .................................................................... 62

3.3.1 PCI* Autoconfiguration.......................................................... 62

3.4 System Management BIOS (SMBIOS)................................................. 63

3.5 Legacy USB Support ........................................................................ 64

3.6 BIOS Updates ................................................................................. 65

3.6.1 Language Support ................................................................ 65

3.6.2 Custom Splash Screen .......................................................... 65

3.7 BIOS Recovery................................................................................ 66

3.8 Boot Options................................................................................... 67

3.8.1 CD-ROM Boot ...................................................................... 67

3.8.2 Network Boot....................................................................... 67

3.8.3 Booting Without Attached Devices........................................... 67

3.8.4 Changing the Default Boot Device During POST ........................ 67

3.9 Adjusting Boot Speed....................................................................... 68

3.9.1 Peripheral Selection and Configuration..................................... 68

3.9.2 BIOS Boot Optimizations ....................................................... 68

3.10 BIOS Security Features .................................................................... 69

4 Error Messages and Beep Codes ......................................... 71

4.1 Speaker ......................................................................................... 71

4.2 BIOS Beep Codes ............................................................................ 71

4.3 BIOS Error Messages ....................................................................... 71

4.4 Port 80h POST Codes ....................................................................... 72

5 Regulatory Compliance and Battery Disposal Information .. 77

5.1 Regulatory Compliance..................................................................... 77

5.1.1 Safety Standards.................................................................. 77

5.1.2 European Union Declaration of Conformity Statement................ 78

5.1.3 Product Ecology Statements................................................... 79

5.1.4 EMC Regulations .................................................................. 83

5.1.5 Product Certification Markings (Board Level)............................. 84

5.2 Battery Disposal Information............................................................. 85

Contents

Figures

Figure 1. Major Board Components............................................................... 11

Figure 2. Block Diagram.............................................................................. 13

Figure 3. Memory Channel and DIMM Configuration ........................................ 18

Figure 4. Back Panel Audio Connector Options................................................ 26

Figure 5. LAN Connector LED Locations ......................................................... 28

Figure 6. Thermal Sensors and Fan Headers .................................................. 30

Figure 7. Location of the Standby Power Indicator LED .................................... 38

Figure 8. Detailed System Memory Address Map............................................. 40

Figure 9. Back Panel Connectors .................................................................. 43

Figure 10. Component-side Connectors and Headers....................................... 44

Figure 11. Connection Diagram for Front Panel Header.................................... 50

Figure 12. Connection Diagram for Front Panel USB Headers............................ 52

Figure 13. Location of the Jumper Block ........................................................ 53

Figure 14. Board Dimensions....................................................................... 55

Figure 15. Localized High Temperature Zones ................................................ 59

Tables

Table 1. Feature Summary............................................................................ 9

Table 2. Board Components Shown in Figure 1............................................... 12

Table 3. Supported Memory Configurations.................................................... 16

Table 4. Audio Jack Retasking Support.......................................................... 25

Table 5. LAN Connector LED States .............................................................. 28

Table 6. Effects of Pressing the Power Switch................................................. 31

Table 7. Power States and Targeted System Power......................................... 32

Table 8. Wake-up Devices and Events........................................................... 33

Table 9. System Memory Map...................................................................... 41

Table 10. Component-side Connectors and Headers Shown in Figure 10 ............ 45

Table 11. Front Panel Audio Header.............................................................. 46

Table 12. Serial ATA Connectors .................................................................. 46

Table 13. Serial Port Header........................................................................ 46

Table 14. Chassis Intrusion Header .............................................................. 46

Table 15. Rear Chassis (3-Pin) Fan Header .................................................... 46

Table 16. Processor (4-Pin) Fan Header......................................................... 47

Table 17. CIR Emitter (Output) Header ......................................................... 47

Table 18. CIR Receiver (Input) Header.......................................................... 47

Table 19. Auxiliary Front Panel Power/Sleep LED Header ................................. 48

Table 20. Processor Core Power Connector .................................................... 49

Table 21. Main Power Connector .................................................................. 49

Table 22. Front Panel Header....................................................................... 50

Table 23. States for a One-Color Power LED .................................................. 51

Table 24. States for a Two-Color Power LED .................................................. 51

Table 25. BIOS Setup Configuration Jumper Settings ...................................... 54

Table 26. Recommended Power Supply Current Values.................................... 56

Table 27. Recommended Power Supply Current Values.................................... 56

Table 28. Fan Header Current Capability ....................................................... 57

vii

Intel Desktop Board DG45FC Technical Product Specification

Table 29. Thermal Considerations for Components.......................................... 59

Table 30. Intel® Desktop Board DG45FC Environmental Specifications ............... 60

Table 31. BIOS Setup Program Menu Bar ...................................................... 62

Table 32. BIOS Setup Program Function Keys ................................................ 62

Table 33. Acceptable Drives/Media Types for BIOS Recovery............................ 66

Table 34. Boot Device Menu Options............................................................. 67

Table 35. Supervisor and User Password Functions ......................................... 69

Table 36. Beep Codes................................................................................. 71

Table 37. BIOS Error Messages.................................................................... 71

Table 38. Port 80h POST Code Ranges .......................................................... 72

Table 39. Port 80h POST Codes.................................................................... 73

Table 40. Typical Port 80h POST Sequence .................................................... 76

Table 41. Safety Standards ......................................................................... 77

Table 42. Lead-Free Board Markings............................................................. 82

Table 43. EMC Regulations .......................................................................... 83

Table 44. Product Certification Markings........................................................ 84

viii

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the Intel Desktop Board DG45FC.

Table 1. Feature Summary

Form Factor Mini-ITX (6.75 inches by 6.75 inches [171.45 millimeters by 171.45 millimeters]) Processor Support for the following:

Memory

Chipset

Audio 8-channel (7.1) audio subsystem using the IDT* 92HD73E high definition audio

Video Intel® Graphics Media Accelerator X4500HD (Intel® GMA X4500HD) onboard

Legacy I/O Control Legacy I/O controller for serial port header and Consumer Infrared (CIR)

Peripheral Interfaces

LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel

BIOS

• Intel

• Dual-Core Intel

• Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR2 800 MHz or DDR2 667 MHz DIMMs

• Support for up to 4 GB of system memory using DDR2 800 MHz or DDR2

Intel

• Intel

codec and Dolby* Home Theater certification

graphics subsystem.

• Ten USB 2.0 ports

• Five Serial ATA (3 Gbps) interfaces, including one red-colored external Serial

• One serial port header (may require specialized chassis or cable for use)

Gigabit Ethernet Controller

• Intel

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

Core™2 Duo processor in an LGA775 socket

Pentium® Dual-Core processor in an LGA775 socket

Celeron® Dual-Core processor in an LGA775 socket

Celeron® processor Sequence 400 in an LGA775 socket

667 MHz DIMMs

G45 Express Chipset, consisting of:

82G45 Graphics and Memory Controller Hub (GMCH)

82801JR I/O Controller Hub (ICH10R)

ATA (eSATA) interface on the back panel

BIOS (resident in the SPI Flash device)

and SMBIOS

Xeon® processor in an LGA775 socket

82567LF

continued

Intel Desktop Board DG45FC Technical Product Specification

Table 1. Feature Summary (continued)

Instantly Available PC Technology

Expansion Capabilities

Hardware Monitor Subsystem

• Support for PCI* Local Bus Specification Revision 2.3

• Support for PCI Express* Revision 1.0a

• Suspend to RAM support

• Wake on PCI, RS-232, front panel, USB ports, LAN, and CIR

• One PCI Express x1 bus add-in card connector

• Intel

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Two fan headers

• Two fan sense inputs used to monitor fan activity

Quiet System Technology implemented through the Intel® Management

Engine (Intel

MEI) in ICH10R

1.1.2 Board Layout

Figure 1 shows the location of the major components.

Product Description

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Intel Desktop Board DG45FC Technical Product Specification

Table 2. Board Components Shown in Figure 1

Item/callout from Figure 1 Descri

A Front panel audio header B Back panel connectors C CIR emitter (output) header D Processor core power connector (2 X 2) E Front panel USB header F Front panel USB header G BIOS Setup configuration jumper block H Chassis intrusion header

I LGA775 processor socket

J Front chassis fan header K Processor fan header L Serial port header M CIR receiver (input) header N Main Power connector (2 X 12) O Battery P Speaker Q DIMM socket R DIMM socket S Intel 82G45 GMCH T Intel 82801JR I/O Controller Hub (ICH10R) U Auxiliary front panel power LED header V Front panel header

W Serial ATA connectors [4]

X PCI Express x1 connector

ption

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas.

Product Description

Figure 2. Block Diagram

Intel Desktop Board DG45FC Technical Product Specification

1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

• No parallel port

• No floppy drive connector

• No parallel ATA IDE connector

• No serial port on the back panel

• No IEEE 1394a connector on the back panel

• No PCI Express x16 connector

• No PCI Conventional connector

• The serial port header is located near the memory sockets and may require a

specialized chassis or cabling solution to use

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel® Desktop Board DG45FC http://www.intel.com/products/motherboard/DG45FC/index.htm Desktop Board Support http://support.intel.com/support/motherboards/desktop Available configurations for the Intel

Desktop Board DG45FC Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com

http://www.intel.com/products/motherboard/DG45FC/index.htm

1.4 Processor

The board is designed to support the following processors:

• Intel Core 2 Duo processor in an LGA775 socket

• Intel Pentium Dual-Core processor in an LGA775 socket

• Intel Celeron Dual-Core processor in an LGA775 socket

• Intel Celeron processor Sequence 400 in an LGA775 socket

• Dual-Core Intel Xeon processor in an LGA775 socket

Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 65 W. The processors listed above are only supported when falling within the wattage requirements of the Intel Desktop Board DG45FC. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

INTEGRATOR’S NOTE

Use only ATX12V-compliant power supplies.

For information about Refer to

Power supply connectors Section 2.2.2.4, page 49

Product Description

Intel Desktop Board DG45FC Technical Product Specification

1.5 System Memory

The board has two DIMM sockets and support the following memory features:

• 1.8 V DDR2 SDRAM DIMMs with gold plated contacts, with the option to raise the

voltage to support higher performance DDR2 SDRAM DIMMs

• Dual channel interleaved mode support

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMs with x16 organization are not supported.

• 4 GB maximum total system memory using DDR2 800 or DDR2 667 DIMMs; refer

to Section 2.1.1 on page 39 for information on the total amount of addressable memory.

• Minimum recommended total system memory: 512 MB for the Windows* XP

operating system or 1 GB for the Windows Vista* operating system

• Non-ECC DIMMs

• Serial Presence Detect

• DDR2 800 MHz or DDR2 667 MHz SDRAM DIMMs

• DDR2 667 MHz DIMMs with SPD timings of only 5-5-5 (tCL-tRCD-tRP)

• DDR2 800 MHz DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)

 NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

Table 3. Supported Memory Configurations

DIMM Type

DDR2 667 512 Mbit 256 MB 1 GB 2 GB DDR2 667 1 Gbit 512 MB 2 GB 4 GB DDR2 800 512 Mbit 256 MB 1 GB 2 GB DDR2 800 1 Gbit 512 MB 2 GB 4 GB

SDRAM Technology

Smallest usable DIMM (one x16 Single-sided DIMM)

Largest usable DIMM (one x8 Double-sided DIMM)

For information about… Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/

CS-025414.htm

Maximum capacity with two identical x8 Double-sided DIMMs

Product Description

1.5.1 Memory Configurations

The Intel 82G45 GMCH supports the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for

real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel

bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Flex mode. This mode provides the most flexible performance characteristics.

The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 4 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/

cs-011965.htm

Intel Desktop Board DG45FC Technical Product Specification

Figure 3 illustrates the memory channel and DIMM configuration.



NOTE

The DIMM 0 sockets of both channels are blue.

Figure 3. Memory Channel and DIMM Configuration

INTEGRATOR’S NOTE

Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the

Intel

Management Engine.

Product Description

1.6 Intel® G45 Express Chipset

The Intel G45 Express chipset consists of the following devices:

• Intel 82G45 Graphics and Memory Controller Hub (GMCH) with Direct Media

Interface (DMI) interconnect

• Intel 82801JR I/O Controller Hub (ICH10R) The GMCH component provides interfaces to the CPU, memory, PCI Express, and the

DMI interconnect. The component also provides integrated graphics capabilities supporting 3D, 2D, and display capabilities. The ICH10R is a centralized controller for the board’s I/O paths.

The chipset supports the following features:

• Onboard Graphics

• Dynamic Video Memory Technology

• USB

• Serial ATA

For information about Refer to

The Intel G45 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

1.6.1 Intel G45 Graphics Subsystem

The Intel G45 Express chipset contains the Intel Graphics Media Accelerator X4500HD (Intel GMA X4500HD) graphics controller.

1.6.1.1 Intel® Graphics Media Accelerator X4500HD Graphics

Controller

The Intel GMA X4500HD graphics controller features the following:

• High quality texture engine ⎯ DirectX10* and OpenGL* 2.0 compliant ⎯ Shader Model 4.0

• 3D Graphics Rendering enhancements ⎯ 1.6 dual texture GigaPixel/sec max fill rate ⎯ 16-bit and 32-bit color ⎯ Vertex cache

• Video ⎯ Hi-Definition content at up to 1080p resolution ⎯ Dynamic Video Memory Technology (DVMT) 5.0 uses system memory

depending on the OS and the amount of memory installed

Intel Desktop Board DG45FC Technical Product Specification

• Display ⎯ Supports digital and analog displays up to 2048 x 1536 at 75 Hz refresh

(QXGA); also supports 1920 x 1080 resolution for full High Definition video playback quality

⎯ Dual independent display support

1.6.1.2 Dynamic Video Memory Technology (DVMT 5.0)

DVMT enables enhanced graphics and memory performance through highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. The amount of system memory allocated to DVMT varies depending on the amount of total system memory installed as well as the operating system being used. For Windows Vista, a minimum of 128 MB can be allocated to DVMT and a maximum of over 2 GB can be allocated to DVMT with the correct amount of memory installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem.

DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions.



NOTE

The use of DVMT requires operating system driver support.

1.6.1.3 Configuration Modes

The video modes supported by this board are based on the Extended Display Identification Data (EDID) modes of the monitor to which the system is connected. Standard monitors are assumed.

1.6.1.4 High-Definition Multimedia Interface* (HDMI*)

The HDMI* port supports standard, enhanced, or high-definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV standards and supports 8-channel digital audio. The HDMI port is compliant with the HDMI 1.3 specification.

1.6.1.5 Digital Visual Interface (DVI)

The DVI-I port supports both digital and analog DVI displays. The maximum supported resolution is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI port is compliant with the DVI 1.0 specification.

Product Description

1.6.2 Intel® Viiv™ Processor Technology

This Intel desktop board supports Intel® Viiv™ processor technology. To be eligible for the Intel Viiv processor technology brand, a system must meet certain hardware and software requirements. To get the list of requirements for Intel Viiv processor technology branding as well as all the features supported by Intel Viiv processor technology, refer to:

http://www.intel.com/products/viiv/index.htm

1.6.3 USB

The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.

The ICH10R provides the USB controller for all ports. The port arrangement is as follows:

• Six ports are implemented with stacked back panel connectors

• Four ports are routed to two separate front panel USB headers

For information about Refer to

The location of the USB connectors on the back panel Figure 9, page 43 The location of the front panel USB headers Figure 10, page 44

Intel Desktop Board DG45FC Technical Product Specification

1.6.4 Serial ATA Interfaces

The board provides four Serial ATA (SATA) connectors, which support one device per connector. The board also provides one red-colored external Serial ATA (eSATA) connector on the back panel.

1.6.4.1 Serial ATA Support

The board’s Serial ATA controller offers five independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of five Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.

For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows Vista operating systems.



NOTE

Many Serial ATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/

For information about Refer to

The location of the Serial ATA connectors Figure 10, page 44

1.6.4.2 Serial ATA RAID

The board supports the following RAID (Redundant Array of Independent Drives) levels:

• RAID 0 - data striping

• RAID 1 - data mirroring

• RAID 0+1 (or RAID 10) - data striping and mirroring

• RAID 5 - distributed parity

Product Description

1.6.4.3 Intel® Rapid Recover Technology (Intel® RRT)

The board incorporates the Intel® Rapid Recover Technology (Intel® RRT). Intel® Rapid Recover Technology is a feature of Intel® Matrix Storage Manager. It uses RAID 1 (mirroring) functionality to copy data from a designated master drive to a designated recovery drive. The master drive data can be copied to the recovery drive either continuously or on request.

When using the continuous update policy, changes made to the data on the master drive while the recovery drive is disconnected or offline are automatically copied to the recovery drive when it is reconnected. When using the on request update policy, the master drive data can be restored to a previous state by copying the data on the recovery drive back to the master drive.

1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

 NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.

1.8 Legacy I/O Controller

The I/O controller provides the following features:

• Consumer Infrared (CIR) headers

• One serial port header

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• Intelligent power management, including a programmable wake-up event interface

• PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

Intel Desktop Board DG45FC Technical Product Specification

1.8.1 Consumer Infrared (CIR)

The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows Vista* is the supported operating system.

The CIR feature is made up of two separate pieces: the receiving header, and the emitter header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware.

Customers are required to buy or create their own interface modules to plug into Intel Desktop Boards for this feature to work.

1.8.2 Serial Port

The board has one serial port header located on the component side of the board. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.

For information about Refer to

The location of the serial port header Figure 10, page 44 The signal names of the serial port header Table 13, page 46

Product Description

1.9 Audio Subsystem

The onboard audio subsystem consists of the following:

• Intel 82801JR (ICH10R)

• IDT 92HD73E audio codec

• Back panel audio connectors

• Component-side audio header: ⎯ Intel

The audio subsystem supports the following features:

• Dolby Home Theater support

• A signal-to-noise (S/N) ratio of 95 dB

• Independent multi-streaming 7.1 audio (using the back panel audio connectors)

and stereo (using the Intel High Definition Audio front panel header)

Table 4 lists the supported functions of the front panel and back panel audio jacks.

High Definition Audio front panel header

Table 4. Audio Jack Retasking Support

Audio Jack

Front panel – Green No Yes Yes No No No Front panel – Pink Yes No No No No No Back panel – Blue No No No Yes No No Back panel – Green No Yes Yes No No No Back panel – Pink Yes No No No No No Back panel – Black No No No No Yes No Back panel -

Orange

Supports

Micro-

phone?

No No No No No Yes

Supports Line out?

Supports

Head-

phones?

Supports

Line in /

Side

Surround?

Supports

Rear

Surround?

Supports

Center/

Subwoofer?

Intel Desktop Board DG45FC Technical Product Specification

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and drivers Section 1.2, page 14

1.9.2 Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors.

The front/back panel audio connectors are configurable through the audio device drivers. The available configurable audio ports are shown in Figure 4.

Item Description

A Rear surround left/right channel audio out B Center channel and LFE (subwoofer) audio out C Line in / Side surround D Line out E Mic in F S/PDIF Digital Audio Out (Optical)

Figure 4. Back Panel Audio Connector Options

For information about Refer to

The location of the front panel audio header Figure 10, page 44 The signal names of the front panel audio header Table 11, page 46 The back panel audio connectors Section 2.2.1, page 43

1.10 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82567LF Gigabit Ethernet Controller (10/100/1000 Mbits/sec)

• Intel 82801JR (ICH10R)

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between ICH10R and the LAN controller

• PCI Conventional bus power management ⎯ ACPI technology support ⎯ LAN wake capabilities

• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

Product Description

1.10.1 Intel® 82567LF Gigabit Ethernet Controller

The Intel 82567LF Gigabit Ethernet Controller supports the following features:

• PCI Express link

• 10/100/1000 IEEE 802.3 compliant

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Transmit TCP segmentation

• Full device driver compatibility

• PCI Express power management support

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Intel BLKDG45FC, DG45FC Technical Product Specification

Specifications and Main Features

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User Manual