Intel BLKD955XCSLKR, BOXD955XCSLKR - Motherboard 955X Express Chipset BTX, D955XCS Technical Product Specification
Intel® Desktop Board
D955XCS
Technical Product Specification
The Intel® Desktop Board D955XCS may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D955XCS Specification Update.
July 2005
Order Number: D14066-001US
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D955XCS Technical Product
Specification
July 2005
This product specification applies to only the standard Intel
®
Desktop Board D955XCS with BIOS
identifier BK95510J.86A.
Changes to this specification will be published in the Intel Desktop Board D955XCS Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
®
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
®
PRODUCTS INCLUDING LIABILITY OR WARRANTIES
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
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Copyright © 2005, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
power and environmental requirements, and the BIOS for the Intel
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop Board
D955XCS and its components to the vendors, system integrators, and other engineers and
technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D955XCS
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
®
Desktop Board D955XCS. It
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D955XCS Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D955XCS, and X is the instance of the
particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbits/sec Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview......................................................................................................................10
1.1.1 Feature Summary..........................................................................................10
1.1.2 Manufacturing Options ..................................................................................11
1.1.3 Board Layout.................................................................................................12
1.1.4 Block Diagram...............................................................................................14
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.4.1 Memory Configurations .................................................................................17
1.5 Intel® 955X Chipset......................................................................................................21
1.5.1 USB...............................................................................................................21
1.5.2 IDE Support...................................................................................................21
1.5.3 Real-Time Clock, CMOS SRAM, and Battery................................................23
1.6 Discrete Serial ATA Interface (Optional)......................................................................24
1.7 PCI Express* Connectors ............................................................................................24
1.8 Auxiliary Power (AUX PWR) Connector (Optional)......................................................25
1.9 IEEE-1394a/b Connectors (Optional)...........................................................................25
1.10 Legacy I/O Controller...................................................................................................26
1.10.1 Serial Port......................................................................................................26
1.10.2 Parallel Port...................................................................................................26
1.10.3 Diskette Drive Controller................................................................................26
1.10.4 Keyboard and Mouse Interface .....................................................................26
1.11 Audio Subsystem.........................................................................................................27
1.11.1 Audio Subsystem Software ...........................................................................27
1.11.2 Audio Connectors..........................................................................................27
1.11.3 8-Channel (7.1) Audio Subsystem.................................................................28
1.11.4 6-Channel (5.1) Audio Subsystem.................................................................30
1.12 LAN Subsystem ...........................................................................................................31
1.12.1 Intel® 82573E/82573V Gigabit Ethernet Controller .......................................31
1.12.2 RJ-45 LAN Connector with Integrated LEDs.................................................31
1.12.3 Alert Standard Format (ASF) Support (Optional) ..........................................32
1.12.4 Intel® Active Management Technology (AMT) (Optional)..............................32
1.12.5 LAN Subsystem Software..............................................................................34
1.13 Hardware Management Subsystem.............................................................................34
1.13.1 Hardware Monitoring and Fan Control ASIC.................................................34
1.13.2 Thermal Monitoring........................................................................................35
1.13.3 Fan Monitoring...............................................................................................36
1.13.4 Chassis Intrusion and Detection....................................................................36
1.14 Power Management.....................................................................................................36
1.14.1 ACPI..............................................................................................................36
1.14.2 Hardware Support .........................................................................................39
1.15 Trusted Platform Module (Optional).............................................................................42
v
Intel Desktop Board D955XCS Technical Product Specification
2 Technical Reference
2.1 Memory Resources......................................................................................................43
2.1.1 Addressable Memory.....................................................................................43
2.1.2 Memory Map..................................................................................................45
2.2 DMA Channels.............................................................................................................45
2.3 Fixed I/O Map...............................................................................................................46
2.4 PCI Configuration Space Map......................................................................................47
2.5 Interrupts......................................................................................................................48
2.6 PCI Conventional Interrupt Routing Map .....................................................................49
2.7 Connectors...................................................................................................................51
2.7.1 Back Panel Connectors.................................................................................51
2.7.2 Component-side Connectors.........................................................................54
2.8 Jumper Block ...............................................................................................................65
2.9 Mechanical Considerations..........................................................................................66
2.9.1 Form Factor...................................................................................................66
2.9.2 I/O Shield.......................................................................................................67
2.10 Electrical Considerations..............................................................................................69
2.10.1 DC Loading....................................................................................................69
2.10.2 Add-in Board Considerations.........................................................................69
2.10.3 Fan Connector Current Capability.................................................................70
2.10.4 Power Supply Considerations .......................................................................70
2.11 Thermal Considerations...............................................................................................71
2.12 Reliability......................................................................................................................73
2.13 Environmental..............................................................................................................74
2.14 Regulatory Compliance................................................................................................75
2.14.1 Safety Regulations ........................................................................................75
2.14.2 EMC Regulations...........................................................................................75
2.14.3 European Union Declaration of Conformity Statement..................................76
2.14.4 Recycling Considerations..............................................................................77
2.14.5 Product Certification Markings (Board Level)................................................78
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................79
3.2 Resource Configuration ...............................................................................................80
3.2.1 PCI Autoconfiguration....................................................................................80
3.2.2 PCI IDE Support............................................................................................80
3.3 System Management BIOS (SMBIOS) ........................................................................81
3.4 Legacy USB Support....................................................................................................81
3.5 BIOS Updates..............................................................................................................82
3.5.1 Language Support.........................................................................................82
3.5.2 Custom Splash Screen..................................................................................82
3.6 Boot Options ................................................................................................................83
3.6.1 CD-ROM Boot ...............................................................................................83
3.6.2 Network Boot.................................................................................................83
3.6.3 Booting Without Attached Devices................................................................83
3.6.4 Changing the Default Boot Device During POST..........................................83
vi
3.7 Fast Booting Systems with Intel® Rapid BIOS Boot.....................................................84
3.7.1 Peripheral Selection and Configuration.........................................................84
3.7.2 Intel Rapid BIOS Boot ...................................................................................84
3.8 BIOS Security Features ...............................................................................................85
4 Error Messages and Beep Codes
4.1 Speaker ....................................................................................................................... 87
4.2 BIOS Beep Codes........................................................................................................87
4.3 BIOS Error Messages..................................................................................................87
4.4 Port 80h POST Codes .................................................................................................88
Figures
1. Desktop Board Components........................................................................................12
2. Block Diagram..............................................................................................................14
3. Memory Channel and DIMM Configuration..................................................................17
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs ..............................18
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................18
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs..............................19
7. Single Channel (Asymmetric) Mode Configuration with One DIMM.............................20
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs........................20
9. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem....28
10. 8-channel (7.1) Audio Subsystem Block Diagram........................................................29
11. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem....30
12. 6-Channel (5.1) Audio Subsystem Block Diagram.......................................................30
13. LAN Connector LED Locations....................................................................................31
14. Sensors and Fan Connectors ......................................................................................35
15. Location of the Standby Power Indicator LED .............................................................42
16. Detailed System Memory Address Map.......................................................................44
17. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ...................................52
18. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ...................................53
19. Component-side Connectors.......................................................................................54
20. Connection Diagram for Front Panel Connector..........................................................61
21. Connection Diagram for Front Panel USB Connectors................................................63
22. Connection Diagram for Front Panel IEEE 1394a/b Connectors.................................64
23. Location of the Jumper Block.......................................................................................65
24. Board Dimensions........................................................................................................66
25. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............67
26. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............68
27. Example of a Processor Heatsink for Omni-directional Airflow....................................71
28. Localized High Temperature Zones.............................................................................72
Contents
Tables
1. Feature Summary ........................................................................................................10
2. Manufacturing Options.................................................................................................11
3. Components Shown in Figure 1...................................................................................13
4. Supported Memory Configurations ..............................................................................16
5. LAN Connector LED States .........................................................................................31
6. Effects of Pressing the Power Switch ..........................................................................37
vii
Intel Desktop Board D955XCS Technical Product Specification
7. Power States and Targeted System Power .................................................................38
8. Wake-up Devices and Events......................................................................................39
9. System Memory Map ...................................................................................................45
10. DMA Channels.............................................................................................................45
11. I/O Map ........................................................................................................................46
12. PCI Configuration Space Map......................................................................................47
13. Interrupts......................................................................................................................48
14. PCI Interrupt Routing Map ...........................................................................................50
15. Back Panel Connectors Shown in Figure 17................................................................52
16. Back Panel Connectors Shown in Figure 18................................................................53
17. Component-side Connectors Shown in Figure 19 .......................................................55
18. ATAPI CD-ROM Connector (Optional).........................................................................56
19. Front Panel Audio Connector.......................................................................................56
20. Front Chassis Fan and Rear Chassis Fan Connectors...............................................56
21. Processor Fan Connector and Auxiliary Fan Connector..............................................56
22. Chassis Intrusion Connector........................................................................................57
23. Serial ATA Connectors.................................................................................................57
24. Auxiliary Power (AUX PWR) Output Connector (Optional)..........................................57
25. Main Power Connector.................................................................................................59
26. Processor Power Connector (2 x 4 Pin).......................................................................59
27. Processor Power Connector (2 x 2 Pin).......................................................................59
28. Auxiliary PCI Express Power Connector......................................................................59
29. Auxiliary Front Panel Power/Sleep LED Connector.....................................................60
30. Front Panel Connector.................................................................................................61
31. States for a One-Color Power LED..............................................................................62
32. States for a Two-Color Power LED..............................................................................62
33. BIOS Setup Configuration Jumper Settings.................................................................65
34. DC Loading Characteristics .........................................................................................69
35. Fan Connector Current Capability................................................................................70
36. Thermal Considerations for Components ....................................................................73
37. Environmental Specifications.......................................................................................74
38. Safety Regulations.......................................................................................................75
39. EMC Regulations.........................................................................................................75
40. Product Certification Markings.....................................................................................78
41. BIOS Setup Program Menu Bar...................................................................................80
42. BIOS Setup Program Function Keys............................................................................80
43. Boot Device Menu Options ..........................................................................................83
44. Supervisor and User Password Functions...................................................................85
45. Beep Codes .................................................................................................................87
46. BIOS Error Messages..................................................................................................87
47. Port 80h POST Code Ranges......................................................................................88
48. Port 80h POST Codes .................................................................................................89
49. Typical Port 80h POST Sequence...............................................................................92
viii
1 Product Description
What This Chapter Contains
1.1 Overview......................................................................................................................10
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.5 Intel® 955X Chipset......................................................................................................21
1.6 Discrete Serial ATA Interface (Optional)......................................................................24
1.7 PCI Express Connectors..............................................................................................24
1.8 Auxiliary Power (AUX PWR) Connector (Optional)......................................................25
1.9 IEEE-1394a/b Connectors (Optional)...........................................................................25
1.10 Legacy I/O Controller...................................................................................................26
1.11 Audio Subsystem.........................................................................................................27
1.12 LAN Subsystem ...........................................................................................................31
1.13 Hardware Management Subsystem.............................................................................34
1.14 Power Management.....................................................................................................36
1.15 Trusted Platform Module (Optional).............................................................................42
9
Intel Desktop Board D955XCS Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio
Legacy I/O Control
USB
Peripheral
Interfaces
BIOS
Instantly Available
PC Technology
LAN Support
Expansion
Capabilities
BTX (12.80 inches by 10.50 inches [325.12 millimeters by 266.71 millimeters])
Support for an Intel® Pentium® 4 processor in an LGA775 socket with a 1066 or
800 MHz system bus
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for 667 and 533 MHz DDR2 DIMMs
• Support for up to 8 GB of system memory
• Support for ECC and non-ECC memory
®
955X Chipset, consisting of:
Intel
®
• Intel
• Intel® 82801GR I/O Controller Hub (ICH7-R)
Intel
Legacy I/O controller
Support for USB 2.0 devices
• Eight USB ports
• One serial port
• One parallel port
• Four Serial ATA interfaces with RAID support
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2* keyboard and mouse ports
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI Local Bus Specification Revision 2.3
• Support for PCI Express* Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel
Gigabit Ethernet Controller
• Four PCI Conventional* bus add-in card connectors (SMBus routed to PCI
• One PCI Express x16 bus add-in card connector
• One Secondary PCI Express x16/x4 bus add-in card connector
• One PCI Express x1 bus add-in card connector
82955X Memory Controller Hub (MCH)
®
High Definition Audio subsystem
®
BIOS (resident in the FWH or SPI Flash device)
SMBIOS, and Intel
Conventional bus connector 2)
®
Active Management Technology (Intel® AMT)
®
82573E/82573V
continued
10
Product Description
Table 1. Feature Summary (continued)
Hardware Monitor
Subsystem
• Hardware monitoring and fan control ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 2. Manufacturing Options
ATAPI CD-ROM
connector
Audio Subsystem
Auxiliary PCI
Express Power
Connector
Auxiliary Power
(AUX PWR)
Connector
Discrete SATA
RAID controller
IEEE-1394a/b
Interface
Processor power
connector
Trusted Platform
Module (TPM)
For information about Refer to
Available configurations for the board Section 1.2, page 15
A 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI CD-ROM drive to
the audio mixer
Intel High Definition Audio subsystem in one of the following configurations:
• 8-channel (7.1) audio subsystem with five analog audio outputs and two S/PDIF
digital audio outputs (coaxial and optical) using the Sigmatel* 9223 audio codec
• 6-channel (5.1) audio subsystem with three analog audio outputs using the
Sigmatel 9220 audio codec
Provides required additional power when using high power (75 W or greater) add-in
cards in both the PCI Express x16 and the Secondary PCI Express x16/x4 bus add-in
card connectors
Provides power for internal chassis lighting
• Silicon Image Sil 3114 SATA RAID controller
• Four SATA connectors (in addition to the four SATA connectors on the ICH7-R
SATA interface)
IEEE-1394a/b controller and three IEEE-1394a/b connectors: one back panel
connector, two front-panel connectors. Back panel connector is IEEE-1394acompatible only; front panel connectors are 1394a- or 1394b-compatible, configurable
through the BIOS Setup program.
One of the following connectors for providing +12 V power to the processor voltage
regulator:
• 2 x 4-pin (requires a power supply with a dual-rail 2 x 4 power cable)
• 2 x 2-pin
A component that enhances platform security
11
Intel Desktop Board D955XCS Technical Product Specification
1.1.3 Board Layout
Figure 1 shows the location of the major components.
PP
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BA I J KG H
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C
D
E
L
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N
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P
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CC
Figure 1. Desktop Board Components
Table 3 lists the components identified in Figure 1.
12
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Table 3. Components Shown in Figure 1
Item/callout from Figure 1 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
BB
CC
DD
EE
FF
GG
HH
II
JJ
KK
LL
MM
NN
OO
PP
Front panel audio connector
Back panel connectors
Chassis intrusion connector
Front panel USB connectors [2]
Serial ATA connectors (ICH7-R RAID) [4]
Power connector
PCI Express x1 bus add-in card connector
PCI Express x16 bus add-in card connector
Legacy I/O controller
PCI Conventional bus add-in card connector
Secondary PCI Express x16/x4 bus add-in card connector
PCI Conventional bus add-in card connectors [3]
IEEE-1394a/b PHY component (optional)
Auxiliary power connector (optional)
IEEE-1394a/b Link component (optional)
IEEE-1394a/b front panel connectors [2]
Auxiliary front panel power LED connector
Serial ATA RAID controller (Discrete RAID) (optional)
Serial ATA RAID connectors (Discrete RAID) (optional) [2]
Auxiliary fan connector
Serial ATA RAID connectors (Discrete RAID) (optional) [2]
Front panel connector
Front chassis fan connector
Diskette drive connector
BIOS Setup configuration jumper block
Firmware Hub (FWH)
Auxiliary PCI Express power connector (optional)
Speaker
Intel 82801GR I/O Controller Hub (ICH7-R)
LGA775 processor socket
Intel 82955X MCH
Battery
Processor power connector
Processor fan connector
DIMM Channel A sockets [2]
DIMM Channel B sockets [2]
Rear chassis fan connector
SPI Flash device
Parallel ATA IDE connector
ATAPI CD-ROM connector (optional)
Audio codec
Gigabit Ethernet Controller
Product Description
13
Intel Desktop Board D955XCS Technical Product Specification
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
PCI Express x1 Slot
Secondary PCI
Express x16/x4 Slot
Parallel ATA
IDE Connector
LGA775
Processor Socket
PCI Express
x16 Interface
PCI Express
x16
Connector
Channel A
DIMMs (2)
PCI Express Interface
Parallel ATA
IDE Interface
System Bus
(1066/800 MHz)
Intel 955X Chipset
Intel 82955X Memory
Controller Hub (MCH)
SMBus
Dual-Channel
Memory Bus
SMBus
SMBus
Gigabit Ethernet
Controller
USB
LPC Bus
I/O
Controller
LPC Bus
Intel 82801GR
I/O Controller Hub
(ICH7-R)
DMI Interconne ct
Back Panel/Front Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Diskette Drive
LPC Bus
TPM Component
LAN
Connector
Connector
Firmware
Hub (FWH)
-- or --
SPI Flash
Device
(Optional)
Channel B
DIMMs (2)
IEEE-1394a/b Connectors
(Optional)
SATA RAID
Connectors (4)
(Optional)
PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
IEEE-1394a/b
Controller
(Optional)
Discrete SATA RAID
Controller
(Optional)
PCI Bus
SMBus
Hardware Monitoring
and Fan Control ASIC
Figure 2. Block Diagram
PCI
Bus
PCI
Bus
High Definition Audio Link
SATA IDE
Interface
Front Panel Mic In
Front Panel Line Out
Mic In/Retasking Jack
Line In/Retasking Jack
Audio
Codec
Surround Left-Right/Retasking Jack
Line Out/Retasking Jack
CD-ROM (Optional)
Center and LFE/Retasking Jack
Connectors (4)
S/PDIF
SATA IDE
OM17986
14
Product Description
1.2 Online Support
To find information about… Visit this World Wide Web site:
®
Desktop Board D955XCS under
Intel
“Desktop Board Products” or “Desktop
Board Support”
Available configurations for the Desktop
Board D955XCS
Processor data sheets http://www.intel.com/design/litcentr
ICH7-R addressing http://developer.intel.com/products/chipsets
Custom splash screens http://intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Intel® Active Management Technology http://www.intel.com/technology/manage/iamt/index.htm
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/cs/cs_available.htm
1.3 Processor
The board is designed to support Intel Pentium 4 processors in an LGA775 processor socket with a
1066 or 800 MHz system bus. See the Intel web site listed below for the most up-to-date list of
supported processors.
For information about… Refer to:
Supported processors for the board http://www.intel.com/design/motherbd/cs/cs_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
This board has specific requirements for providing power to the processor. Refer to Section 2.7.2.1
on page 58 for information on power supply requirements for this board.
15
Intel Desktop Board D955XCS Technical Product Specification
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.8 V and 1.9 V DDR2 SDRAM DIMMs
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 8 GB maximum total system memory. Refer to Section 2.1.1 on page 43 for information on the
total amount of addressable memory.
• Minimum total system memory: 128 MB
• ECC DIMMs and non-ECC DIMMs
• Serial Presence Detect
• DDR2 667 and 533 MHz SDRAM DIMMs
NOTES
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read the SPD data and program the chipset to accurately configure memory settings
for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly
configure the memory settings, but performance and reliability may be impacted or the DIMMs
may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
128 MB SS 256 Mbit 16 M x 16/empty 4 [5]
256 MB SS 256 Mbit 32 M x 8/empty 8 [9]
256 MB SS 512 Mbit 32 M x 16/empty 4 [5]
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16 [18]
512 MB SS 512 Mbit 64 M x 8/empty 8 [9]
512 MB SS 1 Gbit 64 M x 16/empty 4 [5]
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16 [18]
1024 MB SS 1 Gbit 128 M x 8/empty 8 [9]
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16 [18]
Notes:
1. In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
2. In the fifth column, the number in brackets specifies the number of SDRAM devices on an ECC DIMM.
INTEGRATOR’S NOTE
#
Configuration
(Note 1)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
(Note 2)
Refer to Section 2.1.1, on page 43 for additional information on available memory.
16
Product Description
1.4.1 Memory Configurations
The Intel 82955X MCH supports two types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for real world
applications. Dual channel mode is enabled when the installed memory capacities of both
DIMM channels are equal. Technology and device width can vary from one channel to the
other but the installed memory capacity for each channel must be equal. If different speed
DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth
operation for real world applications. This mode is used when only a single DIMM is installed
or the memory capacities are unequal. Technology and device width can vary from one
channel to the other. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 3. Memory Channel and DIMM Configuration
OM17987
17
Intel Desktop Board D955XCS Technical Product Specification
1.4.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0
(blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
1 GB
Channel B, DIMM 0
Channel B, DIMM 1
OM17988
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0
(blue) socket of Channel B.
256 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
18
OM17989
Product Description
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in
Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
256 MB
512 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17990
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
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Intel Desktop Board D955XCS Technical Product Specification
1.4.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0
(blue) socket of Channel A is populated. Channel B is not populated.
256 MB
Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM17991
Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined
capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the
DIMM0 (blue) socket of Channel B.
256 MB
512 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs
20
OM17992
Product Description
1.5 Intel® 955X Chipset
The Intel 955X chipset consists of the following devices:
• Intel 82955X Memory Controller Hub (MCH) with Direct Media Interface (DMI) interconnect
• Intel 82801GR I/O Controller Hub (ICH7-R) with DMI interconnect
The MCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and
the DMI interconnect. The ICH7-R is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel 955X chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
1.5.1 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The ICH7-R provides the USB controller for all ports. The port arrangement is as follows:
• Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
• Four ports are routed to two separate front panel USB connectors
NOTES
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 18, page 53
The location of the front panel USB connectors Figure 19, page 54
1.5.2 IDE Support
The board provides five IDE interface connectors:
• One parallel ATA IDE connector that supports two devices
• Four serial ATA IDE connectors that support one device per connector
1.5.2.1 Parallel ATE IDE Interface
The ICH7-R’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface.
The Parallel ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
21
Intel Desktop Board D955XCS Technical Product Specification
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7-R’s
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 19, page 54
1.5.2.2 Serial ATA Interfaces
The ICH7-R’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows* XP and Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors Figure 19, page 54
22
Product Description
1.5.2.3 Serial ATA RAID
The ICH7-R supports the following RAID (Redundant Array of Independent Drives) levels:
• RAID 0 - data striping. Multiple physical drives can be teamed together to create one logical
drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus
increasing the throughput. The ICH7-R allows for more than two drives to be used in a
RAID 0 configuration.
• RAID 1 - data mirroring. Multiple physical drives maintain duplicate sets of all data on
separate disk drives. Level 1 provides the highest data reliability because two complete copies
of all information are maintained. The ICH7-R allows for two or four drives to be used in a
RAID 1 configuration.
• RAID 0+1 (or RAID 10) - data striping and mirroring. RAID 0+1 combines multiple mirrored
drives (RAID 1) with data striping (RAID 0) into a single array. This provides the highest
performance with data protection. Data is striped across all mirrored sets. RAID 0+1 utilizes
several drives to stripe data (increased performance) and then makes a copy of the striped
drives to provide redundancy. The mirrored disks eliminate the overhead and delay of parity.
• RAID 5 - distributed parity. RAID Level 5 stripes data at a block level across several drives
and distributes parity among the drives; no single disk is devoted to parity. Because parity data
is distributed on each drive, read performance tends to be lower than other RAID types.
RAID 5 requires the use of three or four drives.
1.5.3 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
23
Intel Desktop Board D955XCS Technical Product Specification
1.6 Discrete Serial ATA Interface (Optional)
As a manufacturing option, the board provides a Silicon Image Sil 3114 Serial ATA (SATA)
controller and four connectors (that support one device per connector) for SATA devices. These
connectors are in addition to the four SATA connectors of the ICH7-R SATA interface.
The Sil 3114 controller uses the PCI bus for data transfer and provides a maximum data transfer
rate of up to 1.5 Gbits/sec. The discrete SATA interface supports the following RAID levels:
• RAID 0
• RAID 1
• RAID 0+1
For information about Refer to
RAID levels Section 1.5.2.3, page 23
The location of the discrete SATA RAID connectors Figure 19, page 54
1.7 PCI Express* Connectors
The board provides the following PCI Express connectors:
• One PCI Express x16 connector. The x16 interface supports simultaneous (full duplex)
transfers up to 8 GBytes/sec. Single-ended (half duplex) transfers are supported at up to
4 GBytes/sec.
• One Secondary PCI Express x16/x4 bus add-in card connector: The board provides a PCI
Express add-in card connector in the form of a physical x16 connector with electrical routing of
x4. It is important to note that this connector is an electrical equivalent of a PCI Express x4 bus
add-in card connector. This connector supports x4 and x1 PCI Express add-in cards.
• One PCI Express x1 connector. The x1 interface supports simultaneous transfers up to
500 MBytes/sec.
INTEGRATOR’S NOTE
#
Although the PCI Express specification allows x16 cards to auto-negotiate down from x16 to x4
and x1 and may function properly, such configurations have not been validated on this board.
Please consult your add-in card vendor prior to attempting to use a PCI Express x16 add-in card in
this connector.
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the
underlying PCI Express architecture is compatible with PCI Conventional compliant operating
systems. Additional features of the PCI Express interface includes the following:
• Support for the PCI Express enhanced configuration mechanism
• Automatic discovery, link training, and initialization
• Support for Active State Power Management (ASPM)
• SMBus 2.0 support
• Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
• Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
24
Product Description
1.8 Auxiliary Power (AUX PWR) Connector (Optional)
The board includes a 1x4 power connector that can be used to provide power for internal chassis
lighting or additional fans. The on/off function of this connector is controlled from within the
BIOS Setup Program. The default setting in the BIOS is for this connector to be off.
CAUTION
When using this connector, observe the following precautions:
• This connector does not include overcurrent protection. Do not connect any devices to this
connector that draw more than 1.5 A.
• This connector will not provide adequate power for storage devices. Do not use a Y-adapter,
power splitter, or SATA power adapter to attach storage devices (such as hard disk drives or
CD/DVD drives) to this connector.
Failure to observe these precautions may cause damage to the board.
For information about Refer to
The location of the optional auxiliary power connector Figure 19, page 54
The signal names of the optional auxiliary power connector Table 24, page 57
1.9 IEEE-1394a/b Connectors (Optional)
The optional IEEE-1394 interface addresses interconnection of both computer peripherals and
consumer electronics with these features:
• IEEE-1394a and IEEE-1394b operation
• Support for up to 63 peer-to-peer devices
• Operation ranging from 100 Mbits/sec to 800 Mbits/sec (depending on cable type)
• Connection over short and long distances
• Support for both asynchronous and isochronous data transfer
As a manufacturing option, the board includes three IEEE-1394a/b connectors as follows:
• One IEEE-1394a connector located on the back panel. This connector supports IEEE-1394a
operation only; IEEE-1394b operation is not supported.
• Two IEEE-1394a/b front-panel connectors located on the component side. These connectors
can be independently configured for either IEEE-1394a or IEEE-1394b operation using the
BIOS Setup program.
The IEEE-1394a interface provides a throughput ranging from 100 Mbits/sec to 400 Mbits/sec.
The IEEE-1394b interface is completely compatible with IEEE-1394a. IEEE-1394b also supports
higher data transfer rates (800 Mbits/sec) and longer distances.
25
Intel Desktop Board D955XCS Technical Product Specification
For information about Refer to
The location of the back panel IEEE-1394a connector Figure 17, page 52
The location of the front panel IEEE-1394a/b connectors Figure 19, page 54
The signal names of the front panel IEEE-1394a/b connectors Section 2.7.2.6, page 64
1.10 Legacy I/O Controller
The legacy I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the legacy I/O controller.
1.10.1 Serial Port
The board has one serial port connector located on the back panel. The serial port supports data
transfers at rates of up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 18, page 53
1.10.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 18, page 53
1.10.3 Diskette Drive Controller
The legacy I/O controller supports one diskette drive. Use the BIOS Setup program to configure
the diskette drive interface.
For information about Refer to
The location of the diskette drive connector Figure 19, page 54
1.10.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
26
Product Description
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2
connector. Power to the computer should be turned off before a keyboard or mouse is connected or
disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 18, page 53
1.11 Audio Subsystem
The board supports the Intel High Definition audio subsystem based on the Sigmatel 9223 or the
Sigmatel 9220 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize
the device that is connected to an audio port. The back panel audio jacks are capable of
retasking according to user’s definition, or can be automatically switched depending on the
recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
1.11.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 15
1.11.2 Audio Connectors
The board contains audio connectors on both the back panel and the component side of the board.
The component-side audio connectors include the following:
• Front panel audio (a 2 x 5-pin connector that provides mic in and line out signals for front panel
audio connectors)
• ATAPI CD-ROM (an optional 1 x 4-pin ATAPI-style connector for connecting an internal
ATAPI CD-ROM drive to the audio mixer)
The functions of the back panel audio connectors are dependent on which subsystem is present.
The 8-channel (7.1) audio subsystem is described in Section 1.11.3; the 6-channel (5.1) audio
subsystem is described in Section 1.11.4.
For information about Refer to
The locations of the front panel audio connector and the optional ATAPI
CD-ROM connector
The signal names of the front panel audio connector Table 19, page 56
The signal names of the optional ATAPI CD-ROM connector Table 18, page 56
The back panel audio connectors Section 2.7.1, page 51
Figure 19, page 54
27
Intel Desktop Board D955XCS Technical Product Specification
1.11.3 8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
• Intel 82801GR I/O Controller Hub (ICH7-R)
• Sigmatel 9223 audio codec
• Microphone input that supports a single dynamic, condenser, or electret microphone
The back panel audio connectors are configurable through the audio device drivers. The available
configurable audio ports are shown in Figure 9.
Front Panel
Audio Connectors
Line Out
Mic In
Surround Left and Right/Retasking Jack
[Black]
Center channel and LFE (Subwoofer)/
Retasking Jack [Orange]
S/PDIF Digital Audio Out
S/PDIF
Digital Audio Out
Coaxial
Mic In/Retasking Jack
Side Surround
Left and Right/
Line In/Retasking Jack
[Blue]
Optical
[Pink]
Figure 9. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem
28
Line Out/Retasking Jack
[Lime Green]
OM17555
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