Intel BLKD510MO, D510MO Technical Product Specification
Intel® Desktop Board
D510MO
Technical Product Specification
October 2011
Order Number: E74523-002
The Intel® Desktop Board D510MO may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board D510MO Specification Update.
Revision History
Revision Revision History Date
001 First release of the Intel® Desktop Board D510MO Technical Product
Specification.
002 Specification Changes October 2011
This product specification applies to only the standard Intel® Desktop Board D510MO with BIOS
identifier MOPNV10J.86A.
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December 2009
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
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to any such patents, trademarks, copyrights, or other intellectual property rights.
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
Desktop Boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, the Intel logo, and Intel Atom are trademarks of Intel Corporation in the United States and/or other
countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009-2011, Intel Corporation. All rights reserved.
Board Identification Information
Basic Desktop Board D510MO Identification Information
AA Revision BIOS Revision Notes
E76523-302 MOPNV10J.86A.0115 1,2
E76523-400 MOPNV10J.86A.0148 1,2
E76523-401 MOPNV10J.86A.0154 1,2
E76523-402 MOPNV10J.86A.0175 1,2
E76523-403 MOPNV10J.86A.0175 1,2
E76523-404 MOPNV10N.86A.0400 1,2
E76523-405 MOPNV10N.86A.0516 1,2
E76523-406 MOPNV10N.86A.0516 1,2
E76525-301 MOPNV10J.86A.0115 1,2
E76525-400 MOPNV10J.86A.0148 1,2
E76525-401 MOPNV10J.86A.0154 1,2
E76525-402 MOPNV10J.86A.0175 1,2
E76525-403 MOPNV10J.86A.0175 1,2
E76525-404 MOPNV10N.86A.0400 1,2
E76525-405 MOPNV10N.86A.0516 1,2
E76525-406 MOPNV10N.86A.0516 1,2
E67982-303 MOPNV10J.86A.0115 1,2
E67982-400 MOPNV10J.86A.0148 1,2
E67982-401 MOPNV10J.86A.0154 1,2
E67982-402 MOPNV10J.86A.0175 1,2
E67982-403 MOPNV10J.86A.0175 1,2
E67982-404 MOPNV10N.86A.0400 1,2
E67982-405 MOPNV10N.86A.0516 1,2
E67982-406 MOPNV10N.86A.0516 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The CG82NM10 Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
CG82NM10 B0 SLGXX
iii
Intel Desktop Board D510MO Technical Product Specification
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
®
Desktop Board D510MO.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
October 2011 Spec Clarification
• Updated Table 34:
― Deleted “2.5-inch SATA hard disk drive”
d t
― Change
for Current Draw at 12 V and 45.9 W for Power
Consumption
he Maximum Load Configuration to 3.825 A
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D510MO. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D510MO and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board D510MO Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1 Product Description
1.1 Overview........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2 Online Support................................................................................ 16
1.3 Processor ....................................................................................... 16
1.3.1 Intel D510 Graphics Subsystem.............................................. 17
1.4 System Memory .............................................................................. 18
1.5 Intel® NM10 Express Chipset............................................................. 19
1.5.2 USB ................................................................................... 21
1.5.3 SATA Support ...................................................................... 21
1.6 Real-Time Clock Subsystem .............................................................. 22
1.7 Legacy I/O Controller ....................................................................... 22
1.7.1 Serial Port Headers............................................................... 22
1.7.2 Parallel Port Header .............................................................. 23
1.8 LAN Subsystem ............................................................................... 23
1.8.1 LAN Subsystem Drivers ......................................................... 23
1.8.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.9 Audio Subsystem............................................................................. 25
1.9.1 Audio Subsystem Software .................................................... 26
1.9.2 Audio Connectors and Headers ............................................... 26
1.10 Hardware Management Subsystem .................................................... 27
1.10.1 Hardware Monitoring............................................................. 27
1.10.2 Thermal Monitoring .............................................................. 28
1.11 Power Management ......................................................................... 29
1.11.1 ACPI................................................................................... 29
1.11.2 Hardware Support ................................................................ 32
1.11.3 ENERGY STAR*, E-Standby, and EuP Compliance ...................... 35
2 Technical Reference
2.1 Memory Map................................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1 Back Panel .......................................................................... 41
2.2.2 Component-side Connectors and Headers ................................ 43
2.3 BIOS Configuration Jumper Block....................................................... 54
2.4 Mechanical Considerations ................................................................ 56
2.4.1 Form Factor......................................................................... 56
2.5 Electrical Considerations ................................................................... 57
2.5.1 Fan Header Current Capability................................................ 57
2.5.2 Add-in Board Considerations .................................................. 57
vii
Intel Desktop Board D510MO Technical Product Specification
2.6 Thermal Considerations .................................................................... 57
2.6.1 Passive Heatsink Design in a Passive System Environment ......... 59
2.7 Power Consumption ......................................................................... 62
2.7.1 Minimum Load Configuration.................................................. 62
2.7.2 Maximum Load Configuration ................................................. 62
2.8 Reliability ....................................................................................... 63
2.9 Environmental ................................................................................ 64
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 65
3.2 BIOS Flash Memory Organization ....................................................... 66
3.3 Resource Configuration .................................................................... 66
3.3.1 PCI* Autoconfiguration.......................................................... 66
3.4 System Management BIOS (SMBIOS)................................................. 67
3.5 Legacy USB Support ........................................................................ 68
3.6 BIOS Updates ................................................................................. 69
3.6.1 BIOS Recovery..................................................................... 69
3.6.2 Custom Splash Screen .......................................................... 70
3.7 Boot Options................................................................................... 70
3.7.1 CD-ROM Boot ...................................................................... 70
3.7.2 Network Boot....................................................................... 70
3.7.3 Booting Without Attached Devices........................................... 71
3.7.4 Changing the Default Boot Device During POST ........................ 71
3.8 BIOS Security Features .................................................................... 72
4 Board Status and Error Messages
4.1 BIOS Beep Codes ............................................................................ 73
4.2 Front-panel Power LED Blink Codes .................................................... 74
4.3 BIOS Error Messages ....................................................................... 74
4.4 Port 80h POST Codes ....................................................................... 75
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 81
5.1.1 Safety Standards.................................................................. 81
5.1.2 European Union Declaration of Conformity Statement................ 82
5.1.3 Product Ecology Statements................................................... 83
5.1.4 EMC Regulations .................................................................. 87
5.1.5 Product Certification Markings (Board Level)............................. 88
5.2 Battery Disposal Information............................................................. 89
viii
Contents
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. LAN Connector LED Locations............................................................ 24
4. Back Panel Audio Connectors ............................................................ 26
5. Thermal Sensors and Fan Header....................................................... 28
6. Location of the Standby Power Indicator LED....................................... 34
7. Detailed System Memory Address Map ............................................... 38
8. Back Panel Connectors ..................................................................... 41
9. I/O Shield Reference Diagram ........................................................... 42
10. Component-side Connectors and Headers ........................................... 43
11. Connection Diagram for Front Panel Header ........................................ 51
12. Connection Diagram for Front Panel USB Header.................................. 53
13. Connection Diagram for Front Panel USB Header (with Intel Z-U130
USB Solid-State Drive, or Compatible Device, Support)......................... 53
14. Location of the BIOS Configuration Jumper Block ................................. 54
15. Board Dimensions ........................................................................... 56
16. Localized High Temperature Zones..................................................... 58
17. Fan Location Guide for Cassis Selection (Chassis Orientation is
Not Restricted)................................................................................ 61
Tables
1. Feature Summary............................................................................ 11
2. Board Components Shown in Figure 1-1 ............................................. 14
3. Supported Memory Configurations ..................................................... 18
4. LAN Connector LED States................................................................ 24
5. Audio Jack Support.......................................................................... 25
6. Effects of Pressing the Power Switch .................................................. 29
7. Power States and Targeted System Power........................................... 30
8. Wake-up Devices and Events ............................................................ 31
9. ENERGY STAR Requirements............................................................. 35
10. System Memory Map ....................................................................... 39
11. Component-side Connectors and Headers Shown in Figure 2-4............... 44
12. Serial Port Header (COM 1 and COM 2)............................................... 45
13. LVDS Data Connector (30-Pin) .......................................................... 45
14. LVDS Panel Voltage Selection Jumper ................................................. 46
15. Chassis Fan Header ......................................................................... 46
16. SATA Connectors............................................................................. 46
17. LVDS Inverter Power Connector......................................................... 47
18. LVDS Inverter Power Voltage Selection Jumper .................................... 47
19. Parallel Port Header ......................................................................... 48
20. Front Panel Wireless Activity LED Header ............................................ 48
21. S/PDIF Header ................................................................................ 48
22. Front Panel Audio Header for Intel HD Audio........................................ 49
23. Front Panel Audio Header for AC ’97 Audio .......................................... 49
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Intel Desktop Board D510MO Technical Product Specification
24. Front Panel USB Header ................................................................... 49
25. Front Panel USB Header (with Intel Z-U130 USB Solid-State Drive,
or Compatible Device, Support)......................................................... 49
26. Power Connector ............................................................................. 50
27. Front Panel Header .......................................................................... 51
28. States for a One-Color Power LED ...................................................... 52
29. BIOS Configuration Jumper Settings................................................... 55
30. Fan Header Current Capability........................................................... 57
31. Thermal Considerations for Components ............................................. 59
32. Minimum Load Configuration Current and Power Results ....................... 62
33. Maximum Load Configuration Current and Power Results....................... 63
34. Intel Desktop Board D510MO Environmental Specifications.................... 64
35. BIOS Setup Program Menu Bar .......................................................... 66
36. BIOS Setup Program Function Keys.................................................... 66
37. Acceptable Drives/Media Types for BIOS Recovery ............................... 69
38. Boot Device Menu Options ................................................................ 71
39. Supervisor and User Password Functions............................................. 72
40. BIOS Beep Codes ............................................................................ 73
41. Front-panel Power LED Blink Codes .................................................... 74
42. BIOS Error Messages ....................................................................... 74
43. Port 80h POST Code Ranges.............................................................. 75
44. Port 80h POST Codes ....................................................................... 76
45. Typical Port 80h POST Sequence........................................................ 79
46. Safety Standards............................................................................. 81
47. Lead-Free Board Markings ................................................................ 86
48. EMC Regulations ............................................................................. 87
49. Product Certification Markings ........................................................... 88
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of Intel Desktop Board D510MO.
Table 2. Feature Summary
Form Factor Mini-ITX, (6.7 inches by 6.7 inches [170 millimeters by 170 millimeters])
compatible with microATX
Processor Passively-cooled, soldered-down Dual-Core Intel® Atom™ processor with
integrated graphics and integrated memory controller
Memory
Chipset
Audio Multi-streaming 4+2 channel audio subsystem support based on the Realtek*
Internal Graphics Onboard Intel® graphics subsystem with support for:
Legacy I/O Control Winbond W83627THG-I based Legacy I/O controller for hardware management,
Peripheral
Interfaces
LAN Support 10/100/1000 Mbits/sec LAN subsystem using a Realtek 8111DL Gigabit Ethernet
• Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 800 MHz and DDR2 667 MHz DIMMs
• Support for up to 2 GB of system memory on a single DIMM (4 GB with
two DIMMs)
• Passively cooled, Intel
ALC662 high definition audio codec
• Integrated GMCH
• Analog displays (VGA)
• Flat Panel displays (optional LVDS interface)
serial, parallel, and PS/2* ports
• Seven USB 2.0 ports:
― Four back panel ports
― Three front panel ports (via two internal headers; one header (with one
port) supports an Intel
device)
• Two Serial ATA (SATA) 3.0 Gb/s connectors (supporting IDE and AHCI)
• One parallel port header
• Two serial port headers
• PS/2*-style keyboard and mouse ports
Controller
®
NM10 Express Chipset
®
Z-U130 USB Solid-State Drive (or compatible
continued
11
Intel Desktop Board D510MO Technical Product Specification
Table 2. Feature Summary (continued)
®
BIOS
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI* Local Bus Specification Revision 2.3
• Suspend to RAM support
• Wake on PCI, PCI Express*, PS/2, serial, front panel, USB ports, and LAN
• One PCI Conventional bus connector
• PCI Express x1 Mini Card connector
• Hardware monitoring through the Windbond I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• One fan header
• One fan sense input used to monitor fan activity
• Fan speed control
BIOS (resident in the SPI Flash device)
and SMBIOS
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Product Description
Table 3 lists the components identified in Figure 1.
Figure 1. Major Board Components
13
Intel Desktop Board D510MO Technical Product Specification
Table 3. Board Components Shown in Figure 1
Item/callout
from Figure 1
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
Descript
Back panel connectors
Serial port header (COM 1)
Parallel port header
Serial port header (COM 2)
LVDS inverter power voltage selection jumper (optional)
Chassis fan header
Power connector (2 x 12)
LVDS inverter power connector (optional)
Standby power LED
Intel Atom processor
LVDS inverter panel voltage selection header (optional)
DIMM channel A socket, DIMM 0
DIMM channel A socket, DIMM 1
LVDS panel connector (optional)
SATA connector 1
SATA connector 0
Front panel header
Battery
Front panel wireless activity LED header
Intel NM10 Express Chipset
Front panel USB header (with Intel Z-U130 USB Solid-State
Drive (or compatible device) support
PCI conventional bus connector
PCI Express x1 Mini Card connector
USB front panel header
Front panel audio header
BIOS setup configuration jumper block
S/PDIF header
ion
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board D510MO Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D510MO http://www.intel.com/products/motherboard/510MO/index.htm
Desktop Board Support http://www.intel.com/support/motherboards/desktop
Available configurations for the Intel
Desktop Board D510MO
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Integration information http://www.intel.com/support/go/buildit
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
http://www.intel.com/products/motherboard/D510MO/index.htm
025414.htm
1.3 Processor
The board has a passively-cooled, soldered-down Dual-Core Intel Atom processor with
integrated graphics and integrated memory controller.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
Power supply connectors Section 2.2.2.3, page 50
16
Product Description
1.3.1 Intel D510 Graphics Subsystem
1.3.1.1 Intel® Graphics Media Accelerator 3150 Graphics
Controller
The Intel GMA 3150 graphics controller features the following:
• 400 MHz core frequency
• High quality texture engine
⎯ DX9.0c* and OpenGL* 1.4 compliant
⎯ Hardware Pixel Shader 2.0
⎯ Vertex Shader Model 2.0
• 3D Graphics Rendering enhancements
⎯ 1.6 dual texture GigaPixel/s max fill rate
⎯ 16-bit and 32-bit color
⎯ Vertex cache
• Video
⎯ Software DVD at 30 fps full screen
⎯ DVMT support up to 256 MB
• Display
⎯ Supports analog displays up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ Optionally supports LVDS display up to 1366 x 768 (single channel, 18 bpp)
⎯ Dual independent display support with LVDS option
For information about Refer to
Obtaining graphics software and utilities Section 1.2, page 16
17
Intel Desktop Board D510MO Technical Product Specification
1.4 System Memory
The board has two 240-pin DDR2 DIMM sockets and supports the following memory
features:
• DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs
• 4 GB maximum total system memory
• Minimum total system memory: 256 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 800 MHz and DDR2 667 MHz DIMMs
NOTE
Due to passively-cooled thermal constraints, system memory must have an operating
temperature rating of 85
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the system memory area for maximum
heat dissipation effectiveness.
o
C.
NOTE
To be fully compliant with all applicable DDR2 SDRAM memory specifications, the
board should be populated with DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, performance and reliability may be impacted or the DIMMs may not
function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity Configuration
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)
and “SS” refers to single-sided memory modules (containing one row of SDRAM).
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
18
Product Description
1.5 Intel® NM10 Express Chipset
The Intel NM10 Express Chipset provides interfaces to the processor and the USB,
SATA, LPC, LAN, PCI, and PCIe interfaces. The Intel NM10 Express Chipset is a
centralized controller for the board’s I/O paths.
NOTE
The board is designed to be passively cooled in a properly ventilated chassis. Chassis
venting locations are recommended above the processor heatsink area for maximum
heat dissipation effectiveness.
For information about Refer to
The Intel NM10 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.5.1.1 Video Memory Allocation
Video memory is allocated from the total available system memory for the efficient
balancing of 2-D/3-D graphics performance and overall system performance. Dynamic
allocation of system memory to video memory is as follows:
• 256 MB total RAM results in 32 MB video RAM
• 512 MB total RAM results in 64 MB video RAM
• 1 GB total RAM results in 128 MB video RAM
• 2 GB total RAM results in 224 MB video RAM
1.5.1.2 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate.
1.5.1.3 Optional Flat Panel Interface (LVDS)
The optional flat panel interface (LVDS) supports the following:
• Panel support up to UXGA (1366 x 768)
• 25 MHz to 112 MHz single–channel; @18 bpp
⎯ TFT panel type
• Panel fitting, panning, and center mode
• CPIS 1.5 compliant
• Spread spectrum clocking
• Panel power sequencing
• Integrated PWM interface for LCD backlight inverter control
19
Intel Desktop Board D510MO Technical Product Specification
1.5.1.4 Configuration Modes
For monitors attached to the VGA port, video modes supported by this board are
based on the Extended Display Identification Data (EDID) protocol.
Video mode configuration for LVDS displays is supported as follows:
• Automatic panel identification via Extended Display Identification Data (EDID) for
LVDS panels supporting EDID protocol.
• Manual LVDS panel configuration through the BIOS setup page. This feature
allows the manual entry of critical panel settings (equivalent to the 18-byte
Detailed Timings Descriptor structure defined by the VESA EDID specification) for
non-EDID panel support.
In addition, BIOS setup provides the following configuration parameters for LVDS
displays:
• Screen Brightness: allows the end-user to set screen brightness for the display.
• Maintain Aspect Ratio: allows the end-user to select whether the native aspect
ratio is to be preserved during POST and before the video driver is loaded.
• LVDS Configuration Changes: allows the system integrator to “lock” critical settings
of the LVDS configuration to avoid end-users potentially rendering the display
unusable (refer to Note 1).
• Inverter Frequency and Polarity: allows the system integrator to set the operating
frequency and polarity of the panel inverter board.
• Minimum Inverter Current Limit (%): allows the system integrator to set minimum
PWM%, as appropriate, according to the power requirements of the LVDS display
and the selected inverter board.
NOTE
Support for LVDS configuration complies with the following:
1. “Unlocking” of critical settings of the LVDS configuration is supported via Intel
Integrator Toolkit’s command-line tool.
2. Critical settings of the LVDS configuration are not exposed through Intel Integrator
Toolkit or Intel
3. Critical settings of the LVDS configuration will not be overwritten by loading BIOS
setup defaults.
4. Critical settings of the LVDS configuration will be preserved across BIOS updates.
®
Integrator Assistant GUIs.
®
20
Product Description
1.5.2 USB
The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers. The port arrangement is as follows:
• Four ports are implemented with stacked back panel connectors
• Three front panel ports (via two internal headers; one header (with one port)
supports an Intel
NOTE
One of the front panel USB headers supports an Intel Z-U130 USB Solid-State Drive
(or compatible device).
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 8, page 41
The location of the front panel USB headers Figure 10, page 43
®
Z-U130 USB Solid-State Drive (or compatible device)
1.5.3 SATA Support
The board provides two SATA interface connectors that support one device per
connector.
The board’s SATA controller offers independent SATA ports with a theoretical
maximum transfer rate of 3.0 Gbits/sec on each port. One device can be installed on
each port for a maximum of two SATA devices. A point-to-point interface is used for
host to device connections, unlike PATA which supports a master/slave configuration
and two devices on each channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller supports IDE and AHCI configuration and can operate in
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources
are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus
resource steering is used. Native mode is the preferred mode for configurations using
the Windows* XP and Windows Vista* operating systems.
For information about Refer to
Obtaining AHCI driver Section 1.2, page 16
The location of the SATA connectors Figure 10, page 43
21
Intel Desktop Board D510MO Technical Product Specification
1.6 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.7 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• Two serial port headers
• One parallel port header with Extended Capabilities Port (ECP) and Enhanced
Parallel Port (EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
• PS/2-style keyboard and mouse ports
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.7.1 Serial Port Headers
The serial port headers, COM 1 and COM 2, are implemented as two 10-pin headers on
the board. The serial port headers support data transfers at speeds up to
115.2 kbits/s with BIOS support.
For information about Refer to
The location of the serial port headers Figure 10, page 43
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Product Description
1.7.2 Parallel Port Header
The parallel port header is implemented as a 26-pin header on the board. Use the
BIOS Setup program to set the parallel port mode.
For information about Refer to
The location of the parallel port header Figure 10, page 43
1.8 LAN Subsystem
The LAN subsystem consists of the following:
• Intel NM10 Express Chipset
• Realtek 8111DL Gigabit Ethernet Controller for 10/100/1000 Mbits/sec Ethernet
LAN connectivity
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface that supports the ethernet controller
• PCI Conventional bus power management
⎯ Supports ACPI technology
⎯ Supports LAN wake capabilities
1.8.1 LAN Subsystem Drivers
LAN drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN drivers Section 1.2, page 16
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Intel Desktop Board D510MO Technical Product Specification
1.8.2 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 3).
Figure 3. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the
10/100/1000 Mbits/sec LAN subsystem is operating.
Table 5. LAN Connector LED States
LED Color State Condition
Activity (A)
Speed (B)
Green Blinking LAN activity occurring
N/A Off 10 Mb/s data rate
Green On 100 Mb/s data rate
Yellow On 1000 Mb/s data rate
24
Product Description
1.9 Audio Subsystem
The board supports the Intel High Definition Audio subsystem. The audio subsystem
consists of the following:
• Intel NM10 Express Chipset
• Realtek ALC662 audio codec
The audio subsystem has the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Front panel Intel HD Audio and AC ’97 audio support
• 3-port analog audio out stack
• Internal S/PDIF out header
• Windows Vista Basic certification
• A signal-to-noise (S/N) ratio of 95 dB
• Independent 5.1 audio playback from back panel connectors and stereo playback
from the Intel High Definition Audio front panel header.
• 4+2 channel in multi-streaming mode
Table 6 lists the supported functions of the front panel and back panel audio jacks.
Table 6. Audio Jack Support
Audio Jack
Front panel – Green No Yes No No No Yes
Front panel – Pink No No No No Yes No
Back panel – Blue Yes No Yes No No No
Back panel – Green No Yes No No No Yes
Back panel – Pink No No No Yes Yes No
Line In
Line/
Front Out Rear Out
Center/
LFE
MIC
Headphones
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Intel Desktop Board D510MO Technical Product Specification
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors)
• S/PDIF audio 1 x 3-pin header
Item Description
A Line in
B Line out
C Mic in
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 10, page 43
The signal names of the front panel audio header and S/PDIF header Section 2.2.2.1. page 45
The back panel audio connectors Figure 4. page 26
26
Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Thermal and voltage monitoring
• Chassis intrusion detection
1.10.1 Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Winbond
W83627THG-I device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP
• SMBus interface
27
Intel Desktop Board D510MO Technical Product Specification
1.10.2 Thermal Monitoring
Figure 5 shows the locations of the thermal sensors and fan header.
Item Description
A Chassis fan header
B Thermal diode, located on the processor die
C Remote thermal sensor
Figure 5. Thermal Sensors and Fan Header
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