Intel BLKD102GGC2, BOXD102GGC2L, D102GGC2 Technical Product Specification
Intel® Desktop Board
D102GGC2
Technical Product Specification
The Intel® Desktop Board D102GGC2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D102GGC2 Specification Update.
April 2006
Order Number: D44278-001US
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D102GGC2 Technical Product
Specification.
This product specification applies to only standard Intel Desktop Board D102GGC2 with BIOS
identifier GC11020M.86A.
Changes to this specification will be published in the Intel Desktop Board D102GGC2
Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
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WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
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rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not
provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
April 2006
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
®
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2006, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for the Intel
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
D102GGC2 and its components to the vendors, system integrators, and other engineers and
technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D102GGC2
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
Desktop Board D102GGC2. It
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D102GGC2 Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the board, and X is the instance of the particular part at that
general location. For example, J5J1 is a connector, located at 5J. It is the first connector in
the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview......................................................................................................................10
1.1.1 Feature Summary..........................................................................................10
1.1.2 Manufacturing Options ..................................................................................11
1.1.3 Board Layout.................................................................................................12
1.1.4 Block Diagram...............................................................................................14
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.5 ATI Radeon* Xpress 200 Chipset................................................................................17
1.5.1 Graphics Subsystem .....................................................................................17
1.5.2 Firmware Hub (FWH) ....................................................................................17
1.5.3 USB...............................................................................................................17
1.5.4 IDE Support...................................................................................................18
1.5.5 Real-Time Clock, CMOS SRAM, and Battery................................................20
1.6 PCI Express* Connectors ............................................................................................24
1.7 Legacy I/O Controller...................................................................................................24
1.7.1 Serial Port......................................................................................................24
1.7.2 Parallel Port...................................................................................................25
1.7.3 Diskette Drive Controller................................................................................25
1.7.4 Keyboard and Mouse Interface .....................................................................25
1.8 High Definition Audio Subsystem.................................................................................26
1.8.1 Audio Subsystem Software ...........................................................................26
1.8.2 Audio Connectors..........................................................................................27
1.9 LAN Subsystem ...........................................................................................................28
1.9.1 LAN Subsystem Software..............................................................................28
1.10 Hardware Management Subsystem.............................................................................29
1.10.1 Fan Monitoring...............................................................................................29
1.10.2 Chassis Intrusion and Detection....................................................................29
1.11 Power Management.....................................................................................................29
1.11.1 ACPI..............................................................................................................30
1.11.2 Hardware Support .........................................................................................32
2 Technical Reference
2.1 Memory Map................................................................................................................37
2.2 DMA Channels.............................................................................................................38
2.3 Fixed I/O Map...............................................................................................................39
2.4 Interrupts......................................................................................................................40
2.5 PCI Configuration Space Map......................................................................................41
2.6 PCI Conventional Interrupt Routing Map .....................................................................41
2.7 Connectors...................................................................................................................42
2.7.1 Back Panel Connectors.................................................................................43
2.7.2 Component-side Connectors.........................................................................44
2.7.3 Front Panel USB Connectors........................................................................50
2.8 Jumper Block ...............................................................................................................51
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Intel Desktop Board D102GGC2 Technical Product Specification
2.9 Mechanical Considerations..........................................................................................52
2.9.1 Form Factor...................................................................................................52
2.9.2 I/O Shield.......................................................................................................53
2.10 Electrical Considerations..............................................................................................54
2.10.1 DC Loading....................................................................................................54
2.10.2 Add-in Board Considerations.........................................................................54
2.10.3 Fan Connector Current Capability.................................................................55
2.10.4 Power Supply Considerations .......................................................................55
2.11 Thermal Considerations...............................................................................................56
2.12 Reliability......................................................................................................................58
2.13 Environmental..............................................................................................................59
2.14 Regulatory Compliance................................................................................................60
2.14.1 Safety Regulations ........................................................................................60
2.14.2 European Union Declaration of Conformity Statement..................................60
2.14.3 Product Ecology Statements.........................................................................62
2.14.4 EMC Regulations...........................................................................................65
2.14.5 Product Certification Markings (Board Level)................................................66
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................67
3.2 BIOS Flash Memory Organization ...............................................................................68
3.3 Resource Configuration ...............................................................................................68
3.3.1 PCI Autoconfiguration....................................................................................68
3.3.2 PCI IDE Support............................................................................................68
3.4 System Management BIOS (SMBIOS) ........................................................................69
3.5 Legacy USB Support....................................................................................................69
3.6 BIOS Updates..............................................................................................................70
3.6.1 Language Support.........................................................................................70
3.6.2 Custom Splash Screen..................................................................................70
3.7 Boot Options ................................................................................................................71
3.7.1 CD-ROM Boot ...............................................................................................71
3.7.2 Network Boot.................................................................................................71
3.7.3 Booting Without Attached Devices................................................................71
3.7.4 Changing the Default Boot Device During POST..........................................71
3.8 Adjusting Boot Speed...................................................................................................72
3.8.1 Peripheral Selection and Configuration.........................................................72
3.8.2 BIOS Boot Optimizations...............................................................................72
3.9 BIOS Security Features ...............................................................................................73
4 Error Messages and Beep Codes
4.1 Speaker ....................................................................................................................... 75
4.2 BIOS Beep Codes........................................................................................................75
4.3 BIOS Error Messages..................................................................................................75
4.4 Port 80h POST Codes .................................................................................................76
vi
Figures
1. Board Components......................................................................................................12
2. Block Diagram..............................................................................................................14
3. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......27
4. LAN Connector LED Locations....................................................................................28
5. Location of the Standby Power Indicator LED .............................................................35
6. Back Panel Connectors................................................................................................43
7. Component-side Connectors .......................................................................................44
8. Connection Diagram for Front Panel Connector..........................................................49
9. Connection Diagram for Front Panel USB Connectors................................................50
10. Location of the Jumper Block.......................................................................................51
11. Board Dimensions........................................................................................................52
12. I/O Shield Dimensions..................................................................................................53
13. Processor Heatsink for Omni-directional Airflow..........................................................56
14. Localized High Temperature Zones.............................................................................57
Tables
1. Feature Summary ........................................................................................................10
2. Manufacturing Options.................................................................................................11
3. Board Components Shown in Figure 1........................................................................13
4. Supported Memory Configurations ..............................................................................16
5. LAN Connector LED States .........................................................................................28
6. Effects of Pressing the Power Switch ..........................................................................30
7. Power States and Targeted System Power .................................................................31
8. Wake-up Devices and Events......................................................................................31
9. System Memory Map ...................................................................................................37
10. DMA Channels.............................................................................................................38
11. I/O Map ........................................................................................................................39
12. Interrupts......................................................................................................................40
13. PCI Configuration Space Map......................................................................................41
14. PCI Interrupt Routing Map ...........................................................................................41
15. Back Panel Connectors Shown in Figure 6..................................................................43
16. Component-side Connectors Shown in Figure 7 .........................................................45
17. Front Panel Audio Connector.......................................................................................45
18. Chassis Intrusion Connector........................................................................................46
19. Serial ATA Connectors.................................................................................................46
20. Processor Fan Connector............................................................................................46
21. Chassis Fan Connectors..............................................................................................46
22. Main Power Connector.................................................................................................47
23. ATX12V Power Connector...........................................................................................47
24. Auxiliary Front Panel Power/Sleep LED Connector.....................................................48
25. Front Panel Connector.................................................................................................48
26. States for a One-Color Power LED..............................................................................49
27. States for a Two-Color Power LED..............................................................................49
28. BIOS Setup Configuration Jumper Settings.................................................................51
29. DC Loading Characteristics .........................................................................................54
30. Fan Connector Current Capability................................................................................55
31. Thermal Considerations for Components ....................................................................58
Contents
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Intel Desktop Board D102GGC2 Technical Product Specification
32. Environmental Specifications.......................................................................................59
33. Safety Regulations.......................................................................................................60
34. Lead-Free Board Markings ..........................................................................................64
35. EMC Regulations.........................................................................................................65
36. Product Certification Markings.....................................................................................66
37. BIOS Setup Program Menu Bar...................................................................................68
38. BIOS Setup Program Function Keys............................................................................68
39. Boot Device Menu Options ..........................................................................................71
40. Supervisor and User Password Functions...................................................................73
41. Beep Codes .................................................................................................................75
42. BIOS Error Messages..................................................................................................75
43. Port 80h POST Code Ranges......................................................................................76
44. Port 80h POST Codes .................................................................................................77
45. Typical Port 80h POST Sequence...............................................................................80
viii
1 Product Description
What This Chapter Contains
1.1 Overview......................................................................................................................10
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.5 ATI Radeon* Xpress 200 Chipset................................................................................17
1.6 PCI Express* Connectors ............................................................................................24
1.7 Legacy I/O Controller...................................................................................................24
1.8 High Definition Audio Subsystem.................................................................................26
1.9 LAN Subsystem ...........................................................................................................28
1.10 Hardware Management Subsystem.............................................................................29
1.11 Power Management.....................................................................................................29
9
Intel Desktop Board D102GGC2 Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Video
Audio
Legacy I/O Control
USB
Peripheral
Interfaces
LAN Support
BIOS
Expansion
Capabilities
Instantly Available
PC Technology
Hardware Monitor
Subsystem
(controlled by SMSC
SCH5017 I/O
controller)
microATX (9.60 inches by 8.60 inches [243.84 millimeters by 218.44 millimeters])
Support for the following:
®
• Intel
• Intel
• Intel
• Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 533 MHz and DDR2 400 MHz DIMMs
• Support for up to 2 GB of system memory
• ATI Radeon* Xpress 200 Northbridge
• ATI IXP 450 Southbridge
• 4 Mbit Firmware Hub (FWH)
ATI Radeon X300 integrated graphics
High Definition Audio subsystem using the Realtek ALC883 audio codec
SMSC SCH5017 Legacy I/O controller for hardware management, diskette drive,
serial, parallel, and PS/2* ports
Support for USB 2.0 devices
• Eight USB ports
• One serial port
• One parallel port
• Four Serial ATA interfaces
• Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2 keyboard and mouse ports
10/100 Mbits/sec LAN subsystem using the Realtek 8101L LAN adapter device
Intel
• Two PCI Conventional* bus connectors
• One PCI Express* x1 bus add-in card connector
• One PCI Express x16 bus add-in card connector
• Support for PCI Local Bus Specification Revision 2.2
• Support for PCI Express Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
Pentium® D processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Pentium® 4 processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Celeron® D processor in an LGA775 socket with a 533 MHz system bus
®
BIOS resident in the 4 Mbit FWH
10
Product Description
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 2. Manufacturing Options
SATA RAID
For information about Refer to
Available configurations for the Desktop Board D102GGC2 Section 1.1.4, page 14
Support for RAID 0 (data striping) and RAID 1 (data mirroring) on the SATA ports
11
Intel Desktop Board D102GGC2 Technical Product Specification
1.1.3 Board Layout
Figure 1 shows the location of the major components.
DD
CC
BB
AA
W
A
DC
B
E
F
G
H
Z
Y
X
I
J
V
U
T RS
Figure 1. Board Components
Table 3 lists the components identified in Figure 1.
K
L
O N MPQ
OM18247
12
Table 3. Board Components Shown in Figure 1
Item/callout
from Figure 1 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
BB
CC
DD
Front panel audio connector
Audio codec
PCI Express x16 add-in card connector
Ethernet device
Back panel connectors
+12V power connector (ATX12V)
Rear chassis fan connector
LGA775 processor socket
ATI Radeon Xpress 200 Northbridge
DIMM Channel A sockets [2]
Processor fan connector
Chassis intrusion connector
Legacy I/O controller
Main power connector
Diskette drive connector
Parallel ATE IDE connectors [2]
Battery
Front chassis fan connector
Serial ATA connectors [4]
Auxiliary front panel power LED connector
Front panel connector
4 Mbit Firmware Hub (FWH)
IXP 450 Southbridge
Speaker
Front panel USB connector
BIOS Setup configuration jumper block
PCI Conventional bus add-in card connectors [2]
Front panel USB connector
PCI Express x1 bus add-in card connector
Standby power indicator LED
Product Description
13
Intel Desktop Board D102GGC2 Technical Product Specification
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
PCI Express x1 Slot 1 PCI Express x1 Interface
Parallel ATA
IDE Connectors (2)
Parallel ATA
IDE Interface
SMSC
SCH5017
Legacy
I/O
Controller
USB
Back Panel/
Front Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse
PS/2 Keyboard
LGA775
Processor Socket
VGA
Port
Channel A
DIMMs (2)
PCI Slot 1
PCI Slot 2
System Bus
(800/533 MHz)
ATI Radeon Xpress 200
Northbridge
Display Interface
Memory Bus
PCI Bus
SMBus
SMBus
PCI Express x4
Diskette Drive
Connector
LPC Bus
ATI IXP 450
Interface
Southbridge
High Definition Audio Link
Realtek
ALC883
Audio
Codec
PCI Bus
Realtek
8101L
LAN Controller
Serial ATA
IDE Interface
Line In or Rear Left/Right Out
Line Out or Front Left/Right Out
Mic In or Center/LFE Out
Line Out [Front Panel]
Mic In [Front Panel]
4 Mbit
Firmware Hub
(FWH)
LAN
Connector
Serial ATA IDE
Connectors (4)
= connector or socket
14
Figure 2. Block Diagram
OM18294
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D102GGC2 under
“Desktop Board Products” or “Desktop
Board Support”
Available configurations for the Desktop
Board D102GGC2
Processor data sheets http://www.intel.com/products/index.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/gc2/gc2_available.htm
1.3 Processor
The board is designed to support the following processors:
• Intel Pentium
• Intel Pentium
• Intel Celeron D processor in an LGA775 processor socket with a 533 MHz system bus
For information about… Refer to:
Supported processors for the
D102GGC2 board
D processor in an LGA775 processor socket with an 800 or 533 MHz system bus
4 processor in an LGA775 processor socket with an 800 or 533 MHz system bus
http://www.intel.com/design/motherbd/gc2/gc2_documentation.htm
Product Description
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.7.2.1, page 47
15
Intel Desktop Board D102GGC2 Technical Product Specification
1.4 System Memory
The board has two 240-pin DIMM sockets and supports the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 2 GB maximum total system memory.
• Minimum total system memory: 128 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 533 or DDR2 400 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read the SPD data and program the chipset to accurately configure memory settings
for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly
configure the memory settings, but performance and reliability may be impacted or the DIMMs
may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
Configuration
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
16
Product Description
1.5 ATI Radeon* Xpress 200 Chipset
The ATI Radeon Xpress 200 chipset consists of the following devices:
• ATI Radeon Xpress 200 Northbridge
• IXP 450 Southbridge
The ATI Radeon Xpress 200 Northbridge is a centralized controller for the system bus, the memory
bus, and the PCI Express bus. The ATI Radeon Xpress 200 Northbridge also provides integrated
graphics capabilities supporting 3D, 2D and display capabilities. The IXP 450 is a centralized
controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.
For information about Refer to
The ATI Radeon Xpress 200 Northbridge http://www.ati.com/
The IXP 450 Southbridge http://www.ati.com/
Resources used by the chipset Chapter 2
1.5.1 Graphics Subsystem
The board contains two separate, mutually exclusive graphics options. Either the integrated
graphics processor (based on the ATI Radeon X300 core contained within the ATI Radeon
Xpress 200 Northbridge) is used, or a PCI Express x16 add-in card can be used.
1.5.2 Firmware Hub (FWH)
The Firmware Hub provides the nonvolatile storage of the Intel BIOS.
1.5.3 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The IXP 450 Southbridge provides the USB controller for all ports. The port arrangement is as
follows:
• Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
• Four ports are routed to two separate front panel USB connectors
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 6, page 43
The location of the front panel USB connectors Figure 7, page 44
17
Intel Desktop Board D102GGC2 Technical Product Specification
1.5.4 IDE Support
The board provides six IDE interface connectors:
• Two parallel ATA IDE connector that supports two devices
• Four serial ATA IDE connectors that support one device per connector
1.5.4.1 Parallel ATE IDE Interface
The IXP 450’s Parallel ATA IDE controller has two bus-mastering Parallel ATA IDE interfaces.
The Parallel ATA IDE interfaces support the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The IXP 450’s
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
• ATA-133: DMA protocol on IDE bus allows host and target throttling. The IXP 450’s
ATA-133 logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer
rates in excess of 100 MB/sec.
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
For information about Refer to
The location of the Parallel ATA IDE connectors Figure 7, page 44
18
Product Description
1.5.4.2 Serial ATA Interfaces
The IXP 450’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows* XP and Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors Figure 7, page 44
1.5.4.3 Serial ATA RAID (Optional)
As a manufacturing option, the board’s Serial ATA controller supports the following RAID
(Redundant Array of Independent Drives) levels:
• RAID 0 - data striping. Multiple physical drives can be teamed together to create one logical
drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus
increasing the throughput. The Serial ATA controller allows for more than two drives to be
used in a RAID 0 configuration.
• RAID 1 - data mirroring. Multiple physical drives maintain duplicate sets of all data on
separate disk drives. Level 1 provides the highest data reliability because two complete copies
of all information are maintained. The Serial ATA controller allows for two or four drives to
be used in a RAID 1 configuration.
19
Intel Desktop Board D102GGC2 Technical Product Specification
1.5.5 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS
RAM (for example, the date and time) might not be accurate. Replace the battery with an
equivalent one. Figure 1 on page 12 shows the location of the battery.
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled
where possible. Disposal of used batteries must be in accordance with local environmental
regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées
doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit
respecter les réglementations locales en vigueur en matière de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt
genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende
miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i
henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de
lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista.
Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch
denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden.
Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.
20
Product Description
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo
pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate,
seguire le istruzioni del produttore.
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas
iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de
las pilas usadas, siga igualmente las instrucciones del fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij.
Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte
batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias
devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de
acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны,
па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з
мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly
být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η µπαταρία αντικατασταθεί από µία λανθασµένου
τύπου. Οι µπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των
χρησιµοποιηµένων µπαταριών πρέπει να γίνεται σύµφωνα µε τους κατά τόπο περιβαλλοντικούς
κανονισµούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint
újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell
kiselejtezni.
21
Intel Desktop Board D102GGC2 Technical Product Specification
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya
dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar
tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte
baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony
środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie
reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale
privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať
v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
22
Product Description
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей
має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
23
Intel Desktop Board D102GGC2 Technical Product Specification
1.6 PCI Express* Connectors
The board provides the following PCI Express connectors:
• One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec
• One PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to
500 MBytes/sec
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the
underlying PCI Express architecture is compatible with PCI Conventional compliant operating
systems. Additional features of the PCI Express interface include the following:
• Support for the PCI Express enhanced configuration mechanism
• Automatic discovery, link training, and initialization
• Support for Active State Power Management (ASPM)
• SMBus 2.0 support
• Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
• Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
1.7 Legacy I/O Controller
The SMSC SCH5017 Legacy I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.7.1 Serial Port
The Serial port A connector is located on the back panel. The serial port supports data transfers at
speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 6, page 43
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