Intel BKCMCM2FBAV3 Product Data Sheet
Intel® NUC Pro Chassis Element
CMCM2FB and CMCM2FBAV
Product Specification
Revision 1.0
Regulatory Model: CMCM2FB
August 2020
Intel® NUC Pro Chassis Element CMCM2FB or CMCM2FBAV may contain design defects or errors known as errata that may cause the product to
deviate from published specifications. Current characterized errata, if any, are documented in this product specification.
Revision History
Revision
Revision History
Date
1.0
First release
August 2020
Disclaimer
This product specification applies to only the standard Intel® NUC Pro Chassis Element with product codes
BKCMCM2FB and BKCMCM2FBAV.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT.
EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO
LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR
ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL
INJURY OR DEATH MAY OCCUR.
All Intel® NUC Pro Chassis Elements are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this
product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems,
test equipment, etc. may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does
not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or
other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or
“undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each
processor family, not across different processor families: Go to:
Learn About Intel® Processor Numbers
Intel® NUC Pro Chassis Elements may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product
order.
Intel, the Intel logo and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2020 Intel Corporation. All rights reserved.
iii
Preface
This Product Specification specifies the layout, components, connectors, power and
environmental features for the Intel® NUC Pro Chassis Element
NOTE
In this document, the use of “Intel® NUC Pro Chassis Element” will refer to the CMCM2FB and
CMCM2FBAV versions of the Intel® NUC Pro Chassis Element.
Intended Audience
The document is intended to provide technical information about Intel® NUC Pro Chassis Element
and its components to the vendors, system integrators, and other engineers and technicians who
need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter
Description
1
A description of the Intel® NUC Pro Chassis Element features
2
A technical description of the Intel® NUC Pro Chassis Element
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of
these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iv
Other Common Notation
#
Used after a signal name to identify an active-low signal (such as USBP0#)
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
KB
Kilobyte (1024 bytes)
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
MB/s
Megabytes per second
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
Xxh
An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their respective
owners.
v
Intel® NUC Pro Chassis Element Identification Information
NUC Pro Chassis Element Identification Information
SA Revision
Product Code
Capture Card
AC Cord
Notes
K93662-202
BKCMCM2FB
No
None
1
K93662-202
BKCMCM2FB1
No
US 1 K93662-202
BKCMCM2FB2
No
EU 1 K93662-202
BKCMCM2FB3
No
UK 1 K93662-202
BKCMCM2FB4
No
AU 1 K93663-202
BKCMCM2FBAV
Yes
None
1
K93663-202
BKCMCM2FBAV1
Yes
US
1
K93663-202
BKCMCM2FBAV2
Yes
EU
1
K93663-202
BKCMCM2FBAV3
Yes
UK 1 K93663-202
BKCMCM2FBAV4
Yes
AU
1
Notes:
1. The SA number is found on the bottom of the chassis
vi
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to
the Intel® NUC Pro Chassis Element CMCM2FB and CMCM2FBAV.
Specification Changes or Clarifications
Date
Type of Change
Description of Changes or Clarifications
Errata
Current characterized errata, if any, will be documented in Section 3 of this Product Specification.
vii
Contents
Revision History ............................................................................................................... ii
Disclaimer .................................................................................................................................................................. ii
Preface .............................................................................................................................. iii
Intended Audience ................................................................................................................................................ iii
What This Document Contains ........................................................................................................................ iii
Typographical Conventions .............................................................................................................................. iii
Intel® NUC Pro Chassis Element Identification Information ................................................................. v
Specification Changes or Clarifications ........................................................................................................ vi
Errata ........................................................................................................................................................................... vi
Contents .......................................................................................................................... vii
1 Product Description .................................................................................................. 9
1.1 Overview ......................................................................................................................................................... 9
1.2 Version Summary ........................................................................................................................................ 9
1.3 Feature Summary ..................................................................................................................................... 10
2 Technical Reference ............................................................................................... 11
2.1 Block Diagrams .......................................................................................................................................... 11
2.2 Features ........................................................................................................................................................ 13
2.3 Power............................................................................................................................................................. 14
2.4 M.2 Connectors ......................................................................................................................................... 15
2.5 Intel® vPro® Technology ........................................................................................................................ 15
2.6 Display Emulation .................................................................................................................................... 16
2.7 Wireless Enable/Disable Jumper ...................................................................................................... 17
2.8 Mechanical .................................................................................................................................................. 18
2.8.1 Form Factor .............................................................................................................................. 18
2.8.2 Weights ...................................................................................................................................... 19
2.9 Thermal ........................................................................................................................................................ 19
2.10 Environmental ........................................................................................................................................... 20
3 Characterized Errata ............................................................................................... 21
Figures
Figure 1. CMCM2FB Block Diagram .................................................................................................................... 11
Figure 2. CMCM2FBAV Block Diagram .............................................................................................................. 12
Figure 3. CMCM2FB/CMCM2FBAV Front Panel ............................................................................................. 13
Figure 4. CMCM2FB Back Panel ........................................................................................................................... 13
Figure 5. CMCM2FBAV Back Panel ..................................................................................................................... 14
Figure 6. Wireless Enable/Disable Jumper Location .................................................................................. 17
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