Intel Bay Trail Series Technical Manual
TECHNICAL MANUAL
Of
Intel Bay Trail Series CPU
Based Mini-ITX M/B
NO. G03-NC52-F
Revision: 1.0
Release date: February 6, 2015
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION ...........................................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION .......................................................................................iv
ITEM CHECKLIST .....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION .........................................................................................................2
1-3 LAYOUT DIAGRAM ....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................7
2-2 CONNECTORS AND HEADERS................................................................................10
2-2-1 CONNECTORS .............................................................................................10
2-2-2 HEADERS .....................................................................................................12
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................16
3-2 BIOS MENU SCREEN ................................................................................................17
3-3 FUNCTION KEYS .......................................................................................................17
3-4 GETTING HELP ..........................................................................................................18
3-5 MEMU BARS...............................................................................................................18
3-6 MAIN MENU ................................................................................................................19
3-7 ADVANCED MENU .....................................................................................................20
3-8 CHIPSET MENU..........................................................................................................26
3-9 SECURITY MENU .......................................................................................................29
3-10 BOOT MENU...............................................................................................................30
3-11 SAVE & EXIT MENU...................................................................................................31
TABLE OF CONTENT
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition February 6, 2015
Item Checklist
Motherboard
DVD for motherboard utilities
User’s Manual
Cable(s)
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Bay Trail Series Processor, with low power consumption never
denies high performance
Support 2 * DDR3L 1066/1333 MHz SO-DIMM up to 16GB, support dual channel
function
Onboard RTL8111G Gigabit Ethernet LAN chip
Integrated ALC887 HD audio chip
Support full-size Mini-PCIE connector
Support m-SATA connector
Support USB 3.0 data transport demands
Integrated with 24-bit dual channel LVDS header
Support VGA display output & DVI-D display output
Support 1 * SATAII (3Gb/s) Device
Supports ACPI S3 Function
Support CPU Smart FAN
Support Thunder Protection Function
Compliance with EuP Standard
All Solid Capacitor design
2
1-2 Specification
Spec Description
Design
Mini-ITX form factor ;
PCB size: 17.0 x 17.0 cm
Embedded CPU
Intel® Bay Trail-D/M/I series CPU
Memory Slot
2* DDR3L SO-DIMM slot for un-buffered 2* 1066/1333
MHz
DDR3L SO-DIMM expandable to 16GB
Support dual channel function
Expansion Slot
1* Full-size Mini-PCIE slot
Storage
1* SATA II 3G/s Connector
1 * M-SATA Connector
LAN Chip
Integrated with Realtek RTL8111G PCI-E Gigabit LAN
chip
Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
Audio Chip
Realtek ALC887 HD Audio Codec integrated
Audio driver and utility included
BIOS
64M DIP Flash ROM
Multi I/O
Rear Panel I/O:
1* PS/2 keyboard connector
1* PS/2 mouse connector
1 * VGA port
1 * DVI-D port
1* USB 3.0 port
2* USB 2.0/1.1 port
1* RJ-45 LAN port
1* Audio Line-in connector
1* Audio Line-out connector
1* Audio MIC connector
Internal I/O Connectors& Headers:
3
1 *24-pin main power connector
1*CPU fan connector
1*System fan connector
1 * Front panel audio header
1 * HDMI_SPDIF header
1 * COM header
1 * Front panel header
1* LVDS inverter header
1 * LVDS header
1-3 Layout Diagram
Rear IO Diagram
MIC-IN
Line-OUT
PS/2
Keyboard Port
USB 2.0 Ports
RJ-45 LAN Port
PS/2
Mouse Port
DVI-
D Port
VGA Port
USB 3.0 Port
Line-IN
4
Motherboard Internal Diagram
Note: 1. Priority should be given to SODIMM1 slot when installing only one compatible memory
modules. 2. The module should be DDR3L 1.35V SODIMM and not exceeding 8GB total capacity.
Intel CPU
LVDS Header
Front Panel
Audio Header
Front Panel Header
M-SATA
Hard Disk
Connector
SATAII Port
(SATA2)
PS/2 Keyboard
over
PS/2 Mouse Port
USB 3.0 Port
Audio
Connectors
SYSFAN Header
Full-Size
Mini-PCIE
Connector
CPUFAN Header
Serial Port Header
HDMI_SPDIF
Header
VGA Port
DVI-D Port
USB 2.0 Ports
ATXPWR
Main
Power connector
LVDS Inverter
DDR3L
SODIMM Slot
(SODIMM1)
DDR3L
SODIMM Slot
(SODIMM2)
5
Motherboard Jumper Position
Jumper
Jumper Name Description
JP3 INVERTER1 Back Light VCC 3.3V/5V/12V Select 4-pin Block
JP4 LVDS VCC 3.3V/5V/12V Select 4-pin Block
JBAT CMOS RAM Clear Function Setting 3-pin Block
ME_RTC
Clear ME RTC Function Setting
2-pin Block
JP6 Mini-PCIE (MMPE) Slot VCC 3.3V/3VSB Select
3-pin Block
JP8 K/B Power on Function Select
3-pin Block
JBAT
JP8
JP6
JP4
JP3
ME_RTC
6
Connectors
Connector Name
ATXPWR 24-pin Main Power Connector
KB/MS(Top) PS/2 Mouse Connector
KB/MS(Bottom) PS/2 Keyboard Connector
VGA Video Graphic Attach Connector
DVI DVI-D Connector
USB3_0 USB 3.0 Port Connector
UL1(Middle & Bottom) USB 2.0 Port Connector x2
UL1(Top) RJ-45 LAN Connector
AUDIO (Top) Audio Line In Connector
AUDIO (Middle) Audio Line Out Connector
AUDIO (Bottom) Audio MIC Connector
SATA2 SATAII Connector
MINIPE Full-size Mini-PCIE Connector
MSATA Full-size Mini-SATA Connector
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin Block
HDMI_SPDIF HDMI_SPDIF Out Header 2-pin Block
COM Serial Port Header 9-pin Block
JW_FP
Front Panel Header(PWR LED/ HD
LED/Power Button /Reset)
9-pin Block
LVDS LVDS Header 30-pin Block
INVERTER LVDS Inverter 6-pin Block
CPUFAN CPUFAN Header 4-pin Block
SYSFAN SYSFAN Header 3-pin Block
7
Chapter 2
Hardware Installation
2-1 Jumper Setting
JP3 (4-pin): INVERTER1 Back Light VCC 3.3V/5V/12V Select
JP3→ Inverter Back Light
6
4
2
3
1
5
1
2
4
6
3
5
2
4
6
1
3
5
2-4 Closed:
Inverter Backlight
VCC= 3.3V;
3-4 Closed:
Inverter Backlight
VCC= 5V;
4-6 Closed:
Inverter Backlight
VCC= 12V.
JP4 (4-pin): LVDS VCC 3.3V/5V /12V Select
JP4→ LVDS VCC
6
4
2
3
1
5
1
2
4
6
3
5
2
4
6
1
3
5
2-4 Closed:
VCC=3.3V;
3-4 Closed:
VCC= 5V;
4-6 Closed:
VCC= 12V.
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