Intel Atom N270, 945GSE User Manual

Intel® Atom™ Processor N270

®

and Mobile Intel

945GSE

Express Chipset

Development Kit User’s Manual

September 2008

Revision 002

Developer’s Kit User Manual

320436-002

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL
PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,
OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended
for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the
absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The
information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be
obtained by calling 1-800-548-4725, or by visiting Intel’s Web Site.

Any software source code reprinted in this document is furnished under a software license and may only be used or copied in
accordance with the terms of that license.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
family, not across different processor families. See http://www.intel.com/products/processor_number for details.

Code Names are only for use by Intel to identify products, platforms, programs, services, etc. (“products”) in development by
Intel that have not been made commercially available to the public, i.e., announced, launched or shipped. They are never to be
used as “commercial” names for products. Also, they are not intended to function as trademarks.

*Other names and brands may be claimed as the property of others.

The Intel
errata which may cause the product to deviate from published specifications. Current characterized errata are available on
request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel
Corporation or its subsidiaries in the United States and other countries.

*Other names and brands may be claimed as the property of others.

Copyright © 2008, Intel Corporation. All rights reserved.

®

Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset may contain design defects or errors known as

®

Atom Processor N270, Intel® 945GSE Express Chipset, and the Intel logo are trademarks or registered trademarks of Intel

2 Developer’s Kit User Manual

Contents

1 About This Manual ............................................................................................7

1.1 Content Overview...................................................................................7

1.2 Text Conventions ...................................................................................8

1.3 Glossary of Acronyms .............................................................................9

1.4 Technical Support.................................................................................10

1.4.1 Additional Technical Support..................................................... 10

1.5 Product Literature ................................................................................11

1.6 Related Documents ..............................................................................12

2 Getting Started...............................................................................................13

2.1 Overview ............................................................................................13

2.2 Development Board Features .................................................................15

2.3 Included Hardware and Documentation ...................................................16

2.4 Software Key Features ..........................................................................17

2.4.1 EFI firmware...........................................................................17

2.5 Before You Begin..................................................................................18

3 Theory of Operation ........................................................................................ 19

3.1 Block Diagram ..................................................................................... 19

3.2 Mechanical Form Factor......................................................................... 19

3.3 Thermal Management ........................................................................... 19

3.3.1 Thermal Solution..................................................................... 20

3.4 Power Management .............................................................................. 20

3.4.1 Power Management States........................................................20

3.4.2 Power Measurement Support ....................................................20

3.5 Intel® Atom™ Processor N270................................................................21

3.5.1 Processor Voltage Regulators ....................................................21

3.5.2 FSB.......................................................................................21

3.5.3 Power Management ................................................................. 21

3.5.4 Debug Interfaces.....................................................................21

3.5.5 Testability .............................................................................. 21

3.6 Mobile Intel® 945GSE Express Chipset GMCH ...........................................22

3.6.1 Memory ................................................................................. 22

3.6.2 Graphics ................................................................................ 22

3.7 ICH7M ................................................................................................22

3.7.1 PCI Expansion Slot .................................................................. 22

3.7.2 PCIe* x1 Expansion Slot...........................................................22

3.7.3 PCIe* Mini-Card ...................................................................... 23

3.7.4 LAN....................................................................................... 23

3.7.5 USB 2.0 ................................................................................. 23

3.7.6 Audio ....................................................................................23

3.7.7 SATA.....................................................................................23

3.7.8 IDE ....................................................................................... 24

3.7.9 TPM.......................................................................................24

3.7.10 GPIO ..................................................................................... 25

Developer’s Kit User Manual 3

3.7.11 PCI Configuration Space...........................................................27

4 Hardware Reference ........................................................................................ 29

4.1 Primary Features.................................................................................. 29

4.2 Power.................................................................................................29

4.2.1 Power Supply .........................................................................30

4.3 I/O Headers and Connectors ..................................................................30

4.3.1 Front Panel I/O Headers........................................................... 30

4.3.2 Back Panel I/O Connectors .......................................................31

4.4 Configuration Settings ..........................................................................32

4.4.1 Configuration Jumpers/Switches................................................32

4.4.2 System EFI Firmware Configuration ...........................................32

4.5 LED....................................................................................................33

5 Software........................................................................................................34

5.1 EFI Firmware ....................................................................................... 34

5.1.1 Overview ...............................................................................34

5.1.2 EFI Setup Security...................................................................34

5.1.3 PXE Boot Support....................................................................34

5.1.4 ACPI......................................................................................34

5.2 OS Support .........................................................................................34

6 Quick Start ....................................................................................................35

6.1 Required Peripherals............................................................................. 35

6.2 Power Up/Power Down .......................................................................... 35

Figures

Figure 1. Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset

Board (Top View)......................................................................................

Figure 2. Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset

CRB Block Diagram ...................................................................................

Figure 3. CRB Components...............................................................................29

Figure 4. Front Panel .......................................................................................30

Figure 5. Back Panel........................................................................................ 31

Figure 6. Firmware Hub ...................................................................................32

14
19

Tables

Table 1. Text Conventions..................................................................................8

Table 2. Acronyms ............................................................................................9

Table 3. Intel Literature Centers........................................................................11

Table 4. Related Documents .............................................................................12

Table 5. Intel® Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset CRB

Feature Set Summary ...............................................................................

Table 6. Platform Power Management States.......................................................20

Table 7. ICH GPIOs ......................................................................................... 25

Table 8. PCI Configuration Space ......................................................................27

15

4 Developer’s Kit User Manual

Table 9. CRB LEDs ..........................................................................................

33

Developer’s Kit User Manual 5

Revision History

Document

Number

320436 001 Initial release. August 2008
320436 002 • Updated Chapter 5 EFI Firmware September 2008

Revision

Number

Description Revision Date

§

6 Developer’s Kit User Manual

About This Manual

1 About This Manual

This manual describes the typical hardware set-up procedures, features, and use of
the Intel
Customer Reference Board (CRB) and other components included in the Development
Kit. This manual is written for OEMs, system evaluators, and embedded system
developers. This document defines all jumpers, headers, LED functions, and their
locations on the development board along with subsystem features. This manual
assumes basic familiarity in the fundamental concepts involved with installing and
configuring hardware for a personal computer system.

Note: Read this document in its entirety prior to applying power to the motherboard.

Chapter 6 provides quick start procedures.

Intel recommends having both the schematic and board present while reading this
document.

The references in this document correlate to reference designators and board
properties of Intel
FAB B Customer Reference Board.

This manual is intended to be used with the Development Kit but can also be used to
help bring up the Intel
Chipset board, although not all associated peripherals will be included with the
development board.

®

Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset

®

Atom™ Processor N270 and Mobile Intel® 945GSE Express Chipset

®

Atom™ Processor N270 and Mobile Intel® 945GSE Express

1.1 Content Overview

Chapter 1.0, “About This Manual” — This chapter contains a description of conventions
used in this manual. The last few sections explain how to obtain literature and contact
customer support.

Chapter 2.0, “Getting Started”— This chapter identifies key components, features and
specifications.

Chapter 3.0, “Theory of Operation” — This chapter provides information on the system
design.

Chapter 4.0, “Hardware Reference”— This chapter provides a description of
development kit primary features, connectors, and configuration settings.

Chapter 5.0, “Software” — This chapter provides information on system BIOS and OS
support.

Chapter 6.0, “Quick Start”— This chapter provides a summary of hardware and
power-on instructions for the development kit.

Developer’s Kit User Manual 7

1.2 Text Conventions

The notations listed in Table 1 may be used throughout this manual.

Table 1. Text Conventions

Notation Definition

# The pound symbol (#) appended to a signal name indicates that the signal

is active low. (e.g., PM_BMBUSY#)

Variables Variables are shown in italics. Variables must be replaced with correct

values.

Instructions Instruction mnemonics are shown in uppercase. When you are

programming, instructions are not case-sensitive. You may use either
uppercase or lowercase.

Numbers Hexadecimal numbers are represented by a string of hexadecimal digits

followed by the character H. A zero prefix is added to numbers that begin
with A through F. (For example, FF is shown as 0FFH.) Decimal and binary
numbers are represented by their customary notations. (That is, 255 is a
decimal number and 1111 is a binary number. In some cases, the letter B
is added for clarity.)

Units of Measure

A
GB
KB
KΩ

mA
MB

MHz

ms

mW

ns
pF
W

V
µA

µF
µs

µW

Signal Names Signal names are shown in uppercase. When several signals share a

The following abbreviations are used to represent units of measure:

amps, amperes
gigabytes
kilobytes
kilo-ohms
milliamps, milliamperes
megabytes
megahertz
milliseconds
milliwatts
nanoseconds
picofarads
watts
volts
microamps, microamperes
microfarads
microseconds
microwatts

common name, an individual signal is represented by the signal name
followed by a number, while the group is represented by the signal name
followed by a variable (n). For example, the lower chip-select signals are
named CS0#, CS1#, CS2#, and so on; they are collectively called CSn#.
A pound symbol (#) appended to a signal name identifies an active-low
signal. Port pins are represented by the port abbreviation, a period, and
the pin number (e.g., P1.0).

Developer’s Kit User Manual

1.3 Glossary of Acronyms

Table 2 defines the acronyms used throughout this document.

Table 2. Acronyms

Term Definition

ACPI Advanced Configuration and Power Interface

AGTL Assisted Gunning Transceiver Logic

ATA Advanced Technology Attachment (disk drive interface)

ATX Advanced Technology Extended (motherboard form Factor)

BGA Ball Grid Array

BIOS Basic Input/Output System

CMOS Complementary Metal-Oxide-Semiconductor

CRB Customer Reference Board

DDR Double Data Rate

DMA Direct Memory Access

DVI-D Digital Visual Interface Digital only

EFI Extensible Firmware Interface

FAE Field Application Engineer

FCBGA Flip Chip Ball Grid Array

FSB Front Side Bus

FWH Firmware Hub

GMCH Graphics Memory Controller Hub

GPIO General Purpose Input Output

HDD Hard disk drive

ICH I/O Controller Hub

IDE Integrated Device Electronics

Intel® HD Audio Intel® High Definition Audio

ITP In-Target Probe

LAN Local Area Network

LED Light Emitting Diode

LPC Low Pin Count

OS Operating System

PATA Parallel AT Attachment

PCIe* PCI Express*

Developer’s Kit User Manual

About This Manual

Term Definition

POST Power-on self-test

PXE Pre-boot Execution Environment

RTC Real Time Clock

SATA Serial Advanced Technology Attachment

SIO Super Input Output

SMB System Management Bus

SMC System Management Controller

SO-DIMM Small Outline Dual In-line Memory Module

SPI Serial Peripheral Interface Bus

SSD Solid-state Drive

TDP Thermal Design Power

TPM Trusted Platform Module

USB Universal Serial Bus

VGA Video Graphics Array

VID Voltage Identification

VRM Voltage Regulator Module

WoL Wake on LAN

XDP Extended Debug Port

1.4 Technical Support

Support Services for your hardware and software are provided through the secure

®

Premier Support Web site at https://premier.intel.com. After you log on, you

Intel
can obtain technical support, review “What’s New,” and download any items required
to maintain the platform. Support is provided through the following product: Dev Kit
(Embedded/N270/945GSE/ICH7M).

1.4.1 Additional Technical Support

If you require additional technical support, please contact your field sales
representative or local distributor.

10 Developer’s Kit User Manual

1.5 Product Literature

To order hard copies of product literature, the following instructions should be
followed:

1. Determine the SKU Number

If you do not know the SKU # of the document you are ordering, please refer

www.intel.com or contact your FAE. The SKU # is the first 6 digits of the

to

number on the PDF file, such as: 12345612.pdf or at the bottom of the

download page for that document.

2. Call, Mail or Email a request

Call: To place an order for a publication or text in hardcopy or CD form,

please contact our Intel

Table 3. Intel Literature Centers

U.S. and Canada 1-800-548-4725

International 1-303-675-2148

Fax [phone]

Mail a request to:

Intel Literature Fulfilment Center
P.O. Box 5937
Denver, Colorado 80217-9808
USA

®

Literature Fulfillment Centers listed in Table 3.

Location Telephone Number

Email a request to:

[e-mail]

Please make sure to include in your mailed/emailed request:

SKU #
Company Name
Your Name (first, last)
Full mailing address
Daytime Phone Number in case of questions

Note: Please be aware not all documents are available in all media types. Some may only be

available as a download.

Developer’s Kit User Manual