Product Brief
Intel
Edge Switches 100 Series
48 and 24 port edge switches (100 Gbps per port)
The Right Fabric for HPC
® Omni-Path Fabric
Intel® Omni-Path Fabric Edge Switches,
an element of the Intel® Scalable System
Framework, are part of an end-to-end
product family for HPC fabrics that
delivers high performance with
breakthrough value. Intel
562731-04
Architecture (Intel® OPA) builds on
proven technologies from Intel® True
Scale Architecture, the Cray Aries*
interconnect, and open source software
to provide an evolutionary on-ramp to
revolutionary new fabric capabilities.
Higher Performance at Lower Cost
Intel® Omni-Path Edge Switches deliver
100 Gbps port bandwidth with latency
that stays low even at extreme scale.
Second generation Intel fabric switch
silicon, with market leading 48 port radix,
these switches can lower fabric
acquisition costs by as much as 50
percent, while simultaneously reducing
space and power requirements.
these savings, you can potentially
achieve higher total cluster performance
within the same hardware budget to
expand and accelerate your research.
Flexible Fabrics at Every Scale
Intel® Omni-Path Fabric Edge Switches
support HPC clusters of all sizes, from
entry-level systems to supercomputers
with tens of thousands of server nodes.
You can use these switches in
®
Omni-Path
i
With
Key Benefits
Highly-integrated design reduces
space, power, and cost
• 48 ports, 1U chassis
• 24 ports, 1U chassis
Optimized for high message rates
and low end-to-end latency
Simple generational upgrades, with:
• Binary compatible applications
• FastFabric tools for easy
installation
• All open source software
Key Features
Up to 1.2 terabytes of aggregate
bandwidth
Out of band fabric management
(optional)
Redundant power (optional)
Redundant cooling
Reversible air flow
Next-generation fabric innovations
• Packet Integrity Protection
(PIP)
• Traffic Flow Optimization
(TFO)
• Dynamic Lane Scaling (DLS)
• New 8K and 10K MTUs for
improved storage efficiency
Intel® Omni-Path Edge Switches 100 Series 2
combination with Intel® Omni-Path
Director Class Switches to build lowlatency, multi-tier fabrics with an
exceptional set of features for highspeed networking.
High Availability
Intel® Omni-Path Fabric Edge Switches
provide integrated support for high
availability with advanced features such
as power, component-level diagnostics
and alarming, and out-of-band
management. Innovative features take
fabric resilience and availability to new
heights without sacrificing performance.
Packet Integrity Protection (PIP), for
example, provides high packet reliability
with latency-free error checking and linklevel recovery. Dynamic Lane Scaling
(DLS) maintains 75 percent of link
bandwidth if a physical lane fails, so HPC
workloads can complete gracefully to
keep project efforts on track.
SWITCH SPECIFICATIONS
Based on Intel® Omni-Path Switch
•
Silicon 100 Series 48 Port ASIC
100 Gbps per port bidirectional
•
Virtual lanes: Configurable from one to
•
eight VLs plus one management VL
Configurable MTU size of 2 KB, 4 KB,
•
8 KB, or 10KB
Maximum multicast table size: 8192
•
entries
Maximum unicast table size: 49151
•
entries
Supports QSFP28 Quad Small Form
•
Factor Pluggable cabling
Passive copper or active fiber cables
•
Management Features
Management Card (Optional)
•
Built-in Fabric Manager
•
Subnet Management Agent (SMA)
•
Performance Management Agent
•
(PMA)
Enables Command Line Interface and
•
Chassis Management GUI through
10/100/1000 Base-T Ethernet
Enables Serial Console through USB
•
Serial Port
Supports Embedded Subnet Manager
•
(ESM) and Performance Manager (PM)
Enables Network Time Protocol (NTP),
•
SNMP/MIBs, and LDAP
FastFabric Toolset
•
Fabric Management GUI
•
LED status
Twenty-four (24) or forty-eight (48)
•
link status indicators, one per QSFP28
port (Green)
Two (2) Ethernet indicators (Off = 10;
•
Green = 100; Orange = 1G)
Two (2) Chassis indicators (Green –
•
Status; Amber - Attention)
Two (2) Power Supply, one per supply
•
(Green)
One (1) Q7 Management Installed,
•
(Green - Installed)
One (1) External Management Capable,
•
(Green – One or more ports can be
directly connected to a Fabric
Manager)
Airflow direction (Green – front-to-
•
back airflow)
Intel® Omni-Path Edge Switches 100 Series 3
FEATURE
100SWE48Q
100SWE48U
100SWE24Q
100SWE24U
100Gb ports
48
48
24
24
Total System Bandwidth (bi-dir)
1.2TB/s
1.2TB/s
.6 TB/s
.6 TB/s
Dimensions (w x h x d)
17.3"x1.72”x17.15"
17.3"x1.72”x17.15"
17.3"x1.72”x17.15"
17.3"x1.72”x17.15"
Reversible Fan Modules
1 1 1 1 Mgmt. Modules
1 0 1 0 Power Supplies (Fixed) Min / AC
1/2
1/2
1/2
1/2
Power (Typ./Max) Input
100
Power w/ Max 3W QSFP
189/238 W (Copper)
356/408 W (All Optical)
189/238 W (Copper)
356/408 W (All Optical)
146/179 W (Copper)
231/264 W (All Optical)
146/179 W (Copper)
231/264 W (All Optical)
Weight - Fully Loaded
6.7kg
6.7kg
6.2kg
6.2kg
INTEL SKU
INTEL MM#
DESCRIPTION
100SWE48QF2
948588
Intel® Omni-Path Edge Switch 100 Series 48 Port Managed Forward 2 PSU 100SWE48QF2
100SWE48UF2
948678
Intel® Omni-Path Edge Switch 100 Series 48 Port Forward 2 PSU 100SWE48UF2
100SWE24QF2
945654
Intel® Omni-Path Edge Switch 100 Series 24 Port Managed Forward 2 PSU 100SWE24QF2
100SWE24UF2
945655
Intel® Omni-Path Edge Switch 100 Series 24 Port Forward 2 PSU 100SWE24UF2
100SWE48QF1
945662
Intel® Omni-Path Edge Switch 100 Series 48 Port Managed Forward 1 PSU 100SWE48QF1
100SWE48UF1
945663
Intel® Omni-Path Edge Switch 100 Series 48 Port Forward 1 PSU 100SWE48UF1
100SWE24QF1
945664
Intel® Omni-Path Edge Switch 100 Series 24 Port Managed Forward 1 PSU 100SWE24QF1
100SWE24UR1
945669
Intel® Omni-Path Edge Switch 100 Series 24 Port Reverse 1 PSU 100SWE24UR1
100SWEQ7CN1
945775
Intel® Omni-Path Edge Switch Management Card 100 Series 100SWEQ7CN1
100SWEIKIT1
945820
Intel® Omni-Path Edge Switch Installation Kit 100 Series 100SWEIKIT1
-240 VAC 50-60 Hz Optical
Intel® Omni-Path Edge Switches 100 Series 4
Compliance
US/Canada
FCC Part 15, Subpart B, Class A
•
CAN ICES-3 (A)
•
Europe
CISPR22
•
CISPR32/EN55032
•
EN55024
•
EN61000-3-2
•
EN61000-3-3
•
Japan
VCCI, Class A
•
New Zealand/Australia
AS/NZS CISPR 22, Class A
•
Korea
RRA/KC (KN22, KN24), Class A
•
Taiwan
BSMI (CNS 13438), Class A
•
Customs Union: Russia, Belarus and Kazakhstan
GOST R IEC 60950-1
•
GOST R 51318.22
•
GOST 30805.24
•
GOST R 51317.3.2 (Section 6, 7)
•
GOST R 51317.3.3
•
International
CB Scheme: IEC 60950-1
•
RoHS/REACH
Complies with RoHS II Directive
•
2011/65/EU of the European
Parliament
Complies with REACH Regulation (EC)
•
No 1907/2006
Acoustics
Less than 7.0 Bels
•
Environmental Specifications
Temperature
Operating: 0° to 40° C
•
Storage: -40° to 70° C
•
Humidity
Operating: 5% to 85% non-
•
condensing
Storage: 5% to 95% non-condensing
•
Altitude
Operating: 0 – 10,000 feet
•
(Temperature Derating 1C/175M
above 900M)
Storage: 0 – 40,000 feet
•
Shock
Unpackaged: Half-sine, 2g 11ms 300
•
pulses total
Packaged: 36" in free fall drop
•
Airflow - Reversible (Variable Speed Fans)
70 CFM maximum at 40°C
•
Agency Approvals – Safety (Planned)
US/Canada
TUV NRTL: UL 60950-1, CSA 22.1.No.
•
60950-1
Europe
TUV SUD EN60950-1
•
Vibration
UnPackaged: 5-500 Hz, 2.2 g RMS
•
random
Packaged: 5-500 Hz, 1.09 g RMS
•
random
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND
INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES R ELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel may make changes to spec ifications an d product descriptions at any time, witho ut notice. Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conf licts or incomp atibilities arising from future changes to them. The
information her e is subject to change witho ut notice. Do not finalize a design with this information.
The products described in this document may contain desig n defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are
available on request.
Contact your lo cal Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to:
http://www.intel.com/design/literature.htm
Intel® and the I ntel logo are trademarks or registered tr ademarks of I ntel Corporation or its subsidiaries in t he United State s and other countries.
*Other names and brands may be claimed as the property of others.
Intel technolo gies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer.
Software and workloads used in performance tests may have been optimized for performance only on Intel® microprocessors
Copyright © 2016, Intel Corporation. All rights reserved..
i
Internal cost analysis based on a 256-node to 2048-node clusters configured with Mellanox* FDR and EDR InfiniBand* products. Mellanox component pricing from
kernelsoftware.com Prices as of November 3, 2015. Compute node pricing based on Dell PowerEdge R730 server from www.dell.com
OPA (x8) utilizes a 2-1 over-subscribed Fabric. Intel® OPA pricing based on estimated reseller pricing using projected Intel MSRP pricing on day of launch.
. Prices as of May 26, 2015. Intel®
5
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