1. GENERAL DESCRIPTION........................................................................................................................................... 5
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PRODUCT SPECIFICATION
7.1 TEST CONDITIONS.......................................................................................................................................... 30
9. DEFINITION OF LABELS........................................................................................................................................... 37
9.1 OPEN CELL LABEL.......................................................................................................................................... 37
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Version Date
Ver 2.0 Jun.24.2013
PRODUCT SPECIFICATION
REVISION HISTORY
Page
(New)
All All The Approval Specification was first issued.
Section Description
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PRODUCT SPECIFICATION
X+C Board
1. GENERAL DESCRIPTION
1.1 OVERVIEW
V420DK1-PS1 is a 42” TFT Liquid Crystal Display product with driver ICs and 4ch-LVDS interface. This product
supports 3840 x 2160 Quad Full HDTV format and can display true 1.07G colors (8-bit +FRC). The backlight unit
is not built in.
1.2 FEATURES
CHARACTERISTICS ITEMS SPECIFICATIONS
Pixels [lines] 3840 x R.G.B. x 2160
Active Area [mm]
Sub-Pixel Pitch [mm] 0.0798 (H) x 0.2394 (V)
Pixel Arrangement RGB vertical stripe
Weight [g] 1460
Physical Size [mm] 931.296 × 566.204 × 1.8 Typ.
Display Mode Transmissive mode / Normally black
Contrast Ratio 5000:1 Typ.
+88/-88(H),+88/-88(V) Typ.
(Typical value measured by INX’s module)
+80/-80(H),+80/-70(V) Typ.
(Typical value measured by INX’s module)
R=(0.659,0.325)
G=(0.277, 0.588)
B=(0.134, 0.115)
W=(0.312, 0.362)
* Please refer to “color chromaticity” in 7.2
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Cell Transparency [%] 4.5% Typ. Please refer to “Transmittance” in 7.2
Polarizer Surface Treatment
Rotation Function
Display Orientation
RoHs Compliance
Back Side
Anti-Glare coating (Haze 1%)
Achievable
Signal input with “INX”
Front Side
INX
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PRODUCT SPECIFICATION
1.3 MECHANICAL SPECIFICATIONS
Item Min. Typ. Max. Unit Note
Weight - 1460 - g -
I/F connector mounting position
Note (1) Please refer to the attached drawings for more information of front and back outline dimensions.
Note (2) Connector mounting position
The mounting inclination of the connector makes the
screen center within ± 0.5mm as the horizontal.
+/- 0.5mm
(2)
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PRODUCT SPECIFICATION
2. ABSOLUTE MAXIMUM RATINGS
2.1 ABSOLUTE RATINGS OF ENVIRONMENT
Item Symbol
Storage Temperature TST -20 +60 ºC (1), (3)
Operating Ambient Temperature TOP 0 50 ºC (1), (2), (3)
Note (1) Temperature and relative humidity range is shown in the figure below.
(a) 90 %RH Max. (Ta 40 ºC).≦ (b) Wet-bulb temperature should be 39 ºC Max. (Ta > 40 ºC).
(c) No condensation.
Note (2) Thermal management should be considered in final product design to prevent the surface temperature of display
area from being over 65 ºC. The range of operating temperature may degrade in case of improper thermal
management in final product design.
Note (3) The rating of environment is base on LCD module. Leave LCD cell alone, this environment condition can’t be
guaranteed. Except LCD cell, the customer has to consider the ability of other parts of LCD module and LCD module
process.
Min. Max.
Value
Unit Note
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PRODUCT SPECIFICATION
2.2 ABSOLUTE RATINGS OF ENVIRONMENT (OPEN CELL)
Recommended Storage Condition: With shipping package.
Recommended Storage temperature range: 25±5 ℃
Recommended Storage humidity range: 50±10%RH
Recommended Shelf life: a month
2.3 ELECTRICAL ABSOLUTE RATINGS
2.3.1 TFT LCD MODULE
Value
Item Symbol
Min. Max.
Power Supply Voltage VCC -0.3 13.5 V
Logic Input Voltage VIN -0.3 3.6 V
Note (1) Permanent damage to the device may occur if maximum values are exceeded. Function operation
Unit Note
(1)
should be restricted to the conditions described under Normal Operating Conditions.
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PRODUCT SPECIFICATION
3. ELECTRICAL CHARACTERISTICS
3.1 TFT LCD Module
(Ta = 25 ± 2 ºC)
Power Supply Voltage VCC 10.8 12 13.2 V (1)
Rush Current I
QFHD 120Hz Output
Power Consumption
QFHD 120Hz Output
Power Supply Current
QFHD 60Hz Output
Power Consumption
Parameter Symbol
RUSH
White Pattern P
Horizontal Stripe PT
Black Pattern PT
White Pattern
Horizontal Stripe
Black Pattern
White Pattern P
Horizontal Stripe PT
Black Pattern PT
T
- -
- -
- -
T
Value
Min. Typ. Max.
- -
-
-
-
-
-
-
9.48 11.28 W
20.88 25.20 W
9.36 11.04 W
0.79 0.94 A
1.74 2.10 A
0.78 0.92 A
9.00 10.80 W
20.16 23.52 W
8.88 10.20 W
Unit Note
2.8 A (2)
(3)
QFHD 60Hz Output
Power Supply Current
Differential Input High
Threshold Voltage
Differential Input Low
LVDS
interface
CMOS
interface
Threshold Voltage
Common Input Voltage VCM 1.0 1.2 1.4 V
Differential input voltage
(single-end)
Terminating Resistor RT
Input High Threshold Voltage VIH 2.7
Input Low Threshold Voltage VIL 0
White Pattern
Horizontal Stripe
Black Pattern
- -
- -
- -
V
+100
LVTH
V
-300
LVTL
|VID| 200
-
0.75 0.90 A
1.68 1.96 A
0.74 0.85 A
-
-
-
100
-
-
+300 mV
-100 mV
600 mV
-
3.3 V
0.7 V
ohm
(4)
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PRODUCT SPECIFICATION
Note (1) The module should be always operated within the above ranges. The ripple voltage should be controlled under 10% of
Vcc (Typ.)
Note (2) Measurement condition :
Note (3) The specified power supply current is under the conditions at Vcc = 12 V, Ta = 25 ± 2 ºC, fv = 60/120 Hz, whereas a
power dissipation check pattern below is displayed.
a. White Pattern
GND
Vcc rising time is 470us
Vcc
0.9Vcc
0.1Vcc
470us
b. Black Pattern
c.Horizontal Pattern
Active Area
Active Area
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Note (4) The LVDS input characteristics is shown as below :
PRODUCT SPECIFICATION
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1 N.C. No Connection (1)
2 SCL I2C Clock (for mode selection & function setting)
3 SDA I2C Data (for mode selection & function setting)
4 N.C. No Connection
5 L/R_O Output signal for Left Right Glasses control
6 N.C. No Connection (1)
7 SELLVDS Input signal for LVDS Data Format Selection (3)(9)
8 N.C. No Connection
9 N.C. No Connection
10 N.C. No Connection
11 GND Ground
12 CH1[0]- First pixel Negative LVDS differential data input. Pair 0
13 CH1[0]+ First pixel Positive LVDS differential data input. Pair 0
Note
(1)
(2)
(1)
14 CH1[1]- First pixel Negative LVDS differential data input. Pair 1
(4)
15 CH1[1]+ First pixel Positive LVDS differential data input. Pair 1
16 CH1[2]- First pixel Negative LVDS differential data input. Pair 2
17 CH1[2]+ First pixel Positive LVDS differential data input. Pair 2
18 GND Ground
19 CH1CLK- First pixel Negative LVDS differential clock input.
20 CH1CLK+ First pixel Positive LVDS differential clock input.
21 GND Ground
22 CH1[3]- First pixel Negative LVDS differential data input. Pair 3
23 CH1[3]+ First pixel Positive LVDS differential data input. Pair 3
24 CH1[4]- First pixel Negative LVDS differential data input. Pair 4
25 CH1[4]+ First pixel Positive LVDS differential data input. Pair 4
26 2D/3D Input signal for 2D/3D Mode Selection (5)(10)
27 L/R Input signal for Left Right eye frame synchronous (6)
(4)
(4)
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PRODUCT SPECIFICATION
28 CH2[0]- Second pixel Negative LVDS differential data input. Pair 0
29 CH2[0]+ Second pixel Positive LVDS differential data input. Pair 0
30 CH2[1]- Second pixel Negative LVDS differential data input. Pair 1
31 CH2[1]+ Second pixel Positive LVDS differential data input. Pair 1
32 CH2[2]- Second pixel Negative LVDS differential data input. Pair 2
33 CH2[2]+ Second pixel Positive LVDS differential data input. Pair 2
(4)
34 GND Ground
35 CH2CLK- Second pixel Negative LVDS differential clock input.
36 CH2CLK+ Second pixel Positive LVDS differential clock input.
37 GND Ground
38 CH2[3]- Second pixel Negative LVDS differential data input. Pair 3
39 CH2[3]+ Second pixel Positive LVDS differential data input. Pair 3
40 CH2[4]- Second pixel Negative LVDS differential data input. Pair 4
41 CH2[4]+ Second pixel Positive LVDS differential data input. Pair 4
42 LD_EN Input signal for Local Dimming Enable (7)(9)
43 N.C. No Connection (8)
44 GND Ground
45 GND Ground
46 GND Ground
47 N.C. No Connection
(4)
(4)
(1)
48 VCC +12V power supply
49 VCC +12V power supply
50 VCC +12V power supply
51 VCC +12V power supply
CON2 Connector Pin Assignment (LM123S010HTF13Y or equivalent)
1 N.C. No Connection
2 N.C. No Connection
3 N.C. No Connection
4 GND Ground
5 N.C. No Connection
6 L/R_O Output signal for Left Right Glasses control
7 N.C. No Connection
8 N.C. No Connection
9 N.C. No Connection
10 N.C. No Connection
Note (1) Reserved for internal use. Please leave it open.
Note (2) The definition of L/R_O signal as follows
L= 0V, H=+3.3V
L/R_O Note
L Right glass turn on
H Left glass turn on
(1)
-
(1)
(2)
(1)
Note (3) LVDS format selection.
L= Connect to GND, H=Connect to +3.3V or Open
SELLVDS Note
L JEIDA Format
H or Open VESA Format
Note (4) LVDS Data Mapping
LVDS 4-port FHD 100/120Hz Input
Port Channel of LVDS Data Stream
1st Port First Pixel 1, 5, 9, ……1913, 1917
2nd Port Second Pixel 2, 6, 10, ….1914, 1918
3rd Port Third Pixel 3, 7, 11, ….1915, 1919
4th Port Fourth Pixel 4, 8, 12, ….1916, 1920
LVDS 2port FHD 50/60Hz Input
Port Channel of LVDS Data Stream
1st Port First Pixel 1, 3, 5, ……1917, 1919
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2nd Port Second Pixel 2, 4, 6, ….1918, 1920
LVDS 4-port QFHD 24/30Hz Input
Port Channel of LVDS Data Stream
1st Port First Pixel 1, 5, 9, ……3833, 3837
2nd Port Second Pixel 2, 6, 10, ….3834, 3838
3rd Port Third Pixel 3, 7, 11, ….3835, 3839
4th Port Fourth Pixel 4, 8, 12, ….3836, 3840
Note (5) 2D/3D mode selection.
L= Connect to GND or Open, H=Connect to +3.3V
2D/3D Note
L or Open 2D Mode
H 3D Mode
Note (6) Input signal for left and right eye frame synchronous
VIL=0~0.7 V, VIH=2.7~3.3 V
L/R Note
L Right synchronous signal
H Left synchronous signal
PRODUCT SPECIFICATION
Note (7) Local dimming enable selection.
L= Connect to GND,H=Connect to +3.3V or Open
LD_EN Note
L Local Dimming Disable
H or Open Local Dimming Enable
Note (8) Reserved for internal use. Open is preferred. However, it is also acceptable to reserve the wire connecting with
specific High/Low voltage level.
Note (9) Interface optional pin has internal scheme as following diagram. Customer should keep the interface voltage level
requirement which including panel board loading as below.
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System Board
PRODUCT SPECIFICATION
3.3V
10K ohm
1K ohm
IC
Interface Voltage Level
VH > V
VL < V
IH
IL
Panel Board
Note (10) Interface optional pin has internal scheme as following diagram. Customer should keep the interface voltage level
requirement which including panel board loading as below.
Panel Board System Board
1K ohm
IC
Interface Voltage Level
VH > V
IH
VL < V
IL
10K ohm
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PRODUCT SPECIFICATION
Note (11) LVDS connector pin order defined as follows
Note (12) LVDS connector mating dimension range request is 0.93mm~1.0mm as below
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5.2 LVDS INTERFACE
JEIDA Format : SELLVDS = L
VESA Format : SELLVDS = H or Open
VESA Format
PRODUCT SPECIFICATION
Current Cycle
AR 0P
AR 0N
AR 1P
AR 1N
AR 2P
AR 2N
AR 3P
AR 3N
AR 4P
AR 4N
JEIDA Format
AR 0P
AR 0N
AR 1P
AR 1N
AR0
AG1
AB2
AR6
AR4
AG5
AG0AR5
AB1
DEVSHSAB5AB4AB3AB2
REVAB7AB6AG7AG6AR7AR6
REVAB9AB8AG9AG8AR9AR8AR8REV
AG4AR7
AB5
AB0AG5AG4AG3AG2AG1
AB4AG7AG6AG5AG9AG8
AR4AR3AR2AR1AR0
AR6AR5AR4AR9AR8
AG0
AB1
DE
REV
AG4
AB5
AR 2P
AR 2N
AR 3P
AR 3N
AR 4P
AR 4N
R0~R9: Pixel R Data (9; MSB, 0; LSB)
G0~G9: Pixel G Data (9; MSB, 0; LSB)
B0~B9: Pixel B Data (9; MSB, 0; LSB)
DE : Data enable signal
DCLK : Data clock signal
Notes: (1) RSVD (reserved) pins on the transmitter shall be “H” or “L”.
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AB6
AR2
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DEVSHSAB7AB6AB9AB8
REVAB3AB2AG3AG2AR3AR2
REVAB1AB0AG1AG0AR1AR0AR0REV
DE
REV
PRODUCT SPECIFICATION
5.3 COLOR DATA INUT ASSIGNMENT
The brightness of each primary color (red, green and blue) is based on the 10-bit gray scale data input for the color.
The higher the binary input the brighter the color. The table below provides the assignment of color versus data
input.
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PRODUCT SPECIFICATION
(2) Adjustment method: (Digital V-com)
Programmable memory IC is used for Digital V-com adjustment in this model. INX provide Auto Vcom tools to
adjust Digital V-com.The detail connection and setting instruction, please directly contact with Account FAE or
refer INX Auto V-com adjustment OI. Below items is suggested to be ready before Digital V-com adjustment in
customer LCM line.
a. USB Sensor Board.
b. Programmable software
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PRODUCT SPECIFICATION
6. INTERFACE TIMING
6.1 INPUT SIGNAL TIMING SPECIFICATIONS
The input signal timing specifications are shown as the following table and timing diagram. (Ta = 25 ± 2 ºC)
Signal Item Symbol
Min. Typ. Max. Unit Note
Input cycle to
T
- - 200 ps (1)
cycle jitter
rcl
LVDS
Spread spectrum
Receiver
modulation range
clkin_mod
F
F
clkin
-1.5%
- F
+1.5% MHz
clkin
Clock
Spread spectrum
modulation frequency
SSM
- - 66 KHz
F
LVDS
Receiver
Receiver skew margin T
RSKM
-400 - 400 ps (3)
Data
6.1.1 Input Timing Spec for FHD, Frame Rate = 50Hz
Display Thd 960 Tc
Blank Thb 32 415 480 Tc
Front porch Thfp 12
Back porch Thbp
Hsync Thswid
10
4
- -
- -
- -
Tc
Tc
Tc
6.1.6 Input Timing spec for QFHD, Frame Rate = 30Hz
Signal Item Symbol
LVDS Clock Frequency
F
clkin
(=1/TC)
Min. Typ. Max. Unit Note
60 74.25 79 MHz (4)
Frame Rate 2D Mode Fr 29 30 31 Hz (5)
Vertical
2D Mode
Total Tv 2208 2250 2450 Th Tv=Tvd+Tvb
Active
Display Tvd 2160 Th
(6)
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Display
Term
PRODUCT SPECIFICATION
Blank Tvb 48 90 290 Th
Front porch Tvfp 20
--
Th
Back porch Tvbp
Vsync Tvswid
Total Th 992 1100 1340 Tc Th=Thd+Thb
Horizontal
Active
Display
Term
Note (1) The input clock cycle-to-cycle jitter is defined as below figures. Trcl =|T1 – T︱
Display Thd 960 Tc
Blank Thb 32 140 380 Tc
Front porch Thfp 12
Back porch Thbp
Hsync Thswid
20
8
10
4
- -
- -
- -
- -
- -
Th
Th
Tc
Tc
Tc
(6)
(6)
Note (2) The SSCG (Spread spectrum clock generator) is defined as below figures.
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PRODUCT SPECIFICATION
Note (3) The LVDS timing diagram and the receiver skew margin is defined and shown in following figure.
Tc
RXCLK+/-
RXn+/-
T
RSKM
Note (4) Please make sure the range of pixel clock has follow the below equations.
Fclkin (max) ≧ (Fr Tv Th╳╳) Fclkin(min)≧
Note (5)
a. The frame-to-frame jitter of the input frame rate is defined as the following figure.
b. FRn = FRn-1 ± 1.8%.
Note (6)
c. Hsync and Vsync signals are necessary for this module.
d. The polarity of Hsync & Vsync should be positive.
e. Please follow the input signal timing diagram as below :
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PRODUCT SPECIFICATION
500ms
≦T4
0≦T8≦T3
T
10≦10ms
6.2 POWER ON/OFF SEQUENCE
(Ta = 25 ± 2 ºC)
To prevent a latch-up or DC operation of LCD module, the power on/off sequence should be as the diagram
below.
0.5≦T1≦10ms
0≦T2≦200ms
0≦T3
LVDS Signals
0≦T7≦T2
Option Signals
(SELLVDS,2D/3D, LD_EN)
Host I2C Command
Backlight (Recommended)
1000ms≦T5
100ms≦T6
Vcc Dip
0V
0V
500ms≦T9
0.9Vcc
0.1VCC
Power On
T7
Vcc(typ.) x 0.85
T2
Vcc
T5
0.9Vcc
0.1Vcc
T3 T1
T4
Power Off
T8
T
9
50%
50%
T6
T10
0V
Note (1) The supply voltage of external system for the module input should follow the definition of Vcc.
Note (2) Apply the lamp voltage within the LCD operation range. When the backlight turns on before the LCD operation or the
LCD turns off before the backlight turns off, the display may momentarily become abnormal screen.
Note (3) In case of VCC=off, please keep the level of input signals on the low or high impedance.
Note (4) T4 should be measured after the module has been fully discharged between power off and on period.
Note (5) Interface signal shall not be kept at high impedance when the power is on.
Note (6) Vcc must decay smoothly when power-off.
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PRODUCT SPECIFICATION
7. OPTICAL CHARACTERISTICS
7.1 TEST CONDITIONS
Item Symbol Value Unit
Ambient Temperature Ta
Ambient Humidity Ha
Supply Voltage VCC
Input Signal According to typical value in "3. ELECTRICAL CHARACTERISTICS"
The LCD module should be stabilized at given temperature for 1 hour to avoid abrupt temperature change during
measuring in a windless room.
25±2
50±10
12V±1.2
o
C
%RH
V
LCD Module
LCD Panel
Field of View = 1º
500 mm
CS - 2000
Light Shield Room
(Ambient Luminance < 2 lux)
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PRODUCT SPECIFICATION
7.2 OPTICAL SPECIFICATIONS
The relative measurement methods of optical characteristics are shown as below. The following items should
be measured under the test conditions described in 7.1 and stable environment shown in 7.1.
Item Symbol
Color
Chromaticity
Red
Green
Blue
Rcx
Rcy
Gcx
Gcy
Bcx
Bcy
Wcx
Viewing Angle at Normal
Standard light source “C”
Condition Min. Typ. Max. Unit Note
0.659
0.325
0.277
-
-
-
θx=0°, θY =0°
Direction
Typ.
-0.03
0.588
0.133
0.115
0.312
Typ.
+0.03
-
-
-
-
(0)
White
Wcy
0.362
-
Transmittance T% 4.05 4.5 - % (5)
θx=0°, θY =0°
Transmittance Variation
δT
- - 1.3 (6)
with INX module
Contrast Ratio CR
Gray to
Response Time
gray
3500 5000
θx=0°, θY =0°
- 6.5 13 ms (1),(4)
with INX Module
- - (1),(3)
θx+
80
88
-
Horizontal
Viewing
θx-
CR≥20
80
88
Deg. (1),(2)
Angle
θY+
With INX module
80
88
-
Vertical
θY-
80
88
-
Transmission direction
Φ
-
of the up polarizer
Note (0) Light source is the standard light source ”C” which is defined by CIE and driving voltage are based on
suitable gamma voltages. The calculating method is as following :
1. Measure Module’s and BLU’s spectrum at center point. White and R,G,B are with signal input. BLU (for
V420DK1-LS1) is supplied by INX.
2. Calculate cell’s spectrum.
3. Calculate cell’s chromaticity by using the spectrum of standard light source “C”.
Note (1) Light source is the BLU which supplied by INX (V420DK1-LS1) and the cell driving voltage are based on suitable
gamma voltages.
up-P
-
90
-
Deg. (7)
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Note (2) Definition of Viewing Angle (θx, θy) :
Time
Viewing angles are measured by Autronic Conoscope Cono-80 (or Eldim EZ-Contrast 160R)
PRODUCT SPECIFICATION
θX- = 90º
6 o’cloc
Note (3) Definition of Contrast Ratio (CR):
The contrast ratio can be calculated by the following expression.
Contrast Ratio (CR) =
y-
x-
Normal
θx = θy = 0º
θy-θy+
θx−
θx+
12 o’clock direction
y+
θy+ = 90º
x+
θX+ = 90º
L1023 of Luminance Surface
L0 of Luminance Surface
L1023 : Luminance of gray level 1023
L0 : Luminance of gray level 0
CR = CR (5), where CR (X) is corresponding to the Contrast Ratio of the point X at the figure in Note (5).
Note (4) Definition of Gray-to-Gray Switching Time:
100%
90%
Optical
Response
10%
0%
Gray to gray
switching time
The driving signal means the signal of gray level 0, 124, 252, 380, 508, 636, 764, 892 and 1023.
Gray to gray
switching time
Gray to gray average time means the average switching time of gray level 0, 124, 252, 380, 508, 636, 764, 892 and
1023 to each other.
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Note (5) Definition of Transmittance (T%) :
[
]
Measure the transmittance at 5 points.
Light source is the BLU which contains three diffuser sheets and the cell driving voltage are based on suitable
gamma voltages.
PRODUCT SPECIFICATION
Transmittance (T%) =
The transmittance of each point can be calculated by the following expression.
T (X) =
L1023: Luminance of gray level 1023
T(X) is corresponding to the point X1~X5 at the figure in Note (6).
Note (6) Definition of Transmittance Variation (δT) :
Measure the transmittance at 5 points.
Transmittance Variation (δT )=
T(X) is calculated as Note(5).
module LCD of (X) L1023
BLU of (X) Luminance
×
D/4 D/2 3D/4
%100
Horizontal Line
D
T(5)T(4),T(3),T(2),T(1), Average
] T(5) T(4), T(3), T(2), T(1), [ Maximum
] T(5) T(4), T(3), T(2), T(1), [ Minimum
W/4
1 2
: Test Point
W/2
W
Vertical Line
3W/4
3 4
5
X
X=1 to 5
Active Area
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PRODUCT SPECIFICATION
6 o’clock
Note (7) This is a reference for designing the shutter glasses of 3D application. (VA case)
Definition of the transmission direction of the up polarizer (Φ
) on LCD Module:
up-P
x-
12 o’clock direction
y+
Φ
up-P
y-
The transmission axis of the front polarizer of the shutter glasses should be parallel to this panel transmission direction to
get a maximum 3D mode luminance.
Up Polarizer
x
+
Φ=0o
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PRODUCT SPECIFICATION
8. PRECAUTIONS
8.1 ASSEMBLY AND HANDLING PRECAUTIONS
[ 1 ] Do not apply improper or unbalanced force such as bending or twisting to open cells during assembly.
[ 2 ] It is recommended to assemble or to install an open cell into a customer’s product in clean working areas.
The dust and oil may cause electrical short to an open cell or worsen polarizers on an open cell.
[ 3 ] Do not apply pressure or impulse to an open cell to prevent the damage.
[ 4 ] Always follow the correct power-on sequence when an open cell is assembled and turned on. This can
prevent the damage and latch-up of the CMOS LSI chips.
[ 5 ] Do not design sharp-pointed structure / parting line / tooling gate on the plastic part of a COF (Chip on film),
because the burr will scrape the COF.
[ 6 ] If COF would be bended in assemble process, do not place IC on the bending corner.
[ 7 ] The gap between COF IC and any structure of BLU must be bigger than 2 mm. This can prevent the damage
of COF IC.
[ 8 ] The bezel opening must have no burr and be smooth to prevent the surface of an open cell scraped.
[ 9 ] The bezel of a module or a TV set can not contact with force on the surface of an open cell. It might cause
light leakage or scrape.
[ 10 ] In the case of no FFC or FPC attached with open cells, customers can refer the FFC / FPC drawing and buy
them by self.
[ 11 ] It is important to keep enough clearance between customers’ front bezel/backlight and an open cell.
Without enough clearance, the unexpected force during module assembly procedure may damage an open
cell.
[ 12 ] Do not plug in or unplug an I/F (interface) connector while an assembled open cell is in operation.
[ 13 ] Use a soft dry cloth without chemicals for cleaning, because the surface of the polarizer is very soft and
easily scratched.
[ 14 ] Moisture can easily penetrate into an open cell and may cause the damage during operation.
[ 15 ] When storing open cells as spares for a long time, the following precaution is necessary.
[ 15.1 ] Do not leave open cells in high temperature and high humidity for a long time. It is highly
recommended to store open cells in the temperature range from 0 to 35 at normal humidity without ℃
condensation.
[ 15.2 ] Open cells shall be stored in dark place. Do not store open cells in direct sunlight or fluorescent light
environment.
[ 16 ] When ambient temperature is lower than 10ºC, the display quality might be reduced.
[ 17 ] Unpacking (Cartons/Tray plates) in order to prevent open cells broken:
[ 17.1 ] Moving tray plates by one operator may cause tray plates bent which may induce open cells broken.
Two operators carry one carton with their two hands. Do not throw cartons/tray plates, avoid any
impact on cartons/tray plates, and put down & pile cartons/tray plates gently.
[ 17.2 ] A tray plate handled with unbalanced force may cause an open cell damaged. Trays should be
completely put on a flat platform.
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PRODUCT SPECIFICATION
[ 17.3 ] To prevent open cells broken, tray plates should be moved one by one from a plastic bag.
[ 17.4 ] Please follow the packing design instruction, such as the maximum number of tray stacking to
prevent the deformation of tray plates which may cause open cells broken.
[ 17.5 ] To prevent an open cell broken or a COF damaged on a tray, please follow the instructions below:
[17.5.1] Do not peel a polarizer protection film of an open cell off on a tray
[17.5.2] Do not install FFC or LVDS cables of an open cell on a tray
[17.5.3] Do not press the surface of an open cell on a tray.
[17.5.4] Do not pull X-board when an open cell placed on a tray.
[ 18 ] Unpacking (Hard Box) in order to prevent open cells broken:
[ 18.1 ] Moving hard boxes by one operator may cause hard boxes fell down and open cells broken by
abnormal methods. Two operators carry one hard box with their two hands. Do handle hard boxes
carefully, such as avoiding impact, putting down, and piling up gently.
[ 18.2 ] To prevent hard boxes sliding from carts and falling down, hard boxes should be placed on a surface
with resistance.
[ 18.3 ] To prevent an open cell broken or a COF damaged in a hard box, please follow the instructions
below:
[18.3.1] Do not peel a polarizer protection film of an open cell off in a hard box.
[18.3.2] Do not install FFC or LVDS cables of an open cell in a hard box.
[18.3.3] Do not press the surface of an open cell in a hard box.
[18.3.4] Do not pull X-board when an open cell placed in a hard box.
[ 19 ] Handling – In order to prevent open cells, COFs , and components damaged:
[ 19.1 ] The forced displacement between open cells and X-board may cause a COF damaged. Use a fixture
tool for handling an open cell to avoid X-board vibrating and interfering with other components on a
PCBA & a COF.
[ 19.2 ] To prevent open cells and COFs damaged by taking out from hard boxes, using vacuum jigs to take
out open cells horizontally is recommended.
[ 19.3 ] Improper installation procedure may cause COFs of an open cell over bent which causes damages.
As installing an open cell on a backlight or a test jig, place the bottom side of the open cell first on the
backlight or the test jig and make sure no interference before fitting the open cell into the
backlight/the test jig.
[ 19.4 ] Handle open cells one by one.
[ 20 ] Avoid any metal or conductive material to contact PCB components, because it could cause electrical
damage or defect.
8.2 SAFETY PRECAUTIONS
[ 1 ] If the liquid crystal material leaks from the open cell, it should be kept away from the eyes or mouth. In case
of contact with hands, skin or clothes, it has to be washed away thoroughly with soap.
[ 2 ] After the end of life, open cells are not harmful in case of normal operation and storage.
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PRODUCT SPECIFICATION
9. DEFINITION OF LABELS
9.1 OPEN CELL LABEL
The barcode nameplate is pasted on each open cell as illustration for INX internal control
Figure.9-1 Serial No. Label on SPWB
Model Name : V420DK1-PS1
Revision : Rev. XX, for example: A0, A1… B1, B2… or C1, C2…etc.
Serial ID : X X X X X X X Y M D L N N N N
V420DK1 –PS1Rev. XX
X X X X X X X Y M D L N N N N
Serial No.
Year, Month, Date
INX Internal Use
Revision
Serial ID includes the information as below:
Manufactured Date :
Year: 2010=0, 2011=1,2012=2…etc.
Month: 1~9, A~C, for Jan. ~ Dec.
Day: 1~9, A~Y, for 1st to 31st, exclude I ,O, and U.
Revision Code : Cover all the change
Serial No.: Manufacturing sequence of product
INX Internal Use
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PRODUCT SPECIFICATION
Figure.9-2 Panel ID Label on Cell
Panel ID Label includes the information as below:
Panel ID: T X X X X X X X X X X X
TXXXXXXXXXXX
INX Internal Use
FAB Line: 1~8, for Fab1~Fab8
TFT
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PRODUCT SPECIFICATION
10. PACKAGING
10.1 PACKAGING SPECIFICATIONS
(1) 13 pcs LCD Open Cell / 1 Box
(2) Box dimensions : 1113 (L) X 813 (W) X 99.4 (H)mm
(3) Weight : approximately 7.7 Kg ( 13 Open Cells per box)
(4) 156 LCD TV Panels / 1 Group
(5) Without the outer Carton, Boxes stack under the package architecture.
10.2 PACKAGING METHOD
Packing method (Hard Box) is shown in following figures.
Figure.10-1 packing method
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PRODUCT SPECIFICATION
Figure.10-2 packing method
10.3 UNPACKAGING METHOD
Unpacking method (Hard Box) is shown in following figures.
Figure.10-3 unpacking method
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11. MECHANICAL CHARACTERISTIC
PRODUCT SPECIFICATION
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PRODUCT SPECIFICATION
Version 2.0 42 Date : Jun. 24 2013
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PRODUCT SPECIFICATION
Appendix A
Local Dimming demo function
A.1 I2C address and write command
Device address: 0xe0
Register address: 0x65
Command data: 0x16 0x00 0x00 0x00 0x00 0x00: Local Dimming demo mode OFF (Note 1)
0x16 0x00 0x00 0x00 0x00 0x01 : Local Dimming demo mode ON (Demo in right half