Appendix. SYSTEM COVER DESIGN NOTICE..........................................................................30
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PRODUCT SPECIFICATION
REVISION HISTORY
Version Date Page Description
0.0 Jul 23, 2012 All Tentative Spec Ver.0.0 was first issued.
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PRODUCT SPECIFICATION
1. GENERAL DESCRIPTION
1.1 OVERVIEW
N140FGE-LA2 is a 14.0” (14.0” diagonal) TFT Liquid Crystal Display module with LED Backlight unit
and 40 pins LVDS interface. This module supports 1600 x 900 HD+ mode and can display 262,144
colors. The optimum viewing angle is at 6 o’clock direction.
1.2 GENERAL SPECIFICATI0NS
Item Specification Unit Note
Screen Size 14.0” diagonal
Driver Element a-si TFT active matrix - Pixel Number 1600 x R.G.B. x 900 pixel Pixel Pitch 0.1935 (H) x 0.1935 (V) mm Pixel Arrange ment RGB vertical stripe - Display Colors 262,144 color Transmissive Mode Normally white - Surface Treatment Hard coating (3H), Anti-Glare - Luminance, White 300 Cd/m2
Power Consumption Total (6.3 W) (Tpy.) @ cell (1.3 W) (Max.), BL (5 W) (Max.) (1)
Note (1) The specified power consumption (with converter efficiency) is under the conditions at VCCS =
3.3 V, fv = 60 Hz, LED_VCCS = Typ, fPWM = 200 Hz, Duty=100% and Ta = 25 ± 2 ºC, whereas mosaic
pattern is displayed.
2. MECHANICAL SPECIFICATIONS
Item Min. Typ. Max. Unit Note
Horizontal (H) 319.9 320.4 320.9 mm
Module Size
Active Area
Note (1) Please refer to the attached dra win gs for more information of front and back outline dimensions.
Vertical (V) 204.6 205.1 205.6 mm
Thickness (T) - - 3.0 mm
Horizontal 309.3 309.6 309.9 mm
Vertical 173.85 174.15 174.45 mm
Weight - 270 280 g
2.1 CONNECTOR TYPE
Pin1 Pin40
(1)
Please refer Appendix Outline Drawing for detail design.
Connector Part No.: IPEX-20455-040E-12 & Foxconn-GS13401-1110A-7H or equivalent
User’s connector Part No: IPEX-20453-040T-01 or equivalent
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PRODUCT SPECIFICATION
3. ABSOLUTE MAXIMUM RATINGS
3.1 ABSOLUTE RATINGS OF ENVIRONMENT
Item Symbol
Min. Max.
Storage Temperature TST -20 +60 ºC (1)
Operating Ambient T emperature TOP 0 +50 ºC (1), (2)
Note (1) (a) 90 %RH Max. (Ta <= 40 ºC).
(b) Wet-bulb temperature should be 39 ºC Max. (Ta > 40 ºC).
(c) No condensation.
Note (2) The temperature of panel surface should be 0 ºC min. and 60 ºC max.
Relative Humidity (%RH)
100
90
Value
Unit Note
80
60
Operating
40
20
10
Storage Range
Temperature (ºC)
3.2 ELECTRICAL ABSOLUTE RATINGS
3.2.1 TFT LCD MODULE
Item Symbol
Power Supply V oltage VCCS (-0.3) (+4.0) V
Logic Input Voltage VIN (-0.3) (VCCS+0.3) V
Converter Input Voltage
Converter Control Signal Voltage
Converter Control Signal Voltage
LED_VCCS
LED_PWM,
LED_EN
Value
Min. Max.
(-0.3) (25) V (1)
(-0.3) (5) V (1)
(-0.3) (5) V (1)
Unit Note
80 60 -20 40 0 20 -40
(1)
Note (1) Stresses beyond those listed in above “ELECTRICAL ABSOLUTE RATINGS” may cause
permanent damage to the device. Normal operation should be restricted to the conditions
described in “ELECTRICAL CHARACTERISTICS”.
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4. ELECTRICAL SPECIFICATIONS
4.1 FUNCTION BLOCK DIAGRAM
LVDS Display
Data & Clock
VCCS
GND
Data
EDID
CLK
EDID
V
EDID
Converter
Input Signals
INPUT CONNECTOR
DC/DC CONVERTER &
REFERENCE VOLTAGE
LED CONVERTER BACKLIGHT UNIT
PRODUCT SPECIFICATION
TIMING
CONTROLLER
GENERATOR
EDID
EEPROM
SCAN DRIVER IC
TFT LCD
PANEL
DA TA DRIVER IC
4.2. INTERFACE CONNECTIONS
PIN ASSIGNMENT
Pin Symbol Description Remark
1 NC No Connection (Reserve)
2 VCCS Power Supply (3.3V typ.)
3 VCCS Power Supply (3.3V typ.)
4 VEDID DDC 3.3V power
5 NC No Connection (Reserved for CMI test)
6 CLKEDID DDC clock
7 DATAEDID DDC data
8 RXO0- LVDS Differential Data Input (Odd)
9 RXO0+ LVDS Differential Data Input (Odd)
10 VSS Ground
11 RXO1- LVDS Differential Data Input (Odd)
12 RXO1+ LVDS Differential Data Input (Odd)
13 VSS Ground
14 RXO2- LVDS Differential Data Input (Odd)
15 RXO2+ LVDS Differential Data Input (Odd)
16 VSS Ground
17 RXOC- LVDS Clock Data Input (Odd)
18 RXOC+ LVDS Clock Data Input (Odd)
19 VSS Ground
20 RXE0- LVDS Differential Data Input (Even) R0-R5, G0
21 RXE0+ LVDS Differential Data Input (Even)
22 VSS Ground
23 RXE1- LVDS Differential Data Input (Even) G1~G5, B0, B1
R0-R5, G0
G1~G5, B0, B1
B2-B5,HS,VS, DE
LVDS CLK
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PRODUCT SPECIFICATION
24 RXE1+ LVDS Differential Data Input (Even)
25 VSS Ground
26 RXE2- LVDS Differential Data Input (Even) B2-B5,HS,VS, DE
27 RXE2+ LVDS Differential Data Input (Even)
28 VSS Ground
29 RXEC- LVDS Clock Data Input (Even) LVDS CLK
30 RXEC+ LVDS Clock Data Input (Even)
31 LED_GND LED Ground
32 LED_GND LED Ground
33 LED_GND LED Ground
34 NC No Connectio n (Reserve)
35 LED_PWM PWM Control Signal of LED Converter
36 LED_EN Enable Control Signal of LED Converter
37 CABC_EN CABC Enable Input
38 LED_VCCS LED Power Supply
39 LED_VCCS LED Power Supply
40 LED_VCCS LED Power Supply
Note (1) The first pixel is odd as shown in the following figure.
1,1
(odd)
2,1
3,1
1,2
(even)
2,2
1,3
(odd)
1,4
(even)
1,Xmax
Pitch
Pitch
Ymax,1
Note (2) The setting of Color engine and CABC function are as follows.
Pin Enable Disable
CABC_EN Hi Lo or Open
Hi = High level, Lo = Low level.
Ymax,
Xmax
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PRODUCT SPECIFICATION
4.3 ELECTRICAL CHARACTERISTICS
4.3.1 LCD ELETRONICS SPECIFICATION
Parameter Symbol
Min. Typ. Max.
Power Supply Voltage VCCS (3.0) (3.3) (3.6) V (1)Ripple Voltage VRP - (50) - mV (1)-
Value
Unit Note
CABC_EN Input Voltage
High Level V
Low Level V
Inrush Current I
(2.3) - (3.6) V
IHCABC
(0) - (0.5) V
ILCABC
- - 1.5 A (1),(2)
RUSH
Mosaic - TBD TBD mA (3)a
Power Supply Current
Black
lcc
- TBD TBD mA (3)b
Note (1) The ambient temperature is Ta = 25 ± 2 ºC.
Note (2) I
: the maximum current when VCCS is rising
RUSH
I
: the maximum current of the first 100ms after power-on
IS
Measurement Conditions: Shown as the following figure. Test pattern: black.
+3.3V
Q1 2SK1475
VR1
R1
47K
Q2
2SK1470
C2
47K
R2
1K
0.01uF
(High to Low)
(Control Signal)
SW
+12V
C1
1uF
FUSE
C3
1uF
VCCS
(LCD Module Input)
VCCS rising time is 0.5ms
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PRODUCT SPECIFICATION
Note (3) The specified power supply current is under the conditions at VCCS = 3.3 V, Ta = 25 ± 2 ºC, DC
Current and f
= 60 Hz, whereas a power dissipation check pattern below is displayed.
v
a. Mosaic Pattern
Active Area
b. Black Pattern
Active Area
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PRODUCT SPECIFICATION
4.3.2 LED CONVERTER SPECIFICATION
Value
Parameter Symbol
Min. Typ. Max.
Converter Input power supply voltage LED_Vccs(6.0) (12.0) (21.0) V
Unit Note
Converter Inrush Current ILED
RUSH
- - (1.5) A (1)
Backlight On (2.3) - (5.0) V
EN Control Level
Backlight Off
0 - (0.5) V
PWM High Level (2.3) - (5.0) V
PWM Control Level
PWM Low Level
0 - (0.5) V
(10) - 100 %
PWM Control Duty Ratio
(5) - 100 % (2)
PWM Control Permissive Ripple
Voltage
PWM Control Frequency f
VPWM_pp- - 100 mV
(190) - (2K) Hz (3)
PWM
LED Power Current LED_VCCS =Typ. ILEDTBD TBD TBD mA (4)
Note (1) ILED
ILED
Measurement Conditions: Shown as the following figure. LED_VCCS = Typ, Ta = 25 ± 2 ºC, f
: the maximum current when LED_VCCS is rising,
RUSH
: the maximum current of the first 100ms after power-on,
IS
PWM
= 200 Hz, Duty=100%.
LED_VCCS(Typ)
Q1 IRL3303
VR1
R1
47K
R2
1K
47K
0.01uF
Q2
IRL3303
C2
(High to Low)
(Control Signal)
SW=24V
LED_VCCS(Typ)
C1
1uF
FUSE
C3
1uF
(LED Converter Input)
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PRODUCT SPECIFICATION
≤
∗
∗+≤
LED_VCC
LED_PWM
LED_EN
ILED
0V
0V
0V
ILED
VLED rising time is 0.5ms
0.5ms
90%
10%
Rush
100ms
ILED
IS
Note (2) If the PWM control duty ratio is less than 10%, there is some possibility that acoustic noise or
backlight flash can be found. And it is also difficult to control the brightness linearity.
Note (3) If PWM control frequency is applied in the range less than 1KHz, the “waterfall” phenomenon on
the screen may be found. To avoid the issue, it’s a suggestion that PWM control frequency should
follow the criterion as below.
PWM control frequency f
+fN)33.0( f
should be in the range
PWM
fN
PWM
)66.0(
N : Integer )3(≥N
f : Frame rate
Note (4) The specified LED power supply current is under the conditions at “LED_VCCS = Typ.”, Ta = 25
± 2 ºC, f
= 200 Hz, Duty=100%.
PWM
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PRODUCT SPECIFICATION
4.3.3BACKLIGHT UNIT
Ta = 25 ± 2 ºC
Parameter Symbol
LED Light Bar Power
Supply Volt age
LED Light Bar Power
Supply Current
L25 29 30 V
V
I
L -- (115) -- mA
Min. Typ. Max.
Power Consumption PL (2.88) (3.34) (3.45) W (3)
LED Life Time LBL 15000 - - Hrs (4)
Note (1) LED current is measured by utilizing a high frequency current meter as shown below :
Value
Unit Note
(1)(2)(Duty100%)
V
L, IL
LED
Light Bar
Light Bar Feedback
Channels
Note (2) For better LED light bar driving quality, it is recommended to utilize the adaptive boost converter
with current balancing function to drive LED light-bar.
Note (3) P
= IL ×VL (Without LED converter transfer efficiency)
L
Note (4) The lifetime of LED is defined as the time when it continues to operate under the cond itions at Ta =
o
25 ±2
C and IL = 23 mA(Per EA) until the brightness becomes 50% of its original value.≦
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PRODUCT SPECIFICATION
|
|
4.4 LVDS INPUT SIGNAL TIMING SPECIFICATIONS
4.4.1 LVDS DC SPECIFICATIONS
Parameter Symbol
Min. Typ. Max.
LVDS Differential Input High Threshold V
LVDS Differential Input Low Threshold V
LVDS Common Mode Voltage VCM (1.125)- (1.375) V (1)
LVDS Differential Input Voltage |VID| (100) - (600) mV (1)
L VDS Terminating Resistor RT (100) Ohm -
Note (1) The parameters of LVDS signal s are defined as the following figures.
Single Ended
V
0V
CM
TH(LVDS)
(-100) - - mV
TL(LVDS)
- - (+100) mV
Value
Unit Note
V
V
VID|
(1),
=1.2V
CM
(1)
=1.2V
CM
Differential
4.4.2 LVDS DATA FORMAT
CLK+
Rxin2
Rxin1
Rxin0
T/7
IN20 IN19 IN18 IN17 IN16 IN15 IN14
DE B5 B4 B3 B2 Vsync Hsync
IN13 IN12 IN11 IN10 IN9 IN8 IN7
B1 G4 G3 G2 G1 B0 G5
IN6
G0 R3 R2 R1 R0
V
0V
V
IN5 IN4 IN3 IN2 IN1 IN0
R5
VID|
R4
Signal for 1 DCLK Cycle (T)
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RXEC+
RXE2+/-
PRODUCT SPECIFICATION
T/7
IN20 IN19 IN18 IN17 IN16 IN15 IN14
DE EB5 EB4 EB3 EB2 Vsync Hsync
RXE1+/-
RXE0+/-
IN13 IN12 IN11 IN10 IN9 IN8 IN7
EB1 EG4 EG3 EG2 EG1 EB0 EG5
IN6
EG0 ER3 ER2 ER1 ER0 ER5 ER4
IN5 IN4 IN3 IN2 IN1 IN0
Signal for 1 DCLK Cycle (T)
4.4.3 COLOR DATA INPUT ASSIGNMENT
The brightness of each primary color (red, green and blue) is based on the 6-bit gray scale data input
for the color. The higher the binary input the brighter the color. The table below provides the assignment
of color versus data input.
Data Signal
Color
R5 R4 R3 R2 R1 R0 G5 G4 G3 G2 G1 G0 B5 B4 B3 B2 B1 B0
Black
Red
Green
Basic
Colors
Gray
Scale
Of
Red
Gray
Scale
Of
Green
Gray
Scale
Of
Blue
Note (1) 0: Low Level Voltage, 1: High Level Voltage
Blue
Cyan
Magenta
Yellow
White
Red(0)/Dark
Red(1)
Red(2)
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PRODUCT SPECIFICATION
4.5 DISPLAY TIMING SPECIFICATIONS
The input signal timing specifications are shown as the following table and timing diagram.
Signal Item SymbolMin. Typ. Max. Unit Note
DCLK Frequency 1/Tc TBD (97.79) TBD MHz -
Vertical Total Time TV TBD (926)TBD TH -
Vertical Active Display Period TVD (900)(900)(900) TH -
DE
Note (1) Because this module is operated by DE only mode, Hsync and Vsync are ignored.
DE
DCLK
DE
Vertical Active Blanking Period TVB TV-TVD(26) TV-TVD TH -
Horizontal Total Time TH TBD (1760) TBD Tc -
Horizontal Active Display Period THD (1600)(1600) (1600) Tc -
Horizontal Active Blanking Period THB
INPUT SIGNAL TIMING DIAGRAM
TC
TH-THD
T
HD
(160)
TH-THD
Tc -
DATA
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PRODUCT SPECIFICATION
4.6 POWER ON/OFF SEQUENCE
The power sequence specifications are shown as the following table and diagram.
Symbol
Min. Typ. Max.
t1 (0.5) - (10) ms
t2 (0) - (50) ms
t3 (0) - (50) ms
t4 (500) - - ms
t5 (200) - - ms
t6 (200) - - ms
t7 (0.5) - (10) ms
tA (0.5) - (10) ms
tB (0) (10) ms
tC (10) - - ms
tD (10) - - ms
tE (10) - - ms
tF (10) - - ms
Value
Unit Note
- Power Supply
for LCD, VCCS
- Interface Signal
(LVDS Signal of
Transmitter), VI
- Power Supply for
LED Converter,
LED_VCCS
- LED Converter
Dimming Signal,
LED_PWM
- LED Converter
Enable Signal,
LED_EN
0V
0V
0V
0V
0V
Power On
90%
10%
Power Off
t1
t2
Valid Data
t6 t5
90%
10%
tA
tC
PWM Signal
tE t
90%
tB
t
D
F
90%
10%
t3
t7
10%
10%
t4
Note (1) Please don’t plug or unplug the interface cabl e when system is turned on.
Note (2) Please avoid floating state of the interface signal during signal invalid period.
Note (3) It is recommended that the backlight power must be turned on after the power supply for LCD and the
interface signal is valid.
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PRODUCT SPECIFICATION
θ
y
90
θ
y
90
θx− θx+
y
θ
θ
y
5. OPTICAL CHARACTERISTICS
5.1 TEST CONDITIONS
Item Symbol Value Unit
Ambient Temperature T a
Ambient Humidity Ha
25±2
50±10
Supply Volt age VCC 3.3 V
Input Signal According to typical value in "3. ELECTRICAL CHARACTERISTICS"
LED Light Bar Input Current IL
(115)
The measurement methods of optical characteristics are shown in Section 5.2. The following items
should be measured under the test conditions described in Section 5.1 and stable environment shown in
Note (5).
5.2 OPTICAL SPECIFICATIONS
Item Symbol Condition Min. Typ. Max. UnitNote
Contrast Ratio CR 500 650 - -
Response Time
Average Luminance of White
Red
Color
Chromaticity
Green
Blue
White
Horizontal
Viewing Angle
Vertical
White Variation of 5 Points
Note (1) Definition of Viewin g Angle (θx, θy):
θX- = 90º
TR - (3) (8) ms
T
- (7) (12) ms
F
L
AVE
Rx
Ry
Gx
Gy
Bx
By
=0°, θY =0°
θ
x
Viewing Normal Angle
255 300 - cd/m
(0.580)
(0.340)
(0.325)
Typ –
0.03
(0.565)
(0.159)
Typ +
0.03
(0.145)
Wx 0.313 Wy
θ
θ
θ
θ
δW
+
x
-
x
+
Y
-
Y
5p
CR≥10
θ
=0°, θY =0°
x
40 45
40 45 15 20 40 45 -
80 - - %
0.329
Normal
x =
= 0º
θy- θy+
x-
12 o’clock direction
+
+ =
º
o
C
%RH
mA
-
-
-
-
-
-
-
Deg.
2
(2),
(5),(7)
(3),(7)
(4),
(6),(7)
(1),(7)
(1),(5),
(7)
(5),(6),
(7)
6 o’clock
- =
y-
x+
θX+ = 90º
º
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Note (2) Definition of Contrast Ratio (CR):
The contrast ratio can be calculated by the following expression.
Contrast Ratio (CR) = L63 / L0
L63: Luminance of gray level 63
L 0: Luminance of gray level 0
CR = CR (1)
CR (X) is corresponding to the Contrast Ratio of the point X at Figure in Note (6).
PRODUCT SPECIFICATION
Note (3) Definition of Response Time (T
R
100%
90%
Optical
Response
10%
0%
T
R
66.67 ms
Note (4) Definition of Average Luminan ce of White (L
Measure the luminance of White at 5 points
L
= [L (1)+ L (2)+ L (3)+ L (4)+ L (5)] / 5
AVE
L (x) is corresponding to the luminance of the point X at Figure in Note (6)
, TF):
AVE
):
T
F
66.67 ms
Time
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Note (5) Measurement Setup:
(
A
)
The LCD module should be stabilized at given temperature for 20 minutes to avoid abrupt
temperature change during measuring. In order to stabilize the luminance, the measurement
should be executed after lighting Backlight for 20 minutes in a windless room.
LCD M odule
LCD P anel
USB2000
or equivalent
PRODUCT SPECIFICATION
CS-2000T
or equivalent
Center of the Screen
500 mm
Light Shield Room
mbient L uminance < 2 l u x
Note (6) Definition of White Variation (δW):
Measure the luminance of White at 5 points
= {Minimum [L (1)~L (5)] / Maximum [L (1)~ L (5)]}*100%
δW
5p
10mm
6
H/4
2
H
9
45
7
3
1
8
X
: Test Point
10
X=1 to 13
H/4H/4H/4
10mm
11
10mm10mm
W/4W/4W/4W/4
12
W
13
Active area
Note (7) The listed optical specifications refer to the initial value of manufacture, but the condition of
the specifications after long-term operation will not be warranted.
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PRODUCT SPECIFICATION
6. RELIABILITY TEST ITEM
Test Item Test Condition Note
High Temperature S t orage Test 60ºC, 240 hours
Low Temperature Storage Test -20ºC, 240 hours
Thermal Shock Storage Test
-20ºC, 0.5hour←→60℃, 0.5hour; 100cycles, 1hour/cycle
High Temperature Operation Test 50ºC, 240 hours
Low Temperature Operation Test 0ºC, 240 hours
High Temperature & High Humidity
Operation Test
ESD Test (Operation)
Shock (Non-Operating)
Vibration (Non-Operating)
Note (1) criteria : Normal display image with no obvious non-uniformity and no line defect.
Note (2) Evaluation should be tested after storage at room temperature for more than two hour
Note (3) At testing Vibration and Shock, the fixture in holding the module has to be hard and rigid enough
so that the module would not be twisted or bent by the fixture.
220G, 2ms, half sine wave,1 time for each direction of
±X,±Y,±Z
1.5G / 10-500 Hz, Sine wave, 30 min/cycle, 1cycle for each
X, Y, Z
(1) (2)
(1)
(1)(3)
(1)(3)
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PRODUCT SPECIFICATION
7. PACKING
7.1 MODULE LABEL
The barcode nameplate is pasted on each module as illustration, and its definitions are as following explanation.
(a) Model Name: N140FGE - LA2
(b) Revision: Rev. XX, for example: C1, C2 …etc.
(c) Serial ID: X X
(d) Production Location: MADE IN XXXX.
(e) UL/CB logo: XXXX is UL factory ID.
Serial ID includes the information as below:
(a) Manufactured Date: Year: 0~9, for 2010~2019
Day: 1~9, A~Y, for 1
(b) Revision Code: cover all the change
X X X X X Y M D L N N N N
Month: 1~9, A~C, for Jan. ~ De c.
Serial No.
Product Line
Year, Month, Date
CMI Internal Use
Revision
CMI Internal Use
st
to 31st, exclude I , O and U
(c) Serial No.: Manufacturing sequence of product
(d) Product Line: 1 -> Line1, 2 -> Line 2, …etc.
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7.2 CARTON
PRODUCT SPECIFICATION
Figure. 7-2 Packing method
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7.3 PALLET
PRODUCT SPECIFICATION
Figure. 7-3 Packing method
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PRODUCT SPECIFICATION
8. PRECAUTIONS
8.1 HANDLING PRECAUTIONS
(1) The module should be assembled into the system firmly by using every mounting hole. Be careful
not to twist or bend the module.
(2) While assembling or installing modules, it can only be in the clean area. The dust and oil may cause
electrical short or damage the polarizer.
(3) Use fingerstalls or soft gloves in order to keep display clean during the incoming inspection and
assembly process.
(4) Do not press or scratch the surface harder than a HB pencil lead on the panel because the polarizer
is very soft and easily scratched.
(5) If the surface of the polarizer is dirty, please clean it by some absorbent cotton or soft cloth. Do not
use Ketone type materials (ex. Acetone), Ethyl alcohol, Toluene, Ethyl acid or Methyl chloride. It
might permanently damage the polarizer due to chemical reaction.
(6) Wipe off water droplets or oil immediately. Staining and discoloration may occur if they left on panel
for a long time.
(7) If the liquid crystal material leaks from the panel, it should be kept away from the eyes or mouth. In
case of contacting with hands, legs or clothes, it must be washed away thoroughly with soap.
(8) Protect the module from static electricity, it may cause damage to the C-MOS Gate Array IC.
(9) Do not disassemble the module.
(10) Do not pull or fold the LED wire.
(11) Pins of I/F connector should not be touched directly with bare hands.
8.2 STORAGE PRECAUTIONS
(1) High temperature or humidity may reduce the performance of module. Please store LCD module
within the specified storage conditions.
(2) It is dangerous that moisture come into or contacted the LCD module, because the moisture may
damage LCD module when it is operating.
(3) It may reduce the display quality if the ambient temperature is lower than 10 ºC. For example, the
response time will become slowly, and the starting voltage of LED will be higher than the room
temperature.
8.3 OPERATION PRECAUTIONS
(1) Do not pull the I/F connector in or out while the module is operating.
(2) Always follow the correct power on/off sequence when LCD module is connecting and operating.
This can prevent the CMIS LSI chips from damage during latch-up.
(3) The startup voltage of Backlight is approximately 1000 Volts. It may cause electrical shock while
assembling with converter . Do not disassemble the module or insert anything into the Backlight unit.
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Page 25
PRODUCT SPECIFICATION
Appendix. EDID DATA STRUCTURE
The EDID (Extended Display Identification Data) data formats are to support displays as defined in the
VESA Plug & Display and FPDI standards.
9 ID system manufacturer name AE 10101110
0A ID system Product Code (LSB) 81 10000001
0B ID system Product Code (MSB) 14 00010100
0C 32-bit serial # Unused(01h for VESA, 00h for SPWG) 00 00000000
0D 32-bit serial # Unused(01h for VESA, 00h for SPWG) 00 00000000
0E 32-bit serial # Unused(01h for VESA, 00h for SPWG) 00 00000000
0F 32-bit serial # Unused(01h for VESA, 00h for SPWG) 00 00000000
10 Week of manufacture 1 - 53 (unused: 00h) : 10h fixed by CMO 1E 00011110
11 Year of manufacture year - 1990(unsed:00h) : 14h (Year 2010) fixed
by CMO
12 Version=1 01 00000001
13 Revision=4 04 00000100
14 Vedio Input Definition 90 10010000
15 Active area horizontal 31cm 1F 00011111
16 Active area vertical 17cm 11 00010001
17 Display Gamma (Gamma = "2.2") 78 01111000
18 Feature support 02 00000010
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PRODUCT SPECIFICATION
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
29 Standard timing ID # 2 01 00000001
2A Standard timing ID # 3 01 00000001
2B Standard timing ID # 3 01 00000001
2C Standard timing ID # 4 01 00000001
2D Standard timing ID # 4 01 00000001
2E Standard timing ID # 5 01 00000001
2F Standard timing ID # 5 01 00000001
30 Standard timing ID # 6 01 00000001
31 Standard timing ID # 6 01 00000001
32 Standard timing ID # 7 01 00000001
33 Standard timing ID # 7 01 00000001
34 Standard timing ID # 8 01 00000001
35 Standard timing ID # 8 01 00000001
36 Detailed timing description # 1 Pixel clock ( "97.79"MHz, According to
VESA CVT Rev1.4 )
37 # 1 97.79MHz/10000 =9779=2633(Hex) 26 00100110
38 # 1 H active ("1600") 40 01000000
39 # 1 H blank ("160") A0 10100000
3A # 1 H active : H blank ("1600 : 160") 60 01100000
3B # 1 V active ("900") 84 10000100
3C # 1 V blank ("26") 1A 00011010
3D # 1 V active : V blank ("900 : 26") 30 00110000
3E # 1 H sync offset ("48") 30 00110000
3F # 1 H sync pulse width ("32") 20 00100000
40 # 1 V sync offset : V sync pulse width ("3 : 5") 35 00110101
41 # 1 H sync offset : H sync pulse width : V sync offset : V sync width
("48 : 32 : 3 : 5")
42 # 1 H image size ("310 mm") 36 00110110
43 # 1 V image size ("174 mm") AE 10101110
44 # 1 H image size : V image size ("310 : 174") 10 00010000
45 # 1 H boarder ("0") 00 00000000
46 # 1 V boarder ("0") 00 00000000
47 Non-interlaced, Normal Display, Digital separate, Positive Hsync,
Negative Vsync
48 Detailed timing description # 2 Pixel clock ( "65.2"MHz, According to
VESA CVT Rev1.4 )
49 # 2 65.2MHz/10000 =6520=1978(Hex) 19 00011001
4A # 2 H active ("1600") 40 01000000
4B # 2 H blank ("160") A0 10100000
4C # 2 H active : H blank ("1600 : 160") 60 01100000
4D # 2 V active ("900") 84 10000100
4E # 2 V blank ("26") 1A 00011010
4F # 2 V active : V blank ("900 : 26") 30 00110000
50 # 2 H sync offset ("48") 30 00110000
51 # 2 H sync pulse width ("32") 20 00100000
52 # 2 V sync offset : V sync pulse width ("3 : 5") 35 00110101
53 # 2 H sync offset : H sync pulse width : V sync offset : V sync width
("48 : 32 : 3 : 5")
54 # 2 H image size ("310 mm") 36 00110110
33
00 00000000
1A 00011010
78 01111000
00 00000000
00110011
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55 # 2 V image size ("174 mm") AE 10101110
56 # 2 H image size : V image size ("310 : 174") 10 00010000
57 # 2 H boarder ("0") 00 00000000
58 # 2 V boarder ("0") 00 00000000
59 Non-interlaced, Normal Display, Digital separate, Positive Hsync,
Negative Vsync
5A Flag 00 00000000
5B Flag 00 00000000
5C Flag 00 00000000
5D Data Type Tag: Alphanumeric Data String (ASCII) FE 11111110
5E Flag 00 00000000
5F Dell P/N 1st Character"5" 35 00110101
6C Flag 00 00000000
6D Flag 00 00000000
6E Flag 00 00000000
6F Data Type Tag: Manufacturer Specified Data 00 00 00000000
70 Flag 00 00000000
71 Color Management 00 00000000
72 Panel Type and Revision 41 01000001
73 Frame Rate 31 00110001
74 Light Controller Interface and Maximum Luminance 9E 10011110
75 Front Surface / Polarizer and Pixel Structure 00 00000000
76 Multi-Media Features 10 00010000
77 Multi-Media Features 00 00000000
78 Special Features 00 00000000
79 Special Features 02 00000010
7A Special Features 01 00000001
7B (If <13 char, then terminate with ASCII code 0Ah, set remaining char =
20h)
7C (If <13 char, then terminate with ASCII code 0Ah, set remaining char =
20h)
7D (If <13 char, then terminate with ASCII code 0Ah, set remaining char =
20h)
7E No extension 00 00000000
7F Checksum 6C 01101100
1A 00011010
0A 00001010
0A 00001010
20 00100000
20 00100000
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Page 28
Appendix. OUTLINE DRAWING
PRODUCT SPECIFICATION
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PRODUCT SPECIFICATION
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PRODUCT SPECIFICATION
Appendix. SYSTEM COVER DESIGN NOTICE
1. Design gap A between panel & any components on system cover
a). Sufficient gap between panel & system is a must for preventing from backpack or pogo
test fail.
Definition
2 Design gap B1 & B2 between panel & protrusions
b). Zero gap from panel's maximum thickness boundary to any component s, foreign objects,
wire, cable or extrusion on system cover inner surface is forbidden.
2.0mm min. gap is recommended between panel & protrusions for preventing from shock
Definition
3 Design gap C between system front bezel & panel surface.
related failures.
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PRODUCT SPECIFICATION
C
LCD
Backlight
Panel Backcover
a). Sufficient gap between system front bezel & panel surface is a must for preventing from
pooling or glass broken.
Definition
4 Design gap D1 & D2 between system front bezel & PCB Assembly.
b). Zero gap or interference is forbidden.
System
front bezel
a). Sufficient gap between system front bezel & PCB assembly is a must for preventing from
abnormal display after backpack test, hinge test, twist test or pogo test.
Definition
5 Interference examination of antenna cable and WebCam wire
Definition
6 System inner surface examination
b). Zero gap or interference is forbidden.
WebCam Wire
a). Antenna cable or WebCam wire overlap with panel outline is forbidden for preventing
from abnormal display & white spot after backpack test, hinge test, twist test or pogo test.
b). Antenna cable or WebCam wire bypass panel outline is recommende d.
WebCam Wire
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Page 32
PRODUCT SPECIFICATION
Definition a). Burr at logo edge, step, protrusion or PCB board will easily cause white spot or glass
broken.
b). Keeping flat surface underneath backlight is recommended.
7 Tape/sponge design on system inner su rface
Definition a) To prevent abnormal display & white spot after scuffing test, hinge test, pogo test,
backpack test, it is not recommended to add tape/sponge in separate location. Since each
tape/sponge may act as pressure concentration location.
b) We suggest to design a tape/sponge that well covered under panel rear cover.
8 Assembly SOP examination
Definition To prevent panel crack during system front bezel assembly process with hook design, it is
prohibited to press panel or any location that related directly to the panel.
9 Material used for system rear bezel
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Page 33
PRODUCT SPECIFICATION
Definition To prevent panel crack during system front bezel assembly process without hook design, it
is only allowed to give slight pressure with large contact area. This can help to distribute the
stress to prevent point concentration, also it is suggest to put the system on a flat surface
stage during the assembly.
10 Material used for system rear bezel
Definition a) To prevent abnormal display & white spot after scuffing test, hinge test, pogo test,
backpack test, as the poor rigidity result from deformation of system rear cover during the
test.
b) We suggest to use aluminum-magnesium alloy as the rear frame material with thickness
min 1.5mm, instead of using PC/ABS.
11 System base unit design near keyboard and mouse pad
Definition To prevent abnormal display & white spot after scuffing test, hinge test, pogo test, backpack
test, no sharp edge design is allowed in any area that may damage the panel during the
test. We suggest to remove all sharp edges, or to reduce the thickness difference of
keyboard/mouse pad from the nearby surface.
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