WB10
Datasheet
Copyright and thirdparty information as required
Revisions History
Date
Version
Number
Document Changes
2018/03/05 0.0 Initial Draft
2018/04/18 0.1 Correct typo
2018/08/14 0.2 Update connector SPEC and link
® 2018 InnoComm Mobile Technology Corp.
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Copyright © 2018, InnoComm Mobile Technology Corp.
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www.innocomm.comii
Table of Contents
1 Overview ................................................................................................................................................................................. 5
1.1 .... General Information ......................................................................................................................................................... 5
1.2 .... Architecture and Block Diagram ................................................................................................................................ 6
1.3 .... Feature Summary .............................................................................................................................................................. 6
1.4 .... Dimension .............................................................................................................................................................................. 7
2 Main Hardware Components ......................................................................................................................................... 8
2.1 .... CPU ............................................................................................................................................................................................ 9
2.2 .... Memory ................................................................................................................................................................................... 9
2.3 .... Power Management IC .................................................................................................................................................... 9
2.4 .... eMMC Storage ................................................................................................................................................................... 10
2.5 .... Wi-Fi/Bluetooth Module .............................................................................................................................................. 10
2.6 .... Antenna ................................................................................................................................................................................ 10
3 WB10 Interfaces and Connectors .............................................................................................................................. 11
3.1 .... CON2601 Connector ....................................................................................................................................................... 11
3.2 .... CON2401 Connector ....................................................................................................................................................... 12
3.3 .... CON2501 Connector ....................................................................................................................................................... 13
4 WB10Interfaces ................................................................................................................................................................ 14
4.1 .... Power Signals .................................................................................................................................................................... 14
4.2 .... GPIO ....................................................................................................................................................................................... 15
4.3 .... Ethernet ............................................................................................................................................................................... 15
4.4 .... USB ......................................................................................................................................................................................... 16
4.5 .... UARTs ................................................................................................................................................................................... 17
4.6 .... I2Cs......................................................................................................................................................................................... 17
4.7 .... eCSPI...................................................................................................................................................................................... 18
4.8 .... DSI Interface ...................................................................................................................................................................... 18
4.9 .... MIPI CSI interface ........................................................................................................................................................... 19
4.10 .. PWM ...................................................................................................................................................................................... 20
4.11 .. SD/MMC ............................................................................................................................................................................... 20
4.12 .. SAIs......................................................................................................................................................................................... 20
4.13 .. HDMI ..................................................................................................................................................................................... 23
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4.14 .. SPDIF ..................................................................................................................................................................................... 23
4.15 .. PCIe ........................................................................................................................................................................................ 24
5 Getting start ........................................................................................................................................................................ 24
6 Reference Documents ..................................................................................................................................................... 25
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1 Overview
1.1 General Information
WB10 is a high performance System on Module(SOM) which is designed based on
NXP®i.MX8MQuad processor. The i.MX8MQuad integrate fourARM® Cotex-A53up to 1.5GHz
and oneCotex-M4 cores to provide industry-leading audio voice and video processing for
applications that scale from consumer home audio to home&building automation, voice
assistance&machine vision, healthcare industry, etc.It supports video quality with full 4K
Ultra HD resolution and supports the highest levels of pro audio fidelity with more than 20
audio channels each @384KHz as well.
WB10 module offers a wide range of interfaces - GPIOs, PWM, I2C, SPI, CSI, DSI, HDMI, UART,
USB 3.0 and synchronous audio interface (SAI) that supports full duplex serial interfaces with
frame synchronization, such as I2S, AC97, TDM, and codec/DSP interfaces. Moreover, this
module features anEthernet PHY on the module to support Giga bitsEthernet Transceiver
with HP Auto-MDIX.
It targets a wide range of embedded products such as medical devices, industrial automation,
HMIs, data acquisition, and much more.
www.innocomm.com5
1.2 Architecture and Block Diagram
Figure 1-1 WB10 SOM Block Diagram
1.3 Feature Summary
NXP i.MX8M Quad
1GB/2GB LPDDR4 RAM
4GB/8GB eMMC
HDMI2.0a output
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1 x MIPI DSI
2 x MIPI CSI
Wi-Fi 802.11 a/b/g/n/ac, 2x2 MIMO
Bluetooth 4.2
1 x USB 2.0 OTG
1 x USB 3.0 Host
1x Ethernet Gigabits
1 x SD/MMC
Serial interfaces (3 x I2C, 3 x UART, 1 x SPI, 4 x SAI)
2 x PWM/GPIOs
1x PCIe2.0
1.4 Dimension
Figure 1-5 WB10 Dimension
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2 Main Hardware Components
WB10has three Hirose DF40C-80DP-0.4V(51)80in headers to connect with another carrier
board. Itintegrates the NXP®i.MX8M, LPDDR4 Memory,eMMC, Power Manage IC (PMIC),
and Wi-Fi/Bluetooth on the module.
Figure 2-1 – Top side of WB10
Figure 2-2 – Bottom side of WB10
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2.1 CPU
The i.MX 8MQuad integrate four ARM® Cotex-A53 up to 1.5GHz and one Cotex-M4 coresto
provide industry-leading audio, voice and video processing for applications.
The features of the i.MX 8MQuad of processors include the following:
• 4xARM Cortex-A53 plus ARM Cortex-M4
• L1 Instruction Cache
32 KB L1 Instruction Cache for A53
16 KBL1 Instruction Cache for M4
• L1 Data Cache (each core)
32 KB L1 Data Cache (A7)
16 KB L1Data Cache (M4)
• The ARM Cortex-A53 Core complex shares
General interrupt controller (GIC)
Global timer
Snoop control unit (SCU)
Unified instruction and data (1MB)
2.2 Memory
WB10 is available with up to 3GB of LPDDR4 memory. The default configuration is 1GB/2GB
LPDDR4.
2.3 Power Management IC
WB10 features Rohm BD71837MWV power management IC. BD71837MWV is a
programmable power management IC integrates 8 buck regulators and 7 LDOs to provide all
power rails required by SoC and peripherals.
For system management, it provides the following features,
Support software shutdown or hardware power off
External wakeup source
Output monitor
PWROK signal for reset or power off
OVP, UVLO, TSD
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2.4 eMMC Storage
The onboard eMMC device is connected on the SD1 pins of the i.MX 8M processor in an 8 bit
width configuration.
2.5 Wi-Fi/Bluetooth Module
The WB10 adopts Fn-Link 8274B combo module that integrates wireless local area
network802.11 a/b/g/n/ac2x2 MIMO and Bluetooth 4.2.
2.6 Antenna
The module is shipped with an Embedded Wi-Fi Dual Band Antenna, only the antenna
supplied with the module may be used. It is PCB type, using IPEX connecter to connect
with module.
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3 WB10 Interfaces and Connectors
CON2601
i.MX
8
CON2601
i.MX8
WB10is equipped with threeHirose DF40C-80DP-0.4V(51)connectors- CON2401, CON2501
and CON2601. The tables below detail the pin assignment and functionality of these
connectors.
3.1 CON2601 Connector
Table 3-1 CON2601 Connector
Pin#
1 PWRON_B . 2 VDD_SD2 .
3 BTB_GPIO5_IO7 A4 ECSPI1_MOSI 4 VDD_ETH_3V3 .
5 BTB_GPIO5_IO6 D5 ECSPI1_SCLK 6 GND .
7 GND . 8 GPIO3_IO6 G20
9 PCIE2_RXM D24 10 GPIO3_IO12 L19
11 PCIE2_RXP D25 12 GPIO3_IO15 K19
13 GND . 14 GPIO3_IO7 J20
15 PCIE2_TXM E24 16 GPIO3_IO16 K20
17 PCIE2_TXP E25 18 GPIO3_IO10 L20
19 GND . 20 GPIO3_IO8 H22
21 PCIE2_REF_CLKM F24 22 GPIO3_IO11 J22
23 PCIE2_REF_CLKP F25 24 GPIO3_IO9 J21
25 GND . 26 GPIO3_IO18 K21
27 GPIO3_IO17 K22 28 GND .
29 SD2_CLK L22 30 SD2_WP M21
31 GPIO3_IO14 M20 32 SD2_CMD M22
Signal Name
Pin #
i.MX8 Ball Name
Pin#
Signal Name
Pin #
i.MX8 Ball Name
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33 GPIO3_IO13 M19 34 SD2_DATA0 N22
35 SD2_DATA3 P21 36 SD2_DATA1 N21
37 SD2_nRST R22 38 SD2_DATA2 P22
39 SD2_nSDCD L21 40 GND .
41 JTAG_TCK T5 42 JTAG_TMS V5
43 JTAG_nTRST U6 44 JTAG_TDO U5
45 GND . 46 BOOT_MODE1 V6
47 ETHER_TRXN3 . 48 BOOT_MODE0 W6
49 ETHER_TRXP3 . 50 JTAG_TDI W5
51 GND . 52 ONOFF W21 ONOFF
53 ETHER_TRXN2 . 54 GND .
55 ETHER_TRXP2 . 56 LED_1000 .
57 GND . 58 LED_ACT .
59 ETHER_TRXN1 . 60 SYS_nRST .
61 ETHER_TRXP1 . 62 VDD_1V8 .
63 GND . 64 VDD_1V8 .
65 ETHER_TRXN0 . 66 VDD_SNVS_3V3 .
67 ETHER_TRXP0 . 68 PORn W20 POR_B
69 GND . 70 GND .
71 VDC_5V . 72 VDC_5V .
73 VDC_5V . 74 VDC_5V .
75 VDC_5V . 76 VDC_5V .
77 VDC_5V . 78 VDC_5V .
79 VDC_5V . 80 VDC_5V .
3.2 CON2401 Connector
Table 3-2CON2401 Connector
CON2401
Pin#
1 HDMI_AUXM V2 2 HDMI_CEC P1
3 HDMI_AUXP V1 4 HDMI_DDC_SDA P3
5 GND . 6 HDMI_DDC_SCL R3
7 HDMI_D0M T2 8 HDMI_HPD W2
9 HDMI_D0P T1 10 GND .
11 GND . 12 HDMI_D1P U2
13 HDMI_D2P N2 14 HDMI_D1M U1
15 HDMI_D2M N1 16 GND .
17 GND . 18 HDMI_D3M M2
19 SAI1_RXC K1 20 HDMI_D3P M1
Signal Name
i.Mx8
Pin #
i.MX8 Ball Name
CON2401
Pin#
Signal Name
i.Mx8
Pin #
i.MX8 Ball Name
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21 SAI1_RXD0 K2 22 GND .
23 SAI1_RXD3 J2 24 SAI1_RXD1 L2
25 SAI1_RXD4 J1 26 SAI1_RXFS L1
27 SAI2_RXFS J4 28 SAI1_RXD2 H2
29 BTB_GPIO1_IO3 P4 GPIO1_IO03 30 SAI1_TXFS H1
31 BTB_GPIO1_IO1 T7 GPIO1_IO01 32 SAI2_RXC H3
33 SAI5_RXFS N4 34 SAI2_TXFS H4
35 SAI5_RXD2 M4 36 SAI1_RXD7 G1
37 BTB_GPIO1_IO5 P7 GPIO1_IO05 38 GND .
39 BTB_GPIO1_IO12 L7 GPIO1_IO12 40 SAI1_RXD6 G2
41 GND . 42 BTB_GPIO1_IO6 N5 GPIO1_IO06
43 SAI5_MCLK K4 44 SAI5_RXD0 M5
45 SAI5_RXD3 K5 46 BTB_GPIO1_IO8 N7 GPIO1_IO08
47 BTB_GPIO1_IO13 K6 GPIO1_IO13 48 GND .
49 BTB_GPIO1_IO15 J6 GPIO1_IO15 50 SAI5_RXD1 L4
51 SAI2_MCLK H5 52 SAI5_RXC L5
53 SAI2_RXD H6 54 SAI2_TXC J5
55 SPDIF_RX G6 56 SAI2_TXD G5
57 SPDIF_EXT_CLK E6 58 SPDIF_TX F6
59 SAI1_TXD0 F2 60 SAI3_TXFS G3
61 GND . 62 SAI1_RXD5 F1
63 SAI3_RXD F3 64 GND .
65 SAI1_TXC E1 66 SAI3_RXFS G4
67 SAI1_TXD1 E2 68 SAI1_TXD3 D1
69 SAI3_RXC F4 70 SAI1_TXD4 D2
71 SAI1_TXD7 C1 72 SAI3_TXD C3
73 SAI1_TXD5 C2 74 SAI3_MCLK D3
75 GND . 76 GND .
77 SAI1_TXD2 B2 78 SAI1_TXD6 B3
79 SAI1_MCLK A3 80 SAI3_TXC C4
3.3 CON2501 Connector
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Table 3-3CON2501 Connector
CON2501
Pin#
i.Mx8
CON2501
i.Mx8
UART4_TXD
UART4_RXD
1 ECSPI2_MOSI E5 2 USB1_VBUS D14
3 ECSPI2_MISO B5 4 USB1_ID C14
5 I2C3_SDA E9 6 UART2_TXD D6
7 I2C3_SCL G8 8 UART2_RXD B6
9 USB2_VBUS D9 10 ECSPI2_SCLK C5
11 USB2_ID C9 12 ECSPI2_SS0 A5
13 PCIE2_NCLKREQ F9 I2C4_SDA 14
15 I2C2_SCL G7 16
17 I2C2_SDA F7 18 UART1_TXD A7
19 I2C1_SDA E8 20 UART1_RXD C7
21 I2C1_SCL E7 22 GND .
23 GND . 24 DSI_D3P B15
25 DSI_CLKP D16 26 DSI_D3M A15
27 DSI_CLKM C16 28 DSI_D1P B16
29 DSI_D0P B17 30 DSI_D1M A16
31 DSI_D0M A17 32 GND .
33 GND . 34 CSI2_CLKP B19
35 DSI_D2P B18 36 CSI2_CLKM A19
37 DSI_D2M A18 38 GND .
39 GND . 40 CSI2_D2P B21
41 CSI2_D1P B20 42 CSI2_D2M A21
43 CSI2_D1M A20 44 GND .
45 GND . 46 CSI1_CLKP B22
47 CSI2_D3P D19 48 CSI1_CLKM A22
49 CSI2_D3M C19 50 GND .
51 GND . 52 CSI1_D0P B23
53 CSI2_D0P D20 54 CSI1_D0M A23
55 CSI2_D0M C20 56 GND .
57 GND . 58 CSI1_D3P D21
59 CSI1_D1M C22 60 CSI1_D3M C21
61 CSI1_D1P D22 62 GND .
63 GND . 64 USB2_RXP A8
65 CSI1_D2M B24 66 USB2_RXN B8
67 CSI1_D2P C23 68 USB2_TXP A9
69 GND . 70 USB2_TXN B9
71 USB2_DP A10 72 USB1_RXP A12
73 USB2_DN B10 74 USB1_RXN B12
75 USB1_DP A14 76 USB1_TXP A13
77 USB1_DN B14 78 USB1_TXN B13
79 VDDIO_3V3 . 80 VDDIO_3V3 .
Signal Name
Pin #
i.MX8 Ball Name
Pin#
Signal Name
(UART2_RTS)
(UART2_CTS)
Pin #
i.MX8 Ball Name
D7
C6
4 WB10Interfaces
4.1 Power Signals
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Connector
PIN#
CON2601
71, 72, 73, 74, 75, 76, 77, 78 ,79 ,80
CON2601
62, 64
CON2601
66
CON2601
4
CON2601
2
CON2601
60
CON2601
1
CON2501
79, 80
CON2501
2
CON2501
9
4.2 GPIO
Table 4-1 Power Signal Pins
WB10Function I/O Description
VDC_5V I Input power 5V
VDD_1V8 O 1.8V power
VDD_SNVS_3V3 O RTC power
VDD_ETH_3V3 O Ethernet indicationLED power
VDD_SD2 O SD card power
SYS_nRST I SOM Reset
PWRON_B I Power On-Off Key
VDDIO_3V3 O 3.3V IO power
USB1_VBUS I USB1 VBUS input power
USB2_VBUS I USB2 VBUS input power
WB10 SOM has 15 dedicate pins for GPIO purpose, moreover the pins are not used in other
function (SDIO, SPI, UART, SAI..) can be configured as GPIO as well. The power domain of
WB10 SOM IOs is VDDIO_3V3.
Table 4-2 GPIO Signal Pins
Connector
PIN#
CON2601
3, 5, 8, 10, 12, 14, 16, 18, 20, 22, 24,
26, 27, 31, 33,
WB10 Function I/O Description
GPIO I/O GPIO (3.3V)
* Unused pins in other function (SDIO, SPI, UART, SAI) can be configured as GPIO.
4.3 Ethernet
One Gigabit Ethernet interface is supported.
Connector
PIN#
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Table 4-3 Ethernet Signal Pins
WB10Function I/O Description
CON2601
56
CON2601
58
CON2601
67
CON2601
65
CON2601
61
CON2601
59
CON2601
55
CON2601
53
CON2601
49
CON2601
47
LED1000 O Ethernet LED1 control
LED_ACT O Ethernet LED2 control
ETHER_TRXP0 IO Ethernet_TRXP
ETHER_TRXN0 IO Ethernet_TRXN
ETHER_TRXP1 IO Ethernet_TRXP
ETHER_TRXN1 IO Ethernet_TRXN
ETHER_TRXP2 IO Ethernet_TRXP
ETHER_TRXN2 IO Ethernet_TRXN
ETHER_TRXP3 IO Ethernet_TRXP
ETHER_TRXN3 IO Ethernet_TRXN
4.4 USB
The USB interface which provides high speed USB functionality conforms to the USB3.0. The
OTG controller conforms to OTG2.0 specification.
Connector
PIN#
CON2501
2
CON2501
4
CON2501
9
CON2501
11
CON2501
75
CON2501
77
CON2501
71
CON2501
73
CON2501
72
CON2501
74
CON2501
76
CON2601
78
CON2501
64
CON2501
66
Table 4-4 USB Signal Pins
WB10Function I/O Description
USB1_VBUS I USB1_VBUS
USB1_ID I USB1_ID
USB2_VBUS I USB2_VBUS
USB2_ID I USB2_ID
USB1_DP IO USB1_DP
USB1_DN IO USB1_DN
USB2_DP IO USB2_DP
USB2_DN IO USB2_DN
USB1_RXP IO USB1_RXP
USB1_RXN IO USB1_RXN
USB1_TXP IO USB1_TXP
USB1_TXN IO USB1_TXN
USB2_RXP IO USB2_RXP
USB2_RXN IO USB2_RXN
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CON2501
68
CON2501
70
USB2_TXP IO USB2_TXP
USB2_TXN IO USB2_TXN
4.5 UARTs
Each of the UART interface support the followingserial data transmit/receive protocols
andconfigurations:
• 7- or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd or none)
• Programmable baud rates up to 4 Mbps. This is a higher max baud rate relative to the
1.875 MHz, which is stated by the TIA/EIA-232-F standard.
• 32-byte FIFO on Tx and 32 half-word FIFO on Rx supporting auto-baud
Table 4-5 UART Signal Pins
Connector
PIN#
CON2501
6
CON2501
8
CON2501
14
CON2501
16
CON2501
18
CON2501
20
WB10 Function I/O Description
UART2_TXD O UART2_TXD
UART2_RXD I UART2_RXD
UART4_TXD O UART4_TXD
UART4_RXD I UART4_RXD
UART1_TXD O UART1_TXD
UART1_RXD I UART1_RXD
4.6 I2Cs
WB10SOM has three I2C interfaces which provide serial interface for external devices. Data
rates of up to 400 kbps are supported.
Table 4-6 I2C Signal Pins
Connector
PIN#
CON2501
5
CON2501
7
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WB10 Function I/O Description
I2C3_SDA IO I2C3_SDA
I2C3_SCL IO I2C3_SCL
CON2501
15
CON2501
17
CON2501
19
CON2501
21
I2C2_SCL IO I2C2_SCL
I2C2_SDA IO I2C2_SDA
I2C1_SDA IO I2C1_SDA
I2C1_SCL IO I2C1_SCL
4.7 eCSPI
WB10 SOM supports one full-duplex Enhanced Configurable Serial Peripheral Interface
(ECSPI).
The ECSPI contain a 64x32 receive buffer and a 64x32 transmit buffer.
Table 4-7eSPI Signal Pins
Connector
PIN#
CON2501
1
CON2501
3
CON2501
10
CON2501
12
WB10 Function I/O Description
ECSPI2_MOSI O ECSPI2_MOSI
ECSPI2_MISO I ECSPI2_MISO
ECSPI2_SCLK O ECSPI2_SCLK
ECSPI2_SS0 O ECSPI2_SS0
4.8 DSI Interface
WB10SOM provides a 4-lanes MIPI display interface operating up to 1080p60 resolution.
Table 4-8 DSI Signal Pins
Connector
PIN#
CON2501
25
CON2501
27
CON2501
29
CON2501
31
CON2501
28
CON2501
30
CON2501
35
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WB10 Function I/O Description
DSI_CLKP O DSI_CLKP
DSI_CLKM O DSI_CLKM
DSI_D0P O DSI_D0P
DSI_D0M O DSI_D0M
DSI_D1P O DSI_D1P
DSI_D1M O DSI_D1M
DSI_D2P O DSI_D2P
CON2501
37
CON2501
24
CON2501
26
DSI_D2M O DSI_D2M
DSI_D3P O DSI_D3P
DSI_D3M O DSI_D3M
4.9 MIPI CSI interface
This module provides a two 4-lanes MIPI camera interface operating up to a maximum bit
rate of 1.5 Gbps per lane, providing 4K@30fps capability for the 4 lanes.
Table 4-9 CSI Signal Pins
Connector
PIN#
CON2501
34
CON2501
36
CON2501
53
CON2501
55
CON2501
41
CON2501
43
CON2501
40
CON2501
42
CON2501
47
CON2501
49
CON2501
46
CON2501
48
CON2501
52
CON2501
54
CON2501
61
CON2501
59
CON2501
65
CON2501
67
CON2501
58
CON2501
60
WB10 Function I/O Description
CSI2_CLKP I CSI2_CLKP
CSI2_CLKM I CSI2_CLKM
CSI2_D0P
CSI2_D0M
CSI2_D1P
CSI2_D1M
CSI2_D2P
CSI2_D2M
CSI2_D3P I CSI2_D3P
CSI2_D3M
CSI1_CLKP
CSI1_CLKM
CSI1_D0P
CSI1_D0M
CSI1_D1P
CSI1_D1M
CSI1_D2P
CSI1_D2M
CSI1_D3P
CSI1_D3M
I
CSI2_D0P
I
CSI2_D0M
I
CSI2_D1P
I
CSI2_D1M
I
CSI2_D2P
I
CSI2_D2M
I
CSI2_D3M
I
CSI1_CLKP
I
CSI1_CLKM
I
CSI1_D0P
I
CSI1_D0M
I
CSI1_D1P
I
CSI1_D1M
I
CSI1_D2P
I
CSI1_D2M
I
CSI1_D3P
I
CSI1_D3M
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4.10 PWM
The pulse-width modulator (PWM) has a 16-bit counter and is optimized to generate sound
from stored sample audio images and it can also generate tones. It uses16-bit resolution and
a 4x16 data FIFO.
Table 4-10 PWN Signal Pins
Connector
PIN#
CON2401
29
CON2401
31
WB10Function I/O Description
BTB_GPIO1_IO3 IO PWM1
BTB_GPIO1_IO1 IO PWM2
4.11 SD/MMC
Fully compatible with MMC command/response setand Physical Layer as defined in the
MultimediaCard System Specification,v5.0/v4.4/v4.41/v4.4/v4.3/v4.2.
• Fully compatible with SD command/response sets and Physical Layer as defined in the
SD Memory Card Specifications v 3.0 including high-capacity SDXC cards up to 2 TB.
• Fully compatible with SDIO command/response sets and interrupt/Read-Wait mode as
defined in the SDIO Card Specification, Part E1, v. 3.0
Table 4-11 SD/MMC Signal Pins
Connector
PIN#
CON2601
30
CON2601
37
CON2601
32
CON2601
39
CON2601
34
CON2601
36
CON2601
38
CON2601
35
WB10Function I/O Description
SD2_WP O SD2 Write Protection
SD2_nRST O SD2 Rest
SD2_CMD O SD2_CMD
SD2_nSDCD I SD2 Card detection
SD2_DATA0 IO SD2_DATA0
SD2_DATA1 IO SD2_DATA1
SD2_DATA2 IO SD2_DATA2
SD2_DATA3 IO SD2_DATA3
4.12 SAIs
The SAI interface provides a synchronous audiointerface (SAI) that supports full duplex serial
interfaceswith frame synchronization, such as I2S, AC97, TDMand codec/DSP interfaces.
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Table 4-12 SAI1 Signal Pins
CON2401
PIN#
79 SAI1_MCLK O SAI1_MCLK
19 SAI1_RXC I SAI1_RXC
26 SAI1_RXFS I SAI1_RXFS
21 SAI1_RXD0 I SAI1_RXD0
24 SAI1_RXD1 I SAI1_RXD1
28 SAI1_RXD2 I SAI1_RXD2
23 SAI1_RXD3 I SAI1_RXD3
25 SAI1_RXD4 I SAI1_RXD4
62 SAI1_RXD5 I SAI1_RXD5
40 SAI1_RXD6 I SAI1_RXD6
36 SAI1_RXD7 I SAI1_RXD7
30 SAI1_TXFS O SAI1_TXFS
65 SAI1_TXC O SAI1_TXC
59 SAI1_TXD0 O SAI1_TXD0
67 SAI1_TXD1 O SAI1_TXD1
WB10 Function I/O Description
77 SAI1_TXD2 O SAI1_TXD2
68 SAI1_TXD3 O SAI1_TXD3
70 SAI1_TXD4 O SAI1_TXD4
73 SAI1_TXD5 O SAI1_TXD5
78 SAI1_TXD6 O SAI1_TXD6
71 SAI1_TXD7 O SAI1_TXD7
Table 4-13 SAI2,3,5 Signal Pins
CON2401
PIN#
51 SAI2_MCLK O SAI2_MCLK
32 SAI2_RXC I SAI2_RXC
27 SAI2_RXFS I SAI2_RXFS
53 SAI2_RXD I SAI2_RXD
54 SAI2_TXC O SAI2_TXC
34 SAI2_TXFS O SAI2_TXFS
56 SAI2_TXD O SAI2_TXD
74 SAI3_MCLK O SAI3_MCLK
WB10 Function I/O Description
69 SAI3_RXC I SAI3_RXC
66 SAI3_RXFS I SAI3_RXFS
63 SAI3_RXD I SAI3_RXD
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80 SAI3_TXC O SAI3_TXC
60 SAI3_TXFS O SAI3_TXFS
72 SAI3_TXD O SAI3_TXD
43 SAI5_MCLK O SAI5_MCLK
52 SAI5_RXC I SAI5_RXC
33 SAI5_RXFS I SAI5_RXFS
44 SAI5_RXD0 I SAI5_RXD0
50 SAI5_RXD1 I SAI5_RXD1
35 SAI5_RXD2 I SAI5_RXD2
45 SAI5_RXD3 I SAI5_RXD3
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4.13 HDMI
WB10SOM support HDMI TX port with HDMI 2.0a specification.
Table 4-14 HDMI Signal Pins
CON2401
PIN#
1 HDMI_AUXM I HDMI_AUXM
3 HDMI_AUXP I HDMI_AUXP
2 HDMI_CEC IO HDMI_CEC
4 HDMI_DDC_SDA IO HDMI_DDC_SDA
6 HDMI_DDC_SCL O HDMI_DDC_SCL
7 HDMI_D0M O HDMI_D0M
9 HDMI_D0P O HDMI_D0P
12 HDMI_D1P O HDMI_D1P
14 HDMI_D1M O HDMI_D1M
15 HDMI_D2M O HDMI_D2M
13 HDMI_D2P O HDMI_D2P
18 HDMI_D3M O HDMI_D3M
WB10 Function I/O Description
20 HDMI_D3P O HDMI_D3P
8 HDMI_HPD I HDMI_HPD
4.14 SPDIF
WB10SOM supports Sony/Philips Digital Interface with 24-bit data width.
Table 4-15 SPDIF Signal Pins
CON2401
PIN#
55 SPDIF_RX I SPDIF_RX
57 SPDIF_EXT_CLK I SPDIF_EXT_CLK
58 SPDIF_TX O SPDIF_TX
WB10Function I/O Description
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4.15 PCIe
Table 4-16 PCIe Signal Pins
CON2601
PIN#
9 PCIE2_RXM I Rx Data_M
11 PCIE2_RXP I Rx Data_P
15 PCIE2_TXM O Tx Data_M
17 PCIE2_TXP O Tx Data_P
21 PCIE2_REF_CLKM O CLK_M
23 PCIE2_REF_CLKP O CLK_P
WB10Function I/O Description
5 Getting start
1. The SoM can function power on 5V DC input, once system start, WB10 can use EVB
HDMI output or use USB sharing to external monitor for control.
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2. You can use App for any application like play video, music etc.
6 Reference Documents
3. i.MX 8M Family of Applications Processors Datasheet
4. i.MX 8M Family of Applications Processor Reference Manual
5. BD71837MWV Data sheet
6. Fn-Link 8274B Combo Wi-Fi Module Datasheet
7. LAN AR8035 Datasheet
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Federal Communication Commission Interference Statement
15.19
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
15.105
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the equipment off and on,
the user is encouraged to try to correct the interference by one or more of the following measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
15.21
Any changes or modifications not expressly approved by the party responsible for compliance could void the
authority to operate equipment.
This device and its antenna must not be co-located or operating in conjunction with any other antenna or
transmitter.
End-users and installers must be provided with antenna installation instructions and transmitter operating
conditions for satisfying RF exposure compliance.
For product available in the USA/Canada market, only channel 1~11 can be operated. Selection of other channels is
not possible
FCC RF Radiation Exposure Statement:
This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance
requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be
maintained between the antenna and the users for the host this module is integrated into. Under such configuration,
the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied.
Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate
this equipment.
USERS MANUAL OF THE END PRODUCT:
In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the
antenna while this end product is installed and operated. The end user has to be informed that the FCC radiofrequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be
informed that any changes or modifications not expressly approved by the manufacturer could void the user's
authority to operate this equipment.
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If the size of the end product is smaller than 8x10cm, then additional FCC part 15.19 statement is required to be
available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference
received, including interference that may cause undesired operation.
LABEL OF THE END PRODUCT:
The final end product must be labeled in a visible area with the following " Contains TX FCC ID: YAIWB10 ". If the size
of the end product is larger than 8x10cm, then the following FCC part 15.19 statement has to also be available on
the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1)
this device may not cause harmful interference and (2) this device must accept any interference received, including
interference that may cause undesired operation.
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MIC Statement
・5GHz product for indoor use only
・「5.2GHz 帯を使用する登録局と通信する場合を除き屋外使用禁止」
・「5.2GHz 帯を使用する登録局と通信する場合を除き屋内においてのみ使用可能」
・「5.2GHz 帯登録局と通信する場合を除き屋内においてのみ使用可能」
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