The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
Data Sheet, V1.2, March 2007
XC164KM
16-Bit Single-Chip Microcontroller
with C166SV2 Core
Microcontrollers
XC164KM
Revision History: V1.2, 2007-03
Previous Version(s):
V1.1, 2006-08
V1.0, 2005-11
PageSubjects (major changes since last revision)
6Design steps of the derivatives differentiated.
50Power consumption of the derivatives differentiated.
51Figure 10 adapted.
52Figure 12 adapted.
59Packages of the derivatives differentiated.
XC164KM
Derivatives
60Thermal resistances of the derivatives differentiated.
all“Preliminary” removed
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XC164KM16-Bit Single-Chip Microcontroller with C166SV2 Core
XC166 Family
1Summary of Features
For a quick overview or reference, the XC164KM’s properties are listed here in a
condensed way.
•High Performance 16-bit CPU with 5-Stage Pipeline
– 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution)
– 1-Cycle Multiplication (16 × 16 bit), Background Division (32 / 16 bit) in 21 Cycles
– 1-Cycle Multiply-and-Accumulate (MAC) Instructions
– Enhanced Boolean Bit Manipulation Facilities
– Zero-Cycle Jump Execution
– Additional Instructions to Support HLL and Operating Systems
– Register-Based Design with Multiple Variable Register Banks
– Fast Context Switching Support with Two Additional Local Register Banks
– 16 Mbytes Total Linear Address Space for Code and Data
– 1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible)
•16-Priority-Level Interrupt System with up to 63 Sources, Sample-Rate down to 50 ns
•8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via
Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space
•Clock Generation via on-chip PLL (factors 1:0.15 … 1:10), or
via Prescaler (factors 1:1 … 60:1)
•On-Chip Peripheral Modules
– 16-Channel General Purpose Capture/Compare Unit (CAPCOM2)
– Multi-Functional General Purpose Timer Unit with 5 Timers
– Two Synchronous/Asynchronous Serial Channels (USARTs)
– Two High-Speed-Synchronous Serial Channels
– On-Chip TwinCAN Interface (Rev. 2.0B active) with 32 Message Objects
(Full CAN/Basic CAN) on Two CAN Nodes, and Gateway Functionality
– On-Chip Real Time Clock, Driven by the Main Oscillator
•Idle, Sleep, and Power Down Modes with Flexible Power Management
•Programmable Watchdog Timer and Oscillator Watchdog
1)
On-Chip Data SRAM (DSRAM)
1)
Kbytes On-Chip Program Memory (Flash Memory)
1) Depends on the respective derivative. See Table 1 “XC164KM Derivative Synopsis” on Page 6.
Data Sheet4V1.2, 2007-03
XC164KM
Derivatives
Summary of Features
•Up to 47 General Purpose I/O Lines,
partly with Selectable Input Thresholds and Hysteresis
•On-Chip Bootstrap Loader
•On-Chip Debug Support via JTAG Interface
•64-Pin Green LQFP Package for the -16F derivatives, 0.5 mm (19.7 mil) pitch (RoHS
compliant)
•64-Pin TQFP Package for the -4F/8F derivatives, 0.5 mm (19.7 mil) pitch (RoHS
compliant)
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
•the derivative itself, i.e. its function set, the temperature range, and the supply voltage
•the package and the type of delivery.
For the available ordering codes for the XC164KM please refer to your responsible sales
representative or your local distributor.
This document describes several derivatives of the XC164KM group. Table 1
enumerates these derivatives and summarizes the differences. As this document refers
to all of these derivatives, some descriptions may not apply to a specific product.
For simplicity all versions are referred to by the term XC164KM throughout this
document.
Data Sheet5V1.2, 2007-03
Table 1XC164KM Derivative Synopsis
Derivative
1)
Temp.
Range
Program
Memory
XC164KM
Derivatives
Summary of Features
On-Chip RAMInterfaces
SAF-XC164KM-16F40F
SAF-XC164KM-16F20F
-40 to
85 °C
128 Kbytes
Flash
2 Kbytes DPRAM,
4 Kbytes DSRAM,
2 Kbytes PSRAM
SAF-XC164KM-8F40F
SAF-XC164KM-8F20F
-40 to
85 °C
64 Kbytes
Flash
2 Kbytes DPRAM,
2 Kbytes DSRAM,
2 Kbytes PSRAM
SAF-XC164KM-4F40F
SAF-XC164KM-4F20F
1) This Data Sheet is valid for:
devices starting with and including design step BA for the -16F derivatives, and for
devices starting with and including design step AA for -4F/8F derivatives.
-40 to
85 °C
32 Kbytes
Flash
2 Kbytes DPRAM,
2 Kbytes PSRAM
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1
ASC0, ASC1,
SSC0, SSC1,
CAN0, CAN1
Data Sheet6V1.2, 2007-03
XC164KM
Derivatives
General Device Information
2General Device Information
The XC164KM derivatives are high-performance members of the Infineon XC166 Family
of full featured single-chip CMOS microcontrollers. These devices extend the
functionality and performance of the C166 Family in terms of instructions (MAC unit),
peripherals, and speed. They combine high CPU performance (up to 40 million
instructions per second) with high peripheral functionality and enhanced IO-capabilities.
They also provide clock generation via PLL and various on-chip memory modules such
as program Flash, program RAM, and data RAM.
V
DDI/P
V
SS
XTAL1
XTAL2
NMI
RSTIN
Port 5
14 bit
Figure 1Logic Symbol
XC164KM
PORT1
14 bit
Port 3
15 bit
Port 9
6 bit
TRST
MCA05554_XC164KM
Data Sheet7V1.2, 2007-03
XC164KM
*
*
Derivatives
General Device Information
2.1Pin Configuration and Definition
The pins of the XC164KM are described in detail in Table 2, including all their alternate
functions. Figure 2 summarizes all pins in a condensed way, showing their location on
the 4 sides of the package. E* marks pins to be used as alternate external interrupt
inputs.
DDP
DDI
SS
V
TRST
RSTIN
NMI
V
XTAL1
XTAL2
P1 L.6
P1L.7/CC22IO
V
P1L.3
P1L.4
P1L.5
P1L.0
P1L.1
P1L.2
P1 H. 0/ EX0I N/ CC 23 IO
P1 H. 1/ EX1I N/ MR ST1
P1 H. 2/ EX2I N/ MT RS1
P1 H. 3/ EX3I N/ T7I N/ SCL K1
P1H.4/CC24IO/EX4IN
5
I
/
E
5
X
I
O
2
C
5
/
C
.
P
1
H
V
SS
V
DDP
P5 .0
P5 .1
P5 .2
P5 .3
P5 .4
P5 .5
P5 .1 0/T6 EUD
P5 .1 1/T5 EUD
49505152535455565758596061626364
P9.5/CC21IO
1
2
3
4
5
N
6
7
8
9
XC164KM
10
11
12
13
14
15
16
48
P9.4/CC20IO
47
46
P9.3/CC19IO/CAN1_TxD
P9.2/CC18IO/CAN1_RxD/E
45
P9.1/CC17IO/CAN2_TxD
44
43
P9.0/CC16IO/CAN2_RxD/E
42
P3.15/CLKOUT/FOUT
V
41
SS
40
V
DDP
39
P3 .1 3/SC LK0 /E*
P3.11/RxD0/E*
38
P3.10/TxD0/E*
37
P3 .9 /M TSR 0
36
P3 .8 /M RST0
35
34
P3 .7 /T 2I N/ BRKIN
33
P3 .6 /T 3I N
32313029282726252423222120191817
SS
SS
V
V
P5.6
P5.7
P5 .12 /T6 IN
P5 .13 /T5 IN
SS
DDI
DDP
V
V
V
P5.14/T4EUD
P5.15/T2EUD
P3.2/CAPIN/TDI
P3.3/T3OUT/TDO
P3.4/T3EUD/TMS
P3.1/T6OUT/RxD1/TCK/E*
P3.5/T4IN/TxD1/BRKOUT
mc_xc164km_pinout.vsd
Figure 2Pin Configuration (top view)
Data Sheet8V1.2, 2007-03
Table 2Pin Definitions and Functions
XC164KM
Derivatives
General Device Information
Symbol
Pin
Num.
Input
Outp.
Function
RSTIN63IReset Input with Schmitt-Trigger characteristics. A low-level
at this pin while the oscillator is running resets the XC164KM.
A spike filter suppresses input pulses < 10 ns. Input pulses
> 100 ns safely pass the filter. The minimum duration for a
safe recognition should be 100 ns + 2 CPU clock cycles.
Note: The reset duration must be sufficient to let the
hardware configuration signals settle.
External circuitry must guarantee low-level at the
RSTIN
pin at least until both power supply voltages
have reached the operating range.
NMI
64INon-Maskable Interrupt Input. A high to low transition at this
pin causes the CPU to vector to the NMI trap routine. When
the PWRDN (power down) instruction is executed, the NMI
pin must be low in order to force the XC164KM into power
down mode. If NMI
is high, when PWRDN is executed, the
part will continue to run in normal mode.
If not used, pin NMI
should be pulled high externally.
Port 9
P9.0
P9.1
P9.2
P9.3
P9.4
P9.5
43-48
43
44
45
46
47
48
IO
I/O
I
I
I/O
O
I/O
I
I
I/O
O
I/O
I/O
Port 9 is a 6-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance state)
or output (configurable as push/pull or open drain driver). The
input threshold of Port 9 is selectable (standard or special).
The following Port 9 pins also serve for alternate functions:
CC16IO: (CAPCOM2) CC16 Capture Inp./Compare Outp.,
CAN2_RxD: (CAN Node 2) Receive Data Input
Note: At the end of an external reset P9.4 and P9.5 also may
input startup configuration values.
Data Sheet9V1.2, 2007-03
Table 2Pin Definitions and Functions (cont’d)
XC164KM
Derivatives
General Device Information
Symbol
Port 5
P5.10
P5.11
P5.12
P5.13
P5.14
P5.15
TRST
Pin
Num.
9-18,
21-24
15
16
21
22
23
24
Input
Outp.
I
I
I
I
I
I
I
Function
Port 5 is a 14-bit input-only port.
Some pins of Port 5 also serve as timer inputs:
T6EUD: GPT2 Timer T6 Ext. Up/Down Control Input
T5EUD: GPT2 Timer T5 Ext. Up/Down Control Input
T6IN: GPT2 Timer T6 Count/Gate Input
T5IN: GPT2 Timer T5 Count/Gate Input
T4EUD: GPT1 Timer T4 Ext. Up/Down Control Input
T2EUD: GPT1 Timer T2 Ext. Up/Down Control Input
62ITest-System Reset Input. For normal system operation, pin
TRST
edge of RSTIN
should be held low. A high level at this pin at the rising
enables the hardware configuration and
activates the XC164KM’s debug system. In this case, pin
TRST
must be driven low once to reset the debug system.
Data Sheet10V1.2, 2007-03
Table 2Pin Definitions and Functions (cont’d)
XC164KM
Derivatives
General Device Information
Symbol
Port 3
P3.1
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
P3.8
P3.9
P3.10
P3.11
P3.13
P3.15
Pin
Num.
28-39,
42
28
29
30
31
32
33
34
35
36
37
38
39
42
Input
Outp.
IO
O
I/O
I
I
I
I
O
O
I
I
I
O
O
I
I
I
I/O
I/O
O
I
I/O
I
I/O
I
O
O
Function
Port 3 is a 13-bit bidirectional I/O port. Each pin can be
programmed for input (output driver in high-impedance state)
or output (configurable as push/pull or open drain driver). The
input threshold of Port 3 is selectable (standard or
special).The following Port 3 pins also serve for alternate
functions:
T6OUT: [GPT2] Timer T6 Toggle Latch Output,
RxD1: [ASC1] Data Input (Async.) or Inp./Outp. (Sync.),
EX1IN: [Fast External Interrupt 1] Input (alternate pin A),
TCK: [Debug System] JTAG Clock Input
CAPIN: [GPT2] Register CAPREL Capture Input,
TDI: [Debug System] JTAG Data In
T3OUT: [GPT1] Timer T3 Toggle Latch Output,
TDO: [Debug System] JTAG Data Out
T3EUD: [GPT1] Timer T3 External Up/Down Control Input,
TMS: [Debug System] JTAG Test Mode Selection
T4IN: [GPT1] Timer T4 Count/Gate/Reload/Capture Inp.
TxD1: [ASC0] Clock/Data Output (Async./Sync.),
BRKOUT
: [Debug System] Break Out
T3IN: [GPT1] Timer T3 Count/Gate Input
T2IN: [GPT1] Timer T2 Count/Gate/Reload/Capture Inp.
BRKIN
: [Debug System] Break In
MRST0: [SSC0] Master-Receive/Slave-Transmit In/Out.
MTSR0: [SSC0] Master-Transmit/Slave-Receive Out/In.
TxD0: [ASC0] Clock/Data Output (Async./Sync.),
EX2IN: [Fast External Interrupt 2] Input (alternate pin B)
RxD0: [ASC0] Data Input (Async.) or Inp./Outp. (Sync.),
EX2IN: [Fast External Interrupt 2] Input (alternate pin A)
SCLK0: [SSC0] Master Clock Output / Slave Clock Input.,
EX3IN: [Fast External Interrupt 3] Input (alternate pin A)
CLKOUT: System Clock Output (= CPU Clock),
FOUT: Programmable Frequency Output
Data Sheet11V1.2, 2007-03
Table 2Pin Definitions and Functions (cont’d)
XC164KM
Derivatives
General Device Information
Symbol
PORT1
P1L.7
P1H.0
P1H.1
P1H.2
P1H.3
P1H.4
P1H.5
Pin
Num.
1-6,
49-56
56
1
2
3
3
5
6
Input
Outp.
IO
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
I/O
I
Function
PORT1 consists of one 8-bit and one 6-bit bidirectional I/O
port P1L and P1H. Each pin can be programmed for input
(output driver in high-impedance state) or output.
The following PORT1 pins also serve for alt. functions:
CC22IO: [CAPCOM2] CC22 Capture Inp./Compare Outp.
EX0IN: [Fast External Interrupt 0] Input (default pin),
CC23IO: [CAPCOM2] CC23 Capture Inp./Compare Outp.
EX1IN: [Fast External Interrupt 1] Input (default pin),
MRST1: [SSC1] Master-Receive/Slave-Transmit In/Out.
EX2IN: [Fast External Interrupt 2] Input (default pin),
MTSR1: [SSC1] Master-Transmit/Slave-Receive Out/Inp.
T7IN: [CAPCOM2] Timer T7 Count Input,
SCLK1: [SSC1] Master Clock Output / Slave Clock Input,
EX3IN: [Fast External Interrupt 3] Input (default pin),
CC24IO: [CAPCOM2] CC24 Capture Inp./Compare Outp.,
EX4IN: [Fast External Interrupt 4] Input (default pin)
CC25IO: [CAPCOM2] CC25 Capture Inp./Compare Outp.,
EX5IN: [Fast External Interrupt 5] Input (default pin)
XTAL2
XTAL16160
V
DDI
26, 58–Digital Core Supply Voltage (On-Chip Modules):
O
I
Note: At the end of an external reset P1H.4 and P1H.5 also
may input startup configuration values
XTAL2: Output of the oscillator amplifier circuit
XTAL1: Input to the oscillator amplifier and input to the
internal clock generator
To clock the device from an external source, drive XTAL1,
while leaving XTAL2 unconnected. Minimum and maximum
high/low and rise/fall times specified in the AC Characteristics
must be observed.
Note: Input pin XTAL1 belongs to the core voltage domain.
Therefore, input voltages must be within the range
defined for
V
DDI
.
+2.5 V during normal operation and idle mode.
Please refer to the Operating Condition Parameters
Data Sheet12V1.2, 2007-03
Table 2Pin Definitions and Functions (cont’d)
XC164KM
Derivatives
General Device Information
Symbol
V
DDP
Pin
Num.
8, 27,
40, 57
Input
Function
Outp.
–Digital Pad Supply Voltage (Pin Output Drivers):
+5 V during normal operation and idle mode.
Please refer to the Operating Condition Parameters
V
SS
7, 25,
41, 59
–Digital Ground
Connect decoupling capacitors to adjacent
as close as possible to the pins.
All
V
pins must be connected to the ground-line or ground-
SS
plane.
1) The CAN interface lines are assigned to port P9 under software control.
V
DD/VSS
pin pairs
Data Sheet13V1.2, 2007-03
XC164KM
Derivatives
Functional Description
3Functional Description
The architecture of the XC164KM combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a very well-balanced way. In
addition, the on-chip memory blocks allow the design of compact systems-on-silicon with
maximum performance (computing, control, communication).
The on-chip memory blocks (program code-memory and SRAM, dual-port RAM, data
SRAM) and the set of generic peripherals are connected to the CPU via separate buses.
Another bus, the LXBus, connects additional on-chip resources (see Figure 3).
This bus structure enhances the overall system performance by enabling the concurrent
operation of several subsystems of the XC164KM.
The following block diagram gives an overview of the different on-chip components and
of the advanced, high bandwidth internal bus structure of the XC164KM.
XTAL
PSRAM
2 Kbytes
ProgMem
Flash
32/64/128 Kbytes
OCDS
Debug Support
Osc / PLL
Clock Generation
GPT
T2
T3
T4
T5
T6
RTC WDT
ASC0
(USART)
BRGen
ASC1
(USART)
BRGen
PMU
SSC0
(SPI)
BRGen
DPRAM
2 Kbytes
CPU
C166SV2-Core
Interrupt & PEC
SSC1
(SPI)
BRGen
DMU
Interrupt B us
P eripheral Dat a Bus
CC2
T7
T8
DSRAM
0/2/4 Kbytes
reduced
LXBus
EBC
Control
Twin
LXBus
CAN
AB
Port 5
6
14
13
POR T1Port 3Port 9
14
Mc_xc164km_block1.vsd
Figure 3Block Diagram
Data Sheet14V1.2, 2007-03
XC164KM
Derivatives
Functional Description
3.1Memory Subsystem and Organization
The memory space of the XC164KM is configured in a von Neumann architecture, which
means that all internal and external resources, such as code memory, data memory,
registers and I/O ports, are organized within the same linear address space. This
common memory space includes 16 Mbytes and is arranged as 256 segments of
64 Kbytes each, where each segment consists of four data pages of 16 Kbytes each.
The entire memory space can be accessed byte wise or word wise. Portions of the
on-chip DPRAM and the register spaces (E/SFR) have additionally been made directly
bit addressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
accesses to the program memories, such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
accesses to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected via the high-speed system bus to exchange
data. This is required if operands are read from program memory, code or data is written
to the PSRAM, or data is read from or written to peripherals on the LXBus (such as
TwinCAN). The system bus allows concurrent two-way communication for maximum
transfer performance.
32/64/128 Kbytes of on-chip Flash memory
1)
store code or constant data. The on-chip
Flash memory is organized as four 8-Kbyte sectors and up to three 32-Kbyte sectors.
Each sector can be separately write protected
2)
, erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A password sequence
temporarily unlocks protected areas. The Flash module combines very fast 64-bit onecycle read accesses with protected and efficient writing algorithms for programming and
erasing. Thus, program execution out of the internal Flash results in maximum
performance. Dynamic error correction provides extremely high read data security for all
read accesses.
Programming typically takes 2 ms per 128-byte block (5 ms max.), erasing a sector
typically takes 200 ms (500 ms max.).
2 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data.
The PSRAM is accessed via the PMU and is therefore optimized for code fetches.
0/2/4 Kbytes
1)
of on-chip Data SRAM (DSRAM) are provided as a storage for general
user data. The DSRAM is accessed via the DMU and is therefore optimized for data
accesses. DSRAM is not available in the XC164KM-4F derivatives.
1) Depends on the respective derivative. See Table 1 “XC164KM Derivative Synopsis” on Page 6.
2) Each two 8-Kbyte sectors are combined for write-protection purposes.
Data Sheet15V1.2, 2007-03
XC164KM
Derivatives
Functional Description
2 Kbytes of on-chip Dual-Port RAM (DPRAM) are provided as a storage for user
defined variables, for the system stack, general purpose register banks. A register bank
can consist of up to 16 word wide (R0 to R15) and/or byte wide (RL0, RH0, …, RL7, RH7)
so-called General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word wide registers which are
used for controlling and monitoring functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XC166 Family. Therefore, they should
either not be accessed, or written with zeros, to ensure upward compatibility.
Reserved00’D000
Data SRAM00’C000
Reserved for DSRAM00’8000
Reserved00’0000
1) The areas marked with “<” are slightly smaller than indicated, see column “Notes”.
H
H
H
H
00’DFFF
00’CFFF
00’BFFF
00’7FFF
6 Kbytes–
H
4 Kbytes
H
16 Kbytes–
H
32 Kbytes–
H
3)
Data Sheet16V1.2, 2007-03
XC164KM
Derivatives
Functional Description
2) Not defined register locations return a trap code (1E9BH).
3) Depends on the respective derivative. See Table 1 “XC164KM Derivative Synopsis” on Page 6.
Data Sheet17V1.2, 2007-03
XC164KM
Derivatives
Functional Description
3.2Central Processing Unit (CPU)
The main core of the CPU consists of a 5-stage execution pipeline with a 2-stage
instruction-fetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply
and accumulate unit (MAC), a register-file providing three register banks, and dedicated
SFRs. The ALU features a multiply and divide unit, a bit-mask generator, and a barrel
shifter.
CPU
Prefetch
Branch
Multiply
Unit
Unit
FIFO
IDX0
IDX1
QX0
QX1
+/-
Unit
+/-
CSPIP
CPUCON1
CPUCON2
Return
Stack
QR0
QR1
+/-
MRW
MCW
MSW
IFU
DPP0
DPP1
DPP2
DPP3
Division Unit
M u ltiply U n it
MDC
PSW
VECSEG
TFR
Injection/
Exception
Handler
SPSEG
SP
STKOV
STKUN
Bit-Mask-Gen.
Barrel-Shifter
+/-
ADU
PMU
2-Stage
5-Stage
R15
R14
GPRs
GPRs
RF
Prefetch
Pipeline
Pipeline
CP
R15
R15
R14
R14
GPRs
R1
R1
R0
R1
R0
R0
PSRAM
Flash/ROM
DPRAM
IPIP
R15
R14
GPRs
R1
R0
MAC
MAH
MAL
MDH
ZEROS
MDL
ONES
ALU
Buffer
DMU
WB
DSRAM
EBC
Peripherals
mca04917_x.vsd
Figure 4CPU Block Diagram
Based on these hardware provisions, most of the XC164KM’s instructions can be
executed in just one machine cycle which requires 25 ns at 40 MHz CPU clock. For
Data Sheet18V1.2, 2007-03
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