INFINEON XC164CS-16F User Manual

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Data Sheet, V2.2, March 2006

XC164CS-16F

16-Bit Single-Chip Microcontroller with C166SV2 Core

Microcontrollers

Edition 2006-03

Published by Infineon Technologies AG 81726 München, Germany

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The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of noninfringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com).

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Data Sheet, V2.2, March 2006

XC164CS-16F

16-Bit Single-Chip Microcontroller with C166SV2 Core

Microcontrollers

XC164-16

Derivatives

XC164 Revision History: V2.2, 2006-03

Previous Version(s): V2.1, 2003-06 V2.0, 2003-01 V1.0, 2002-03

Page Subjects (major changes since last revision)

all Layout of graphics and text structures has been adapted to the new

company documentation rules.

55 Footnote about leakage current at P3.15 added.

67 Minimum oscillator period corrected

71 Output delay/hold time of A23 … A16 moved from tc11->tc12, tc21->tc23

74 Chapter “Package and Reliability” added.

We Listen to Your Comments

Any information within this document that you feel is wrong, unclear or missing at all? Your feedback will help us to continuously improve the quality of this document. Please send your proposal (including a reference to this document) to:

mcdocu.comments@infineon.com

Data Sheet V2.2, 2006-03

XC164-16

Derivatives

Table of Contents

1 Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2 General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.1 Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.2 External Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.3 Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.4 Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.5 On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.6 Capture/Compare Units (CAPCOM1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

3.7 The Capture/Compare Unit CAPCOM6 . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.8 General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

3.9 Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

3.10 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

3.11 Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1) . . . . . . . . . . 40

3.12 High Speed Synchronous Serial Channels (SSC0/SSC1) . . . . . . . . . . . . 41

3.13 TwinCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

3.14 Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

3.15 Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

3.16 Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

3.17 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

3.18 Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

4 Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

4.1 General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

4.2 DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

4.3 Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4.4 AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

4.4.1 Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

4.4.2 On-chip Flash Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

4.4.3 External Clock Drive XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67

4.4.4 Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

4.4.5 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

5 Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

5.1 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

5.2 Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

Data Sheet 3 V2.2, 2006-03

XC16416-Bit Single-Chip Microcontroller with C166SV2 Core

XC166 Family

1 Summary of Features

• High Performance 16-bit CPU with 5-Stage Pipeline – 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution) – 1-Cycle Multiplication (16 × 16 bit), Background Division (32 / 16 bit) in 21 Cycles – 1-Cycle Multiply-and-Accumulate (MAC) Instructions – Enhanced Boolean Bit Manipulation Facilities – Zero-Cycle Jump Execution – Additional Instructions to Support HLL and Operating Systems – Register-Based Design with Multiple Variable Register Banks – Fast Context Switching Support with Two Additional Local Register Banks – 16 Mbytes Total Linear Address Space for Code and Data – 1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible)

• 16-Priority-Level Interrupt System with up to 75 Sources, Sample-Rate down to 50 ns

• 8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space

• Clock Generation via on-chip PLL (factors 1:0.15 … 1:10), or via Prescaler (factors 1:1 … 60:1)

• On-Chip Memory Modules – 2 Kbytes On-Chip Dual-Port RAM (DPRAM) – 2/4 Kbytes On-Chip Data SRAM (DSRAM) – 2 Kbytes On-Chip Program/Data SRAM (PSRAM) – 64/128 Kbytes On-Chip Program Memory (Flash Memory or Mask ROM)

• On-Chip Peripheral Modules – 14-Channel A/D Converter with Programmable Resolution (10-bit or 8-bit) and

Conversion Time (down to 2.55 µs or 2.15 µs) – Two 16-Channel General Purpose Capture/Compare Units (12 Input/Output Pins) – Capture/Compare Unit for flexible PWM Signal Generation (CAPCOM6)

(3/6 Capture/Compare Channels and 1 Compare Channel) – Multi-Functional General Purpose Timer Unit with 5 Timers – Two Synchronous/Asynchronous Serial Channels (USARTs) – Two High-Speed-Synchronous Serial Channels – On-Chip TwinCAN Interface (Rev. 2.0B active) with 32 Message Objects

(Full CAN/Basic CAN) on Two CAN Nodes, and Gateway Functionality – On-Chip Real Time Clock

• Idle, Sleep, and Power Down Modes with Flexible Power Management

1) Depends on the respective derivative. The derivatives are listed in Table 1.

Data Sheet 4 V2.2, 2006-03

Summary of Features

• Programmable Watchdog Timer and Oscillator Watchdog

• Up to 12 Mbytes External Address Space for Code and Data – Programmable External Bus Characteristics for Different Address Ranges – Multiplexed or Demultiplexed External Address/Data Buses – Selectable Address Bus Width – 16-Bit or 8-Bit Data Bus Width – Four Programmable Chip-Select Signals

• Up to 79 General Purpose I/O Lines, partly with Selectable Input Thresholds and Hysteresis

• On-Chip Bootstrap Loader

• Supported by a Large Range of Development Tools like C-Compilers, Macro-Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers, Simulators, Logic Analyzer Disassemblers, Programming Boards

• On-Chip Debug Support via JTAG Interface

• 100-Pin TQFP Package, 0.5 mm (19.7 mil) pitch

XC164-16

Derivatives

Ordering Information

The ordering code for Infineon microcontrollers provides an exact reference to the required product. This ordering code identifies:

• the derivative itself, i.e. its function set, the temperature range, and the supply voltage

• the package and the type of delivery.

For the available ordering codes for the XC164 please refer to the “Product Catalog Microcontrollers”, which summarizes all available microcontroller variants.

Note: The ordering codes for Mask-ROM versions are defined for each product after

verification of the respective ROM code.

This document describes several derivatives of the XC164 group. Table 1 enumerates these derivatives and summarizes the differences. As this document refers to all of these derivatives, some descriptions may not apply to a specific product.

For simplicity all versions are referred to by the term XC164 throughout this document.

Data Sheet 5 V2.2, 2006-03

Table 1 XC164 Derivative Synopsis

Derivative

Temp. Range

Program Memory

XC164-16

Derivatives

Summary of Features

On-Chip RAM Interfaces

SAK-XC164CS-16F40F, SAK-XC164CS-16F20F

SAK-XC164CS-16R40F, SAK-XC164CS-16R20F

SAF-XC164CS-16F40F, SAF-XC164CS-16F20F

SAF-XC164CS-16R40F, SAF-XC164CS-16R20F

SAK-XC164CS-8F40F, SAK-XC164CS-8F20F

SAK-XC164CS-8R40F, SAK-XC164CS-8R20F

-40 °C to 125 °C

-40 °C to 85 °C

-40 °C to 125 °C

128 Kbytes Flash

128 Kbytes ROM

128 Kbytes Flash

128 Kbytes ROM

64 Kbytes Flash

64 Kbytes ROM

2 Kbytes DPRAM, 4 Kbytes DSRAM, 2 Kbytes PSRAM

2 Kbytes DPRAM, 2 Kbytes DSRAM, 2 Kbytes PSRAM

ASC0, ASC1, SSC0, SSC1, CAN0, CAN1

SAF-XC164CS-8F40F, SAF-XC164CS-8F20F

SAF-XC164CS-8R40F, SAF-XC164CS-8R20F

1) This Data Sheet is valid for devices starting with and including design step AD of the Flash version, and design

step AA of the ROM version.

-40 °C to 85 °C

64 Kbytes Flash

64 Kbytes ROM

2 Kbytes DPRAM, 2 Kbytes DSRAM, 2 Kbytes PSRAM

ASC0, ASC1, SSC0, SSC1, CAN0, CAN1

Data Sheet 6 V2.2, 2006-03

XC164-16

Derivatives

General Device Information

2 General Device Information

2.1 Introduction

The XC164 derivatives are high-performance members of the Infineon XC166 Family of full featured single-chip CMOS microcontrollers. These devices extend the functionality and performance of the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They combine high CPU performance (up to 40 million instructions per second) with high peripheral functionality and enhanced IO-capabilities. They also provide clock generation via PLL and various on-chip memory modules such as program ROM or Flash, program RAM, and data RAM.

Port 20 5 bit

XTAL1

XTAL2

NMI

RSTIN

RSTOUT

ALE

AREF

AGND

XC164

DDI/P

SSI/P

PORT0 16 bit

PORT1 16 bit

Port 3 14 bit

Port 4 8 bit

WR/WRL

Port 5 14 bit

Port 9 6 bit

JTAGTRST Debug

via Port 3

MCA05554_XC 164

Figure 1 Logic Symbol

Data Sheet 7 V2.2, 2006-03

XC164-16

Derivatives

General Device Information

2.2 Pin Configuration and Definition

The pins of the XC164 are described in detail in Table 2, including all their alternate functions. Figure 2 summarizes all pins in a condensed way, showing their location on the 4 sides of the package. E*) and C*) mark pins to be used as alternate external interrupt inputs, C*) marks pins that can have CAN interface lines assigned to them.

SSP DDP

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

P20.12/RSTOUT

RSTIN

NMI P0H.0/AD8 P0H.1/AD9

P0H.2/AD10 P0H.3/AD11

P9.0/CC16IO/C*) P9.1/CC17IO/C*) P9.2/CC18IO/C*) P9.3/CC19IO/C*)

P9.4/CC20IO P9.5/CC21IO

P5.0/AN0 P5.1/AN1 P5.2/AN2 P5.3/AN3 P5.4/AN4

P5.5/AN5 P5.10/AN10/T6EUD P5.11/AN11/T5EUD 25

SSIVDDI

P1H.7/A15/CC27IO/EX7IN

P1H.6/A14/CC26IO/EX6IN

P1H.5/A13/CC25IO/EX5IN

P1H.4/A12/CC24IO/EX4IN

P1H.3/A11/T7IN/SCLK1/EX3IN/E*)

XTAL1

XTAL2

9998979695949392919089888786858483828180797877

100

26272829303132333435363738394041424344

P1H.2/A10/C6P2/MTSR1/EX2IN

P1H.1/A9/C6P1/MRST1/EX1IN

P1H.0/A8/C6P0/CC23IO/EX0IN

XC164

SSPVDDP

P1L.7/A7/CTRAP/CC22IO

P1L.6/A6/COUT63

P1L.5/A5/COUT62

P1L.4/A4/CC62

P1L.3/A3/COUT61

P1L.2/A2/CC61

P1L.1/A1/COUT60

P1L.0/A0/CC60

45P3.7/T2IN/BRKIN46474849

P0H.7/AD15

P0H.6/AD14

P0H.5/AD13

75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 P3.13/SCLK0/E*)

P0H.4/AD12 P0L.7/AD7 P0L.6/AD6 P0L.5/AD5 P0L.4/AD4 P0L.3/AD3 P0L.2/AD2 P0L.1/AD1 P0L.0/AD0 P20.5/EA P20.4/ALE P20.1/WR/WRL P20.0/RD

SSP

DDP

P4.7/A23/C*) P4.6/A22/C*) P4.5/A21/C*) P4.4/A20/C*) P4.3/A19/CS0 P4.2/A18/CS1 P4.1/A17/CS2 P4.0/A16/CS3 P3.15/CLKOUT/FOUT

SSI

DDI

SSP

TRST

DDP

P3.6/T3IN

P3.8/MRST0

P3.9/MTSR0

P3.10/TxD0/E*)

P3.2/CAPIN/TDI

P3.3/T3OUT/TDO

P3.4/T3EUD/TMS

P3.1/T6OUT/RxD1/TCK/E*)

P3.5/T4IN/TxD1/BRKOUT

P3.11/RxD0/E*)

P3.12/BHE/WRH/E*)

MCP06457

AREF

AGND

P5.6/AN6

P5.7/AN7

P5.12/AN12/T6IN

P5.13/AN13/T5IN

P5.14/AN14/T4EUD

P5.15/AN15/T2EUD

Figure 2 Pin Configuration (top view)

Data Sheet 8 V2.2, 2006-03

Table 2 Pin Definitions and Functions

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

Input Outp.

Function

RSTIN 1 I Reset Input with Schmitt-Trigger characteristics. A low level

at this pin while the oscillator is running resets the XC164. A spike filter suppresses input pulses <10 ns. Input pulses >100 ns safely pass the filter. The minimum duration for a safe recognition should be 100 ns + 2 CPU clock cycles.

Note: The reset duration must be sufficient to let the

hardware configuration signals settle. External circuitry must guarantee low level at the RSTIN

pin at least until both power supply voltages

have reached the operating range.

P20.12 2 IO For details, please refer to the description of P20.

NMI

3 I Non-Maskable Interrupt Input. A high to low transition at this

pin causes the CPU to vector to the NMI trap routine. When the PWRDN (power down) instruction is executed, the NMI pin must be low in order to force the XC164 into power down mode. If NMI

is high, when PWRDN is executed, the part will continue to run in normal mode. If not used, pin NMI

should be pulled high externally.

P0H.0P0H.3

4 … 7 IO For details, please refer to the description of PORT0.

Data Sheet 9 V2.2, 2006-03

Table 2 Pin Definitions and Functions (cont’d)

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

P9.0

P9.1

P9.2

P9.3

P9.4 P9.5

14 15

Input Outp.

I/O I I I/O O I I/O I I I/O O I I/O I/O

Function

Port 9 is a 6-bit bidirectional I/O port. Each pin can be programmed for input (output driver in high-impedance state) or output (configurable as push/pull or open drain driver). The input threshold of Port 9 is selectable (standard or special). The following Port 9 pins also serve for alternate functions: CC16IO CAPCOM2: CC16 Capture Inp./Compare Outp., CAN2_RxD CAN Node 2 Receive Data Input, EX7IN Fast External Interrupt 7 Input (alternate pin B) CC17IO CAPCOM2: CC17 Capture Inp./Compare Outp., CAN2_TxD CAN Node 2 Transmit Data Output, EX6IN Fast External Interrupt 6 Input (alternate pin B) CC18IO CAPCOM2: CC18 Capture Inp./Compare Outp. CAN1_RxD CAN Node 1 Receive Data Input, EX7IN Fast External Interrupt 7 Input (alternate pin A) CC19IO CAPCOM2: CC19 Capture Inp./Compare Outp., CAN1_TxD CAN Node 1 Transmit Data Output, EX6IN Fast External Interrupt 6 Input (alternate pin A) CC20IO CAPCOM2: CC20 Capture Inp./Compare Outp. CC21IO CAPCOM2: CC21 Capture Inp./Compare Outp.

P5.0 P5.1 P5.2 P5.3 P5.4 P5.5 P5.10 P5.11 P5.6 P5.7 P5.12 P5.13 P5.14 P5.15

18 19 20 21 22 23 24 25 26 27 30 31 32 33

Port 5 is a 14-bit input-only port. The pins of Port 5 also serve as analog input channels for the A/D converter, or they serve as timer inputs:

I I I I I I I I I I I I I I

AN0 AN1 AN2 AN3 AN4 AN5 AN10, T6EUD GPT2 Timer T6 Ext. Up/Down Ctrl. Inp. AN11, T5EUD GPT2 Timer T5 Ext. Up/Down Ctrl. Inp. AN6 AN7 AN12, T6IN GPT2 Timer T6 Count/Gate Input AN13, T5IN GPT2 Timer T5 Count/Gate Input AN14, T4EUD GPT1 Timer T4 Ext. Up/Down Ctrl. Inp. AN15, T2EUD GPT1 Timer T2 Ext. Up/Down Ctrl. Inp.

Data Sheet 10 V2.2, 2006-03

Table 2 Pin Definitions and Functions (cont’d)

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

Input Outp.

Function

TRST 36 I Test-System Reset Input. A high level at this pin activates

the XC164’s debug system. For normal system operation,

pin TRST

Port 3 is a 14-bit bidirectional I/O port. Each pin can be

should be held low.

programmed for input (output driver in high-impedance state) or output (configurable as push/pull or open drain driver). The input threshold of Port 3 is selectable (standard or special). The following Port 3 pins also serve for alternate functions:

P3.1

P3.2

P3.3

P3.4

P3.5

P3.6 P3.7

P3.8 P3.9 P3.10

P3.11

P3.12

P3.13

P3.15

44 45

46 47 48

O I/O I I I I O O I I I O O I I I I/O I/O O I I/O I O O I I/O I O O

T6OUT GPT2 Timer T6 Toggle Latch Output, RxD1 ASC1 Data Input (Async.) or Inp./Outp. (Sync.), EX1IN Fast External Interrupt 1 Input (alternate pin A), TCK Debug System: JTAG Clock Input CAPIN GPT2 Register CAPREL Capture Input, TDI Debug System: JTAG Data In T3OUT GPT1 Timer T3 Toggle Latch Output, TDO Debug System: JTAG Data Out T3EUD GPT1 Timer T3 External Up/Down Control

Input, TMS Debug System: JTAG Test Mode Selection T4IN GPT1 Timer T4 Count/Gate/Reload/Capture Inp TxD1 ASC0 Clock/Data Output (Async./Sync.), BRKOUT

Debug System: Break Out T3IN GPT1 Timer T3 Count/Gate Input T2IN GPT1 Timer T2 Count/Gate/Reload/Capture Inp BRKIN

Debug System: Break In MRST0 SSC0 Master-Receive/Slave-Transmit In/Out. MTSR0 SSC0 Master-Transmit/Slave-Receive Out/In. TxD0 ASC0 Clock/Data Output (Async./Sync.), EX2IN Fast External Interrupt 2 Input (alternate pin B) RxD0 ASC0 Data Input (Async.) or Inp./Outp. (Sync.), EX2IN Fast External Interrupt 2 Input (alternate pin A) BHE WRH

External Memory High Byte Enable Signal,

External Memory High Byte Write Strobe, EX3IN Fast External Interrupt 3 Input (alternate pin B) SCLK0 SSC0 Master Clock Output / Slave Clock Input., EX3IN Fast External Interrupt 3 Input (alternate pin A) CLKOUT System Clock Output (= CPU Clock), FOUT Programmable Frequency Output

Data Sheet 11 V2.2, 2006-03

Table 2 Pin Definitions and Functions (cont’d)

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

P4.0

P4.1

P4.2

P4.3

P4.4

P4.5

P4.6

P4.7

Input Outp.

O O O O O O O O O I I O I I O O I O I O I

Function

Port 4 is an 8-bit bidirectional I/O port. Each pin can be programmed for input (output driver in high-impedance state) or output (configurable as push/pull or open drain driver). The input threshold of Port 4 is selectable (standard or special). Port 4 can be used to output the segment address lines, the optional chip select lines, and for serial interface lines:

A16 Least Significant Segment Address Line, CS3

Chip Select 3 Output A17 Segment Address Line, CS2

Chip Select 2 Output A18 Segment Address Line, CS1

Chip Select 1 Output A19 Segment Address Line, CS0

Chip Select 0 Output A20 Segment Address Line, CAN2_RxD CAN Node 2 Receive Data Input, EX5IN Fast External Interrupt 5 Input (alternate pin B) A21 Segment Address Line, CAN1_RxD CAN Node 1 Receive Data Input, EX4IN Fast External Interrupt 4 Input (alternate pin B) A22 Segment Address Line, CAN1_TxD CAN Node 1 Transmit Data Output, EX5IN Fast External Interrupt 5 Input (alternate pin A) A23 Most Significant Segment Address Line, CAN1_RxD CAN Node 1 Receive Data Input, CAN2_TxD CAN Node 2 Transmit Data Output, EX4IN Fast External Interrupt 4 Input (alternate pin A)

Data Sheet 12 V2.2, 2006-03

Table 2 Pin Definitions and Functions (cont’d)

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

P20

P20.0

P20.1

P20.4

P20.5

P20.12

Input Outp.

Function

Port 20 is a 5-bit bidirectional I/O port. Each pin can be programmed for input (output driver in high-impedance state) or output. The input threshold of Port 20 is selectable (standard or special). The following Port 20 pins also serve for alternate functions: RD

External Memory Read Strobe, activated for

every external instruction or data read access. WR

/WRL External Memory Write Strobe.

In WR

-mode this pin is activated for every external data write access. In WRL

-mode this pin is activated for low byte data write accesses on a 16-bit bus, and for every data write access on an 8-bit bus.

ALE Address Latch Enable Output.

Can be used for latching the address into external memory or an address latch in the multiplexed bus modes.

External Access Enable pin. A low level at this pin during and after Reset forces the XC164 to latch the configuration from PORT0 and pin RD

, and to begin instruction

execution out of external memory. A high level forces the XC164 to latch the configuration from pins RD

, ALE, and WR, and to begin instruction execution out of the internal program memory. "ROMless" versions must have this pin tied to ‘0’.

RSTOUT

Internal Reset Indication Output. Is activated asynchronously with an external hardware reset. It may also be activated (selectable) synchronously with an internal software or watchdog reset. Is deactivated upon the execution of the EINIT instruction, optionally at the end of reset, or at any time (before EINIT) via user software.

Note: Port 20 pins may input configuration values (see EA

Data Sheet 13 V2.2, 2006-03

Table 2 Pin Definitions and Functions (cont’d)

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

PORT0

P0L.0-

67 - 74

P0L.7

P0H.0-

4 - 7 P0H.3 P0H.4-

75 - 78 P0H.7

PORT1

P1L.0 P1L.1 P1L.2 P1L.3 P1L.4 P1L.5 P1L.6 P1L.7

P1H

…

Input

Function

Outp.

IO PORT0 consists of the two 8-bit bidirectional I/O ports P0L

and P0H. Each pin can be programmed for input (output driver in high-impedance state) or output. In case of an external bus configuration, PORT0 serves as the address (A) and address/data (AD) bus in multiplexed bus modes and as the data (D) bus in demultiplexed bus modes.

Demultiplexed bus modes:

8-bit data bus: P0H = I/O, P0L = D7 - D0 16-bit data bus: P0H = D15 - D8, P0L = D7 - D0

Multiplexed bus modes:

8-bit data bus: P0H = A15 - A8, P0L = AD7 - AD0 16-bit data bus: P0H = AD15 - AD8, P0L = AD7 - AD0

Note: At the end of an external reset (EA

= 0) PORT0 also

may input configuration values

PORT1 consists of the two 8-bit bidirectional I/O ports P1L and P1H. Each pin can be programmed for input (output driver in high-impedance state) or output. PORT1 is used as the 16-bit address bus (A) in demultiplexed bus modes (also after switching from a demultiplexed to a multiplexed bus mode).

The following PORT1 pins also serve for alt. functions: I/O O I/O O I/O O O I

CC60 CAPCOM6: Input / Output of Channel 0

COUT60 CAPCOM6: Output of Channel 0

CC61 CAPCOM6: Input / Output of Channel 1

COUT61 CAPCOM6: Output of Channel 1

CC62 CAPCOM6: Input / Output of Channel 2

COUT62 CAPCOM6: Output of Channel 2

COUT63 Output of 10-bit Compare Channel

CTRAP

CAPCOM6: Trap Input

is an input pin with an internal pull-up resistor. A low level on this pin switches the CAPCOM6 compare outputs to the logic level defined by software (if enabled).

I/O

CC22IO CAPCOM2: CC22 Capture Inp./Compare Outp. … continued …

Data Sheet 14 V2.2, 2006-03

Table 2 Pin Definitions and Functions (cont’d)

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

PORT1

(cont’d) P1H.0

P1H.1

P1H.2

P1H.3

P1H.4

P1H.5

P1H.6

P1H.7

Input Outp.

I I I/O I I I/O I I I/O I I/O I I I/O I I/O I I/O I I/O I

Function

… continued …

CC6POS0

CAPCOM6: Position 0 Input, EX0IN Fast External Interrupt 0 Input (default pin), CC23IO CAPCOM2: CC23 Capture Inp./Compare Outp. CC6POS1

CAPCOM6: Position 1 Input, EX1IN Fast External Interrupt 1 Input (default pin), MRST1 SSC1 Master-Receive/Slave-Transmit In/Out. CC6POS2

CAPCOM6: Position 2 Input, EX2IN Fast External Interrupt 2 Input (default pin), MTSR1 SSC1 Master-Transmit/Slave-Receive Out/Inp. T7IN CAPCOM2: Timer T7 Count Input, SCLK1 SSC1 Master Clock Output / Slave Clock Input, EX3IN Fast External Interrupt 3 Input (default pin), EX0IN Fast External Interrupt 0 Input (alternate pin A) CC24IO CAPCOM2: CC24 Capture Inp./Compare Outp., EX4IN Fast External Interrupt 4 Input (default pin) CC25IO CAPCOM2: CC25 Capture Inp./Compare Outp., EX5IN Fast External Interrupt 5 Input (default pin) CC26IO CAPCOM2: CC26 Capture Inp./Compare Outp., EX6IN Fast External Interrupt 6 Input (default pin) CC27IO CAPCOM2: CC27 Capture Inp./Compare Outp., EX7IN Fast External Interrupt 7 Input (default pin)

XTAL2 XTAL1

99 100

O I

XTAL2: Output of the oscillator amplifier circuit XTAL1: Input to the oscillator amplifier and input to the

internal clock generator To clock the device from an external source, drive XTAL1, while leaving XTAL2 unconnected. Minimum and maximum high/low and rise/fall times specified in the AC Characteristics must be observed.

AREF

AGND

DDI

28 – Reference voltage for the A/D converter.

29 – Reference ground for the A/D converter.

35, 97 – Digital Core Supply Voltage (On-Chip Modules):

+2.5 V during normal operation and idle mode. Please refer to the Operating Condition Parameters

Data Sheet 15 V2.2, 2006-03

Table 2 Pin Definitions and Functions (cont’d)

XC164-16

Derivatives

General Device Information

Symbol Pin

Num.

DDP

9, 17, 38, 61, 87

SSI

SSP

34, 98 – Digital Ground.

8, 16, 37, 62, 88

Input

Function

Outp.

– Digital Pad Supply Voltage (Pin Output Drivers):

+5 V during normal operation and idle mode. Please refer to the Operating Condition Parameters

–

Connect decoupling capacitors to adjacent as close as possible to the pins. All

pins must be connected to the ground-line or ground-

plane.

1) The CAN interface lines are assigned to ports P4 and P9 under software control.

DD/VSS

pin pairs

Data Sheet 16 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3 Functional Description

The architecture of the XC164 combines advantages of RISC, CISC, and DSP processors with an advanced peripheral subsystem in a very well-balanced way. In addition, the on-chip memory blocks allow the design of compact systems-on-silicon with maximum performance (computing, control, communication).

The on-chip memory blocks (program code-memory and SRAM, dual-port RAM, data SRAM) and the set of generic peripherals are connected to the CPU via separate buses. Another bus, the LXBus, connects additional on-chip resources as well as external resources (see Figure 3).

This bus structure enhances the overall system performance by enabling the concurrent operation of several subsystems of the XC164.

The following block diagram gives an overview of the different on-chip components and of the advanced, high bandwidth internal bus structure of the XC164.

Flash/ROM

64/128 Kbytes

Debug Support

Osc / PLL

Clock Generator

XTAL

ADC

8-Bi t/

10-Bit 14 Ch

PSRAM

ProgMem

OCDS

GPT

DPRAM

CPU

PMU

C166SV2 - Core

RTC WD T Interrupt & PEC

ASC0

USART

BRGen BRGen BRGen BRGen

ASC1

USART

SSC0

SPI

SSC1

SPI

CC1

DMU

Interr upt Bus

CC2

CC6

T12

T13

DSRAM

EBC

LXBus Control

Exter nal Bus

Control

LXB us

Twin

CAN

A B

Peripheral Data Bus

P 20 P 9 Port 5 Port 4 Port 3 PORT1 PORT0

5 6

16148

MCB04323_X416

Figure 3 Block Diagram

Data Sheet 17 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.1 Memory Subsystem and Organization

The memory space of the XC164 is configured in a Von Neumann architecture, which means that all internal and external resources, such as code memory, data memory, registers and I/O ports, are organized within the same linear address space. This common memory space includes 16 Mbytes and is arranged as 256 segments of 64 Kbytes each, where each segment consists of four data pages of 16 Kbytes each. The entire memory space can be accessed bytewise or wordwise. Portions of the onchip DPRAM and the register spaces (E/SFR) have additionally been made directly bitaddressable.

The internal data memory areas and the Special Function Register areas (SFR and ESFR) are mapped into segment 0, the system segment.

The Program Management Unit (PMU) handles all code fetches and, therefore, controls accesses to the program memories, such as Flash memory, ROM, and PSRAM.

The Data Management Unit (DMU) handles all data transfers and, therefore, controls accesses to the DSRAM and the on-chip peripherals.

Both units (PMU and DMU) are connected via the high-speed system bus to exchange data. This is required if operands are read from program memory, code or data is written to the PSRAM, code is fetched from external memory, or data is read from or written to external resources, including peripherals on the LXBus (such as TwinCAN). The system bus allows concurrent two-way communication for maximum transfer performance.

64/128 Kbytes

of on-chip Flash memory or mask-programmable ROM store code

or constant data. The on-chip Flash memory is organized as four 8-Kbyte sectors, one 32-Kbyte sector, and one 64-Kbyte sector. Each sector can be separately write protected

, erased and programmed (in blocks of 128 Bytes). The complete Flash or ROM area can be read-protected. A password sequence temporarily unlocks protected areas. The Flash module combines very fast 64-bit one-cycle read accesses with protected and efficient writing algorithms for programming and erasing. Thus, program execution out of the internal Flash results in maximum performance. Dynamic error correction provides extremely high read data security for all read accesses. For timing characteristics, please refer to Section 4.4.2.

2 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data. The PSRAM is accessed via the PMU and is therefore optimized for code fetches.

2/4 Kbytes

of on-chip Data SRAM (DSRAM) are provided as a storage for general

user data. The DSRAM is accessed via the DMU and is therefore optimized for data accesses.

2 Kbytes of on-chip Dual-Port RAM (DPRAM) are provided as a storage for user defined variables, for the system stack, and general purpose register banks. A register

1) Depends on the respective derivative. The derivatives are listed in Table 1.

2) Each two 8-Kbyte sectors are combined for write-protection purposes.

Data Sheet 18 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

bank can consist of up to 16 wordwide (R0 to R15) and/or bytewide (RL0, RH0, …, RL7, RH7) so-called General Purpose Registers (GPRs). The upper 256 bytes of the DPRAM are directly bitaddressable. When used by a GPR, any location in the DPRAM is bitaddressable.

1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function Register areas (SFR space and ESFR space). SFRs are wordwide registers which are used for controlling and monitoring functions of the different on-chip units. Unused SFR addresses are reserved for future members of the XC166 Family. Therefore, they should either not be accessed, or written with zeros, to ensure upward compatibility.

In order to meet the needs of designs where more memory is required than is provided on chip, up to 12 Mbytes (approximately, see Table 3) of external RAM and/or ROM can be connected to the microcontroller.

Table 3 XC164 Memory Map

Address Area Start Loc. End Loc. Area Size

Flash register space FF’F000

Reserved (Acc. trap) F8’0000

Reserved for PSRAM E0’0800

Program SRAM E0’0000

Reserved for program

C2’0000

FF’FFFF

FF’EFFF

F7’FFFF

E0’07FF

DF’FFFF

4 Kbytes Flash only

< 0.5 Mbytes Minus Flash register

< 1.5 Mbytes Minus PSRAM

2 Kbytes Maximum

< 2 Mbytes Minus Flash/ROM

memory

Program Flash/ROM C0’0000

Reserved BF’0000

External memory area 40’0000

External IO area

20’0800

TwinCAN registers 20’0000

C1’FFFF

BF’FFFF

BE’FFFF

3F’FFFF

20’07FF

128 Kbytes

64 Kbytes –

< 8 Mbytes Minus reserved

< 2 Mbytes Minus TwinCAN

2 Kbytes –

Notes

space

segment

External memory area 01’0000

Data RAMs and SFRs 00’8000

External memory area 00’0000

1) Accesses to the shaded areas generate external bus accesses.

2) The areas marked with “<” are slightly smaller than indicated, see column “Notes”.

3) Not defined register locations return a trap code.

4) Depends on the respective derivative. The derivatives are listed in Table 1.

5) Several pipeline optimizations are not active within the external IO area. This is necessary to control external

peripherals properly.

1F’FFFF

00’FFFF

00’7FFF

< 2 Mbytes Minus segment 0

32 Kbytes Partly used

32 Kbytes –

Data Sheet 19 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.2 External Bus Controller

All of the external memory accesses are performed by a particular on-chip External Bus Controller (EBC). It can be programmed either to Single Chip Mode when no external memory is required, or to one of four different external memory access modes are as follows:

• 16 … 24-bit Addresses, 16-bit Data, Demultiplexed

• 16 … 24-bit Addresses, 16-bit Data, Multiplexed

• 16 … 24-bit Addresses, 8-bit Data, Multiplexed

• 16 … 24-bit Addresses, 8-bit Data, Demultiplexed

In the demultiplexed bus modes, addresses are output on PORT1 and data is input/output on PORT0 or P0L, respectively. In the multiplexed bus modes both addresses and data use PORT0 for input/output. The high order address (segment) lines use Port 4. The number of active segment address lines is selectable, restricting the external address space to 8 Mbytes … 64 Kbytes. This is required when interface lines are assigned to Port 4.

, which

Up to 4 external CS

signals (3 windows plus default) can be generated in order to save external glue logic. External modules can directly be connected to the common address/data bus and their individual select lines.

Important timing characteristics of the external bus interface have been made programmable (via registers TCONCSx/FCONCSx) to allow the user the adaption of a wide range of different types of memories and external peripherals.

In addition, up to 4 independent address windows may be defined (via registers ADDRSELx) which control the access to different resources with different bus characteristics. These address windows are arranged hierarchically where window 4 overrides window 3, and window 2 overrides window 1. All accesses to locations not covered by these 4 address windows are controlled by TCONCS0/FCONCS0. The currently active window can generate a chip select signal.

Note: The chip select signal of address window 4 is not available on a pin.

The external bus timing is related to the rising edge of the reference clock output CLKOUT. The external bus protocol is compatible with that of the standard C166 Family.

The EBC also controls accesses to resources connected to the on-chip LXBus. The LXBus is an internal representation of the external bus and allows accessing integrated peripherals and modules in the same way as external components.

The TwinCAN module is connected and accessed via the LXBus.

1) Bus modes are switched dynamically if several address windows with different mode settings are used.

Data Sheet 20 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.3 Central Processing Unit (CPU)

The main core of the CPU consists of a 5-stage execution pipeline with a 2-stage instruction-fetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and accumulate unit (MAC), a register-file providing three register banks, and dedicated SFRs. The ALU features a multiply and divide unit, a bit-mask generator, and a barrel shifter.

CPU

Prefetch

Branch

Multiply

Unit

FIFO

IDX0 IDX1

QX0 QX1

+/-

Unit

+/-

CSP IP CPUCON1

CPUCON2

Return

Stack

QR0 QR1

+/-

MRW

MCW

MSW

IFU

DPP0 DPP1 DPP2 DPP3

Division Unit M ultip ly U n it

MDC

PSW

VECSEG

TFR

Injection/

Exception

Handler

SPSEG

SP STKOV STKUN

Bit-Mask-Gen.

Barrel-Shifter

+/-

ADU

PMU

2-Stage

5-Stage

R15 R14

GPRs

Prefetch

Pipeline

R15

R14

GPRs

PSRAM

Flash/ROM

DPRAM

IPIP

R15 R14

GPRs

R1 R0

MAC

MAH

MAL

MDH

ZEROS

MDL

ONES

ALU

Buffer

DMU

DSRAM

EBC

Peripherals

mca04917_x.vsd

Figure 4 CPU Block Diagram

Based on these hardware provisions, most of the XC164’s instructions can be executed in just one machine cycle which requires 25 ns at 40 MHz CPU clock. For example, shift

Data Sheet 21 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

and rotate instructions are always processed during one machine cycle independent of the number of bits to be shifted. Also multiplication and most MAC instructions execute in one single cycle. All multiple-cycle instructions have been optimized so that they can be executed very fast as well: for example, a division algorithm is performed in 18 to 21 CPU cycles, depending on the data and division type. Four cycles are always visible, the rest runs in the background. Another pipeline optimization, the branch target prediction, allows eliminating the execution time of branch instructions if the prediction was correct.

The CPU has a register context consisting of up to three register banks with 16 wordwide GPRs each at its disposal. The global register bank is physically allocated within the onchip DPRAM area. A Context Pointer (CP) register determines the base address of the active global register bank to be accessed by the CPU at any time. The number of register banks is only restricted by the available internal RAM space. For easy parameter passing, a register bank may overlap others.

A system stack of up to 32 Kwords is provided as a storage for temporary data. The system stack can be allocated to any location within the address space (preferably in the on-chip RAM area), and it is accessed by the CPU via the stack pointer (SP) register. Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack pointer value upon each stack access for the detection of a stack overflow or underflow.

The high performance offered by the hardware implementation of the CPU can efficiently be utilized by a programmer via the highly efficient XC164 instruction set which includes the following instruction classes:

• Standard Arithmetic Instructions

• DSP-Oriented Arithmetic Instructions

• Logical Instructions

• Boolean Bit Manipulation Instructions

• Compare and Loop Control Instructions

• Shift and Rotate Instructions

• Prioritize Instruction

• Data Movement Instructions

• System Stack Instructions

• Jump and Call Instructions

• Return Instructions

• System Control Instructions

• Miscellaneous Instructions

The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes and words. A variety of direct, indirect or immediate addressing modes are provided to specify the required operands.

Data Sheet 22 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.4 Interrupt System

With an interrupt response time of typically 8 CPU clocks (in case of internal program execution), the XC164 is capable of reacting very fast to the occurrence of nondeterministic events.

The architecture of the XC164 supports several mechanisms for fast and flexible response to service requests that can be generated from various sources internal or external to the microcontroller. Any of these interrupt requests can be programmed to being serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).

In contrast to a standard interrupt service where the current program execution is suspended and a branch to the interrupt vector table is performed, just one cycle is ‘stolen’ from the current CPU activity to perform a PEC service. A PEC service implies a single byte or word data transfer between any two memory locations with an additional increment of either the PEC source, or the destination pointer, or both. An individual PEC transfer counter is implicitly decremented for each PEC service except when performing in the continuous transfer mode. When this counter reaches zero, a standard interrupt is performed to the corresponding source related vector location. PEC services are very well suited, for example, for supporting the transmission or reception of blocks of data. The XC164 has 8 PEC channels each of which offers such fast interrupt-driven data transfer capabilities.

A separate control register which contains an interrupt request flag, an interrupt enable flag and an interrupt priority bitfield exists for each of the possible interrupt nodes. Via its related register, each node can be programmed to one of sixteen interrupt priority levels. Once having been accepted by the CPU, an interrupt service can only be interrupted by a higher prioritized service request. For the standard interrupt processing, each of the possible interrupt nodes has a dedicated vector location.

Fast external interrupt inputs are provided to service external interrupts with high precision requirements. These fast interrupt inputs feature programmable edge detection (rising edge, falling edge, or both edges).

Software interrupts are supported by means of the ‘TRAP’ instruction in combination with an individual trap (interrupt) number.

Table 4 shows all of the possible XC164 interrupt sources and the corresponding

hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers.

Note: Interrupt nodes which are not assigned to peripherals (unassigned nodes), may

be used to generate software controlled interrupt requests by setting the respective interrupt request bit (xIR).

Data Sheet 23 V2.2, 2006-03

Table 4 XC164 Interrupt Nodes

XC164-16

Derivatives

Functional Description

Source of Interrupt or PEC Service Request

Control Register

Vector Location

CAPCOM Register 0 CC1_CC0IC xx’0040

CAPCOM Register 1 CC1_CC1IC xx’0044

CAPCOM Register 2 CC1_CC2IC xx’0048

CAPCOM Register 3 CC1_CC3IC xx’004C

CAPCOM Register 4 CC1_CC4IC xx’0050

CAPCOM Register 5 CC1_CC5IC xx’0054

CAPCOM Register 6 CC1_CC6IC xx’0058

CAPCOM Register 7 CC1_CC7IC xx’005C

CAPCOM Register 8 CC1_CC8IC xx’0060

CAPCOM Register 9 CC1_CC9IC xx’0064

CAPCOM Register 10 CC1_CC10IC xx’0068

CAPCOM Register 11 CC1_CC11IC xx’006C

CAPCOM Register 12 CC1_CC12IC xx’0070

Trap

Number

10H / 16

11H / 17

12H / 18

13H / 19

14H / 20

15H / 21

16H / 22

17H / 23

18H / 24

19H / 25

1AH / 26

1BH / 27

1CH / 28

CAPCOM Register 13 CC1_CC13IC xx’0074

CAPCOM Register 14 CC1_CC14IC xx’0078

CAPCOM Register 15 CC1_CC15IC xx’007C

CAPCOM Register 16 CC2_CC16IC xx’00C0

CAPCOM Register 17 CC2_CC17IC xx’00C4

CAPCOM Register 18 CC2_CC18IC xx’00C8

CAPCOM Register 19 CC2_CC19IC xx’00CC

CAPCOM Register 20 CC2_CC20IC xx’00D0

CAPCOM Register 21 CC2_CC21IC xx’00D4

CAPCOM Register 22 CC2_CC22IC xx’00D8

CAPCOM Register 23 CC2_CC23IC xx’00DC

CAPCOM Register 24 CC2_CC24IC xx’00E0

CAPCOM Register 25 CC2_CC25IC xx’00E4

CAPCOM Register 26 CC2_CC26IC xx’00E8

CAPCOM Register 27 CC2_CC27IC xx’00EC

1DH / 29

1EH / 30

1FH / 31

30H / 48

31H / 49

32H / 50

33H / 51

34H / 52

35H / 53

36H / 54

37H / 55

38H / 56

39H / 57

3AH / 58

3BH / 59

CAPCOM Register 28 CC2_CC28IC xx’00F0

3CH / 60

Data Sheet 24 V2.2, 2006-03

Table 4 XC164 Interrupt Nodes (cont’d)

XC164-16

Derivatives

Functional Description

Source of Interrupt or PEC Service Request

Control Register

Vector Location

CAPCOM Register 29 CC2_CC29IC xx’0110

CAPCOM Register 30 CC2_CC30IC xx’0114

CAPCOM Register 31 CC2_CC31IC xx’0118

CAPCOM Timer 0 CC1_T0IC xx’0080

CAPCOM Timer 1 CC1_T1IC xx’0084

CAPCOM Timer 7 CC2_T7IC xx’00F4

CAPCOM Timer 8 CC2_T8IC xx’00F8

GPT1 Timer 2 GPT12E_T2IC xx’0088

GPT1 Timer 3 GPT12E_T3IC xx’008C

GPT1 Timer 4 GPT12E_T4IC xx’0090

GPT2 Timer 5 GPT12E_T5IC xx’0094

GPT2 Timer 6 GPT12E_T6IC xx’0098

GPT2 CAPREL Register GPT12E_CRIC xx’009C

Trap

Number

44H / 68

45H / 69

46H / 70

20H / 32

21H / 33

3DH / 61

3EH / 62

22H / 34

23H / 35

24H / 36

25H / 37

26H / 38

27H / 39

A/D Conversion Complete ADC_CIC xx’00A0

A/D Overrun Error ADC_EIC xx’00A4

ASC0 Transmit ASC0_TIC xx’00A8

ASC0 Transmit Buffer ASC0_TBIC xx’011C

ASC0 Receive ASC0_RIC xx’00AC

ASC0 Error ASC0_EIC xx’00B0

ASC0 Autobaud ASC0_ABIC xx’017C

SSC0 Transmit SSC0_TIC xx’00B4

SSC0 Receive SSC0_RIC xx’00B8

SSC0 Error SSC0_EIC xx’00BC

PLL/OWD PLLIC xx’010C

ASC1 Transmit ASC1_TIC xx’0120

ASC1 Transmit Buffer ASC1_TBIC xx’0178

ASC1 Receive ASC1_RIC xx’0124

ASC1 Error ASC1_EIC xx’0128

28H / 40

29H / 41

2AH / 42

47H / 71

2BH / 43

2CH / 44

5FH / 95

2DH / 45

2EH / 46

2FH / 47

43H / 67

48H / 72

5EH / 94

49H / 73

4AH / 74

ASC1 Autobaud ASC1_ABIC xx’0108

End of PEC Subchannel EOPIC xx’0130

42H / 66

4CH / 76

Data Sheet 25 V2.2, 2006-03

Table 4 XC164 Interrupt Nodes (cont’d)

XC164-16

Derivatives

Functional Description

Source of Interrupt or PEC Service Request

Control Register

Vector Location

CAPCOM6 Timer T12 CCU6_T12IC xx’0134

CAPCOM6 Timer T13 CCU6_T13IC xx’0138

CAPCOM6 Emergency CCU6_EIC xx’013C

CAPCOM6 CCU6_IC xx’0140

SSC1 Transmit SSC1_TIC xx’0144

SSC1 Receive SSC1_RIC xx’0148

SSC1 Error SSC1_EIC xx’014C

CAN0 CAN_0IC xx’0150

CAN1 CAN_1IC xx’0154

CAN2 CAN_2IC xx’0158

CAN3 CAN_3IC xx’015C

CAN4 CAN_4IC xx’0164

CAN5 CAN_5IC xx’0168

Trap

Number

4DH / 77

4EH / 78

4FH / 79

50H / 80

51H / 81

52H / 82

53H / 83

54H / 84

55H / 85

56H / 86

57H / 87

59H / 89

5AH / 90

CAN6 CAN_6IC xx’016C

CAN7 CAN_7IC xx’0170

RTC RTC_IC xx’0174

Unassigned node – xx’0100

Unassigned node – xx’0104

Unassigned node – xx’012C

Unassigned node – xx’00FC

Unassigned node – xx’0160

1) Register VECSEG defines the segment where the vector table is located to. Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table represents the default setting, with a distance of 4 (two words) between two vectors.

5BH / 91

5CH / 92

5DH / 93

40H / 64

41H / 65

4BH / 75

3FH / 63

58H / 88

Data Sheet 26 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

The XC164 also provides an excellent mechanism to identify and to process exceptions or error conditions that arise during run-time, so-called ‘Hardware Traps’. Hardware traps cause immediate non-maskable system reaction which is similar to a standard interrupt service (branching to a dedicated vector table location). The occurrence of a hardware trap is additionally signified by an individual bit in the trap flag register (TFR). Except when another higher prioritized trap service is in progress, a hardware trap will interrupt any actual program execution. In turn, hardware trap services can normally not be interrupted by standard or PEC interrupts.

Table 5 shows all of the possible exceptions or error conditions that can arise during run-

time:

Table 5 Hardware Trap Summary

Exception Condition Trap

Flag

Reset Functions:

–

• Hardware Reset

• Software Reset

• Watchdog Timer

Overflow

Class A Hardware Traps:

• Non-Maskable Interrupt

• Stack Overflow

• Stack Underflow

• Software Break

NMI STKOF STKUF SOFTBRK

Class B Hardware Traps:

• Undefined Opcode

• PMI Access Error

• Protected Instruction

UNDOPC PACER PRTFLT

Fault

• Illegal Word Operand

ILLOPA

Access

Trap Vector

RESET RESET RESET

NMITRAP STOTRAP STUTRAP SBRKTRAP

BTRAP BTRAP BTRAP

BTRAP

Vector Location

xx’0000 xx’0000 xx’0000

xx’0008 xx’0010 xx’0018 xx’0020

xx’0028 xx’0028 xx’0028

xx’0028

Trap

Number

00 00 00

02 04 06 08

0A 0A 0A

Trap Priority

III III III

II II II II

I I I

Reserved – – [2C

Software Traps

–– Any

• TRAP Instruction

- 3CH][0BH -

[xx’0000 xx’01FC

]

Any [00 7F

–

]

Current

]

CPU

Priority in steps of 4

1) Register VECSEG defines the segment where the vector table is located to.

Data Sheet 27 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.5 On-Chip Debug Support (OCDS)

The On-Chip Debug Support system provides a broad range of debug and emulation features built into the XC164. The user software running on the XC164 can thus be debugged within the target system environment.

The OCDS is controlled by an external debugging device via the debug interface, consisting of the IEEE-1149-conforming JTAG port and a break interface. The debugger controls the OCDS via a set of dedicated registers accessible via the JTAG interface. Additionally, the OCDS system can be controlled by the CPU, e.g. by a monitor program. An injection interface allows the execution of OCDS-generated instructions by the CPU.

Multiple breakpoints can be triggered by on-chip hardware, by software, or by an external trigger input. Single stepping is supported as well as the injection of arbitrary instructions and read/write access to the complete internal address space. A breakpoint trigger can be answered with a CPU-halt, a monitor call, a data transfer, or/and the activation of an external signal.

Tracing data can be obtained via the JTAG interface or via the external bus interface for increased performance.

The debug interface uses a set of 6 interface signals (4 JTAG lines, 2 break lines) to communicate with external circuitry. These interface signals are realized as alternate functions on Port 3 pins.

Complete system emulation is supported by the New Emulation Technology (NET) interface.

Data Sheet 28 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.6 Capture/Compare Units (CAPCOM1/2)

The CAPCOM units support generation and control of timing sequences on up to 32 channels with a maximum resolution of 1 system clock cycle (8 cycles in staggered mode). The CAPCOM units are typically used to handle high speed I/O tasks such as pulse and waveform generation, pulse width modulation (PMW), Digital to Analog (D/A) conversion, software timing, or time recording relative to external events.

Four 16-bit timers (T0/T1, T7/T8) with reload registers provide two independent time bases for each capture/compare register array.

The input clock for the timers is programmable to several prescaled values of the internal system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2. This provides a wide range of variation for the timer period and resolution and allows precise adjustments to the application specific requirements. In addition, external count inputs for CAPCOM timers T0 and T7 allow event scheduling for the capture/compare registers relative to external events.

Both of the two capture/compare register arrays contain 16 dual purpose capture/compare registers, each of which may be individually allocated to either CAPCOM timer T0 or T1 (T7 or T8, respectively), and programmed for capture or compare function. 12 registers of the CAPCOM2 module have each one port pin associated with it which serves as an input pin for triggering the capture function, or as an output pin to indicate the occurrence of a compare event.

Table 6 Compare Modes (CAPCOM1/2)

Compare Modes Function

Mode 0 Interrupt-only compare mode;

several compare interrupts per timer period are possible

Mode 1 Pin toggles on each compare match;

several compare events per timer period are possible

Mode 2 Interrupt-only compare mode;

only one compare interrupt per timer period is generated

Mode 3 Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;

only one compare event per timer period is generated

Double Register Mode

Single Event Mode Generates single edges or pulses;

Data Sheet 29 V2.2, 2006-03

Two registers operate on one pin; pin toggles on each compare match; several compare events per timer period are possible

can be used with any compare mode

XC164-16

Derivatives

Functional Description

When a capture/compare register has been selected for capture mode, the current contents of the allocated timer will be latched (‘captured’) into the capture/compare register in response to an external event at the port pin which is associated with this register. In addition, a specific interrupt request for this capture/compare register is generated. Either a positive, a negative, or both a positive and a negative external signal transition at the pin can be selected as the triggering event.

The contents of all registers which have been selected for one of the five compare modes are continuously compared with the contents of the allocated timers.

When a match occurs between the timer value and the value in a capture/compare register, specific actions will be taken based on the selected compare mode.

Data Sheet 30 V2.2, 2006-03

Reload Reg.

T0REL/T7REL

XC164-16

Derivatives

Functional Description

T0IN/T7IN T6OUF

CCxIO CCxIO

T0/T7

Input

Control

Mode

Control

(Capture

Compare)

Timer T0/T7

Sixteen

16-bit

Capture/

Compare Registers

T0IRQ, T7IRQ

CCxIRQ CCxIRQ

CCxIO

T6OUF

T1/T8

Input

Control

Timer T1/T8

CCxIRQ

T1IRQ, T8IRQ

Reload Reg.

T1REL/T8REL

CAPCOM1 provides channels x = 0 … 15, CAPCOM2 provides channels x = 16 … 31.

(see signals CCxIO and CCxIRQ)

MCB05569

Figure 5 CAPCOM1/2 Unit Block Diagram

Data Sheet 31 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.7 The Capture/Compare Unit CAPCOM6

The CAPCOM6 unit supports generation and control of timing sequences on up to three 16-bit capture/compare channels plus one independent 10-bit compare channel. In compare mode the CAPCOM6 unit provides two output signals per channel which have inverted polarity and non-overlapping pulse transitions (deadtime control). The compare channel can generate a single PWM output signal and is further used to modulate the capture/compare output signals. In capture mode the contents of compare timer T12 is stored in the capture registers upon a signal transition at pins CCx.

Compare timers T12 (16-bit) and T13 (10-bit) are free running timers which are clocked by the prescaled system clock.

CPU

Period Register

T12P

Offset Register

T12OF

Compare

Timer T12

Prescaler

16-bit

Control Register

CTCON

Compare

Timer T13

10-bit

Period Register

T13P

Mode

Select Register

CC6MSEL

CC Channel 0

CC60

CC Channel 1

Control

CC61

CC Channel 2

CC62

Compare Register

CMP13

Trap Register

Port

Control

Logic

Block

Commutation

Control

CC6MCON.H

CTRAP

CC60 COUT60

CC61 COUT61

CC62 COUT62

COUT63

CC6POS0 CC6POS1 CC6POS2

The timer registers (T12, T13) are not directly accessible. The period and offset registers are loading a value into the timer registers.

MCB04109

Figure 6 CAPCOM6 Block Diagram

For motor control applications both subunits may generate versatile multichannel PWM signals which are basically either controlled by compare timer T12 or by a typical hall sensor pattern at the interrupt inputs (block commutation).

Data Sheet 32 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.8 General Purpose Timer (GPT12E) Unit

The GPT12E unit represents a very flexible multifunctional timer/counter structure which may be used for many different time related tasks such as event timing and counting, pulse width and duty cycle measurements, pulse generation, or pulse multiplication.

The GPT12E unit incorporates five 16-bit timers which are organized in two separate modules, GPT1 and GPT2. Each timer in each module may operate independently in a number of different modes, or may be concatenated with another timer of the same module.

Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for one of four basic modes of operation, which are Timer, Gated Timer, Counter, and Incremental Interface Mode. In Timer Mode, the input clock for a timer is derived from the system clock, divided by a programmable prescaler, while Counter Mode allows a timer to be clocked in reference to external events. Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the operation of a timer is controlled by the ‘gate’ level on an external input pin. For these purposes, each timer has one associated port pin (TxIN) which serves as gate or clock input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.

The count direction (up/down) for each timer is programmable by software or may additionally be altered dynamically by an external signal on a port pin (TxEUD) to facilitate e.g. position tracking.

In Incremental Interface Mode the GPT1 timers (T2, T3, T4) can be directly connected to the incremental position sensor signals A and B via their respective inputs TxIN and TxEUD. Direction and count signals are internally derived from these two input signals, so the contents of the respective timer Tx corresponds to the sensor position. The third position sensor signal TOP0 can be connected to an interrupt input.

Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer overflowoverflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out monitoring of external hardware components. It may also be used internally to clock timers T2 and T4 for measuring long time periods with high resolution.

In addition to their basic operating modes, timers T2 and T4 may be configured as reload or capture registers for timer T3. When used as capture or reload registers, timers T2 and T4 are stopped. The contents of timer T3 is captured into T2 or T4 in response to a signal at their associated input pins (TxIN). Timer T3 is reloaded with the contents of T2 or T4 triggered either by an external signal or by a selectable state transition of its toggle latch T3OTL. When both T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL with the low and high times of a PWM signal, this signal can be constantly generated without software intervention.

Data Sheet 33 V2.2, 2006-03

T3CON.BPS1

XC164-16

Derivatives

Functional Description

GPT

2n:1

Basic Clock

Interrupt

T2IN

T2EUD

Mode

Control

Aux. Timer T2

U/D

Reload

Request (T2IRQ)

Capture

Interrupt Request

(T3IRQ)

T3IN

T3EUD

Mode

Control

Core Timer T3

U/D

T3OTL

Toggle Latch

T3OUT

Capture

Reload

T4IN

T4EUD

Mode

Control

Aux. Timer T4

U/D

Interrupt Request

(T4IRQ)

MCA05563

Figure 7 Block Diagram of GPT1

With its maximum resolution of 2 system clock cycles, the GPT2 module provides precise event control and time measurement. It includes two timers (T5, T6) and a capture/reload register (CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via a programmable prescaler or with external signals. The

Data Sheet 34 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

count direction (up/down) for each timer is programmable by software or may additionally be altered dynamically by an external signal on a port pin (TxEUD). Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6, which changes its state on each timer overflow/underflow.

The state of this latch may be used to clock timer T5, and/or it may be output on pin T6OUT. The overflows/underflows of timer T6 can additionally be used to clock the CAPCOM1/2 timers, and to cause a reload from the CAPREL register.

The CAPREL register may capture the contents of timer T5 based on an external signal transition on the corresponding port pin (CAPIN), and timer T5 may optionally be cleared after the capture procedure. This allows the XC164 to measure absolute time differences or to perform pulse multiplication without software overhead.

The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of GPT1 timer T3’s inputs T3IN and/or T3EUD. This is especially advantageous when T3 operates in Incremental Interface Mode.

Data Sheet 35 V2.2, 2006-03

T6CON.BPS2

XC164-16

Derivatives

Functional Description

GPT

2n:1

Basic Clock

Interrupt

GPT2 Timer T5

Request (T5IR)

T5IN

Mode

Control

CAPIN

T3IN/ T3EUD

CAPREL

Mode

Control

U/D

Clear

Capture

Reload

Clear

GPT2 CAPREL

Interrupt Request

(CRIR)

Interrupt Request

(T6IR)

Toggle FF

T6IN

Mode

Control

GPT2 Timer T6 T6OTL

U/D

T6OUT

T6OUF

MCA05564

Figure 8 Block Diagram of GPT2

Data Sheet 36 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.9 Real Time Clock

The Real Time Clock (RTC) module of the XC164 is directly clocked via a separate clock driver with the prescaled on-chip main oscillator frequency ( therefore independent from the selected clock generation mode of the XC164.

The RTC basically consists of a chain of divider blocks:

• a selectable 8:1 divider (on - off)

• the reloadable 16-bit timer T14

• the 32-bit RTC timer block (accessible via registers RTCH and RTCL), made of: – a reloadable 10-bit timer – a reloadable 6-bit timer – a reloadable 6-bit timer – a reloadable 10-bit timer

All timers count up. Each timer can generate an interrupt request. All requests are combined to a common node request.

RTC

= f

OSCm

/32). It is

RT C

MUX

RTCINT

Interrupt Sub Node

RUN

PRE

CNT INT0

CNT INT1

CNT INT2

CNT INT3

REL-Register

T14REL 10 Bits6 Bits6 Bits10 Bits

CNT

T14-Register

CNT-Register

10 Bits6 Bits6 Bits10 BitsT14

MCB05568

Figure 9 RTC Block Diagram

Note: The registers associated with the RTC are not affected by a reset in order to

maintain the correct system time even when intermediate resets are executed.

Data Sheet 37 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

The RTC module can be used for different purposes:

• System clock to determine the current time and date, optionally during idle mode, sleep mode, and power down mode.

• Cyclic time based interrupt, to provide a system time tick independent of CPU frequency and other resources, e.g. to wake up regularly from idle mode.

• 48-bit timer for long term measurements (maximum timespan is > 100 years).

• Alarm interrupt for wake-up on a defined time.

Data Sheet 38 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.10 A/D Converter

For analog signal measurement, a 10-bit A/D converter with 14 multiplexed input channels and a sample and hold circuit has been integrated on-chip. It uses the method of successive approximation. The sample time (for loading the capacitors) and the conversion time is programmable (in two modes) and can thus be adjusted to the external circuitry. The A/D converter can also operate in 8-bit conversion mode, where the conversion time is further reduced.

Overrun error detection/protection is provided for the conversion result register (ADDAT): either an interrupt request will be generated when the result of a previous conversion has not been read from the result register at the time the next conversion is complete, or the next conversion is suspended in such a case until the previous result has been read.

For applications which require less analog input channels, the remaining channel inputs can be used as digital input port pins.

The A/D converter of the XC164 supports four different conversion modes. In the standard Single Channel conversion mode, the analog level on a specified channel is sampled once and converted to a digital result. In the Single Channel Continuous mode, the analog level on a specified channel is repeatedly sampled and converted without software intervention. In the Auto Scan mode, the analog levels on a prespecified number of channels are sequentially sampled and converted. In the Auto Scan Continuous mode, the prespecified channels are repeatedly sampled and converted. In addition, the conversion of a specific channel can be inserted (injected) into a running sequence without disturbing this sequence. This is called Channel Injection Mode.

The Peripheral Event Controller (PEC) may be used to automatically store the conversion results into a table in memory for later evaluation, without requiring the overhead of entering and exiting interrupt routines for each data transfer.

After each reset and also during normal operation the ADC automatically performs calibration cycles. This automatic self-calibration constantly adjusts the converter to changing operating conditions (e.g. temperature) and compensates process variations.

These calibration cycles are part of the conversion cycle, so they do not affect the normal operation of the A/D converter.

In order to decouple analog inputs from digital noise and to avoid input trigger noise those pins used for analog input can be disconnected from the digital IO or input stages under software control. This can be selected for each pin separately via register P5DIDIS (Port 5 Digital Input Disable).

The Auto-Power-Down feature of the A/D converter minimizes the power consumption when no conversion is in progress.

Data Sheet 39 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.11 Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1)

The Asynchronous/Synchronous Serial Interfaces ASC0/ASC1 (USARTs) provide serial communication with other microcontrollers, processors, terminals or external peripheral components. They are upward compatible with the serial ports of the Infineon 8-bit microcontroller families and support full-duplex asynchronous communication and halfduplex synchronous communication. A dedicated baud rate generator with a fractional divider precisely generates all standard baud rates without oscillator tuning. For transmission, reception, error handling, and baudrate detection 5 separate interrupt vectors are provided.

In asynchronous mode, 8- or 9-bit data frames (with optional parity bit) are transmitted or received, preceded by a start bit and terminated by one or two stop bits. For multiprocessor communication, a mechanism to distinguish address from data bytes has been included (8-bit data plus wake-up bit mode). IrDA data transmissions up to

115.2 kbit/s with fixed or programmable IrDA pulse width are supported.

In synchronous mode, bytes (8 bits) are transmitted or received synchronously to a shift clock which is generated by the ASC0/1. The LSB is always shifted first.

In both modes, transmission and reception of data is FIFO-buffered. An autobaud detection unit allows to detect asynchronous data frames with its baudrate and mode with automatic initialization of the baudrate generator and the mode control bits.

A number of optional hardware error detection capabilities has been included to increase the reliability of data transfers. A parity bit can automatically be generated on transmission or be checked on reception. Framing error detection allows to recognize data frames with missing stop bits. An overrun error will be generated, if the last character received has not been read out of the receive buffer register at the time the reception of a new character is complete.

Summary of Features

• Full-duplex asynchronous operating modes – 8- or 9-bit data frames, LSB first, one or two stop bits, parity generation/checking – Baudrate from 2.5 Mbit/s to 0.6 bit/s (@ 40 MHz) – Multiprocessor mode for automatic address/data byte detection – Support for IrDA data transmission/reception up to max. 115.2 kbit/s (@ 40 MHz) – Loop-back capability – Auto baudrate detection

• Half-duplex 8-bit synchronous operating mode at 5 Mbit/s to 406.9 bit/s (@ 40 MHz)

• Buffered transmitter/receiver with FIFO support (8 entries per direction)

• Loop-back option available for testing purposes

• Interrupt generation on transmitter buffer empty condition, last bit transmitted condition, receive buffer full condition, error condition (frame, parity, overrun error), start and end of an autobaud detection

Data Sheet 40 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.12 High Speed Synchronous Serial Channels (SSC0/SSC1)

The High Speed Synchronous Serial Channels SSC0/SSC1 support full-duplex and halfduplex synchronous communication. It may be configured so it interfaces with serially linked peripheral components, full SPI functionality is supported.

A dedicated baud rate generator allows to set up all standard baud rates without oscillator tuning. For transmission, reception and error handling three separate interrupt vectors are provided.

The SSC transmits or receives characters of 2 … 16 bits length synchronously to a shift clock which can be generated by the SSC (master mode) or by an external master (slave mode). The SSC can start shifting with the LSB or with the MSB and allows the selection of shifting and latching clock edges as well as the clock polarity.

A number of optional hardware error detection capabilities has been included to increase the reliability of data transfers. Transmit error and receive error supervise the correct handling of the data buffer. Phase error and baudrate error detect incorrect serial data.

Summary of Features

• Master or Slave mode operation

• Full-duplex or Half-duplex transfers

• Baudrate generation from 20 Mbit/s to 305.18 bit/s (@ 40 MHz)

• Flexible data format – Programmable number of data bits: 2 to 16 bits – Programmable shift direction: LSB-first or MSB-first – Programmable clock polarity: idle low or idle high – Programmable clock/data phase: data shift with leading or trailing clock edge

• Loop back option available for testing purposes

• Interrupt generation on transmitter buffer empty condition, receive buffer full condition, error condition (receive, phase, baudrate, transmit error)

• Three pin interface with flexible SSC pin configuration

Data Sheet 41 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.13 TwinCAN Module

The integrated TwinCAN module handles the completely autonomous transmission and reception of CAN frames in accordance with the CAN specification V2.0 part B (active), i.e. the on-chip TwinCAN module can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers.

Two Full-CAN nodes share the TwinCAN module’s resources to optimize the CAN bus traffic handling and to minimize the CPU load. The module provides up to 32 message objects, which can be assigned to one of the CAN nodes and can be combined to FIFOstructures. Each object provides separate masks for acceptance filtering.

The flexible combination of Full-CAN functionality and FIFO architecture reduces the efforts to fulfill the real-time requirements of complex embedded control applications. Improved CAN bus monitoring functionality as well as the number of message objects permit precise and comfortable CAN bus traffic handling.

Gateway functionality allows automatic data exchange between two separate CAN bus systems, which reduces CPU load and improves the real time behavior of the entire system.

The bit timing for both CAN nodes is derived from the master clock and is programmable up to a data rate of 1 Mbit/s. Each CAN node uses two pins of Port 4, Port 7, or Port 9 to interface to an external bus transceiver. The interface pins are assigned via software.

TwinCAN Module Kernel

Clock

Control

Address

Decoder

CAN

Node A

Message

CAN

Node B

Object Buffer

TxDCA

RxDCA

Port

Control

TxDCB

Interrupt

Control

TwinCAN Control

RxDCB

MCB05567

Figure 10 TwinCAN Module Block Diagram

Data Sheet 42 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

Summary of Features

• CAN functionality according to CAN specification V2.0 B active

• Data transfer rate up to 1 Mbit/s

• Flexible and powerful message transfer control and error handling capabilities

• Full-CAN functionality and Basic CAN functionality for each message object

• 32 flexible message objects – Assignment to one of the two CAN nodes – Configuration as transmit object or receive object – Concatenation to a 2-, 4-, 8-, 16-, or 32-message buffer with FIFO algorithm – Handling of frames with 11-bit or 29-bit identifiers – Individual programmable acceptance mask register for filtering for each object – Monitoring via a frame counter – Configuration for Remote Monitoring Mode

• Up to eight individually programmable interrupt nodes can be used

• CAN Analyzer Mode for bus monitoring is implemented

Note: When a CAN node has the interface lines assigned to Port 4, the segment address

output on Port 4 must be limited. CS

lines can be used to increase the total amount

of addressable external memory.

Data Sheet 43 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.14 Watchdog Timer

The Watchdog Timer represents one of the fail-safe mechanisms which have been implemented to prevent the controller from malfunctioning for longer periods of time.

The Watchdog Timer is always enabled after a reset of the chip, and can be disabled until the EINIT instruction has been executed (compatible mode), or it can be disabled and enabled at any time by executing instructions DISWDT and ENWDT (enhanced mode). Thus, the chip’s start-up procedure is always monitored. The software has to be designed to restart the Watchdog Timer before it overflows. If, due to hardware or software related failures, the software fails to do so, the Watchdog Timer overflows and generates an internal hardware reset and pulls the RSTOUT external hardware components to be reset.

The Watchdog Timer is a 16-bit timer, clocked with the system clock divided by 2/4/128/256. The high byte of the Watchdog Timer register can be set to a prespecified reload value (stored in WDTREL) in order to allow further variation of the monitored time interval. Each time it is serviced by the application software, the high byte of the Watchdog Timer is reloaded and the low byte is cleared. Thus, time intervals between 13 µs and 419 ms can be monitored (@ 40 MHz). The default Watchdog Timer interval after reset is 3.28 ms (@ 40 MHz).

pin low in order to allow

Data Sheet 44 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.15 Clock Generation

The Clock Generation Unit uses a programmable on-chip PLL with multiple prescalers to generate the clock signals for the XC164 with high flexibility. The master clock the reference clock signal, and is used for TwinCAN and is output to the external system. The CPU clock directly (1:1) or via a 2:1 prescaler (

and the system clock f

CPU

SYS

= f

are derived from the master clock either

SYS

= fMC / 2). See also Section 4.4.1.

CPU

The on-chip oscillator can drive an external crystal or accepts an external clock signal. The oscillator clock frequency can be multiplied by the on-chip PLL (by a programmable factor) or can be divided by a programmable prescaler factor.

If the bypass mode is used (direct drive or prescaler) the PLL can deliver an independent clock to monitor the clock signal generated by the on-chip oscillator. This PLL clock is independent from the XTAL1 clock. When the expected oscillator clock transitions are missing the Oscillator Watchdog (OWD) activates the PLL Unlock/OWD interrupt node and supplies the CPU with an emergency clock, the PLL clock signal. Under these circumstances the PLL will oscillate with its basic frequency.

The oscillator watchdog can be disabled by switching the PLL off. This reduces power consumption, but also no interrupt request will be generated in case of a missing oscillator clock.

Note: At the end of an external reset (EA

via hardware by (externally) pulling the RD

= ‘0’) the oscillator watchdog may be disabled

line low upon a reset, similar to the

standard reset configuration.

3.16 Parallel Ports

The XC164 provides up to 79 I/O lines which are organized into six input/output ports and one input port. All port lines are bit-addressable, and all input/output lines are individually (bit-wise) programmable as inputs or outputs via direction registers. The I/O ports are true bidirectional ports which are switched to high impedance state when configured as inputs. The output drivers of some I/O ports can be configured (pin by pin) for push/pull operation or open-drain operation via control registers. During the internal reset, all port pins are configured as inputs (except for pin RSTOUT

The edge characteristics (shape) and driver characteristics (output current) of the port drivers can be selected via registers POCONx.

The input threshold of some ports is selectable (TTL or CMOS like), where the special CMOS like input threshold reduces noise sensitivity due to the input hysteresis. The input threshold may be selected individually for each byte of the respective ports.

All port lines have programmable alternate input or output functions associated with them. All port lines that are not used for these alternate functions may be used as general purpose IO lines.

Data Sheet 45 V2.2, 2006-03

Table 7 Summary of the XC164’s Parallel Ports

Port Control Alternate Functions

PORT0 Pad drivers Address/Data lines or data lines

PORT1 Pad drivers Address lines

Capture inputs or compare outputs, Serial interface lines

XC164-16

Derivatives

Functional Description

Port 3 Pad drivers,

Open drain, Input threshold

Port 4 Pad drivers,

Open drain,

Timer control signals, serial interface lines, Optional bus control signal BHE

/WRH,

System clock output CLKOUT (or FOUT)

Segment address lines

CAN interface lines

, CS signal lines

Input threshold

Port 5 – Analog input channels to the A/D converter,

Timer control signals

Port 9 Pad drivers,

Open drain,

Capture inputs or compare outputs

CAN interface lines

Input threshold

Port 20 Pad drivers,

Open drain

Bus control signals RD, WR/WRL, ALE, External access enable pin EA

Reset indication output RSTOUT

1) For multiplexed bus cycles.

2) For demultiplexed bus cycles.

3) For more than 64 Kbytes of external resources.

4) Can be assigned by software.

Data Sheet 46 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.17 Power Management

The XC164 provides several means to control the power it consumes either at a given time or averaged over a certain timespan. Three mechanisms can be used (partly in parallel):

• Power Saving Modes switch the XC164 into a special operating mode (control via instructions). Idle Mode stops the CPU while the peripherals can continue to operate. Sleep Mode and Power Down Mode stop all clock signals and all operation (RTC may optionally continue running). Sleep Mode can be terminated by external interrupt signals.

• Clock Generation Management controls the distribution and the frequency of internal and external clock signals. While the clock signals for currently inactive parts of logic are disabled automatically, the user can reduce the XC164’s CPU clock frequency which drastically reduces the consumed power. External circuitry can be controlled via the programmable frequency output FOUT.

• Peripheral Management permits temporary disabling of peripheral modules (control via register SYSCON3). Each peripheral can separately be disabled/enabled.

The on-chip RTC supports intermittent operation of the XC164 by generating cyclic wake-up signals. This offers full performance to quickly react on action requests while the intermittent sleep phases greatly reduce the average power consumption of the system.

Data Sheet 47 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

3.18 Instruction Set Summary

Table 8 lists the instructions of the XC164 in a condensed way.

The various addressing modes that can be used with a specific instruction, the operation of the instructions, parameters for conditional execution of instructions, and the opcodes for each instruction can be found in the “Instruction Set Manual”.

This document also provides a detailed description of each instruction.

Table 8 Instruction Set Summary

Mnemonic Description Bytes

ADD(B) Add word (byte) operands 2 / 4

ADDC(B) Add word (byte) operands with Carry 2 / 4

SUB(B) Subtract word (byte) operands 2 / 4

SUBC(B) Subtract word (byte) operands with Carry 2 / 4

MUL(U) (Un)Signed multiply direct GPR by direct GPR

(16- × 16-bit)

DIV(U) (Un)Signed divide register MDL by direct GPR (16-/16-bit) 2

DIVL(U) (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2

CPL(B) Complement direct word (byte) GPR 2

NEG(B) Negate direct word (byte) GPR 2

AND(B) Bitwise AND, (word/byte operands) 2 / 4

(X)OR(B) Bitwise (exclusive)) OR, (word/byte operands) 2 / 4

BCLR/BSET Clear/Set direct bit 2

BMOV(N) Move (negated) direct bit to direct bit 4

BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit 4

BCMP Compare direct bit to direct bit 4

BFLDH/BFLDL Bitwise modify masked high/low byte of bit-addressable

direct word memory with immediate data

CMP(B) Compare word (byte) operands 2 / 4

CMPD1/2 Compare word data to GPR and decrement GPR by 1/2 2 / 4

CMPI1/2 Compare word data to GPR and increment GPR by 1/2 2 / 4

PRIOR Determine number of shift cycles to normalize direct

word GPR and store result in direct word GPR

SHL/SHR Shift left/right direct word GPR 2

ROL/ROR Rotate left/right direct word GPR 2

Data Sheet 48 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

Table 8 Instruction Set Summary (cont’d)

Mnemonic Description Bytes

ASHR Arithmetic (sign bit) shift right direct word GPR 2

MOV(B) Move word (byte) data 2 / 4

MOVBS/Z Move byte operand to word op. with sign/zero extension 2 / 4

JMPA/I/R Jump absolute/indirect/relative if condition is met 4

JMPS Jump absolute to a code segment 4

JB(C) Jump relative if direct bit is set (and clear bit) 4

JNB(S) Jump relative if direct bit is not set (and set bit) 4

CALLA/I/R Call absolute/indirect/relative subroutine if condition is met 4

CALLS Call absolute subroutine in any code segment 4

PCALL Push direct word register onto system stack and call

absolute subroutine

TRAP Call interrupt service routine via immediate trap number 2

PUSH/POP Push/pop direct word register onto/from system stack 2

SCXT Push direct word register onto system stack and update

RET(P) Return from intra-segment subroutine

(and pop direct word register from system stack)

RETS Return from inter-segment subroutine 2

RETI Return from interrupt service subroutine 2

SBRK Software Break 2

SRST Software Reset 4

IDLE Enter Idle Mode 4

PWRDN Enter Power Down Mode (supposes NMI

-pin being low) 4

SRVWDT Service Watchdog Timer 4

DISWDT/ENWDT Disable/Enable Watchdog Timer 4

EINIT Signify End-of-Initialization on RSTOUT

pin 4

ATOMIC Begin ATOMIC sequence 2

EXTR Begin EXTended Register sequence 2

EXTP(R) Begin EXTended Page (and Register) sequence 2 / 4

EXTS(R) Begin EXTended Segment (and Register) sequence 2 / 4

NOP Null operation 2

Data Sheet 49 V2.2, 2006-03

XC164-16

Derivatives

Functional Description

Table 8 Instruction Set Summary (cont’d)

Mnemonic Description Bytes

CoMUL/CoMAC Multiply (and accumulate) 4

CoADD/CoSUB Add/Subtract 4

Co(A)SHR/CoSHL (Arithmetic) Shift right/Shift left 4

CoLOAD/STORE Load accumulator/Store MAC register 4

CoCMP/MAX/MIN Compare (maximum/minimum) 4

CoABS/CoRND Absolute value/Round accumulator 4

CoMOV/NEG/NOP Data move/Negate accumulator/Null operation 4

Data Sheet 50 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

4 Electrical Parameters

4.1 General Parameters

Table 9 Absolute Maximum Ratings

Parameter Symbol Limit Values Unit Notes

Min. Max.

Storage temperature

-65 150 °C

Junction temperature T

Voltage on respect to ground (

Voltage on any pin with respect to ground (

Input current on any pin

pins with

DDI

DDP

)

pins with

)

– -10 10 mA –

DDI

DDP

-40 150 °C under bias

-0.5 3.25 V –

-0.5 6.2 V –

-0.5 V

+ 0.5 V –

DDP

during overload condition

Absolute sum of all input

–– |100|mA– currents during overload condition

1) Moisture Sensitivity Level (MSL) 3, conforming to Jedec J-STD-020C for 240 °C.

Note: Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During absolute maximum rating overload conditions ( voltage on

pins with respect to ground (VSS) must not exceed the values

DDP

> V

or VIN < VSS) the

DDP

defined by the absolute maximum ratings.

Data Sheet 51 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

Operating Conditions

The following operating conditions must not be exceeded to ensure correct operation of the XC164. All parameters specified in the following sections refer to these operating conditions, unless otherwise noticed.

Table 10 Operating Condition Parameters

Parameter Symbol Limit Values Unit Notes

Min. Max.

Digital supply voltage for

the core

Digital supply voltage for

IO pads

Supply Voltage Difference ∆V

Digital ground voltage V

Overload current

Overload current coupling factor for analog inputs

Overload current coupling factor for digital I/O pins

Absolute sum of overload

Σ|

currents

External Load

Capacitance

DDI

DDP

2.35 2.7 V Active mode,

4.4 5.5 V Active mode

-0.5 – V V

0 V Reference voltage

-5 5 mA Per IO pin

-2 5 mA Per analog input

OVA

OVD

–1.0 × 10-4– IOV > 0

–1.5 × 10

-3

–5.0 × 10-3– IOV > 0

–1.0 × 10

-2

|– 50 mA

– 50 pF Pin drivers in

= f

CPU

- V

DDP

5)6)

– IOV < 0

default mode

CPUmax

1)2)

2)3)

DDI

5)6)

Ambient temperature T

1) f

2) External circuitry must guarantee low-level at the RSTIN

3) The specified voltage range is allowed for operation. The range limits may be reached under extreme

4) This limitation must be fulfilled under all operating conditions including power-ramp-up, power-ramp-down,

= 40 MHz for devices marked … 40F, f

CPUmax

reached the operating range.

operating conditions. However, specified parameters, such as leakage currents, refer to the standard operating voltage range of

and power-save modes.

= 4.75 V to 5.25 V.

DDP

––°C see Table 1

= 20 MHz for devices marked … 20F.

CPUmax

pin at least until both power supply voltages have

Data Sheet 52 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

5) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin

exceeds the specified range: input overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified limits. Proper operation is not guaranteed if overload conditions occur on functional pins such as XTAL1, RD etc.

6) Not subject to production test - verified by design/characterization.

7) An overload current (

current adds to the respective pin’s leakage current ( current and is defined by the overload coupling factor compared to the polarity of the overload current that produces it. The total current through a pin is | voltage on analog inputs.

8) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output

current may lead to increased delays or reduced driving capability (

Parameter Interpretation

> V

) through a pin injects a certain error current (I

+ 0.5 V (IOV > 0) or VOV < VSS - 0.5 V (IOV < 0). The absolute sum of

DDP

). The amount of error current depends on the overload

. The polarity of the injected error current is inverse

| = |IOZ| + (|IOV| × KOV). The additional error current may distort the input

TOT

) into the adjacent pins. This error

INJ

, WR,

The parameters listed in the following partly represent the characteristics of the XC164 and partly its demands on the system. To aid in interpreting the parameters right, when evaluating them for a design, they are marked in column “Symbol”:

CC (Controller Characteristics): The logic of the XC164 will provide signals with the respective characteristics.

SR (System Requirement): The external system must provide signals with the respective characteristics to the XC164.

Data Sheet 53 V2.2, 2006-03

4.2 DC Parameters

XC164-16

Derivatives

Electrical Parameters

Table 11 DC Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Condition

Min. Max.

Input low voltage TTL (all except XTAL1)

Input low voltage

ILC

SR -0.5 0.2 × V

- 0.1

SR -0.5 0.3 × V

V–

DDP

V–

DDI

XTAL1

Input low voltage (Special Threshold)

Input high voltage TTL (all except XTAL1)

Input high voltage

ILS

IHC

SR -0.5 0.45 ×

DDP

SR 0.2 × V

DDP

+ 0.5 V –

DDP

+ 0.9

SR 0.7 × V

DDI

+ 0.5 V –

DDI

XTAL1

Input high voltage

(Special Threshold)

Input Hysteresis

HYS 0.04 ×

(Special Threshold)

Output low voltage V

Output high voltage

IHS

SR 0.8 × V

DDP

+ 0.5 V

DDP

- 0.2

–VV

DDP

CC – 1.0 V IOL ≤ I

–0.45VIOL ≤ I

CC V

- 1.0 – V IOH ≥ I

DDP

–VIOH ≥ I

in [V],

DDP

Series resistance = 0 Ω

OLmax

OLnom

OHmax

OHnom

3)4)

0.45

Input leakage current (Port 5)

Input leakage current (all other

7))6)

Configuration pull-up current

Configuration pulldown current

Data Sheet 54 V2.2, 2006-03

11)

OZ1

OZ2

CPUH

CPUL

CPDL

CPDH

CC – ±300 nA 0 V < VIN < V

≤ 125 °C

±200 nA 0 V <

≤ 85 °C

CC – ±500 nA 0.45 V < VIN <

DDP

10)

–-10µA VIN = V

-100 – µA VIN = V

–10µA VIN = V

120 – µA VIN = V

< V

IHmin

ILmax

IHmin

13)

DDP

XC164-16

Derivatives

Electrical Parameters

Table 11 DC Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test Condition

Min. Max.

Level inactive hold current

12)

Level active hold current

12)

LHI

LHA

10)

–-10µA V

-100 – µA V

(cont’d)

OUT

DDP

OUT

= 0.5 ×

= 0.45 V

XTAL1 input current

Pin capacitance

13)

CC – ±20 µA0 V < VIN < V

CC – 10 pF –

DDI

(digital inputs/outputs)

1) Keeping signal levels within the limits specified in this table, ensures operation without overload conditions.

For signal levels outside these specifications, also refer to the specification of the overload current

2) This parameter is tested for P3, P4, P9.

3) The maximum deliverable output current of a port driver depends on the selected output driver mode, see

Table 12, Current Limits for Port Output Drivers. The limit for pin groups must be respected.

4) As a rule, with decreasing output current the output levels approach the respective supply level (

→ V

5) This specification is not valid for outputs which are switched to open drain mode. In this case the respective

output will float and the voltage results from the external circuitry.

6) An additional error current (

the definition of the overload coupling factor

7) The driver of P3.15 is designed for faster switching, because this pin can deliver the reference clock for the

bus interface (CLKOUT). The maximum leakage current for P3.15 is, therefore, increased to 1 µA.

8) This specification is valid during Reset for configuration on RD

9) The maximum current may be drawn while the respective signal line remains inactive.

10) The minimum current must be drawn to drive the respective signal line active.

11) This specification is valid during Reset for configuration on ALE.

12) This specification is valid during Reset for pins P4.3-0, which can act as CS

13) Not subject to production test - verified by design/characterization.

). However, only the levels for nominal output currents are guaranteed.

DDP

) will flow if an overload current flows through an adjacent pin. Please refer to

INJ

, WR, EA, PORT0

outputs, and for P3.12.

→ VSS,

Table 12 Current Limits for Port Output Drivers

Port Output Driver Mode

Maximum Output Current

(

OLmax

, -I

OHmax

)

Nominal Output Current (

OLnom

, -I

OHnom

)

Strong driver 10 mA 2.5 mA

Medium driver 4.0 mA 1.0 mA

Weak driver 0.5 mA 0.1 mA

1) An output current above |I

For any group of 16 neighboring port output pins the total output current in each direction (Σ remain below 50 mA.

Data Sheet 55 V2.2, 2006-03

| may be drawn from up to three pins at the same time.

OXnom

and Σ-IOH) must

Electrical Parameters

Table 13 Power Consumption XC164 (Operating Conditions apply)

XC164-16

Derivatives

Parameter Sym-

bol

Power supply current (active)

DDI

with all peripherals active

Pad supply current I

Idle mode supply current

DDP

IDX

with all peripherals active

Sleep and Power down mode

PDL

supply current caused by leakage

Sleep and Power down mode

PDM

supply current caused by leakage and the RTC running, clocked by the main oscillator

1) During Flash programming or erase operations the supply current is increased by max. 5 mA.

2) The supply current is a function of the operating frequency. This dependency is illustrated in Figure 11.

These parameters are tested at all inputs at

3) The pad supply voltage pins (V

amount of current is consumed even though no outputs are driven, because the drivers’ input stages are switched and also the Flash module draws some power from the

4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage

current and the frequency dependent current for RTC and main oscillator (if active).

5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the

junction temperature (see Figure 13). The junction temperature if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be taken into account.

6) All inputs (including pins configured as inputs) at 0 V to 0.1 V or at V

pins configured as outputs) disconnected. This parameter is tested at 25 °C and is valid for

7) This parameter is determined mainly by the current consumed by the oscillator switched to low gain mode (see

Figure 12). This current, however, is influenced by the external oscillator circuitry (crystal, capacitors). The

given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry.

or VIH.

DDP

and maximum CPU clock frequency with all outputs disconnected and

DDImax

) mainly provides the current consumed by the pin output drivers. A small

Limit Values Unit Test Condition

Min. Max.

– 15 +

2.6 ×

CPU

–5 mA

– 15 +

1.2 ×

CPU

– 128,000

-α

× e

mA f

mA V

in [MHz]

CPU

in [MHz]

CPU

= V

DDI

in [°C]

α = 4670 / (273 +

– 0.6 +

0.02 × +

PDL

OSC

DDP

is the same as the ambient temperature T

DDP

mA V

supply.

- 0.1 V to V

= V

DDI

in [MHz]

OSC

, all outputs (including

DDP

≥ 25 °C.

DDImax

1)2)

)

Data Sheet 56 V2.2, 2006-03

I [mA]

140

XC164-16

Derivatives

Electrical Parameters

DDImax

120

100

DDItyp

IDXmax

IDXtyp

10 20 30 40

CPU

[MHz]

Figure 11 Supply/Idle Current as a Function of Operating Frequency

Data Sheet 57 V2.2, 2006-03

I [mA]

3.0

2.0

1.0

XC164-16

Derivatives

Electrical Parameters

PDMmax

PDMtyp

0.1

32 kHz

PDAmax

4 8 12 16

OSC

[MHz]

Figure 12 Sleep and Power Down Supply Current due to RTC and Oscillator

Running, as a Function of Oscillator Frequency

PDO

[mA]

1.5

1.0

0.5

-50

0 50 100 150

[°C]

Figure 13 Sleep and Power Down Leakage Supply Current as a Function of

Temperature

Data Sheet 58 V2.2, 2006-03

Derivatives

Electrical Parameters

4.3 Analog/Digital Converter Parameters

Table 14 A/D Converter Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test

Condition

Analog reference supply

AREF

Min. Max.

SR 4.5 V

DDP

+ 0.1

XC164-16

Analog reference ground V

Analog input voltage range

Basic clock frequency f

Conversion time for 10-bit result

Conversion time for 8-bit result

Calibration time after reset

AGND

AIN

C10P

C10

C8P

CAL

Total unadjusted error TUE CC – ±2LSB

Total capacitance

AINT

SR VSS - 0.1 VSS + 0.1 V –

SR V

AGND

AREF

0.5 20 MHz

CC 52 × tBC + tS + 6 × t

CC 40 × tBC + tS + 6 × t

CC 44 × tBC + tS + 6 × t

CC 32 × tBC + tS + 6 × t

CC 484 11,696 t

– Post-calibr. on

SYS

– Post-calibr. off

SYS

– Post-calibr. on

SYS

– Post-calibr. off

SYS

CC – 15 pF

of an analog input

Switched capacitance

AINS

CC – 10 pF

of an analog input

Resistance of

AIN

CC – 2 kΩ

the analog input path

Total capacitance

AREFT

CC – 20 pF

of the reference input

Switched capacitance

AREFS

CC – 15 pF

of the reference input

Resistance of

AREF

CC – 1 kΩ

the reference input path

1) TUE is tested at V

defined voltage range. If the analog reference supply voltage drops below 4.5 V (i.e. voltage by up to 0.2 V (i.e. subject to production test. The specified TUE is guaranteed only, if the absolute sum of input overload currents on Port 5 pins (see specification) does not exceed 10 mA, and if V time. During the reset calibration sequence the maximum TUE may be ±4 LSB.

2) V

may exceed V

AIN

cases will be X000

= V

AREF

or V

AGND

or X3FFH, respectively.

+ 0.1 V, V

DDP

= V

AREF

up to the absolute maximum ratings. However, the conversion result in these

AREF

+ 0.2 V) the maximum TUE is increased to ±3 LSB. This range is not

DDP

= 0 V. It is verified by design for all other voltages within the

AGND

≥ 4.0 V) or exceeds the power supply

AREF

and V

remain stable during the respective period of

AGND

Data Sheet 59 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

3) The limit values for fBC must not be exceeded when selecting the peripheral frequency and the ADCTC setting.

4) This parameter includes the sample time

result register with the conversion result ( Values for the basic clock When the post-calibration is switched off, the conversion time is reduced by 12 ×

5) The actual duration of the reset calibration depends on the noise on the reference signal. Conversions

executed during the reset calibration increase the calibration time. The TUE for those conversions may be increased.

6) Not subject to production test - verified by design/characterization.

The given parameter values cover the complete operating range. Under relaxed operating conditions (temperature, supply voltage) reduced values can be used for calculations. At room temperature and nominal supply voltage the following typical values can be used:

AINTtyp

= 12 pF, C

AINStyp

depend on programming and can be taken from Table 15.

= 7 pF, R

AINtyp

, the time for determining the digital result and the time to load the

= 1/f

SYS

= 1.5 kΩ, C

SYS

AREFTtyp

= 15 pF, C

AREFStyp

= 13 pF, R

AREFtyp

= 0.7 kΩ.

AIN

Source

Ext

AIN, On

AINTCAINS

Figure 14 Equivalent Circuitry for Analog Inputs

A/D Converter

AINS

MCS05570

Data Sheet 60 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

Sample time and conversion time of the XC164’s A/D Converter are programmable. In compatibility mode, the above timing can be calculated using Table 15. The limit values for

must not be exceeded when selecting ADCTC.

Table 15 A/D Converter Computation Table

ADCON.15|14 (ADCTC)

00 f

1) These selections are available in compatibility mode. An improved mechanism to control the ADC input clock

can be selected.

A/D Converter Basic Clock

/ 4 00 tBC × 8

SYS

/ 2 01 tBC × 16

SYS

/ 16 10 tBC × 32

SYS

/ 8 11 tBC × 64

SYS

ADCON.13|12 (ADSTC)

Sample Time

Converter Timing Example:

Assumptions:

Basic clock

Sample time

SYS

= 40 MHz (i.e. t

= f

/ 2 = 20 MHz, i.e. tBC = 50 ns

SYS

= tBC × 8 = 400 ns

= 25 ns), ADCTC = ‘01’, ADSTC = ‘00’

Conversion 10-bit:

With post-calibr.

Post-calibr. off

Conversion 8-bit:

With post-calibr.

Post-calibr. off

C10P

C10

C8P

= 52 × tBC + tS + 6 × t

= 40 × tBC + tS + 6 × t

= 44 × tBC + tS + 6 × t

= 32 × tBC + tS + 6 × t

= (2600 + 400 + 150) ns = 3.15 µs

SYS

= (2000 + 400 + 150) ns = 2.55 µs

SYS

= (2200 + 400 + 150) ns = 2.75 µs

SYS

= (1600 + 400 + 150) ns = 2.15 µs

SYS

Data Sheet 61 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

4.4 AC Parameters

4.4.1 Definition of Internal Timing

The internal operation of the XC164 is controlled by the internal master clock fMC.

The master clock signal

can be generated from the oscillator clock signal f

OSC

via different mechanisms. The duration of master clock periods (TCMs) and their variation (and also the derived external timing) depend on the used mechanism to generate

This influence must be regarded when calculating the timings for the XC164.

Phase Locked Loop Operation (1:N)

OSC

TCM

Direct Clock Drive (1:1)

OSC

TCM

Prescaler Operation (N:1)

OSC

TCM

MCT05555

Figure 15 Generation Mechanisms for the Master Clock

Note: The example for PLL operation shown in Figure 15 refers to a PLL factor of 1:4,

the example for prescaler operation refers to a divider factor of 2:1.

The used mechanism to generate the master clock is selected by register PLLCON.

Data Sheet 62 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

CPU and EBC are clocked with the CPU clock signal f same frequency as the master clock ( two:

= fMC / 2. This factor is selected by bit CPSYS in register SYSCON1.

CPU

= fMC) or can be the master clock divided by

CPU

. The CPU clock can have the

CPU

The specification of the external timing (AC Characteristics) depends on the period of the CPU clock, called “TCP”.

The other peripherals are supplied with the system clock signal frequency as the CPU clock signal

CPU

which has the same

SYS

Bypass Operation

When bypass operation is configured (PLLCTRL = 0x

) the master clock is derived from

the internal oscillator (input clock signal XTAL1) through the input- and outputprescalers:

= f

If both divider factors are selected as ‘1’ (PLLIDIV = PLLODIV = ‘0’) the frequency of directly follows the frequency of f cycle of the input clock

/ ((PLLIDIV+1) × (PLLODIV+1)).

OSC

so the high and low time of fMC is defined by the duty

The lowest master clock frequency is achieved by selecting the maximum values for both divider factors:

= f

/ ((3 + 1) × (14 + 1)) = f

OSC

/ 60.

Phase Locked Loop (PLL)

When PLL operation is configured (PLLCTRL = 11

) the on-chip phase locked loop is

enabled and provides the master clock. The PLL multiplies the input frequency by the factor F (

= f

× F) which results from the input divider, the multiplication factor, and

OSC

the output divider (F = PLLMUL+1 / (PLLIDIV+1 × PLLODIV+1)). The PLL circuit synchronizes the master clock to the input clock. This synchronization is done smoothly, i.e. the master clock frequency does not change abruptly.

Due to this adaptation to the input clock the frequency of is locked to

. The slight variation causes a jitter of fMC which also affects the duration

OSC

is constantly adjusted so it

of individual TCMs.

The timing listed in the AC Characteristics refers to TCPs. Because

, the timing must be calculated using the minimum TCP possible under the respective

is derived from

CPU

circumstances. The actual minimum value for TCP depends on the jitter of the PLL. As the PLL is constantly adjusting its output frequency so it corresponds to the applied input frequency (crystal or oscillator) the relative deviation for periods of more than one TCP is lower than for one single TCP (see formula and Figure 16).

This is especially important for bus cycles using waitstates and e.g. for the operation of timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train

Data Sheet 63 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter is negligible.

The value of the accumulated PLL jitter depends on the number of consecutive VCO output cycles within the respective timeframe. The VCO output clock is divided by the output prescaler (K = PLLODIV+1) to generate the master clock signal the number of VCO cycles can be represented as K × N, where N is the number of consecutive

cycles (TCM).

For a period of N × TCM the accumulated PLL jitter is defined by the deviation D

[ns] = ±(1.5 + 6.32 × N / fMC); fMC in [MHz], N = number of consecutive TCMs.

So, for a period of 3 TCMs @ 20 MHz and K = 12: D

= ±(1.5 + 6.32 × 3 / 20) = 2.448 ns.

This formula is applicable for K × N < 95. For longer periods the K × N = 95 value can be used. This steady value can be approximated by: D

[ns] = ±(1.5 + 600 / (K × fMC)).

Nmax

. Therefore,

Acc. jitter

±8

±7

±6

±5

±4

±3

±2

±1

051015 20 25

10 MHz

40 MHz

K = 12

K = 15

20 MHz

K = 8

K = 10

K = 6 K = 5

MCD05566

Figure 16 Approximated Accumulated PLL Jitter

Note: The bold lines indicate the minimum accumulated jitter which can be achieved by

selecting the maximum possible output prescaler factor K.

Different frequency bands can be selected for the VCO, so the operation of the PLL can be adjusted to a wide range of input and output frequencies:

Data Sheet 64 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

Table 16 VCO Bands for PLL Operation

PLLCON.PLLVB VCO Frequency Range Base Frequency Range

00 100 … 150 MHz 20 … 80 MHz

01 150 … 200 MHz 40 … 130 MHz

10 200 … 250 MHz 60 … 180 MHz

11 Reserved

1) Not subject to production test - verified by design/characterization.

Data Sheet 65 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

4.4.2 On-chip Flash Operation

The XC164’s Flash module delivers data within a fixed access time (see Table 17).

Accesses to the Flash module are controlled by the PMI and take 1+WS clock cycles, where WS is the number of Flash access waitstates selected via bitfield WSFLASH in register IMBCTRL. The resulting duration of the access phase must cover the access time available speed grade as well as on the actual system frequency.

Note: The Flash access waitstates only affect non-sequential accesses. Due to

of the Flash array. Therefore, the required Flash waitstates depend on the

ACC

prefetching mechanisms, the performance for sequential accesses (depending on the software structure) is only partially influenced by waitstates. In typical applications, eliminating one waitstate increases the average performance by 5% … 15%.

Table 17 Flash Characteristics

(Operating Conditions apply)

Parameter Symbol Limit Values Unit

Min. Typ. Max.

Flash module access time t

Programming time per 128-byte block

Erase time per sector

1) Programming and erase time depends on the system frequency. Typical values are valid for 40 MHz.

ACC

CC – – 50 ns

CC – 2

CC – 200

5ms

500 ms

Example: For an operating frequency of 40 MHz (clock cycle = 25 ns), devices can be operated with 1 waitstate: ((1+1)

× 25 ns) ≥ 50 ns.

Table 18 indicates the interrelation of waitstates and system frequency.

Table 18 Flash Access Waitstates

Required Waitstates Frequency Range

0 WS (WSFLASH = 00B) f

1 WS (WSFLASH = 01

) f

≤ 20 MHz

CPU

≤ 40 MHz

CPU

Note: The maximum achievable system frequency is limited by the properties of the

respective derivative, i.e. 40 MHz (or 20 MHz for xxx-16F20F devices).

Data Sheet 66 V2.2, 2006-03

4.4.3 External Clock Drive XTAL1

XC164-16

Derivatives

Electrical Parameters

Table 19 External Clock Drive Characteristics

(Operating Conditions apply)

Parameter Symbol Limit Values Unit

Min. Max.

V V

IHC

ILC

Oscillator period t

High time

Low time

Rise time

Fall time

1) The maximum limit is only relevant for PLL operation to ensure the minimum input frequency for the PLL.

2) The clock input signal must reach the defined levels V

0.5

DDI

OSC

SR 25 250

SR6–ns

SR–8ns

and V

ILC

OSC

IHC

MCT05572

Figure 17 External Clock Drive XTAL1

Note: If the on-chip oscillator is used together with a crystal or a ceramic resonator, the

oscillator frequency is limited to a range of 4 MHz to 16 MHz. It is strongly recommended to measure the oscillation allowance (negative resistance) in the final target system (layout) to determine the optimum parameters for the oscillator operation. Please refer to the limits specified by the crystal supplier. When driven by an external clock signal it will accept the specified frequency range. Operation at lower input frequencies is possible but is verified by design only (not subject to production test).

Data Sheet 67 V2.2, 2006-03

4.4.4 Testing Waveforms

XC164-16

Derivatives

Electrical Parameters

Output delay

Hold time

Output delay

Hold time

2.0 V Input Signal

(driven by tester)

Output Signal

(measured)

0.8 V

0.45 V

Output timings refer to the rising edge of CLKOUT. Input timings are calculated from the time, when the input signal reaches

or VIL, respectively.

MCD05556

Figure 18 Input Output Waveforms

+ 0.1 V

Load

Timing

Reference

Points

- 0.1 V

Load

For timing purposes a port pin is no longer floating when a 100 mV change from load voltage occurs, but begins to float when a 100 mV change from the loaded

Figure 19 Float Waveforms

level occurs (

- 0.1 V

+ 0.1 V

= 20 mA).

MCA05565

Data Sheet 68 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

4.4.5 External Bus Timing

Table 20 CLKOUT Reference Signal

Parameter Symbol Limits Unit

Min. Max.

CLKOUT cycle time tc

CC 40/30/25

CLKOUT high time

CLKOUT low time

CLKOUT rise time

CLKOUT fall time

1) The CLKOUT cycle time is influenced by the PLL jitter (given values apply to f

For longer periods the relative deviation decreases (see PLL deviation formula).

CC8–ns

CC6–ns

CC–4ns

CLKOUT

= 25/33/40 MHz).

CPU

MCT05571

Figure 20 CLKOUT Signal Timing

Data Sheet 69 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

Variable Memory Cycles

External bus cycles of the XC164 are executed in five subsequent cycle phases (AB, C, D, E, F). The duration of each cycle phase is programmable (via the TCONCSx registers) to adapt the external bus cycles to the respective external module (memory, peripheral, etc.).

This table provides a summary of the phases and the respective choices for their duration.

Table 21 Programmable Bus Cycle Phases

(see timing diagrams)

Bus Cycle Phase Parameter Valid Values Unit

Address setup phase, the standard duration of this

1 … 2 (5) TCP phase (1 … 2 TCP) can be extended by 0 … 3 TCP if the address window is changed

Command delay phase

Write Data setup/MUX Tristate phase

Access phase

Address/Write Data hold phase

0 … 3 TCP

0 … 1 TCP

1 … 32 TCP

0 … 3 TCP

Note: The bandwidth of a parameter (minimum and maximum value) covers the whole

operating range (temperature, voltage) as well as process variations. Within a given device, however, this bandwidth is smaller than the specified range. This is also due to interdependencies between certain parameters. Some of these interdependencies are described in additional notes (see standard timing).

Data Sheet 70 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

Table 22 External Bus Cycle Timing

(Operating Conditions apply)

Parameter Symbol Limits Unit

Min. Max.

Output valid delay for: RD

, WR(L/H)

Output valid delay for: BHE

, ALE

Output valid delay for:

CC 113ns

CC -1 7 ns

CC 116ns

A23 … A16, A15 … A0 (on PORT1)

Output valid delay for:

CC 316ns

A15 … A0 (on PORT0)

Output valid delay for:

CC 114ns

Output valid delay for:

CC 317ns

D15 … D0 (write data, MUX-mode)

Output valid delay for:

CC 317ns

D15 … D0 (write data, DEMUX-mode)

Output hold time for: RD

, WR(L/H)

Output hold time for: BHE

, ALE

Output hold time for:

CC -3 3ns

CC 0 8ns

CC 1 13 ns

A23 … A16, A15 … A0 (on PORT0)

Output hold time for:

CC -3 3ns

Output hold time for:

CC 1 13 ns

D15 … D0 (write data)

Input setup time for:

SR 24 – ns

D15 … D0 (read data)

Input hold time D15 … D0 (read data)

1) Read data are latched with the same (internal) clock edge that triggers the address change and the rising edge

of RD

. Therefore address changes before the end of RD have no impact on (demultiplexed) read cycles. Read

data can be removed after the rising edge of RD

SR -5 – ns

Note: The shaded parameters have been verified by characterization.

They are not subject to production test.

Data Sheet 71 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

CLKOUT

ALE

A23-A16, BHE, CSx

RD WR(L/H)

High Address

AD15-AD0 (read)

Low Address

AD15-AD0 (write)

Figure 21 Multiplexed Bus Cycle

Data In

Data OutLow Address

MCT05557

Data Sheet 72 V2.2, 2006-03

XC164-16

Derivatives

Electrical Parameters

CLKOUT

ALE

A23-A0, BHE, CSx

RD WR(L/H)

Address

D15-D0 (read)

D15-D0 (write)

Figure 22 Demultiplexed Bus Cycle

Data In

Data Out

MCT05558

Data Sheet 73 V2.2, 2006-03

Derivatives

Package and Reliability

5 Package and Reliability

5.1 Packaging

Table 23 Package Parameters (P-TQFP-100-16)

Parameter Symbol Limit Values Unit Notes

Min. Max.

XC164-16

Power dissipation P

Thermal resistance

Package Outlines

DISS

THA

–0.8W–

–29K/WChip-Ambient

GPP09189

Figure 23 P-TQFP-100-16

You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products.

Data Sheet 74 V2.2, 2006-03

(Plastic Thin Quad Flat Package)

Dimensions in mm

XC164-16

Derivatives

Package and Reliability

5.2 Flash Memory Parameters

The data retention time of the XC164’s Flash memory (i.e. the time after which stored data can still be retrieved) depends on the number of times the Flash memory has been erased and programmed.

Table 24 Flash Parameters (XC164, 128 Kbytes)

Parameter Symbol Limit Values Unit Notes

Min. Max.

Data retention time t

Flash Erase Endurance

RET

15 – years 103 erase/program

cycles

20 × 10

– cycles data retention time

5years

Data Sheet 75 V2.2, 2006-03

www.infineon.com

Published by Infineon Technologies AG

INFINEON XC164CS-16F User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Table of Contents

1 Summary of Features

2 General Device Information

2.1 Introduction

2.2 Pin Configuration and Definition

3 Functional Description

3.1 Memory Subsystem and Organization

3.2 External Bus Controller

3.3 Central Processing Unit (CPU)

3.4 Interrupt System

3.5 On-Chip Debug Support (OCDS)

3.6 Capture/Compare Units (CAPCOM1/2)

3.7 The Capture/Compare Unit CAPCOM6

3.8 General Purpose Timer (GPT12E) Unit

3.9 Real Time Clock

3.10 A/D Converter

3.11 Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1)

3.12 High Speed Synchronous Serial Channels (SSC0/SSC1)

3.13 TwinCAN Module

3.14 Watchdog Timer

3.15 Clock Generation

3.16 Parallel Ports

3.17 Power Management

3.18 Instruction Set Summary

4 Electrical Parameters

4.1 General Parameters

4.2 DC Parameters

4.3 Analog/Digital Converter Parameters

4.4 AC Parameters

4.4.1 Definition of Internal Timing

4.4.2 On-chip Flash Operation

4.4.3 External Clock Drive XTAL1

4.4.4 Testing Waveforms

4.4.5 External Bus Timing

5 Package and Reliability

5.1 Packaging

5.2 Flash Memory Parameters