Infineon UG-2020-31, CoolSiC User Manual

Please read the Important notice and the Safety precautions and the Warnings

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UG-2020-31

11 kW bi-directional CLLC DC-DC converter with

1200 V and 1700 V CoolSiC™ MOSFETs

About this document

Scope and purpose

This document introduces a complete Infineon Technologies AG system solution for an 11 kW bi-directional DCDC converter. The REF-DAB11KIZSICSYS board is a DC-DC stage with a wide range output using two inductors and two capacitors (CLLC) resonant network with bi-directional capability.This converter can operate under high power conversion efficiency, as the symmetric CLLC resonant network has zero-voltage switching capability for primary power switches and synchronous-rectification commutation capability for secondry-side output rectifiers. The converter could change the power flow direction, and its maximum power conversion efficiency was around 98% during the operation.

This document shows the board using 1200 V CoolSiC™ MOSFETs in TO247-4 package and EiceDRIVER™ 1ED compact gate driver ICs, which leverage the advantages of SiC technology including improved efficiency, space

and weight savings, part count reduction, and enhanced system reliability.

Intended audience

This document is intended for engineers who want to use 1200 V and 1700 V CoolSiC™ MOSFETs with EiceDRIVER™ driver ICs for bi-directional resonant topology applications such as EV-charger wall box, energy

storage systems to achieve reliable main-circuit design and increased power density.

Reference board/kit

Product(s) embedded in a PCB, with focus on specific applications and defined use cases that can include software. PCB and auxiliary circuits are optimized for the requirements of the target application.

Note: Boards do not necessarily meet safety, EMI, quality standards (for example UL, CE) requirements.

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Important notice

“Evaluation Boards and Reference Boards” shall mean products embedded on a printed circuit board

(PCB) for demonstration and/or evaluation purposes, which include, without limitation, demonstration, reference and evaluation boards, kits and design (collectively referred to as “Reference Board”).

Environmental conditions have been considered in the design of the Evaluation Boards and Reference Boards provided by Infineon Technologies. The design of the Evaluation Boards and Reference Boards has been tested by Infineon Technologies only as described in this document. The design is not qualified in terms of safety requirements, manufacturing and operation over the entire operating temperature range or lifetime.

The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to the same procedures as regular products regarding returned material analysis (RMA), process change notification (PCN) and product discontinuation (PD).

Evaluation Boards and Reference Boards are not commercialized products, and are solely intended for evaluation and testing purposes. In particular, they shall not be used for reliability testing or production. The Evaluation Boards and Reference Boards may therefore not comply with CE or similar standards (including but not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other requirements of the country in which they are operated by the customer. The customer shall ensure that all Evaluation Boards and Reference Boards will be handled in a way which is compliant with the relevant requirements and standards of the country in which they are operated.

The Evaluation Boards and Reference Boards as well as the information provided in this document are addressed only to qualified and skilled technical staff, for laboratory usage, and shall be used and managed according to the terms and conditions set forth in this document and in other related documentation supplied with the respective Evaluation Board or Reference Board.

It is the responsibility of the customer’s technical departments to evaluate the suitability of the

Evaluation Boards and Reference Boards for the intended application, and to evaluate the completeness and correctness of the information provided in this document with respect to such application.

The customer is obliged to ensure that the use of the Evaluation Boards and Reference Boards does not cause any harm to persons or third party property. The Evaluation Boards and Reference Boards and any information in this document is provided "as is" and Infineon Technologies disclaims any warranties, express or implied, including but not limited to warranties of non-infringement of third party rights and implied warranties of fitness for any purpose, or for merchantability.

Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation Boards and Reference Boards and/or from any information provided in this document. The customer is obliged to defend, indemnify and hold Infineon Technologies harmless from and against any claims or damages arising out of or resulting from any use thereof.

Infineon Technologies reserves the right to modify this document and/or any information provided herein at any time without further notice.

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Safety precautions

Note: Please note the following warnings regarding the hazards associated with development systems.

Table 1 Safety precautions

Warning: The DC link potential of this board is up to 1000 VDC. When measuring voltage

waveforms by oscilloscope, high voltage differential probes must be used. Failure to do so may result in personal injury or death.

Warning: The evaluation or reference board contains DC bus capacitors which take time to discharge after removal of the main supply. Before working on the drive system, wait five minutes for capacitors to discharge to safe voltage levels. Failure to do so may result in personal injury or death. Darkened display LEDs are not an indication that capacitors have discharged to safe voltage levels.

Warning: The evaluation or reference board is connected to the grid input during testing. Hence, high-voltage differential probes must be used when measuring voltage waveforms by oscilloscope. Failure to do so may result in personal injury or death. Darkened display LEDs are not an indication that capacitors have discharged to safe voltage levels.

Warning: Remove or disconnect power from the drive before you disconnect or reconnect wires, or perform maintenance work. Wait five minutes after removing power to discharge the bus capacitors. Do not attempt to service the drive until the bus capacitors have discharged to zero. Failure to do so may result in personal injury or death.

Caution: The heat sink and device surfaces of the evaluation or reference board may become hot during testing. Hence, necessary precautions are required while handling the board. Failure to comply may cause injury.

Caution: Only personnel familiar with the drive, power electronics and associated machinery should plan, install, commission and subsequently service the system. Failure to comply may result in personal injury and/or equipment damage.

Caution: The evaluation or reference board contains parts and assemblies sensitive to electrostatic discharge (ESD). Electrostatic control precautions are required when installing, testing, servicing or repairing the assembly. Component damage may result if ESD control procedures are not followed. If you are not familiar with electrostatic control procedures, refer to the applicable ESD protection handbooks and guidelines.

Caution: A drive that is incorrectly applied or installed can lead to component damage or reduction in product lifetime. Wiring or application errors such as undersizing the motor, supplying an incorrect or inadequate AC supply, or excessive ambient temperatures may result in system malfunction.

Caution: The evaluation or reference board is shipped with packing materials that need to be removed prior to installation. Failure to remove all packing materials that are unnecessary for system installation may result in overheating or abnormal operating conditions.

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Table of contents

Contents

About this document ....................................................................................................................... 1

Important notice ............................................................................................................................ 2

Safety precautions .......................................................................................................................... 3

Table of contents ............................................................................................................................ 4

1 The board at a glance .............................................................................................................. 5

1.1 Delivery content ...................................................................................................................................... 6

1.2 Block diagram .......................................................................................................................................... 6

1.3 Main features ........................................................................................................................................... 8

1.4 Board parameters and technical data .................................................................................................... 8

2 System and functional description ........................................................................................... 9

2.1 Commissioning ........................................................................................................................................ 9

2.2 Description of the functional blocks ....................................................................................................... 9

2.2.1 Description of the functional blocks ............................................................................................... 10

2.2.2 Special operation modes ................................................................................................................. 15

2.3 Auxiliary power boards ......................................................................................................................... 17

2.3.1 The technical specification of auxiliary power boards ................................................................... 17

2.3.2 Auxiliary power board description .................................................................................................. 17

2.3.3 1700 V CoolSiC™ MOSFET overview ................................................................................................ 18

2.4 User interface ........................................................................................................................................ 19

3 System design....................................................................................................................... 22

3.1 Schematics ............................................................................................................................................ 22

3.2 Layout .................................................................................................................................................... 26

3.3 Bill of material ....................................................................................................................................... 30

4 References and appendices .................................................................................................... 35

4.1 Abbreviations and definitions ............................................................................................................... 35

4.2 References ............................................................................................................................................. 35

4.3 Additional information .......................................................................................................................... 35

Revision history ............................................................................................................................. 36

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The board at a glance

E-mobility is well on its way to revolutionizing private and public transportation, reducing air pollution and making the earth a better place to live. Energy storage systems can also help save energy consumption by maximizing the allocation of energy. Infineon is proud to be a key player in this green megatrend. Being a one-stop shop for high-quality components and solutions, the target of the REF-DAB11KIZSICSYS board is to build up a solution for bi-directional DC-DC converters, which will enable customers to implement unique bi-directional charger designs in a very short time. This featured 11 kW CLLC resonant DC-DC converter with bi-directional power flow capability and soft-switching characteristics is the ideal choice for on- & off-board chargers and energy storage systems (ESS). This reference design provides a complete and fully characterized hardware and firmware solution, and user-friendly graphical user interface (GUI). It ensures that CoolSiC™ MOSFETs integrate with Infineon driver IC, XMC controller, flyback controller, voltage regulator MOSFETs, current sensor, Cypress memory, and security & safty chip. It is the perfect way to improve cost-effective power density with high reliability, and easy usage up to the next level! In UG-2020-31, Figure 1 shows the placement of the different components on the 11 kW bi-directional DC-DC converter. The outer dimensions of the board, enclosed in the case, are 33.1 mm x 13.4 mm x 6 mm, which results in a power density in the range of 4.1 W/cm³ (5.5 W/g).

Auxiliary Power Board

1200 V SiC MOSFETs- IMZ120R030M1H

Controller Board

1200 V SiC MOSFETs- IMZ120R030M1H

Driver ICs-1EDC20I12AH

Current Sensor- TLI4971

Resonant capacitor

Resonant Inductor

Resonant InductorResonant capacitor

Transformer

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The board at a glance

Figure 1 Placement of the different sections in the 11 kW bi-directional CLLC DC-DC converter with

Infineon CoolSiC™ MOSFETs.

1.1 Delivery content

The 11 kW bi-directional board is a CLLC DC-DC converter developed with Infineon power semiconductors as well as Infineon drivers, current sensor, controllers, communication chip, security chip and memory chip. The combination of these devices can provide customers with an optimized system solution. The Infineon devices used in the implementation of the 11 kW bi-directional board include:

Main power board

 1200 V CoolSiC

MOSFETs discretes - IMZ120R030M1H

 1200VSingle channel IGBT gate driver IC in wide body package -1EDC20I12AH  XENSIV™ - high-precision coreless current sensors for industrial applications- TLI4971

Auxilary power board

 1700 V CoolSiC™ MOSFET discretes- IMBF170R1K0M1  PWM-QR (quasi resonant) flyback control ICs- ICE5QSAG

Controller board

 32-bit XMC4000 industrial microcontroller ARM® Cortex®-M4 family- XMC4400-F100k512 BA  High speed CAN transceiver generation-TLE9251VSJ  OPTIGA™ TRUST M -SLS32AIA  Low voltage drop linear voltage regulators - IFX25001TFV33  256-Kbit (32K × 8) serial (SPI) F-RAM: FM25V02A from Cypress

More information concerning these devices is available on the Infineon website.

1.2 Block diagram

The REF-DAB11KIZSICSYS design consists of a CLLC in full-bridge configuration (Figure 2). The CLLC resonant converter is widely used as a DC transformer to interlink the AC/DC to DC bus, because of its advantages of high power density and the capacity of bi-directional power transfer. In both forward and reverse modes, the resonant tank possesses almost the same operational characteristics of the conventional LLC resonant tank.Thus the ZVS+ZCS soft switching can be achieved both in forward and reverse modes, and the switching losses can be minimized, thereby improving charger efficiency.

This architecture showed in the block diagram contains three parts, the main power circuit, the auxiliary power board and the control board.

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The board at a glance

Isolated gate driver

1EDC20I12AH

Isolated current

transformer

Isolated current

transformer

Isolated voltage

sensor

Isolated

voltage sensor

XMC4400 MCU Controller

Aux power

CoolSET+SIC MOS

FAN Wifi Module Cypress FeRAM OPTIGATrust X

NTC

Current sensor

isolated

Aux power

CoolSET+SIC MOS

Current sensor

TLI4971

Isolated gate driver

1EDC20I12AH

GUI

Figure 2 11 kW bi-directional CLLC DC-DC converter (REF-DAB11KIZSICSYS ) – simplified diagram

showing the Infineon semiconductors used in the system

The main power circuit includes 1200 V CoolSiCTM MOSFETs make high efficiency possible.

The auxiliary power supply uses 1700 V CoolSiCTM MOSFETs for an efficient design, as it is as small as a card.

The control is implemented in an XMC4400 Infineon microcontroller, which includes the following features:

 ARM® Cortex™-M4, 120MHz, incl. single cycle DSP MAC and floating point unit (FPU)  8-channel DMA + dedicated DMAs for USB and Ethernet

 USIC 4ch [Quad SPI, SCI/UART, I²C, I²S, LIN]  Supply voltage range: 3.13 - 3.63V  USB 2.0 full-speed, on-the-go  CPU frequency: 120MHz  Peripherals‘ clock: 120 [MHZ]  eFlash: 512 kB including hardware ECC  80 kB SRAM  10/100 Ethernet MAC (/w IEEE 1588)  2x CAN, 64 MO  Package: PG-LQFP-100  4x ΔΣ demodulator  Temperature range from -40° to 125°

Further details about the digital control implementation and other functionalities of CLLC in the XMC™ 4000 family can be found on the Infineon website.

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The board at a glance

1.3 Main features

A bi-directional full-bridge CLLC resonant converter using a symmetric CLLC-type resonant network is proposed for a bi-directional power distribution system. This converter can operate under high power conversion efficiency, as the symmetric LLC resonant network has zero-voltage switching capability for primary power switches and sychronous rectification capability for secondary- side rectifiers.

In addition, the proposed topology does not require any snubber circuits to reduce the voltage stress of the switching devices because the switch voltage of the primary and secondary power stage is confined by the input and output voltage, respectively. In addition, the power conversion efficiency of any direction is similar. Intelligent digital-control algorithms are also proposed to regulate output voltage, control bi-directional power conversions and to achieve synchronous rectification.

1.4 Board parameters and technical data

Table 2 shows the specifications of the board

Table 2 Parameter

Parameter

Symbol

Conditions

Value

Unit

Rated power P V

bus

=750V,

VHV=800V,Ta=250C. I

pri.

=15A

Primay side bus voltage

bus

750

Secondary side bus voltage

VHV

550-~800

Primay side current

pri.

bus

=750V,

VHV=800V,Ta=250C. I

pri.

=15A

Secondary side current

sec.

VHV=550V,P=11KW,

Ta=250C.

Switching frequency

40~200

Khz

Auxilary power output voltage

aux.

=32W

15/20

Auxilary power output power

aux.

=20V, ,Ta=250C.

Board net weight

Without encloser

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System and functional description

2 System and functional description

2.1 Commissioning

This chapter presents the set-up on how to evaluate the performance and behavior of the 11 kW bi-directional DC-DC converter using CoolSiC™ MOSFETs.

 DC source provides the power to the converter prototype  Secondary side of converter prototype connect with the DC electric load  The host computer controls the start and stop of the prototype and sets the working parameters

through GUI

 Observe the corresponding waveforms with an oscilloscope

Figure 3 11 kW bi-directional CLLC DC-DC converter measuring environment

2.2 Description of the functional blocks

The 11 kW bi-directional CLLC DC-DC converter can operate as an isolated buck or as an isolated boost converter, with the power flowing from the bus side to the isolated HV side or vice versa.

For validation of the buck mode, the suggested set-up includes:

 Bus supply capable of 700 V~800 V and at least 11 kW (when testing up to full load)

 HV electronic load (500 V to 800 V), in constant current mode, capable of at least 11 kW (when testing up to full

load). Nominal input voltage of the converter is 750 V. The converter works as indicated in Figure 4.

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System and functional description

Bus

36uH 132nF 22uH216nF

20:16,Lm=160uH

Figure 4 Buck mode recommended validation set-up

For validation of the boost mode, the suggested set-up is exactly the same as for the buck mode, except for thing: the output voltage parameter must be changed in the GUI window.

2.2.1 Description of the functional blocks

The output gain function of CLLC topology is generally analyzed by the fundamental wave-analysis method. Based on this analysis method, the parameters of the key resonant components in the current design are shown in the Figure 4:

By using this parameter, the resonance parameter Q of the primary and secondary transformers is consistent, and the natural resonance frequency is 73 kHz. In the design, we chose a switching frequency of the topology in the range of 40 kHz to 200 KHz.

The structure of CLLC topology on the primary side and the secondary side is the same. On the contrary, the fundamental wave-analysis method is also valid. The relationship between the output/input gain and the switching frequency of the circuit is shown in Error! Reference source not found.(reverse energy transmission):

The current of the primary/secondary resonant cavity and the Vds waveform of the SiC MOSFET in the steady state can be obtained as follows with the help of PLECS simulation software for verification:

Buck mode (forward-energy transmission), input voltage 800 V, and output voltage 550 V with load 27.5 Ω. At this time, the CLLC topology switching frequency is 86.2 KHz:

Ilr_pri is the primary side resonant tank current.

Ilr_sec is the secondary side resonant tank current.

VHB is the V

voltage of Q2 (The position of SiC MOSFETs Q1~Q8 can be seen in Figure 4.).

Fsw is the switching frequency.

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System and functional description

Figure 5 Simulation result of CLLC buck mode

Forward-energy transmission, input voltage 750 V, output voltage 750 V, load 51.1 Ohm. The switching frequency of CLLC topology is 54.0 KHz at this condition, the simulation wavefrom can be seen in Figure 6.

Figure 6 Simulation result of CLLC

Boost mode (forward-energy transmission), input voltage 700 V, output voltage 800 V, load 58.1 Ohm. At this time, the CLLC topology switching frequency is around 48.2 KHz:

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System and functional description

Figure 7 Simulation result of CLLC boost mode

In the case of no load or light load, the CLLC topology must work in frequency-modulation mode (PFM), otherwise the power devices in the circuit may work at a very high switching frequency. Due to the existence of parasitic parameters, the output voltage cannot be reduced to the target value under the circumstances of continuous wave mode. The topology will work in this mode:

Channel 1 is the controller board ouput pulse-width modulation (PWM) signal.

Channel 2 is the output voltage.

Figure 8 Test result of light load

In the “burst” state, the output voltage waveform is as follows when a sudden load is added:

Channel 3 is the output voltage.

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