•Two integrated Low-Drop Voltage Regulators: Main regulator (5 V or 3.3 V
up to 250 mA) and auxiliary regulator (5 V up to 100 mA) with off-board
usage protection
•Voltage regulator (5 V, 3.3 V or 1.8 V) with external PNP transistor
configurable for off-board usage or for load sharing
•1 high-speed CAN transceiver supporting FD communication up to
5 Mbit/s featuring CAN Partial Networking & CAN FD tolerant mode
according to ISO 11898-2:2016 & SAE J2284
•Integrated fail-safe and supervision functions, e.g. fail-safe, watchdog, interrupt- and reset outputs
•16-bit SPI for configuration and diagnostics
Potential applications
•Body Control Modules (BMC), Passive keyless entry and start modules, Gateway applications
•Heating, ventilation and air conditioning (HVAC)
•Seat, roof, tailgate, trailer, door and other closure modules
•Light control modules
•Gear shifters and selectors
Product validation
Qualified for automotive applications. Product validation according to AEC-Q100/101.
Description
Body System IC with Integrated Voltage Regulators, Power Management Functions, HS-CAN Transceiver
supporting CAN FD featuring Partial Networking (incl. FD Tolerant Mode).
Featuring Multiple High-Side Switches and High-Voltage Wake Inputs.
•Product family with various products for complete scalable application coverage.
•Dedicated Data Sheets are available for the different product variants
•Complete compatibility (hardware and software) across the family
•TLE9263 with 2 LIN transceivers, 3 voltage regulators
•TLE9262 with 1 LIN transceiver, 3 voltage regulators
•TLE9261 without LIN transceivers, 3 voltage regulators
•Product variants for 5V (TLE926xQX) and 3.3V (TLE926xQXV33) output voltage for main voltage regulator
•CAN Partial Networking variants for 5V (TLE926x-3QX) and 3.3V (TLE926x-3QXV33) output voltage
Device Description
The TLE9261-3BQX is a monolithic integrated circuit in an exposed pad VQFN-48 (7mm x 7mm) power package
with Lead Tip Inspection (LTI) feature to support Automatic Optical Inspection (AOI).
The device is designed for various CAN automotive applications as main supply for the microcontroller and as
interface for a CAN bus network including the CAN Partial Networking feature.
To support these applications, the System Basis Chip (SBC) provides the main functions, such as a 5V lowdropout voltage regulator (LDO) for e.g. a microcontroller supply, another 5V low-dropout voltage regulator
with off-board protection for e.g. sensor supply, another 5V/3.3V regulator to drive an external PNP transistor,
which can be used as an independent supply for off-board usage or in load sharing configuration with the
main regulator VCC1, a HS-CAN transceiver supporting CAN FD and CAN Partial Networking (incl. FD tolerant
mode) for data transmission, high-side switches with embedded protective functions and a 16-bit Serial
Peripheral Interface (SPI) to control and monitor the device. Also implemented are a configurable timeout /
window watchdog circuit with a reset feature, three Fail Outputs and an undervoltage reset feature.
The device offers low-power modes in order to minimize current consumption on applications that are
connected permanently to the battery. A wake-up from the low-power mode is possible via a message on the
buses, via the bi-level sensitive monitoring/wake-up inputs as well as via cyclic wake.
The device is designed to withstand the severe conditions of automotive applications.
Datasheet6Rev. 1.1
2019-09-27
TLE9261-3BQX
Overview
Product Features
•Very low quiescent current consumption in Stop- and Sleep Mode
•Periodic Cyclic Wake in SBC Normal- and Stop Mode
•Periodic Cyclic Sense in SBC Normal-, Stop- and Sleep Mode
•Low-Drop Voltage Regulator 5V, 250mA
•Low-Drop Voltage Regulator 5V, 100mA, protected features for off-board usage
•Low-Drop Voltage Regulator, driving an external PNP transistor - 5V in load sharing configuration or
5V/3.3V in stand-alone configuration, protected features for off-board usage. Current limitation by shunt
resistor (up to 350mA with 470mΩ external shunt resistor) in stand-alone configuration
•High-Speed CAN Transceiver:
–fully compliant to HS-CAN standard ISO 11898-2:2016
–fully compliant to CAN Partial Networking including CAN FD tolerant feature (acc. ISO 11898-2:2016)
–supporting CAN FD communication up to 5 Mbps
•Fully compliant to “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive
Applications” Revision 1.3, 2012-05-04
•Four High-Side Outputs 7Ω typ.
•Dedicated supply pin for High-Side Outputs
•Two General Purpose High-Voltage In- and Outputs (GPIOs) configurable as add. Fail Outputs, Wake Inputs,
Low-Side switches or High-Side switches
•Three universal High-Voltage Wake Inputs for voltage level monitoring
•Alternate High-Voltage Measurement Function, e.g. for battery voltage sensing
•Configurable wake-up sources
•Reset Output
•Configurable timeout and window watchdog
•Up to three Fail Outputs (depending on configuration)
•Overtemperature and short circuit protection feature
•Wide supply input voltage and temperature range
•Software compatible to all SBC families TLE926x and TLE927x
•Green Product (RoHS compliant) & AEC Qualified
•PG-VQFN-48 leadless exposed-pad power package with Lead Tip Inspection (LTI) feature to support
Automatic Optical Inspection (AOI)
Datasheet7Rev. 1.1
2019-09-27
V
CC1
SPI
Interrupt
Control
SBC
STATE
MACHINE
SDI
SDO
CLK
CSN
VCC1
CAN cell
Window W atchdog
WK
TXDCAN
RXDCAN
VCAN
CANH
CANL
WK1
RESET
GENERATOR
INT
GND
WAKE
REGISTER
VS
V
S
Fail Safe
RO
FO3/TEST
FO2
FO1
V
CC2
VCC2
High Side
HS2
HS3
HS4
HS1
WK
WK2
WK
WK3
V
CC3
VCC3REF
VCC3SH
VCC3B
VSHSVS
Selective Wake
Logic
Alter nati ve funct ion
for FO 2/3: GPIO1 /2
Alter native
function for WK 1/2:
Voltage measur ement
TLE9261-3BQX
Block Diagram
2Block Diagram
Figure 1 Block Diagram with CAN Partial Networking
Datasheet8Rev. 1.1
2019-09-27
TLE9261
PG-VQFN-48
TLE9261 .vsd
1 GND
2 n.c.
3 VCC3REF
4 VCC3B
5 VCC3SH
6 n.c.
7 n.c.
8 HS1
9 HS2
10 HS3
11 HS4
12 n. c.
FO3/TEST 48
FO2 47
n.c. 46
n.c. 45
N.U. 44
GND 43
N.U. 42
n.c. 41
CANH 40
CANL 39
GND 38
VCAN 37
13 VSHS
14 VS
15 VS
16 n.c.
17 VCC1
18 VCC2
19 n.c.
20 GND
21 FO1
22 WK1
23 WK2
24 WK3
25 N. U.
26 N. U.
27 CLK
28 SDI
29 SDO
30 CSN
31 INT
32 RO
33 N. U.
34 N. U.
35 TXDCAN
36 RXDCAN
TLE9261-3BQX
Pin Configuration
3Pin Configuration
3.1Pin Assignment
Figure 2 Pin Configuration
Datasheet9Rev. 1.1
2019-09-27
TLE9261-3BQX
Pin Configuration
3.2Pin Definitions and Functions
PinSymbolFunction
1GNDGround
2n.c.not connected; internally not bonded.
3VCC3REFVCC3REF; Collector connection for external PNP, reference input
4VCC3BVCC3B; Base connection for external PNP
5VCC3SHVCC3SH; Emitter connection for external PNP, shunt connection
6n.c.not connected; internally not bonded.
7n.c.not connected; internally not bonded.
8HS1High Side Output 1; typ. 7Ω
9HS2High Side Output 2; typ. 7Ω
10HS3High Side Output 3; typ. 7Ω
11HS4High Side Output 4; typ. 7Ω
12n.cnot connected; internally not bonded.
13VSHSSupply Voltage HS and GPIO1/2 in HS configuration; Supply voltage for High-
Side Switches modules and respective UV-/OV supervision; Connected to
battery voltage with reverse protection diode and filter against EMC;
connect to VS if separate supply is not needed
14VSSupply Voltage; Supply voltage for chip internal supply and voltage regulators;
Connected to Battery Voltage with external reverse protection Diode and Filter
against EMC
15VSSupply Voltage; Supply voltage for chip internal supply and voltage regulators;
Connected to Battery Voltage with external reverse protection Diode and Filter
against EMC
16n.c.not connected; internally not bonded.
17VCC1Voltage Regulator Output 1
18VCC2Voltage Regulator Output 2
19n.c.not connected; internally not bonded.
20GNDGND
21FO1Fail Output 1
22WK1Wake Input 1; Alternative function: HV-measurement function input pin
(only in combination with WK2, see Chapter 11.2.2)
23WK2Wake Input 2; Alternative function: HV-measurement function output pin
(only in combination with WK1, see Chapter 11.2.2)
24WK3Wake Input 3
25N.U.Not Used; Used for internal testing purpose. Do not connect, leave open
26N.U.Not Used; Used for internal testing purpose. Do not connect, leave open
27CLKSPI Clock Input
28SDI
29SDOSPI Data Output; out of SBC (=MISO)
Datasheet10Rev. 1.1
SPI Data Input; into SBC (=MOSI)
2019-09-27
TLE9261-3BQX
Pin Configuration
PinSymbolFunction
30CSNSPI Chip Select Not Input
31INTInterrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal
Mode and for indicating failures. Active low.
During start-up used to set the SBC configuration. External pull-up sets config
1/3, no external pull-up sets config 2/4.
32ROReset Output
33N.U.Not Used; Used for internal testing purpose. Do not connect, leave open
34N.U.Not Used; Used for internal testing purpose. Do not connect, leave open
35TXDCANTransmit CAN; alternate function: calibration of high-precision oscillator
36RXDCANReceive CAN
37VCANSupply Input; for internal HS-CAN cell
38GNDGND
39CANLCAN Low Bus Pin
40CANHCAN High Bus Pin
41n.c.not connected; internally not bonded.
42N.U.Not Used; Used for internal testing purpose. Do not connect, leave open
43GNDGround
44N.U.Not Used; Used for internal testing purpose. Do not connect, leave open
45n.c.not connected; internally not bonded.
46n.c.not connected; internally not bonded.
47FO2Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;
Open drain. Active LOW.
Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO2, see also Chapter 13.1.1)
output;
Open drain. Active LOW
TEST; Connect to GND to activate SBC Development Mode;
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for
normal operation.
Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO3, see also Chapter 13.1.1)
Coolin
g Tab
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB.
No te:all V S Pins mus t be con necte d to battery potential or insert a reverse polarity diodes where required;
Datasheet11Rev. 1.1
GNDCooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground.
The exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND
(recommended) for the best EMC performance.
all GND pins as well as the Cooling Tab must be connected to one common GND potential;
note that the tie bars at each package corner are connected to the cooling tab (see also Chapter 17)
1)
2019-09-27
TLE9261-3BQX
Pin Configuration
3.3Hints for Unused Pins
It must be ensured that the correct configurations are also selected, i.e. in case functions are not used that
they are disabled via SPI:
•WK1/2/3: connect to GND and disable WK inputs via SPI
•HSx: leave open
•CANH/L, RXDCAN, TXDCAN: leave all pins open
•RO / FOx: leave open
•INT: leave open
•TEST: connect to GND during power-up to activate SBC Development Mode;
connect to VS or leave open for normal user mode operation
•VCC2: leave open and keep disabled
•VCC3: See
•VCAN: connect to VCC1
•n.c.: not connected; internally not bonded; connect to GND
•N.U.: Not Used; Used for internal testing purposes only. Do not connect, leave open, i.e. not connected to
any potential on the board. In case N.U. pins are connected on the board an open bridge has to be foreseen
to avoid external disturbances. The bridge can be shorted by a 0 Ω resistance if signal is needed.
Chapter 8.5
3.4Hints for Alternate Pin Functions
In case of alternate pin functions, selectable via SPI, it must be ensured that the correct configurations are also
selected via SPI, in case it is not done automatically. Please consult the respective chapter. In addition,
following topics shall be considered:
•WK1..2: The pins can be either used as HV wake / voltage monitoring inputs or for a voltage measurement
function (via bit
detection nor cyclic sense functionality, i.e. WK1 and WK2 must be disabled in the register
the level information is to be ignored in the register
•FO2..3: The pins can also be configured as GPIOs in the GPIO_CTRL register. In this case, the pins shall not
be used for any fail output functionality. The default function after Power on Reset (POR) is FOx.
WK_MEAS). In the second case, the WK1..2 pins shall not be used / assigned for any wake
WK_CTRL_2 and
WK_LVL_STAT.
Datasheet12Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
4General Product Characteristics
4.1Absolute Maximum Ratings
Table 1 Absolute Maximum Ratings
1)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
ParameterSymbolValuesUnitNote or
Min.Typ.Max.
Test Condition
Voltages
Supply Voltage (VS, VSHS)VS
Supply Voltage (VS, VSHS)VS
x, max
x, max
-0.3–28V–P_4.1.1
-0.3–40VLoad Dump,
max. 400 ms
Voltage Regulator 1V
Voltage Regulator 2V
CC1, max
CC2, max
-0.3–5.5V–P_4.1.3
-0.3–28VV
= 40V for
CC2
Load Dump,
max. 400 ms;
Voltage Regulator 3
(VCC3REF)
Voltage Regulator 3 (VCC3B) V
V
CC3REF,max
CC3B,max
-0.3–28VV
-0.3–VS
+ 10
VV
= 40V for
CC3REF
Load Dump,
max. 400 ms;
= 40V for
CC3B
Load Dump,
max. 400 ms;
Number
P_4.1.2
P_4.1.4
P_4.1.5
P_4.1.25
Voltage Regulator 3
(VCC3SH)
Wake Inputs WK1..3V
Fail Pin FO1V
Fail Pins FO2, FO3/TESTV
CANH, CANLV
Maximum Differential CAN
Bus Voltage
Logic Input Pins (CSN, CLK,
SDI, TXDCAN)
Logic Output Pins (SDO, RO,
INT, RXDCAN)
VCAN Input VoltageV
High Side 1...4V
Currents
Wake input WK1I
Wake input WK2I
V
CC3SH,max
WK, max
FO1, max
FO2_3, max
BUS, max
V
CAN_Diff, max
V
I, max
V
O, max
VCAN, max
HS, max
WK1,max
WK2,max
V
S
- 0.30
–V
S
+ 0.30
V–P_4.1.26
-0.3–40V–P_4.1.6
-0.3–40V–P_4.1.7
-0.3–V
S
V–P_4.1.23
+ 0.3
-27–40V–P_4.1.8
-5–10V–P_4.1.27
-0.3–V
CC1
V–P_4.1.9
+ 0.3
-0.3–V
CC1
V–P_4.1.10
+ 0.3
-0.3–5.5V–P_4.1.11
-0.3–V
SHS
V–P_4.1.12
+ 0.3
0–500µA
-500–0µA
2)
2)
P_4.1.13
P_4.1.14
Datasheet13Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
Table 1 Absolute Maximum Ratings1) (cont’d)
= -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
T
j
(unless otherwise specified)
ParameterSymbolValuesUnitNote or
Min.Typ.Max.
Test Condition
Number
Temperatures
Junction TemperatureT
Storage TemperatureT
j
stg
-40–150°C–P_4.1.15
-55–150°C–P_4.1.16
ESD Susceptibility
ESD ResistivityV
ESD Resistivity to GND, HSxV
ESD Resistivity to GND,
ESD,11
ESD,12
V
ESD,13
-2–2kVHBM
-2–2kVHBM
-8–8kVHBM
3)
3)
4)3)
P_4.1.17
P_4.1.18
P_4.1.19
CANH, CANL
ESD Resistivity to GNDV
ESD Resistivity Pin 1,
ESD,21
V
ESD,22
-500–500VCDM
-750–750VCDM
5)
5)
P_4.1.20
P_4.1.21
12,13,24,25,36,37,48 (corner
pins) to GND
1) Not subject to production test, specified by design.
2) Applies only if WK1 and WK2 are configured as alternative HV-measurement function
3) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS-001 (1.5 kΩ, 100 pF)
4) For ESD “GUN” Resistivity 6KV (according to IEC61000-4-2 “gun test” (150pF, 330Ω)), will be shown in Application
Information and test report will be provided from IBEE
5) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101 or ESDA STM5.3.1
Notes
1. Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2. Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Datasheet14Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
4.2Functional Range
Table 2 Functional Range
ParameterSymbolValuesUnitNote or
Test Condition
see
POR
Supply VoltageV
S,func
Min.Typ.Max.
V
POR
–28V1) V
Number
P_4.2.1
Chapter 14.10
CAN Supply VoltageV
SPI frequencyf
CAN,func
SPI
4.75–5.25V–P_4.2.3
––4MHzsee
P_4.2.4
Chapter 15.7 for
f
SPI,max
Junction TemperatureT
1) Including Power-On Reset, Over- and Undervoltage Protection
j
-40–150°C–P_4.2.5
Note:Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics
table.
Device Behavior Outside of Specified Functional Range:
•28V < V
< 40V: Device will still be functional including the state machine; the specified electrical
S,func
characteristics might not be ensured anymore. The regulators VCC1/2/3 are working properly, however, a
thermal shutdown might occur due to high power dissipation. HSx switches might be turned OFF
depending on VSHS_OV configurations. The specified SPI communication speed is ensured; the absolute
maximum ratings are not violated, however the device is not intended for continuous operation of VS >28V.
The device operation at high junction temperatures for long periods might reduce the operating life time;
•V
< 4.75V: The undervoltage bit VCAN_UV will be set in the SPI register BUS_STAT_1 and the transmitter
CAN
will be disabled as long as the UV condition is present;
•5.25V < V
< 5.50V: CAN transceiver still functional. However, the communication might fail due to out-of-
CAN
spec operation;
•V
< VS < 5.5V: Device will still be functional; the specified electrical characteristics might not be ensured
POR,f
anymore.
–The voltage regulators will enter the low-drop operation mode
(applies for VCC3 only if bit VCC3_VS_ UV_OFF is set),
–A VCC1_UV reset could be triggered depending on the Vrtx settings,
–HSx switch behavior will depend on the respective configuration:
- HS_UV_SD_EN = ‘0’ (default): HSx will be turned OFF for VSHS < VSHS_UV and will stay OFF;
- HS_UV_SD_EN = ‘1’ : HSx st ays on a s lo ng as po ssible . An unw ant ed over curren t shut d own may occ ur.
OC shut down bit set and the respective HSx switch will stay OFF;
–FOx outputs will remain ON if they were enabled before VS > 5.5V,
–The specified SPI communication speed is ensured.
Datasheet15Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
4.3Thermal Resistance
Table 3 Thermal Resistance
ParameterSymbolValuesUnitNote or
Junction to Soldering PointR
Junction to AmbientR
1) Not subject to production test, specified by design.
2) According to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board for 1.5W. Board: 76.2x114.3x1.5mm3 with
2 inner copper layers (35µm thick), with thermal via array under the exposed pad contacting the first inner copper
layer and 300mm2 cooling area on the bottom layer (70µm).
1)
thJSP
thJA
Number
Min.Typ.Max.
–6–K/WExposed PadP_4.3.1
–33–K/W
Test Condition
2)
P_4.3.2
Datasheet16Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
4.4Current Consumption
Table 4 Current Consumption
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
ParameterSymbolValuesUnitNote or
Min.Typ.Max.
Test Condition
SBC Normal Mode
Normal Mode current
consumption
I
Normal
–3.56.5mAVS = 5.5 V to 28 V;
T
= -40 °C to +150 °C;
j
VCC2, CAN, VCC3, HSx
= OFF
SBC Stop Mode
Stop Mode current
consumption
I
Stop_1,25
–4460µA1)VCC2/3, HSx = OFF;
2)
, WKx not wake
CAN
capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘0’
Stop Mode current
consumption
I
Stop_1,85
–5070µA
1)3)
Tj = 85°C;
VCC2/3, HSx = OFF;
2)
CAN
, WKx not wake
capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘0’
Number
P_4.4.1
P_4.4.2
P_4.4.3
Stop Mode current
consumption
(high active peak threshold)
Stop Mode current
consumption
(high active peak threshold)
SBC Sleep Mode
Sleep Mode current
consumption
Sleep Mode current
consumption
I
Stop_2,25
I
Stop_2,85
I
Sleep,25
I
Sleep,85
–6490µA1)VCC2/3, HSx = OFF;
2)
CAN
, WKx not wake
capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘1’
–70100µA
1)3)
Tj = 85°C;
VCC2/3, HSx = OFF;
2)
CAN
, WKx not wake
capable;
Watchdog = OFF;
no load on VCC1;
I_PEAK_TH = ‘1’
–1525µAVCC2/3, HSx = OFF;
2)
, WKx not wake
CAN
capable
–2535µA3)Tj = 85°C;
VCC2/3, HSx = OFF;
2)
, WKx not wake
CAN
capable
P_4.4.35
P_4.4.36
P_4.4.5
P_4.4.6
Datasheet17Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
Table 4 Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
ParameterSymbolValuesUnitNote or
Min.Typ.Max.
Test Condition
Feature Incremental Current Consumption
Current consumption for
CAN module, recessive state
I
CAN,rec
–23mASBC Normal/Stop
Mode; CAN Normal
Mode; VCC1
connected to VCAN;
VTXDCAN = VCC1; no
RL on CAN
Current consumption for
CAN module, dominant
state
I
CAN,dom
–34.5mA3)SBC Normal/Stop
Mode; CAN Normal
Mode; VCC1
connected to VCAN;
VTXDCAN = GND;
no RL on CAN
Current consumption for
CAN module, Receive Only
Mode
I
CAN,RcvOnly
–0.91.2mA
3)4)
SBC Normal/Stop
Mode; CAN Receive
Only Mode; VCC1
connected to VCAN;
VTXDCAN = VCC1; no
RL on CAN
Current consumption during
CAN Partial Networking
frame detect mode
(RX_WK_ SEL = ‘1’)
I
CAN,SWK,25
–560690µA
3)
Tj = 25°C;
SBC Stop Mode;
VCC2, HSx = OFF;
WKx not wake
capable;
CAN SWK wake
capable, SWK
Receiver enabled,
WUF detect;
no RL on CAN
Current consumption during
CAN Partial Networking
frame detect mode
(RX_WK_ SEL = ‘1’)
I
CAN,SWK,85
–600720µA
3)
Tj = 85°C;
SBC Stop Mode;
VCC2, HSx = OFF;
WKx not wake
capable;
CAN SWK wake
capable, SWK
Receiver enabled,
WUF detect;
no RL on CAN
Current consumption for
WK1..3 wake capability
(all wake inputs)
I
Wake,WKx,25
–0.22µA
5)6)7)
SBC Sleep Mode;
WK1..3 wake capable
(all WKx enabled);
CAN = OFF
Number
P_4.4.7
P_4.4.8
P_4.4.9
P_4.4.4
P_4.4.29
P_4.4.13
Datasheet18Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
Table 4 Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
ParameterSymbolValuesUnitNote or
Test Condition
3)5)6)7)
SBC Sleep
Mode; T
WK1..3 wake capable;
Current consumption for
WK1..3 wake capability
(all wake inputs)
I
Wake,WKx,85
Min.Typ.Max.
–0.53µA
(all WKx enabled);
CAN = OFF
Current consumption for
CAN wake capability
(tsilence expired)
Current consumption for
CAN wake capability
(tsilence expired)
I
Wake,CAN,25
I
Wake,CAN,85
–4.56µA
–5.57µA
2)5)
SBC Sleep Mode;
CAN wake capable;
WK1..3
2)3)5)
SBC Sleep Mode;
T
= 85°C;
j
CAN wake capable;
WK1..3
VCC2 Normal Mode current
consumption
I
Normal,VCC2
–2.53.5mAVS = 5.5 V to 28 V;
= -40 °C to +150 °C;
T
j
VCC2 = ON (no load)
Current consumption for
VCC2 in SBC Sleep Mode
Current consumption for
VCC2 in SBC Sleep Mode
I
Sleep,VCC2,25
I
Sleep,VCC2,85
–2535µA
–3040µA
1)5)
SBC Sleep Mode;
VCC2 = ON (no load);
CAN,
WK1..3 = OFF
1)3)5)
SBC Sleep Mode;
= 85°C; VCC2 = ON
T
j
(no load); CAN,
WK1..3 = OFF
Current consumption for
VCC3 in SBC Sleep Mode in
stand-alone configuration
I
Sleep,VCC3,25
–4060µA
1)5)
SBC Sleep Mode;
VCC3 = ON (no load,
stand-along config.);
CAN,
WK1..3 = OFF
Current consumption for
VCC3 in SBC Sleep Mode in
stand-alone configuration
I
Sleep,VCC3,85
–5070µA
1)3)5)
SBC Sleep Mode;
= 85°C; VCC3 = ON
T
j
(no load, stand-along
config.); CAN, WK1..3
= OFF
Current consumption for
HSx in SBC Stop Mode
I
Stop,HSx,25
–550675µA
5)8)
SBC Stop Mode;
Cyclic Sense & HSx=
ON (no load);
CAN,
WK1..3 = OFF
= 85°C;
j
Number
P_4.4.14
P_4.4.17
P_4.4.18
P_4.4.32
P_4.4.19
P_4.4.20
P_4.4.21
P_4.4.22
P_4.4.33
Datasheet19Rev. 1.1
2019-09-27
TLE9261-3BQX
General Product Characteristics
Table 4 Current Consumption (cont’d)
Current consumption values are specified at Tj = 25°C, VS = 13.5V, all outputs open (unless otherwise specified)
ParameterSymbolValuesUnitNote or
Test Condition
3)5)8)
SBC Stop Mode;
= 85°C;
T
j
Current consumption for
HSx in SBC Stop Mode
I
Stop,HSx,85
Min.Typ.Max.
–575700µA
Number
P_4.4.34
Cyclic Sense & HSx =
ON (no load);
CAN,
WK1..3 = OFF
Current consumption for
cyclic sense function
Current consumption for
cyclic sense function
I
Stop,CS25
I
Stop,CS85
–2028µA
–2435µA
5)9)10)
SBC Stop Mode;
WD = OFF
3)5)9)10)
SBC Stop Mode;
T
= 85°C;
j
P_4.4.23
P_4.4.27
WD = OFF
Current consumption for
watchdog active in Stop
I
Stop,WD25
–2028µA3)SBC Stop Mode;
Watchdog running
P_4.4.30
Mode
Current consumption for
watchdog active in Stop
Mode
Current consumption for
active fail outputs (FO1..3)
I
Stop,WD85
I
Stop,FOx
–2435µA3)SBC Stop Mode;
= 85°C;
T
j
Watchdog running
–1.02.0mA3)all SBC Modes;
T
= 25°C; FOx = ON (no
j
P_4.4.31
P_4.4.24
load);
1) If the load current on VCC1 will exceed the configured VCC1 active peak threshold I
the current consumption will increase by typ. 2.9mA to ensure optimum dynamic load behavior. Same applies to
VCC2. For VCC3 the current consumption will increase by typ. 1.4mA. See also Chapter 6, Chapter 7, Chapter 8.
2) CAN not configured in selective wake mode.
3) Not subject to production test, specified by design.
4) Current consumption adder also applies for during WUF detection (frame detect mode) when CAN Partial Networking
is activated.
5) Current consumption adders of features defined for SBC Sleep Mode also apply for SBC Stop Mode and vice versa
(unless otherwise specified).
6) No pull-up or pull-down configuration selected.
7) The specified WKx current consumption adder for wake capability applies regardless how many WK inputs are
activated.
8) A typ. 75µA / max 125µA (T
In SBC Normal Mode every HSx switch consumes the typ. 75µA / max 125µA (T
because the biasing is already enabled.
9) HS1 used for cyclic sense, Timer 2, 20ms period, 0.1ms on-time, no load on HS1.
= 85°C) adder applies for every additionally activated HSx switch in SBC Stop Mode;
j
VCC1,Ipeak1,r
= 85°C) without the initial adder
j
or I
VCC1,Ipeak2,r
,
In general the current consumption adder for cyclic sense in SBC Stop Mode can be calculated with below equation:
IStop,CS = 18µA + (550µA *tON/TPer)
10) Also applies to Cyclic Wake
Note:There is no additional current consumption contribution due to PWM generators.
Datasheet20Rev. 1.1
2019-09-27
TLE9261-3BQX
System Features
5System Features
This chapter describes the system features and behavior of the TLE9261-3BQX:
•State machine
•SBC mode control
•Device configuration
•State of supply and peripherals
•System functions such as cyclic sense or cyclic wake
•Supervision and diagnosis functions
The System Basis Chip (SBC) offers six operating modes:
•SBC Init Mode: Power-up of the device and after a soft reset,
•SBC Normal Mode: The main operating mode of the device,
•SBC Stop Mode: The first-level power saving mode with the main voltage regulator VCC1 enabled,
•SBC Sleep Mode: The second-level power saving mode with VCC1 disabled,
•SBC Restart Mode: An intermediate mode after a wake event from SBC Sleep or Fail-Safe Mode or after a
failure (e.g. WD failure, VCC1 undervoltage reset) to bring the microcontroller into a defined state via a reset.
Once the failure condition is not present anymore the device will automatically change to SBC Normal Mode
after a delay time (
•SBC Fail-Safe Mode: A safe-state mode after critical failures (e.g. WD failure, VCC1 undervoltage reset) to
bring the system into a safe state and to ensure a proper restart of the system. VCC1 is disabled. It is a
permanent state until either a wake event (via CAN or WKx) occurs or the overtemperature condition is not
present anymore.
t
RD1
).
A special mode, called SBC Development Mode, is available during software development or debugging of the
system. All above mentioned operating modes can be accessed in this mode. However, the watchdog counter
is stopped and does not need to be triggered. This mode can be accessed by setting the TEST pin to GND
during SBC Init Mode.
The device can be configured via hardware (external component) to determine the device behavior after a
watchdog trigger failure. See Chapter 5.1.1 for further information.
The System Basis Chip is controlled via a 16-bit SPI interface. A detailed description can be found in
Chapter 15.The configuration as well as the diagnosis is handled via the SPI. The SPI mapping of the TLE9261-
3BQX is compatible to other devices of the TLE926x and TLE927x families.
Datasheet21Rev. 1.1
2019-09-27
SBC Init M ode *
(Long open window )
VCC1ONVCC2
OFF
VCC3
OFF
FOx
inact.
CAN
(3)
OFF
Wake up event
SPI cmdSPI cmd
SPI cmd
Any SPI
command
WD trigger
First battery connection
VCC1
Unde rvoltag e
Automatic
1s t Wa tch dog Fai lure Co nfig 2,
2nd Watchdog Failure, Config 4
VCC1 Short to GND
SBC Soft Reset
Reset is released
WD starts with long open window
(1)
Afte r Fail-Saf e Mode entr y, the devi ce will sta y for at least
typ. 1 s in this m ode (with RO low) af ter a TSD2 ev ent and
min. ty p. 100ms a fter other Fail-Safe E vents. Only then the d evice
can l eave the mod e via a wak e-up event . Wake eve nts are sto red
during thi s time.
(2)
acco rding to VC C3 configura tion.
(3)
For SBC Develop ment Mode CAN/VCC2 are ON in SBC Init
Mode and st ay ON when g oing from there to SBC N ormal Mode.
(4)
See chapt er CAN for detailed beha vior in SBC Restart Mode.
(5)
CAN t ransceiver c an be S WK capable, depending o n
confi guration.
(6)
See C hapter 5.1. 5 and 13.1 for detail ed FOx behav ior.
(7)
Must be set to CA N wake cap able / CAN OFF mode bef ore
enteri ng SBC Sleep Mode.
WD
Confi g.
HSx
OFF
SBC Normal Mode
VCC1ONVCC2
config.
VCC3
config.
FOx
act/inact
CAN
(3)
config.
WD
config.
HSx
config.
SBC Sleep Mode
VCC1
OFF
VCC2
fixed
FOx
fixed
CAN
(5)(7)
Wake
capable /off
WD
OFF.
HSx
fixed
SBC Stop Mode
VCC1ONVCC2
fixed
VCC3
fixed
FOx
fixed
CAN
(5)
fixed
WD
fixed
HSx
fixed
SBC Re start Mode
(RO pin is asserted)
VCC1
ON/
ramping
VCC2
OFF
FOx
(6)
active /
fixed
CAN
(4)
woken /
OFF
WD
OFF
HSx
OFF
SBC Fail-Safe Mod e
(1)
VCC1
OFF
VCC2
OFF
VCC3
OFF
FOx
(6)
active
CAN
Wake
capable
WD
OFF
HSx
OFF
Config.: settings can be
changed in this SBC mode;
Fixed: settings stay as
defined in SBC Normal Mode
TSD2 event,
VCC3
(2)
fixed/
ramping
VCC3
(2)
Fixed /
OFF
* The SBC Development
Mode is a super set of state
machine where the WD timer
is stopped and CAN behavior
differs in SBC Init Mode.
Otherwise, there are no
differences in behavior.
Cyc. Wake
OFF
Cyc. Sense
OFF
Cyc. Wake
config.
Cyc. Sense
config.
Cyc. Wake
fixed
Cyc. Sense
fixed
Cyc. Wake
OFF
Cyc. Sense
fixed
Cyc. Wake
OFF
Cyc. Sense
OFF
Cyc. Wake
OFF
Cyc. Sense
OFF
CAN, WKx wa ke-up event
OR
Relea se of o ver tem perat ure
TSD2 after t
TSD2
VCC1 over voltage
Config 2/4 (if VCC_OV_RST set)
VCC1 over voltage
Config 1/3 (if VCC_OV_RST set)
Watchdog Failure:
Config 1/3 & 1st WD failure
in Config4
After 4x consecutive VCC1
under voltage eve nts
(if VS > VS_UV)
TLE9261-3BQX
System Features
5.1Block Description of State Machine
The different SBC Modes are selected via SPI by setting the respective SBC MODE bits in the register
M_S_CTRL. The SBC MODE bits are cleared when going through SBC Restart Mode and thus always show the
current SBC mode.
Figure 3 State Diagram showing the SBC Operating Modes including CAN Partial Networking
Datasheet22Rev. 1.1
2019-09-27
TLE9261-3BQX
System Features
5.1.1Device Configuration and SBC Init Mode
The SBC starts up in SBC Init Mode after crossing the power-on reset V
and the watchdog will start with a long open window (t
During this power-on phase following configurations are stored in the device:
•The device behavior regarding a watchdog trigger failure and a VCC1 overvoltage condition is determined by
the external circuitry on the INT pin (see below)
•The selection of the normal device operation or the SBC Development Mode (watchdog disabled for debugging
purposes) will be set depending on the voltage level of the FO3/TEST pin (see also
LW
).
threshold (see also Chapter 14.3)
POR,r
Chapter 5.1.7).
5.1.1.1Device Configuration
The configuration selection is intended to select the SBC behavior regarding a watchdog trigger failure.
Depending on the requirements of the application, the VCC1 output shall be switched OFF and the device shall
go to SBC Fail-Safe Mode in case of a watchdog failure (1 or 2 fails). To set this configuration (Config 2/4), the
INT pin does not need an external pull-up resistor. In case VCC1 should not be switched OFF (Config 1/3), the
INT pin needs to have an external pull-up resistor connected to VCC1 (see application diagram in
Chapter 16.1).
Figure 5 shows the timing diagram of the hardware configuration selection. The hardware configuration is
defined during SBC Init Mode. The INT pin is internally pulled LOW with a weak pull-down resistor during the
reset delay time t
pin is monitored during this time (with a continuos filter time of t
the voltage level at INT) is stored at the rising edge of RO.
, i.e.after VCC1 crosses the reset threshold VRT1 and before the RO pin goes HIGH. The INT
RD1
) and the configuration (depending on
CFG_F
Note:If the POR bit is not cleared then the internal pull-down resistor will be reactivated every time RO is
pulled LOW the configuration will be updated at the rising edge of RO. Therefore it is recommended
to clear the POR bit right after initialization. In case there is no stable signal at INT, then the default
value ‘0’ will taken as the config select value = SBC Fail-Safe Mode.
There are four different device configurations (Table 5) available defining the watchdog failure and the VCC1
overvoltage behavior. The configurations can be selected via the external connection on the INT pin and the
SPI bit CFG in the HW_CTRL register (see also Chapter 15.4):
•CFGP = ‘1’: Config 1 and Config 3:
–A watchdog trigger failure leads to SBC Restart Mode and depending on CFG the Fail Outputs (FOx) are
activated after the 1st (Config 1) or 2nd (Config 3) watchdog trigger failure;
–A VCC1 overvoltage detection will lead to SBC Restart Mode if VCC1_OV_RST is set.
VCC1_ OV will be set and the Fail Outputs are activated;
•CFGP = ‘0’: Config 2 and Config 4:
–A watchdog trigger failure leads to SBC Fail-Safe Mode and depending on CFG the Fail Outputs (FOx)
are activated after the 1st (Config 2) or 2nd (Config 4) watchdog trigger failure. The first watchdog
trigger failure in Config 4 will lead to SBC Restart Mode;
–A VCC1 overvoltage detection will lead to SBC Fail-Safe Mode if VCC1_OV_RST is set.
VCC1_ OV will be set and the Fail Outputs are activated;
The respective device configuration can be identified by reading the SPI bit CFG in the HW_CTRL register and
the CFGP bit in the WK_LVL_STAT register.
Table 5 shows the configurations and the device behavior in case of a watchdog trigger failure:
Table 5 Watchdog Trigger Failure Configuration
Config INT Pin (CFGP)SPI Bit CFGEventFOx ActivationSBC Mode Entry
Table 6 shows the configurations and the device behavior in case of a VCC1 overvoltage detection when
VCC1_OV_RST is set:
Table 6 Device Behavior in Case of VCC1 Overvoltage Detection
Config INT Pin (CFGP) CFG Bit VCC1_O
V_RST
1-4any valuex01 x VCC1 OV 1no FOx activationunchanged
1External pull-
up
2No ext. pull-up1 1 1 x VCC1 OV 1after 1st VCC1 OVSBC Fail-Safe Mode
3External pull-
up
4No ext. pull-up0 1 1 x VCC1 OV 1after 1st VCC1 OVSBC Fail-Safe Mode
The respective configuration will be stored for all conditions and can only be changed by powering down the
device (VS < V
POR,f
).
111 x VCC1 OV 1after 1st VCC1 OVSBC Restart Mode
011 x VCC1 OV 1after 1st VCC1 OVSBC Restart Mode
EventVCC1_
OV
FOx ActivationSBC Mode Entry
Datasheet25Rev. 1.1
2019-09-27
TLE9261-3BQX
System Features
5.1.1.2SBC Init Mode
In SBC Init Mode, the device waits for the microcontroller to finish its startup and initialization sequence. In
the SBC Init Mode any valid SPI command will bring the SBC to SBC Normal Mode. During the long open
window the watchdog has to be triggered. Thereby the watchdog will be automatically configured.
A missing watchdog trigger during the long open window will cause a watchdog failure and the device will
enter SBC Restart Mode.
Wake events are ignored during SBC Init Mode and will therefore be lost.
Note: Any SPI command will bring the SBC to SBC Normal Mode even if it is a illegal SPI command (see
Chapter 15.2).
Note:For a safe start-up, it is recommended to use the first SPI command to trigger and to configure the
watchdog (see Chapter 14.2).
Note:At power up no VCC1_UV will be issued nor will FOx be triggered as long as VCC1 is below the V
threshold and if VS is below the VCC1 short circuit detection threshold V
low as long as VCC1 is below the selected V
threshold.
RT,x
. The RO pin will be kept
S,UV
RT,x
Datasheet26Rev. 1.1
2019-09-27
TLE9261-3BQX
System Features
5.1.2SBC Normal Mode
The SBC Normal Mode is the standard operating mode for the SBC. All configurations have to be done in SBC
Normal Mode before entering a low-power mode (see also Chapter 5.1.6 for the device configuration defining
the Fail-Safe Mode behavior). A wake-up event on CAN and WKx will create an interrupt on pin INT - however,
no change of the SBC mode will occur. The configuration options are listed below:
•VCC1 is active
•VCC2 can be switched ON or OFF (default = OFF)
•VCC3 is configurable (OFF coming from SBC Init Mode; as previously programmed coming from SBC Restart
Mode)
•CAN is configurable (OFF coming from SBC Init Mode; OFF or wake capable coming from SBC Restart Mode,
see also Chapter 5.1.5)
•HS Outputs can be switched ON or OFF (default = OFF) or can be controlled by PWM; HS Outputs are OFF
coming from SBC Restart Mode
•Wake pins show the input level and can be selected to be wake capable (interrupt)
•Cyclic sense can be configured with HS1...4 and Timer1 or Timer 2
•Cyclic wake can be configured with Timer1 or Timer2
•Watchdog is configurable
•All FOx outputs are OFF by default. Coming from SBC Restart Mode FOx can be active (due to a failure event,
e.g. watchdog trigger failure, VCC1 short circuit, etc.) or inactive (no failure occurred)
In SBC Normal Mode, there is the possibility of testing the FO outputs, i.e. to verify if setting the FO pin to low
will create the intended behavior within the system. The FO output can be enabled and then disabled again
by the microcontroller by setting the FO_ON SPI bit. This feature is only intended for testing purposes.
Datasheet27Rev. 1.1
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TLE9261-3BQX
System Features
5.1.3SBC Stop Mode
The SBC Stop Mode is the first level technique to reduce the overall current consumption by setting the
voltage regulators VCC1, VCC2 and VCC3 into a low-power mode. In this mode VCC1 is still active and supplying
the microcontroller, which can enter a power down mode. The VCC2 supply, CAN mode as well as the HSx
outputs can be configured to stay enable d. All kind o f se ttings hav e to be d one before en tering SBC Sto p Mo de.
In SBC Stop Mode any kind of SPI WRITE commands are ignored and the SPI_FAIL bit is set, except for
changing to SBC Normal Mode, triggering a SBC Soft Reset, refreshing the watchdog as well as for reading and
clearing the SPI status registers. A wake-up event on CAN and WKx will create an interrupt on pin INT however, no change of the SBC mode will occur. The configuration options are listed below:
•VCC1 is ON
•VCC2 is fixed as configured in SBC Normal Mode
•VCC3 is fixed as configured in SBC Normal Mode
•CAN mode is fixed as configured in SBC Normal Mode
•WK pins are fixed as configured in SBC Normal Mode
•HS Outputs are fixed as configured in SBC Normal Mode
•Cyclic sense is fixed as configured in SBC Normal Mode
•Cyclic wake is fixed as configured in SBC Normal Mode
•Watchdog is fixed as configured in SBC Normal Mode
•SBC Soft Reset can be triggered
•FOx outputs are fixed, i.e. the state from SBC Normal Mode is maintained
An interrupt is triggered on the pin INT when SBC Stop Mode is entered and not all wake source signalization
flags from WK_STAT_1 and WK_STAT_2 were cleared.
Note:If switches are enabled during SBC Stop Mode, e.g. HSx on with or without PWM, then the SBC current
consumption will increase (see Chapter 4.4).
Note:It is not possible to switch directly from SBC Stop Mode to SBC Sleep Mode. Doing so will also set the
SPI_FAIL flag and will bring the SBC into Restart Mode.
Note:When WK1 and WK2 are configured for the alternate measurement function (WK_MEAS = 1) then the
wake inputs cannot be selected as wake input sources.
Datasheet28Rev. 1.1
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TLE9261-3BQX
System Features
5.1.4SBC Sleep Mode
The SBC Sleep Mode is the second level technique to reduce the overall current consumption to a minimum
needed to react on wake-up events or for the SBC to perform autonomous actions (e.g. cyclic sense). In this
mode, VCC1 is OFF and not supplying the microcontroller anymore.The VCC2 supply as well as the HSx outputs
can be configured to stay enabled. The settings have to be done before entering SBC Sleep Mode. A wake-up
event on CAN or WKx will bring the device via SBC Restart Mode into SBC Normal Mode again and signal the
wake source. The configuration options are listed below:
•VCC1 is OFF
•VCC2 is fixed as configured in SBC Normal Mode
•VCC3 is fixed or OFF as configured in SBC Normal Mode
•CAN mod e changes automati cally from ON or Receive Only Mode t o wake capab le mode or can be selected
to be OFF
•CAN must be set to CAN wake capable / CAN off mode before entering SBC Sleep Mode
•WK pins are fixed as configured in SBC Normal Mode
•HS Outputs are fixed as configured in SBC Normal Mode
•Cyclic sense is fixed as configured in SBC Normal Mode
•Cyclic wake is not available
•Watchdog is OFF
•FOx outputs are fixed, i.e. the state from SBC Normal Mode is maintained
•As VCC1 is OFF during SBC Sleep Mode, no SPI communication is possible;
•The Sleep Mode entry is signalled in the SPI register DEV_STAT with the bit DEV_STAT
It is not possible to switch all wake sources off in SBC Sleep Mode. Doing so will set the SPI_FAIL flag and will
bring the SBC into SBC Restart Mode.
In order to enter SBC Sleep Mode successfully, all wake source signalization flags from WK_STAT_1 and
WK_STAT_2 need to be cleared. A failure to do so will result in an immediate wake-up from SBC Sleep Mode
by going via SBC Restart to Normal Mode.
All settings must be done before entering SBC Sleep Mode.
Note:If switches are enabled during SBC Sleep mode, e.g. HSx on with or without PWM, then the SBC
current consumption will increase (see Chapter 4.4).
Note:Cyclic Sense function will not work properly anymore in case of an overcurrent, overtemperature,
under- or overvoltage (in case function is selected) event because the respective HS switch will be
disabled.
Note:When WK1 and WK2 are configured for the alternate measurement function (WK_MEAS = 1) then the
wake inputs cannot be selected as wake input sources.
Datasheet29Rev. 1.1
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TLE9261-3BQX
System Features
5.1.5SBC Restart Mode
There are multiple reasons to enter the SBC Restart Mode. The purpose of the SBC Restart Mode is to reset the
microcontroller:
•in case of undervoltage on VCC1 in SBC Normal and in SBC Stop Mode,
•in case of overvoltage on VCC1 if the bit
•due to 1st incorrect Watchdog triggering (only if Config1, Config3 or Config 4 is selected, otherwise SBC FailSafe Mode is immediately entered),
•In case of a wake event from SBC Sleep or SBC Fail-Safe Mode or a release of overtemperature shutdown
(TSD2) out of SBC Fail-Safe Mode this transition is used to ramp up VCC1 after a wake in a defined way.
From SBC Restart Mode, the SBC goes automatically to SBC Normal Mode, i.e the mode is left automatically
by the SBC without any microcontroller influence. The SBC MODE bits are cleared. As shown in Figure 46 the
Reset Output (RO) is pulled low when entering Restart Mode and is released at the transition to Normal Mode
after the reset delay time (t
moment of the rising edge of RO and the watchdog period setting in the register WD_CTRL will be changed to
the respective default value ‘100’.
). The watchdog timer will start with a long open window starting from the
RD1
VCC1_OV_RST is set and if CFGP = ‘1’,
Leaving the SBC Restart Mode will not result in changing / deactivating the Fail outputs.
The behavior of the blocks is listed below:
•All FOx outputs are activated in case of a 1st watchdog trigger failure (if Config1 or Config2 is selected) or
in case of VCC1 overvoltage detection (if
•VCC1 is ON or ramping up
•VCC2 will be disabled if it was activated before
•VCC3 is fixed or ramping as configured in SBC Normal Mode
•CAN is “woken” due to a wake event or OFF depending on previous SBC and transceiver mode (see also
Chapter 10). It is wake capable when it was in CAN Normal-, Receive Only or wake capable mode before
SBC Restart Mode
•HS Outputs will be disabled if they were activated before
•RO is pulled low during SBC Restart Mode
•SPI communication is ignored by the SBC, i.e. it is not interpreted
•The Restart Mode entry is signalled in the SPI register DEV_STAT with the bits DEV_STAT
Table 7 Reasons for Restart - State of SPI Status Bits after Return to Normal Mode