INFINEON TLE 6255 G DATA SHEET

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Single Wire CAN-Transceiver

Final Data Sheet

1Features

• Single wire transceiver for up to 33 kBit/s bus speed

• Compatibel to GM LAN Standard GMW 3089 - V1.26

• Excellent EMC performance

• High speed mode for up to 100 kBit/s bus speed

• Ambient operation range

• Supply voltage operation range 5.5 V to 28 V

•Typ. 30 µA total current consumption in sleep mode

• 4 kV ESD protection

• Short circuit and overtemperature protected

• Input bilevel feature for wake-up detection

• Output bilevel feature for wake up call

• Loss of Ground protection

• Bus dominant timeout feature

• Programmable slewrate

– 40 °C to 125 °C

TLE 6255 G

P-DSO-14-8; -9

Type Ordering Code Package

TLE 6255 G Q67006-A9352 P-DSO-14-9 (SMD)

2 Description

The TLE 6255 G is a special featured low speed transceiver for use in single wire
applications.
The device is primarily designed for use in single wire CAN systems operating with
various CSMA/CR (carrier sense multiple access/collision resolution) protocols such as
the BOSCH Controller Area Network (CAN).

The normal communication bitrate in CAN-systems is up to 33 kBit/s. For software or
diagnostic data download a high speed mode is offered that allows transmission rates
up to 100 kBit/s.
With many integrated features such as slewrate controlled output, loss of ground circuit,
bi-level wake-up and sleep mode for low power consumption the TLE 6255 G is
optimized for use in automotive applications.
The device is based on Smart Power Technology SPT
control circuitry to be integrated with DMOS power devices on the same monolithic

®

which allows bipolar and CMOS

circuitry.
Additional features like short circuit and overtemperature protection, over- and
undervoltage lockout are integrated. To enhance the reliability and robustness of the
TLE 6255 G the enhanced power SO-14 package is used in order to provide high
thermal capacity and low thermal resistance.

Data Sheet Rev. 2.5 1 2003-11-27

3 Pin Configuration

(top view)

TLE 6255 G

GND

TxD

M0

M1

RxD

V

CC

GND

1

2

3

4

5

6

7

Leadframe

Chip

AEP02568

14

13

12

11

10

9

8

GND

N.C.

CANH

LOAD

V

batt

RSL

GND

Figure 1 Pin Configuration

RxD = H indicates a bus recessive state, RxD = L a bus normal or high voltage dominant
state.

Data Sheet Rev. 2.5 2 2003-11-27

TLE 6255 G

4 Pin Definitions and Functions

Pin No. Symbol Function

1, 7, 8, 14 GND Ground; internally connected to leadframe

2TxDTransceive-Input; low active, logic command to transmit

on the single wire CAN bus; inverting: TxD = low causes

CANH = dominant (high level); internal 10 kΩ pull up

3M0Mode-Input 0; to program the device operating mode;

internal pull down

4M1Mode-Input 1; to program the device operating mode;

internal pull down

5RxDReceive-Output; open drain, logic data as sensed on the

single wire CAN bus; inverting (RxD = L when CANH is
dominant)

6

9RSLSlewrate-Program-Input; an external resistor to

V

CC

Supply Voltage; input for 5 V logic supply voltage

V

CC

on

this pin is required to program the bus output slewrate

10

V

batt

Battery Supply Voltage; external blocking capacitor
necessary (see application circuit)

11 LOAD Unit-Load Resistor Input; internal termination to GND

12 CANH CAN Bus Input/Output; single wire bus input and output;

short circuit protected

13 N.C. not connected

Data Sheet Rev. 2.5 3 2003-11-27

5 Block Diagram

TLE 6255 G

CANH

LOAD

12

11

4 kV
ESD

4 kV
ESD

V

Batt

10

Protection

and

Startup-

Control

Driver

Feedback-

Loop

Load
Driver

V

CC

6

Biasing

OVLO
UVLO

Wave-

Shape-

Circuit

Input
Filter

Loss of
Ground

Control

Converter

Time Out

Circuit

Mode-Logic

M1 M0 Mode

L L Sleep

HL High-Speed
LH Wake-up Call
HH Normal

Receive

Comp

TLE 6255G

Voltage
Current

BUF

9

2

3

4

5

RSL

TxD

M0

M1

RxD

1, 7, 8, 14

GND

13

N.C.

AEB02565

Figure 2 Block Diagram

Data Sheet Rev. 2.5 4 2003-11-27

TLE 6255 G

6 Functional Description and Application Hints

6.1 Mode Control

By use of the two mode control pins M0 and M1 the transceiver can be set in the
following modes.

Table 1 Transceiver Modes

#M0M1Mode

1 Low Low Sleep mode

2 High Low High speed mode

3 Low High Wake-up call

4 High High Normal mode

Sleep-Mode

In the sleep mode the total current consumption of the TLE 6255 G is reduced to typically

30 µA. Nodes not set to sleep mode can communicate without disturbing ECUs that are

already set to sleep mode. To achieve a wake-up via the CAN bus a high voltage level
message (wake-up call) is necessary. Only high voltage level messages are reported to
the RxD pin in sleep mode. A wake-up from sleep mode of the transceiver itself has to
be done by setting the control inputs M0 and M1. If there is no modification on the mode
inputs the device remains in sleep mode after the wake-up signal is removed from the
bus.
The transceiver’s loss of ground protection circuit connection to ground is not interrupted
when in the sleep mode.

High-Speed-Mode

The high-speed mode can be used for software or diagnostic data download with bitrates
up to 100 kBit/s. Therefore the slewrate control feature is deactivated to achieve the

required timings. Further an additional external resistor of 100 Ω from CANH to GND is

necessary in this mode.

Wakeup-Call Mode

In this mode the TLE 6255 G sends the message to be transmitted as a high voltage
wake-up message.
The bus includes a special node wake up capability which allows normal communication
to take place among some nodes while leaving the other nodes in an undisturbed sleep
state. This is accomplished by controlling the level of the signal voltages such that all
nodes must wake up when they receive a higher voltage message signal waveform.
Communication at the lower, normal voltage levels shall not disturb the sleeping nodes
(

V

>9V).

batt

Data Sheet Rev. 2.5 5 2003-11-27

TLE 6255 G

Normal Mode

In the normal mode the TLE 6255 G sends a normal voltage message waveform on the
bus. It is possible to run the transceiver up to transmission rates of 33 kBits/s in this
mode.
The waveform as well as the slew rate of the rising edge (recessive to dominant
transition) are controlled by the internal active wave shaping circuit to minimize EME
(electromagnetic emission). For the same reason waveform trailing edge control is
required to assure that high frequency content is minimized at the beginning of the
downward voltage slope (dominant to recessive transition). The remaining fall time
occurs after the bus is inactive with drivers off and is determined by the RC time constant
of the total bus load.

6.2 Slew-Rate Control

The CANH output voltage and current is controlled by an internal waveshaping circuit.
For optimized adjusting of the slew rate to the system timing, the slew rate is
programmable by an external resistor connected from pin RSL to

R

the correlation of the slew rate to the resistor

RSL

.

V

. Figure 4 shows

CC

6.3 Transmitter

The TLE 6255 G contains a high current fully short circuit and overtemperature protected
highside-driver (pin CANH). To minimize spectral content the CANH-output waveform is
controlled.
Logic low (TxD = L) on pin TxD will command the output stage to switch to dominant high
potential; TxD = H to recessive low on the bus.
To avoid the bus to be blocked by a permanent dominant TxD input signal, the
TLE 6255 G incorporates a timeout feature. In case of TxD = L for longer than the
internal fixed timeout the CANH output is switched off automatically. The timeout is
resetted by a H-signal at TxD without a delay.
The loss of an ECU ground may cause the ECU to source current through the various
ECU circuits to the communications bus instead of to the vehicle system ground.
Therefore the unit-load resistor of any ECU is connected to the LOAD-pin. The
TLE 6255 G incorporates a reverse protected switch from LOAD to ground potential.
This switch is automatically switched off in a loss of ground state.

6.4 Receiver

In normal, high speed and wakeup-mode all data on the bus is sensed by the receive
comparator and transmitted to the RxD output. In sleep mode no normal level data is
detected. The receiver threshold is set to the wake-up level. So a wake-up interrupt is
sent only in case of a wake-up call on the bus. An internal fixed filter improves the EMC
susceptibility.

Data Sheet Rev. 2.5 6 2003-11-27

TLE 6255 G

6.5 Unit Load Resistor

The TLE 6255 covers the specification GMW 3089 V1.26 or the so called first generation
of SW CAN. GM decided to design a second generation of SW CAN, which is defined in
the specification GMW 3089 V2.0. This led to some differences in the electrical
characteristics(GND shift, time constants, etc.) and also in the pinout (pin 9 is used to
control a voltage regulator).

It must be pointed out, that GMW 3089 V1.26 defines a unit load resistance of:

R

= 8,999 to 9,126 kOhm

UL

With this R
of this range are not a subject to GMW 3089 V1.26!

The loss of ground circuit is not specified to function when the load resistor is out of the

8.999-9.126 kohm range!

, the TLE 6255 complies to the GMW 3089 V1.26 specification. Values out

UL

Data Sheet Rev. 2.5 7 2003-11-27

TLE 6255 G

7 Absolute Maximum Ratings

Parameter Symbol Limit Values Unit Remarks

min. max.

Voltages

Supply voltage

CAN bus input/output voltage

Load voltage

Logic supply voltage

Logic voltages
(

V

RxD

; V

; VM0; VM1; V

TxD

RSL

)

V

V

V

V

V

batt

CANH

LOAD

CC

logic

– 0.3 40 V –

– 28 28 V –

– 28 28 V –

– 0.3 7 V –

– 0.3 7 V –

Currents

CAN Bus current

Load current

I

CANH

I

LOAD

– – mA internally limited

– – mA internally limited

ESD-Protection (Human Body Model; According to MIL STD 833 D)

Pin CANH, V

Other pins

batt

V

V

ESD

ESD

– 4000 4000 V –

– 2000 2000 V –

Temperatures

Junction temperature T

Junction temperature

Junction temperature

Storage temperature

j

T

j

T

j

T

stg

– 40 150 °C–
–175°C t < 1000 h
–200°C t <10h
– 50 150 °C–

Thermal Resistances

Junction to pin R

Junction ambient

R

thj-pin

thj-a

– 40 K/W junction to pin 1

–65K/W–

Note: Maximum ratings are absolute ratings; exceeding any one of these values may

cause irreversible damage to the integrated circuit.

Data Sheet Rev. 2.5 8 2003-11-27

8 Operating Range

Parameter Symbol Limit Values Unit Remarks

min. max.

TLE 6255 G

Supply voltage

V

Supply voltage increasing V

Supply voltage decreasing

Logic supply voltage

Logic supply voltage;

V

V

V

increasing

Logic supply voltage;

V

decreasing

Junction temperature

RSL resistance

T

R

Thermal Shutdown

Thermal shutdown junction

T

temperature

batt

batt

batt

CC

CC

CC

j

RSL

jSD

V

UVOFF

– 0.3 V

– 0.3 V

V

POROF

– 0.3 V

– 0.3 V

28 V After V

V

UV ON

UV ON

UV OFF

V Outputs in tristate

V Outputs in tristate

5.5 V After V

V

PORON

PORON

POROF

V Outputs in tristate

V Outputs in tristate

– 40 150 °C–
35 200 kΩ –

150 200 °C–

rising above

batt

rising above

CC

Thermal switch-on junction
temperature

T

jSO

120 170 °C temperature hysteresis

∆T = 30° K (typ.)

Data Sheet Rev. 2.5 9 2003-11-27

9 Electrical Characteristics

TLE 6255 G

5.5 V <

R

UL

V

< 16 V; 4.75 V < V

batt

< 5.25 V; – 40 °C<Tj<150 °C; M0 = M1 = H;

CC

= 9.1 kΩ (connected between CANH and LOAD); R

=39kΩ; all voltages with

RSL

respect to ground; positive current defined flowing into pin; unless otherwise specified

Parameter Sym-

bol

Limit Values Unit Test Condition

min. typ. max.

Current Consumption

Supply current at

batt

I

batt

–2040µAM0=M1=L;

V

;

sleep mode

Supply current at

CC

I

CC

–1030µAM0=M1=L;

V

;

sleep mode

Supply current at

Supply current at

Supply current at

Supply current at

Supply current at

V

battIbatt

V

battIbatt

V

battIbatt

V

battIbatt

V

CCICC

–36mATxD=L

–1.53mATxD=H

–59mATxD=L; M0=L

– 4 6 mA TxD=H; M0=L

– 3 5 mA TxD = H or L;

M0 = H or L

Over- and Under Voltage Lockout

UV Switch ON voltage

UV Switch OFF voltage

UV ON/OFF

V

UVON

V

UVOFF

V

UVHY

–5.25.6VV

4.00 4.6 5.1 V V

–0.6–VV

Hysteresis

OV Switch OFF

V

OVOFF

30 33 38 V V

voltage

OV Switch ON voltage

OV ON/OFF

V

OVON

V

OVHY

28 32 36 V V

0.2 2 – V V

Hysteresis

increasing;

batt

V

= 5 V

CC

decreasing;

batt

V

=5 V

CC

– V

UVON

increasing

batt

decreasing

batt

OVOFF

– V

UVOFF

OVON

Data Sheet Rev. 2.5 10 2003-11-27

TLE 6255 G

V

5.5 V <

R

= 9.1 kΩ (connected between CANH and LOAD); R

UL

< 16 V; 4.75 V < V

batt

respect to ground; positive current defined flowing into pin; unless otherwise specified

< 5.25 V; – 40 °C<Tj<150 °C; M0 = M1 = H;

CC

=39kΩ; all voltages with

RSL

Parameter Sym-

bol

Power ON/OFF Reset at V

Power ON Reset

V

PORON

CC

voltage

Power OFF Reset

V

POROF

voltage

POR ON/OFF

V

PORHY

Hysteresis

Transceive Input TxD

H-input voltage

V

TxDH

threshold

L-input voltage

V

TxDL

threshold

Limit Values Unit Test Condition

min. typ. max.

4.00 4.25 4.50 V VCC increasing

3.50 3.75 4.00 V VCC decreasing

0.1 0.5 – V V

–2.60.7×

V

CC

0.3 ×

V

CC

2.4 – V –

V–

PORON

– V

POROF

Hysteresis of input
voltage

Pull up current

Timeout reaction time

Receive Output RxD

Output leakage current I

Output low voltage
level

Falltime

V

TxDHY

I

TxD

t

TOR

RxDLK

V

RxDL

t

FRxD

50 200 500 mV –

–20 –10 –5 µA0 V<V

51030ms–

– 2 0 10 µA V

–0.20.4VI

–80200nsC

=5 V

RxD

=2 mA

RxDL

= 25 pF to GND

RxD

TxD

<4 V

Data Sheet Rev. 2.5 11 2003-11-27

TLE 6255 G

5.5 V <

R

UL

V

< 16 V; 4.75 V < V

batt

< 5.25 V; – 40 °C<Tj<150 °C; M0 = M1 = H;

CC

= 9.1 kΩ (connected between CANH and LOAD); R

=39kΩ; all voltages with

RSL

respect to ground; positive current defined flowing into pin; unless otherwise specified

Parameter Sym-

bol

Limit Values Unit Test Condition

min. typ. max.

Mode Input M0 and M1

H-input voltage
threshold

L-input voltage
threshold

Hysteresis of input

V

M0,1H

V

M0,1L

V

M0,1HY

–2.60.7×

V

CC

0.3 ×

V

CC

2.4 – V –

V–

50 200 500 mV –

voltage

Pull down current

I

M0,1

52050µA1V<V

M0,1

<5V

Mode Change Delaytimes

Normal to high-speed t

Normal to wakeup call

Normal to sleep

Sleep to normal

Slewrate Input RSL

Output voltage

DNH

t

DNW

t

DNS

t

DSN

V

RSL

–530µs M1 H to L;

(not tested, specified by
design)

–530µs M0 H to L

(not tested, specified by
design)

–5500µs M0 and M1 H to L

(not tested, specified by
design)

–550µs M0 and M1 L to H

(not tested, specified by
design)

2.5 3 3.5 V I

=100 µA

RSL

Data Sheet Rev. 2.5 12 2003-11-27

TLE 6255 G

5.5 V <

R

UL

V

< 16 V; 4.75 V < V

batt

< 5.25 V; – 40 °C<Tj<150 °C; M0 = M1 = H;

CC

= 9.1 kΩ (connected between CANH and LOAD); R

=39kΩ; all voltages with

RSL

respect to ground; positive current defined flowing into pin; unless otherwise specified

Parameter Sym-

bol

Limit Values Unit Test Condition

min. typ. max.

CANH as Bus Input / Receiver

Wake up offset
threshold

Wake up fixed
threshold

Wakeup dead time

Wakeup minimal pulse

V

IHWUOVbatt

V

IHWUF

t

DWU

t

WUMIN

–

– V

4.30

6.15 7.1 8.10 V V

batt

3.25

–

V V

batt

see note; see Figure 8

batt

see note; see Figure 8

10 21 50 µs–
1510µs–

= 8 V

= 14 V

time

Receive threshold; in

V

IH

1.8 2 2.2 V 6 V < V

batt

<16V
normal, high-speed
and wake-up mode

Receive hysteresis

Receive propagation
time

Receive propagation
time; high speed

Receive propagation
time

Receive propagation
time; high speed

Receive blanking time
after CANH H to L
transition

V

t

CRF

t

CRF

t

CRR

t

CRR

t

CRB

RHY

50 80 200 mV –

0.05 0.3 1 µs V

>(VIH+ 0.8 V) to

CANH

RxD = L; 6 V <

0.05 0.25 0.5 µs V

>(VIH+ 0.8 V) to

CANH

RxD = L; M1 = L;
6V<

T

0.05 0.3 1 µs V

RxD = H;
6V<

0.05 0.25 0.5 µs V

RxD = H;

V

<16V;

batt

< 125 °C

j

< (VIH– 0.8 V) to

CANH

R

RxD

V

<16V

batt

< (VIH– 0.8 V) to

CANH

R

RxD

M1 = L; 6 V <

T

< 125 °C

j

1.5 3.0 5.0 µs see Figure 7

V

<16 V

batt

=2.4kΩ

=2.4kΩ

V

<16V;

batt

Note: The device will send a wake up call to the microcontroller at the minimum of

V

Data Sheet Rev. 2.5 13 2003-11-27

IHWUO

or V

IHWUF

.

TLE 6255 G

V

5.5 V <

R

= 9.1 kΩ (connected between CANH and LOAD); R

UL

< 16 V; 4.75 V < V

batt

respect to ground; positive current defined flowing into pin; unless otherwise specified

< 5.25 V; – 40 °C<Tj<150 °C; M0 = M1 = H;

CC

=39kΩ; all voltages with

RSL

Parameter Sym-

bol

min. typ. max.

CANH as Bus Output / Transmitter

Offset wakeup output
high voltage

Fixed wakeup output

V

OHWUOVbatt

V

OHWUF

1.5

9.7 – 12 V 220 Ω < RUL<9.1kΩ

high voltage

Bus output high

V

OH

3.60 4.0 4.55 V 100 Ω < RUL<9.1 kΩ

voltage; normal and
high speed

Bus output current limit

Bus output leakage

I

OLI

I

OLK

200 250 350 mA TxD = L; V

– 10 – 200 µATxD=H; Tj< 125 °C;

current

Limit Values Unit Test Condition

–

– V

batt

V220Ω < RUL<9.1kΩ;

TxD = L; M0 = L;

V

6V<

batt

<V

OHWUF

TxD = L; M0 = L
V

OHWUF

< V

batt

TxD = L; 6 V <

CANH

V

–28V<V

batt

V

–1V

batt

<16V

V

batt

=0 V

CANH

<16V

<

Bus output leakage
current (loss of ground)

Slew rate rising edge,
normal mode

Slew rate rising edge,
wake-up mode

Slew rate rising edge;
high speed;

Transmit propagation
time; normal mode

Transmit propagation
time; wake-up mode

I

OLK

S

CANH

S

CANH

S

CANH

t

TCF

t

TCF

– 50 – 200 µA0V<V

V

–28 V<V

batt

V

–1 V

batt

–2.0–V/µs20%<V

–4.0–V/µs20%<V

M0 = L;

51625V/µs20%<V

M1 = L;

< V

batt

CANH

CANH

V

batt

CANH

T

< 125 °C

j

UVOFF

CANH

< 80%

< 80%

=12V

< 80%

256µsTxD=(HtoL) to

V

=(VIH+0.8V)

CANH

1.0 µs < τ < 3.6 µs;

154µsTxD=(HtoL) to

V

M0 = L;

=(VIH+ 0.8 V);

CANH

V

batt

= 12 V;

1.0 µs < τ < 3.6 µs

;

<

Data Sheet Rev. 2.5 14 2003-11-27

TLE 6255 G

5.5 V <

R

UL

V

< 16 V; 4.75 V < V

batt

< 5.25 V; – 40 °C<Tj<150 °C; M0 = M1 = H;

CC

= 9.1 kΩ (connected between CANH and LOAD); R

=39kΩ; all voltages with

RSL

respect to ground; positive current defined flowing into pin; unless otherwise specified

Parameter Sym-

bol

Transmit propagation

t

TCF

time; high speed mode

Limit Values Unit Test Condition

min. typ. max.

–0.51.5µsTxD=(HtoL) to

V

=(VIH+ 0.8 V);

CANH

M1 = L; τ < 1 µs;

T

< 125 °C

j

Transmit propagation
time; normal mode

t

TCR

358µsTxD=(LtoH) to

V

=(VIH–0.8V)

CANH

1.0 µs < τ < 3.6 µs;

Transmit propagation
time; wake-up mode

t

TCR

3–12.7µsTxD=(LtoH) to

V

=(VIH– 0.8 V);

CANH

M0 = L; 1.0 µs < τ < 3.6 µs;

Transmit propagation
time; high speed

t

TCRH

––3.0µsTxD=(LtoH) to

V

=(VIH– 0.8 V);

CANH

M1 = L;

τ < 1.6 µs;

T

< 125 °C

j

Unit-Load Resistor Ground Input LOAD

Output low voltage

V

LOAD

–20100mVI

level

Output leakage current

I

LOADLK

– 50 – 50 µA0V<V

(loss of ground)

=2mA;

LOAD

8V<

T

<

V

batt

bat

< 125 °C; V

j

V

CANH

<16V

< V

< V

batt

UVOFF

–28V

batt

–1V

Data Sheet Rev. 2.5 15 2003-11-27

10 Diagrams

V

TxD

50%

V

CANH

80%

t

TCF

t

TCR

TLE 6255 G

t

V

IH IH

V∆

∆t

20%

t t

tR

t

V

RxD

CRF

50%

Bus Output Slewrate Definition: S

CANH

V∆

=

∆t

with 20% <

V < 80%

CANH

Figure 3 Input/Output-Timing (Pin CANH, TxD and RxD)

tF

t

V

t

CRR

t

AET02566

Data Sheet Rev. 2.5 16 2003-11-27

TLE 6255 G

S

CANH

5.0
V

µs

2.0

1.0

0.5

0.2

0.1

20 50 100 200 500

35

AED02570

kOhm

R

RSL

1000

Figure 4 Slewrate S

V

CANH

V

IHWU

V

IH

V

RxD

vs. Programming Resistor R

CANH

t

p

t

DWU

Figure 5 Wakeup Deadtime

No Wake Up

t < t

DWUp

t

DWU

t

DWU

(Pin RSL)

RSL

t

p

t

WUMIN

Controller

Wake Up

tpt

<

DWU

t

t

AET02571

Data Sheet Rev. 2.5 17 2003-11-27

V

TxD

V

IH

V

CANH

V

IH

Time Out
Counter

Active

TLE 6255 G

t

Parasitic dominant "L" on TxD

t

H

L

t

TOR

t

Time Out

Passive

Status

Normal Operation Normal OperationBus Blocked Bus Available

Figure 6 Bus Dominant Blanking Time t

t

AET02572

TOR

Data Sheet Rev. 2.5 18 2003-11-27

V

TLE 6255 G

TxD

t

V

CANH

V

V

IH

RxD

Bus Ringing Bus Ringing

Without Blanking Feature With Blanking Feature

Figure 7 RxD Blanking Time t

CRB

t

CRB

t

t

AET02573

Data Sheet Rev. 2.5 19 2003-11-27

TLE 6255 G

V

IHWU

8

AED02781

V

7

T = 150 ˚C

6

5

j

= 25 ˚CT

j

= -40 ˚C

T

j

4

3

2

1

0

V

0

2 4 6 8 10 12 14 16 18 20 22 26

24

V

S

Figure 8 Wake-up Threshold V

vs. Supply Voltage V

IHWU

S

Data Sheet Rev. 2.5 20 2003-11-27

11 Application Circuit

ECU

R

WADJ

91 kΩ

C

47 nF

D

R

1N4001

L

UL

47

µ

C

UL

220 pF

Watchdog

Adjust

Reset-Threshold

Adjust (optional)

0

Reset Delay

V

Ι

C

S1

220 nF

C

S2

100 nF

CANH

H

R

UL

9.1 k

Ω

Load

2

7

TLE 4278G

6

13

3-5, 10-12

C

S3

µ

4.7 F
10

12

TLE 6255G

11

1, 7, 8, 14

V

Batt

GND

V

6

GND

Watchdog Input

8

Watchdog Output

1

Reset Output

14

V

Q

9

CC

RSL

9

M0

3

M1

4

RxD

5

TxD

2

C

22µF

R

RSL

CC1

C

RxD

CC2

39 k Ω 2.4 kRΩ

V

TxD

10 kRΩ

TLE 6255 G

CC

Controller

GND

Battery

V

Single Wire CAN Bus

AES02574

Figure 9 Application Circuit

Data Sheet Rev. 2.5 21 2003-11-27

12 Package Outlines

P-DSO-14-9

(Plastic Dual Small Outline)

TLE 6255 G

Sorts of Packing

Package outlines for tubes, trays etc. are contained in our
Data Book “Package Information”.

SMD = Surface Mounted Device

GPS09222

Dimensions in mm

Data Sheet Rev. 2.5 22 2003-11-27

Edition 2003-11-27

Published by Infineon
Technologies AG,
St.-Martin-Strasse 53,
D-81541 München

© Infineon Technologies AG 2003.

All Rights Reserved.

Attention please!

The information herein is given to de­scribe certain components and shall
not be considered as warranted char­acteristics.

Terms of delivery and rights to techni­cal change reserved.

We hereby disclaim any and all war­ranties, including but not limited to
warranties of non-infringement, re­garding circuits, descriptions and
charts stated herein.

Infineon Technologies is an ap­proved CECC manufacturer.

TLE 6255 G

Information

For further information on technolo­gy, delivery terms and conditions and
prices please contact your nearest
Infineon Technologies Office in Ger­many or our Infineon Technologies
Representatives worldwide (see ad­dress list).

Warnings

Due to technical requirements com­ponents may contain dangerous sub­stances. For information on the types
in question please contact your near­est Infineon Technologies Office.

Infineon Technologies Components
may only be used in life-support de­vices or systems with the express
written approval of Infineon Technol­ogies, if a failure of such components
can reasonably be expected to cause
the failure of that life-support device
or system, or to affect the safety or
effectiveness of that device or sys­tem. Life support devices or systems
are intended to be implanted in the
human body, or to support and/or
maintain and sustain and/or protect

Data Sheet Rev. 2.5 23 2003-11-27