0.8A DC Motor Driver for Servo Driver Applications
1Overview
Features
•Optimized for manual headlight beam control applications
•Delivers up to 0.7 A continuous
•Low saturation voltage; typ.1.6 V total @ 25 °C; 0.7 A
•Output protected against short circuit
•Over temperature protection with hysteresis
•Over- and under voltage lockout
•Internal clamp diodes
•Enhanced SMD power package
•Green Product (RoHS compliant)
•AEC Qualified
TLE4209G
PG-DSO-14-22
Description
The TLE4209G is a protected H-Bridge Driver designed specifically for automotive manual headlight beam control
and industrial servo control applications with DC-brush motor loads.
The part is built using the bipolar high voltage power technology DOPL.
The standard enhanced power PG-DSO-14-22 package meets the application requirements and saves PCBboard space and costs. The package is lead- and halogen-free.
The servo-loop-parameter pos.- and neg. Hysteresis, pos.- and neg. deadband and angle-amplification are
programmable with external resistors.
An internal window-comparator controls the input line. In the case of a fault condition, like short circuit to GND,
short circuit to supply-voltage, and broken wire, the TLE4209G stops the motor immediately (brake condition).
Furthermore the built in features like over- and under voltage-lockout, short-circuit-protection and overtemperature-protection will open a wide range of automotive- and industrial applications.
TypePackageMarking
TLE4209GPG-DSO-14-22TLE4209G
Data Sheet3Rev. 1.3, 2008-02-04
TLE4209G
2Block Diagram
RANGE
REF
FB
HYST
13
14
1
2
Range-
AMP
Servo-
AMP
Hyst-
AMP
TLE 4209G
Protection
and Logic
V
S
8
HalfBridge
HalfBridge
6
OUT1
9
OUT2
Block Diagram
Figure 1Block Diagram
7
NC
3,4,5,
10,11,12
GND
AEB02258_4209G
Data Sheet4Rev. 1.3, 2008-02-04
TLE4209G
3Pin Configuration
3.1Pin Assignment
FB
HYST
GND
GND
GND
OUT1
NC
1
2
3
4
5
6
7
14
13
12
11
10
AEP02261_4209G
9
8
REF
RANGE
GND
GND
GND
OUT2
V
S
Pin Configuration
Figure 2Pin Configuration
3.2Pin Definitions and Functions
PinSymbolFunction
1FBFeedback Input
2HYSTHysteresis I/O
3, 4, 5,
10, 11,
12
6OUT1Power Output 1
7NCNot Connected
8
9OUT2Power Output 2
13RANGERange Input
14REFReference Input
GNDGround
V
S
Power Supply Voltage
Data Sheet5Rev. 1.3, 2008-02-04
TLE4209G
General Product Characteristics
4General Product Characteristics
4.1Absolute Maximum Ratings
Absolute Maximum Ratings
T
= -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin
j
(unless otherwise specified)
Pos.ParameterSymbolLimit ValuesUnitConditions
Voltages
4.1.1Supply voltage
4.1.2Supply voltage
4.1.3Logic input voltages
(FB, REF, RANGE, HYST)
Currents
4.1.4Output current (OUT1, OUT2)
4.1.5Output current (Diode)
4.1.6Input current
(FB, REF, RANGE, HYST)
Temperatures
4.1.7Junction temperature
4.1.8Storage temperature
1) Not subject to production test, specified by design.
1)
Min.Max.
V
V
V
I
I
I
S
S
I
OUT
OUT
IN
-0.345V–
-1–Vt < 0.5 s;
I
> -2 A
S
-0.320V–
––Ainternally limited
-0.90.9A–
-2
-6
2
6
mA
mA
t < 2 ms; t/T < 0.1
T
j
T
stg
-40150°C–
-50150°C–
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2Operating Range
Pos.ParameterSymbolLimit ValuesUnitConditions
Min.Max.
4.2.1Supply voltage
4.2.2Supply voltage increasingV
4.2.3Supply voltage decreasing
4.2.4Output current
4.2.5Input current (FB, REF)
4.2.6Junction temperature
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
V
S
S
V
S
I
OUT1-2
I
IN
T
j
818VAfter VS rising
-0.3V
-0.3V
UV ON
UV OFF
above
VOutputs in tristate
VOutputs in tristate
V
UV ON
-0.70.7A–
-50500µA–
-40150°C–
Data Sheet6Rev. 1.3, 2008-02-04
TLE4209G
General Product Characteristics
4.3Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos.ParameterSymbolLimit ValuesUnitConditions
Min.Typ.Max.
4.3.1Junction to Soldeering Point
4.3.2Junction to Ambient
1)
1)
R
R
thJSP
thJA
––25K/Wmeasured to pin 5
–130–K/W
2)
minimal-footprint
4.3.3Junction to Ambient
1)
R
thJA
–65–K/W
3)
additional 600 mm2 CU area
1) Not subject to production test, specified by design.
2) JESD 51-2, 51-3, FR4 76.2 mm × 114.3 mm × 1.5 mm, 70 µm Cu, minimal footprint
3) JESD 51-2, 51-3, FR4 76.2 mm × 114.3 mm × 1.5 mm, 70 µm Cu, 600 mm2 CU cooling area connected to Pins: 3, 4, 5,
10, 11, 12
4.4Electrical Characteristics
Electrical Characteristics
V
= 8 V to 18 V, Tj = -40 °C to +150 °C, I
S
= 0 A, all voltages with respect to ground, positive current flowing
OUT1-2
into pin (unless otherwise specified)
Pos.ParameterSymbolLimit ValuesUnitConditions
Min.Typ.Max.
Current Consumption
4.4.1Supply current
4.4.2Supply current
4.4.3Supply current
I
S
I
S
I
S
– 1220mA–
– 2030mAI
– 3050mAI
OUT1
I
OUT2
OUT1
I
OUT2
= 0.3 A
= -0.3 A
= 0.7 A
= -0.7 A
Over- and Under Voltage Lockout
4.4.4UV Switch ON voltage
4.4.5UV Switch OFF voltage
4.4.6UV ON/OFF Hysteresis
4.4.7OV Switch OFF voltageV
4.4.8OV Switch ON voltage
4.4.9OV ON/OFF Hysteresis
V
UV ON
V
UV OFF
V
UVHY
OV OFF
V
OV ON
V
OVHY
–7.48VVS increasing
6.36.9–VVS decreasing
–0.5–VV
UV ON
- V
UV OFF
–20.523VVS increasing
17.520–VVS decreasing
–0.5–VV
OV OFF
- V
Outputs OUT1-2, Saturation Voltages
4.4.10Source (upper)
I
= -0.3 A
OUT
4.4.11Sink (upper)
I
= -0.7 A
OUT
4.4.12Sink (lower)
I
= 0.3 A
OUT
4.4.13Sink (lower)
I
= 0.7 A
OUT
V
V
V
V
SAT U
SAT U
SAT L
SAT L
–0.901.20V Tj = 25 °C
–1.101.50V Tj = 25 °C
–0.250.40V Tj = 25 °C
–0.450.75V Tj = 25 °C
OV ON
Data Sheet7Rev. 1.3, 2008-02-04
TLE4209G
General Product Characteristics
Electrical Characteristics (cont’d)
V
= 8 V to 18 V, Tj = -40 °C to +150 °C, I
S
= 0 A, all voltages with respect to ground, positive current flowing
OUT1-2
into pin (unless otherwise specified)
Pos.ParameterSymbolLimit ValuesUnitConditions
Min.Typ.Max.
4.4.14Total drop
I
= 0.3 A
OUT
4.4.15Total drop
I
= 0.7 A
OUT
V
SAT
V
SAT
–1.21.7VV
–1.62.5VV
SAT
SAT
= V
= V
SAT U
SAT U
Outputs OUT1-2, Clamp Diodes
4.4.16Forward voltage; upper
4.4.17Upper leakage current
4.4.18Forward voltage; lower
V
I
V
FU
LKU
FL
–11.5VIF = 0.3 A
––5mAIF = 0.3 A
–0.91.4VIF = 0.3 A
Input-Interface, Input REF
4.4.19Quiescent voltage
4.4.20Input resistance
V
R
REFq
REF
–200–mVI
REF
= 0 µA
–6–kΩ0 V < V
REF
Input-Interface, Input FB
4.4.21Quiescent voltage
4.4.22Input resistance
V
FBq
R
FB
–200–mVIFB = 0 µA
–6–kΩ0 V < VFB < 0.5 V
Input-Interface, Input/Output HYST
4.4.23Current Amplification
A
HYST
= I
HYST
/ (I
REF
- IFB)
4.4.24Current Offset
4.4.25Threshold voltage High
4.4.26Deadband voltage High
4.4.27Deadband voltage Low
4.4.28Threshold voltage Low
4.4.29Hysteresis Window
4.4.30Deadband WindowV
A
HYST
I
HYSTIO
V
HYH
V
DBH
V
DBL
V
HYL
V
HYW
DBW
0.80.951.1–-20 µA < I
-20.353µAI
/ VS–52–%–
/ VS–50.4–%–
/ VS–49.6–%–
/ VS–48–%–
/ VS345%(V
/ VS0.40.81.2% (V
10 µA <
I
REF
V
HYST
REF
V
HYST
I
HYST
= 250 µA;
= VS / 2
= IFB = 250 µA;
= VS / 2
- V
HYH
HYL
- V
DBH
DBL
Input-Interface, Input RANGE
4.4.31Input current
4.4.32Switch-OFF voltage HighV
4.4.33Switch-OFF voltage LowV
I
RANGE
OFFH
OFFL
-1–1µA0 V < V
-250100mVrefer to V
RANGE
S
300400500mVrefer to GND
+ V
+ V
< 0.5 V
< -10 µA;
HYST
< 20 µA;
) / V
) / V
< V
SAT L
SAT L
S
S
S
Data Sheet8Rev. 1.3, 2008-02-04
TLE4209G
Electrical Characteristics (cont’d)
V
= 8 V to 18 V, Tj = -40 °C to +150 °C, I
S
into pin (unless otherwise specified)
Pos.ParameterSymbolLimit ValuesUnitConditions
Thermal Shutdown
4.4.34Thermal shutdown junction
temperature
4.4.35Thermal switch-on junction
temperature
4.4.36Temperature hysteresis∆
1) Not subject to production test, specified by design.
1)
1)
= 0 A, all voltages with respect to ground, positive current flowing
OUT1-2
Min.Typ.Max.
T
jSD
T
jSO
150175200°C–
120–170°C–
T–30–K–
General Product Characteristics
Data Sheet9Rev. 1.3, 2008-02-04
TLE4209G
5Application Information
V
+
R
REF
1 kΩ
B
V
+
V
REFIN
B
R
HYH
100 kΩ
R
R
RANGE
Ω50 k
R
REF
50 k
FB
Ω
R
REF 14
FB 1
50 kΩ
13
Range-
AMP
Servo-
AMP
1N4001
TLE 4209G
Protection
and Logic
Dr
Application Information
C
S
22 µF
Dz
36 V
V
S
8
HalfBridge
OUT1
6
P
Half-
M
Bridge
OUT2
9
FB
1 kΩ
HYST 2
HystAMP
R
HYL
100 k
Ω
GND
Figure 3Application Diagram
Note: In the application the PIN 7 can remain not connected.
7
NC
3,4,5,
10,11,12
GND
AES02259_4209G
Data Sheet10Rev. 1.3, 2008-02-04
TLE4209G
V
V=
V
OUT1
-
OUT2
2.0%0.4%
V(V-)/V
FBREF
Motor
-2.0%-0.4%
Application Information
Motor
Status
Turn
CW
S
Brake
Turn
CCW
DBW
DBLDBH
HYW
HYLHYH
Expressions:
= Hysteresis
HY
DeadbandDB =
HighH=
LowL=
WindowW=
Figure 4Hysteresis, Phaselag and Deadband-Definitions
AED02260
Data Sheet11Rev. 1.3, 2008-02-04
TLE4209G
Tes tconditons:
V
OFFH
V
HYH
V
DBH
V
DBL
V
HYL
V
S
V
FB
V
=
V
; no reverse polarity voltage di ode
S
B
R
=
R
R
HYL
= 50 k
FB
V
REF
= 100 k
HYH
R
=
REF
(t)
(t)
Ω
Ω
(t)
Application Information
V
OFFL
S ta r t-C omman d
Stop-Command
V
OUT2
H
L
V
OUT1
H
L
B = Brake
t
t
BBCWBCWBBMotor Status
CCW
CCW
t
Figure 5Timing and Phaselag
Data Sheet12Rev. 1.3, 2008-02-04
TLE4209G
6Package Outlines
1.27
+0.1
0.41
-0.06
14
0.1 MIN.
M
0.28A
(1.5)
0.1
C
14x
4
1.75 MAX.
C
-0.2
0.33
1)
6
±0.08
±0.2
x 45˚
0.64
+0.05
-0.01
0.2
Package Outlines
MAX.8˚
±0.25
1
8.75
Index Marking
1)
Does not include plastic or metal protrusion of 0.15 max. per side
-0.2
7
1)
A
GPS09033
Figure 6PG-DSO-14-22 (Plastic Green - Dual Small Outline Package)
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.
Dimensions in mm
Data Sheet13Rev. 1.3, 2008-02-04
TLE4209G
7Revision History
RevisionDateChanges
1.1
1.2
1.3
2007-04-11
2007-08-10
2008-02-04
RoHS-compliant DSO package version of the TLE 4209
All pages: Infineon logo updated
Page 1:
“AEC qualified” and “RoHS” logo added, “Green Product (RoHS compliant)” and
“AEC qualified” statement added to feature list, package names changed to
RoHS compliant versions, package pictures updated
Page 13:
Package names changed to RoHS compliant versions, “Green Product”
description added
Revision History added
Legal Disclaimer added
Package name changed to PG-DSO-14-22
Page 1: Editorial change: deleted "fully" (The term "fully protected" often leads to
misunderstandings as it is unclear with respect to which parameters).
Revision History
Data Sheet14Rev. 1.3, 2008-02-04
Edition 2008-02-04
Published by
Infineon Technologies AG
81726 Munich, Germany
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
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