• Desktop and Server
VR11.X and VR12 Vcore
and non-Vcore buckconverters
• Network and Telecom
processor VR
• Single Phase and MultiPhase POL
• CPU/GPU Regulation in
Notebook, Graphics Cards,
and Gaming
• Voltage Modules requiring
high power density
• Memory (DDR2/3)
Data Sheet
Page 2 of 20
TDA21211
Pinout
VIN
VIN
VIN
VIN
VIN
VIN
VIN
VIN
VSWH
VSWH
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
VIN
VIN
VIN
VIN
11
12
13
14
15
16
17
18
19
20
22 23 24 25 26 27
21
PGND
PGND
PGND
PGND
8910
VIN
NC
NC
PGND
PGND
PHASE
PHASE
7
VSWH
PGND
PGND
6
GH
GH
PGND
PGND
CGND
CGND
PGND
PGND
BOOT
BOOT
VDRV
VDRV
CGND
28
PGND
PGND
PGND
PGND
SMOD#
SMOD#
VCIN
VCIN
12345
PWM
PWM
40
39
DISB#
DISB#
38
NC
NC
37
CGND
CGND
36
GL
GL
35
VSWH
VSWH
VSWH
34
VSWH
33
VSWH
VSWH
32
VSWH
VSWH
31
VSWH
VSWH
29
30
VSWH
VSWH
VSWH
VSWH
Note:
Signals marked
with "#" at the
end are active
low signals.
Figure 1. Pinout, numbering and name of pins (Transparent Top View)
Pin Description
Pin Name Pin No. Description Remarks
CGND 5, 37,CGND Pad Control signal ground Should be connected to PGND externally
SMOD# 1 Low side gate disable pin when SMOD# is “low” the GL is OFF
VCIN 2 Logic supply voltage 5V bias voltage for the internal logic.
VDRV 3 FET gate supply voltage High & Low Side gate drive 5V
BOOT 4 Bootstrap voltage pin Connect to boot capacitor
GH 6 High side gate signal
PHASE 7 Switch node output Internally connected to VSWH pin
NC 8, 38 No connect Can be connected to any potential
VIN
VSWH
9 to 14, Vin Pad
15, 29 to 35,
Input Voltage connection to the drain of the HS FET
Switch node output high current output switch node
VSWH Pad
PGND
16 to 28
Power ground
GL 36 Low side gate signal
DISB# 39 Disable Signal (active low) pull to GND to disable the IC
PWM 40 PWM drive logic input
pin for monitoring gate of HS FET
All of these pins must be connected to the power GND plane
through multiple, low inductance vias.
pin for monitoring gate of LS FET
the three-state PWM input is compatible with 3.3V and 5V
logic
Data Sheet
Page 3 of 20
TDA21211
General Description
The Infineon TDA21211 is a multichip module that incorporates Infineon’s premier MOSFET technology for a single high
side and a single low side MOSFET coupled with a robust, high performance, high switching frequency gate driver in a
single 40 pin QFN package. The optimized gate timing allows for significant light load efficiency improvements over
discrete solutions. State of the art MOSFET technology provides exceptional full load performance. Thus this device has
a clear advantage over exisiting approaches in the marketplace when both full load and light load efficiencies are
important.
The Driver+MOSFET IC TDA21211 (DrMOS) is pin to pin compatible and compliant with the Intel 6x6 DrMOS
specification. The device package height is only 0.8mm, and is an excellent choice for applications with critical height
limitations.
BLOCK DIAGRAM
GU
VCIN
VCIN
PHASE
PHASE
BOOT
BOOT
GU
DISB#
DISB#
PWM
PWM
SMOD#
SMOD#
VCIN
VCIN
CGND
CGND
CGND
CGND
500k
500k
33k
33k
14k
14k
CGND
CGND
VCIN
VCIN
UVLO
UVLO
Input
Input
Logic
Logic
3-State
3-State
400k
400k
600K
600K
VDRV
VDRV
HS
HS
Logic
Logic
LS
LS
Logic
Logic
Level
Level
Shifter
Shifter
Shoot Through
Shoot Through
VDRV
VDRV
IC DRIVER
IC DRIVER
HS Driver
HS Driver
Protection
Protection
LS Driver
LS Driver
500k
500k
500k
500k
HS
HS
MOS
MOS
LS
LS
MOS
MOS
VIN
VIN
VSWH
VSWH
PGND
PGND
Data Sheet
CGND
CGND
VDRV
VDRV
Figure 2. Simplified block diagram
Page 4 of 20
GL
GL
TDA21211
Electrical Specification Table
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Rating Units
Frequency f
SW
1.2 MHz
Average output current Iout 35 A
Input voltage VIN (DC) -0.3 to +30 V
Supply voltage VCIN (DC) -0.3 to +5.5 V
High and Low side driver voltage VDRV (DC) -0.3 to +5.5 V
Switch node voltage VSWH (DC) -1 to +30 V
BOOT voltage V
SMOD# voltage V
DISB# voltage
PWM voltage
1
1
BOOT-PHASE
SMOD#
VDISB -0.3 to +5.5 V
Vpwm -0.3 to +5.5 V
(DC) -1 to +5.5 V
(DC) -0.3 to +5.5 V
Operating junction temperature Tj-opr -40 to +150 °C
Storage temperature Tstg -55 to +150 °C
Note: All rated voltages are relative to voltages on the CGND and PGND pins unless otherwise specified.
1
Latch Up class II- Level B (Jedec 78). Please refer to Quality Report for details.
Thermal Characteristics
Parameter Symbol
Thermal resistance, junction-soldering point
Thermal resistance, junction-top of package
1
junction-soldering point is referred to the VSWH bottom exposed pad.
1
Values
Unit
Min. Typ. Max.
θ
JS
5
K/W
θ
Jtop
20
Data Sheet
Page 5 of 20
TDA21211
Recommended Operating Conditions and Electrical Characteristics (VCIN = 5V, Ta = 25°C)
Parameter Symbol Min Typ Max Units Test Conditions
Input Voltage VIN 5 25
Driving Voltage VDRV 5
Bias Supply Voltage VCIN 4.5 5 5.5
UVLO Rising V
UVLO Falling V
Driver Current
UVLO_R
UVLO_F
I
VDRV_300kHz
I
VDRV_PWML
I
VCIN_PWML
2.9 3.5 3.9
2.5 3.1 3.3
10 mA
25 µA
250 µA
IC Current (Control)
370 µA
270 µA
IC quiescent
I
VCIN_O
I
CIN+IDRV
Logic Inputs and Thresholds
V
VCIN rising
VCIN falling
DISB# = 5V, f
DISB# = 5V, PWM = 0V
DISB# = 5V, PWM = 0V
SMOD# = Open
DISB# = 5V, PWM = Open
SMOD# = Open
DISB# = 0V
= 300kHz
SW
Input low
Input high
DISB#
Sink Current
Input low
Input high
Open Voltage
SMOD#
Sink Current
Input low
Input high
Input resistance
PWM
Open Voltage
Tri-state Shutdown Window
Dynamic Characteristic
Three State to GL/GH rising
propagation delay
GL/GH Three State Shutdown
Hold-Off time,
GH Turn-on propagation delay
V
DISB_L
V
DISB_H
I
DISB
V
SMOD#_L
V
SMOD#_H
V
SMOD#_O
I
SMOD#
V
PWM_L
V
PWM_H
R
IN-PWM
V
PWM_O
V
PWM_S
T_pts
T_tsshd
T_pdhu
0.7 1.1 1.3 V
V
1.9 2.1 2.4
2 µA V
0.7 1.1 1.3 V
1.9 2.1 2.4 V
V
3.0
-8 µA V
0.7 V
V
2.4
6.5 9.5 12.5 kΩ V
1.5 V
V
1.2 1.9
15
240
15
DISB
V
DISB
DISB
SMOD#
SMOD#
SMOD#
PWM
V
PWM
PWM
PWM_O
falling
rising
= 1V
falling
rising
= 1V
falling
rising
= 1V
T_pdlu
T_pdhl
T_pdll
T_pdl_DISB
T_pdh_DISB
GH Turn-off propagation delay
GL Turn-on propagation delay
GL Turn-off propagation delay
DISB#Turn-off propogation
delay falling
DISB#Turn-on propogation
delay rising
1
Unless otherwise specified, VCIN=VDRV
Data Sheet
20
20
10
20
20
Page 6 of 20
ns
GH, GL unloaded.
TDA21211
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