Infineon SP40PLUS Datasheet

Data Sheet Please read the Important Notice and Warnings at the end of this document Revision 1.2
www.infineon.com 2020-05-14
SP400-11-01
SP40PLUS
Tire Pressure Monitoring Sensor
Quality Requirement Category: Automotive
Patented Glass-Silicon-Glass MEMS pressure sensor with best-in-class media compatibility
Calibrated pressure sensor for absolute air pressure measurement
Z-axis accelerometer for motion detection and angular measurement
Temperature and supply voltage sensors
Industry-standard 8051 microcontroller with 12K of Flash memory
System Controller with flexible wake-up and power management features
RF Transmitter with fractional-N sigma-delta PLL
Unique firmware functions for determination of angular wheel position, supporting tire localization (APS)
LF Receiver allows carrier detection and modulated telegram reception

Applications

Valve based TPMS-Modules
•OEM
•Aftermarket
•Retrofit
In Tire TPMS Modules

Description

The SP40PLUS provides a very high level of integration, and is optimized to perform all of the functions necessary to implement a state-of-the-art Tire Pressure Monitoring System (TPMS) sensor module. With its integrated micro controller, sensors, and convenient peripherals, the SP40PLUS needs the addition of only a few passive components and a battery to form a complete TPMS sensor assembly.
Figure 1
PG-DSOSP-14-82
SP40PLUS
Tire Pressure Monitoring Sensor

Table of Contents

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3.1 Pressure Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3.2 z-axis Acceleration Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3.3 Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.4 Battery Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.5 Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3.6 General Purpose Digital I/O Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.3.7 Voltage Monitoring and Power On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.8 Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.3.9 Supply Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.3.10 LF-Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.3.11 RF-Transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.3.12 RC Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.3.13 Wake-up and power-on timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 Special Features of the SP40PLUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.2 Device states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.3 State Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5 Functional Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.1 SP40PLUS Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2 Wake-up Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.2.1 Interval Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.2.2 LF ON-OFF Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2.3 LF receiver wake-up/resume events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2.4 General purpose I/O PP2 wake-up/resume event . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
5.2.5 Power-on and under-voltage reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.6 Software reset, watchdog reset and flash error reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.2.7 Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.3 System Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.3.1 Sampling Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
5.4 Clock Generators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.5 Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.5.1 Timer Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
5.5.2 Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Data Sheet 2 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
5.5.3 Hardware CRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.5.4 I2C Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
5.5.5 UART Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.6 Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.6.1 Lock-byte concept overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
5.6.2 Flash programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.6.3 Retention RAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.6.4 Data RAM and SFRs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
5.6.5 Retention SFRs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.7 Power Supply and Reset Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.7.1 TX battery voltage detector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.8 Measurement Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.9 RF transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.9.1 Manchester/Biphase Encoder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
5.9.2 SD-PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
5.9.3 FSK Modulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5.9.4 Gaussian filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
5.9.5 RF Power Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
5.9.6 ASK modulator and ASK ramping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
5.9.7 Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
5.9.8 RF Baud-Rate Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.10 RF Transmission Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
5.10.1 SOM and EOM Feature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
5.10.2 Voltage measurement at end of transmission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.11 LF Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
5.11.1 LF Analog Front End (AFE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
5.11.2 LF Digital baseband (DBB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
5.11.3 LF Telegram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.11.4 LF state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
5.12 I/O-Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7 Data Sheet Reference Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
8 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
8.1 Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
8.2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
8.3 Package axis definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Data Sheet 3 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Introduction

1 Introduction

Measurements of pressure, acceleration, temperature, and battery voltage are performed under software control, allowing the application software to format and prepare the data for RF transmission. An intelligent system controller provides flexible wake-up capability in order to reduce energy usage. A calibrated Interval Timer is included to permit periodic wake-up of the CPU, which in turn can then perform measurements and transmit data to a receiver. The integrated Z-axis accelerometer may be used by the application software to detect motion and distinguish between parking and driving situation.
The integrated microcontroller is instruction set compatible to the standard 8051 processor and is supported by commercially available C compilers and IDE tool chains. The microcontroller core is supplemented with various peripherals (e.g. hardware Manchester/BiPhase Encoder/Decoder, CRC Generator/Checker, I2C- and UART­interface) that enable an easy implementation of TPMS application software.
For user specific application code the SP40PLUS includes 12k of on-chip flash memory.
The RF Transmitter block covers both 315 and 434 MHz UHF bands and supports FSK and ASK modulation. The transmitter contains a fractional-N sigma-delta PLL synthesizer which allows for precise control of carrier frequency and accurate FSK frequency modulation. A flexible baseband encoder and advanced power management techniques are used to hold the peak current consumption during RF transmission to a minimum. An integrated autonomous LF Receiver allows the SP40PLUS to receive diagnostic or operating state commands, supporting application features such as pressure-on-demand or tire position localization.
Finally, a comprehensive firmware library supports using all above mentioned hardware blocks effectively. Especially a unique set of Angular Position Sensing (APS) functions allows calculating the instantaneous angular position of the TPMS module relative to the car chassis which may be used for wheel localization on system level.
Data Sheet 4 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2 Specification

2.1 Absolute Maximum Ratings

Table 1 Absolute Maximum Ratings
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Max. Supply Voltage V
ESD robustness HBM V
ESD robustness CDM V
Latch up I
Input voltage V
Peak voltage at PAOUT pin
DDmax
ESD_HBM
ESD_CDM
LU
In
V
In_LF
V
PAOUT_peak
-0.3 +3.8 V 1.1
-2000 2000 V All pins according to
1.2
EIA/JESD22-A114-B
-4000 4000 V PAOUT pin according to
1.3
EIA/JESD22-A114-B
-500 500 V All pins (According to ESDA
1.4
STM 5.3.1)
-750 750 V Corner pins (According to
1.5
ESDA STM 5.3.1)
-100 +100 mA AEC-Q100 (transient
1.6
current)
-0.3 VDD +
V PP0, PP1, PP2, PP3 1.7
0.3
-0.3 +1.8 V LFP, LFN, XIN 1.8
-0.3 +0.3 V Differential input at LFP
1.9
and LFN
8 V The matching network
1.10 must be designed such that the peak-voltage at PA does not exceed this value
Output short-circuit capability
1)
V
SC
0 3.8 V Short to VDD, GND or
neighbor pin for max.
1.11
10min at VDD=3.8V. Note:
VDDREG and XOUT must not be shorted to VDD
DC current I Over pressure p Burst pressure p Static acceleration a
DC
max
burst
static
-10 10 mA all pins 1.13
2000 kPa static load 1.14
2000 kPa 10 times 1 sec 1.15
3000 g Device unpowered. Tested
1.16 in z-direction.
Data Sheet 5 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification
Table 1 Absolute Maximum Ratings
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Mechanical shock a
shock
6000 g 0.3 ms half sine pulses.
1.17 5 shocks in +/- x,y,z­direction, respectively. Device unpowered.
Storage temperature T
storage
-50 +150 °C Maximal 1000 hours
1.18 accumulated over lifetime between 125°C and 150°C. Device not powered. Temperature cycling only allowed between -40°C and 125°C.
1) Refers to following pins: PP0 to PP3 if configured as output, XOUT, VDDREG, PAOUT and VDDPA. For input pins see parameter input voltage.
Note: Absolute maximum ratings are values beyond recommended operating conditions. They describe
those conditions which the device can withstand for some limited time. After exposure to maximum ratings the device will remain functional, but the reliability is no longer guaranteed.
Data Sheet 6 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2.2 Operating Range

The operating range defines the ambient conditions where the device operates as specified. Certain specified parameters in this data sheet may depend on additional operating conditions. These additional conditions are indicated in the corresponding sections.
Table 2 Operating Range
Parameter Symbol Values Unit Note or
Test Condition
Supply Voltage
Min. Typ. Max.
1)
V
DD
VUVRA 3.6 V Device not in power
down state
VUVRPD – 3.6 V Device in power down
state
Ambient Temperature T
Operating
T
Flash
-40 125 °C Normal Operation 3.3
-20 90 °C FLASH programming/erasing
Extended Temperature Range
T
EXT
-50 150 °C Thermal shutdown functional. V to 3.6 V. Exposure to 125°C...150°C maximal 24h over lifetime
z-axis Acceleration a
Operating
-1600 1600 g Exceeding this acceleration will result in a higher pressure error as specified.
1) Supply voltage must be connected to VDDBAT pin.
DD
= V
UVRA
Number
3.1
3.2
3.4
3.5
3.6
Data Sheet 7 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2.3 Characteristics

2.3.1 Pressure Sensor

Table 3 Pressure Sensor 500/750/900kPa Variant
1)2)
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Input Pressure Range p
Random Error p ADC resolution p
Measurement Error
3)
in
random
ADC_res
p
Error 100-500
100 900 kPa 7.1
-1.37 1.37 kPa 95% of all measurements 7.2
0.5 kPa/ LSB
1 LSB of a raw measurement corresponds to 0.5 kPa or less
7.3
-5 5 kPa 0°C to +90°C 7.4
-7 7 kPa -20°C to 0°C
7.5
+90°C to +125°C
-9 9 kPa -40°C to -20°C 7.6
p
Error 500-750
-1.2 1.2 %
-1.6 1.6 %
4)
0°C to +90°C 7.7
4)
-20°C to 0°C
7.8
+90°C to +125°C
4)
-40°C to -20°C 7.9
p
Error 750-900
-2.0 2.0 %
-12 12 kPa 0°C to +125°C 7.10
-14 14 kPa -20°C to 0°C 7.11
-15 15 kPa -40°C to -20°C 7.12
1) Based on averaging two raw values for each measurement
2) Exceeding the maximum z-axis acceleration (parameter 3.6) as defined in the operating range will result in a higher pressure measurement error than specified
3) The measurement error is understood as total error, including random error (noise)
4) Percentage of actual pressure value
Data Sheet 8 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2.3.2 z-axis Acceleration Sensor

Table 4 z-axis Acceleration Sensor
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Input acceleration Range
Total Acceleration
1)
Error
Random error of acceleration compensated values
a
in
a
err_tot
a
rnd_comp_
16
-20 355 g Selectable by firmware function 12.1
-355 20 g 12.2
-6.5 (-3.0)
-8.5 (-5.0)
-8.5 (-5.0)
-10.5 (-7.0)
-12.5 (-9.0)
-14.5 (-11.0)
-22.5 (-19.0)
-24 (-20.5)
-0.35 +0.35 g 99.7% of all measurements.
+6.5 (+3.0)
+8.5 (+5.0)
+8.5 (+5.0)
+10.5 (+7.0)
+12.5 (+9.0)
+14.5 (+11.0)
+22.5 (+19.0)
+24 (+20.5)
g|a
T = -40°C...90°C
g|a
T = 90°C...125°C
g|a
T = -40°C...90°C
g|a
T = 90°C...125°C
g|a
T = -40°C...90°C
g|a
T = 90°C...125°C
g|a
T = -40°C...90°C
g|a
T = 90°C...125°C
|=0g ... 20g
in
|=0g ... 20g
in
|>20g ... 100g
in
|>20g ... 100g
in
|>100g ... 200g
in
|>100g ... 200g
in
|>200g ... 355g
in
|>200g ... 355g
in
12.3
12.4
12.5
12.6
12.7
12.8
12.9
12.10
12.11 Averaging of 16 ADC-samples. No external noise sources present.
ADC resolution a
ADC_res
0.057 0.175 g/
1 LSB of a raw measurement
LSB
corresponds to minimal 0.057g and
12.14
maximal 0.175g
Random error of acceleration raw values
Accelerometer resonance frequency
a
rnd_raw_16
f
res_acc
-4 +4 LSB 99.7% of all measurements. Averaging of 16 ADC-samples. No external noise sources present.
5.1 6 6.9 kHz Mechanical excitation of the SP40PLUS in this frequency range
12.16
12.17
must be avoided (e.g. PCB sawing process)
1) Total error specifications are based on averaging 16 raw values for each measurement and they include random error (noise). The total error may be reduced by 3.5g by periodically (e.g. every 3 months) using the automatic acceleration offset compensation function Lib_Comp_Auto_Acc_Offset(). The reduced errors are put into brackets.
Data Sheet 9 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2.3.3 Temperature Sensor

Table 5 Temperature Sensor
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Measurement range T
Measurement error
1)
Random error T
range
T
Error
random
-40 +125 °C 14.1
-3 +3 °C 14.2
-1 +1 °C 95% of all
14.4
measurements
1) The measurement error is understood as total error, including random error (noise)

2.3.4 Battery Sensor

Table 6 Battery Sensor
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Measurement range V
Measurement error
1)
V
range
Error
VUVRA 3.6 V see Table 10 for V
-3 +3 % percentage of
UVRA
15.1
15.2
measurement value
1) The measurement error is understood as total error, including random error (noise)

2.3.5 Thermal Shutdown

Table 7 Thermal Shutdown
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Thermal Shutdown
T
HOT TH
119 122 125 °C 16.1
HOT threshold
Thermal Shutdown
T
HOT RE
115 120 123.5 °C 16.2
HOT release
Hysteresis T
Thermal Shutdown
HYST
T
COLD TH
1.5 4 °C 16.3
-40 -37 -34 °C 16.4
COLD threshold
Thermal Shutdown
T
COLD RE
-38.5 -35 -30 °C 16.5
COLD release
Data Sheet 10 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2.3.6 General Purpose Digital I/O Pins

Table 8 Digital I/O Pins - Operating Range
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Digital Pin Output
I
out DIG
-4 4 mA Pins PP0 to PP3 17.1
Current
Digital Pin Input High Voltage
Digital Pin Input Low Voltage
V
IH
V
IL
0.8V
DD
V
- 0.05 V for lowest current
DD
0.2V
50 mV for lowest current
V functional 17.2
consumption
V functional 17.4
DD
1)
17.3
17.5
consumption
1) If the digital I/O pins are left open and the internal pull resistors are activated the +/-50mV criterion is fulfilled
Table 9 Digital I/O Pins - Electrical Characteristics
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Digital Pin-Output High
V
OH
V
-0.3 V at 1 mA load current 18.1
DD
Voltage
Digital Pin-Output Low
V
OL
0.3 V 18.2
Voltage
Digital Pin Input Capacitance
C
in
10 pF PP0, PP1 and PP3 18.3
20 pF PP2 18.4
Digital Pin Input current (PP0, PP1, PP3)
Digital Pin Input current (PP2)
I
in_PP0_1_3
I
in_PP2
-1 1 µA PP0, PP1, PP3 configured as input
-1 1 µA PP2 configured as input T = -40°C...+90°C
-1.5 1.5 µA PP2 configured as input T = +90°C...+125°C
18.5
18.6
18.7
Data Sheet 11 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2.3.7 Voltage Monitoring and Power On

Table 10 Voltage Monitoring and Power On
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Under Voltage Reset (measured at VDDBAT pin)
V
UVRA
V
UVRPD
1.6 1.7 V applies in run- and idle-state
and if RF transmission is ongoing
1)
1.2 1.6 V applies in all other device
19.1
19.2
states
Reset Release Threshold
2)
V
THR
1.8 1.9 V applies for a reset triggered
by under voltage and power-
19.3
on reset
RF Undervoltage
V
MIN
1.8 1.9 V 19.4
3)
Warning Level
Brown-out Detection Threshold
1) During TX-interframe in TX-low-power, when the analog circuits are switched off, 19.1 does not apply
2) The device will be released from undervoltage reset or power-on reset only if voltage at VDDBAT pin exceeds V
3) A flag is set if voltage at VDDBAT pin falls below V
4) The brown-out detector monitors the internal 1.5V domain
4)
V
THR_BOD
1.15 1.25 V 19.5
during RF transmission
MIN

2.3.8 Flash memory

THR
Table 11 Flash Memory
1)
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Flash memory data retention time
Flash write cycles N
Flash line write time t
t
Ret Flash
write
write_line
10 y Defect rate < 1ppm over
lifetime.
100 20.2
6msIncluding time for
20.1
20.3
verification. I2C Baud-rate = 400 kbit/s
1) Endurance, data retention, and operational life qualified according AEC-Q100-005D1
Data Sheet 12 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification

2.3.9 Supply Currents

Table 12 Supply Currents at 3.0V supply voltage
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Supply current in power down state
1)
Supply current in idle state (CPU gated off)
Supply current in run
2)
state
Supply current at thermal shutdown
3)
LF-receiver supply current in LF carrier detection mode (digital filter off)
4)
LF-receiver supply current in LF carrier detection mode (digital filter on)
4)
I
PWD_3V
I
IDLE_3V
I
RUN_3V
I
TSD_3V
I
LFCD_3V
I
LFCDFilter_3V
245 540 nA +25°C 21.1
8.5 µA +125°C 21.2
0.15 µA -40°C 21.3
280 400 µA +25°C 21.4
400 µA +125°C 21.5
280 µA -40°C 21.6
0.85 1.05 mA +25°C 21.7
0.95 mA +125°C 21.8
0.83 mA -40°C 21.9
85 116 µA +125°C 21.10
62 110 µA -40°C 21.11
3.3 4 µA +25°C 21.12
10 µA +125°C 21.13
3.5 µA -40°C 21.14
4 6 µA +25°C 21.15
11 µA +125°C 21.16
4 µA -40°C 21.17
LF-receiver supply current in LF data reception mode
4)
Supply current at RF­transmission
I
LF_3V
I
RFTX_3V
3.85 6 µA +25°C 21.18
11 µA +125°C 21.19
4 µA -40°C 21.20
5.5 7 mA 315MHz, -40...+125°C 21.21
5.7 7 mA 434MHz, -40...+125°C 21.22
CW or FSK CPU off
Supply current during RF interframe timing (CPU off)
Supply current in deep idle state
5)
I
TXIF_3V
2.1 12 µA +25°C 21.24
34 µA +125°C 21.25
1.8 µA -40°C 21.26
I
DEEP_3V
2.1 12 µA +25°C 21.27
25 100 µA +125°C 21.28
1.7 µA -40°C 21.29
1) PP0, PP1, PP2, PP3 not connected
2) Measured while code is running from flash, executing a mix of read/write operations on retention RAM, SFRs and RAM
3) I
is the always ON current. Average current for clocked operation is I
TSD
4) The LF-receiver supply currents at each temperature are measured by substracting the power down current with LF­Receiver being turned off from the power down current with LF-Receiver being activated in the specific mode.
TSD_avg=IPWD
+(I
TSD-IPWD
)*2.9/16/Interval_Mul_16ms
Data Sheet 13 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification
5) Measured with the Data Sheet Reference Board, 50 Ohm RF output terminated with 50Ohm, VDDPA = 2.1V

2.3.10 LF-Receiver

Table 13 LF Receiver Operating Conditions
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
LF Carrier Frequency
LF Data Rate DR
LF Data Duty Cycle DC
LF Data amplitude change speed
1) LF sensitivity levels are only valid for the specified carrier frequency range.
1)
f
LF
AC
LF
LF
SLF
115 125 135 kHz 22.1
3.8 3.9 4.2 kbit/s 22.2
45 50 55 % 22.3
1.5 Vpp/s Valid for input signals
22.4
up to 10mVpp
Table 14 LF Receiver Characteristics
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Input differential
C
LF diff
2.5 3.9 10 pF at 125kHz 23.1
capacitance
Input differential resistance
R
LF diff
1 MOhm at 125kHz, AGC inactive, -
40°C to 90°C
1-(T/°C -90)/70 MOhm at 125kHz, AGC inactive,
23.4
23.5
90°C <=T<= 125°C
LF Receiver settling
t
ON_Set.
3.9 ms After receiver power-on 23.6
time after power on
Table 15 LF Receiver Characteristics (Data Reception Mode)
1)2)
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
LF Data Threshold settling time
LF Telegram Detection Sensitivity
t
Settling
S
nodet
S
det
2 ms During LF- telegram
preamble
0.1 mVpp 24.2
1.3 mVpp -20°C to 90°C 24.3
24.1
2.5 mVpp -40°C to 125°C 24.4
1) LF telegram detection sensitivity specified for 100% modulation depth.
2) Specified sensitivities require calling Lib_LF_Sensitivity() in application code, [1].
Data Sheet 14 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification
Table 16 LF Receiver Characteristics (Carrier Detection Mode)
1)
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
LF Carrier Detection Sensitivity
Carrier Detector Filter
2)
Time
1) Specified sensitivities require calling Lib_LF_Sensitivity() in application code, [1].
2) Specified carrier detector filter times require calling Lib_LF_Pulse_Width() in application code, [1].
S
S
t
t
t
CD 1
CD 2
CD 3
nodet
det
0.33 mVpp 25.1
3.35 mVpp 25.2
140 200 240 µs 25.9
350 500 650 µs 25.10
700 1000 1300 µs 25.11

2.3.11 RF-Transmitter

Table 17 RF Transmitter Characteristics
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Transmit Frequency f
TX
314 316 MHz 28.1
433 435 MHz 28.2
1)
RF Data Rate DR
RF Data Rate tolerance
2)
RF Output Power
3)
DR
P
RF
RF
RF TOL
-1 1 % 28.4
4 5 6 dBm 2.5V <=VDD<=3.6V
20 kbit/s Manchester Coded 28.3
28.5
+25 to +60 °C
3 7 dBm 1.8V<=VDD < 2.5V
28.6
-40 to 0 °C
3 7 dBm 2.5V <=VDD<=3.6V
28.7
-40 to +25 °C
3 6 dBm 2.5V <=VDD<=3.6V
28.8
+60 to +125 °C
2 6 dBm 1.8V<=VDD < 2.5V
28.9
0 to +125 °C
FSK frequency shift 0 +/-40 +/-75 kHz programmable
28.10
see [2]
RF Data Duty Cycle DC
ASK Modulation depth MD
1) Parameters have been measured with the Data Sheet Reference Board at the 50 Ohm RF output.
2) Specification applies for following data-rates: 4096, 4200, 9600, 10000 and 19200 Baud. For other data-rates the tolerance may increase to up to +/- 1.5%.
3) Valid for voltage at pin VDDPA = 2.1V
4) FSK duty cycle is characterized by eye-diagram evaluation
5) ASK duty cycle is defined at -3dB of the maximum RF power during ASK on
RF
RF
45 50 55 % valid for FSK4) and ASK5)
90 % 28.12
28.11
Data Sheet 15 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification
Table 18 RF Crystal Oscillator
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Crystal Frequency f
Crystal oscillator drive current
XTAL
I
Xtal_drive
25.920 26 26.080 MHz 29.1
1.5 mA This parameter reflects
29.2 the driving capability of the crystal oscillator
Crystal Oscillator startup time
t
Xtal_start
1msFor crystals
recommended by IFX
29.3

2.3.12 RC Oscillators

Table 19 RC Oscillator Characteristics
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Temperature drift of
2.2kHz oscillator
Total tolerance of
2.2kHz oscillator
1)
Temperature drift of 90kHz oscillator
TD2k -0.075 +0.075 %/K 30.1
TOL2k
tot
-30 30 % -40 to +125°C and over
30.2 lifetime
TD90k -0.05 +0.05 %/K 30.4
Total tolerance of 90kHz oscillator
2)
Temperature drift of
TOL90k
TD12M -0.05 +0.05 %/K 30.7
-5 5 % -40 to +125°C and over
tot
lifetime
30.5
12MHz oscillator
Total tolerance of
TOL12M
12MHz oscillator
1) The 2.2kHz oscillator is the clock source for the interval timer and the ON-OFF timer. The timers can be calibrated with firmware functions. The calibration error is reported in the description of the FW function. This error is only valid if temperature stays constant.
2) The 90kHz oscillator is the clock source for the sampling timer and the interframe timer. The timers can be calibrated with firmware functions. The calibration error is reported in the description of the FW function. This error is only valid if temperature stays constant.
-8 8 % -40 to +125°C and over
tot
lifetime
30.8

2.3.13 Wake-up and power-on timing

Data Sheet 16 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Specification
Table 20 Wake-up and power-on timing
Parameter Symbol Values Unit Note or Test Condition Number
Min. Typ. Max.
Power on time t
ini
10.2 ms Time after exceeding V
THR
until
31.1
start of I2C handler
Normal mode delay time
t
NM_delay
110 µs Time after I2C command for
normal mode sent until
31.2
application code execution start
Resume from deep idle time
t
resume
750 µs Time from resume event during
deep-idle to application code
31.3
execution start.
Mode selection time t
LF Wake-up time
1)
MS
t
LF wake-up
2.1 2.8 4.2 s see Chapter 4.2.5 31.4
5.3 ms Time from LF wake-up event
31.5 during power-down to application code execution start.
IT Wake-up time
1)
t
IT wake-up
6 ms Time from interval timer elapsed
31.6 during power-down to application code execution start.
PP2 Wake-up time
t
PP2 wake-
up
6 ms Time from level-change detected
at PP2 during power-down to
31.7
1)
application code execution start.
1) Note: the device stays in power-down most of the wake-up time and only 550µs(max) in run-state before application code execution starts
Data Sheet 17 Revision 1.2 2020-05-14
131412
11
10
9
8
213
4
5
6
7
output_en
SP40PLUS
Tire Pressure Monitoring Sensor
Pin Description

3 Pin Description

3.1 Pin Configuration

Figure 1 Pin Configuration

3.2 Pin Description

Table 21 Pin Description
Pin No. Name Pin Type Buffer Type Function
1SCL/PP0Digital I/O General Purpose-I/O I2C Clock
2 SDA/PP1 Digital I/O General Purpose-I/O I2C Data
3 PP2 Digital I/O General Purpose-I/O UART RX data
Data Sheet 18 Revision 1.2 2020-05-14
output_en
SP40PLUS
Tire Pressure Monitoring Sensor
Pin Description
Table 21 Pin Description (cont’d)
Pin No. Name Pin Type Buffer Type Function
4GNDD
5 PP3 Digital I/O General Purpose-I/O UART TX data
1)
Supply Digital Ground
6XINAnalog Crystal oscillator input
7XOUTAnalog Crystal oscillator output
8LFNAnalog LF receiver negative input
9LFPAnalog LF receiver positive input
Data Sheet 19 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Pin Description
Table 21 Pin Description (cont’d)
Pin No. Name Pin Type Buffer Type Function
10 VDDREG Supply Regulated voltage output (1.5V)
2)
11 GNDA
1)
Supply Analog Ground
12 PAOUT Analog
output
13 VDDPA Analog
output
RF power amplifier output
Regulated voltage for PA
14 VDDBAT Supply Power supply
1) GNDD and GNDA are shorted internally via leadframe
2) Note: this pin is only intended for stabilization of the internal voltage of the SP40PLUS by an external capacitor. It must not be used as external current source.
Data Sheet 20 Revision 1.2 2020-05-14
SP40PLUS
Tire Pressure Monitoring Sensor
Special Features of the SP40PLUS

4 Special Features of the SP40PLUS

4.1 Operating Modes

Apart from normal operating mode the SP40PLUS provides additional operating modes for debugging and programming purposes. These additional operating modes can be selected by sending a proper I2C command within a specified time interval after power on reset (POR). The I2C command starts with the device address (6C followed by a code for the operating mode to be selected. If the SP40PLUS does not receive any I2C command after POR or a wrong command it starts up in normal operating mode (“Normal mode”).
Table 22 Operating Modes Overview
H
)
Operating mode Device
controlled by
Normal mode application
Short Description I2C
command
Normal operating mode for TPMS application 9876
1)
H
code
Program mode external I2C-
Master
Used for programming application code and user configuration data. Additional I2C commands allow reading
1F5A
H
sensor measurement values.
Debug mode external I2C-
Master
Used for application code development. Commands for RAM read/write, program counter manipulation, execute
FEDC
H
single step and run until breakpoint/interrupt are available.
1) The complete I2C sequence is: [0x6C] [command high byte] [command low byte]

4.2 Device states

In normal operation mode the SP40PLUS can be switched into several device states which differ in the number of enabled circuit blocks. For lowest power consumption unused blocks are disconnected from power supply, hence not even idle currents remain.
Table 23 Device states overview
Device state Short description Important activated blocks
Run state application code execution.
Idle state
1)
No code execution. Device is waiting for a wake-up/resume event. Fast recovery on wake­up/resume event.
CPU with 12 MHz RC-oscillator
All other blocks can be activated if needed
12 MHz CPU clock and CPU timer (CPU disabled)
•Optional: ADC
•Optional: TX-state machine, RF-transmitter
•Optional: Timer 0/1
Optional: LF Receiver with 90 kHz oscillator
Deep idle state
2)
No code execution. Device is waiting for a resume event from sampling timer or wake-up
Wake-up controller with 2.2kHz RC-oscillator
90 kHz oscillator
•System controller
event. Intended for equidistant acceleration raw measurements.
Data Sheet 21 Revision 1.2 2020-05-14
Optional: LF-receiver
Run state
Power down
state
Deep idle
state
Thermal
shutdown
Idle state
TX low power
state
I2C
Handler
Valid I2C
comman
d or time-
out
Resume
Enter
idle
System
Reset
Enter
power-
down
Wake-
up
Resume
Enter
deep
idle
Enter
TX low
power
Enter
power
down
Resume
Wakeup/
Resume boot
sequence
Resume
Enter
thermal
SD
SequenceDevic e state
Reset boot
sequence
SP40PLUS
Tire Pressure Monitoring Sensor
Special Features of the SP40PLUS
Table 23 Device states overview (cont’d)
Device state Short description Important activated blocks
Power-down state No code execution. Device is
waiting for a wake-up event. Lowest current consumption.
TX low power state Power-down state where TX
state-machine can be operated. Device wakes-up/resumes on interval-timer elapsed or transmission end. Other events are postponed.
Thermal shutdown
3)
state
Almost all circuits shut off. Resume only if temperature returns to normal operating range.
1) In idle state the CPU is halted. When device resumes from idle code execution immediately continues behind the point of entering idle state.
2) In deep idle the CPU is shut off. When device resumes from deep idle code execution restarts from reset vector.
3) In thermal shutdown the CPU is shut off. When device resumes from thermal shutdown code execution restarts from reset vector.
Wake-up controller with 2.2kHz RC-oscillator
Optional: LF-receiver with 90 kHz oscillator
Wake-up Controller with 2.2kHz RC-oscillator
Optional: LF Receiver with 90 kHz oscillator
90kHz oscillator
•TX state machine
RF-transmitter when needed by TX state machine
Temperature detector
Wake-up Controller with 2.2kHz RC-oscillator

4.3 State Transitions

Figure 2 shows the possible state transitions in normal mode. The central device state is run state because only
in run state the state transitions can be configured. Entering other states from run state is controlled by application code, either by calling firmware functions [1] or setting control bits [2]. State transitions from other states are controlled by hardware events, e.g. timer events or LF receiver events.
Figure 2 State transitions in normal mode
Data Sheet 22 Revision 1.2 2020-05-14
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