Infineon PBA 313 07 User Manual
Preliminary Data Sheet, 11/2001 CONFIDENTIAL
Never stop thinking.
Secure Mobile Solutions
Preliminary Product Overview
T3130-7V10PO1-7600
Apr-2004
PBA 313 07
Singlestone
Singlestone
PBA 313 07
Preliminary Product Overview 4/2004
2
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™
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BLUETOOTH
TM
is a trademark owned by its proprietor and used by Infineon Technologies AG under license.
Edition 4/2004
Published by Infineon Technologies WS Sweden AB,
Isafjordsgatan 16
SE-164 81 Kista
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All Rights Reserved.
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The information presented in this document does not constitute a part of any quotation or contract. Infineon Technologies
especially emphazises the following:
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circuits implemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics or representation.
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Packing
Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By
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For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components
1
of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express
written approval of Infineon Technologies AG.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected to
cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and
sustain human life, such as, for example, in medical, air traffic, defense, or life-sustaining automotive applications. If they fail, it
is reasonable to assume that the health of the user or another person may be endangered.
Exclusion of Warranty and Liability
The Software is provided "as is" and Infineon gives no warranty - expressly or implied - of any kind, including, but not limited to,
warranties of merchantability or fitness for a particular purpose, nor does Infineon assume any liability whatsoever as to the
performance of the Software.
In addition, Infineon assumes no responsibility for the ability of the customer to use this Software for the purpose it was provided
for, nor does Infineon assume responsibility for any claims, including, but not limited to, claims of infringement of intellectual
property rights of third parties, arising from the customer's use of the Software.
Singlestone
PBA 313 07
Preliminary Product Overview 4/2004
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Table of Contents
1 Introduction......................................................................................................................5
2 General Device Overview..............................................................................................6
2.1 General Features............................................................................................................. 7
2.2 Block diagram................................................................................................................. 8
2.3 Typical application ......................................................................................................... 8
2.4 Mechanical dimension and pad arrangement................................................................. 9
2.5 Module pin-out .............................................................................................................. 10
2.6 Functional Block Diagram ............................................................................................11
2.7 System Integration and Applications ............................................................................ 12
2.7.1 General description ..................................................................................................12
3 Electrical Specifications.............................................................................................13
3.1 Absolute Maximum Ratings .......................................................................................... 13
3.2 Operating conditions .................................................................................................... 13
3.3 Latch-up immunity........................................................................................................13
3.4 Quality ..........................................................................................................................13
3.5 Capacitance..................................................................................................................14
3.6 Current consumption .................................................................................................... 14
3.7 DC Characteristics of Digital Part.................................................................................15
3.7.1 Pull Up characteristics on ResetQ.............................................................................16
3.8 Operational Range for RF part......................................................................................16
3.9 AC/DC Characteristics of RF part..................................................................................16
3.9.1 Transmitter Characteristics .......................................................................................17
3.9.2 RSSI.......................................................................................................................17
3.9.3 Receiver Characteristics...........................................................................................18
3.10 Characteristics of externally supplied 32.768kHz clock signal...............................18
4 Assembly and design guidelines.............................................................................19
4.1 General description of the module ...............................................................................19
4.2 Printed Circuit Board design.........................................................................................19
4.3 Solder paste printing ....................................................................................................19
4.4 Assembly ...................................................................................................................... 20
4.4.1 Component placement .............................................................................................20
4.4.2 Pin mark..................................................................................................................20
4.5 Soldering profile ........................................................................................................... 21
4.6 Antenna ........................................................................................................................21
4.7 Shielding / EMC requirements.......................................................................................21
4.8 Safety............................................................................................................................21
5 Type approvals and Qualification.............................................................................22
5.1 Bluetooth Qualification.................................................................................................22
Singlestone
PBA 313 07
Preliminary Product Overview 4/2004
4
5.2 FCC Modular Approval..................................................................................................22
5.3 R&TTE Approval ........................................................................................................... 22
6 Module marking.............................................................................................................23
7 Package ...........................................................................................................................24
8 References......................................................................................................................25
Singlestone
PBA 313 07
Preliminary Product Overview 4/2004
5
1 Introduction
The module is built around the BlueMoon Single Cellular chip (PMB 8761) which contains the radio,
baseband, link manager and HCI functionality. For additional information regarding the PMB8761 such
as firmware features, complete description of Infineon specific HCI commands and events, please
refer to the latest version of the Data sheet for PMB8761, T8761-XV01Dx-7600.
Singlestone
PBA 313 07
Preliminary Product Overview 4/2004
6
2 General Device Overview
Infineon’s Singlestone - PBA 313 07 is a ready-to-use Class2 Bluetooth module solution targeted for
data and audio applications in the 10 meters personal area range.
BLUETOOTH wireless technology is an open industry standard for short range wireless
communication with both data and voice transmission capability (up to 723 kbit/s data asymmetrically
or up to 3 voice channels simultaneously). Singlestone is a Bluetooth 1.1 pre-qualified component, so
any further development and qualification efforts for the user are minimized. It is already hardware
prepared for the upcoming Bluetooth 1.2 Standard, which will improve the quality of voice connections,
support the co-existence with WLAN solutions using the same frequency band and accelerate the
connection setup.
Integrating the baseband, link manager and RF-transceiver, Singlestone closes the gap between the
Bluetooth air interface (external antenna, 2.4 GHz ISM band) and the standardized host-controllerinterface (HCI), which is physically realized as a full-duplex UART port (HW-handshake optional). In
parallel, the PCM interface is suitable for audio connections.
Around Infineon’s BlueMoon Single Cellular – PMB 8761 Bluetooth chip, all essential components for
a complete Bluetooth solution are integrated in the Singlestone module. A 26 MHz temperature
compensated crystal oscillator (TCXO) provides the highly accurate Bluetooth clock, an E²PROM
holds the application specific configuration data which is loaded after power-up reset, and an
integrated balun-filter component ensures optimized RF matching between the chip and the external
antenna. Only a 32.768 kHz real-time clock, which is available in most target applications, must be
provided to the Singlestone module.
Bluetooth stack software supporting the extended feature set of Infineon’s BlueMoon family and a
comprehensive portfolio of Bluetooth profiles are available from our SW partners ported to a variety of
host architectures.
The device is designed for a broad range of wireless applications in the consumer, automotive and
industrial segments, as well as for interconnection of cellular phones, desktop PCs, laptops, and
PDAs.
The device is available in a shielded LGA package (11.85 x 10.6 mm²) with 8x9 pads.
Singlestone
PBA 313 07
Preliminary Product Overview 4/2004
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2.1 General Features
General
• Low power consumption, programmable Power down mode
• Chip in advanced low power CMOS technology
• External supply-voltage 3.0V..4.75 V, recommended 3.3 V +/- 5 %
• Extended temperature range – 40°C .. +85°C
Interfaces
• UART for UART-HCI with HW-handshake (Baudrate up to 3 Mbaud)
• PCM interface (slave- and master-mode; programmable PCM slot allocation)
• JTAG
• GPIO for control of external devices
Digital-Section
• Digital demodulation gives best performance in sensitivity, co- and adjacent channel performance
• Digital offset compensation and symbol synchronization / frame synchronization
• GFSK-modulator (over-sampling at typ. 9-bit-resolution) with amplitude adjustment and high-
performance A/D-converter for RX-data
• Digital part (Noise-shaper, Gaussian impulse filter) of Σ∆-Fractional-N-PLL
• CVSD transcoder for voice conformant to BLUETOOTH wireless technology
• A-law, u-Law and linear PCM also possible
• Baseband and Linkmanager Firmware up to HCI in internal ROM
• 4 kbit E2PROM for storing Bluetooth device data
RF and Analog Section
• Analog part of Σ∆-Fractional-N-PLL for receive and transmit path (multi-modulus-divider, phase
detector and charge pump) on chip
• Fully integrated and balanced VCO with integrated varactors and inductors.
• On chip 2.5 GHz RF driver amplifier up to + 5 dBm output power (Fine tuning in the range of -16 - +
5 dBm in 1.5 dB steps)
• Integrated LNA
• Fully integrated Balun, switch and antenna filter giving one single-ended RF interface, no additional
external RF components
• Chip-integrated supply voltage regulator for VCO
• On module 26 MHz reference clock
• On module voltage regulator for single supply voltage.
• Typical sensitivity -83 dBm
• Typical output power +2.5 dBm
Software
• Baseband, Link Manager and HCI functionality is incorporated by ProBlue Firmware in chip-
integrated ROM.
• Infineon specific HCI+ commands to support enhanced features
• Configuration data (e.g. Bluetooth device address) are loaded from internal E2PROM after reset.
Optionally, configuration data may be provided by the host via HCI+ command.
Package
• LGA 9 x 8 pads
Singlestone
PBA 313 07
Preliminary Product Overview 4/2004
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2.2 Block diagram
V
supply
Singlestone
– PBA 313 07
EEPROM
I
2
C
PMB8761
Bluemoon
Single
Cellular
Voltage
Regulator
PCM UART HCI
Clock 26 MHz
Low Power
Clock 32.768
kHz Balun Antenna
Filter Antenna
Figure 2-1: Block diagram of the PBA 313 07 Singlestone module
2.3 Typical application
UART
PCM
V
Supply
Host application
CLK32
PBA 313 07
Bluetooth
Module
Singlestone
Figure 2-2: Typical application diagram
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