Infineon OptiMOS-6 User manual
Reference Design Guide Please read the Important Notice and Warnings at the end of this document Version 1.0
www.infineon.com/ref_engcoolfan1kw page 1 of 15 2020-16-25
Z8F69499689
Document Preview
1 kW engine cooling fan reference design for
12 V application
OptiMOS-6™ 40 V sTOLL MOSFET, TLE9879QXW40 Embedded Power IC
Design Overview
This Reference Design Guide describes a detailed
implementation of an automotive engine cooling
fan application. The system is controlled by a
system on chip microcontroller with integrated
MOSFET driver in combination with OptiMOSTM-6
leadless MOSFETs.
The design is capable to drive loads up to 1 kW at a
battery voltage of 12 V.
This design guide contains a description of the
design, schematics and measurement reports.
EMC is tested according to the CISPR25 standard.
Thermal performance information is given and
discussed.
Highlighted Components
• TLE9879QXW40
• IAUA250N04S6N007
Target Application
• Engine Cooling Fan
• Radiator Fan
• 1 kW BLDC Motor for 12 V application
Highlighted Design Aspects
1 kW
functional
EMC
optimized
Thermally
optimized
Reference Design and Block Diagram
Reference Design Guide 2 of 15 Version 1.0
2020-16-25
1 kW engine cooling fan reference design for 12 V application
OptiMOS-6™ 40 V sTOLL MOSFET, TLE9879QXW40 Embedded Power IC
Table of contents
Document Preview
Table of contents
Table of contents ............................................................................................................................ 2
Important Notice ............................................................................................................................ 4
1 System Description ................................................................................................................ 5
1.1 Design Specifications .............................................................................................................................. 5
1.2 Overview .................................................................................................................................................. 6
1.3 Highlighted Products .............................................................................................................................. 7
1.3.1 OptiMOS-6TM 40 V sTOLL(HSOF-5) MOSFET ....................................................................................... 7
1.3.2 3-Phase Bridge Driver IC with Integrated Arm® Cortex®-M3 ............................................................. 7
2 Getting Started ...................................................................................................................... 8
2.1 Toolchain Installation ............................................................................................................................. 8
2.1.1 Configuration ..................................................................................................................................... 8
3 System Design ....................................................................................................................... 9
3.1 Electrical Design and Components ......................................................................................................... 9
3.1.1 DC-link Electrolytic Capacitor ............................................................................................................ 9
3.1.2 Shunt Resistor .................................................................................................................................... 9
3.1.3 Snubber .............................................................................................................................................. 9
3.1.4 3-terminal Filter Capacitor................................................................................................................. 9
3.1.5 Clearance and Creepage .................................................................................................................... 9
3.2 Thermo-mechanical Design and Components ...................................................................................... 9
3.2.1 Layout Pattern Width ......................................................................................................................... 9
3.2.2 PCB Bottom-side ................................................................................................................................ 9
3.2.3 Thermal pad Selection ....................................................................................................................... 9
3.2.4 Bolting Torque.................................................................................................................................... 9
3.2.5 Mounting Hole .................................................................................................................................... 9
3.2.6 Heatsink .............................................................................................................................................. 9
3.2.6.1 Heatsink Selection ........................................................................................................................ 9
3.2.6.2 Machining of the Heatsink ............................................................................................................ 9
4 System Performance ............................................................................................................. 10
4.1 Motor-Generator Test Setup ................................................................................................................. 10
4.1.1 Drive-motor Setup............................................................................................................................ 10
4.1.2 Generator Setup ............................................................................................................................... 10
4.1.3 Gate-drive Setup .............................................................................................................................. 10
4.2 Electrical Test Result ............................................................................................................................. 10
4.2.1 Switching Characteristics ................................................................................................................ 10
4.3 Thermal Behavior .................................................................................................................................. 10
4.3.1 Controlled air flow ........................................................................................................................... 10
4.3.2 Thermal Image ................................................................................................................................. 10
4.3.3 Temperature Profile ......................................................................................................................... 10
4.3.4 Measured R
th(ca)
vs. air flow ............................................................................................................... 10
4.4 EMC performance .................................................................................................................................. 10
4.4.1 Measurement Setup ......................................................................................................................... 10
4.4.2 Conducted Emission with Motor Off-State ..................................................................................... 10
4.4.3 Conducted Emission with Motor On-State ...................................................................................... 10
5 Project Collaterals ................................................................................................................. 11
5.1 Schematics ............................................................................................................................................ 11
5.2 Bill of Material ........................................................................................................................................ 11
Reference Design Guide 3 of 15 Version 1.0
2020-16-25
1 kW engine cooling fan reference design for 12 V application
OptiMOS-6™ 40 V sTOLL MOSFET, TLE9879QXW40 Embedded Power IC
Table of contents
Document Preview
5.3 Layout Printing ...................................................................................................................................... 11
6 Abbreviations and definitions ................................................................................................. 12
7 Reference documents ............................................................................................................ 13
Revision history............................................................................................................................. 14
Reference Design Guide 4 of 15 Version 1.0
2020-16-25
1 kW engine cooling fan reference design for 12 V application
OptiMOS-6™ 40 V sTOLL MOSFET, TLE9879QXW40 Embedded Power IC
Important Notice
Document Preview
Important Notice
The Evaluation Boards and Reference Boards and the information in this document are solely intended to
support designers of applications to evaluate the use of products of Infineon Technologies in the intended
application.
Environmental conditions have been considered in the design of the Evaluation Boards and Reference Boards
provided by Infineon Technologies. The design of the Evaluation Boards and Reference Boards is tested by
Infineon Technologies only as described in this document. The design is not qualified in terms of safety
requirements, manufacturing and operation over the entire operating temperature range or lifetime.
The Evaluation Boards and Reference Boards provided by Infineon Technologies are subject to functional
testing only under typical load conditions. Evaluation Boards and Reference Boards are not subject to the
same procedures as regular products regarding returned material analysis (RMA), process change notification
(PCN) and product discontinuation (PD).
Evaluation Boards and Reference Boards are not commercialized products and are solely intended to be used
for evaluation and testing purposes. They shall in particular not be used for reliability testing or production.
Hence, the Evaluation Boards and Reference Boards may not comply with CE or similar standards (including but
not limited to the EMC Directive 2004/EC/108 and the EMC Act) and may not fulfill other requirements of the
country in which they are operated by the customer. The customer shall ensure that each Evaluation Boards and
Reference Board will be handled in a way which is compliant with all relevant requirements and standards in the
country in which they are operated.
The Evaluation Boards and Reference Boards and any information in this document are addressed only to
qualified and skilled technical staff, for laboratory usage, and shall be used and managed according to the
terms and conditions set forth in this document and in any other related documentation provided with the
respective Evaluation Boards or Reference Board.
It is the responsibility of customer’s technical departments to evaluate the suitability of the Evaluation
Boards and Reference Boards for the intended application and the completeness and correctness of the
information provided in this document with respect to such application.
The customer accepts that the Evaluation Boards and Reference Boards are not intended to be used for lifeendangering applications such as medical, nuclear, military, life-critical or other applications, where failure
of the Evaluation Boards and Reference Boards or any results from the use thereof can reasonably be expected
to result in personal injury.
The Evaluation Boards and Reference Boards and any information in this document is provided "as is" and
Infineon Technologies disclaims any and all warranties, express or implied, including but not limited to
warranties of non-infringement of third party rights and implied warranties of fitness for any purpose, or
for merchantability.
Infineon Technologies shall not be responsible for any damages resulting from the use of the Evaluation
Boards and Reference Boards and/or from any information provided in this document. The customer is
obliged to defend, indemnify and hold harmless Infineon Technologies from and against any claims or
damages arising out of or resulting from any use thereof.
Infineon Technologies reserves the right to change this document and/or any information provided herein at any
time without further notice.
Loading...