Infineon MIPAQ Brochure

MIPAQ™ – More Than You Expect!

Infineon’s functional IGBT module family

www.infineon.com/mipaq

MIPAQ™ Family

Applications

The MIPAQ™ modules

enable highly efficient

power inver ter designs to

be used in

■ Industrial drives, such

as compressors, pumps

and fans

■ Power Supplies

■ Air conditioning systems

■ Solar inverters

The modules are

characterized by enhanced

testing and are delivered

as known-good systems.

MIPAQ™ is a functional product family that is dedicated to useful integration of

electronics into power modules.

The MIPAQ™ family was developed in order to offer Modules Integrating Power,

Application and Quality. It is a functional product family within Infineon‘s IGBT modules

portfolio. The combination of an IGBT module and integrated sensing and driving

electronics leads to an optimized solution in mastering the challenge of designing

powerful and compact inver ters for low and medium power. It eases the cost situation

on the one hand and contributes to energ y saving on the other hand. Thus, it improves

the profitability and protects our environment at the same time.

The MIPAQ™ family includes three products that offer significant board space savings

along with reduced development times and costs:

■ MIPAQ™ base

■ MIPAQ™ sense

■ MIPAQ™ serve

The MIPAQ™ base module features integrated shunts, while the MIPAQ™ sense module

offers fully digital current measurements with galvanically isolated output signals. The

MIPAQ™ serve module includes driver electronics and a digital temperature measure-

ment, both with galvanic isolation.

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Integration Level

MIPAQ™ base

MIPAQ™ sense

MIPAQ™ serve

Chip technology

The MIPAQ™ family is based on an innovative packaging concept and utilizes the

advantages of the Infineon IGBT4 chip technology. This technology makes it possible to

increase the power density of IGBT modules. IGBT4 does not only provide approximately

20 % lower switching losses than IGBT3 but also significantly higher power cycling

capability. The operation junction temperature of IGBT4 is 150 °C offering even more

output power and higher reliability for a variety of applications.

Solder and PressFIT Mounting Technology

The MIPAQ™ base is available with the well known solder terminals while the MIPAQ™

sense features PressFIT connections as state-of-the-art. The advantage of the PressFIT

process is the fact that it can be separated from the soldering process and allows

module mounting on soldering and component side of the PCB. This increases the

design flexibility. The high reliability of PressFIT contacts in general increases the

system reliability. This is especially of interest, if modules are operating in harsh

environments.

Power Range

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