INFINEON ITS 716G User Manual

PROFET® ITS 716G
Smart High-Side Power Switch For Industrial Applications
Four Channels: 4 x 140m
Product Summary Package
Operating Voltage V
5.5 ...40V
bb
Operating Temperature Ta -30 …+85°C
Active channels one four parallel On-state Resistance RON Nominal load current I Current limitation I
L(NOM)
L(SCr)
140m 35m
2.6A 5.3A
6.5A 6.5A
General Description
N channel vertical power MOSFET with charge pump, ground referenced CMOS compatible input and
diagnostic feedback, monolithically integrated in Smart SIPMOS
Providing embedded protective functions
technology.
PG-DSO-20
Applications
µC compatible high-side power switch with diagnostic feedback for 12V and 24V grounded loads in industrial
applications
All types of resistive, inductive and capacitve loads
Most suitable for loads with high inrush currents, so as lamps
Replaces electromechanical relays, fuses and discrete circuits
Basic Functions
Very low standby current
CMOS compatible input
Improved electromagnetic compatibility (EMC)
Fast demagnetization of inductive loads
Stable behaviour at undervoltage
Wide operating voltage range
Logic ground independent from load ground
Protection Functions Block Diagram
Short circuit protection
Overload protection
Current limitation
Thermal shutdown
Overvoltage protection (including load dump) with external
resistor
Reverse battery protection with external resistor
Loss of ground and loss of V
protection
bb
Electrostatic discharge protection (ESD)
Diagnostic Function
Diagnostic feedback with open drain output
Open load detection in OFF-state
Feedback of thermal shutdown in ON-state
IN1
ST1/2
IN2
IN3
ST3/4
IN4
Vbb
Logic Channel 1 Channel 2
Logic Channel 3 Channel 4
GND
Load 1
Load 2
Load 3
Load 4
Infineon Technologies AG 1 of 14 2006-Mar-23
PROFET® ITS 716G
p
g
Functional diagram
overvoltage
rotection
internal
e supply
volta
IN1
ESD
. channel 1
ST1/2
IN2
GND1/2
IN3
ST3/4
IN4
GND3/4
logic
gate
control
+
charge
pump
temperature
sensor
Open load
detection
control and protection circuit
of
channel 2
control and protection circuit
of
channel 3
control and protection circuit
of
channel 4
current limit
clamp for
inductive load
reverse
battery
protection
VBB
OUT1
LOAD
OUT2
OUT3
OUT4
Infineon Technologies AG 2 of 14 2006-Mar-23
PROFET® ITS 716G
Pin Definitions and Functions
Pin Symbol Function
1,10, 11,12, 15,16, 19,20
3 IN1 5 IN2 7 IN3 9 IN4 18 OUT1 17 OUT2 14 OUT3 13 OUT4 4 ST1/2 8 ST3/4 open drain, low on failure 2 GND1/2 6 GND3/4
V
bb
Positive power supply voltage. Design the
wiring for the simultaneous max. short circuit currents from channel 1 to 2 and also for low thermal resistance
Input 1,2,3,4 activates channel 1,2,3,4 in case
of logic high signal
Output 1,2,3,4 protected high-side power output
of channel 1,2,3,4. Design the wiring for the max. short circuit current
Diagnostic feedback 1/2,3/4 of channel 1,2,3,4
Ground of chip 1 (channel 1,2) Ground of chip 2 (channel 3,4)
Pin configuration
(top view)
V
1 20 V
bb
GND1/2 2 19 Vbb
IN1 3 18 OUT1
ST1/2 4 17 OUT2
IN2 5 16 Vbb
GND3/4 6 15 Vbb
IN3 7 14 OUT3
ST3/4 8 13 OUT4
IN4 9 12 Vbb Vbb 10 11 Vbb
bb
Infineon Technologies AG 3 of 14 2006-Mar-23
PROFET® ITS 716G
Maximum Ratings at T
= 25°C unless otherwise specified
j
Parameter Symbol Values Unit
Supply voltage (overvoltage protection see page 6) Vbb 43 V Supply voltage for full short circuit protection
T
= -40 ...+150°C
j,start
Vbb 36 V
Load current (Short-circuit current, see page 6) IL self-limited A
3
Load dump protection1) V
2)
R
= 2 Ω, t
I
= 400 ms; IN = low or high,
d
LoadDump
each channel loaded with R
= VA + Vs, VA = 13.5 V
= 13.5 ,
L
Junction temperature Operating temperature range Storage temperature range Power dissipation (DC)4) Ta = 25°C: (all channels active)
T
= 85°C:
a
Maximal switchable inductance, single pulse V
= 12V, T
bb
IL = 2.3 A, E IL = 3.3 A, E IL = 4.7 A, E
= 150°C4), see diagrams on page 10
j,start
= 76 mJ, 0 one channel:
AS
= 182 mJ, 0 two parallel channels:
AS
= 460 mJ, 0 four parallel channels:
AS
Electrostatic discharge capability (ESD) IN:
V
Load dump
Tj T
a
T
stg
3.6
P
tot
ZL
V
ESD
)
60 V
1.0 (Human Body Model) ST: out to all other pins shorted: acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
R=1.5k; C=100pF
Input voltage (DC) see internal circuit diagram page 9 VIN -10 ... +16 V Current through input pin (DC) Pulsed current through input pin Current through status pin (DC)
5)
I
IN
I
IN
I
ST
+150
°C
-30 ...+85
-40 ...+105
W
1.9
21
mH 25 30
kV
4.0
8.0
±0.3
mA
±5.0 ±5.0
1)
Supply voltages higher than V
resistor for the GND connection is recommended.
2)
RI = internal resistance of the load dump test pulse generator
3)
V
Load dump
4)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air. See page 14
5)
only for testing
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
Infineon Technologies AG 4 of 14 2006-Mar-23
require an external current limit for the GND and status pins (a 150
bb(AZ)
2
(one layer, 70µm thick) copper area for V
bb
PROFET® ITS 716G
Thermal Characteristics
Parameter and Conditions Symbol Values Unit
Thermal resistance junction - soldering point
6)7)
each channel: R junction – ambient6) @ 6 cm2 cooling area one channel active: all channels active:
min typ max
R
thjs
thja
-- -- 17
--
--
--
-­44 35
--
--
--
K/W
Electrical Characteristics
Parameter and Conditions, each of the four channels Symbol Values Unit
at Tj = -40...+150°C, V
Load Switching Capabilities and Characteristics
= 12 V unless otherwise specified
bb
min typ max
On-state resistance (Vbb to OUT); I
= 2 A
L
each channel, Tj = 25°C:
T
= 150°C:
j
two parallel channels, Tj = 25°C: four parallel channels, Tj = 25°C:
see diagram, page 11
Nominal load current one channel active:
two parallel channels active: four parallel channels active:
Device on PCB Output current while GND disconnected or pulled up
V
= 32 V, V
bb
see diagram page 9
Turn-on time Turn-off time IN to 10% V R
= 12
L
Slew rate on 9) 10 to 30% V Slew rate off 9) 70 to 40% V
6)
, T
= 85°C, Tj 150°C
a
= 0,
IN
9)
IN to 90% V
, R
OUT
OUT
L
, R
8)
OUT
OUT
= 12 : dV/dton 0.2 -- 1.0 V/µs
= 12 :-dV/dt
L
: :
;
RON
I
I
ton t
2.3
L(NOM)
L(GNDhigh)
off
-- -- 2 mA
0.2 -- 1.1 V/µs
off
--
--
--
--
3.3
4.7
--
--
110 210
55 28
2.6
3.7
5.3
100 100
140
m
280
70 35
--
A
--
--
250
µs
270
6)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air. See page 14
7)
Soldering point: upper side of solder edge of device pin 15. See page 14
8)
not subject to production test, specified by design
9)
See timing diagram on page 12.
2
(one layer, 70µm thick) copper area for V
bb
Infineon Technologies AG 5 of 14 2006-Mar-23
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