Datasheet ITS436L2 Datasheet (INFINEON)

PROFET
®
ITS436L2
Smart High-Side Power Switch for Industrial Applications
One Channel: 38m
Product Summary Package
On-state Resistance R
Operating Voltage V
Nominal load current I
Current limitation I
Operating Temperature T
ON
bb(on)
L(NOM)
L(SCr)
a
38m
4.75...41V
9.8A
40A
-30 …+85°C
General Description
N channel vertical power MOSFET with charge pump, ground referenced CMOS compatible input and
diagnostic feedback, monolithically integrated in Smart SIPMOS
Providing embedded protective functions
PG-TO220-5-11 PG-TO220-5-12
Standard Straight
technology.
Applications
µC compatible high-side power switch with diagnostic feedback for 5V, 12V and 24V grounded loads in
industrial applications
All types of resistive, inductive and capacitve loads
Most suitable for loads with high inrush currents, so as lamps
Replaces electromechanical relays, fuses and discrete circuits
Basic Functions
Very low standby current
CMOS compatible input
Fast demagnetization of inductive loads
Stable behaviour at undervoltage
Wide operating voltage range
Logic ground independent from load ground
Block Diagram
Protection Functions
Short circuit protection
Overload protection
Current limitation
Thermal shutdown
Overvoltage protection (including load dump) with external
resistor
Reverse battery protection with external resistor
Loss of ground and loss of V
protection
bb
Electrostatic discharge protection (ESD)
IN
ST
Vbb
Logic
with
protection
functions
OUT
Diagnostic Function
Diagnostic feedback with open drain output
Open load detection in ON-state
PROFET
GND
Load
Feedback of thermal shutdown in ON-state
Infineon Technologies AG Page 1 2006-Mar-28
B
p
g
PROFET
Functional diagram
IN
ST
GND
overvoltage
rotection
internal
e supply
volta
ESD
logic
gate
control
+
charge
pump
temperature
sensor
Open load
detection
current limit
clamp for
inductive load
®
PROFET
ITS436L2
VBB
OUT
LOAD
Pin Definitions and Functions
Pin
Symbol Function
1
2 IN
3 Vbb
4 ST
GND
Input, activates the power switch in
Positive power supply voltage
The tab is shorted to pin 3
Diagnostic feedback, low on failure
5 OUT
Tab Vbb
Positive power supply voltage
The tab is shorted to pin 3
Logic ground
case of logical high signal
Output to the load
Pin configuration
(top view)
Tab = V
B
1 2 (3) 4 5
GND IN ST OUT
Infineon Technologies AG Page 2 2006-Mar-28
PROFET
®
ITS436L2
Maximum Ratings at Tj = 25 °C unless otherwise specified
Parameter Symbol Values Unit
Supply voltage (overvoltage protection see page 4) Vbb 43 V Supply voltage for full short circuit protection
T
=-40 ...+150°C
j Start
Load dump protection
2
)
R
= 2 Ω, RL= 4.0 Ω, t
I
1
)
V
LoadDump
= 200 ms, IN= low or high
d
= VA + Vs, VA = 13.5 V
Load current (Current limit, see page 5) IL self-limited A Junction temperature Operating temperature range Storage temperature range Power dissipation (DC), T
25 °C P
C
Maximal switchable inductance, single pulse
V
= 12V, T
bb
(See diagram on page 8) I
= 150°C, TC = 150°C const.
j,start
L(ISO)
= 9.8 A, R
= 0 Ω, E
L
4
)
AS
=0.33J:
Electrostatic discharge capability (ESD) IN: (Human Body Model) ST: out to all other pins shorted: acc. MIL-STD883D, method 3015.7 and
ESD assn. std. S5.1-1993; R=1.5k; C=100pF
Input voltage (DC) VIN -10 ... +16 V Current through input pin (DC) Current through status pin (DC)
see internal circuit diagrams page 7
Vbb 24 V
V
Load dump
Tj T
a
T
stg
75 W
tot
3
60 V
+150
-30 … +85
-40 ...+105
°C
ZL 5.0 mH
V
1.0
ESD
kV
4.0
8.0
IIN IST
±2.0 ±5.0
mA
Thermal Characteristics
Parameter and Conditions Symbol Values Unit
min typ max
75
K/W
--
bb
Thermal resistance chip - case:
junction - ambient (free air): device on pcb
1
)
Supply voltages higher than V
resistor for the GND connection is recommended).
2
)
RI = internal resistance of the load dump test pulse generator
3
)
V
Load dump
4
)
EAS is the maximum inductive switch-off energy
5
)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air.
is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
require an external current limit for the GND and status pins (a 150
bb(AZ)
5
)
R
thJC
R
thJA
:
2
(one layer, 70µm thick) copper area for V
--
--
--
--
--
33
1.75
Infineon Technologies AG Page 3 2006-Mar-28
PROFET
®
ITS436L2
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj =-40...+150°C, V
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to 5)
IL = 2 A; V
7V T
BB
Tj=150 °C:
see diagram, page 9
Nominal load current, (pin 3 to 5)
ISO 10483-1, 6.7:VON=0.5V, TC=85°C
Output current (pin 5) while GND disconnected or
GND pulled up
see diagram page 7
Turn-on time IN to 90% V Turn-off time IN to 10% V R
= 12 Ω,
L
Slew rate on 10 to 30% V
OUT
Slew rate off 70 to 40% V
OUT
= 12 V unless otherwise specified
bb
6
)
, Vbb=30 V, VIN= 0,
, R
= 12 Ω,
L
, R
= 12 Ω,
L
=25 °C:
j
OUT
OUT
RON
min typ max
--
35
64
I
L(ISO)
I
L(GNDhigh)
:
ton
:
t
off
dV /dt
-dV/dt
-- -- 2 mA
0.1 -- 1 V/µs
on
0.1 -- 1 V/µs
off
8.8
50 50
9.8 -- A
100 120
38
72
200 250
m
µs
Operating Parameters
Operating voltage Tj =-40 Tj =+25...+150°C:
7
Overvoltage protection
)
Tj =-40°C:
Ibb=40 mA Tj =25...+150°C: Standby current (pin 3)
VIN=0; see diagram on page 9 T
Off-State output current (included in I
VIN=0
Operating current
8)
T
9
)
, VIN=5 V
=-40...+25°C:
j
= 150°C:
j
)
bb(off)
6
)
not subject to production test, specified by design
7
)
Supply voltages higher than V resistor for the GND connection is recommended. See also V circuit diagram page 7.
8
)
Measured with load
9
)
Add I
, if IST > 0, add IIN, if VIN>5.5 V
ST
require an external current limit for the GND and status pins (a 150
bb(AZ)
V
4.75 --
bb(on)
--
V
I
I
I
41
bb(AZ)
43
--
bb(off)
--
-- 1 10 µA
L(off)
-- 0.8 1.4 mA
GND
in table of protection functions and
ON(CL)
--
47
5
--
41 43
52
25
V
--
8
V
µA
Infineon Technologies AG Page 4 2006-Mar-28
PROFET
®
ITS436L2
Parameter and Conditions Symbol Values Unit
at Tj =-40...+150°C, V
Protection Functions
Current limit (pin 3 to 5) I
(see timing diagrams on page 11) T
Tj =25°C: Tj =+150°C:
Repetitive short circuit shutdown current limit I
= 12 V unless otherwise specified
bb
10)
=-40°C:
j
L(lim)
46
L(SCr)
min typ max
58 39 30
51
38
68 58 46
A
Tj = Tjt (see timing diagrams, page 11) -- 40 -- A
Thermal shutdown time
(see timing diagrams on page 11)
Output clamp (inductive load switch off) at V
= Vbb - V
OUT
ON(CL)
11)
T
j,start
I
= 25°C:
= 40 mA: V
L
t
off(SC)
ON(CL)
-- 1.9 -- ms
41 43
47 52 V
Thermal overload trip temperature Tjt 150 -- -- °C Thermal hysteresis Reverse battery (pin 3 to 1) Reverse battery voltage drop (V
12)
-Vbb -- -- 32 V
13 )
)
> V
out
bb
IL = -2 A Tj=150 °C: -V
Diagnostic Characteristics
Open load detection current
Tjt -- 10 -- K
ON(rev)
-- 600 -- mV
I
100 -- 900 mA
L (OL)
(on-condition)
Input and Status Feedback
Input resistance
see circuit page 7 Input turn-on threshold voltage V Input turn-off threshold voltage V
Input threshold hysteresis V
Off state input current (pin 2), VIN = 0.4 V I On state input current (pin 2), VIN = 5 V I Delay time for status with open load after switch off
(see timing diagrams on page 11)
14
)
R
2.5 3.5 6 k
I
1.7 -- 3.2 V
IN(T+)
1.5 -- -- V
IN(T-)
-- 0.5 -- V
IN(T)
1 -- 50 µA
IN(off)
20 50 90 µA
IN(on)
t
d(ST OL4)
100 520 900 µs
Status output (open drain) Zener limit voltage I ST low voltage IST = +1.6 mA:
10
)
Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation.
11
)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
connection. PCB is vertical without blown air.
12
)
Requires 150 Ω resistor in GND connection. The reverse load current through the intrinsic drain-source
diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 3 and circuit page 7).
13
)
not subject to production test, specified by design
14
)
If a ground resistor R
is used, add the voltage drop across this resistor.
GND
= +1.6 mA:
ST
V V
2
(one layer, 70µm thick) copper area for V
ST(high)
ST(low)
5.4
--
6.1
--
0.4
--
V
bb
Infineon Technologies AG Page 5 2006-Mar-28
PROFET
®
ITS436L2
Truth Table
Input Output Status
Normal operation Open load L
Overtem­perature
L = "Low" Level X = don't care Z = high impedance, potential depends on external circuit H = "High" Level Status signal after the time delay shown in the diagrams (see fig 5. page 11)
level
level BTS 436L2
L H
H L H
L H Z H L L
H H H L H L
Infineon Technologies AG Page 6 2006-Mar-28
PROFET
Terms
I
bb
R
I
3
PROFET
GND
1
GND
V
bb
I
GND
I
I
V
L
OUT
5
V
I
I
IN
IN
2
I
ST
ST
V
IN
V
bb
Input circuit (ESD protection)
4
V
ST
R
IN
I
ESD-ZD
GND
The use of ESD zener diodes as voltage clamp at DC conditions is not recommended
Status output
R
ST(ON)
+5V
ST
ON
OUT
®
ITS436L2
Overvolt. and reverse batt. protection
+ 5V
R
ST
R
I
IN
Logic
ST
R
ST
V
Z1
V
= 6.1 V typ., VZ2 = 47 V typ., R
Z1
R
= 15 kΩ, RI= 3.5 k typ.
ST
R
Signal GND
GND
V
Z2
PRO FET
GND
GND
OUT
Load GND
= 150 Ω,
In case of reverse battery the load current has to be limited by the load. Temperature protection is not active
Open-load detection in on-state
Open load, if V
Logic
unit
ON
ON
< R
ON·IL(OL)
Open load
detection
; IN high
+ V
R
OUT
bb
V
+ V
Load
ON
bb
ESD-
GND
ZD
ESD-Zener diode: 6.1 V typ., max 5.0 mA; R
ST(ON)
< 375
GND disconnect
at 1.6 mA. The use of ESD zener diodes as voltage clamp at DC conditions is not recommended.
Inductive and overvoltage output clamp
V
Z
GND
PROFET
+ V
V
OUT
ON
3
V
IN
2
bb
ST
4
V
V
IN
V
ST
bb
Any kind of load. In case of Input=high is V Due to V
>0, no VST = low signal available.
GND
bb
PROFET
GND
1
V
GND
OUT
OUT
V
5
- V
IN
IN(T+)
.
V
clamped to 47 V typ.
ON
Infineon Technologies AG Page 7 2006-Mar-28
PROFET
GND disconnect with GND pull up
3
V
IN
2
ST
4
V
V
V
bb
ST
IN
bb
PROFET
GND
1
V
GND
OUT
5
Any kind of load. If V Due to V
>0, no VST = low signal available.
GND
GND
>
VIN - V
device stays off
IN(T+)
Vbb disconnect with energized inductive load
3
high
V
bb
IN
2
ST
4
For inductive load currents up to the limits defined by ZL (max. ratings and diagram on page 8) each switch is protected against loss of Vbb.
Consider at your PCB layout that in the case of Vbb dis­connection with energized inductive load all the load current flows through the GND connection.
V
bb
PROFET
GND
1
OUT
5
®
ITS436L2
Inductive Load switch-off energy dissipation
E
bb
E
AS
E
E
E
Load
L
R
V
IN
=
ST
bb
PROFET
GND
OUT
L
{Z
R
L
L
Energy stored in load inductance:
L
L
2
1
E
/
=
·L·I
2
While demagnetizing load inductance, the energy dissipated in PROFET is
= Ebb + EL - ER= ∫ V
E
AS
with an approximate solution for R
· L
I
L
=
·(V
E
AS
2
·R
+ |V
bb
OUT(CL)
L
|)· ln (1+
ON(CL)·iL
L
> 0 :
|V
(t) dt,
I
RL
OUT(CL)
|
)
Maximum allowable load inductance for a single switch off
j,start
L
150°C,T
=
0
=
L = f (I
V
Z
); T
L
12 V, R
=
bb
[mH]
L
1000
150°C const.,
=
C
100
10
1
0.1 02 4610121416 18
IL [A]
Infineon Technologies AG Page 8 2006-Mar-28
PROFET
Typ. on-state resistance
RON = f (Vbb,Tj ); IL = 2 A, IN = high
R
[m]
ON
80
70
60
50
40
30
Tj = 150°C
25°C
-40°C
®
ITS436L2
20
10
3 5 7 9 30 40
V
bb
[V]
Typ. standby current
I
= f (Tj ); V
bb(off)
[µA]
I
bb(off)
45
40
35
30
25
20
= 9...34 V, IN1,2 = low
bb
15
10
5
0
-50 0 50 100 150 200
T
[°C]
j
Infineon Technologies AG Page 9 2006-Mar-28
PROFET
Timing diagrams
Figure 1a: Vbb turn on:
IN
V
bb
V
OUT
ST open drain
Figure 2b: Switching a lamp,
IN
ST
V
OUT
I
t
L
®
ITS436L2
proper turn on under all conditions
Figure 2a: Switching a resistive load, turn-on/off time and slew rate definition:
IN
V
OUT
90%
t
on
dV/dton
10%
I
L
t
off
dV/dtoff
The initial peak current should be limited by the lamp and not by the current limit of the device.
Figure 2c: Switching an inductive load
IN
ST
V
OUT
I
L
t
I
L(OL)
*) if the time constant of load is too large, open-load-status may occur
t
t
Infineon Technologies AG Page 10 2006-Mar-28
t
t
PROFET
Figure 3a: Short circuit
shut down by overtemperature, reset by cooling
IN
I
L
ST
other channel: normal operation
I
L(lim)
I
L(SCr)
t
off(SC)
®
ITS436L2
Figure 5a: Open load: detection in ON-state, open
load occurs in on-state
IN
ST
V
I
OUT
L
t
d(ST OL)
normal
open
t
d(ST OL)
normal
t
Heating up of the chip may require several milliseconds, depending on external conditions
Figure 4a: Overtemperature: Reset if T
<Tjt
j
IN
ST
V
OUT
T
J
t
= 10 µs typ.
d(ST OL)
Figure 5b: Open load: turn on/off to open load
IN
ST
d(STOL4)
I
L
t
t
Infineon Technologies AG Page 11 2006-Mar-28
PROFET
Package and Ordering Code
All dimensions in mm
Standard (=staggered): PG-TO220-5-11
Sales code ITS436L2
Ordering code: SP000221231
±0.2
10
±0.15
9.8
8.5
3.7
-0.15
1)
±0.3
±0.3
13.4
17
15.65
C
0...0.15
1.7
1)
Typical All metal surfaces tin plated, except area of cut.
Straight: PG-TO220-5-12
Sales code ITS436L2 S
Ordering code: SP000221232
10
9.8
8.5
3.7
1)
±0.2 ±0.15
1)
-0.15
0.8
±0.2
2.8
±0.3
8.6
±0.1
A
4.4
±0.1
1.27
0.05
±0.2
9.25
±0.3
10.2
±0.3
3.7
0.5
2.4
M
A0.25
C
A
1.27
B
4.4
±0.1
8.4
3.9
±0.4
®
ITS436L2
Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81669 München © Infineon Technologies AG 2006 All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).
±0.1
Warnings
Due to technical requirements components may contain
±0.4
dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life­support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
1)
±0.3
±0.3
13.4
17
15.65
C
0...0.15
1.7
Typical
1)
All metal surfaces tin plated, except area of cut.
6x
0.8
±0.2
2.8
±0.5
11
±0.1
±0.5
13
0.05
2.4
M
BA0.25
C
0.5
±0.2
9.25
±0.1
Infineon Technologies AG Page 12 2006-Mar-28
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