INFINEON IRLR8721PBF Datasheet

Absolute Maximum Ratings
Continuous Drain Current, V
@ 10V
ID @ TC = 100°C
Continuous Drain Current, V
@ 10V
Pulsed Drain Current
c
PD @TC = 25°C
T
Thermal Resistance
R
R
Junct ion-to-Ambient (PCB Mount)
g
R
65f46
IRLR8721PbF-1
Compatible with Existing Surface Mount Techniques
Form
Quantity
Standar d Pack
HEXFET® Power MOSFET
V
DS
R
DS(on) max
(@VGS = 10V)
Q
g (typica l)
I
D
(@TC = 25°C)
Features Benefits
Industry-standard pinout D-Pak
30 V
8.4
m
8.5 nC
65
f
D
D
Ω
G
A
S
G
D-Pak
IRLR8721PbF-1
Multi-Vendor Compatibility
Easier Manufacturing RoHS Compliant, Halogen-Free Environmentally Friendlier MSL1, Industrial qualification Increased Reliability
Base Part Number Package Type
IRLR8721PbF-1 D-Pak Tape and Reel 2000 IRLR8721TRPbF-1
DS
GS
I
@ TC = 25°C
D
I
DM
@TC = 100°C
D
T
J
STG
Parameter Units
Drain-to-Source Voltage V
Gate-to-Source Voltage
GS
GS
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor W/°C Operating Junction and °C
Storage Temperature Range
Max.
± 20
260
0.43
-55 to + 175
Orderable part number
30
f
65
33
S
W
Parameter Typ. Max. Units
θJC
θJA
θJA
Junct ion-to-Case ––– 2.3
Junct ion-to-Ambient ––– 110
Notes through are on page 12
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––– 50 °C/W
Static @ TJ = 25°C (unless otherwise specified)
BV
ΔΒ
V
/ΔT
R
m
Ω
V
Δ
V
I
I
Q
Q
Q
Q
Q
QswSwitch Charge (Q
+ Qgd)
Q
R
Ω
t
t
t
t
C
C
C
Avalanche Characteristics
EASSingle Pulse Avalanche Energy
dh
IARAvalanche Current
c
EARRepetitive Avalanche Energy
c
Diode Characteristics
Parameter
Min.
Typ.
Max.
Units
I
65
f
I
(Body Diode)
V
t
Q
t
di/dt = 300A/μs
f
Ω
Parameter Min. Typ. Max. Units
DSS
DSS
DS(on)
GS(th)
GS(th)
DSS
GSS
gfs Forward Transconductance 46 ––– ––– S
g
gs1
gs2
gd
godr
oss
G
d(on)
r
d(off)
f
iss
oss
rss
Drain-to-Source Breakdown Voltage 30 ––– ––– V
Breakdown Voltage Temp. Coefficient ––– 21 ––– mV/°C
J
Static Drain-to-Source On-Resistance ––– 6.3 8.4
––– 10.1 11.8
Gate Threshold Voltage 1.35 1.9 2.35 V
Gate Threshold Voltage Coefficient ––– -6.8 ––– mV/°C
Drain-to-Source Leakage Current ––– ––– 1.0 μA
––– ––– 150
Gate-to-Source Forward Leakage ––– ––– 100 nA
Gate-to-Source Reverse Leakage ––– ––– -100
Total Gate Charge ––– 8.5 13
Pre-Vth Gate-to-Source Charge ––– 1.9 –––
Post-Vth Gate-to-Source Charge ––– 1.2 ––– nC
Gate-to-Drain Charge ––– 3.4 –––
Gate Charge Overdrive ––– 2.0 ––– See Fig. 16
gs2
––– 4.6 –––
Output Charge ––– 7.9 ––– nC
Gate Resistance ––– 2.3 3.8
Turn-On Delay Time ––– 8.8 –––
Rise Time ––– 30 –––
Turn-Off Delay Time ––– 9.4 ––– ns
Fall Time ––– 6.5 –––
Input Capacitance ––– 1030 –––
Output Capacitance ––– 350 ––– pF
Reverse Transfer Capacitance ––– 110 –––
IRLR8721PbF-1
Conditions
VGS = 0V, ID = 250μA
Reference to 25°C, I
= 10V, ID = 25A
V
GS
V
= 4.5V, ID = 20A
GS
V
= VGS, ID = 25μA
DS
V
= 24V, VGS = 0V
DS
= 24V, VGS = 0V, TJ = 125°C
V
DS
VGS = 20V
= -20V
V
GS
VDS = 15V, ID = 20A
V
= 15V
DS
V
= 4.5V
GS
= 20A
I
D
V
= 16V, VGS = 0V
DS
V
= 15V, VGS = 4.5V
DD
ID = 20A
RG = 1.8 See Fig. 14
= 0V
V
GS
= 15V
V
DS
ƒ = 1.0MHz
= 1mA
D
f
f
f
Parameter Units
Typ.
–––
–––
–––
Max.
93
20
6.5
mJ
A
mJ
Conditions
S
SM
rr
on
Continuous Source Current ––– –––
(Body Diode) Pulsed Source Current ––– ––– 260
ch
SD
Diode Forward Voltage ––– ––– 1.0 V
Reverse Recovery Time ––– 17 26 ns
rr
Reverse Recovery Charge ––– 24 36 nC
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
A
MOSFET symbol
showing the integral reverse
p-n junction diode. TJ = 25°C, IS = 20A, VGS = 0V
= 25°C, IF = 20A, VDD = 15V
T
J
G
D
S
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f
IRLR8721PbF-1
1000
2.7V
VGS
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
60μs PULSE WIDTH
TOP 10V
) A
(
100
t n e
r
r u
C e
c
r u o S
­o
t
­n
i a
r D
,
D
I
BOTTOM 2.7V
10
1
Tj = 25°C
0.1
0.1 1 10 100
VDS, Drain-to-Source Voltage (V)
1000
) A
( t
100
n e
r
r u
C e
c
r
10
u o S
­o
t
­n
i a
r
1
D ,
D
I
TJ = 25°C
V
DS
60μs PULSE WIDTH
0.1 0 2 4 6 8 10
VGS, Gate-to-Source Voltage (V)
TJ = 175°C
= 15V
1000
VGS
8.0V
5.0V
4.5V
4.0V
3.5V
3.0V
2.7V
60μs PULSE WIDTH
) A
( t n e
r
r u
C e
c
r u o S
­o
t
­n
i a
r D
, I
100
10
D
TOP 10V
BOTTOM 2.7V
Tj = 175°C
1
0.1 1 10 100
VDS, Drain-to-Source Voltage (V)
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
2.0
e c n a
t s
i s e
R n O e
c
r u o S
­o
t
­n
i a
r D
,
) n o
( S D
R
ID = 25A
V
= 10V
GS
1.5
) d e z
i
l a
m
r o
N
(
1.0
0.5
-60 -40 -20 0 20 40 60 80 100120140160180
TJ , Junction Temperature (°C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
vs. Temperature
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IRLR8721PbF-1
10000
) F p
( e
c n a
t
i c a p a
C ,
C
1000
100
10
V
= 0V, f = 1 MHZ
GS
C
= C
iss
rss
oss
= C
= C
gs
gd
ds
C
iss
C
oss
C
rss
C
C
1 10 100
VDS, Drain-to-Source Voltage (V)
Fig 5. Typical Capacitance vs.
Drain-to-Source Voltage
1000
) A
( t
100
n e
r
r u
C n
i a
r
10
D e
s
r e v e
R ,
D S
I
0.1
TJ = 175°C
1
0.0 0.5 1.0 1.5 2.0
VSD, Source-to-Drain Voltage (V)
+ Cgd, C
+ C
gd
TJ = 25°C
SHORTED
ds
V
GS
= 0V
) V
( e
g a
t
l o V
e c
r u o S
­o
t
­e
t a
G ,
V
5.0 ID= 20A
4.0
3.0
2.0
S
1.0
G
0.0
0246810
VDS= 24V
VDS= 15V
VDS= 6.0V
QG, Total Gate Charge (nC)
Fig 6. Typical Gate Charge vs.
Gate-to-Source Voltage
1000
) A
( t
100
n e
r
r u
C e
c
r u
10
o S
­o
t
­n
i a
r D
1
,
D
I
Tc = 25°C Tj = 175°C Single Pulse
0.1
0 1 10 100
OPERATION IN THIS AREA LIMITED BY RDS(on)
100μsec
1msec
10msec
VDS, Drain-to-Source Voltage (V)
Fig 7. Typical Source-Drain Diode
Fig 8. Maximum Safe Operating Area
Forward Voltage
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