INFINEON IRLHS2242PBF Instructions

V
ID @ TA = 25°C
Continuous Drain Current, V
@ 4.5V
Continuous Drain Current, V
@ 4.5V
ID @ T
= 25°C
Continuous Drain Current, V
@ 4.5V
Continuous Drain Current, V
@ 4.5V
ID @ TC = 25°C
Continuous Drain Current, V
@ 4.5V (Wirebond Limited)
Pulsed Drain Current
c
PD @TA = 25°C
Power Dissipation
g
Power Dissipation
g
Linear Derating Factor
W/°C
T
-9.8
-15hi -8.5
Q
G
3
S
D2
D1
4S
5D
6D
TOP VIEW
D
IRLHS2242PbF
RoHS Compliant Containing no Lead, no Bromide and no Halogen
Form
Quantity
Standard Pack
HEXFET® Power MOSFET
V
DS
V
GS max
R
DS(on) max
(@VGS = 4.5V)
R
DS(on) max
(@VGS = 2.5V)
g typ
I
D
(@T
c(Bottom)
= 25°C)
-20 V
12 V
±
31
53
9.6
-8.5
i
m
m
nC
A
Ω
Ω
Applications
l Charge and Discharge Switch for Battery Application l System/load switch
Features and Benefits
Features Benefits
Low Thermal Resistance to PCB ( Low Profile ( Industry-Standard Pinout
Compatible with Existing Surface Mount Techniques
MSL1, Industrial Qualification Increased Reliability
1.0mm) results in Increased Power Density
13° C/ W) Enable better thermal dissipati on
Multi-Vendor Compatibility Easier Manufacturing
Environmentally Friendlier
D
D
D
S
2mm x 2mm PQFN
D
D
G
S
Order able part number Package Type
IRLHS2242TRPbF PQFN 2mm x 2mm Tape and Reel 4000
IRLHS2242TR2PbF
DS
V
GS
ID @ TA = 70°C
C(Bottom)
ID @ T
I
DM
PD @T
T
J
STG
Notes  through are on page 9
C(Bottom)
C(Bottom)
= 100°C
= 25°C
PQFN 2mm x 2mm Tape and Reel 400 EOL notice # 259
Drain-to-Source Voltage
Gate-to-Source Voltage
g
Operating Junction and
Storage Temperature Range
Note
Parameter Units
GS
GS
GS
GS
GS
Max.
-20
±12
-7.2
-5.8
hi
i
-34
2.1
9.6
0.02
-55 to + 150
V
A
W
°C
1 www.irf.com © 2013 International Rectifier Submit Datasheet Feedback December 16, 2013
R
(Bottom)
Junction-to-Case
g
–––13R
(Top)
Junction-to-Case
g
–––
90
R
Junction-to-Ambient
f
–––60R
(<10s)
Junction-to-Ambient
f
–––
42
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max.
Units
BV
ΔΒ
V
/ΔT
R
V
Δ
V
I
I
Q
Q
VDS = -10V
Q
Q
Q
QswSwitch Charge (Q
+ Qgd)
Q
–––
t
t
t
t
C
C
C
Avalanche Characteristics
EASSingle Pulse Avalanche Energy
d
IARAvalanche Current
c
Diode Characteristics
Parameter
Min.
Typ.
Max.
Units
I
I
(Body Diode)
V
t
Q
t
Ω
di/dt = 200A/μs
e
DSS
DSS
J
DS(on)
GS(th)
GS(th)
DSS
GSS
gfs Forward Transconductance 10 ––– ––– S
g
g
gs
gd
godr
oss
R
G
d(on)
r
d(off)
f
iss
oss
rss
Drain-to-Source Breakdown Voltage -20 ––– ––– V
Breakdown Voltage Temp. Coefficient ––– 0.01 ––– V/°C
Static Drain-to-Source On-Resistance ––– 25 31
––– 43 53
mΩ
Gate Threshold Voltage -0.4 -0.8 -1.1 V
Gate Threshold Voltage Coefficient ––– -3.8 ––– mV/°C
Drain-to-Source Leakage Current ––– ––– -1.0
––– ––– -150
Gate-to-Source Forward Leakage ––– ––– -100
Gate-to-Source Reverse Leakage ––– ––– 100
Total Gate Charge ––– 12 ––– nC
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
––– 9.6 –––
––– 1.6 –––
––– 3.7 –––
Gate Charge Overdrive ––– 4.3 –––
gs2
––– 4.8 –––
Output Charge ––– 6.8 ––– nC
Gate Resistance ––– 17 Turn-On Delay Time ––– 7.9 –––
Rise Time ––– 54 –––
Turn-Off Delay Time ––– 54 –––
Fall Time ––– 66 –––
Input Capacitance ––– 877 –––
Output Capacitance ––– 273 –––
Reverse Transfer Capacitance ––– 182 –––
IRLHS2242PbF
VGS = 0V, ID = -250μA
Reference to 25°C, I
V
= -4.5V, ID = -8.5A
GS
= -2.5V, ID = -6.8A
V
GS
= VGS, ID = -10μA
V
DS
= -16V, VGS = 0V
V
DS
μA
nA
nC
Ω
ns
pF
= -16V, VGS = 0V, TJ = 125°C
V
DS
= -12V
V
GS
V
= 12V
GS
VDS = -10V, ID = -8.5A
=-10V, VDS = -10V, ID = -8.5A
V
GS
= -4.5V
V
GS
I
= -8.5A
D
V
= 16V, VGS = 0V
DS
= -10V, VGS = -4.5V
V
DD
ID = -8.5A
R
= 2.0
G
V
= 0V
GS
V
= -10V
DS
ƒ = 1.0KHz
Conditions
= -1mA
D
e e
S
Continuous Source Current
(Body Diode)
SM
SD
rr
rr
on
Pulsed Source Current
Diode Forward Voltage ––– ––– -1.2 V
Reverse Recovery Time ––– 27 41 ns
Reverse Recovery Charge ––– 20 30 nC
Forward Turn-On Time Time is dominated by parasitic Inductance
Thermal Resistance
θ
JC
θJC
θ
JA
θJA
Parameter Units
Typ.
–––
–––
Max.
18
-8.5
Conditions
MOSFET symbol
showing the
A
integral reverse
p-n junction diode. TJ = 25°C, IS = -8.5A, VGS = 0V
T
= 25°C, IF = -8.5A, VDD = -10V
J
G
c
––– ––– -8.5
––– ––– -34
h
Parameter Typ. Max. Units
mJ
A
D
S
e
°C/W
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IRLHS2242PbF
100
TOP -10V
) A
( t n e
r
r
10
u C e
c
r u o S
­o
t
­n
1
i a
r D
,
D
I
-
-1.5V
60μs
BOTTOM -1.5V
PULSE WIDTH
Tj = 25°C
0.1
0.1 1 10 100
-VDS, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
100
) A
( t
n e
r
r
10
u C e
c
r u o S
­o
t
­n
i a
r D
,
D
I
-
1
TJ = 150°C
TJ = 25°C
V
= -10V
DS
60μs PULSE WIDTH
0.1 0 1 2 3 4 5
-VGS, Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
VGS
-7.0V
-4.5V
-3.5V
-2.5V
-2.0V
-1.8V
100
) A
( t n e
r
r
10
u C e
c
r u o S
­o
t
­n
1
i a
r D
,
D
I
-
0.1
-1.5V
60μs
Tj = 150°C
TOP -10V
BOTTOM -1.5V
PULSE WIDTH
VGS
-7.0V
-4.5V
-3.5V
-2.5V
-2.0V
-1.8V
0.1 1 10 100
-VDS, Drain-to-Source Voltage (V)
Fig 2. Typical Output Characteristics
1.4
e c n a
t s
i s e
R n O e
)
c
d
r
e
u
z
i
o
l
S
a
­m
o
t
r
-
o
n
i
N
(
a
r D
,
) n o
( S D
R
1.2
1.0
0.8
ID = -8.5A
V
= -4.5V
GS
0.6
-60 -40 -20 0 20 40 60 80 100 120 140 160
TJ , Junction Temperature (°C)
Fig 4. Normalized On-Resistance vs. Temperature
10000
) F p
( e
c n a
t
i c a p a
C ,
C
V
= 0V, f = 1 KHZ
GS
C
= C
1000
C
C
iss
rss
oss
= C
= C
gs
gd
ds
C
C
oss
C
+ Cgd, C
+ C
iss
rss
SHORTED
ds
gd
100
1 10 100
-VDS, Drain-to-Source Voltage (V)
14
ID= -8.5A
)
12
V
( e
g a
10
t
l o V
e c
r u o S
­o
t
­e
t a
G ,
S G
V
-
VDS= -16V
VDS= -10V
VDS= -4V
8
6
4
2
0
0 5 10 15 20 25
QG, Total Gate Charge (nC)
Fig 6. Typical Gate Charge vs.Gate-to-Source VoltageFig 5. Typical Capacitance vs.Drain-to-Source Voltage
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